Packaging structure for small-size QFN (Quad Flat No-lead) module

Abstract

The invention relates to the technical field of QFN module packaging, and discloses a packaging structure for a small-size QFN module, and the packaging structure comprises a QFN module body, the bottom of the QFN module body is connected with a sliding plate, the outer wall of the sliding plate is slidably connected with a bottom plate, the outer wall of the bottom plate is slidably connected with a housing, and the housing is provided with a heat dissipation mechanism. Compared with a traditional QFN module, the QFN module body does not use a bonding wire to lead out a power signal and a driving signal, but adopts the conductor to lead out the power signal and the driving signal, so that the module is smaller in size, smaller in loop inductance, better in heat dissipation effect and higher in reliability; by starting the cooling fan to work, external cold air is sucked into the shell from the air inlet holes and flows around the QFN module body, so that the QFN module body is blown and cooled, module performance reduction caused by heat accumulation is effectively avoided, the service life of the QFN module body is prolonged, and the working stability of the QFN module body is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of QFN module packaging, in particular to a packaging structure for a small-size QFN-like module. Background Art

[0002] In QFN modules, signal extraction usually relies on the combination of bonding wires and frames. The bonding wires require a certain length and arc height, and the bonding points require the frame to provide pads of a certain size, which limits the thickness and length and width of the module, making it difficult to further reduce the size of the QFN module. At present, QFN packages are usually installed on assembly boards. Due to their poor heat dissipation effect, they are prone to generate heat over long periods of use. If they are not cooled in time, the operating effect will be affected. Therefore, a small-size QFN-like module packaging structure is proposed to solve the above-mentioned problems. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a packaging structure for a small-sized QFN-like module in view of the deficiencies in the above-mentioned prior art.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: a packaging structure for a small-size QFN-like module, comprising a QFN module body, a slide plate connected to the bottom of the QFN module body, a bottom plate slidably connected to the outer wall of the slide plate, a shell slidably connected to the outer wall of the bottom plate, and a heat dissipation mechanism provided on the shell; The QFN module body comprises: a chip carrier, the chip carrier is connected to the top of the slide plate, the top of the chip carrier is connected to a chip connection layer, the top of the chip connection layer is connected to an EMC, the top of the EMC is connected to a chip, the top of the chip is connected to a conductor connection layer, and the top of the conductor connection layer is connected to a conductor; The heat dissipation mechanism includes: an air inlet, an exhaust slot, and a mounting slot, the air inlet is opened on the back side of the shell, a cooling fan is connected to the front of the inner wall of the air inlet, the exhaust slot is opened on the top of the shell, an exhaust hole is opened at the bottom of the exhaust slot, the mounting slot is opened on the top of the shell and is connected to the exhaust slot, a sealing plate is slidably connected to the inner wall of the exhaust hole, two iron sheets are relatively fixedly connected to the outer wall of the sealing plate, and the outer walls of the two iron sheets are respectively slidably connected to the inner wall of the mounting slot, and the front and rear inner walls of the mounting slot are respectively connected to electromagnets and close to the top of the shell.

[0005] Preferably, a dustproof mechanism is provided on the shell, and the dustproof mechanism includes: Velcro A, the Velcro A is fixedly connected to the back side of the shell, Velcro B is adhered to the back side of the Velcro A, the Velcro A and Velcro B are both arranged in a ring shape and located at the air inlet, and the inner wall of the Velcro B is fixedly connected to a dustproof net.

[0006] Preferably, a sealing mechanism is provided on the shell, and the sealing mechanism includes: a connecting groove, which is opened inside the shell and is respectively connected to the air inlet hole and the mounting groove, the inner wall of the connecting groove is slidably connected with a sealing plate, and the top of the sealing plate is fixedly connected to the bottom of the iron sheet at the rear.

