Film forming apparatus, driving method of film forming apparatus, and film forming method

Abstract

The invention provides a film forming apparatus, a driving method of the film forming apparatus, and a film forming method, wherein a substrate can be adsorbed on an adsorption member in a stable state. The film forming apparatus is characterized by being provided with: an electrostatic chuck (31) that sucks a surface of the substrate on the opposite side from the surface on the film forming side; a first support member (41) that supports the peripheral edge of the substrate before and / or after the suction of the substrate with respect to the electrostatic chuck (31); and a pressing member (71) which is configured so as to be movable in a first direction intersecting the surface of the substrate on the film formation side, and which presses the peripheral edge of the substrate from the side opposite the surface of the substrate on the film formation side. The pressing member 71 overlaps the substrate when viewed in the first direction in a state of being separated from the substrate, and is located at a position farther from the substrate than the suction surface of the electrostatic chuck 31.

Description

Technical Field

[0001] The present invention relates to a film forming device, a driving method of the film forming device and a film forming method. Background Art

[0002] Conventionally, there is known a technique in which a film forming apparatus is provided with a suction member for suctioning a surface of a substrate on the side opposite to the surface on the film forming side.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-99910 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In recent years, the size of substrates has been increasing. If the substrate is greatly bent before being adsorbed onto the adsorption member, it may be difficult to appropriately adsorb the substrate onto the adsorption member.

[0008] Means for solving problems

[0009] The film forming apparatus of the present invention is characterized by comprising:

[0010] an adsorption member for adsorbing a surface of the substrate on a side opposite to a surface on a film-forming side;

[0011] a first supporting member that supports a peripheral edge of a surface on a film-forming side of the substrate at least either before or after the substrate is adsorbed by the adsorption member; and

[0012] a pressing member configured to be movable in a first direction intersecting a surface of the substrate on the film forming side and to press a peripheral edge of the substrate from a side of the substrate opposite to the surface of the substrate on the film forming side,

[0013] The pressing member overlaps with the substrate when viewed in the first direction in a state of being separated from the substrate, and is located at a position farther from the substrate than a suction surface of the suction member.

[0014] Effects of the Invention

[0015] As described above, according to the present invention, the substrate can be adsorbed to the adsorption member in a stable state. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a film forming device.

[0017] Figure 2 This is a diagram for explaining the operation of the main parts of the film forming device.

[0018] Figure 3 This is a diagram for explaining the operation of the main parts of the film forming device.

[0019] Figure 4 This is a diagram for explaining the operation of the main parts of the film forming device.

[0020] Figure 5 This is a diagram for explaining the operation of the main parts of the film forming device.

[0021] Figure 6 This is a diagram for explaining the operation of the main parts of the film forming device.

[0022] Figure 7 This is a diagram for explaining the operation of the main parts of the film forming device.

[0023] Figure 8 This is a diagram for explaining the operation of the main parts of the film forming device.

[0024] Fig. 9 This is a diagram for explaining the operation of the main parts of the film forming device.

[0025] Fig.10 This is a diagram for explaining the operation of the main parts of the film forming device.

[0026] Fig.11 This is a diagram for explaining the operation of the main parts of the film forming device.

[0027] Fig.12 This is a diagram for explaining the operation of the main parts of the film forming device.

[0028] Fig.13 It is an explanatory diagram of an organic EL display device. DETAILED DESCRIPTION

[0029] Hereinafter, with reference to the accompanying drawings, the embodiment for implementing the present invention will be described in detail by way of example. However, as for the size, material, shape, relative arrangement, etc. of the structural components described in the embodiment, unless otherwise specified, it is not intended to limit the scope of the present invention to this.

[0030] (Example)

[0031] Reference Figure 1 to Figure 12 , a film forming apparatus according to an embodiment of the present invention is described. Figures 1 to 3 and Figures 5 to 12In order to make the operation of each component easier to understand, the components that operate in an integrated manner are marked with the same type of section lines. In these drawings, each component is shown in a cross-section, but each component can be arranged at different positions on the front side and the back side of the paper, so although the section lines are marked, it does not necessarily represent the cross section.

