Graph generation method and device, storage medium and electronic equipment

Abstract

The invention relates to a graph generation method and device, a storage medium and electronic equipment, and relates to the technical field of semiconductor packaging, and the method comprises the steps: firstly, obtaining the positions of a bump and a wire in a region where a teardrop graph is to be generated in an integrated circuit layout; determining the vertex position of the to-be-generated teardrop pattern based on the positions of the bump and the lead and a preset angle corresponding to the to-be-generated teardrop pattern; and generating a teardrop pattern according to the vertex position. According to the technical scheme, the vertex position of the teardrop pattern is automatically calculated according to the positions of the bumps and the wires in the integrated circuit layout and the constraint of the preset angle, so that teardrop patterns of different sizes are conveniently and efficiently generated in the layout, the layout design efficiency is improved, and the layout design cost is reduced. Meanwhile, accurate control over teardrop graph parameters is achieved, the purposes of enhancing physical strength and improving electrical properties are achieved, and the requirements of complex application scenes can be met.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to a method and apparatus for generating a pattern, a storage medium, and an electronic device. Background Art

[0002] In the layout design of integrated circuits, a teardrop pattern can actually be regarded as a quadrilateral with special geometric properties in the layout, which is often used to create a transition area between the bumps of the pad and the paths, increase the connection strength between the paths and vias and pads, improve electrical parameters, and enable it to withstand greater mechanical stress.

[0003] Currently, traditional tools can usually be used to draw teardrop patterns on a specified metal layer of an integrated circuit. However, when using traditional tools to draw teardrop patterns, only teardrop patterns with a fixed length can often be drawn, and the drawing process is relatively cumbersome, resulting in limited use of teardrop patterns in complex application scenarios. Summary of the Invention

[0004] In view of this, this application provides a method and apparatus for generating a pattern, a storage medium, and an electronic device, mainly aiming to improve the technical problem that the size of the teardrop patterns generated in the current existing technology is single and the drawing process is relatively cumbersome, resulting in the inability to meet the requirements of application scenarios.

[0005] In a first aspect, this application provides a method for generating a pattern, including:

[0006] Obtain the positions of the bumps and paths in the area of the integrated circuit layout where the teardrop pattern is to be generated;

[0007] Based on the positions of the bumps and paths, and the preset angle corresponding to the teardrop pattern to be generated, determine the vertex positions of the teardrop pattern to be generated;

[0008] Generate a teardrop pattern according to the vertex positions.

[0009] Optionally, the determining the vertex positions of the teardrop pattern to be generated based on the positions of the bumps and paths, and the preset angle corresponding to the teardrop pattern to be generated includes:

[0010] Determine the center point of the bump as the first vertex of the teardrop pattern to be generated;

[0011] Based on the preset angle, select the second vertex and the third vertex from the multiple boundary points of the bump;

[0012] According to the positions of the second vertex and the third vertex, determine the position of the fourth vertex on the path;

[0013] Generating a teardrop pattern according to the vertex positions includes:

[0014] Generating the teardrop pattern according to the positions of the first vertex, the second vertex, the third vertex, and the fourth vertex.

[0015] Optionally, selecting the second vertex and the third vertex from multiple boundary points of the bump based on the preset angle includes:

[0016] Traversing each boundary point of the bump to determine a target teardrop pattern that meets the preset angle;

[0017] Determining two boundary points associated with the target teardrop pattern as the second vertex and the third vertex respectively.

[0018] Optionally, traversing each boundary point of the bump to determine a target teardrop pattern that meets the preset angle includes:

[0019] Based on the preset angle, using each boundary point of the bump as a vertex to traverse and obtain multiple pre-generated teardrop patterns;

[0020] Determining the teardrop pattern with the longest length among the pre-generated teardrop patterns as the target teardrop pattern.

