High-speed optical module heat dissipation structure and high-speed optical module

Abstract

The invention relates to the technical field of high-speed optical modules, in particular to a high-speed optical module heat dissipation structure and a high-speed optical module.The high-speed optical module heat dissipation structure comprises a heat dissipation shell, an installation cavity is formed in the heat dissipation shell, and the installation cavity is used for installing functional components of the high-speed optical module; the heat dissipation component is arranged in the mounting cavity, is connected with the functional component and is used for dissipating heat of the functional component; and the heat dissipation fins are arranged on the heat dissipation shell and are close to the heat dissipation component. The invention aims to optimize the heat dissipation structure of the high-speed optical module and indirectly and quickly conduct out the heat of a core heating element which cannot be directly conducted out through the heat dissipation structure, thereby improving the heat dissipation effect of the whole module, reducing the influence of heat dissipation on the work of the module, and improving the performance and the use stability of the module.

Description

Technical Field

[0001] The present invention relates to the technical field of high-speed optical modules, and in particular to a high-speed optical module heat dissipation structure and a high-speed optical module. Background Art

[0002] With the rapid development of information technology, the speed and capacity requirements of data transmission are constantly rising. As a key component in the optical communication network, the high-speed optical module undertakes the important task of converting electrical signals into optical signals and transmitting them at high speed. The quality of its performance directly affects the operating efficiency and stability of the entire optical communication system. During the operation of the high-speed optical module, since the internal electronic components and optical devices generate a lot of heat when running at high speed, and the heating components cannot directly contact the external shell for heat transfer, if the heat cannot be dissipated in time and effectively, the internal temperature of the module will rise sharply. Excessive temperature will not only affect the performance of the electronic components in the optical module, causing the operating parameters to drift, reducing the transmission quality of the signal, and causing problems such as increased bit error rate; it will also have a negative impact on the luminous efficiency and life of the optical device, accelerate the aging of the optical device, and even cause the optical module to fail to work properly in severe cases.

[0003] At present, the common heat dissipation methods of high-speed optical modules on the market mainly include natural heat dissipation, air cooling and simple heat sink cooling. The natural heat dissipation method only relies on the natural heat exchange between the module itself and the surrounding environment to dissipate heat, and the heat dissipation efficiency is extremely low. It is only suitable for some low-power, low-speed optical modules. Although air cooling improves the heat dissipation efficiency to a certain extent, it requires additional equipment such as fans, which increases the complexity and power consumption of the system. At the same time, the fan will generate noise during operation, and the reliability of the fan is relatively low. Regular maintenance and replacement are required, which is not suitable for optical communication fields with extremely high requirements for stability and reliability. Simple heat dissipation fins enhance the heat dissipation effect by increasing the heat dissipation area, but for the large amount of heat generated by high-speed optical modules, its heat dissipation capacity is limited and it is difficult to meet the growing heat dissipation needs. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a high-speed optical module heat dissipation structure and a high-speed optical module. By optimizing the heat dissipation structure of the high-speed optical module, the heat generated by the core heating components that cannot be directly dissipated can be indirectly and quickly conducted out through the heat dissipation structure, thereby improving the heat dissipation effect of the entire module, reducing the impact of heat dissipation on the operation of the module, and improving the module performance and usage stability.

[0005] The present invention solves the above technical problems by the following technical means:

[0006] A high-speed optical module heat dissipation structure, comprising:

[0007] A heat dissipation housing, wherein a mounting cavity is formed in the heat dissipation housing, and the mounting cavity is used to mount functional components of the high-speed optical module;

[0008] A heat dissipation component, which is arranged in the mounting cavity and connected to the functional component, and is used to dissipate heat for the functional component;

[0009] The heat dissipation component includes a first heat dissipation component and a second heat dissipation component; when the first heat dissipation component and the second heat dissipation component are buckled and arranged on the functional component, a closed space is formed to dissipate heat from the functional component in all directions;

[0010] When the first heat dissipation component and the second heat dissipation component are buckled, a high thermal conductivity adhesive material is provided at the buckled joint, wherein the high thermal conductivity adhesive material is a modified thermal conductive silica gel, and the modified thermal conductive silica gel is prepared by using thermal conductive silica gel as a carrier and a graphene aerogel loaded with surface-modified hexagonal boron nitride nanosheets through ultrasonic and vacuum degassing;

[0011] The heat dissipation fins are arranged on the heat dissipation housing and are close to the heat dissipation component.