[0007] Preferably, a buffer mechanism is provided in the shell, and the buffer mechanism comprises: a support block and a sleeve, the support block is fixedly connected to the bottom inner wall of the shell, the top of the support block is connected to a spring damper, the top of the spring damper is connected to the bottom of the base plate, the sleeve is fixedly connected to the right inner wall of the shell, the inner wall of the sleeve is slidably connected to a sleeve rod, the right end of the sleeve rod is fixedly connected to a second spring, the other end of the second spring is fixedly connected to the inner wall of the sleeve, the left end of the sleeve rod is fixedly connected to a connecting block, the top of the connecting block is hinged with an articulated arm, and the top end of the articulated arm is hinged to the bottom of the base plate.

[0008] Preferably, the number of the sleeve, the sleeve rod, the second spring, the connecting block and the hinged arm are two, and they are relatively arranged on the left and right sides of the supporting block.

[0009] Preferably, a slide groove is provided on the top of the bottom plate, the front side of the slide groove is opened, and the bottom of the slide plate is slidably connected to the inner wall of the slide groove.

[0010] Preferably, a limiting mechanism is provided on the bottom plate, and the limiting mechanism comprises: a slot and two magnet blocks 1. The slot is opened in the front of the top of the bottom plate, and the two magnet blocks 1 are respectively embedded in the top of the bottom plate. A limiting plate is inserted into the interior of the slot, and the limiting plate is arranged in an inverted "L" shape. The back of the limiting plate abuts against the front of the skateboard, and two magnet blocks 2 are embedded on the inner side of the top of the limiting plate. The two magnet blocks 2 are respectively attracted to the two magnet blocks 1 by opposite sexes, and an anti-slip pad is fixedly connected to the front of the limiting plate.

[0011] Preferably, movable grooves are respectively provided on the left and right inner walls of the shell, and sliders are respectively fixedly connected to the left and right sides of the bottom plate, and the outer walls of the sliders are slidably connected to the inner walls of the movable grooves.

[0012] Preferably, an infrared temperature measurement module is connected to the top of the base plate, and a controller is connected to the upper back of the shell.

[0013] Preferably, a cover plate is screwed to the front of the shell, a signal lead-out hole is provided on the front of the cover plate, and fixing plates are respectively connected to the lower left and right sides of the shell, and a mounting hole is provided on the top of each fixing plate.

[0014] The present invention adopts the above technical solution to bring the following beneficial effects: 1. A packaging structure for a small-size QFN-like module. Compared with a traditional QFN module, the QFN module body no longer uses bonding wires to lead out power signals and drive signals, but uses conductors to lead out power signals and drive signals, so that the module size is smaller, the loop inductance is smaller, the heat dissipation effect is better, and the reliability is higher; by starting the heat dissipation fan, external cold air is sucked into the shell from the air inlet and flows around the QFN module body, thereby blowing and cooling the QFN module body, and at the same time, the electromagnet is energized to generate magnetic force, and the electromagnet adsorbs the iron sheet to slide vertically along the inner wall of the installation groove. The movement of the iron sheet drives the blocking plate to move along the inner wall of the exhaust hole into the exhaust groove, thereby opening the exhaust hole and connecting it with the exhaust groove. The cold air in the shell takes away the heat and is discharged from the exhaust groove and the exhaust hole, thereby realizing precise control of the exhaust, optimizing the heat dissipation effect according to the heating condition of the module, effectively avoiding the degradation of module performance due to heat accumulation, extending the service life of the QFN module body, and improving its working stability.

[0015] 2. This packaging structure for a small-size QFN-like module can effectively intercept dust and other impurities through the dustproof net, preventing them from entering the interior of the shell with the air, avoiding dust accumulation in the module to affect the heat dissipation efficiency and electrical performance, maintaining the cleanliness of the internal environment, and reducing the risk of module failure due to dust. The installation and replacement of the dustproof net are facilitated by the bonding of Velcro A and Velcro B.