[0021] Optionally, determining the position of the fourth vertex on the wire according to the positions of the second vertex and the third vertex includes:

[0022] Obtaining the perpendicular bisector of the second vertex and the third vertex;

[0023] Determining the position of the fifth vertex on the perpendicular bisector, where the angle formed by connecting the second vertex, the fifth vertex, and the third vertex in sequence is the preset angle;

[0024] Determining the fourth vertex based on the circumcircle of the triangle formed by the second vertex, the third vertex, and the fifth vertex, where the fourth vertex is the intersection of the center line of the wire and the circumcircle outside the bump.

[0025] Optionally, after generating the teardrop pattern according to the vertex positions, the method further includes:

[0026] Based on Design Rule Check (DRC), detecting whether the teardrop pattern meets the constraint conditions of the integrated circuit layout design;

[0027] If the constraint conditions are not met, canceling the generation of the teardrop pattern or adjusting the teardrop pattern.

[0028] Optionally, before obtaining the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated, the method further includes:

[0029] Obtaining various parameters input by the user, where the parameters are used to limit the shape of the teardrop pattern;

[0030] Judging the validity of the parameters according to the preset range of the parameters;

[0031] If the parameters are invalid, an error message is prompted.

[0032] In a second aspect, the present application provides a graphic generation device, including:

[0033] An obtaining module, configured to obtain the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated;

[0034] A determining module, configured to determine the vertex positions of the teardrop pattern to be generated based on the positions of the bumps and wires and the preset angle corresponding to the teardrop pattern to be generated;

[0035] A generating module, configured to generate a teardrop pattern according to the vertex positions.

[0036] In a third aspect, the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the method described in the first aspect is implemented.

[0037] In a fourth aspect, the present application provides an electronic device, including a storage medium, a processor, and a computer program stored on the storage medium and executable on the processor. When the processor executes the computer program, the method described in the first aspect is implemented.

[0038] By means of the above technical solutions, the present application provides a graphic generation method, device, storage medium and electronic device. Specifically, first, the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated are obtained; then, based on the positions of the bumps and wires and the preset angle corresponding to the teardrop pattern to be generated, the vertex positions of the teardrop pattern to be generated are determined; and then, a teardrop pattern is generated according to the vertex positions. Compared with the current existing technologies, by applying the technical solutions of the present application, according to the positions of bumps and wires in the integrated circuit layout, the vertex positions of the teardrop pattern are automatically calculated under the constraint of the preset angle, and then teardrop patterns of different sizes are conveniently and efficiently generated in the layout, improving the efficiency of layout design. At the same time, precise control of the parameters of the teardrop pattern is achieved, thereby achieving the purpose of enhancing physical strength and improving electrical properties, and being able to meet the requirements of complex application scenarios.

[0039] The above description is only an overview of the technical solution of the present application. In order to better understand the technical means of the present application, it can be implemented according to the content of the specification. In order to make the above and other purposes, features, and advantages of the present application more obvious and understandable, the specific embodiments of the present application are specifically exemplified below. Description of the Drawings

[0040] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1 It shows a schematic flowchart of a graphic generation method provided by an embodiment of the present application;

[0043] Figure 2 It shows a schematic flowchart of another graphic generation method provided by an embodiment of the present application;

[0044] Figure 3 It shows a schematic diagram of an application example provided by an embodiment of the present application;

[0045] Figure 4 It shows a schematic diagram of an application example provided by an embodiment of the present application;

[0046] Figure 5 It shows a schematic diagram of an application example provided by an embodiment of the present application;

[0047] Figure 6 It shows a schematic diagram of an application example provided by an embodiment of the present application;

[0048] Figure 7 It shows a schematic structural diagram of a graphic generation device provided by an embodiment of the present application. Detailed Embodiments

[0049] In order to better understand the above objects, features, and advantages of the present application, the following will further describe the solution of the present application. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0050] In order to solve the technical problem that the teardrop graphics generated in the current prior art have a single size and a relatively cumbersome drawing process, resulting in the inability to meet the requirements of the application scenario. This embodiment provides a graphic generation method, asFigure 1 As shown, the method includes:

[0051] Step 101, obtain the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated.

