A method and system for aging detection of a security module circuit board

Abstract

This application relates to the technical field of electrical variable measurement, and specifically relates to a method and system for detecting the aging of a safety module circuit board. The method includes: collecting voltage data of the safety module circuit board during each detection in the aging test process, dividing the rising edge and the falling edge, analyzing the differences between the rising edge and the falling edge of each extreme point, and obtaining a morphological symmetry difference value; extracting the step segments of each rising edge and each falling edge and analyzing the voltage deviation of each step segment, and combining the mutation degree of the step segment to obtain a step jump coefficient to calculate the voltage waveform anomaly value in each detection process, combining the fluctuation degree of all voltage waveform anomaly values in each detection process, obtaining an influence coefficient of the circuit board performance fluctuating with the detection factors in each detection process, and further obtaining a comprehensive performance fluctuation coefficient for each detection, combining the voltage waveform anomaly value, obtaining a circuit board aging state anomaly value to judge the aging state of the circuit board. This application improves the accuracy of circuit board aging detection.

Description

Technical Field

[0001] This application relates to the technical field of electrical variable measurement, and particularly relates to a method and system for detecting the aging of a safety module circuit board. Background Art

[0002] The safety module circuit board is a component and circuit integrating safety functions, which is used to protect electronic devices and systems from electrical faults, environmental factors, and malicious attacks. With the increase of the usage time or the influence of environmental factors, the materials and components on the circuit board gradually degenerate, resulting in the degradation of the performance of the safety template circuit. The electrical test of the circuit board aging is a key step to evaluate its long-term reliability and performance degradation.

[0003] In actual use, the circuit board may face dynamic environmental changes. For example, rapid temperature changes or periodic humidity changes will affect the performance of the circuit board. Existing patents have limitations in the test environment during the circuit board aging detection process, and the circuit board of the safety module has a more stringent protection mechanism in design. The abnormal features extracted under aging faults may not be obvious, resulting in insufficient accuracy of the aging detection of the safety module circuit board. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of this application is to provide a method and system for detecting the aging of a safety module circuit board. The specific technical solutions adopted are as follows:

[0005] The embodiment of this application provides a method for detecting the aging of a safety module circuit board, including the following steps:

[0006] Collect the voltage data of the safety module circuit board during each detection in the aging test process;

[0007] Fit the voltage data to obtain the voltage fitting curve for each detection, analyze the extreme points in the voltage fitting curve to divide the rising edge and the falling edge, analyze the distance relationship and duration difference between the rising edge and the falling edge of each extreme point, and obtain the morphological symmetry difference value on both sides of each extreme point;

[0008] Analyze the voltage change situation of each rising edge and falling edge, extract the step sections of each rising edge and each falling edge, analyze the voltage deviation situation between each step section, and combine the mutation degree between the step sections to obtain the step jump coefficients of each rising edge and each falling edge respectively. Combine the morphological symmetry difference values on both sides of all extreme points to obtain the voltage waveform anomaly value in each detection process;

[0009] Analyze the fluctuation degree of all voltage waveform anomaly values in each detection process, and combine the peak characteristics of the voltage waveform anomaly values in each detection process to obtain the influence coefficients of the circuit board performance fluctuating with the detection factors in each detection process respectively, and then obtain the comprehensive performance fluctuation coefficient of each detection;

[0010] Combining the change trend of the comprehensive performance fluctuation coefficient corresponding to all detections during the aging test process, and combining the abnormal value of the voltage waveform, an abnormal value of the aging state of the circuit board is obtained to judge the aging state of the circuit board.

[0011] Preferably, the method for obtaining the rising edge and the falling edge is as follows:

[0012] Taking the curve segment corresponding to the left endpoint being the minimum value point and the right endpoint being the maximum value point in the voltage fitting curve as the rising edge of the voltage waveform, and taking the curve segment corresponding to the left endpoint being the maximum value point and the right endpoint being the minimum value point as the falling edge of the voltage waveform.

[0013] Preferably, the method for obtaining the morphological symmetry difference value on both sides of each extreme value point is as follows:

[0014] For each extreme value point, taking the perpendicular line where the extreme value point is located as the axis of symmetry, flipping the first falling edge adjacent to the left side of the axis of symmetry around the axis of symmetry to obtain a flipped line segment, and calculating the DTW distance between the obtained flipped line segment and the first rising edge on the right side;

[0015] Calculating the absolute value of the difference in time length between the adjacent rising edge and falling edge on both sides of the extreme value point, and taking the product of the absolute value and the DTW distance as the morphological symmetry difference value on both sides of the extreme value point.