[0012] Based on the above solution, this application also makes the following improvements:

[0013] Furthermore, the heat dissipation housing includes a module cover and a module base, the heat dissipation fins are arranged on one side of the module cover, a first heat conductive member is arranged on the other side of the module cover, a second heat conductive member is arranged on the module base, and the first heat conductive member corresponds to the second heat conductive member.

[0014] According to the above technical means, the functional components and heat dissipation components of the high-speed optical module can be installed inside through the module cover and the module base. When the heat is dissipated through the heat dissipation components, the heat can be transferred and dissipated up and down between the module cover and the module base through the first heat conductive member and the second heat conductive member, so as to improve the heat dissipation efficiency.

[0015] Further, the first heat-conducting member is configured as a first heat-conducting protrusion, the first heat-conducting protrusion is fixedly arranged on the module cover, the second heat-conducting member is configured as a second heat-conducting protrusion, the second heat-conducting protrusion is fixedly arranged on the module base, and the first heat-conducting protrusion and the second heat-conducting protrusion are arranged opposite to each other;

[0016] The free ends of the first heat-conducting protrusion and the second heat-conducting protrusion are both provided with a first heat transfer member.

[0017] According to the above technical means, by setting the heat-conducting member as a heat-conducting protrusion, the upward and downward heat transfer between the module cover and the module base is facilitated, and by setting the first heat-conducting member, the heat transfer efficiency is improved.

[0018] Furthermore, the first heat dissipation assembly includes a heat dissipation cover, a partition and a second heat transfer member, the partition is fixedly arranged in the heat dissipation cover, and is used to separate the heat dissipation cover into a first groove and a second groove, the first groove and the second groove are used to dissipate heat and seal the functional components, and the second heat transfer member is arranged on the heat dissipation cover and contacts the heat dissipation shell.

[0019] According to the above technical means, the functional components can be cooled by setting the heat dissipation cover, and then the heat can be quickly transferred to the heat dissipation shell through the second heat conductor to accelerate the heat dissipation. At the same time, the functional components can be covered to prevent dust and the like from entering the functional components.

[0020] Furthermore, the first heat dissipation assembly further includes a plurality of card blocks, and the plurality of card blocks are respectively arranged on the edges of the heat dissipation cover.

[0021] According to the above technical means, by setting the card block, on the one hand, it can be installed more stably on the functional component, and heat can also be dissipated when contacting the functional component, thereby enhancing the heat dissipation performance; on the other hand, it is easy to buckle with the second heat dissipation component, thereby forming a closed heat dissipation space with the second heat dissipation component.

[0022] Furthermore, the second heat dissipation assembly includes a base plate, a heat dissipation platform and a third heat conducting member. The heat dissipation platform is arranged on the base plate and corresponds to the functional component. The third heat conducting member is arranged on the base plate and contacts the heat dissipation housing.

[0023] According to the above technical means, heat is dissipated by contact between the heat dissipation platform and the bottom surface of the functional component, and the heat can be quickly dissipated to the bottom of the heat dissipation housing in conjunction with the bottom plate and the third heat conducting member.

[0024] Furthermore, the functional component has a through hole, the region of the functional component is connected with the region of the heat dissipation platform through the through hole, and a fourth heat conducting member is arranged between two adjacent heat dissipation platforms.

[0025] According to the above technical means, the heat dissipation speed is increased by setting the through holes, and the heat dissipation can be further accelerated by setting the fourth heat conducting member between the heat dissipation platforms, while maintaining the temperature stability.

[0026] Furthermore, the second heat dissipation assembly also includes two side panels, which are respectively fixedly arranged on two sides of the bottom plate, and both of the side panels are provided with card slots.