[0032] <Structure of film forming equipment>

[0033] In particular, refer to Figure 1 , the overall structure of the film forming device 1 is described. Figure 1 1 is a schematic diagram of the overall structure of the film forming apparatus. The film forming apparatus 1 includes a chamber 10 and a film forming source 20 disposed in the chamber 10. The chamber 10 is configured to be able to maintain a vacuum atmosphere or an inert gas atmosphere. As the film forming source 20, in addition to an evaporation source for evaporating or sublimating a film forming material, a sputtering cathode for performing film formation by sputtering or the like can also be used.

[0034] The upper part of the chamber 10 is provided with various mechanisms for aligning the substrate S as the film-forming object with the mask M arranged on the film-forming side of the substrate S in order to form a thin film of a desired pattern on the substrate S. In addition, in the present embodiment, a structure in which the various mechanisms are provided in the chamber 10 equipped with the film-forming source 20, but a structure in which a chamber for aligning the substrate S with the mask M and a chamber equipped with the film-forming source are separately provided may also be adopted. In this case, after the substrate S and the mask M are aligned in the chamber for alignment, these substrates S and the mask M are transported to the chamber equipped with the film-forming source and film formation is carried out. In addition, in the present embodiment, a structure in which the substrate S is peeled off from the electrostatic suction cup 31 as an adsorption member after film formation on the substrate S using the above-mentioned various mechanisms is shown, but regarding this mechanism, a structure provided in other chambers may also be adopted.

[0035] Hereinafter, various mechanisms for aligning the substrate S and the mask M will be described. A base member 11 and a support plate 12 for supporting the various mechanisms are fixed to the ceiling of the chamber 10 .

[0036] The first lifting mechanism 30 is installed on the base member 11, and the first lifting mechanism 30 lifts and lowers the electrostatic suction cup 31 in the vertical direction. The first lifting mechanism 30 includes: a holding member 32, the holding member 32 holds the electrostatic suction cup 31; a shaft member 33, the shaft member 33 is used to lift and lower the holding member 32; and a driving source 34, the driving source 34 lifts and lowers the shaft member 33. The holding member 32 includes a lifting plate 32a perpendicular to the vertical direction. As for the specific structure of the lifting mechanism, various known technologies such as a ball screw mechanism can be adopted, so the detailed description thereof is omitted. The electrostatic suction cup 31 has an electrode 31a inside, and is configured to generate an electrostatic adsorption force by applying a voltage to the electrode 31a. In addition, as a method of generating the electrostatic adsorption force, various known methods such as a Coulomb force type, a Johnson-Rabbeck force type, and a gradient force type can be adopted. The electrostatic suction cup 31 is used to adsorb the surface of the substrate S on the side opposite to the film forming side, and the substrate S is held.

[0037] The lifting plate 32a of the holding member 32 in the first lifting mechanism 30 is provided with a second lifting mechanism 40, and the second lifting mechanism 40 lifts and lowers the substrate S in the vertical direction. The second lifting mechanism 40 includes: a first supporting member 41, which supports the periphery of the surface of the film forming side of the substrate S; a shaft member 42, which is used to lift and lower the first supporting member 41; and a driving source 43, which lifts and lowers the shaft member 42. As for the specific structure of the lifting mechanism, various well-known technologies such as a ball screw mechanism can be adopted, so the detailed description thereof is omitted. When the lifting plate 32a is lifted and lowered by the first lifting mechanism 30 without operating the second lifting mechanism 40, the electrostatic suction cup 31 and the substrate S are lifted and lowered integrally. On the other hand, by operating the second lifting mechanism 40, the substrate S can be lifted and lowered relative to the electrostatic suction cup 31.

