Display panel and electronic equipment

Abstract

The invention provides a display panel and electronic equipment. The display panel comprises a substrate; the first wiring layer is positioned on one side of the substrate; the first insulating layer is positioned on one side, far away from the substrate, of the first wiring layer; the first electrode comprises a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprises at least two stacked conductive sub-layers; the filling unit is at least partially located in the sunken structure; the second film layer structure is located on the side, away from the substrate, of the first film layer structure and the filling unit, and at least part of the second film layer structure makes contact with the second part of the first film layer structure. According to the display panel and the electronic equipment, the first film layer structure, extending into the first through hole, of the first electrode is set to be provided with the at least two conductive sub-layers, the continuity of the first film layer structure can be improved, and the risk that dark spots exist on the display panel due to breakage of the first film layer structure is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices. In the preparation process of traditional display panels, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A record relevant contents of the non-fine metal mask technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located at a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first part and a second part connected to each other, the first part being located on a side of the first insulating layer away from the substrate, the second part extending along the side wall of the first through hole into the first through hole to form a recessed structure and contacting the first wiring layer; the first film layer structure comprising at least two stacked conductive sublayers; the filling unit being at least partially located in the recessed structure; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, and at least a portion of the second film layer structure being in contact with the second part of the first film layer structure.

[0005] In some possible implementations, the first film layer structure includes a first conductive sublayer and a second conductive sublayer stacked in a direction away from the substrate, the material of the first conductive sublayer includes indium tin oxide, and the material of the second conductive sublayer includes silver; Alternatively, the first film layer structure includes a first conductive sublayer, a second conductive sublayer and a third conductive sublayer stacked in sequence in a direction away from the substrate, the first conductive sublayer and the third conductive sublayer are made of indium tin oxide, and the second conductive sublayer is made of silver.

[0006] In some possible implementations, the second film layer structure includes a fourth conductive sublayer, and a material of the fourth conductive sublayer includes indium tin oxide.

[0007] In some possible implementations, the thickness of the second conductive sublayer is greater than or equal to 800 angstroms.

[0008] In some possible implementations, the second film layer structure includes a fifth conductive sublayer and a sixth conductive sublayer stacked in a direction away from the substrate, the material of the fifth conductive sublayer includes silver, and the material of the sixth conductive sublayer includes indium tin oxide.

[0009] In some possible implementations, the thickness of the second conductive sublayer is greater than or equal to 200 angstroms.

[0010] In some possible implementations, an angle between a side wall of the first insulating layer facing the first through hole and a side of the first insulating layer away from the substrate is greater than or equal to 110 degrees; Alternatively, an angle between a side wall of the first insulating layer facing the first through hole and a side of the first wiring layer away from the substrate is greater than or equal to 110 degrees.

[0011] In some possible implementations, a sidewall of the first insulating layer facing the first through hole has a step structure.

[0012] In some possible implementations, the display panel also includes a second insulating layer located on a side of the first insulating layer away from the substrate, the material of the first insulating layer includes an organic material, and the material of the second insulating layer includes an inorganic material; the first through hole passes through the first insulating layer and the second insulating layer, and at least a portion of the first film layer structure is located on a side of the second insulating layer away from the substrate.

[0013] In some possible implementations, the display panel further includes: A pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer being provided with a plurality of pixel openings, the pixel openings respectively exposing the first electrodes; An isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure comprising an isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the corresponding isolation opening on the substrate; A plurality of light-emitting devices have light-emitting functional layers and second electrodes, wherein the light-emitting functional layers and the second electrodes are located in the corresponding isolation openings and on a side of the first electrode away from the substrate.

[0014] In some possible implementations, an orthographic projection of the filling unit on the substrate is located within an orthographic projection of the pixel opening on the substrate.

[0015] In some possible implementations, at least some of the first film layer structures and / or the second film layer structures of the first electrodes of the light-emitting devices that are adjacent and emit the same light color are connected to each other.

[0016] In some possible implementations, the display panel further includes a plurality of packaging units, and the packaging units are located on a side of the corresponding light-emitting device away from the substrate.

[0017] In some possible implementations, at least a portion of the packaging unit is located in the isolation opening, and at least a portion of the packaging unit is located on a side of the isolation structure away from the substrate.

[0018] In some possible implementations, the display panel further includes a first encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate, and a second encapsulation layer located on a side of the first encapsulation layer away from the substrate.

[0019] In some possible implementations, the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, and an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate.

[0020] In some possible implementations, the isolation structure further includes a receiving portion located between the supporting portion and the substrate; an orthographic projection of the receiving portion on the substrate is located within an orthographic projection of the shielding portion on the substrate.