[0016] 3. This packaging structure for a small-size QFN-like module can block the air inlet through the provided sealing plate when heat dissipation is not required, thereby preventing the intrusion of external moisture, dust, etc., effectively blocking the influence of external adverse factors on the module, protecting the internal chips and circuits from corrosion, and further improving the stability and environmental adaptability of the module. When the iron sheet moves, it drives the sealing plate to slide along the inner wall of the connecting groove, thereby opening the air inlet, which does not affect the entry of cold air.

[0017] 4. A packaging structure for a small-size QFN-like module, when subjected to external impact or vibration, the bottom plate is forced to drive the slider to slide along the inner wall of the movable groove, so that the bottom plate slides along the inner wall of the shell and compresses the spring damper and the hinged arm. The provided spring damper can absorb the impact force from the bottom, and at the same time, the hinged arm rotates along the hinge point and pushes the connecting block and the sleeve rod to slide along the inner wall of the sleeve. The sleeve rod compresses the second spring, and the elastic force of the second spring itself can effectively buffer the force, enhance the shock absorption effect, thereby preventing the QFN module body from being damaged due to excessive impact or vibration, ensuring the stability and reliability of the module in complex environments, and reducing the risk of module failure due to unexpected situations.

[0018] 5. A packaging structure for a small-size QFN-like module fixes a limit plate by the attraction between opposite poles of magnet block 1 and magnet block 2. The limit plate can firmly resist the slide plate to prevent it from being displaced during use, thereby ensuring the stable installation and use of the QFN module body. The limit plate is pushed upward to slide along the inner wall of the slot and drive magnet block 2 to separate from magnet block 1, thereby pulling the limit plate out of the slot, thereby releasing the limit on the slide plate, and then pulling the slide plate out of the slide groove, thereby taking the QFN module body out of the shell, which is convenient for maintenance and replacement of the QFN module body and improving production and use efficiency. The anti-slip pad is provided to increase the stability of the operation and facilitate the removal and placement of the limit plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front structural schematic diagram of the present invention; Figure 2 It is a right side cross-sectional view of the present invention; Figure 3 It is a front cross-sectional view of the present invention; Figure 4 for Figure 2 A magnified image of point A; Figure 5 is a right side cross-sectional view of the housing of the present invention; Figure 6 A top view of the base plate of the present invention; Figure 7 It is a left side cross-sectional view of the limiting plate of the present invention.