[0038] In addition, the film forming apparatus 1 includes a mask adjustment mechanism 50 as a mask driving unit for adjusting the position of the mask M. The mask adjustment mechanism 50 includes a support portion 51 fixed to the top of the chamber 10, a mask stage receiving portion 52 provided at the lower end of the support portion 51, and a magnetic generation coil box 53 fixed to the support portion 51. A magnet 55 is provided on the periphery of a mask stage 54 as a mask holding portion for holding the mask M. The mask stage 54 is configured so that the magnet 55 is arranged in the gap between the mask stage receiving portion 52 and the magnetic generation coil box 53. And, by controlling the magnetic field generated by the magnetic generation coil box 53, the horizontal position of the mask stage 54 is adjusted in a state where the mask stage 54 is floating due to magnetic levitation. That is, when the directions perpendicular to the vertical direction and orthogonal to each other are set as X and Y directions, and the direction rotating around the vertical direction is set as θ direction, the position of the mask stage 54 can be adjusted along the X, Y, and θ directions by controlling the magnetic field generated by the magnetic generating coil box 53.

[0039] The mask adjustment mechanism 50 also has a third lifting mechanism for lifting the mask M. The third lifting mechanism is mounted on a support plate 12 fixed to the top of the chamber 10, and comprises: a support member 56, the support member 56 supports the mask M; an axis member 57, the axis member 57 is used to lift the support member 56; and a drive source 58, the drive source 58 lifts the axis member 57. Regarding the specific structure of the lifting mechanism, various well-known technologies such as a ball screw mechanism can be used, so the detailed description thereof is omitted. The mask lifting mechanism is used to receive the mask M transported into the chamber 10 and place the mask M on the mask stage 54. Figure 1 , a state where the mask M is placed on the mask stage 54 is shown.

[0040] In addition, a fourth lifting mechanism 60 is installed on the base member 11. The fourth lifting mechanism 60 raises and lowers the magnetic adsorption member 61 in the vertical direction after the substrate S and the mask M are aligned. The magnetic adsorption member 61 adsorbs the mask M by magnetic force via the substrate S and the electrostatic chuck 31. The fourth lifting mechanism 60 includes a holding member 62 for holding the magnetic adsorption member 61 and a driving source 63 for raising and lowering the holding member 62. As for the specific structure of the lifting mechanism, various known technologies such as a ball screw mechanism can be adopted, and therefore, a detailed description thereof is omitted.

[0041] Moreover, the film forming device 1 of the present embodiment is provided with a pressing member 71, and the pressing member 71 is configured to be movable along a first direction (in the present embodiment, a vertical direction) intersecting the surface of the film forming side of the substrate S, and to press the periphery of the substrate S from the side of the substrate S opposite to the surface of the film forming side. In addition, the film forming device 1 is provided with a fifth lifting mechanism 70, and the fifth lifting mechanism 70 lifts and lowers the pressing member 71 along the first direction, i.e., the vertical direction. The fifth lifting mechanism 70 is mounted on the lifting plate 32a of the holding member 32 in the first lifting mechanism 30. In addition, the fifth lifting mechanism 70 is provided with: a pressing member 71; a shaft member 72, the shaft member 72 is used to lift and lower the pressing member 71; and a driving source 73, the driving source 73 lifts and lowers the shaft member 72. As for the specific structure of the lifting mechanism, various known technologies such as a ball screw mechanism can be adopted, and therefore, a detailed description thereof is omitted.

[0042] By pressing the periphery of the substrate S with the pressing member 71 while the substrate S is supported by the first supporting member 41, the periphery of the substrate S is sandwiched between the first supporting member 41 and the pressing member 71. As a result, the periphery of the substrate S is horizontal, and the deflection of the substrate S, which is bent in a manner with the center bent downward in the vertical direction due to its own weight when supported only by the first supporting member 41, is eliminated or reduced.

[0043] Here, the pressing member 71 is configured to overlap the substrate S when viewed along the first direction in a state separated from the substrate S and to be located at a position farther from the substrate S than the adsorption surface of the electrostatic chuck 31 (for example, see Figure 2 ). In addition, when viewed along the first direction, the shaft member 72 is arranged on the side of the electrostatic chuck 31 outside the substrate S. In addition, the electrostatic chuck 31 is provided with a recess 31b for the pressing member 71 to retreat in order to move the pressing member 71 away from the substrate S.