[0027] According to the above technical means, a side panel is provided and a card slot is opened on the side panel to facilitate card connection with the card block, thereby forming a closed heat dissipation space.

[0028] The present application also discloses a high-speed optical module, comprising the high-speed optical module heat dissipation structure described above.

[0029] By adopting the high-speed optical module with the heat dissipation structure, the heat dissipation performance of the high-speed optical module can be improved, thereby improving the use stability and service life of the high-speed optical module.

[0030] The present application adopting the above scheme has the following beneficial effects:

[0031] 1. In this application, by using a heat dissipation component in contact with the functional components of the high-speed optical module, the heat generated by the core heating element that cannot be directly conducted away can be indirectly and quickly conducted away through the heat dissipation structure, thereby improving the heat dissipation effect of the entire module, reducing the impact of heat dissipation on the operation of the module, and improving the performance and stability of the module;

[0032] 2. In the present application, by setting the heat dissipation component as the first heat dissipation component and the second heat dissipation component, and respectively setting them on the upper and lower sides of the functional component, a closed heat dissipation space can be formed, so that heat can be dissipated from both the module cover and the module base to improve the heat dissipation efficiency and maintain temperature stability;

[0033] 3. In the present application, the first heat dissipation component can not only quickly dissipate the heat of the functional components, but also cover the upper part of the functional components to prevent dust and the like from entering the functional components; and cooperate with the second heat dissipation component to quickly dissipate the heat of the lower part of the functional components, and a through hole is provided between the functional components and the second heat dissipation component to increase the heat dissipation speed, thereby improving the heat dissipation performance of the high-speed optical module, thereby improving the use stability and service life of the high-speed optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present application may be further illustrated by non-limiting examples given in the accompanying drawings;

[0035] Figure 1 This is a schematic diagram of a partially disassembled structure of a high-speed optical module heat dissipation structure in an embodiment of the present application;

[0036] Figure 2 This is a schematic diagram of heat conduction in the heat dissipation structure of a high-speed optical module in an embodiment of the present application;

[0037] Figure 3 It is a structural schematic diagram of functional components in the heat dissipation structure of a high-speed optical module in an embodiment of the present application;

[0038] Figure 4 It is a structural schematic diagram of the second heat dissipation component in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0039] Figure 5 It is a structural schematic diagram of the first heat dissipation component in the heat dissipation structure of the high-speed optical module in the embodiment of the present application;

[0040] Figure 6 It is a structural schematic diagram of a module base in a high-speed optical module heat dissipation structure in an embodiment of the present application;

[0041] Figure 7 It is a structural schematic diagram of a module cover plate in a high-speed optical module heat dissipation structure in an embodiment of the present application;

[0042] Description of main symbols and components:

[0043] 100, module cover; 110, heat dissipation fins; 120, first heat conducting member; 130, first receiving groove; 200, functional component; 210, circuit board; 220, special-shaped through groove; 221, notch; 230, array optical fiber jumper; 240, optical connector; 250, coupling lens; 260, first heating chip; 270, second heating chip; 280, third heating chip; 290, fourth heating chip;

[0044] 300, module base; 310, second heat conducting member; 320, second containing groove;

[0045] 400, heat dissipation component; 410, second heat dissipation component; 411, bottom plate; 412, first heat dissipation platform; 413, second heat dissipation platform; 414, third heat dissipation platform; 415, side plate; 416, card slot; 420, first heat dissipation component; 421, heat dissipation cover; 422, partition; 423, first groove; 424, second groove; 425, card block. DETAILED DESCRIPTION

[0046] The following describes the implementation of the present invention through specific specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. It should be noted that the illustrations provided in the following embodiments are only for exemplary descriptions, and only schematic diagrams are shown, not physical diagrams, and cannot be understood as limitations on the present invention. In order to better illustrate the embodiments of the present invention, some parts in the figures may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the figures.

