Treatment device based on semiconductor packaging body cutting waste and treatment method thereof

Abstract

The invention relates to the technical field of semiconductor cutting waste treatment, in particular to a treatment device based on semiconductor packaging body cutting waste and a treatment method thereof.The treatment device comprises a waste smashing mechanism, a first-stage sewage filtering mechanism and a second-stage sewage filtering mechanism which are sequentially communicated in the waste discharging direction; the waste smashing mechanism is used for smashing waste frames in cutting waste, the primary sewage filtering mechanism is used for primary filtering treatment of cutting muddy water in the cutting waste, and the secondary sewage filtering mechanism is used for secondary filtering treatment of the cutting muddy water in the cutting waste. Cutting muddy water in cutting waste can be filtered through the first-stage sewage filtering mechanism and the second-stage sewage filtering mechanism, the cutting muddy water generated in the cutting process can be effectively filtered, the cutting muddy water can be prevented from flowing into a blow-off pipeline, then sedimentation is generated, and the blow-off pipeline is blocked; and the treatment efficiency and the discharge efficiency of the waste are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cutting waste treatment, and in particular to a treatment device and a treatment method for semiconductor package cutting waste. Background Art

[0002] Tape Saw is an automatic cutting tool mainly used in the cutting process of semiconductor packages. Currently, during the cutting process of Tape Saw, waste such as waste frames and cutting muddy water (a mixture of cutting cooling water and cutting dust) will be generated. Therefore, we urgently need a treatment device and a treatment method for semiconductor package cutting waste to discharge these wastes after treatment.

[0003] Currently, for the treatment of semiconductor package cutting waste, only a filter screen is provided at the drainage outlet of the cutting equipment. This filter screen can only filter large particle waste frames in the waste, and small particle waste frames and cutting muddy water cannot be filtered. The small particle waste frames and the cutting muddy water mixture are discharged through a pipeline into a sewage collection pool for unified treatment;

[0004] However, due to the long sewage transportation pipeline and the adhesion characteristics of the dust mixture in the cutting muddy water, over time, the sewage transportation pipeline will be blocked, affecting normal sewage discharge;

[0005] In addition, the maintenance personnel of the cutting equipment will regularly check the filter screen and the sewage transportation pipeline. When the maintenance personnel clean the large particle waste frames in the filter screen, there is a risk of scratching their hands. At the same time, each time the sewage transportation pipeline is repaired, the cleaning treatment of the sewage outlet takes more than half an hour. Summary of the Invention

[0006] The applicant of the present invention aims at the above-mentioned disadvantages in the existing production technology, and provides a treatment device and a treatment method for semiconductor package cutting waste. By improving the waste treatment method, it is not necessary for maintenance personnel to clean large particle waste frames, so as to improve the safety of waste treatment. At the same time, it can avoid the blockage of the sewage discharge pipeline and improve the waste treatment efficiency and discharge efficiency.

[0007] The technical solution adopted by the present invention is as follows:

[0008] A processing device based on waste from semiconductor package cutting. The processing device is installed between the sewage outlet of a cutting device and a sewage pipe. The processing device includes: a waste crushing mechanism, a primary sewage filtering mechanism, and a secondary sewage filtering mechanism that are connected in sequence along the waste sewage direction. The inlet end of the waste crushing mechanism is connected to the sewage outlet of the cutting device, and the outlet end of the secondary sewage filtering mechanism is connected to the sewage pipe. The waste crushing mechanism is used for crushing the waste frame in the cutting waste, the primary sewage filtering mechanism is used for the primary filtering of the cutting muddy water in the cutting waste, and the secondary sewage filtering mechanism is used for the secondary filtering of the cutting muddy water in the cutting waste.

[0009] Thus, the waste crushing mechanism can crush the waste frame in the cutting waste, and the primary sewage filtering mechanism and the secondary sewage filtering mechanism can filter the cutting muddy water in the cutting waste twice. Compared with the existing method of only filtering large-particle waste frames in the cutting waste through a filter screen, this method has a simple structure, is easy to operate, can effectively crush the waste frame generated during the cutting process, and the crushed waste residue flows with the sewage and is finally discharged through the sewage pipe, eliminating the need for maintenance personnel to clean the large-particle waste frame, thereby improving the safety of cutting waste treatment. At the same time, it can effectively filter the cutting muddy water generated during the cutting process, prevent this cutting muddy water from flowing into the sewage pipe and settling to block the sewage pipe, and improve the waste treatment efficiency and discharge efficiency.