[0044] In addition, the film forming apparatus 1 further includes a film forming source 20 and a control device 90 for controlling the operation of the above-mentioned various mechanisms, etc. Since the control device for controlling the various devices is a known technology, a detailed description is omitted, but the control device 90 includes a processor such as a CPU, a semiconductor memory, a storage device such as a hard disk, and an input / output interface.

[0045] <Film forming method (method of driving film forming device)>

[0046] In particular, refer to Figures 2 to 12 , a film forming method using the film forming apparatus 1 (a method of driving the film forming apparatus) will be described. Figure 2 , 3 , 5~12 show Figure 1 Various mechanism parts are arranged near the top of the chamber 10. Figure 4 The positional relationship of the substrate S, the first supporting member 41 and the pressing member 71 as viewed from above is shown in the order of operation.

[0047] First, the mask M is transported into the chamber 10, and the mask M is placed on the mask stage 54 by the third lifting mechanism. Then, the substrate S is transported into the chamber 10 by the hand 80 of the transport robot, and the substrate S is placed on the first support member 41 of the second lifting mechanism 40 (see Figure 4 (a)). Thus, the periphery of the surface on the film forming side of the substrate S is supported by the first supporting member 41 (see Figure 2 and Figure 4 (b) The above is the supporting step. At this time, the substrate S is bent by its own weight so that the center of the substrate S is bent downward in the vertical direction.

[0048] After the supporting step, the pressing member 71 is lowered by the fifth lifting mechanism 70, and the pressing member 71 is used to press the periphery of the substrate S from the side opposite to the film forming side of the substrate S (pressing step). Figure 3 and Figure 4 As shown in (c), the periphery of the substrate S is sandwiched between the first supporting member 41 and the pressing member 71. As a result, the periphery of the substrate S is horizontal, and the deflection of the substrate S, which is bent vertically downward due to its own weight, is eliminated or reduced.

[0049] After the pressing step, a moving step is performed in which the substrate S is relatively moved to a suction position sucked by the electrostatic chuck 31. In this embodiment, the first support member 41 of the second lifting mechanism 40 and the pressing member 71 of the fifth lifting mechanism 70 are synchronously lifted to lift the substrate S, and the substrate S is brought into contact with the electrostatic chuck 31 (see FIG. Figure 5 ).

[0050] Then, after the moving step, a pressing release step is performed, in which the pressing performed by the pressing member 71 is released. Specifically, the pressing member 71 is raised by the fifth lifting mechanism 70, and the pressing member 71 retreats to the concave portion 31b (see Figure 6 ). After the pressing release process, the substrate S is adsorbed onto the electrostatic chuck 31 (adsorption process). That is, by applying an adsorption voltage to the electrode 31a provided on the electrostatic chuck 31, the substrate S is adsorbed onto the electrostatic chuck 31 by the electrostatic adsorption force. In addition, the pressing release process may be performed after the moving process, and in the pressing release process, after the substrate S is adsorbed onto the electrostatic chuck 31 (adsorption process), the pressing by the pressing member 71 is released.

[0051] In this way, the first supporting member 41 supports the periphery of the substrate S at least in any of the cases before and after the substrate S is adsorbed to the electrostatic chuck 31 as an adsorption member. Then, by pressing the periphery of the substrate S from the side opposite to the film-forming side of the substrate S with the pressing member 71, the substrate S is adsorbed to the electrostatic chuck 31 after eliminating or reducing the deflection of the substrate S.