[0047] The same or similar reference numerals in the figures of the embodiments of the present invention correspond to the same or similar components. In the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "front", "rear" and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the figure, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the figures are only used for exemplary description and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances:

[0048] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0049] like Figure 1-7 As shown, the embodiment of the present application discloses a high-speed optical module heat dissipation structure, including a heat dissipation housing, a heat dissipation component 400 and heat dissipation fins 110. A mounting cavity is formed in the heat dissipation housing, and the mounting cavity is used to mount the functional component 200 of the high-speed optical module. The heat dissipation component 400 is arranged in the mounting cavity and connected to the functional component 200, and is used to dissipate heat for the functional component 200. The heat dissipation fins 110 are arranged on the heat dissipation housing and close to the heat dissipation component 400, and are used to increase the heat dissipation area and improve the heat dissipation capacity.

[0050] In this embodiment, if Figure 3 As shown, the functional component 200 includes a circuit board 210, a first heating chip 260, a second heating chip 270, a third heating chip 280, a fourth heating chip 290, an array fiber jumper 230, a coupling lens 250 and an optical connector 240. One end of the array fiber jumper 230 is connected to the optical connector 240, and the other end is connected to the coupling lens 250. The coupling lens 250 is coupled to the second heating chip 270 and the fourth heating chip 290. The third heating chip 280 and the fourth heating chip 290 are mounted on the surface of the circuit board 210. The first heating chip 260 and the second heating chip 270 are mounted on the heat dissipation component 400 and are electrically connected to the front of the circuit board 210.

[0051] In this embodiment, a special-shaped through slot 220 is provided on the circuit board 210 to improve electrical performance, increase heat dissipation area, and install the first heating chip 260 and the second heating chip 270. Notches 221 are also provided on both sides of the circuit board 210 to facilitate the installation of the heat dissipation component 400. The circuit board 210 is provided with through holes at the third heating chip 280 and the fourth heating chip 290 to correspond to the heat dissipation component 400.

[0052] In this embodiment, if Figure 1 and Figure 6-7As shown, the heat dissipation housing includes a module cover 100 and a module base 300. The heat dissipation fins 110 are arranged on the upper side of the module cover 100 and close to one side of the upper part of the heat dissipation component 400, so as to increase the heat dissipation area and improve the heat dissipation capacity. A first heat conducting member 120 is arranged on the inner side of the module cover 100, and a second heat conducting member 310 is arranged on the module base 300. The first heat conducting member 120 corresponds to the second heat conducting member 310, so that when the module cover 100 and the module base 300 are closed, the first heat conducting member 120 and the second heat conducting member 310 are in contact, so that heat is transferred and dissipated up and down between the module cover 100 and the module base 300, so as to improve the heat dissipation efficiency.

[0053] In this embodiment, the first heat-conducting member 120 is configured as a first heat-conducting protrusion, which is fixedly disposed on the module cover 100. The second heat-conducting member 310 is configured as a second heat-conducting protrusion, which is fixedly disposed on the module base 300. The first heat-conducting protrusion and the second heat-conducting protrusion are opposite to each other, that is, they may directly abut against each other or have a gap therebetween.

[0054] In some embodiments, when there is a gap between the two opposite ends of the first heat-conducting protrusion and the second heat-conducting protrusion, the free ends of the first heat-conducting protrusion and the second heat-conducting protrusion are both provided with a first heat transfer member to increase the heat transfer efficiency and reduce the thermal resistance. When the two opposite ends of the first heat-conducting protrusion and the second heat-conducting protrusion directly abut against each other, direct contact heat transfer can be achieved.

[0055] The first heat-conducting protrusion and the second heat-conducting protrusion are configured to be a high thermal conductivity material, for example, a copper protrusion, a silicon carbide protrusion, a graphene protrusion, an aluminum nitride protrusion, and the like.