[0020] In the figure: 1. QFN module body; 101. chip carrier; 102. chip connection layer; 103. EMC; 104. chip; 105. conductor connection layer; 106. conductor; 2. slide plate; 3. bottom plate; 4. shell; 5. heat dissipation mechanism; 501. air inlet; 502. cooling fan; 503. exhaust slot; 504. exhaust hole; 505. installation slot; 506. blocking plate; 507. iron sheet; 508. electromagnet; 6. dustproof mechanism; 601. Velcro A; 602. Velcro B; 603. dustproof net; 7. sealing mechanism; 7 01. Connecting groove; 702. Sealing plate; 8. Buffer mechanism; 801. Support block; 802. Spring damper; 803. Sleeve; 804. Sleeve rod; 805. Second spring; 806. Connecting block; 807. Articulated arm; 9. Limiting mechanism; 901. Slot; 902. Magnet block one; 903. Limiting plate; 904. Magnet block two; 905. Anti-slip pad; 10. Slide groove; 11. Moving groove; 12. Sliding block; 13. Infrared temperature measurement module; 14. Controller; 15. Cover plate; 16. Signal lead-out hole; 17. Fixing plate; 18. Mounting hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, they can be fixedly connected or set, or detachably connected or set, or integrally connected or set. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0025] See also Figure 1-7An embodiment of the present invention is: a packaging structure for a small-size QFN-like module, comprising a QFN module body 1, a slide plate 2 is connected to the bottom of the QFN module body 1, a bottom plate 3 is slidably connected to the outer wall of the slide plate 2, a shell 4 is slidably connected to the outer wall of the bottom plate 3, a moving groove 11 is respectively opened on the inner walls of the left and right sides of the shell 4, a slider 12 is fixedly connected to the left and right sides of the bottom plate 3, the outer wall of the slider 12 is slidably connected to the inner wall of the moving groove 11, and a heat dissipation mechanism 5 is arranged on the shell 4; the QFN module body 1 comprises: a chip carrier 101, the chip carrier 101 is connected to the top of the slide plate 2, the top of the chip carrier 101 is connected to a chip connection layer 102, and the chip connection The top of layer 102 is connected to EMC 103, the top of EMC 103 is connected to chip 104, the top of chip 104 is connected to conductor connection layer 105, the top of conductor connection layer 105 is connected to conductor 106. Compared with the traditional QFN module, the QFN module body 1 no longer uses bonding wires to lead out power signals and drive signals, but uses conductor 106 to lead out power signals and drive signals, so that the module size is smaller, the loop inductance is smaller, the heat dissipation effect is better, and the reliability is higher; the heat dissipation mechanism 5 includes: an air inlet 501, an exhaust slot 503, and an installation slot 505. The air inlet 501 is opened on the back of the shell 4, and the front of the inner wall of the air inlet 501 is connected to a heat dissipation device. The fan 502 and the exhaust slot 503 are provided at the top of the shell 4, and an exhaust hole 504 is provided at the bottom of the exhaust slot 503. The mounting slot 505 is provided at the top of the shell 4 and is connected to the exhaust slot 503. The inner wall of the exhaust hole 504 is slidably connected with a blocking plate 506. Two iron sheets 507 are relatively fixedly connected to the outer wall of the blocking plate 506, and the outer walls of the two iron sheets 507 are respectively slidably connected with the inner wall of the mounting slot 505. The inner walls of the front and rear sides of the mounting slot 505 are respectively connected with electromagnets 508, and are close to the top of the shell 4. By starting the cooling fan 502, external cold air is sucked into the shell 4 from the air inlet 501 and flows around the QFN module body 1. Thus, the QFN module body 1 is cooled by blowing air, and at the same time, the electromagnet 508 is powered on to generate magnetic force. The electromagnet 508 adsorbs the iron sheet 507 and slides vertically along the inner wall of the installation groove 505. The movement of the iron sheet 507 drives the blocking plate 506 to move along the inner wall of the exhaust hole 504 into the exhaust groove 503, thereby opening the exhaust hole 504 and connecting it with the exhaust groove 503. The cold air in the shell 4 takes away the heat and is discharged from the exhaust groove 503 and the exhaust hole 504, thereby realizing precise control of the exhaust, optimizing the heat dissipation effect according to the heating condition of the module, effectively avoiding the degradation of the module performance due to heat accumulation, extending the service life of the QFN module body 1, and improving its working stability;The shell 4 is provided with a dustproof mechanism 6, which includes: Velcro A601, which is fixedly connected to the back of the shell 4, and Velcro B602 is bonded to the back of the Velcro A601. Velcro A601 and Velcro B602 are both arranged in a ring shape and located at the air inlet 501. The inner wall of Velcro B602 is fixedly connected with a dustproof net 603. The dustproof net 603 can effectively intercept dust and other impurities to prevent them from entering the shell 4 with the air, thereby avoiding dust accumulation in the module to affect the heat dissipation efficiency and electrical performance, thereby maintaining the cleanliness of the internal environment and reducing the risk of module failure caused by dust. The installation and replacement of the dustproof net 603 are convenient; a sealing mechanism 7 is arranged on the shell 4, and the sealing mechanism 7 comprises: a connecting groove 701, the connecting groove 701 is opened inside the shell 4, and is connected with the air inlet 501 and the installation groove 505 respectively, the inner wall of the connecting groove 701 is slidably connected with a sealing plate 702, and the top of the sealing plate 702 is fixedly connected with the bottom of the rear iron sheet 507, and the sealing plate 702 is arranged to block the air inlet 501 when heat dissipation is not required, to prevent the invasion of external moisture, dust, etc., effectively block the influence of external adverse factors on the module, protect the internal chip and circuit from erosion, further improve the stability and environmental adaptability of the module, and pass the iron sheet When 507 moves, it drives the sealing plate 702 to slide along the inner wall of the connecting groove 701, thereby opening the air inlet 501 without affecting the entry of cold air; the top of the bottom plate 3 is connected to an infrared temperature measurement module 13, and the upper back of the shell 4 is connected to a controller 14. The infrared temperature measurement module 13 can monitor the temperature of the QFN module body 1 in real time and transmit the data to the controller 14. The controller 14 can automatically control the cooling fan 502 and the electromagnet 508 to start according to the temperature information. This real-time monitoring and intelligent control mechanism can respond to the temperature change of the module in time, optimize the heat dissipation effect, and further improve the working performance and stability of the module; the front screw connection of the shell 4 is The cover plate 15 is provided to protect the internal structure of the housing 4, prevent dust, moisture, etc. from invading the external environment, and facilitate maintenance. A signal lead-out hole 16 is provided on the front of the cover plate 15, and the conductor 106 of the QFN module body 1 is conveniently connected to the external circuit through the provided signal lead-out hole 16. The lower left and right sides of the housing 4 are respectively connected with fixing plates 17, and the top of each fixing plate 17 is provided with a mounting hole 18. The fixing plates 17 and mounting holes 18 are provided to facilitate the installation and fixing of the entire packaging structure on the external device, providing a stable installation method, ensuring that the position of the module is fixed during use, and facilitating the overall assembly and operation of the device. ;