[0052] Then, after the substrate S is adsorbed on the electrostatic chuck 31, an alignment operation for aligning the substrate S and the mask M is performed. Various well-known methods can be used for the alignment operation for aligning the substrate S and the mask M, but a representative example is described here. Generally speaking, in order to align, alignment marks (not shown) are provided on the substrate S and the mask M, respectively. And, the marks of the two are photographed by a camera C fixed to the chamber 10, and the positional offset of the two is determined. Then, the horizontal position of at least one of the substrate S and the mask M is adjusted in a manner to eliminate their positional offset (usually so that the positional offset falls within a threshold). In addition, in order to achieve short-time and high-precision alignment, rough alignment for rough alignment and fine alignment for high-precision alignment are generally performed. In the rough alignment, a camera C with a low resolution but a wide field of view is used, and in the fine alignment, a camera C with a narrow field of view but a high resolution is used. In addition, the alignment marks are also different marks that are usually used for rough alignment and for fine alignment.

[0053] Specifically, after the substrate S is adsorbed on the electrostatic chuck 31, the electrostatic chuck 31 and the substrate S are lowered integrally by the first lifting mechanism 30, so that the substrate S is in contact with the mask M (see Figure 7 ). In this state, the control device 90 determines the positional offset between the substrate S and the mask M based on the photographing information obtained from the camera C. Then, the electrostatic chuck 31 is raised integrally with the substrate S by the first lifting mechanism 30, and the substrate S is slightly separated from the mask M (refer to Figure 8 ). Rough alignment is performed in this state. That is, in the case of this embodiment, the substrate S and the mask M are roughly aligned by adjusting the horizontal direction (X, Y, θ directions) of the mask stage 54 using the mask adjustment mechanism 50 based on the positional deviation.

[0054] After the rough alignment is performed, the electrostatic chuck 31 is again lowered integrally with the substrate S by the first lifting mechanism 30, and the substrate S is brought into contact with the mask M. Thereafter, fine alignment is performed in the same order as the rough alignment. Generally speaking, fine alignment is performed repeatedly until the positional offset between the substrate S and the mask M falls within the range of a threshold value. In addition, here, a case is described in which the substrate S and the mask M are separated after determining their positional offset while being brought into contact with each other, and rough alignment and fine alignment are performed. However, it is also possible to lower the electrostatic chuck 31 integrally with the substrate S by the first lifting mechanism 30, so that the substrate S and the mask M are slightly separated, determine their positional offset, and directly perform rough alignment and fine alignment.

[0055] After the fine alignment is completed, the magnetic adsorption member 61 is lowered by the fourth lifting mechanism 60. As a result, the mask M is adsorbed to the magnetic adsorption member 61 via the substrate S and the electrostatic chuck 31. As a result, the substrate S and the mask M are fixed in a state of contact (see Fig. 9 ). Then, a thin film of a desired pattern (opening) formed in the mask M is formed on the surface (film forming surface) of the substrate S by using the film forming source 20. In this way, the film forming step is performed after the adsorption step, and the film is formed in the film forming step.

[0056] Then, after the film forming step, an adsorption release step is performed. In the adsorption release step, after the first supporting member 41 is relatively moved to a position supporting the substrate S by the second lifting mechanism 40 (see Fig.10 ), the electrostatic chuck 31 releases the adsorption of the substrate S. In the adsorption release step, a voltage for peeling is applied to the electrode 31a provided on the electrostatic chuck 31. After the adsorption release step, a post-film-forming pressing step is performed. In the post-film-forming pressing step, the pressing member 71 is lowered by the fifth lifting mechanism 70, and the pressing member 71 is used to press the periphery of the substrate S (refer to Fig.11 ).

[0057] In addition, a post-film forming pressing step may be performed after the film forming step. In the post-film forming pressing step, after the first supporting member 41 is relatively moved to a position supporting the substrate S by the second lifting mechanism 40 (see Fig.10 ), the pressing member 71 is lowered by the fifth lifting mechanism 70, and the periphery of the substrate S is pressed by the pressing member 71 (refer to Fig.11). In this case, the adsorption release process is performed after the post-film forming pressing process, in which the adsorption of the electrostatic chuck 31 to the substrate S is released. When such a process is adopted, after the periphery of the substrate S is sandwiched by the first supporting member 41 and the pressing member 71, the adsorption of the substrate S by the electrostatic chuck 31 is released. Therefore, it is possible to further suppress the substrate S from falling or the substrate S from being broken due to the bending of the substrate S when the adsorption of the substrate S is released.