[0056] In this embodiment, if Figure 1 and Figure 4-5 As shown, the heat dissipation component 400 includes a first heat dissipation component 420 and a second heat dissipation component 410. The first heat dissipation component 420 and the second heat dissipation component 410 can be arranged on the upper and lower sides of the first heat dissipation chip 260, the second heat dissipation chip 270, the third heat dissipation chip 280, and the fourth heat dissipation chip 290, and cooperate with the module cover 100 and the module base 300 to form a sandwich heat dissipation. The first heat dissipation component 420 and the second heat dissipation component 410 can also be coated on the upper and lower sides of the first heat dissipation chip 260, the second heat dissipation chip 270, the third heat dissipation chip 280, and the fourth heat dissipation chip 290 to form a closed heat dissipation space, which can effectively dissipate heat while reducing the impact of heat on other components.

[0057] In this embodiment, when the first heat dissipation component 420 and the second heat dissipation component 410 are arranged on the upper and lower sides of the first heat dissipation chip 260, the second heat dissipation chip 270, the third heat dissipation chip 280, and the fourth heat dissipation chip 290 to form a sandwich heat dissipation:

[0058] like Figure 5 As shown, the first heat dissipation assembly 420 includes a heat dissipation cover 421, a partition 422, and a second heat transfer member. The partition 422 is integrally formed in the heat dissipation cover 421, and is used to separate the heat dissipation cover 421 into a first groove 423 and a second groove 424, which are used to dissipate heat and seal the upper area of ​​the functional component 200. The second heat transfer member is arranged on the outer surface of the heat dissipation cover 421 and contacts the heat dissipation housing to quickly transfer heat to the module cover 100.

[0059] like Figure 4 As shown, the second heat dissipation assembly 410 includes a bottom plate 411, a heat dissipation platform and a third heat conduction member. The heat dissipation platform is arranged on the bottom plate 411 and corresponds to the functional component 200, and is used to dissipate heat from the lower area of ​​the functional component 200. The third heat conduction member is arranged on the bottom plate 411 and contacts the heat dissipation housing to quickly transfer heat to the module base 300.

[0060] In this embodiment, the heat dissipation cover 421 and the partition 422 are made of high thermal conductivity materials, such as diamond, copper, silicon carbide, graphene, aluminum nitride, etc. The first groove 423 and the second groove 424 can respectively seal the first heating chip 260, the second heating chip 270, the fourth heating chip 290 and the coupling lens 250 in the first groove 423 and the second groove 424, and fit with the upper surface of the first heating chip 260, the second heating chip 270, the fourth heating chip 290 and the coupling lens 250, and play the role of a protective box while dissipating heat to prevent dust and other impurities from entering. At this time, the third heating chip 280 is located outside the heat dissipation cover 421, and a second heat transfer member is also provided between the third heating chip 280 and the inner side of the module cover 100 to quickly transfer the heat of the third heating chip 280 to the module cover 100.

[0061] In another embodiment, the heat dissipation cover 421 may also cover the third heat generating chip 280 , and simultaneously dissipate heat and protect the third heat generating chip 280 .

[0062] The second heat transfer member is also made of a high thermal conductivity material, such as diamond, copper, silicon carbide, graphene, aluminum nitride, etc. The second heat transfer member can be prepared in a circular shape, a square shape, etc., and the material used can be the same as or different from the material of the heat dissipation cover 421. The module cover 100 has a first receiving groove 130, the lower surface of the second heat transfer member is in contact with the upper surface of the heat dissipation cover 421, and the upper surface of the second heat transfer member is located in the first receiving groove 130, so that the heat generated by the first heating chip 260, the second heating chip 270, and the fourth heating chip 290 during operation can be quickly transferred to the module cover 100 through the heat dissipation cover 421 and the second heat transfer member, thereby quickly dissipating the heat.

[0063] In this embodiment, the bottom plate 411 and the heat sink are both made of high thermal conductivity materials, such as copper, silicon carbide, graphene, aluminum nitride, etc. There are multiple heat sinks, preferably three, and the three heat sinks and the bottom plate 411 can be fixed by welding, screwing, riveting, etc., or can be integrally formed, preferably integrally formed, which is convenient for processing and molding, and at the same time, the heat transfer effect will not be affected by the addition of other materials.