[0010] As a further improvement of the above technical solution: The primary sewage filtering mechanism is located below the waste crushing mechanism, and the secondary sewage filtering mechanism is located below the primary sewage filtering mechanism. The waste crushing mechanism is connected to the primary sewage filtering mechanism through a first connecting pipe, and the primary sewage filtering mechanism is connected to the secondary sewage filtering mechanism through a second connecting pipe. Thus, through the design of arranging the waste crushing mechanism, the primary sewage filtering mechanism, and the secondary sewage filtering mechanism from top to bottom in sequence, it is ensured that these cutting wastes can only flow from the sewage outlet of the cutting device into the sewage pipe and be finally discharged, enabling the timely discharge of these cutting wastes. At the same time, it can also ensure that the cutting wastes do not flow back into the cutting device through the sewage outlet.

[0011] As a further improvement of the above technical solution: The waste crushing mechanism includes: a crushing box, a feed inlet, a first crushing part, and a second crushing part arranged in sequence along the waste sewage discharge direction. The feed inlet, the first crushing part, and the second crushing part are all located inside the crushing box. The feed inlet is used to drain the waste generated during the cutting of the cutting equipment into the crushing box. The first crushing part is used for the primary crushing of the waste frame, and the second crushing part is used for the secondary crushing of the waste frame. Thus, through the first crushing part and the second crushing part, the large-particle waste frame and small-particle waste frame in the cutting waste can be fully crushed, which can improve the crushing effect of the waste frame. At the same time, the fully crushed waste frame is difficult to block in the sewage pipeline during the sewage discharge process. In this way, the processing efficiency and discharge efficiency of the waste can be further improved.

[0012] As a further improvement of the above technical solution: The structure of the first crushing part is the same as that of the second crushing part; the first crushing part includes: a driving part, a crushing roller, and a plurality of crushing blades. The driving part is located outside the crushing box, the crushing roller is located inside the crushing box, one end of the crushing roller is rotatably connected to the crushing box, the other end of the crushing roller penetrates the crushing box and is connected to the driving end of the driving part, and the crushing blades are sleeved on the outer peripheral surface of the crushing roller. Thus, when the driving part is started, the driving part drives the rotation of the crushing roller, so that the crushing blades rotate, and the crushing of the waste frame is realized by the rotating crushing blades.

[0013] As a further improvement of the above technical solution: A plurality of the crushing blades form a plurality of blade parts along the axial direction of the crushing roller, and the crushing blades of adjacent two blade parts are staggered from each other. Thus, the crushing blades of adjacent two blade parts are staggered from each other, so that part of the crushing blades are always facing the feed inlet during the rotation of the crushing blades, and the waste frame falling from the feed inlet can be crushed in time to improve the crushing efficiency of the waste frame.

[0014] As a further improvement of the above technical solution: The waste crushing mechanism further includes: two guiding parts. One guiding part is located above the first crushing part, and the other guiding part is located above the second crushing part. A single guiding part includes: two guiding plates, the two guiding plates are arranged oppositely, the guiding plates are connected to the crushing box, and the guiding plates are inclined. Thus, through the guiding plates, it can be ensured that the waste frame splashed during the crushing process flows back to the position of the crushing roller, and it is avoided that these splashed waste frames flow out from the gap between the crushing roller and the inner wall of the crushing box, so as to ensure that the waste frame can be fully crushed.