[0026] Working principle: The entire packaging structure is installed and fixed on the external equipment through the set fixing plate 17 and the mounting hole 18, and the temperature of the QFN module body 1 is monitored in real time through the infrared temperature measurement module 13, and the data is transmitted to the controller 14. The controller 14 automatically controls the cooling fan 502 and the electromagnet 508 to start according to the temperature information. When the cooling fan 502 works, the external cold air is sucked into the shell 4 from the air inlet 501 and flows around the QFN module body 1, so as to blow and dissipate the heat of the QFN module body 1. At the same time, the electromagnet 508 is energized to generate magnetic force. The electromagnet 508 adsorbs the iron sheet 507 and slides vertically along the inner wall of the mounting groove 505. The movement of the iron sheet 507 drives the blocking plate 506 to move along the inner wall of the exhaust hole 504 into the exhaust slot 503, thereby opening the exhaust hole 504 and connecting it with the exhaust slot 503. The cold air in the shell 4 After taking away the heat, it is discharged from the exhaust slot 503 and the exhaust hole 504, which effectively avoids the degradation of module performance caused by heat accumulation and prolongs the service life of the QFN module body 1. The dustproof net 603 can effectively intercept dust and other impurities to prevent them from entering the shell 4 with the air, avoid dust accumulation in the module to affect the heat dissipation efficiency and electrical performance, and keep the internal environment clean. The dustproof net 603 can be removed by tearing the Velcro A601 and the Velcro B602, which facilitates the installation and replacement of the dustproof net 603. The sealing plate 702 can block the air inlet 501 when heat dissipation is not required to prevent the invasion of external moisture, dust, etc. When heat dissipation is required, the sealing plate 702 is driven to slide along the inner wall of the connecting slot 701 when the iron sheet 507 moves, thereby opening the air inlet 501 without affecting the entry of cold air.