[0064] The three heat sinks are divided into a first heat sink 412, a second heat sink 413 and a third heat sink 414. The first heat sink 412 and the second heat sink 413 correspond to the first heating chip 260 and the second heating chip 270 respectively. The first heating chip 260 and the second heating chip 270 are mounted on the first heat sink 412 and the second heat sink 413 respectively, and pass through the special-shaped through slot 220 on the circuit board 210 to be electrically connected to the front of the circuit board 210. The third heat sink 414 corresponds to the fourth heating chip 290. There is a through hole between the fourth heating chip 290 and the circuit board 210, so that the fourth heating chip 290 can directly or indirectly transfer heat to the third heat sink 414 through the circuit board 210 and the through hole when working, thereby accelerating heat dissipation. Compared with direct heat transfer of the circuit board 210, heat transfer through the circuit board 210 and through hole has higher heat dissipation efficiency and more reliable temperature stability.

[0065] The third heat transfer member is arranged on the lower surface of the bottom plate 411, and a second receiving groove 320 is arranged on the module base 300. The upper surface of the third heat transfer member is in contact with the outer surface of the base, and the lower surface of the third heat transfer member is located in the second receiving groove 320, so that heat can be quickly transferred to the module base 300 through the heat dissipation platform, the bottom plate 411 and the third heat transfer member, thereby dissipating heat, and the heat is transferred to the module cover 100 through the first heat transfer member 120 and the second heat transfer member 310, thereby further accelerating the heat dissipation.

[0066] In this embodiment, the third heat transfer member is also made of a high thermal conductivity material, such as diamond, copper, silicon carbide, graphene, aluminum nitride, etc. The third heat transfer member can be prepared in a circular or square shape, etc., and the material used can be the same as or different from that of the heat dissipation cover 421.

[0067] In another embodiment, the third heating chip 280 may also correspond to the second heat sink 413. In this case, there is also a through hole between the third heating chip 280 and the circuit board 210, so that the third heating chip 280 can directly or indirectly transfer heat to the second heat sink 413 through the circuit board 210 and the through hole when working, thereby accelerating heat dissipation. Compared with direct heat transfer of the circuit board 210, heat transfer through the circuit board 210 and through hole has higher heat dissipation efficiency and more reliable temperature stability.

[0068] In this embodiment, a fourth heat conducting member is disposed between the first heat dissipation platform 412 , the second heat dissipation platform 413 and the third heat dissipation platform 414 . The fourth heat conducting member can be configured as thermally conductive silica gel, thermally conductive gel, etc. to connect the heat dissipation platforms, which is beneficial to maintaining temperature stability.

[0069] In this embodiment, when the first heat dissipation component 420 and the second heat dissipation component 410 can cover the upper and lower sides of the first heat dissipation chip 260, the second heat dissipation chip 270, the third heat dissipation chip 280, and the fourth heat dissipation chip 290 to form a closed heat dissipation space, the first heat dissipation component 420 and the second heat dissipation component 410 not only include the structure of the above embodiment, but also include the following structure:

[0070] The first heat dissipation assembly 420 further includes a plurality of blocks 425 , which are respectively arranged on the edges of the heat dissipation cover 421 .

[0071] The second heat dissipation assembly 410 further includes two side panels 415 . The two side panels 415 are respectively fixedly disposed on two sides of the bottom plate 411 . A slot 416 is formed on each of the two side panels 415 .

[0072] When the first heat dissipation component 420 and the second heat dissipation component 410 are engaged and cover the upper and lower sides of the first heating chip 260, the second heating chip 270, the third heating chip 280 and the fourth heating chip 290, the clamping block 425 is clamped in the clamping slot 416 to form a closed structure. Through the cooperation of the clamping block 425 and the clamping slot 416, it can be installed more stably on the circuit board 210, and heat can also be dissipated when it contacts the edge of the circuit board 210, and the first heat dissipation component 420 and the second heat dissipation component 410 cooperate to dissipate the heat of the heating chip, thereby enhancing the heat dissipation performance.

[0073] In this embodiment, the card block 425 and the heat dissipation cover 421 are arranged on the edge of the heat dissipation cover 421 by an integral molding manner, and the side panel 415 and the card slot 416 are formed on the bottom plate 411 by an integral molding manner. It is not only convenient to process, but also uses the same high thermal conductivity material, which is conducive to heat dissipation.