[0016] Preferably, further extracting the step segments of each rising edge and each falling edge includes: respectively taking the line segments corresponding to the consecutive data points with a slope of 0 in each rising edge and falling edge as the step segments of the corresponding rising edge and falling edge.

[0017] Preferably, the calculation method for the step jump coefficient of any rising edge is as follows: , where is the step jump coefficient of any rising edge, B represents the product of the average of the time lengths corresponding to all step segments of any rising edge and the sum of the voltage differences between all adjacent step segments, represents the logarithmic function with base 2, and C represents the sum of the absolute values of the slopes between the last data in each step segment of any rising edge and the first data in the adjacent next step segment;

[0018] Among them, if there is no step segment in the rising edge and falling edge, the step jump coefficient is recorded as 0.

[0019] Preferably, the method for obtaining the abnormal value of the voltage waveform in each detection process is as follows:

[0020] Obtain the mean of the morphological symmetry difference values on both sides of all extreme points during each detection process, and the mean of the step jump coefficients of all rising edges and falling edges. Take the sum of the two means as the voltage waveform outlier during each detection process.

[0021] Preferably, the method for obtaining the influence coefficient of the circuit board performance fluctuating with the detection factors during each detection process is as follows:

[0022] Perform peak extraction on all voltage waveform outliers during each detection process, and calculate the kurtosis of the peak positions. Take the product of the kurtosis and the amplitude corresponding to the peak as the influence coefficient of the circuit board performance fluctuating with the detection factors during each detection process, where the detection factors include temperature and humidity.

[0023] Preferably, the method for obtaining the comprehensive performance fluctuation coefficient for each detection is as follows:

[0024] Calculate the Shannon entropy of all voltage waveform outliers during each detection process, and take the product of the average value of the influence coefficients obtained from each detection and the Shannon entropy as the comprehensive performance fluctuation coefficient for each detection.

[0025] Preferably, the method for obtaining the outlier of the circuit board aging state is as follows:

[0026] Fit the comprehensive performance fluctuation coefficients obtained from all detection processes, and calculate the average value of the slope values at all points of the obtained fitting curve, denoted as the average slope value. Take the product of the average slope value and the average value of the voltage waveform outliers during all detection processes as the outlier of the circuit board aging state.

[0027] The embodiment of the present application also provides a safety module circuit board aging detection system, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of the above-mentioned safety module circuit board aging detection method.

[0028] As can be seen from the above, the safety module circuit board aging detection method and system provided by the present application have at least the following beneficial effects:

[0029] The present application performs aging detection through the method of cyclic temperature and humidity durability testing. Its advantage lies in being able to more realistically evaluate its performance stability under long-term use and various environmental conditions; further deeply analyze the waveform anomaly characteristics of the voltage data during each detection process, and combine the degree of influence of performance on temperature and humidity changes and the change amplitude of performance over time to calculate the outlier of the circuit board aging state for aging detection and evaluation of the circuit board. Its advantage lies in being able to accurately obtain the key electrical change characteristics corresponding to circuit board aging and improve the accuracy of safety module circuit board aging detection. Description of the Drawings

[0030] To more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is a flowchart of the steps of a method for detecting the aging of a safety module circuit board provided by the present application;

[0032] Figure 2 It is a schematic diagram of the acquisition process of the morphological symmetry difference value on both sides of the extreme point provided by the present application. Detailed Embodiments

[0033] In order to further elaborate on the technical means and effects adopted by the present application to achieve the intended invention purpose, the following will, in conjunction with the drawings and preferred embodiments, detail the specific embodiments, structures, features, and effects of a method and system for detecting the aging of a safety module circuit board proposed according to the present application. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0034] Unless otherwise specified and limited, terms such as "including", "comprising", or any other variant thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article, or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the article or device including the said element. In addition, the term "and / or" used herein includes any and all combinations of one or more of the related listed items. All technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0035] The following will specifically describe the specific solutions of a method and system for detecting the aging of a safety module circuit board provided by the present application in conjunction with the drawings.

[0036] Please refer to Figure 1 , which shows a flowchart of the steps of a method for detecting the aging of a safety module circuit board provided by an embodiment of the present application, including the following steps:

[0037] Step 1: Collect the voltage data of the safety module circuit board during each detection in the aging test process.