[0052] Exemplarily, before generating the teardrop pattern, it is first necessary to determine the area in the integrated circuit layout where the teardrop pattern needs to be generated, and then further find all the key points where the teardrop pattern needs to be added in this area, such as pads, vias, or other connection points that may need to be strengthened. Check the geometric shapes around each key point, including any adjacent bumps, wires, and their positions, shapes, sizes, and connection conditions, etc.

[0053] Step 102, based on the positions of the bumps and wires, and the preset angle corresponding to the teardrop pattern to be generated, determine the vertex positions of the teardrop pattern to be generated.

[0054] In some examples, a single teardrop pattern can be regarded as a quadrilateral created at the connection of a bump and a wire. One of the four points of the quadrilateral is fixed as the center point of the bump, the other two points are on the boundary of the bump, and the last point is on the center line of the wire connected to the bump. The four points of the quadrilateral can be regarded as the vertices of the teardrop pattern, and a teardrop pattern that meets the requirements can be generated according to these four vertices.

[0055] Exemplarily, the preset angle (angle) can represent the angle formed by the outer edge of the teardrop pattern and the wire connected to the pad or via. Using a fixed preset angle as the initial parameter for generating the teardrop pattern can ensure the angle consistency of all teardrop patterns, making the entire integrated circuit layout design more professional and unified. Selecting an appropriate preset angle according to actual production requirements can also optimize the electrical performance.

[0056] Step 103, generate a teardrop pattern according to the vertex positions.

[0057] For example, according to the selected vertex positions, calculate the path of the edge of the teardrop pattern to ensure that the pattern smoothly expands from the vertex to the maximum width and then gradually shrinks until it ends. Use the calculated path information to automatically generate a teardrop pattern at the specified vertex positions. Further, check whether the generated teardrop pattern meets the expectations and make fine-tuning as needed. For example, ensure that there are no unnecessary overlaps.

[0058] In this embodiment, first, the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated are obtained; then, based on the positions of the bumps and wires and the preset angle corresponding to the teardrop pattern to be generated, the vertex positions of the teardrop pattern to be generated are determined; and then, according to the vertex positions, the teardrop pattern is generated. Compared with the current existing technologies, in this embodiment, according to the positions of the bumps and wires in the integrated circuit layout, the vertex positions of the teardrop pattern are automatically calculated under the constraint of the preset angle, and then different-sized teardrop patterns are conveniently and efficiently generated in the layout, improving the efficiency of layout design. At the same time, precise control of the teardrop pattern parameters is achieved, thereby achieving the purpose of enhancing physical strength and improving electrical properties, and being able to meet the requirements of complex application scenarios.

[0059] Further, as a refinement and extension of the above embodiment, in order to fully illustrate the specific implementation process of the method in this embodiment, this embodiment provides the following specific method, which includes: Figure 2 as shown, the method includes:

[0060] Step 201: Obtain the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated.

[0061] Exemplarily, in the integrated circuit layout design interface, the layout of each component and wire can be clearly seen, including the positions of pads and vias. Usually, these components are displayed graphically on the screen and are accompanied by corresponding identifiers and coordinate information. By clicking or selecting specific bumps and wires, their precise position information, including X and Y coordinates, can be obtained in the software. The connection points between the wires and the bumps are usually the key positions for generating the teardrop pattern.

[0062] Optionally, the method in this embodiment may specifically include: obtaining various parameters input by the user, where the parameters are used to limit the shape of the teardrop pattern; judging the validity of the parameters according to the preset range of the parameters; if the parameters are invalid, an error message is prompted.

[0063] In some examples, the parameters are used to limit the size, width, and length of the teardrop pattern, as well as the smoothness of the transition with the original trace. These parameters may include, but are not limited to, the angle of the teardrop pattern, the maximum width of the teardrop, the distance from the vertex to the widest point, etc.

[0064] For example, the parameters input by the user can be compared with the preset range. The preset range of the parameters can be a numerical range, a string format, an enumerated value, etc. If the parameters are within the preset range, the parameters are considered valid; otherwise, the parameters are considered invalid. When the parameters are invalid, an error message is generated and fed back to the user for reminder.