[0015] As a further improvement of the above technical solution: the structure of the primary sewage filtration mechanism is the same as that of the secondary sewage filtration mechanism; the primary sewage filtration mechanism includes: a filtration box body, a plurality of first support plates and a plurality of second support plates. The first support plates and the second support plates are both located inside the filtration box body. The first support plates are inclined, and the second support plates are inclined. A plurality of the second support plates are evenly distributed at equal intervals on a single first support plate. Filter cotton is provided on the upper surface of a single first support plate and on the side surface of a single second support plate along the waste sewage discharge direction. Thus, the filter cotton can effectively filter out the cutting muddy water in the cutting waste. After the cutting waste passes through the primary sewage filtration mechanism and the secondary sewage filtration mechanism, the cutting muddy water in the cutting waste is adsorbed on the filter cotton and will not continue to flow into the sewage discharge pipe. In this way, the cutting waste flowing into the sewage discharge pipe will not carry cutting muddy water, avoiding the blockage of the sewage discharge pipe due to the settlement of the cutting muddy water in the sewage discharge pipe, and improving the waste treatment efficiency and discharge efficiency; the inclined setting of the first support plate can ensure that the cutting waste will not stay in the primary sewage filtration mechanism and the secondary sewage filtration mechanism and can be completely discharged.

[0016] As a further improvement of the above technical solution: one end of a single first support plate is connected to the inner wall of the filtration box body, and there is a gap between the other end of a single first support plate and the inner wall of the filtration box body. A plurality of the first support plates form an S-shaped filtration channel, and the inclination directions of adjacent two first support plates are opposite. Thus, through the design method of forming an S-shaped filtration channel by a plurality of first support plates, when the cutting waste flows in the primary sewage filtration mechanism and the secondary sewage filtration mechanism, the cutting waste continuously impacts the second support plate and fully contacts the filtration surface on the upper surface of the first support plate and the filter cotton on the side surface of the second support plate along the waste sewage discharge direction. In this way, the cutting muddy water in these cutting wastes can be fully filtered out to improve the filtration effect of the cutting muddy water in the cutting waste.

[0017] A treatment method for a treatment device for semiconductor package body cutting waste includes the following steps:

[0018] S1. The waste frame in the cutting waste is crushed by the waste crushing mechanism to crush the large-particle waste frame into small-particle waste frames, and the crushed waste flows into the primary sewage filtration mechanism;

[0019] S2. The cutting muddy water in the cutting waste is initially filtered by the primary sewage filtration mechanism to filter out the cutting muddy water in the waste, and the waste that has been crushed and initially filtered flows into the secondary sewage filtration mechanism;

[0020] S3. Re-filter the cutting muddy water in the cutting waste through the secondary sewage filtering mechanism to filter out the cutting muddy water in the waste. The waste that has undergone crushing treatment, primary filtering treatment, and secondary filtering treatment is discharged through the sewage pipe.

[0021] As a further improvement of the above technical solution: in S2 and S3, as the waste flows, the cutting muddy water in the waste is adsorbed and filtered by the filter cotton arranged in a stepped manner on the S-shaped filter channel, so that the waste flowing in the subsequent sewage pipe is not blocked.

[0022] The beneficial effects of the present invention are as follows:

[0023] The waste crushing mechanism can crush the waste frame in the cutting waste. The primary sewage filtering mechanism and the secondary sewage filtering mechanism can filter the cutting muddy water in the cutting waste twice. Compared with the existing treatment method that only filters the large-particle waste frame in the cutting waste through a filter screen, this method has a simple structure and is easy to operate. It can effectively crush the waste frame generated during the cutting process. The crushed waste residue flows with the sewage and is finally discharged through the sewage pipe, eliminating the need for maintenance personnel to clean the large-particle waste frame, thus improving the safety of cutting waste treatment. At the same time, it can effectively filter the cutting muddy water generated during the cutting process, prevent this cutting muddy water from flowing into the sewage pipe and settling to block the sewage pipe, and improve the treatment efficiency and discharge efficiency of the waste.

[0024] The present invention also has the following advantages:

[0025] 1. Through the design method of arranging the waste crushing mechanism, the primary sewage filtering mechanism, and the secondary sewage filtering mechanism in sequence from top to bottom, the cutting waste can only flow from the sewage outlet of the cutting equipment into the sewage pipe and be finally discharged, enabling the timely discharge of this cutting waste. At the same time, it can also ensure that the cutting waste does not flow back into the cutting equipment through the sewage outlet.