[0074] In this embodiment, a high thermal conductivity adhesive material is provided at the connection between the card block 425 and the card slot 416, for example, modified thermally conductive silicone, thermally conductive gel, thermally conductive epoxy adhesive, thermally conductive double-sided adhesive, etc. By providing a high thermally conductive adhesive material, on the one hand, the first heat dissipation component 420 and the second heat dissipation component 410 can be installed more stably, and on the other hand, the sealing of the connection can be improved, and at the same time, the heat dissipation effect will not be affected.

[0075] In this embodiment, the high thermal conductivity adhesive material is modified thermal conductive silica gel, which is prepared by using thermal conductive silica gel as a carrier and loading nano thermal conductive material. The specific preparation method includes the following steps:

[0076] placing the hexagonal boron nitride nanosheets in a 3-aminopropyltriethoxysilane solution, reacting for 1-2 hours, stirring during the reaction, obtaining surface-modified hexagonal boron nitride nanosheets, filtering, and drying to obtain dried surface-modified hexagonal boron nitride nanosheets;

[0077] 10 parts by weight of surface-modified hexagonal boron nitride nanosheets were added to 30 parts by weight of a graphene oxide solution having a concentration of 2-4 mg / mL, and then 0.1 parts by weight of an ethylenediamine crosslinking agent was added, and ultrasonicated at 200-300 W for 30 minutes to obtain a self-assembly solution;

[0078] The self-assembly liquid is divided into molds and freeze-dried at -20 to -30°C to obtain graphene aerogel loaded with hexagonal boron nitride nanosheets. The graphene gel is then placed in an acetic acid solution and reduced at 85°C for 2 hours, filtered, and washed with deionized water three times to obtain reduced graphene oxide. At the same time, the amino groups on the surface of the hexagonal boron nitride nanosheets form amide bonds with the carboxyl groups of the reduced graphene oxide to obtain a graphene aerogel with enhanced interface bonding.

[0079] 5 parts by weight of thermally conductive silica gel and 2 parts by weight of graphene aerogel were ultrasonically treated at 800-1000W for 30 minutes, mixed evenly, and then vacuum degassed to obtain modified thermally conductive silica gel. Through testing, the in-plane thermal conductivity of the modified thermally conductive silica gel was 28.4 W / m·K, and the out-of-plane thermal conductivity was increased to 3.6 W / m·K. The surface had a certain degree of adhesion, which could reduce the thermal resistance between the card block 425 and the card slot 416, thereby accelerating heat dissipation.

[0080] In this embodiment, since the heat-generating chip in the functional component 200 is the main heat source of the module, the heat is directly or indirectly conducted to the second heat dissipation component 410, and then to the module base 300. At the same time, the heat is directly or indirectly transferred to the module cover 100 through the first heat dissipation component 420. Since the upper surface of the module cover 100 is the main heat dissipation surface, in addition to the self-heating of the module base 300, part of the heat will be conducted to the module cover 100 through the first heat conductor 120 and the second heat conductor 310 and the contact surface. Finally, the heat is dissipated through the heat dissipation fins 110 provided on the module cover 100 and the external environment. This method makes full use of the internal space of the module, increases the heat transfer area, can accelerate the overall heat dissipation of the module, and thus improves the heat dissipation capacity of the entire module.

[0081] The embodiment of the present application further discloses a high-speed optical module, including the high-speed optical module heat dissipation structure in the above embodiment.

[0082] By adopting the high-speed optical module of the heat dissipation structure of the above embodiment, the heat dissipation performance of the high-speed optical module can be improved, thereby improving the use stability and service life of the high-speed optical module.