[0065] Step 202: Determine the center point of the bump as the first vertex of the teardrop pattern to be generated.

[0066] For example, asFigure 3 As shown, the bump can be represented by a figure formed by boundary points A1, B1, c, D1, E1, b, G1, and H1 in the integrated circuit layout. The center point of the bump can be determined by physical measurement or methods based on bump boundary parameters, etc., and the center point of the bump is determined as the first vertex of the teardrop figure.

[0067] Step 203: Based on a preset angle, select a second vertex and a third vertex from multiple boundary points of the bump.

[0068] For example, first extract all boundary points of the bump from the integrated circuit layout and arrange all boundary points in a certain order (such as clockwise or counterclockwise) so as to correctly calculate the relationship between adjacent points. Variables can also be initialized to record the current optimal two boundary points, and if better boundary points are found, the data of the optimal boundary points are updated. After the traversal ends, the optimal two boundary points are selected as the second vertex and the third vertex of the teardrop figure.

[0069] Optionally, step 203 may specifically include: by traversing each boundary point of the bump, determine a target teardrop figure that meets the preset angle; determine the two boundary points associated with the target teardrop figure as the second vertex and the third vertex respectively.

[0070] Exemplarily, based on a selected fixed preset angle (such as 45°, 60°, etc.), generate a target teardrop figure, and the two intersection points of the target teardrop figure and the boundary of the bump figure are the second vertex and the third vertex. Using a constant angle to generate the teardrop figure can ensure the consistency and predictability of all teardrops, and simplifies the design and manufacturing process.

[0071] In some examples, for each boundary point Pi, the direction vector Vi from P1 to Pi can be calculated, and the direction vector Vi is adjusted using the preset angle to ensure that the teardrop figure is generated at the specified angle. Find another point Pj among the remaining boundary points such that the line connecting Pi and Pj is as close as possible to the adjusted direction vector Vi′, and use the dot product or the method of minimizing the angle difference to measure the similarity. If the length of the teardrop figure formed by Pi and Pj as vertices is greater than the currently recorded maximum value, update the maximum value and the corresponding two boundary points Pi and Pj. After traversing all boundary points, the finally obtained two boundary points are the second vertex and the third vertex. These two points are the boundary intersection points associated with the target teardrop figure.

[0072] Optionally, the above-mentioned determination of the target teardrop figure that meets the preset angle by traversing each boundary point of the bump may specifically include: based on the preset angle, respectively use each boundary point of the bump as a vertex to traverse and obtain multiple pre-generated teardrop figures; determine the teardrop figure with the longest length among the pre-generated teardrop figures as the target teardrop figure.

[0073] In the method of this embodiment, each point on the bump boundary is traversed to create a teardrop pattern at a fixed angle, and the pattern with the longest length is selected as the final result. On the premise that the angle for generating the teardrop pattern is constant, the length of the teardrop pattern also has a great influence on the electrical performance. A longer teardrop pattern makes the connection area between the pad or via and the trace larger, thus significantly enhancing the mechanical strength, better dispersing the stress applied to the connection point, reducing the possibility of local stress concentration, and helping to prevent fractures caused by thermal stress or other mechanical stresses.

[0074] Step 204: Determine the position of the fourth vertex on the wire according to the positions of the second vertex and the third vertex.

[0075] Optionally, step 204 may specifically include: obtaining the perpendicular bisector of the second vertex and the third vertex; determining the position of the fifth vertex on the perpendicular bisector, where the angle formed by connecting the second vertex, the fifth vertex, and the third vertex in sequence is a preset angle; determining the fourth vertex based on the circumcircle of the triangle formed by the second vertex, the third vertex, and the fifth vertex, and the fourth vertex is the intersection of the center line of the wire and the circumcircle outside the bump.