[0026] 2. The first crushing part and the second crushing part of the present invention can fully crush the large-particle waste frame and small-particle waste frame in the cutting waste, improving the crushing effect of the waste frame. At the same time, the fully crushed waste frame is difficult to block in the sewage pipe during the sewage discharge process, thus further improving the treatment efficiency and discharge efficiency of the waste.

[0027] 3. The design method of forming an S-shaped filtration channel by multiple first support plates in the present invention enables the cutting waste to continuously impact the second support plate when flowing in the primary sewage filtration mechanism and the secondary sewage filtration mechanism, and fully contact the filtration surface on the upper surface of the first support plate and the filter cotton on the side of the second support plate along the waste sewage discharge direction. In this way, the cutting muddy water in these cutting wastes can be fully filtered out, so as to improve the filtration effect of the cutting muddy water in the cutting wastes. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram of a processing device for cutting waste of a semiconductor package body according to the present invention;

[0029] Figure 2 is a partial cross-sectional view of a processing device for cutting waste of a semiconductor package body according to the present invention;

[0030] Figure 3 is a partial cross-sectional front view of a processing device for cutting waste of a semiconductor package body according to the present invention;

[0031] Figure 4 is a partial cross-sectional view of a waste crushing mechanism according to the present invention;

[0032] Figure 5 is a partial cross-sectional front view of a waste crushing mechanism according to the present invention;

[0033] Figure 6 is a schematic structural diagram of a first crushing part according to the present invention;

[0034] Figure 7 according to the present invention Figure 6 is a schematic enlarged view of a partial structure at A in

[0035] Figure 8 is a partial cross-sectional view of a primary sewage filtration mechanism according to the present invention;

[0036] Figure 9 is a partial cross-sectional front view of a primary sewage filtration mechanism according to the present invention;

[0037] Figure 10 is a schematic structural diagram of the installation of two adjacent first support plates according to the present invention;

[0038] Figure 11 is a front view of the installation of two adjacent first support plates according to the present invention;

[0039] Figure 12 is a flowchart of a processing method of a processing device for cutting waste of a semiconductor package body according to the present invention.

[0040] Among them: 1. Waste crushing mechanism;

[0041] 101. Crushing box; 102. Feeding port; 103. First crushing part; 1031. Driving part; 1032. Crushing roller; 1033. Crushing blade; 104. Second crushing part; 105. Diversion part; 1051. Diversion plate

[0042] 2. Primary sewage filtration mechanism

[0043] 201. Filtration box body; 202. First support plate; 203. Second support plate; 204. Filter cotton

[0044] 3. Secondary sewage filtration mechanism

[0045] 4. First connecting pipe

[0046] 5. Second connecting pipe

[0047] 6. Discharge port Specific embodiments

[0048] The following will describe the specific embodiments of the present invention with reference to the accompanying drawings

[0049] As Figures 1 to 10 shown, a processing device for semiconductor package cutting waste is installed between the sewage outlet of the cutting equipment and the sewage pipe. The processing device includes: a waste crushing mechanism 1, a primary sewage filtration mechanism 2, and a secondary sewage filtration mechanism 3 that are connected in sequence along the waste sewage direction. The inlet end of the waste crushing mechanism 1 is connected to the sewage outlet of the cutting equipment, and the outlet end of the secondary sewage filtration mechanism 3 is connected to the sewage pipe. The waste crushing mechanism 1 is used for crushing the waste frame in the cutting waste, the primary sewage filtration mechanism 2 is used for the primary filtration of the cutting muddy water in the cutting waste, and the secondary sewage filtration mechanism 3 is used for the secondary filtration of the cutting muddy water in the cutting waste. Thus, the waste frame in the cutting waste can be crushed by the waste crushing mechanism 1, and the cutting muddy water in the cutting waste can be filtered by the primary sewage filtration mechanism 2 and the secondary sewage filtration mechanism 3. Compared with the existing processing method that only filters the large particle waste frame in the cutting waste through a filter screen, this method has a simple structure and is easy to operate. It can effectively crush the waste frame generated during the cutting process. The crushed waste residue flows with the sewage and is finally discharged through the sewage pipe, eliminating the need for maintenance personnel to clean the large particle waste frame, thereby improving the safety of cutting waste treatment. At the same time, it can effectively filter the cutting muddy water generated during the cutting process, prevent this cutting muddy water from flowing into the sewage pipe and then settling to block the sewage pipe, and improve the treatment efficiency and discharge efficiency of the waste