[0027] See also Figure 1-7On the basis of the above embodiment, in another embodiment of the present invention, a buffer mechanism 8 is arranged in the shell 4, and the buffer mechanism 8 includes: a support block 801 and a sleeve 803. The support block 801 is fixedly connected to the bottom inner wall of the shell 4. The top of the support block 801 is connected to a spring damper 802. The top of the spring damper 802 is connected to the bottom of the bottom plate 3. The sleeve 803 is fixedly connected to the right inner wall of the shell 4. The inner wall of the sleeve 803 is slidably connected to a sleeve rod 804. The right end of the sleeve rod 804 is fixedly connected to a second spring 805. The other end of the second spring 805 is fixedly connected to the inner wall of the sleeve 803. The left end of the sleeve rod 804 is fixedly connected to a connecting block 806. The top of the connecting block 806 is hinged with an articulated arm 807. The top of the articulated arm 807 is hinged to the bottom of the bottom plate 3. The sleeve 803, the sleeve rod 804, the second spring 805, and the connecting block 806 are hinged to each other. There are two connecting blocks 806 and two articulated arms 807, which are relatively arranged on the left and right sides of the support block 801. When subjected to external impact or vibration, the bottom plate 3 is forced to drive the slider 12 to slide along the inner wall of the movable groove 11, so that the bottom plate 3 slides along the inner wall of the shell 4 and compresses the spring damper 802 and the articulated arm 807. The spring damper 802 can absorb the impact force from the bottom. At the same time, the articulated arm 807 rotates along the hinge point and pushes the connecting block 806 and the sleeve rod 804 to slide along the inner wall of the sleeve 803. The sleeve rod 804 compresses the second spring 805. Under the action of the elastic force of the second spring 805 itself, it can effectively buffer the force and enhance the shock absorption effect, thereby preventing the QFN module body 1 from being damaged due to excessive impact or vibration, ensuring the stability and reliability of the module in a complex environment, and reducing the risk of module failure due to unexpected situations.

[0028] Working principle: When subjected to external impact or vibration, the bottom plate 3 is forced to drive the slider 12 to slide along the inner wall of the movable groove 11, so that the bottom plate 3 slides along the inner wall of the shell 4 and compresses the spring damper 802 and the hinge arm 807. The spring damper 802 can absorb the impact force from the bottom, and at the same time, the hinge arm 807 rotates along the hinge point and pushes the connecting block 806 and the sleeve rod 804 to slide along the inner wall of the sleeve 803. The sleeve rod 804 compresses the second spring 805. Under the action of the elastic force of the second spring 805 itself, it can effectively buffer the force and enhance the shock absorption effect, thereby preventing the QFN module body 1 from being damaged due to excessive impact or vibration.

[0029] See also Figure 1-7On the basis of the above embodiment, in another embodiment of the present invention, a slide groove 10 is provided on the top of the bottom plate 3, and the front opening of the slide groove 10 is set. The bottom of the slide plate 2 is slidably connected to the inner wall of the slide groove 10. The slide plate 2 slides along the inner wall of the slide groove 10, so that the slide plate 2 can be easily pulled out from the bottom plate 3, and the QFN module body 1 on the slide plate 2 can be easily repaired and maintained. A limiting mechanism 9 is set on the bottom plate 3, and the limiting mechanism 9 includes: a slot 901 and two magnet blocks 902. The slot 901 is opened at the front of the top of the bottom plate 3. The two magnet blocks 902 are respectively embedded in the top of the bottom plate 3. A limiting plate 903 is inserted inside the slot 901. The limiting plate 903 is set in an inverted "L" shape. The back of the limiting plate 903 abuts against the front of the slide plate 2. Two magnet blocks 904 are embedded in the inner side of the top of the limiting plate 903. The two magnet blocks 904 are respectively connected to the two magnet blocks 904. The iron block 1 902 attracts each other with opposite charges, and the front of the limit plate 903 is fixedly connected with an anti-skid pad 905. The limit plate 903 is fixed by the oppositely charged attraction between the magnet block 1 902 and the magnet block 2 904. The limit plate 903 can firmly resist the slide plate 2 to prevent it from being displaced during use, thereby ensuring the stable installation and use of the QFN module body 1. The limit plate 903 is pushed upward to slide along the inner wall of the slot 901 and drive the magnet block 2 904 to separate from the magnet block 1 902, thereby pulling the limit plate 903 out of the slot 901, thereby releasing the limit on the slide plate 2, and then pulling the slide plate 2 out of the slide groove 10, thereby taking the QFN module body 1 out of the shell 4, which is convenient for the maintenance and replacement of the QFN module body 1 and improving the production and use efficiency. The anti-skid pad 905 is provided to increase the stability of the operation and facilitate the removal and placement of the limit plate 903.