[0038] The safety module circuit board is the core component integrating safety functions and circuit connections, and its performance and reliability directly affect the stable operation of the device. In actual applications, the circuit board may be affected by various factors, such as temperature, humidity, etc. These factors will cause the aging of the circuit board. Abnormal circuits are prone to appear on the circuit board, especially in extreme environments, the performance of components inside the circuit board decreases significantly, such as an increase in resistance value or a decrease in capacitance value, affecting the signal transmission function of the circuit. Therefore, the aging state of the safety module circuit board can be better reflected through electrical performance testing.

[0039] To more comprehensively reflect the operating state of the circuit board in different environments, this application conducts durability environmental stress tests on the safety module circuit board, places the circuit board in different temperature and humidity environments, and monitors its electrical performance. In the humidity test, in this embodiment, the detection environmental temperature is set to , and the humidity range is from 10% to 90%. Each time, the environmental humidity is adjusted by increasing or decreasing 10%. A cyclic test is carried out within this humidity range, and each process of changing the temperature from the lowest to the highest and then back to the lowest is regarded as a humidity cycle test. During the temperature test, in this embodiment, the environmental humidity is set to 50%, and the temperature range is to . Each time, the environmental temperature is adjusted by increasing or decreasing . A cyclic test is carried out within this temperature range, and each process of changing the temperature from the lowest to the highest and then back to the lowest is regarded as a temperature cycle test. It should be noted that in this embodiment, the temperature cycle test and the humidity cycle test are carried out alternately. Among them, in this embodiment, for the convenience of expression and understanding, each temperature cycle test and each humidity cycle test are both recorded as one detection.

[0040] Furthermore, the detection time length after each temperature or humidity adjustment is set to 2 minutes. In this embodiment, the entire detection time of the temperature test and the humidity test is set to 48 hours. The voltage waveform data of the safety module circuit board during each detection process is collected through an oscilloscope, and the data collection frequency is 1000HZ.

[0041] Step 2: Fit the voltage data to obtain the voltage fitting curve for each detection, analyze the extreme points in the voltage fitting curve to divide the rising edge and the falling edge, analyze the distance relationship and duration difference between the rising edge and the falling edge of each extreme point, and obtain the morphological symmetry difference value on both sides of each extreme point.

[0042] After the safety module circuit board ages, its internal components are prone to expansion, contraction, poor welding and uneven coating, which affects its working stability. Since different components on the safety module circuit board have different sensitivities to temperature and humidity, and in order to be able to observe possible faults and problems of the circuit board in a shorter period of time, this embodiment adopts a cyclic temperature and humidity durability method for monitoring, so as to observe the performance changes of various components on the circuit board under different environmental conditions and improve the test efficiency. In addition, in each test process, in order to simulate the operation under actual working conditions, a certain workload is applied to the safety module circuit board, and combined with the temperature and humidity cycle change detection, the change characteristics of the voltage data during each test process are analyzed.

[0043] Taking any one of the tests as an example, after the aging of the safety module circuit board, there will be performance degradation of the filter capacitor and resistor components and imbalance of the drive circuit, which will lead to abnormal waveform in the output voltage, specifically manifested as asymmetric characteristics and step-like fluctuation characteristics. The asymmetric characteristics are reflected by the asymmetry of the rising edge and the falling edge of the voltage waveform data, and the time difference between the rising edge and the falling edge. Therefore, in order to analyze this feature, the following processing is first performed.

[0044] Since the voltage collected by the oscilloscope is discrete data, the present application first uses polynomial fitting technology to process the voltage data to obtain the voltage fitting curve corresponding to this detection. Although there may be step fluctuations in the details of the rising edge or falling edge of the voltage waveform, its overall change still shows a sine wave style, and then all extreme points in the voltage fitting curve are obtained, and the curve segment corresponding to the left end point of the voltage fitting curve is the minimum point and the right end point is the maximum point as the rising edge of the voltage waveform, and the curve segment corresponding to the left end point of the voltage fitting curve is the maximum point and the right end point is the minimum point as the falling edge of the voltage waveform. Then, asymmetric features are performed based on the divided rising and falling edges. Taking a certain maximum point as an example, the vertical line where it is located is used as the axis of symmetry, and the first falling edge adjacent to the left side of the axis of symmetry is flipped around the axis of symmetry to obtain a flip line segment, and then the DTW distance between the flip line segment and the first rising edge on the right is calculated, and the DTW distance reflects the waveform style difference characteristics on both sides of the extreme point. The absolute value of the difference between the time lengths of the rising edge and the falling edge on both sides of the maximum point is further calculated, and the product of the absolute value and the DTW distance is taken as the morphological symmetry difference value on both sides of the maximum point, which reflects the local asymmetric characteristics of the voltage waveform data.