[0050] In other words, the waste crushing mechanism 1 can fully crush large-particle waste frames and small-particle waste frames. The crushed waste residues are discharged along with the flow of sewage. Compared with the existing method of filtering large-particle waste frames, this method crushes the waste frames and directly discharges the crushed waste residues, eliminating the need for maintenance personnel to clean the large-particle waste frames, thereby improving the safety of cutting waste treatment. In addition, by crushing the waste frames, there is no need for a cleaning step, which can further improve the waste treatment efficiency and discharge efficiency. The primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3 can fully filter out the cutting mud and water in the cutting waste. Compared with the existing method of directly discharging after filtering out the large-particle waste frames, this method can filter out the cutting mud and water, preventing them from flowing into the sewage discharge pipe and settling to block the pipe, thus improving the waste treatment efficiency and discharge efficiency (i.e., the cutting waste after removing the cutting mud and water can smoothly pass through the sewage discharge pipe without sedimentation in the pipe to block it, and thus there is no need to regularly clean the sewage discharge pipe (each cleaning of the sewage discharge pipe takes at least half an hour or more)).

[0051] It should be noted that the cutting waste includes solid waste (such as large-particle waste and small-particle waste) and liquid waste (such as sewage and cutting mud and water mixed in the sewage).

[0052] In this embodiment, the primary sewage filtering mechanism 2 is located below the waste crushing mechanism 1, and the secondary sewage filtering mechanism 3 is located below the primary sewage filtering mechanism 2. The waste crushing mechanism 1 is connected to the primary sewage filtering mechanism 2 through the first connecting pipe 4, and the primary sewage filtering mechanism 2 is connected to the secondary sewage filtering mechanism 3 through the second connecting pipe 5. Thus, by arranging the waste crushing mechanism 1, the primary sewage filtering mechanism 2, and the secondary sewage filtering mechanism 3 in sequence from top to bottom, it is ensured that these cutting wastes can only flow from the sewage discharge port of the cutting equipment into the sewage discharge pipe and be finally discharged, enabling timely discharge of these cutting wastes. At the same time, it can also ensure that the cutting wastes do not flow back into the cutting equipment through the sewage discharge port.

[0053] In this embodiment, the waste crushing mechanism 1 includes: a crushing box 101, a feed inlet 102, a first crushing part 103, and a second crushing part 104 arranged in sequence along the waste sewage discharge direction. The feed inlet 102, the first crushing part 103, and the second crushing part 104 are all located inside the crushing box 101. The feed inlet 102 is used to divert the waste generated during the cutting of the cutting equipment into the crushing box 101. The first crushing part 103 is used for the primary crushing of the waste frame, and the second crushing part 104 is used for the secondary crushing of the waste frame. The structure of the first crushing part 103 is the same as that of the second crushing part 104. The first crushing part 103 includes: a driving member 1031, a crushing roller 1032, and a plurality of crushing blades 1033. The driving member 1031 is located outside the crushing box 101, the crushing roller 1032 is located inside the crushing box 101. One end of the crushing roller 1032 is rotatably connected to the crushing box 101, and the other end of the crushing roller 1032 penetrates through the crushing box 101 and is connected to the driving end of the driving member 1031. The crushing blades 1033 are sleeved on the outer circumferential surface of the crushing roller 1032. The plurality of crushing blades 1033 form a plurality of blade parts along the axial direction of the crushing roller 1032, and the crushing blades 1033 of adjacent two blade parts are staggered with each other. The waste crushing mechanism 1 further includes: two guiding parts 105. One guiding part 105 is located above the first crushing part 103, and the other guiding part 105 is located above the second crushing part 104. A single guiding part 105 includes: two guiding plates 1051. The two guiding plates 1051 are arranged oppositely, and the guiding plates 1051 are connected to the crushing box 101. The guiding plates 1051 are inclined. Thus, through the first crushing part 103 and the second crushing part 104, the large-particle waste frame and the small-particle waste frame in the cutting waste can be fully crushed, which can improve the crushing effect of the waste frame. At the same time, the fully crushed waste frame is difficult to block in the sewage discharge pipe during the sewage discharge process. In this way, the treatment efficiency and discharge efficiency of the waste can be further improved. Start the driving member 1031, drive the rotation of the crushing roller 1032 through the driving member 1031, so that the crushing blades 1033 rotate, and the crushing treatment of the waste frame is realized through the rotating crushing blades 1033. The crushing blades 1033 of adjacent two blade parts are staggered with each other, so that part of the crushing blades 1033 of the rotating crushing blades 1033 are always facing the feed inlet 102, and the waste falling from the feed inlet 102 can be timely crushed to improve the crushing efficiency of the waste frame. Through the guiding plates 1051, it can be ensured that the waste frame splashed during the crushing process flows back to the position of the crushing roller 1032, and these splashed waste frames are prevented from flowing out through the gap between the crushing roller 1032 and the inner wall of the crushing box 101, so as to ensure that the waste frame can be fully crushed.