[0021] The present application also provides a display panel, the display panel comprising: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located at a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, the second portion extending along the sidewall of the first through hole into the first through hole to form a recessed structure and in contact with the first wiring layer; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, at least a portion of the second film layer structure in contact with the second portion of the first film layer structure; The first film layer structure and / or the second film layer structure of the first electrode of the light-emitting devices which are at least partially adjacent and emit light of the same color are connected to each other.

[0022] The present application also provides a display panel, the display panel comprising: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located on a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; and a side wall of the first insulating layer facing the first through hole being in a step structure; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first part and a second part connected to each other, the first part being located on a side of the first insulating layer away from the substrate, the second part extending along the side wall of the first through hole into the first through hole to form a recessed structure and contacting the first wiring layer; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, and at least a part of the second film layer structure contacting the second part of the first film layer structure.

[0023] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application.

[0024] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel and an electronic device. By setting the first film layer structure extending from the first electrode to the first through hole to have at least two conductive sublayers, the continuity of the first film layer structure can be improved and the risk of dark spots on the display panel due to breakage of the first film layer structure can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 is a schematic diagram of an existing related display panel; Figure 2 Schematic diagram of the display panel provided in this application Figure 1 ; Figure 3 Schematic diagram of the display panel provided in this application Figure 2 ; Figure 4 Schematic diagram of the display panel provided in this application Figure 3 ; Figure 5 Schematic diagram of the display panel provided in this application Figure 4 ; Figure 6 Schematic diagram of the display panel provided in this application Figure 5 ; Figure 7 Schematic diagram of the display panel provided in this application Figure 6 ; Figure 8 Schematic diagram of the display panel provided in this application Figure 7 ; Fig. 9 One of the step structure schematic diagrams provided for this application; Fig.10 The second schematic diagram of the step structure provided for this application; Fig.11 Schematic diagram of the display panel provided in this application Figure 8 ; Fig.12 A schematic diagram of the layout of the light-emitting devices of the display panel provided in the present application; Fig.13 Schematic diagram of the display panel provided in this application Figure 9 ; Fig.14Schematic diagram of the display panel provided in this application Figure 10 ; Fig.15 Schematic diagram of the display panel provided in this application Figure 10 one; Fig.16 Schematic diagram of the display panel provided in this application Figure 10 two; Fig.17 Schematic diagram of the display panel provided in this application Figure 10 three; Fig.18 One of the schematic diagrams of the isolation structure provided in this application; Fig.19 The second schematic diagram of the isolation structure provided for this application; Fig. 20 Schematic diagram of the display panel provided in this application Figure 10 Four; Fig.21 Schematic diagram of the display panel provided in this application Figure 10 five; Fig. 22 Schematic diagram of the display panel provided in this application Figure 10 six.

[0027] Icon: 100 (100') - substrate; 110 (110') - array functional layer; 1116 (1116') - first wiring layer; 1117 (1117') - first insulating layer; 1118 - second insulating layer; 120 (120') - first electrode; 121' - first sublayer; 122' - second sublayer; 123' - third sublayer; 710 - first film layer structure; 711 - first conductive sublayer; 712 - second conductive sublayer; 713 - third conductive sublayer; 7101 - first part; 7102 - second part; 720 - second film layer structure; 721 - fourth conductive sublayer; 722 - fifth conductive sublayer; 723 - sixth conductive sublayer; 701 (701') - concave Trapped structure; 130 (130')-pixel defining layer; 140 (140')-isolation structure; 141-supporting part; 142-shielding part; 143-receiving part; 810 (810')-light-emitting device; 811-first light-emitting device; 812-second light-emitting device; 813-third light-emitting device; 910 (910')-isolation opening; 920-pixel opening; 150 (150')-light-emitting functional layer; 160 (160')-second electrode; 170 (170')-packaging unit; 180-first packaging layer; 190-second packaging layer; 610-filling unit; 501-first side surface; 502-second side surface; 503-first step surface; 504-second step surface. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invention product is usually placed when in use, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0033] In order to increase the pixel density of the display panel, it is necessary to reduce the spacing distance between the light emitting devices 810'. Figure 1 In some related display panels, the via hole of the first electrode 120' originally set between the pixel openings (i.e., the via hole connecting the first electrode 120' and the first wiring layer 1116' in the array function layer 110') is set at a corresponding position within the pixel opening. The first electrode 120' generally includes a first sublayer 121', a second sublayer 122', and a third sublayer 123' which are stacked.

[0034] In this case, in order to ensure the flatness of the first electrode 120' at the via hole, after setting the first sublayer 121' extending into the via hole, a filling unit 610' is usually set in the recessed structure 701' formed by the first sublayer 121' sinking into the via hole, and then other sublayers of the first electrode 120' are set.