[0030] Working principle: The limit plate 903 is fixed by the oppositely charged attraction between the magnet block 1 902 and the magnet block 2 904. The limit plate 903 can firmly resist the slide plate 2 to prevent it from being displaced during use, thereby ensuring the stable installation and use of the QFN module body 1. When the QFN module body 1 needs to be maintained, the cover plate 15 is first opened, and the limit plate 903 is pushed upward to slide along the inner wall of the slot 901 and drive the magnet block 2 904 to separate from the magnet block 1 902, thereby pulling the limit plate 903 out of the slot 901, thereby releasing the limit on the slide plate 2, and then pulling the slide plate 2 out of the slide groove 10, thereby taking the QFN module body 1 out of the shell 4, which is convenient for the maintenance and replacement of the QFN module body 1.

[0031] It is worth noting that the cooling fan 502, electromagnet 508, spring damper 802, infrared temperature measurement module 13, and controller 14 in the above-mentioned embodiment are all commonly used equipment in the prior art, and the models used can be customized according to actual usage requirements. The power supply interface of the electrical equipment in the present invention is connected to the power supply system through a switch (not shown in the figure) and a wire (not shown in the figure) to achieve control thereof. The circuits and controls involved therein are all prior art and are well known in the current field of technology, and will not be described in detail here.

[0032] The present invention provides a packaging structure for a small-size QFN-like module. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention. All components not specified in this embodiment can be implemented using existing technologies.

Claims

1. A packaging structure for a small-size QFN-like module, comprising a QFN module body (1), characterized in that: The bottom of the QFN module body (1) is connected to a slide plate (2), the outer wall of the slide plate (2) is slidably connected to a bottom plate (3), the outer wall of the bottom plate (3) is slidably connected to a shell (4), and a heat dissipation mechanism (5) is provided on the shell (4); The QFN module body (1) comprises: a chip carrier (101), the chip carrier (101) being connected to the top of a slide plate (2), the top of the chip carrier (101) being connected to a chip connection layer (102), the top of the chip connection layer (102) being connected to an EMC (103), the top of the EMC (103) being connected to a chip (104), the top of the chip (104) being connected to a conductor connection layer (105), and the top of the conductor connection layer (105) being connected to a conductor (106); The heat dissipation mechanism (5) comprises: an air inlet (501), an air exhaust slot (503), and a mounting slot (505); the air inlet (501) is provided on the back of the shell (4); a heat dissipation fan (502) is connected to the front of the inner wall of the air inlet (501); the air exhaust slot (503) is provided on the top of the shell (4); an air exhaust slot (504) is provided at the bottom of the air exhaust slot (503); the mounting slot (505) is provided on the top of the shell (4) and is connected to the air exhaust slot (503); a blocking plate (506) is slidably connected to the inner wall of the air exhaust hole (504); two iron sheets (507) are relatively fixedly connected to the outer wall of the blocking plate (506); and the outer walls of the two iron sheets (507) are respectively slidably connected to the inner wall of the mounting slot (505); and electromagnets (508) are respectively connected to the inner walls of the front and rear sides of the mounting slot (505) and are close to the top of the shell (4).