[0054] For example: The driving member 1031 adopts a motor.

[0055] In this embodiment, the structure of the primary sewage filtering mechanism 2 is the same as that of the secondary sewage filtering mechanism 3; the primary sewage filtering mechanism 2 includes: a filtering box body 201, a plurality of first support plates 202 and a plurality of second support plates 203. The first support plates 202 and the second support plates 203 are both located inside the filtering box body 201. The first support plates 202 are inclined, and the second support plates 203 are inclined. A plurality of second support plates 203 are equidistantly distributed on a single first support plate 202. Filter cotton 204 is provided on the upper surface of a single first support plate 202 and on the side surface of a single second support plate 203 along the waste sewage discharge direction; one end of a single first support plate 202 is connected to the inner wall of the filtering box body 201, and there is a gap between the other end of a single first support plate 202 and the inner wall of the filtering box body 201. The plurality of first support plates 202 form an S-shaped filtering channel, and the inclination directions of two adjacent first support plates 202 are opposite. Thus, the cutting muddy water in the cutting waste can be effectively filtered out by the filter cotton 204. After the cutting waste passes through the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3, the cutting muddy water in the cutting waste is adsorbed on the filter cotton 204 and will not continue to flow into the sewage discharge pipe. In this way, the cutting waste flowing into the sewage discharge pipe will not carry cutting muddy water, avoiding the blockage of the sewage discharge pipe due to the settlement of the cutting muddy water in the sewage discharge pipe, and improving the treatment efficiency and discharge efficiency of the waste; the inclined arrangement of the first support plates 202 can ensure that the cutting waste will not stay in the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3 and can be completely discharged; through the design method of forming an S-shaped filtering channel by the plurality of first support plates 202, when the cutting waste flows in the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3, these cutting wastes continuously impact the second support plates 203 and are in full contact with the filtering surface on the upper surface of the first support plates 202 and the filter cotton 204 on the side surface of the second support plates 203 along the waste sewage discharge direction. In this way, the cutting muddy water in these cutting wastes can be fully filtered out to improve the filtering effect of the cutting muddy water in the cutting waste.

[0056] It should be noted that: the opposite inclination directions of two adjacent first support plates 202 means that: one first support plate 202 presents a state where the side closer to the first connecting pipe 4 is higher than the side away from the first connecting pipe 4, and the other first support plate 202 presents a state where the side away from the first connecting pipe 4 is higher than the side closer to the first connecting pipe 4. In this way, a plurality of first support plates 202 can form an S-shaped channel in the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3.