[0076] For example, as Figure 3 shown, assume that the second vertex b and the third vertex c have been determined on the bump. First, determine the midpoint R of the line segment bc, and then obtain the perpendicular bisector RT of the second vertex b and the third vertex c. Find the point e on the perpendicular bisector RT that can satisfy the angle of ∠bec being the preset angle (β = 50.12°), and determine the point e as the fifth vertex e. Then, according to the three vertices b, c, and e, the circumcircle of the triangle bce can be obtained. According to the property of "the top angles of two triangles with the same base on the same side in a cyclic quadrilateral are equal", determine the intersection of the circumcircle and the center line UV of the wire as the fourth vertex d.

[0077] Step 205: Generate a teardrop pattern according to the positions of the first vertex, the second vertex, the third vertex, and the fourth vertex.

[0078] Exemplarily, the first vertex, the second vertex, the third vertex, and the fourth vertex are used to define the shape of the teardrop pattern. Connect the first vertex, the second vertex, the fourth vertex, the third vertex, and the first vertex in sequence as determined in the above steps, and the obtained pattern is the teardrop pattern that meets the preset angle. In addition, the smoothness or other characteristics of the teardrop can be further optimized according to actual needs.

[0079] For example, the positions of a group of bumps and wires in an integrated circuit layout are as Figure 4 shown. As a feasible way, generate a teardrop with an angle constraint of 60°, and the automatically generated teardrop pattern that meets the conditions is as Figure 5As shown, the tail angle of the teardrop shape is a preset angle of 60°.

[0080] Optionally, the method of this embodiment may further specifically include: based on DRC, detecting whether the teardrop shape meets the constraint conditions of the integrated circuit layout design; if it does not meet the constraint conditions, canceling the generation of the teardrop shape or adjusting the teardrop shape.

[0081] Exemplarily, to ensure that the teardrop shape follows the constraint conditions such as the minimum spacing and minimum width set by DRC, it must be carried out strictly according to specific design rules. Check whether the generated teardrop shape conflicts with other structures or violates any design rules. If there are conflicts, it may be necessary to adjust the size, shape or position of the teardrop shape, or even reconsider the preset angle. At the same time, considering the limitations of the actual production process, overly complex or difficult-to-implement graphic designs should be avoided.

[0082] For example, after creating the teardrop-shaped graphic, immediately perform DRC to detect whether the teardrop shape meets the constraint conditions. If the teardrop shape fails to meet the established constraint conditions, such as distance constraints, then choose not to generate the teardrop; or, after the teardrop shape is generated, identify and detect the graphic area covered by it, and then make necessary avoidance adjustments according to the distance requirements specified by DRC.

[0083] Exemplarily, considering the possible influence of the surrounding structures, the shape, size and position of the teardrop shape can be appropriately adjusted, which not only enhances the physical connection strength but also avoids unnecessary interference to other circuit elements. After these adjustments are completed, use an automated DRC tool to recheck the updated layout to ensure that there are no new violations.

[0084] By applying the method of this embodiment, as Figure 6 shown, first collect various parameters input by the user on the interface and judge whether the parameters are valid. If they are invalid, corresponding error messages will be prompted. Then obtain all the bumps and wires within the area to be generated, as well as obtain the eligible graphics within the area to be generated. After determining the number and position of the teardrop shapes to be generated, generate the teardrop shapes according to the constraints, and finally judge whether the generated teardrop shapes can pass the DRC check.

[0085] Compared with the current existing technologies, according to the positions of the bumps and wires in the integrated circuit layout in this embodiment, the vertex positions of the teardrop shapes are adaptively calculated according to the constraints of the preset angle. Only by selecting the area for generating the teardrop shapes, different-sized teardrop shapes can be conveniently and efficiently generated in the layout, improving the efficiency of the layout design. At the same time, precise control of the parameters of the teardrop shapes is achieved, ensuring that the generated teardrop shapes can pass the DRC check, thereby achieving the purpose of enhancing the physical strength and improving the electrical properties, and meeting the requirements of complex application scenarios.

[0086] Further, as a Figure 1 specific implementation of the method shown, this embodiment provides a graphic generation device, as Figure 7 shown, the device includes: an acquisition module 31, a determination module 32, and a generation module 33.