2. The package structure for a small-size QFN-like module according to claim 1, characterized in that: The shell (4) is provided with a dustproof mechanism (6), the dustproof mechanism (6) comprising: a Velcro A (601), the Velcro A (601) being fixedly connected to the back of the shell (4), the back of the Velcro A (601) being adhered with a Velcro B (602), the Velcro A (601) and the Velcro B (602) both being arranged in a ring shape and being located at the air inlet (501), the inner wall of the Velcro B (602) being fixedly connected with a dustproof net (603).

3. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: The shell (4) is provided with a sealing mechanism (7), the sealing mechanism (7) comprising: a connecting groove (701), the connecting groove (701) being provided inside the shell (4) and being connected to the air inlet hole (501) and the mounting groove (505) respectively, a sealing plate (702) being slidably connected to the inner wall of the connecting groove (701), and the top of the sealing plate (702) being fixedly connected to the bottom of the rear iron sheet (507).

4. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: A buffer mechanism (8) is arranged in the shell (4), and the buffer mechanism (8) comprises: a support block (801) and a sleeve (803), wherein the support block (801) is fixedly connected to the bottom inner wall of the shell (4), the top of the support block (801) is connected to a spring damper (802), the top of the spring damper (802) is connected to the bottom of the base plate (3), the sleeve (803) is fixedly connected to the right inner wall of the shell (4), and the sleeve (803) is fixedly connected to the right inner wall of the shell (4). The inner wall of the cylinder (803) is slidably connected to a sleeve rod (804), the right end of the sleeve rod (804) is fixedly connected to a second spring (805), the other end of the second spring (805) is fixedly connected to the inner wall of the sleeve (803), the left end of the sleeve rod (804) is fixedly connected to a connecting block (806), the top of the connecting block (806) is hinged to a hinged arm (807), and the top end of the hinged arm (807) is hinged to the bottom of the bottom plate (3).

5. The packaging structure for a small-size QFN-like module according to claim 4, characterized in that: The sleeve (803), the sleeve rod (804), the second spring (805), the connecting block (806), and the hinged arm (807) are each provided in two pieces, and are arranged on the left and right sides of the supporting block (801) in a relative manner.

6. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: A slide groove (10) is provided at the top of the bottom plate (3), the front side of the slide groove (10) is open, and the bottom of the slide plate (2) is slidably connected to the inner wall of the slide groove (10).

7. The packaging structure for a small-size QFN-like module according to claim 6, characterized in that: A limiting mechanism (9) is provided on the bottom plate (3), the limiting mechanism (9) comprising: a slot (901) and two magnet blocks (902); the slot (901) is provided at the top front of the bottom plate (3); the two magnet blocks (902) are respectively embedded in the top of the bottom plate (3); a limiting plate (903) is inserted into the inside of the slot (901); the limiting plate (903) is arranged in an inverted "L" shape; the back of the limiting plate (903) abuts against the front of the slide plate (2); two magnet blocks (904) are embedded in the inner side of the top of the limiting plate (903); the two magnet blocks (904) are attracted to the two magnet blocks (902) respectively by opposite polarities; and an anti-slip pad (905) is fixedly connected to the front of the limiting plate (903).

8. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: The left and right inner walls of the housing (4) are respectively provided with movable grooves (11), the left and right sides of the bottom plate (3) are respectively fixedly connected with sliders (12), and the outer walls of the sliders (12) are slidably connected to the inner walls of the movable grooves (11).

9. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: An infrared temperature measurement module (13) is connected to the top of the base plate (3), and a controller (14) is connected to the upper back of the housing (4).

10. The packaging structure for a small-size QFN-like module according to claim 1, characterized in that: The front surface of the housing (4) is screwed to a cover plate (15), the front surface of the cover plate (15) is provided with a signal lead-out hole (16), and the lower left and right sides of the housing (4) are respectively connected to fixing plates (17), and the top of each fixing plate (17) is provided with a mounting hole (18).

Images