[0057] The treatment process of the cutting waste of the present invention is as follows: First, connect the feed inlet 102 to the sewage outlet of the cutting equipment, and connect the discharge outlet 6 to the sewage pipeline; Then, start the driving member 1031, drive the crushing roller 1032 to rotate through the driving member 1031, so that the crushing blade 1033 rotates, and use the rotating crushing blade 1033 to crush the waste frames (large particle waste frames, small particle waste frames) in the cutting waste; Finally, the cutting waste (including the waste residue after crushing treatment) flows through the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3, and finally is discharged through the sewage pipeline (the discharged cutting waste does not contain large particle waste frames, small particle waste frames and cutting muddy water), and the filtering treatment of the cutting muddy water in the cutting waste is completed in the primary sewage filtering mechanism 2 and the secondary sewage filtering mechanism 3.

[0058] As Figure 11 shown, a treatment method for a treatment device of cutting waste based on a semiconductor package body includes the following steps:

[0059] S1. Crush the waste frames in the cutting waste through the waste crushing mechanism 1 to crush the large particle waste frames into small particle waste frames, and the crushed waste flows into the primary sewage filtering mechanism 2;

[0060] S2. Conduct primary filtration treatment on the cutting muddy water in the cutting waste through the primary sewage filtering mechanism 2 to filter out the cutting muddy water in the waste, and the waste after crushing treatment and primary filtration treatment flows into the secondary sewage filtering mechanism 3;

[0061] S3. Conduct secondary filtration treatment on the cutting muddy water in the cutting waste through the secondary sewage filtering mechanism 3 to filter out the cutting muddy water in the waste, and the waste after crushing treatment, primary filtration treatment and secondary filtration treatment is discharged through the sewage pipeline.

[0062] In this embodiment, in S2 and S3, as the waste flows, the cutting muddy water in the waste is adsorbed and filtered by the filter cotton 204 arranged in a stepped manner on the S-shaped filtration channel, so that the waste flowing in the subsequent sewage pipeline is not blocked.

[0063] In summary, through the waste crushing mechanism 1 of the present invention, the waste frames in the waste can be crushed and cut. Through the primary sewage filtration mechanism 2 and the secondary sewage filtration mechanism 3, the cutting muddy water in the cut waste can be filtered twice. Compared with the existing treatment method that only filters the large-particle waste frames in the cut waste through a filter screen, this method has a simple structure and is easy to operate. It can effectively crush the waste frames generated during the cutting process. The crushed waste residues flow with the sewage and are finally discharged through the sewage discharge pipe, eliminating the need for maintenance personnel to clean the large-particle waste frames, thereby improving the safety of waste cutting treatment. At the same time, it can effectively filter the cutting muddy water generated during the cutting process, preventing this cutting muddy water from flowing into the sewage discharge pipe and settling to block the sewage discharge pipe, and improving the waste treatment efficiency and discharge efficiency.

[0064] The above description is an explanation of the present invention, not a limitation of the invention. The scope defined by the present invention is referred to the claims. Any form of modification can be made within the protection scope of the present invention.

Claims

1. A device for processing semiconductor package cutting waste, the device being installed between the sewage outlet of the cutting equipment and the sewage pipe, characterized in that: The processing device comprises: A waste crushing mechanism (1), a primary sewage filtering mechanism (2) and a secondary sewage filtering mechanism (3) are sequentially connected along the waste discharge direction, the inlet end of the waste crushing mechanism (1) is connected to the sewage discharge port of the cutting device, the outlet end of the secondary sewage filtering mechanism (3) is connected to the sewage discharge pipe, the waste crushing mechanism (1) is used for crushing the waste frame in the cutting waste, the primary sewage filtering mechanism (2) is used for the primary filtering treatment of cutting mud and water in the cutting waste, and the secondary sewage filtering mechanism (3) is used for the secondary filtering treatment of cutting mud and water in the cutting waste.

2. The device for processing semiconductor package cutting waste according to claim 1, characterized in that: The primary sewage filtering mechanism (2) is located below the waste crushing mechanism (1), and the secondary sewage filtering mechanism (3) is located below the primary sewage filtering mechanism (2). The waste crushing mechanism (1) is connected to the primary sewage filtering mechanism (2) via a first connecting pipe (4), and the primary sewage filtering mechanism (2) is connected to the secondary sewage filtering mechanism (3) via a second connecting pipe (5).