[0045] Correspondingly, for the minimum point, the vertical line where the minimum point is located is also used as the symmetry axis, and the same calculation steps as above in this embodiment are adopted to obtain the morphological symmetry difference value corresponding to the minimum point.

[0046] Specifically, the schematic diagram of the acquisition process of the morphological symmetry difference value on both sides of the extreme point is as follows Figure 2 shown.

[0047] Step 3: Analyze the voltage changes at each rising edge and falling edge, extract the step segments at each rising edge and each falling edge, analyze the voltage deviation between the step segments, and combine the mutation degree between the step segments to obtain the step jump coefficients at each rising edge and each falling edge respectively. Combine the morphological symmetry difference values on both sides of all extreme points to obtain the voltage waveform abnormality values in each detection process.

[0048] In addition, when the circuit board ages, there are certain stepped fluctuation characteristics in its voltage data at the rising edge and the falling edge. If the width of each step is larger, the height difference between the steps is larger, and the jump is steeper, it indicates that the aging degree of the component is more serious. Therefore, to analyze this characteristic, the following processing is carried out. Taking a rising edge of the voltage data as an example, if there is a step change, there are continuous data points with a slope of 0 corresponding to the defect, and then obtain the line segment corresponding to all the continuous data points with a slope of 0 as the step segment of this rising edge. First, calculate the average value of the time lengths corresponding to all the step segments of this rising edge, then calculate the cumulative sum of the voltage differences between all adjacent step segments, and obtain the cumulative result of the absolute value of the slope between the last data in each step segment and the first data in the next adjacent step segment. The calculation method of the step jump coefficient for any rising edge is: , where is the step jump coefficient of any rising edge, B represents the product between the average value of the time lengths corresponding to all the step segments of any rising edge and the cumulative sum of the voltage differences between all adjacent step segments, C represents the cumulative sum of the absolute values of the slopes between the last data in each step segment of any rising edge and the first data in the next adjacent step segment, represents the logarithmic function with base 2. Since the slope obtained during the stepped fluctuation process may be extremely large, a mapping is performed through the logarithmic function. The larger the obtained step jump coefficient, the more significant the stepped fluctuation appears in the voltage waveform data, and the more likely the performance of the component is affected by aging. If there is no step jump, that is, there is no step segment, the step jump coefficient is recorded as 0.

[0049] So far, the step jump coefficients of all rising edges can be obtained through the above process of this embodiment. Correspondingly, for each falling edge, repeat the above process of this embodiment to obtain the step segments of each falling edge and calculate the step jump coefficients of each falling edge.

[0050] Through the above analysis, the asymmetric characteristics and step-like fluctuation characteristics in the output voltage are obtained. The two comprehensively reflect the abnormal characteristics of the waveform of the safety module circuit board due to aging. Then, for each detection, the mean of the morphological symmetry difference values on both sides of all extreme points in each detection process and the mean of the step jump coefficients of all rising and falling edges are obtained. The sum of the two means is taken as the voltage waveform abnormal value in each detection process. The larger the voltage waveform abnormal value, the more significant the asymmetric characteristics and step-like fluctuation characteristics of the voltage waveform in the detection process.

[0051] Step 4: Analyze the fluctuation degree of all voltage waveform abnormal values during each detection process, and combine the peak characteristics of the voltage waveform abnormal values during each detection process to obtain the influence coefficient of the circuit board performance during each detection process with the fluctuation of the detection factors, and then obtain the comprehensive performance fluctuation coefficient of each detection.

