Leakage-wave-proof packaging structure based on electromagnetic metamaterial

Abstract

The invention belongs to the technical field of microwave and millimeter wave and sub-terahertz-terahertz communication, and provides a leaky-wave-proof packaging structure based on an electromagnetic metamaterial, and the leaky-wave-proof packaging structure is suitable for chip packaging of a super-large substrate. The antenna comprises an input waveguide, a dielectric substrate, a probe circuit, an on-chip circuit and a wave leakage prevention structure, the probe circuit is arranged on the dielectric substrate and forms a microstrip metal probe structure together with the dielectric substrate, the probe structure is inserted into the input waveguide, and an electromagnetic wave is input from the input waveguide, converted into a microstrip mode through the probe structure and output to the on-chip circuit; the input waveguide is provided with a gap corresponding to the probe structure, the wave leakage prevention structure is composed of a plurality of electromagnetic metamaterial units, and the electromagnetic metamaterial units are arranged on the outer side of the input waveguide along the gap in a surrounding mode. The invention creatively provides a leaky wave prevention structure based on the electromagnetic metamaterial to prevent leaky waves, and realizes chip packaging of a complex and super-large substrate based on the leaky wave prevention structure, so that the boundary of chip packaging is widened, and the flexibility and adaptability of a packaging technology are also improved.

Description

Technical Field

[0001] The present invention belongs to the field of microwave millimeter wave and sub-terahertz communication technology, and specifically provides an anti-leakage wave packaging structure based on electromagnetic metamaterials, which is particularly suitable for ultra-large substrate packaging. Background Art

[0002] Waveguide-microstrip probe transition is the most widely used transition structure in millimeter wave circuits and terahertz circuits. Its circuit principle is similar to that of coaxial-waveguide probe conversion. The electromagnetic field is converted from the TE10 mode of a single conductor transmission mode to the TEM or quasi-TEM transmission mode of a dual conductor on-chip circuit through a coupled probe structure. However, due to the great limitations on the special-shaped cutting of on-chip circuit substrates, uncut circuit substrates will introduce gaps during packaging, resulting in leakage waves, which ultimately affects the packaging performance. In addition, when multiple separate on-chip structures need to be connected, gold wire jumpers and other technologies are often used. In addition to the high difficulty of assembly, this also limits the design of the on-chip structure to a certain extent, greatly increases the loss, and greatly increases the uncertainty of device performance. In response to this problem, the present invention provides an anti-leakage wave packaging structure based on a new packaging concept. Summary of the invention

[0003] The purpose of the present invention is to provide an anti-leakage wave packaging structure based on artificial microstructures in response to many shortcomings of traditional packaging technology. The present invention creatively proposes an anti-leakage wave structure based on electromagnetic metamaterials (artificial microstructures), and utilizes the unique physical and structural properties of electromagnetic metamaterials to achieve precise control of the electromagnetic wave propagation path, avoid leakage waves, and achieve anti-leakage wave effects. Therefore, chip packaging of complex and ultra-large substrates is achieved based on the anti-leakage wave structure, which not only broadens the boundaries of chip packaging, but also greatly improves the flexibility and adaptability of packaging technology.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A leakage-proof packaging structure based on electromagnetic metamaterials comprises: an input waveguide, a dielectric substrate, an on-chip circuit and an leakage-proof structure; characterized in that the probe circuit is arranged on the dielectric substrate and together constitutes a microstrip metal probe structure, the microstrip metal probe structure is inserted into the input waveguide, the on-chip circuit is arranged on the dielectric substrate and connected to the probe circuit, and the electromagnetic wave is input from the input waveguide and converted into a microstrip mode through the probe structure and output to the on-chip circuit; a gap is provided in the input waveguide corresponding to the probe structure, the leakage-proof structure consists of a plurality of electromagnetic metamaterial units, and the plurality of electromagnetic metamaterial units are arranged along the gap on the outside of the input waveguide.

[0006] Furthermore, the stop band of the electromagnetic metamaterial unit overlaps with the main mode frequency band of the input waveguide.

[0007] Furthermore, the electromagnetic metamaterial unit adopts a single-sided electromagnetic metamaterial structure, which is composed of a metal base and a metal attachment. The metal base is arranged above or below the dielectric substrate, and the bottom end of the metal attachment is connected to the metal base, and the top end maintains a gap or direct contact with the dielectric substrate.

[0008] Furthermore, the electromagnetic metamaterial unit adopts a double-sided electromagnetic metamaterial structure, and the double-sided electromagnetic metamaterial structure is composed of two single-sided electromagnetic metamaterial structures, and the two single-sided electromagnetic metamaterial structures are symmetrically arranged with respect to the dielectric substrate.