[0087] The acquisition module 31 is configured to acquire the positions of bumps and wires in the area of the integrated circuit layout where the teardrop pattern is to be generated;

[0088] The determination module 32 is configured to determine the vertex positions of the teardrop pattern to be generated based on the positions of the bumps and wires and a preset angle corresponding to the teardrop pattern to be generated;

[0089] The generation module 33 is configured to generate a teardrop pattern according to the vertex positions.

[0090] In some examples, the determination module 32 is specifically configured to determine the center point of the bump as the first vertex of the teardrop pattern to be generated; select a second vertex and a third vertex from multiple boundary points of the bump based on the preset angle; determine the position of a fourth vertex on the wire according to the positions of the second vertex and the third vertex; correspondingly, the generation module 33 is specifically configured to generate the teardrop pattern according to the positions of the first vertex, the second vertex, the third vertex, and the fourth vertex.

[0091] In some examples, the determination module 32 is further specifically configured to traverse each boundary point of the bump to determine a target teardrop pattern that meets the preset angle; and determine the second vertex and the third vertex as two boundary points associated with the target teardrop pattern respectively.

[0092] In some examples, the determination module 32 is further specifically configured to traverse based on the preset angle with each boundary point of the bump as a vertex to obtain multiple pre-generated teardrop patterns; and determine the teardrop pattern with the longest length among the pre-generated teardrop patterns as the target teardrop pattern.

[0093] In some examples, the determination module 32 is further specifically configured to obtain the perpendicular bisector of the second vertex and the third vertex; determine the position of a fifth vertex on the perpendicular bisector, where the angle formed by connecting the second vertex, the fifth vertex, and the third vertex in sequence is the preset angle; and determine the fourth vertex based on the circumcircle of the triangle formed by the second vertex, the third vertex, and the fifth vertex, and the fourth vertex is the intersection of the center line of the wire and the circumcircle outside the bump.

[0094] In some examples, the generating module 33 is further specifically configured to detect, based on DRC, whether the teardrop pattern meets the constraints of the integrated circuit layout design; if the constraints are not met, generating the teardrop pattern is cancelled or the teardrop pattern is adjusted.

[0095] In some examples, the obtaining module 31 is further specifically configured to obtain various parameters input by a user, where the parameters are used to limit the shape of the teardrop pattern; determine the validity of the parameters according to a preset range of the parameters; if the parameters are invalid, an error message is prompted.

[0096] Based on the methods as described above such as Figure 1 and Figure 2 shown, correspondingly, this embodiment further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the methods as described above such as Figure 1 and Figure 2 shown are implemented.

[0097] Based on such an understanding, the technical solution of the present application can be embodied in the form of a software product, and the software product can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.), and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of various implementation scenarios of the present application.

[0098] Based on the methods as described above such as Figure 1 and Figure 2 shown, and Figure 7 shown virtual device embodiments, to achieve the above object, an electronic device is further provided in an embodiment of the present application, which may include a storage medium and a processor; the storage medium is used to store a computer program; the processor is used to execute the computer program to implement the methods as described above such as Figure 1 and Figure 2 shown.

[0099] Optionally, the above-mentioned physical device may further include a user interface, a network interface, a camera, a radio frequency (RF) circuit, sensors, an audio circuit, a WI-FI module, and so on. The user interface may include a display screen (Display), an input unit such as a keyboard (Keyboard), etc., and optionally the user interface may further include a USB interface, a card reader interface, etc. The network interface may optionally include a standard wired interface, a wireless interface (such as a WI-FI interface), etc.

[0100] Those skilled in the art can understand that the above-mentioned physical device structure provided in this embodiment does not constitute a limitation on the physical device, and may include more or fewer components, or combine some components, or have different component arrangements.

[0101] The storage medium may further include an operating system and a network communication module. The operating system is a program for managing the hardware and software resources of the above-mentioned physical devices, and supports the operation of information processing programs and other software and / or programs. The network communication module is used to implement communication between components inside the storage medium, as well as communication with other hardware and software in the information processing physical device.

