Electrical connector with high-speed mounting interface

Abstract

The invention provides an electrical connector with a high-speed mounting interface. An electrical interconnect for communicating high speed signals through an electronic system having high signal density and high signal integrity includes an electrical connector and a transition of a printed circuit board to which the electrical connector is mounted. Edge-to-pad mounting is used to connect signal conductors to pads on a surface of the PCB. The pad is aligned with the intermediate portion of the signal conductor such that transitions within the electrical connector that may degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupling pairs extending in rows within the electrical connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. A ground plane beneath the surface trace facilitates a transition from a signal path in the electrical connector to a signal path in the PCB, where the low mode transition avoids resonances in the connector shield.

Description

[0001] This patent application is a divisional application of a patent application with an international application date of January 27, 2021, an international application number of PCT / US2021 / 015221, an application number of 202180023029.X after entering the Chinese national phase, and an invention name of "Electrical connector with a high-speed mounting interface". Technical Field

[0002] The present patent application relates generally to interconnection systems for interconnecting electronic components, such as interconnection systems including electrical connectors. Background Art

[0003] Electrical connectors are used in many electronic systems. It is often easier and more cost-effective to manufacture the system as a separate electronic component such as a printed circuit board ("PCB") that can be engaged with the electrical connector. A known arrangement for engaging some printed circuit boards is to have one printed circuit board used as a backplane. Other printed circuit boards, known as "daughter boards" or "daughter cards," can be connected through the backplane.

[0004] A known backplane is a printed circuit board on which a number of connectors may be mounted. Conductive traces in the backplane may be electrically connected to signal conductors in the connectors so that signals may be routed between the connectors. Daughter cards may also have connectors mounted thereon. The connectors mounted on the daughter cards may be plugged into connectors mounted on the backplane. In this way, signals may be routed between daughter cards through the backplane. The daughter cards may be plugged into the backplane at right angles. Therefore, connectors for these applications may include right angle bends and are commonly referred to as "right angle connectors."

[0005] Connectors may also be used in other configurations for interconnecting printed circuit boards. Some systems use a midplane configuration. Similar to a backplane, a midplane has connectors mounted on one surface that are interconnected by routing channels within the midplane. The midplane additionally has connectors mounted on a second side so that daughter cards are plugged into both sides of the midplane.

[0006] Daughter cards inserted from opposite sides of the midplane typically have an orthogonal orientation. This orientation positions one edge of each printed circuit board adjacent to the edge of each board inserted into the opposite side of the midplane. Traces within the midplane connecting a board on one side of the midplane to a board on the other side of the midplane can be short to achieve ideal signal integrity characteristics.

[0007] A variation of the midplane configuration is called "direct attach." In this configuration, daughter cards are inserted from opposite sides of the system. The boards are also oriented orthogonally so that the edge of a board inserted from one side of the system is adjacent to the edge of a board inserted from the opposite side of the system. These daughter cards also have connectors. However, instead of plugging into a connector on the midplane, the connector on each daughter card plugs directly into a connector on a printed circuit board that is inserted from the opposite side of the system.

[0008] Connectors of this configuration are sometimes referred to as orthogonal connectors. Examples of orthogonal connectors are shown in U.S. Patents 7,354,274, 7,331,830, 8,678,860, 8,057,267, and 8,251,745. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a perspective view of a mating direct attach orthogonal connector according to some embodiments;

[0010] Figure 2A yes Figure 1 A perspective view of the electrical connector 102a;

[0011] Figure 2B yes Figure 1 A perspective view of the electrical connector 102b;

[0012] Figure 3A yes Figure 1 A front view of an alternative embodiment of the electrical connector 102a;

[0013] Figure 3B yes Figure 1 A front view of an alternative embodiment of an electrical connector 102b configured to be used with Figure 3A Connector mating;

[0014] Figure 3C yes Figure 3A A bottom view of the electrical connector 302a;

[0015] Figure 3D Yes Figure 3C An enlarged view of the mounting interface of the electrical connector 302a is shown;

[0016] Figure 3E yes Figure 1 A front view of another alternative embodiment of the electrical connector 102a;

[0017] Figure 3F yes Figure 1 A front view of another alternative embodiment of the electrical connector 102b;