[0035] Research has found that in this type of display panel, due to the poor climbing formation of the first sublayer 121', disconnection is easily caused at the via hole, resulting in poor electrical connection between the first electrode 120' and the first wiring layer 1116' as a whole, which in turn causes dark spots in the display panel.

[0036] In view of this, this embodiment provides a solution for improving the conductive connection effect of the first electrode in the above scenario. The solution provided by this embodiment is described in detail below.

[0037] See also Figures 2 to 5 , Figures 2 to 5 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 100 , a first wiring layer 1116 , a first insulating layer 1117 and at least one light emitting device 810 .

[0038] In this embodiment, the material of the substrate 100 may include a rigid material, such as glass; or the material of the substrate 100 may include a flexible material, such as polyimide (Pi).

[0039] An array function layer 110 may also be provided on one side of the substrate 100. The array function layer 110 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuits.

[0040] The first wiring layer 1116 is located at one side of the substrate 100. For example, the first wiring layer 1116 may be a conductive layer in the array functional layer 110 that is away from the substrate 100.

[0041] The first insulating layer 1117 is located on a side of the first wiring layer 1116 away from the substrate 100, and the first insulating layer 1117 is provided with at least one first through hole exposing the first wiring layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0042] The light emitting device 810 includes a first electrode 120 , and the first electrode 120 includes a first film layer structure 710 , a filling unit 610 and a second film layer structure 720 .

[0043] See also Figure 6 The first film layer structure 710 includes a first part 7101 and a second part 7102 that are connected to each other. The first part 7101 is located on a side of the first insulating layer 1117 away from the substrate 100, and the second part 7102 extends along the side wall of the first through hole into the first through hole to form a recessed structure 701 and contact the first routing layer 1116.

[0044] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection on the first film layer structure 710. The first film layer structure 710 extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole to contact the first wiring layer 1116. In this case, the first film layer structure 710 is sunken into the first through hole to form a recessed structure 701. The first film layer structure 710 includes at least two stacked conductive sublayers, and both conductive sublayers extend into the first through hole.

[0045] The filling unit 610 is at least partially located in the recessed structure 701 , that is, the filling unit 610 fills the recessed structure 701 formed by the first conductive sublayer 711 , so that the filling unit 610 and the first film layer structure 710 together form a relatively flat surface for setting the second film layer structure 720 .

[0046] The second film layer structure 720 is located on a side of the first film layer structure 710 and the filling unit 610 away from the substrate 100 , and at least a portion of the second film layer structure 720 is in contact with the second portion 7102 of the first film layer structure 710 .

[0047] Based on the above design, in the display panel provided in this embodiment, by extending the first electrode 120 to the first film layer structure 710 in the first through hole to have at least two conductive sub-layers, the continuity of the first film layer structure 710 can be improved and the risk of dark spots on the display panel due to breakage of the first film layer structure 710 can be reduced.

[0048] For some possible implementations, see Figure 7 The display panel provided in this embodiment may further include a pixel defining layer 130 and an isolation structure 140 .

[0049] The pixel defining layer 130 is located at a side of the first electrode 120 away from the substrate 100 . The pixel defining layer 130 is provided with a plurality of pixel openings 920 . The pixel openings 920 expose the first electrodes 120 respectively.

[0050] The isolation structure 140 is located on the side of the pixel defining layer 130 away from the substrate 100. The isolation structure 140 includes an isolation opening 910. The orthographic projection of the pixel opening 920 on the substrate 100 is located within the orthographic projection of the corresponding isolation opening 910 on the substrate 100. That is, the pixel opening 920 and the isolation opening 910 are connected.

[0051] The light emitting device 810 further includes a light emitting functional layer 150 and a second electrode 160 . The light emitting functional layer 150 and the second electrode 160 are located in the corresponding isolation opening 910 and on a side of the first electrode 120 away from the substrate 100 .

[0052] The isolation structure 140 is conductive, and the second electrode 160 is electrically connected to the isolation structure 140. For example, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 110, and the second electrode 160 can be connected to the power supply line providing the common voltage through the isolation structure 140, and when the driving current is transmitted to the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 is driven to emit light.

[0053] For some possible implementations, see Figure 2 and Figure 3 The first film layer structure 710 includes a first conductive sublayer 711 and a second conductive sublayer 712 stacked in a direction away from the substrate 100. The material of the first conductive sublayer 711 includes indium tin oxide, and the material of the second conductive sublayer 712 includes silver. In this way, since silver has good ductility, the second conductive sublayer 712 made of silver is also set to extend into the first through hole and cover the first conductive sublayer 711 made of indium tin oxide. In the case that the first conductive sublayer 711 may be broken, the second conductive sublayer 712 can ensure the overall conductive performance of the first film layer structure 710.