[0009] Furthermore, the metal attachment is a columnar attachment, a spherical attachment, a hemispherical attachment, a conical attachment, a terrace attachment or a polyhedral attachment.

[0010] Furthermore, the input waveguide is a rectangular waveguide, a circular waveguide, an elliptical waveguide or a ridge waveguide.

[0011] Furthermore, in the anti-leakage wave structure, several electromagnetic metamaterial units are arranged in a single layer or multiple layers, and each layer is arranged in a straight line or a curve; several electromagnetic metamaterial units are arranged uniformly or non-uniformly.

[0012] Based on the above technical solution, the beneficial effects of the present invention are:

[0013] The present invention provides an anti-leakage wave packaging structure based on an artificial microstructure, creatively proposes to use the anti-leakage wave structure based on an electromagnetic metamaterial (artificial microstructure) to perform gold wire bonding-free chip packaging, and utilizes the unique physical and structural properties of the electromagnetic metamaterial to achieve precise control of the electromagnetic wave propagation path, avoid leakage waves, and achieve an anti-leakage wave effect; further, a plurality of electromagnetic metamaterial units are arranged along the waveguide gap on the outside of the input waveguide to simulate the formation of a perfect electrical boundary short-circuit surface at the end of the input waveguide, thereby ensuring that the electromagnetic wave propagates along the microstrip and avoids leakage waves at the gap, thereby realizing chip packaging of complex and ultra-large substrates, which not only broadens the boundaries of chip packaging, but also greatly improves the flexibility and adaptability of packaging technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the structure of the leaky wave prevention packaging structure based on electromagnetic metamaterials in an embodiment of the present invention.

[0015] Figure 2 Schematic diagram of the structure of the electromagnetic metamaterial unit of the anti-leakage wave structure in the embodiment of the present invention, wherein (a) is a single-sided electromagnetic metamaterial structure, and (b) is a double-sided electromagnetic metamaterial structure.

[0016] Figure 3 Graph showing the dispersion of the electromagnetic metamaterial unit of the leaky wave prevention structure in an embodiment of the present invention.

[0017] Figure 4 It is an S11 curve diagram of the leaky wave prevention packaging structure based on electromagnetic metamaterials in an embodiment of the present invention.

[0018] Figure 5 It is an S21 curve diagram of the leaky wave prevention packaging structure based on electromagnetic metamaterials in an embodiment of the present invention.

[0019] Figure 6 Schematic diagram of the structure of various input waveguides in an embodiment of the present invention.

[0020] Figure 7 Schematic diagram of the structure of various metal attachments in the electromagnetic metamaterial unit in an embodiment of the present invention.

[0021] Figure 8 Schematic diagram of the arrangement of various electromagnetic metamaterial units in the anti-leakage wave structure in an embodiment of the present invention.

[0022] Fig. 9 Schematic diagram of the distribution position of the anti-leakage wave packaging structure based on electromagnetic metamaterials on the chip in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and beneficial effects of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0024] The present invention provides an anti-leakage wave packaging structure based on electromagnetic metamaterials, the structure of which is as follows Figure 1 As shown, from left to right are the main view, side view and top view, specifically including: an input waveguide, a dielectric substrate, a probe circuit, an on-chip circuit and an anti-leakage wave structure; the probe circuit is arranged on the dielectric substrate and together constitutes a microstrip metal probe structure, the microstrip metal probe structure is inserted into the input waveguide, the on-chip circuit is arranged on the dielectric substrate and connected to the probe circuit, and the electromagnetic wave is input from the input waveguide and converted into a microstrip mode through the probe structure and output to the on-chip circuit; the input waveguide has a gap corresponding to the probe structure, and the anti-leakage wave structure consists of a plurality of electromagnetic metamaterial units, and the plurality of electromagnetic metamaterial units are arranged along the gap on the outside of the input waveguide.

[0025] Furthermore, the electromagnetic metamaterial unit adopts a single-sided electromagnetic metamaterial structure or a double-sided electromagnetic metamaterial structure, the single-sided electromagnetic metamaterial structure is composed of a metal base and a metal attachment, the metal base is arranged above or below the dielectric substrate, the bottom end of the metal attachment is connected to the metal base, and the top end of the metal attachment maintains a gap or is in direct contact with the dielectric substrate, such as Figure 2As shown in (a); the double-sided electromagnetic metamaterial structure is composed of two single-sided electromagnetic metamaterial structures, and the two single-sided electromagnetic metamaterial structures are symmetrically arranged about the dielectric substrate, as shown in Figure 2 As shown in (b).