[0102] Through the description of the above embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform, or can also be implemented by hardware. By applying the solution of this embodiment, according to the positions of bumps and wires in the integrated circuit layout, the vertex positions of the teardrop patterns are adaptively calculated according to the constraints of the preset angles. Only by selecting the area for generating the teardrop patterns, different-sized teardrop patterns can be conveniently and efficiently generated in the layout, improving the efficiency of layout design. At the same time, precise control of the teardrop pattern parameters is achieved, ensuring that the generated teardrop patterns can pass DRC checks, thereby achieving the purpose of enhancing physical strength and improving electrical properties, and meeting the requirements of complex application scenarios.

[0103] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article, or device comprising the element.

[0104] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments herein, but will conform to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for generating a graph, characterized in that: include: Obtaining the positions of bumps and wires in the region of the integrated circuit layout where the teardrop pattern is to be generated; Determining the vertex position of the teardrop pattern to be generated based on the positions of the bump and the wire, and the preset angle corresponding to the teardrop pattern to be generated; A teardrop graphic is generated according to the vertex position.

2. The method according to claim 1, characterized in that The step of determining the vertex position of the teardrop pattern to be generated based on the positions of the bump and the wire and the preset angle corresponding to the teardrop pattern to be generated comprises: Determine the center point of the convex block as the first vertex of the teardrop pattern to be generated; Based on the preset angle, selecting a second vertex and a third vertex from a plurality of boundary points of the bump; Determine the position of the fourth vertex on the wire according to the positions of the second vertex and the third vertex; Generating a teardrop graphic according to the vertex position includes: The teardrop graphic is generated according to positions of the first vertex, the second vertex, the third vertex, and the fourth vertex.

3. The method according to claim 2, characterized in that The selecting a second vertex and a third vertex from a plurality of boundary points of the bump based on the preset angle comprises: By traversing each boundary point of the convex block, a target teardrop pattern satisfying the preset angle is determined; Two boundary points associated with the target teardrop graphic are respectively determined as the second vertex and the third vertex.

4. The method according to claim 3, characterized in that The step of traversing each boundary point of the convex block to determine a target teardrop pattern that satisfies the preset angle includes: Based on the preset angle, taking each boundary point of the convex block as a vertex, traversing to obtain a plurality of pre-generated teardrop graphics; The teardrop pattern with the longest length among the pre-generated teardrop patterns is determined as the target teardrop pattern.

5. The method according to claim 2, characterized in that: The step of determining the position of the fourth vertex on the wire according to the positions of the second vertex and the third vertex includes: Obtaining a perpendicular bisector between the second vertex and the third vertex; Determine the position of the fifth vertex on the perpendicular bisector, wherein the angle formed by sequentially connecting the second vertex, the fifth vertex and the third vertex is a preset angle; The fourth vertex is determined based on the circumscribed circle of a triangle formed by the second vertex, the third vertex, and the fifth vertex, and the fourth vertex is an intersection point of a center line of the wire and the circumscribed circle outside the bump.

6. The method according to claim 1, characterized in that After generating the teardrop graphic according to the vertex position, the method further includes: Based on the design rule check DRC, detecting whether the teardrop pattern meets the constraints of the integrated circuit layout design; If the constraint condition is not met, the generation of the teardrop graphic is canceled or the teardrop graphic is adjusted.

7. The method according to claim 1, characterized in that Before obtaining the positions of bumps and wires in the region where the teardrop pattern is to be generated in the integrated circuit layout, the method further includes: Acquire various parameters input by a user, where the parameters are used to limit the shape of the teardrop graphic; Determining the validity of the parameter according to a preset range of the parameter; If the parameters are invalid, an error message will be displayed.

8. A graphics generating device, characterized in that: include: An acquisition module configured to acquire positions of bumps and wires in a region of the integrated circuit layout where a teardrop pattern is to be generated; A determination module, configured to determine the vertex position of the teardrop pattern to be generated based on the positions of the bump and the wire, and the preset angle corresponding to the teardrop pattern to be generated; The generating module is configured to generate a teardrop graphic according to the vertex position.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

10. An electronic device comprising a storage medium, a processor, and a computer program stored in the storage medium and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 7 is implemented.

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