[0054] For some possible implementations, see Figure 4 and Figure 5, the first film layer structure 710 includes a first conductive sublayer 711, a second conductive sublayer 712 and a third conductive sublayer 713 which are sequentially stacked in a direction away from the substrate 100, the materials of the first conductive sublayer 711 and the third conductive sublayer 713 include indium tin oxide, and the material of the second conductive sublayer 712 includes silver. In this way, since silver has good ductility, the second conductive sublayer 712 made of silver is also set to extend into the first through hole and cover the first conductive sublayer 711 made of indium tin oxide. In the case that the first conductive sublayer 711 may be broken, the second conductive sublayer 712 can ensure the overall conductive performance of the first film layer structure 710. In addition, the second conductive sublayer 712 is covered by the third conductive sublayer 713 with better stability, thereby reducing the risk of poor conductive effect and poor adhesion of the film layer due to oxidation of the surface of the second conductive sublayer 712 due to excessive exposure area.

[0055] For some possible implementations, see Figure 2 and Figure 4 The second film layer structure 720 includes a fourth conductive sublayer 721, and the material of the fourth conductive sublayer 721 includes indium tin oxide.

[0056] Optionally, in this case, the thickness W1 of the second conductive sublayer 712 is greater than or equal to 800 angstroms, so as to ensure the continuity of the second conductive sublayer 712 and reduce the overall impedance of the first film layer structure 710 .

[0057] For other possible implementations, see Figure 3 and Figure 5 The second film layer structure 720 includes a fifth conductive sublayer 722 and a sixth conductive sublayer 723 stacked in a direction away from the substrate 100. The material of the fifth conductive sublayer 722 includes silver, and the material of the sixth conductive sublayer 723 includes indium tin oxide. In this way, there is a fifth conductive sublayer 722 made of silver under the sixth conductive sublayer 723 made of indium tin oxide. In the case where the sixth conductive sublayer 723 may be damaged, the fifth conductive sublayer 722 can also protect the first through hole, preventing the second conductive sublayer 712 and the first conductive sublayer 711 in the first through hole from being damaged, thereby ensuring the effectiveness of the electrical connection between the first electrode 120 as a whole and the first wiring layer 1116.

[0058] Optionally, in this case, the thickness W1 of the second conductive sublayer 712 is greater than or equal to 200 angstroms. In this way, the second conductive sublayer 712 and the fifth conductive sublayer 722 together can ensure the impedance requirement of the first film layer structure 710 as a whole.

[0059] Optionally, the thickness W2 of the first conductive sublayer 711 is greater than or equal to 300 angstroms. In this way, the risk of the first conductive sublayer 711 being broken can be reduced by increasing the thickness of the first conductive sublayer 711 .

[0060] In some possible implementations, the angle between the sidewall of the first insulating layer 1117 facing the first through hole and the side of the first insulating layer 1117 away from the substrate 100 is In this way, the stress of the first conductive sublayer 711 at the sloped corner of the top edge of the opening of the recessed structure 701 can be reduced, thereby reducing the risk of the first conductive sublayer 711 being broken.

[0061] Correspondingly, the angle between the side wall of the first insulating layer 1117 facing the first through hole and the side of the first wiring layer 1116 away from the substrate 111 is In this way, the stress of the first conductive sublayer 711 at the sloped corner of the bottom edge of the recessed structure 701 can be reduced, thereby reducing the risk of the first conductive sublayer 711 being broken.

[0062] For some possible implementations, see Figure 8 The side wall of the first insulating layer 1117 facing the first through hole is a step structure. In this way, the climbing difficulty of the first conductive sublayer 711 can be reduced, thereby reducing the risk of the first conductive sublayer 711 breaking and ensuring the effectiveness of the electrical connection between the first electrode 120 and the first wiring layer 1116.

[0063] Alternatively, in an example, see Fig. 9 The side wall of the first insulating layer 116 facing the first through hole may include a first side wall 501 close to the substrate 111 and a second side wall 502 away from the substrate 111, wherein the angle between the first side wall 501 and the plane where the substrate 111 is located is greater than the angle between the second side wall 502 and the plane where the substrate 111 is located, and the first side wall 501 and the second side wall 502 are connected to each other to form a sloped step.

[0064] In another example, see Fig.10 The first insulating layer 116 faces one side of the first through hole, including a first step surface 503 and a second step surface 503 parallel to the substrate 111. When placed away from the substrate, the distance from the first step surface 503 to the substrate 111 is smaller than the distance from the second step surface 504 to the substrate 111, and the first step surface 503 and the second step surface 504 form a step structure.