[0058] After these steps, the electrostatic chuck 31 is separated from the substrate S (see Fig.12 ), the substrate S after film formation is moved out of the chamber 10 using the hand 80 of the conveying robot.

[0059] <Method for manufacturing electronic device>

[0060] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device is shown, and an example of a method for manufacturing the organic EL display device is described.

[0061] First, the organic EL display device to be manufactured will be described. Fig.13 (a) is an overall view of the organic EL display device 150. Fig.13 (b) shows the cross-sectional structure of a pixel.

[0062] like Fig.13 As shown in (a), in the display area 151 of the organic EL display device 150, a plurality of pixels 152 having a plurality of light-emitting elements are arranged in a matrix. The details will be described later, but the light-emitting elements each have the following structure, which has an organic layer sandwiched by a pair of electrodes. In addition, the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 151. In the case of the organic EL display device of this embodiment, the pixel 152 is formed by a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B that show different light. The pixel 152 is mostly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, as long as it is at least one color, and it is not particularly limited.

[0063] Fig.13 (b) Yes Fig.13(a) is a partial cross-sectional schematic diagram at the AB line. The pixel 152 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 154, a hole transport layer 155, any one of the light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. The hole transport layer 155, the light-emitting layers 156R, 156G, 156B, and the electron transport layer 157 are equivalent to organic layers. In addition, in this embodiment, the light-emitting layer 156R is an organic EL layer that emits red light, the light-emitting layer 156G is an organic EL layer that emits green light, and the light-emitting layer 156B is an organic EL layer that emits blue light. The light-emitting layers 156R, 156G, and 156B are formed into patterns corresponding to the light-emitting elements (sometimes also referred to as organic EL elements) that emit red light, green light, and blue light, respectively. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed in common in the plurality of light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 154 and the second electrode 158 from being short-circuited due to foreign matter, an insulating layer 159 is provided between the first electrodes 154. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 140 is provided to protect the organic EL element from moisture and oxygen.

[0064] exist Fig.13 In (b), the hole transport layer 155 and the electron transport layer 157 are shown as one layer, but they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure that allows smooth injection of holes from the first electrode 154 to the hole transport layer 155 may be formed between the first electrode 154 and the hole transport layer 155. Similarly, an electron injection layer may be formed between the second electrode 158 and the electron transport layer 157.

[0065] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0066] First, a substrate 153 on which a circuit (not shown) for driving the organic EL display device and the first electrode 154 are formed is prepared.

[0067] Acrylic resin is formed by spin coating on the substrate 153 having the first electrode 154 formed thereon, and the acrylic resin is patterned by photolithography to form an opening at the portion where the first electrode 154 is formed, and an insulating layer 159 is formed. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0068] The substrate 153 on which the insulating layer 159 is patterned is carried into the first organic material film forming device, and the substrate is held by the substrate support table and the electrostatic chuck, and the hole transport layer 155 is formed as a common layer on the first electrode 154 of the display area. The hole transport layer 155 is formed by vacuum evaporation. Since the hole transport layer 155 is actually formed to a size larger than the display area 151, a high-precision mask is not required.

[0069] Next, the substrate 153 formed up to the hole transport layer 155 is carried into the second organic material film forming device and held by the substrate support table and the electrostatic chuck. The substrate and the mask are aligned, and the substrate is placed on the mask, and the light-emitting layer 156R emitting red light is formed on the portion of the substrate 153 where the element emitting red light is arranged.

[0070] Similar to the film formation of the light-emitting layer 156R, the light-emitting layer 156G emitting green light is formed by the third organic material film-forming device, and the light-emitting layer 156B emitting blue light is formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 156R, 156G, and 156B is completed, the electron transport layer 157 is formed in the entire display area 151 by the fifth film-forming device. The electron transport layer 157 is formed as a common layer on the light-emitting layers 156R, 156G, and 156B of the three colors.

