A high-performance manganese zinc SMD chip inductor and its manufacturing process

CN120126894BActive Publication Date: 2026-05-26SHENZHEN HONGFUBANG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN HONGFUBANG TECH CO LTD
Filing Date
2025-02-13
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing manganese zinc SMD chip inductors are difficult to replace when damaged, resulting in wasted resources and increased operating costs. They are also difficult to solder, have low soldering efficiency, and are inconvenient to disassemble, increasing the risk of burns.

Method used

The design incorporates an electrode plate, a magnetic core post, a power connection assembly, and auxiliary components. The power connection assembly enables quick disassembly and replacement, the auxiliary components improve welding efficiency, and the stabilizing bumps and power connection heads enhance stability and adaptability.

Benefits of technology

It enables quick disassembly and replacement of inductors, reduces the risk of burns, improves welding efficiency and practicality, reduces resource waste, and lowers usage costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a high-performance manganese-zinc SMD surface mount inductor and its manufacturing process, relating to the field of SMD surface mount inductor technology. It includes an electrode plate, with a magnetic core column fixedly connected to the center of the upper surface of the electrode plate. A printed circuit board is fixedly connected to the upper end of the magnetic core column. Two embedded holes are formed on the upper surfaces of both ends of the electrode plate. Multiple stabilizing protrusions are provided on the inner walls of both sides of each embedded hole. A coil is wound around the outside of the magnetic core column. Through a specially designed interconnecting component, squeezing the two finger plates first causes two positioning blocks to move in opposite directions. When the two positioning blocks are fully disengaged from the inner cavity of the slot, pulling the printed circuit board upwards quickly separates the electrode plate from the solder plate, thus rapidly disassembling the surface mount inductor. This disassembly method effectively reduces the risk of burns to workers and significantly improves the safety of using surface mount inductors.
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