[0065] For some possible implementations, see Fig.11The display panel further includes a second insulating layer 1118 located on a side of the first insulating layer 1117 away from the substrate 100. The material of the first insulating layer 1117 includes an organic material, and the material of the second insulating layer 1118 includes an inorganic material. The first through hole penetrates the first insulating layer 1117 and the second insulating layer 1118, and at least a portion of the first film layer structure 710 is located on a side of the second insulating layer 1118 away from the substrate 100. Optionally, the material of the second insulating layer 1118 may include silicon oxide and / or silicon nitride.

[0066] Thus, a second insulating layer 1118 formed of an inorganic material is disposed on the first insulating layer 1117. At the first through hole, the second insulating layer 1118 can be formed into a gentler angle by dry etching, thereby reducing the risk of the first conductive sublayer 711 climbing and breaking. In addition, the second insulating layer 118 formed of an inorganic material can better prevent water vapor from invading the first insulating layer 1117 formed of an organic material.

[0067] In some possible implementations, the orthographic projection of the filling unit 610 on the substrate 100 is located within the orthographic projection of the pixel opening 920 on the substrate 100. In this way, it is possible to avoid the first through hole and the filling unit 610 being arranged between the light-emitting devices 810, which affects the gap width between the light-emitting devices 810, thereby improving the pixel arrangement density of the display panel.

[0068] In some possible implementations, at least some of the first film layer structures 710 and / or the second film layer structures 720 of the first electrodes 120 of the light-emitting devices 810 that are adjacent and emit the same light color are connected to each other. Fig.12 , the light emitting device 810 may include a first light emitting device 811, a second light emitting device 812, and a third light emitting device 813 with different light emitting colors. At least some of the light emitting devices 810 with the same light emitting color are arranged adjacent to each other, and the first electrodes 120 of at least two adjacent light emitting devices 810 with the same light emitting color are connected to each other. In this case, the two light emitting devices 810 can be driven to emit light at the same time. When one of the light emitting devices 810 cannot emit light due to poor process, the other light emitting device 810 can continue to work, thereby reducing the risk of dark spots on the display panel.

[0069] Optionally, the first electrodes 120 corresponding to the light-emitting devices 810 emitting different colors are arranged at intervals.

[0070] For some possible implementations, see Fig.13 In the case where the first film layer structure 710 includes a first sublayer 711 and a second sublayer 712, the first conductive sublayer 711 of the first film layer structure 710 of the first electrode 120 of at least two adjacent light-emitting devices 810 with the same luminous color can be connected to each other, while other film layers in the first electrode 120 can be spaced apart from each other.

[0071] In this way, the second conductive sublayer 712 can be prevented from being exposed over a large area, thereby reducing the risk of the second conductive sublayer 712 being oxidized and causing poor electrical connection with other film layers.

[0072] For other possible implementations, see Fig.14 In the case where the first film layer structure 710 includes a first sublayer 711 and a second sublayer 712, the second conductive sublayer 712 of the first film layer structure 710 of the first electrode 120 of at least two adjacent light-emitting devices 810 with the same luminous color can be connected to each other, and other film layers in the first electrode 120 can be spaced apart from each other.

[0073] In this way, the first electrodes 120 of two adjacent light-emitting devices 810 emitting the same light color are connected to each other via the second sublayer 712 with good conductivity, which can reduce the overall resistance between the two first electrodes 120 and ensure the light-emitting efficiency.

[0074] For other possible implementations, see Fig.15 In the case where the first film layer structure 710 includes a first sublayer 711 and a second sublayer 712, the second conductive sublayer 712 and the second film layer structure 720 of the first film layer structure 710 of the first electrode 120 of at least two adjacent light-emitting devices 810 with the same luminous color can be connected to each other, and other film layers in the first electrode 120 can be spaced apart from each other.

[0075] In this way, the first electrodes 120 of two adjacent light-emitting devices 810 with the same luminous color are connected to each other through the second sublayer 712 with better conductivity, which reduces the overall resistance between the two first electrodes 120 while avoiding large-area exposure of the second conductive sublayer 712, thereby reducing the risk of the second conductive sublayer 712 being oxidized and causing poor electrical connection with other film layers.

[0076] For other possible implementations, see Fig.16 The first film layer structure 710 and the second film layer structure 720 of the first electrode 120 of at least two adjacent light emitting devices 810 emitting the same light color may be connected to each other.

[0077] In this way, the first electrodes 120 of two adjacent light-emitting devices 810 with the same luminous color are connected to each other through the second sublayer 712 with better conductivity, which reduces the overall resistance between the two first electrodes 120 while avoiding large-area exposure of the second conductive sublayer 712, thereby reducing the risk of the second conductive sublayer 712 being oxidized and causing poor electrical connection with other film layers.

[0078] Accordingly, when the first film layer structure 710 includes a first sublayer 711, a second sublayer 712 and a third sublayer 713, one or more layers of the first sublayer 711, the second sublayer 712 and the third sublayer 713 in the first electrode 120 of at least two adjacent light-emitting devices 810 with the same luminous color can be connected to each other.