[0026] Specifically, in a preferred embodiment, the input waveguide adopts a standard rectangular waveguide WR-4, covering the full frequency band of 170 GHz to 260 GHz. The probe structure is one quarter wavelength away from the waveguide short circuit of the input waveguide. The electromagnetic wave is input from the input waveguide, and is converted into a microstrip mode after coupling with the microstrip metal probe structure, and is output to the on-chip circuit; the electromagnetic metamaterial unit adopts a double-sided electromagnetic metamaterial structure, such as Figure 2 As shown in (b), the metal attachment is a rectangular metal column, and the dispersion characteristics of the electromagnetic metamaterial unit are simulated and tested. The results are as follows: Figure 3 As shown in FIG. 1 , its stop band covers the full frequency band of the standard waveguide (170 GHz to 260 GHz), achieving a wave blocking effect and forming a high reflectivity surface, thereby effectively preventing leakage waves. The S parameter simulation test of the anti-leakage wave packaging structure in this embodiment is performed, and the S11 parameter is as follows: Figure 4 As shown, the S21 parameters are as follows Figure 5 As shown in the figure, it can be seen that based on the anti-leakage wave packaging structure provided by the present invention, the S11 parameter is lower than -16dB, with very good coupling performance, and the S21 parameter is higher than -0.45dB, indicating that the electromagnetic wave loss is very low during microstrip transmission of the main transmission line.

[0027] It should be noted that, in other preferred embodiments, the input waveguide may also be a circular waveguide, an elliptical waveguide, a ridge waveguide, etc. Figure 6 As shown; the metal attachment can also be a spherical attachment, a hemispherical attachment, a conical attachment, a terrace attachment, a polyhedral attachment, etc., such as Figure 7 As shown; the plurality of electromagnetic metamaterial units in the anti-leakage wave structure may be arranged in a single layer or multiple layers, may be arranged uniformly (arranged at equal intervals) or non-uniformly (arranged at unequal intervals), may be arranged in a straight line or in a curve, such as Figure 8 As shown; the anti-leakage wave packaging structure based on electromagnetic metamaterials can be located at the corners, edges, center, etc. of the chip, such as Fig. 9 As shown; the above structures can be adaptively selected through simulation optimization according to actual application requirements without violating the present invention.

[0028] The above description is only a specific implementation mode of the present invention. Any feature disclosed in this specification, unless otherwise stated, can be replaced by other alternative features that are equivalent or have similar purposes; all the disclosed features, or all the steps in the methods or processes, except for mutually exclusive features and / or steps, can be combined in any way.

Claims

1. An anti-leakage wave packaging structure based on electromagnetic metamaterials, comprising: An input waveguide, a dielectric substrate, a probe circuit, an on-chip circuit and an anti-leakage wave structure; characterized in that the probe circuit is arranged on the dielectric substrate and together constitutes a microstrip metal probe structure, the microstrip metal probe structure is inserted and arranged in the input waveguide, the on-chip circuit is arranged on the dielectric substrate and connected to the probe circuit, and the electromagnetic wave is input from the input waveguide and converted into a microstrip mode through the probe structure and output to the on-chip circuit; a gap is opened in the input waveguide corresponding to the probe structure, and the anti-leakage wave structure consists of a plurality of electromagnetic metamaterial units, and the plurality of electromagnetic metamaterial units are arranged along the gap on the outside of the input waveguide.

2. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 1, characterized in that: The stop band of the electromagnetic metamaterial unit overlaps with the main mode frequency band of the input waveguide.

3. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 1 is characterized in that The electromagnetic metamaterial unit adopts a single-sided electromagnetic metamaterial structure, which is composed of a metal base and a metal attachment. The metal base is arranged above or below a dielectric substrate, and the bottom end of the metal attachment is connected to the metal base, and the top end maintains a gap or direct contact with the dielectric substrate.

4. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 3 is characterized in that The electromagnetic metamaterial unit adopts a double-sided electromagnetic metamaterial structure, which is composed of two single-sided electromagnetic metamaterial structures, and the two single-sided electromagnetic metamaterial structures are symmetrically arranged about the dielectric substrate.

5. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 3 is characterized in that The metal attachment is a columnar attachment, a spherical attachment, a hemispherical attachment, a cone attachment, a terrace attachment or a polyhedron attachment.

6. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 1 is characterized in that The input waveguide is a rectangular waveguide, a circular waveguide, an elliptical waveguide or a ridge waveguide.

7. The anti-leakage wave packaging structure based on electromagnetic metamaterials according to claim 1 is characterized in that In the anti-leakage wave structure, several electromagnetic metamaterial units are arranged in a single layer or multiple layers, and each layer is arranged in a straight line or a curve; several electromagnetic metamaterial units are arranged uniformly or non-uniformly.

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