[0071] The substrate on which the electron transport layer 157 has been formed is moved to a metallic vapor deposition material film forming apparatus, and the second electrode 158 is formed into a film.

[0072] Thereafter, the process is moved to a plasma CVD device to form a protective layer 140 , thereby completing the organic EL display device 150 .

[0073] From the time when the substrate 153 on which the insulating layer 159 is patterned is carried into the film forming apparatus until the film forming of the protective layer 140 is completed, if the light-emitting layer composed of the organic EL material is exposed to an atmosphere containing moisture and oxygen, the light-emitting layer may be degraded by moisture and oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0074] <Advantages of the film forming apparatus of this embodiment>

[0075] According to the film forming apparatus 1 of the present embodiment, by providing the pressing member 71, it is possible to suppress the bending of the substrate S before the substrate S is adsorbed on the electrostatic chuck 31. Thus, the substrate S can be adsorbed on the electrostatic chuck 31 in a stable state. That is, it is possible to suppress the substrate S from being adsorbed on the electrostatic chuck 31 in a state of undulation or partial deformation.

[0076] Description of Reference Numerals

[0077] 1: Film forming device 10: Chamber 11: Base member 12: Support plate 20: Film forming source 30: First lifting mechanism 31: Electrostatic suction cup 31a: Electrode 31b: Recess 32: Holding member 32a: Lifting plate 33: Shaft member 34: Driving source 40: Second lifting mechanism 41: First supporting member 42: Shaft member 43: Driving source 50: Mask adjustment mechanism 51: Support column 52: Mask stage receiving portion 53: Coil box for magnetic generation 54: Mask stage 55: Magnet 56: Support member 57: Shaft member 58: Driving source 60: Fourth lifting mechanism 61: Magnetic adsorption member 62: Holding member 63: Driving source 70: Fifth lifting mechanism 71: Pressing member 72: Shaft member 73: Driving source 80: Hand 90: Control device C: Camera M: Mask S: Substrate.

Claims

1. A film forming device, It is characterized in that The film forming device comprises: an adsorption member for adsorbing a surface of the substrate on a side opposite to a surface on a film-forming side; a first supporting member configured to support a peripheral edge of a surface on a film-forming side of the substrate in at least one of before and after the substrate is adsorbed by the adsorption member; as well as a pressing member configured to be movable in a first direction intersecting a surface of the substrate on the film forming side and to press a peripheral edge of the substrate from a side of the substrate opposite to the surface of the substrate on the film forming side, The pressing member overlaps with the substrate when viewed in the first direction in a state of being separated from the substrate, and is located at a position farther from the substrate than a suction surface of the suction member.

2. The film forming device according to claim 1, It is characterized in that The film forming apparatus includes a shaft member that moves the pressing member in the first direction, and the shaft member is arranged on the side of the adsorption member outside the substrate when viewed in the first direction.

3. The film forming device according to claim 1 or 2, It is characterized in that When the substrate is adsorbed by the adsorption member, In a state where the periphery of the substrate is supported by the first supporting member and pressed by the pressing member, the substrate relatively moves to a suction position sucked by the suction member, and after the pressing by the pressing member is released, the substrate is sucked by the suction member.

4. The film forming device according to claim 1 or 2, It is characterized in that When the substrate is adsorbed by the adsorption member, In a state where the periphery of the substrate is supported by the first supporting member and pressed by the pressing member, the substrate relatively moves to a suction position where it is sucked by the suction member, and after the substrate is sucked by the suction member, the pressing by the pressing member is released.

5. The film forming device according to claim 1 or 2, It is characterized in that When the adsorption of the substrate by the adsorption member is released, The first supporting member relatively moves to a position supporting the substrate in a state where the substrate is adsorbed by the adsorption member, and after the adsorption of the substrate by the adsorption member is released, the substrate is pressed by the pressing member.