[0079] For some possible implementations, see Fig.17 The display panel further includes a plurality of packaging units 170 , and the packaging units 170 are located on a side of the corresponding light emitting device 810 away from the substrate 100 .

[0080] Optionally, at least a portion of the packaging unit 170 is located in the isolation opening 910 , and at least a portion of the packaging unit 170 is located on a side of the isolation structure 140 away from the substrate 100 .

[0081] Optionally, the display panel further includes a first encapsulation layer 180 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 100 , and a second encapsulation layer 190 located on a side of the first encapsulation layer 180 away from the substrate 100 .

[0082] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials, and the material of the first encapsulation layer 180 includes organic materials.

[0083] For some possible implementations, see Fig.18 The isolation structure 140 includes a supporting portion 141 and a shielding portion 142 located on a side of the supporting portion 141 away from the substrate 100 , and an orthographic projection of the supporting portion 141 on the substrate 100 is located within an orthographic projection of the shielding portion 142 on the substrate 100 .

[0084] Optionally, under the same etching conditions, the etching resistance of the support portion 141 is weaker than the etching resistance of the shielding portion 142 .

[0085] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0086] Optionally, see Fig.19 The isolation structure 140 further includes a receiving portion 143 located between the supporting portion 141 and the substrate 100 .

[0087] Optionally, the orthographic projection of the receiving portion 143 on the substrate 100 is located within the orthographic projection of the shielding portion 142 on the substrate 100 .

[0088] Optionally, the material of the receiving portion 143 includes molybdenum.

[0089] See also Figure 20 to Figure 22, this embodiment provides a display panel, which may include a substrate 100, a first wiring layer 1116, a first insulating layer 1117 and at least one light-emitting device 810.

[0090] In this embodiment, the material of the substrate 100 may include a rigid material, such as glass; or the material of the substrate 100 may include a flexible material, such as polyimide (Pi).

[0091] An array function layer 110 may also be provided on one side of the substrate 100. The array function layer 110 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuits.

[0092] The first wiring layer 1116 is located at one side of the substrate 100. For example, the first wiring layer 1116 may be a conductive layer in the array functional layer 110 that is away from the substrate 100.

[0093] The first insulating layer 1117 is located on a side of the first wiring layer 1116 away from the substrate 100, and the first insulating layer 1117 is provided with at least one first through hole exposing the first wiring layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0094] The light emitting device 810 includes a first electrode 120 , and the first electrode 120 includes a first film layer structure 710 , a filling unit 610 and a second film layer structure 720 .

[0095] The first film layer structure 710 includes a first part 7101 and a second part 7102 that are connected to each other. The first part 7101 is located on a side of the first insulating layer 1117 away from the substrate 100 , and the second part 7102 extends along the side wall of the first through hole into the first through hole to form a recessed structure 701 and contact the first routing layer 1116 .

[0096] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection on the first film layer structure 710. The first film layer structure 710 extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole to contact the first wiring layer 1116. In this case, the first film layer structure 710 is sunken into the first through hole to form a recessed structure 701.

[0097] The filling unit 610 is at least partially located in the recessed structure 701 , that is, the filling unit 610 fills the recessed structure 701 formed by the first conductive sublayer 711 , so that the filling unit 610 and the first film layer structure 710 together form a relatively flat surface for setting the second film layer structure 720 .

[0098] The second film layer structure 720 is located on a side of the first film layer structure 710 and the filling unit 610 away from the substrate 100 , and at least a portion of the second film layer structure 720 is in contact with the second portion 7102 of the first film layer structure 710 .

[0099] The first film layer structure 710 and / or the second film layer structure 720 of the first electrode 120 of at least some adjacent light-emitting devices 810 emitting the same light color are connected to each other. In this case, the two light-emitting devices 810 can be driven to emit light at the same time, and when one of the light-emitting devices 810 fails to emit light due to poor process, the other light-emitting device 810 can continue to work, thereby reducing the risk of dark spots on the display panel.

[0100] For example, see Fig. 20 , the first film layer structures 710 of the first electrodes 120 of at least some adjacent light emitting devices 810 emitting the same light color may be connected to each other, but the second film layer structures 720 are arranged at intervals.

[0101] For another example, see Fig.21 The second film layer structures 720 of the first electrodes 120 of at least some adjacent light-emitting devices 810 emitting the same light-emitting color may be connected to each other, but the first film layer structures 710 are arranged at intervals.

[0102] For another example, see Fig. 22 , the first film layer structure 710 and the second film layer structure 720 of the first electrode 120 of at least some adjacent light-emitting devices 810 that emit the same light color may be connected to each other.