[0083] The above is a detailed introduction to a high-speed optical module heat dissipation structure and a high-speed optical module provided by the present invention. The description of the specific embodiment is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

[0084] It should be noted that the phrases "one embodiment", "embodiment", "some optional embodiments", "exemplary embodiments", "some embodiments", etc. mentioned in the specification indicate that the described embodiment may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing specific features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A high-speed optical module heat dissipation structure, characterized in that: include: A heat dissipation housing, wherein a mounting cavity is formed in the heat dissipation housing, and the mounting cavity is used to mount functional components (200) of a high-speed optical module; a heat dissipation component (400), the heat dissipation component (400) being arranged in the installation cavity and connected to the functional component (200) and used for dissipating heat from the functional component (200); The heat dissipation component (400) comprises a first heat dissipation component (420) and a second heat dissipation component (410); when the first heat dissipation component (420) and the second heat dissipation component (410) are buckled and arranged on the functional component (200), a closed space is formed to perform all-round heat dissipation on the functional component (200); When the first heat dissipation component (420) and the second heat dissipation component (410) are buckled, a high thermal conductivity adhesive material is provided at the buckled joint, wherein the high thermal conductivity adhesive material is a modified thermal conductive silica gel, and the modified thermal conductive silica gel is prepared by using thermal conductive silica gel as a carrier and graphene aerogel loaded with surface-modified hexagonal boron nitride nanosheets through ultrasonic and vacuum degassing; The heat dissipation fins (110) are arranged on the heat dissipation housing and are close to the heat dissipation component (400).

2. The high-speed optical module heat dissipation structure according to claim 1, characterized in that: The heat dissipation housing comprises a module cover (100) and a module base (300); the heat dissipation fins (110) are arranged on one side of the module cover (100); a first heat conducting member (120) is arranged on the other side of the module cover (100); a second heat conducting member (310) is arranged on the module base (300); and the first heat conducting member (120) corresponds to the second heat conducting member (310).

3. The high-speed optical module heat dissipation structure according to claim 2, characterized in that: The first heat-conducting member (120) is configured as a first heat-conducting protrusion, which is fixedly arranged on the module cover (100); the second heat-conducting member (310) is configured as a second heat-conducting protrusion, which is fixedly arranged on the module base (300); the first heat-conducting protrusion and the second heat-conducting protrusion are arranged opposite to each other; The free ends of the first heat-conducting protrusion and the second heat-conducting protrusion are both provided with a first heat transfer member.

4. The high-speed optical module heat dissipation structure according to claim 1 or 2, characterized in that: The first heat dissipation component (420) comprises a heat dissipation cover (421), a partition (422) and a second heat transfer element. The partition (422) is fixedly arranged in the heat dissipation cover (421) and is used to separate the heat dissipation cover (421) into a first groove (423) and a second groove (424). The first groove (423) and the second groove (424) are used to dissipate heat and seal the functional component (200). The second heat transfer element is arranged on the heat dissipation cover (421) and is in contact with the heat dissipation housing.

5. The high-speed optical module heat dissipation structure according to claim 4, characterized in that: The first heat dissipation component (420) further comprises a plurality of card blocks (425), and the plurality of card blocks (425) are respectively arranged on the edge of the heat dissipation cover (421).

6. The high-speed optical module heat dissipation structure according to claim 1, characterized in that: The second heat dissipation component (410) comprises a base plate (411), a heat dissipation platform and a third heat conducting member, wherein the heat dissipation platform is arranged on the base plate (411) and corresponds to the functional component (200), and the third heat conducting member is arranged on the base plate (411) and contacts the heat dissipation housing.

7. The high-speed optical module heat dissipation structure according to claim 6, characterized in that: The functional component (200) is provided with a through hole, and the area of ​​the functional component (200) is connected with the area of ​​the heat dissipation platform through the through hole, and a fourth heat conducting member is arranged between two adjacent heat dissipation platforms.

8. The high-speed optical module heat dissipation structure according to claim 6, characterized in that: The second heat dissipation component (410) further comprises two side panels (415), wherein the two side panels (415) are respectively fixedly arranged on two sides of the bottom plate (411), and the two side panels (415) are both provided with a card slot (416).

9. A high-speed optical module, characterized in that: The invention comprises the heat dissipation structure of a high-speed optical module as described in any one of claims 1 to 8.

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