[0052] Furthermore, when performing aging tests on circuit boards, it is crucial to conduct cyclic temperature and humidity durability tests. This test method helps evaluate the reliability and stability of circuit boards by simulating various temperature and humidity environments that circuit boards may encounter during actual use. Therefore, the abnormal characteristics of voltage data obtained under various temperature and humidity test environments can reflect the aging characteristics that may occur in circuit boards. In low humidity environments, the moisture in the air is reduced, and static electricity is more likely to accumulate. Electrostatic discharge may damage sensitive components on circuit boards, causing component performance degradation or even failure. High humidity environments can easily lead to oxidation and corrosion of metal parts such as solder joints and wires on circuit boards, affecting the reliability of circuit board connections. In addition, under low temperature conditions, the strength of solder joints in circuit boards will decrease, which may lead to desoldering and short circuits. Under high temperature environments, the conductive properties of electronic devices will be significantly reduced, current transmission will be poor, and resistance values will change, affecting the overall performance of the circuit. It can be seen that under extreme ambient humidity and extreme ambient temperature conditions, the abnormal characteristics exhibited by circuit boards during aging are more significant.

[0053] In this embodiment, the detection factors include temperature and humidity. Specifically, taking the temperature cycle test as an example, for each temperature cycle test, for a circuit board in a normal state, the degree of influence of environmental temperature changes on its performance is relatively low, while for an aged circuit board, the performance difference under temperature fluctuations is relatively large. Therefore, during each temperature cycle detection process, the abnormal values of the voltage waveforms obtained may fluctuate correspondingly with the rise and fall of temperature. Furthermore, first calculate the Shannon entropy of all abnormal values of the voltage waveforms in this temperature cycle test, and this value reflects the degree of fluctuation of the circuit board performance with temperature changes. And during the cycle, there is a state where the environmental temperature is relatively high, resulting in peaks in the abnormal values of the voltage waveforms arranged in ascending order of time. The larger the amplitude of the obtained peak and the sharper the peak, the higher the degree of influence of temperature on the circuit board performance. Then, use the findpeaks algorithm to extract the peaks from all abnormal values of the voltage waveforms and calculate the kurtosis of the peak positions. Multiply the kurtosis by the amplitude corresponding to the peak as the influence coefficient of the circuit board performance fluctuating with temperature during the detection process. This value reflects the degree of fluctuation of the circuit board performance during temperature cycle changes.

[0054] According to the above process of this embodiment, during the humidity cycle test, the influence coefficient of the circuit board performance fluctuating with humidity during the detection process can be obtained. For each cycle, multiply the mean value of the influence coefficients during each cycle by the Shannon entropy as the comprehensive performance fluctuation coefficient for each cycle. This value reflects the comprehensive degree of influence of the circuit board performance by environmental temperature and humidity changes.

[0055] Step Five: Combine the change trend of the comprehensive performance fluctuation coefficients corresponding to all detections during the aging test process, and combine the abnormal values of the voltage waveforms to obtain the abnormal value of the circuit board aging state to determine the circuit board aging state.

[0056] And the aging detection of the circuit board of the security module usually takes a long time. As the temperature and humidity durability test continues, the aging of its circuit board becomes more and more serious, making the degree of influence of performance by the environment greater and greater, and the obtained comprehensive performance fluctuation coefficient will gradually increase, and the increasing amplitude will become larger and larger as the test progresses, thereby reflecting the speed of circuit board aging. Therefore, in this embodiment, the comprehensive performance fluctuation coefficients obtained during all detection processes are fitted by the least squares method, and the average value of the slope values at all points of the obtained fitting curve is calculated, denoted as the average slope value. Multiply the average slope value by the average value of the abnormal values of the voltage waveforms during all detection processes during the aging test as the abnormal value of the circuit board aging state. This value reflects that the adaptability of the circuit board during the test process is worse during long-term use.

[0057] In this embodiment, by analyzing the abnormal voltage characteristics in the cyclic temperature and humidity durability test, combining the degree of influence of performance on temperature and humidity changes and the change range of performance over time, the abnormal value of the circuit board aging state is calculated, and based on this, the aging detection and evaluation of the circuit board are carried out. The higher the obtained abnormal value of the circuit board aging state, the more unstable the performance of the safety module circuit board is, and the worse the adaptability for long-term use is. For quantitative evaluation, this embodiment uses the tanh function to normalize the obtained abnormal value of the circuit board aging state, and sets its aging detection and evaluation interval as follows. If the normalized result is less than 0.5, it means that the circuit board has not aged and the performance is good; if the normalized result is greater than or equal to 0.5, it means that the circuit board has aged and the adaptability for long-term use is poor, and corresponding measures need to be taken for maintenance.

[0058] Based on the same inventive concept as the above method, an embodiment of the present application also provides a safety module circuit board aging detection system, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any one of the above safety module circuit board aging detection methods.