[0103] On this basis, the first film layer structure 710 can be a single-layer structure, or the first film layer structure 710 can include a plurality of sub-layers stacked in sequence in a direction away from the substrate 111; the second film layer structure 720 can be a single-layer structure, or the second film layer structure 720 can include a plurality of sub-layers stacked in sequence in a direction away from the substrate 111, which is not specifically limited in this embodiment.

[0104] See also Figure 8 , this embodiment provides a display panel, which may include a substrate 100, a first wiring layer 1116, a first insulating layer 1117 and at least one light-emitting device 810.

[0105] In this embodiment, the material of the substrate 100 may include a rigid material, such as glass; or the material of the substrate 100 may include a flexible material, such as polyimide (Pi).

[0106] An array function layer 110 may also be provided on one side of the substrate 100. The array function layer 110 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuits.

[0107] The first wiring layer 1116 is located at one side of the substrate 100. For example, the first wiring layer 1116 may be a conductive layer in the array functional layer 110 that is away from the substrate 100.

[0108] The first insulating layer 1117 is located on a side of the first wiring layer 1116 away from the substrate 100, and the first insulating layer 1117 is provided with at least one first through hole exposing the first wiring layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0109] The light emitting device 810 includes a first electrode 120 , and the first electrode 120 includes a first film layer structure 710 , a filling unit 610 and a second film layer structure 720 .

[0110] The first film layer structure 710 includes a first part 7101 and a second part 7102 that are connected to each other. The first part 7101 is located on a side of the first insulating layer 1117 away from the substrate 100 , and the second part 7102 extends along the side wall of the first through hole into the first through hole to form a recessed structure 701 and contact the first routing layer 1116 .

[0111] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection on the first film layer structure 710. The first film layer structure 710 extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole to contact the first wiring layer 1116. In this case, the first film layer structure 710 is sunken into the first through hole to form a recessed structure 701.

[0112] The filling unit 610 is at least partially located in the recessed structure 701 , that is, the filling unit 610 fills the recessed structure 701 formed by the first conductive sublayer 711 , so that the filling unit 610 and the first film layer structure 710 together form a relatively flat surface for setting the second film layer structure 720 .

[0113] The second film layer structure 720 is located on a side of the first film layer structure 710 and the filling unit 610 away from the substrate 100 , and at least a portion of the second film layer structure 720 is in contact with the second portion 7102 of the first film layer structure 710 .

[0114] In this way, the climbing difficulty of the first film layer structure 710 can be reduced, thereby reducing the risk of the first film layer structure 710 being broken, and ensuring the effectiveness of the electrical connection between the first electrode 120 and the first wiring layer 1116 .

[0115] Optionally, in one example, see reference 7, the side wall of the first insulating layer 116 facing the first through hole may include a first side wall 501 close to the substrate 111 and a second side wall 502 away from the substrate 111, wherein the angle between the first side wall 501 and the plane where the substrate 111 is located is greater than the angle between the second side wall 502 and the plane where the substrate 111 is located, and the first side wall 501 and the second side wall 502 are interconnected to form a sloped step.

[0116] In another example, see Fig.10 The first insulating layer 116 faces one side of the first through hole, including a first step surface 503 and a second step surface 503 parallel to the substrate 111. When placed away from the substrate, the distance from the first step surface 503 to the substrate 111 is smaller than the distance from the second step surface 504 to the substrate 111, and the first step surface 503 and the second step surface 504 form a step structure.

[0117] On this basis, the first film layer structure 710 can be a single-layer structure, or the first film layer structure 710 can include a plurality of sub-layers stacked in sequence in a direction away from the substrate 111; the second film layer structure 720 can be a single-layer structure, or the second film layer structure 720 can include a plurality of sub-layers stacked in sequence in a direction away from the substrate 111, which is not specifically limited in this embodiment.

[0118] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0119] In summary, the present application provides a display panel and an electronic device. By setting the first film layer structure in which the first electrode extends into the first through hole to have at least two conductive sublayers, the continuity of the first film layer structure can be improved and the risk of dark spots on the display panel due to breakage of the first film layer structure can be reduced.

[0120] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located at a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first part and a second part connected to each other, the first part being located on a side of the first insulating layer away from the substrate, the second part extending along the side wall of the first through hole into the first through hole to form a recessed structure and contacting the first wiring layer; the first film layer structure comprising at least two stacked conductive sublayers; the filling unit being at least partially located in the recessed structure; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, and at least a portion of the second film layer structure being in contact with the second part of the first film layer structure.