3. The device for processing semiconductor package cutting waste according to claim 1, characterized in that: The waste crushing mechanism (1) comprises: A crushing box (101), a feed port (102) arranged in sequence along the waste discharge direction, a first crushing section (103) and a second crushing section (104), wherein the feed port (102), the first crushing section (103) and the second crushing section (104) are all located in the crushing box (101), the feed port (102) is used to guide the waste generated during cutting by the cutting equipment into the crushing box (101), the first crushing section (103) is used for the initial crushing of the waste frame, and the second crushing section (104) is used for the secondary crushing of the waste frame.

4. The device for processing semiconductor package cutting waste according to claim 3, characterized in that: The structure of the first crushing part (103) is the same as the structure of the second crushing part (104); The first crushing unit (103) comprises: A driving member (1031), a crushing roller (1032) and a plurality of crushing blades (1033), wherein the driving member (1031) is located outside the crushing box (101), the crushing roller (1032) is located inside the crushing box (101), one end of the crushing roller (1032) is rotatably connected to the crushing box (101), the other end of the crushing roller (1032) passes through the crushing box (101) and is connected to the driving end of the driving member (1031), and the crushing blades (1033) are sleeved on the outer peripheral surface of the crushing roller (1032).

5. The device for processing semiconductor package cutting waste according to claim 4, characterized in that: The plurality of crushing blades (1033) form a plurality of blade sections along the axial direction of the crushing roller (1032), and the crushing blades (1033) of two adjacent blade sections are staggered with each other.

6. The device for processing semiconductor package cutting waste according to claim 3, characterized in that: The waste crushing mechanism (1) further comprises: Two guide parts (105), one of the guide parts (105) is located above the first crushing part (103), and the other of the guide parts (105) is located above the second crushing part (104) The single flow guide (105) comprises: Two guide plates (1051), the two guide plates (1051) are arranged opposite to each other, the guide plates (1051) are connected to the crushing box (101), and the guide plates (1051) are arranged obliquely.

7. The device for processing semiconductor package cutting waste according to claim 1, characterized in that: The structure of the primary sewage filtering mechanism (2) is the same as that of the secondary sewage filtering mechanism (3); The primary sewage filtering mechanism (2) comprises: A filter box (201), a plurality of first support plates (202) and a plurality of second support plates (203), wherein the first support plate (202) and the second support plate (203) are both located in the filter box (201), the first support plate (202) is tilted, the second support plate (203) is tilted, a plurality of second support plates (203) are evenly spaced on a single first support plate (202), and filter cotton (204) is provided on the upper surface of the single first support plate (202) and the side surface of the single second support plate (203) along the waste discharge direction.

8. The device for processing semiconductor package cutting waste according to claim 7, characterized in that: One end of a single first support plate (202) is connected to the inner wall of the filter box (201), and a gap exists between the other end of the single first support plate (202) and the inner wall of the filter box (201); a plurality of first support plates (202) form an S-shaped filter channel, and the inclination directions of two adjacent first support plates (202) are opposite.

9. A method for treating semiconductor package cutting waste based on the device for treating semiconductor package cutting waste according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, the waste frame in the cutting waste is crushed by the waste crushing mechanism (1) to crush the large particles of the waste frame into small particles of the waste frame, and the crushed waste flows into the primary sewage filtering mechanism (2); S2, performing a primary filtration treatment on the cutting muddy water in the cutting waste through the primary sewage filtering mechanism (2) to filter out the cutting muddy water in the waste, and the waste that has been pulverized and initially filtered flows into the secondary sewage filtering mechanism (3); S3, the cutting muddy water in the cutting waste is filtered again by the secondary sewage filtering mechanism (3) to filter out the cutting muddy water in the waste, and the waste that has been crushed, initially filtered and filtered again is discharged through a sewage pipe.

10. The method for treating semiconductor package cutting waste based on the device for treating semiconductor package cutting waste according to claim 9, characterized in that: In S2 and S3, as the waste flows, the cutting muddy water in the waste is adsorbed and filtered by the filter cotton (204) arranged in steps on the S-shaped filter channel, so that the waste flowing in the subsequent sewage pipe is not blocked.

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