[0059] It can be understood that the above sequence of embodiments of the present application is only for description and does not represent the superiority or inferiority of the embodiments. And the above specific embodiments of this specification have been described. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0060] Each embodiment in this specification is described in a progressive manner. For the same or similar parts between each embodiment, reference can be made to each other. The key point of each embodiment is to illustrate the differences from other embodiments.

[0061] The above content is only the implementation manner of the present application and is not used to limit the scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the protection scope of the present application.

Claims

1. A method for detecting the aging of a safety module circuit board, characterized in that, Including the following steps: Collect the voltage data of the safety module circuit board during each detection in the aging test process; Fit the voltage data to obtain the voltage fitting curve for each detection. For each extreme point in the voltage fitting curve, with the perpendicular line where the extreme point is located as the axis of symmetry, flip the first falling edge adjacent to the left side of the axis of symmetry around the axis of symmetry to obtain a flipped line segment, and calculate the DTW distance between the obtained flipped line segment and the first rising edge on the right side; Calculate the absolute value of the difference in time length between the adjacent rising edge and falling edge on both sides of the extreme point, and take the product of the absolute value and the DTW distance as the morphological symmetry difference value on both sides of the extreme point; Analyze the voltage changes at each rising edge and falling edge, extract the step segments at each rising edge and each falling edge, analyze the voltage deviation between each step segment, and combine the mutation degree between the step segments to obtain the step jump coefficients at each rising edge and each falling edge respectively. The calculation formula for the step jump coefficient is as follows: , where is the step jump coefficient of any rising edge. B represents the product of the average of the time lengths corresponding to all step segments of the any rising edge and the sum of the voltage differences between all adjacent step segments. represents the logarithmic function with base 2. C represents the sum of the absolute values of the slopes between the last data in each step segment of the any rising edge and the first data in the adjacent next step segment. Among them, if there is no step segment in the rising edge and falling edge, the step jump coefficient is recorded as 0. Combine the morphological symmetry difference values on both sides of all extreme points to obtain the voltage waveform outliers in each detection process. Perform peak extraction on all voltage waveform outliers during each detection process, and calculate the kurtosis of the peak position. Take the product of the kurtosis and the amplitude corresponding to the peak as the influence coefficient of the circuit board performance fluctuating with the detection factors during each detection process, where the detection factors include temperature and humidity; Calculate the Shannon entropy of all voltage waveform outliers during each detection process, and take the product of the average value of the influence coefficients obtained from each detection and the Shannon entropy as the comprehensive performance fluctuation coefficient for each detection; Combining the change trend of the comprehensive performance fluctuation coefficients corresponding to all detections in the aging test process, and combining the voltage waveform outliers, obtain the circuit board aging state outliers to judge the circuit board aging state.

2. The aging detection method for a safety module circuit board according to claim 1, characterized in that, The method for obtaining the rising edge and falling edge is as follows: Take the curve segment with the left endpoint as the minimum value point and the right endpoint as the maximum value point in the voltage fitting curve as the rising edge of the voltage waveform, and take the curve segment with the left endpoint as the maximum value point and the right endpoint as the minimum value point as the falling edge of the voltage waveform.

3. The aging detection method for a safety module circuit board according to claim 1, wherein The further step of extracting the step segments of each rising edge and each falling edge includes: respectively taking the line segment corresponding to the continuous data points with a slope of 0 in each rising edge and falling edge as the step segment of the corresponding rising edge and falling edge.

4. A method for aging detection of a safety module circuit board according to claim 1, characterized in that, The method for obtaining the voltage waveform outliers during each detection process is as follows: Obtain the mean value of the morphological symmetry difference values on both sides of all extreme points during each detection process, and the mean value of the step jump coefficients of all rising edges and falling edges. Take the sum of the two mean values as the voltage waveform outliers during each detection process.

5. The aging detection method for a safety module circuit board according to claim 1, characterized in that, The method for obtaining the circuit board aging state outliers is as follows: Fit the comprehensive performance fluctuation coefficients obtained from all detection processes, and calculate the average value of the slope values at all points of the obtained fitting curve, denoted as the slope mean value. Take the product of the slope mean value and the mean value of the voltage waveform outliers during all detection processes as the circuit board aging state outliers.

6. A safety module circuit board aging detection system, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method for detecting the aging of a safety module circuit board according to any one of claims 1-5.

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