2. The display panel according to claim 1, characterized in that: The first film layer structure includes a first conductive sublayer and a second conductive sublayer stacked in a direction away from the substrate, the material of the first conductive sublayer includes indium tin oxide, and the material of the second conductive sublayer includes silver; Alternatively, the first film layer structure includes a first conductive sublayer, a second conductive sublayer and a third conductive sublayer stacked in sequence in a direction away from the substrate, the first conductive sublayer and the third conductive sublayer are made of indium tin oxide, and the second conductive sublayer is made of silver.

3. The display panel according to claim 2, characterized in that: The second film layer structure includes a fourth conductive sublayer, and a material of the fourth conductive sublayer includes indium tin oxide.

4. The display panel according to claim 3, characterized in that: The thickness of the second conductive sublayer is greater than or equal to 800 angstroms.

5. The display panel according to claim 2, characterized in that: The second film layer structure includes a fifth conductive sublayer and a sixth conductive sublayer stacked in a direction away from the substrate. The material of the fifth conductive sublayer includes silver, and the material of the sixth conductive sublayer includes indium tin oxide.

6. The display panel according to claim 5, characterized in that: The thickness of the second conductive sublayer is greater than or equal to 200 angstroms.

7. The display panel according to claim 1, characterized in that: An angle between a side wall of the first insulating layer facing the first through hole and a side of the first insulating layer away from the substrate is greater than or equal to 110 degrees; Alternatively, an angle between a side wall of the first insulating layer facing the first through hole and a side of the first wiring layer away from the substrate is greater than or equal to 110 degrees.

8. The display panel according to claim 1, characterized in that: The side wall of the first insulating layer facing the first through hole has a step structure.

9. The display panel according to claim 1, characterized in that: The display panel also includes a second insulating layer located on a side of the first insulating layer away from the substrate, the material of the first insulating layer includes an organic material, and the material of the second insulating layer includes an inorganic material; the first through hole passes through the first insulating layer and the second insulating layer, and at least part of the first film layer structure is located on a side of the second insulating layer away from the substrate.

10. The display panel according to claim 1, characterized in that: The display panel further includes: A pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer being provided with a plurality of pixel openings, the pixel openings respectively exposing the first electrodes; An isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure comprising an isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the corresponding isolation opening on the substrate; A plurality of light-emitting devices have light-emitting functional layers and second electrodes, wherein the light-emitting functional layers and the second electrodes are located in the corresponding isolation openings and on a side of the first electrode away from the substrate.

11. The display panel according to claim 10, characterized in that: The orthographic projection of the filling unit on the substrate is located within the orthographic projection of the pixel opening on the substrate.

12. The display panel according to claim 10, characterized in that: The first film layer structure and / or the second film layer structure of the first electrode of the light-emitting devices which are at least partially adjacent and emit light of the same color are connected to each other.

13. The display panel according to claim 10, characterized in that: The display panel further includes a plurality of packaging units, and the packaging units are located at a side of the corresponding light emitting device away from the substrate.

14. The display panel according to claim 13, characterized in that: At least a portion of the packaging unit is located in the isolation opening, and at least a portion of the packaging unit is located at a side of the isolation structure away from the substrate.

15. The display panel according to claim 13, characterized in that: The display panel further includes a first encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate, and a second encapsulation layer located on a side of the first encapsulation layer away from the substrate.

16. The display panel according to claim 10, characterized in that: The isolation structure includes a supporting portion and a shielding portion located at a side of the supporting portion away from the substrate, and an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate.

17. The display panel according to claim 16, characterized in that: The isolation structure further includes a receiving portion located between the supporting portion and the substrate; an orthographic projection of the receiving portion on the substrate is located within an orthographic projection of the shielding portion on the substrate.

18. A display panel, characterized in that: The display panel comprises: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located at a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, the second portion extending along the sidewall of the first through hole into the first through hole to form a recessed structure and in contact with the first wiring layer; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, at least a portion of the second film layer structure in contact with the second portion of the first film layer structure; The first film layer structure and / or the second film layer structure of the first electrode of the light-emitting devices which are at least partially adjacent and emit light of the same color are connected to each other.

19. A display panel, characterized in that: The display panel comprises: substrate; A first wiring layer located at one side of the substrate; A first insulating layer located on a side of the first wiring layer away from the substrate, the first insulating layer being provided with at least one first through hole exposing the first wiring layer; and a side wall of the first insulating layer facing the first through hole being in a step structure; A first electrode of at least one light-emitting device, the first electrode comprising a first film layer structure, a filling unit and a second film layer structure; the first film layer structure comprising a first part and a second part connected to each other, the first part being located on a side of the first insulating layer away from the substrate, the second part extending along the side wall of the first through hole into the first through hole to form a recessed structure and contacting the first wiring layer; the second film layer structure being located on a side of the first film layer structure and the filling unit away from the substrate, and at least a part of the second film layer structure contacting the second part of the first film layer structure.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1-19.

Images