6. The film forming device according to claim 1 or 2, It is characterized in that When the adsorption of the substrate by the adsorption member is released, In a state where the substrate is adsorbed by the adsorption member, the first supporting member relatively moves to a position supporting the substrate, and after the substrate is pressed by the pressing member, the adsorption of the substrate by the adsorption member is released.

7. The film forming device according to claim 1 or 2, It is characterized in that The adsorption member is provided with a recessed portion into which the pressing member is retracted in order to move the pressing member away from the substrate.

8. The film forming device according to claim 1 or 2, It is characterized in that The adsorption member has an electrode inside and is configured to generate an electrostatic adsorption force by applying a voltage to the electrode.

9. The film forming device according to claim 1 or 2, It is characterized in that The film forming device comprises: a mask holding portion that holds a mask; as well as a mask driving unit configured to move the mask holding unit while the mask holding unit is floating by magnetic levitation, The mask driving unit moves the mask holding unit in a state where the adsorption member adsorbs the substrate, thereby aligning the substrate and the mask.

10. The film forming device according to claim 1 or 2, It is characterized in that The film forming device includes a film forming source that forms a thin film on the substrate adsorbed by the adsorption member.

11. A method for driving a film forming device, the film forming device comprising: an adsorption member for adsorbing a surface of the substrate on a side opposite to a surface on a film-forming side; a first supporting member that supports a peripheral edge of a surface of the substrate on a film-forming side; as well as a pressing member configured to be movable in a first direction intersecting a surface of the substrate on the film forming side and to press a peripheral edge of the substrate from a side of the substrate opposite to the surface of the substrate on the film forming side, It is characterized in that The driving method of the film forming device comprises: a supporting step, in which the first supporting member supports the periphery of the substrate; a pressing step, after the supporting step, in which the periphery of the substrate is pressed by the pressing member; a moving step, after the pressing step, in which the substrate is relatively moved to a suction position sucked by the suction member; a pressing release step, after the moving step, in which the pressing performed by the pressing member is released; an adsorption process, after the pressing release process, in which the substrate is adsorbed by the adsorption member; and The film forming step is performed after the adsorption step.

12. A method for driving a film forming device, the film forming device comprising: an adsorption member for adsorbing a surface of the substrate on a side opposite to a surface on a film-forming side; a first supporting member that supports a peripheral edge of a surface of the substrate on a film-forming side; as well as a pressing member configured to be movable in a first direction intersecting a surface of the substrate on the film forming side and to press a peripheral edge of the substrate from a side of the substrate opposite to the surface of the substrate on the film forming side, It is characterized in that The driving method of the film forming device comprises: a supporting step, in which the first supporting member supports the periphery of the substrate; a pressing step, after the supporting step, in which the periphery of the substrate is pressed by the pressing member; a moving step, after the pressing step, in which the substrate is relatively moved to a suction position sucked by the suction member; an adsorption process, after the moving process, in which the substrate is adsorbed by the adsorption member; a pressing release step of releasing the pressing performed by the pressing member after the adsorption step; and The film forming step is performed after the pressure releasing step.

13. The method for driving a film forming apparatus according to claim 11 or 12, It is characterized in that The driving method of the film forming device comprises: an adsorption release step, after the film forming step, in which the first supporting member is relatively moved to a position supporting the substrate, and then the adsorption of the substrate by the adsorption member is released; as well as The post-film formation pressing step is performed after the adsorption release step. In the post-film formation pressing step, the periphery of the substrate is pressed by the pressing member.

14. The method for driving a film forming apparatus according to claim 11 or 12, It is characterized in that The driving method of the film forming device comprises: a post-film-forming pressing step, after the film-forming step, in which the periphery of the substrate is pressed by the pressing member after the first supporting member is relatively moved to a position supporting the substrate; as well as The adsorption release step is performed after the post-film formation pressing step. In the adsorption release step, the adsorption of the substrate by the adsorption member is released.

15. A film forming method, It is characterized in that The film forming method forms a film on a substrate using the driving method of the film forming apparatus according to claim 11 or 12.

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