[0018] Figure 4A yes Figure 1 A partial exploded view of the electrical connector 102a;

[0019] Figure 4B yes Figure 1 A partial exploded view of the electrical connector 102b;

[0020] Figure 5 is a partially exploded view of an electrical connector with a front housing removed and having a compliant shield member according to some embodiments;

[0021] Fig. 6A yes Figure 5 A perspective view of the sheet 130 of the electrical connector 102 is shown;

[0022] Figure 6B is a sheet housing member 133b from which the sheet housing member 133b is cut away Figure 5 A plan view of a sheet 130;

[0023] Fig. 7A yes Figure 6B A perspective view of a connector module 200;

[0024] Figure 7B is a structure in which the outer insulating members 180a and 180b and the inner insulating member 230 are removed Figure 6B A perspective view of a connector module 200;

[0025] Fig. 8A The electromagnetic shielding member 210 is cut away. Figure 6B A perspective view of a connector module 200;

[0026] Figure 8B yes Fig. 8A A side view of the connector module 200;

[0027] Fig. 9A is a structure in which the electromagnetic shielding member 210 and the outer insulating members 180a and 180b are cut away Figure 6B A perspective view of a connector module 200;

[0028] Fig. 9B yes Fig. 9A A side view of the connector module 200;

[0029] Fig. 10A yes FIG. 9A to FIG. 9B A perspective view of the signal conductors 260a and 260b of the connector module 200;

[0030] Fig. 10B Yes Fig. 10A An enlarged view of the compliant portion 266 of the signal conductors 260a and 260b is shown;

[0031] Fig. 10C yes Fig. 10AA front view of signal conductors 260a and 260b;

[0032] Fig.11A is a side perspective view of a portion of a substrate configured to receive a portion of an electrical connector according to some embodiments;

[0033] Fig. 11B yes Fig.11A A top perspective view of a top conductive layer and a lower ground layer of a substrate 1100;

[0034] Fig. 11C yes Fig. 11B A top view of the layers of substrate 1100 is shown;

[0035] Fig. 12A is a top view of a conductive layer 1202 of a substrate 1200 having a connector footprint according to some embodiments;

[0036] Fig. 12B yes Fig. 12A A top view of an inner layer 1204 of a substrate 1200;

[0037] Fig. 12C is a top view of the signal wiring conductive layer 1220 of the substrate 1200 of FIG. 12 ;

[0038] Fig.12D yes Fig. 12A A cross-sectional view of a portion of a substrate 1200;

[0039] Fig.13A Yes Fig.11A An exploded view of an electronic assembly 1300 including a substrate 1100 and a pair of contact tails of an electrical connector;

[0040] Fig. 13B yes Fig.13A A perspective view of an electronic assembly 1300;

[0041] Fig.14A yes Fig.13A A partial exploded view of an electronic assembly 1300, also showing a shielding member of the electrical connector;

[0042] Fig. 14B yes Fig.14A An exploded view of an electronic assembly 1300;

[0043] Fig. 14C One of the contact tails 1312 and half of the shield member 1320 is cut off. Fig.14A A perspective view of an electronic assembly 1300;

[0044] Fig.14DA configuration in which half of each contact tail 1312 and a portion of the shield member 1320 are cut away Fig.14A A perspective view of electronic assembly 1300 is shown.

[0045] Fig.15 is a perspective view of the head connector;

[0046] Fig.16 is a perspective view of alternative configurations of connectors in which some connector modules are configured for attachment to a printed circuit board and other connector modules are terminated to cables;

[0047] Fig.17A is a side view of a portion of an alternative connector module 1700 that may be included in an electrical connector according to some embodiments;

[0048] Fig. 17B yes Fig.17A A front view of a portion of the connector module 1700;

[0049] Fig.18 is a structure in which the electromagnetic shielding member 1710a is cut away Fig.17A A side view of a portion of the connector module 1700;

[0050] Fig.19A The electromagnetic shielding member 1710a and the outer insulating member 1780a are cut away. Fig.17A A side view of a portion of the connector module 1700;

[0051] Fig.19B Yes Fig.19A A perspective view of a portion of connector module 1700 is shown;

[0052] Fig. 20 is a perspective view of a portion of the connector module 1700 of FIG. 17 with the electromagnetic shield member 1710 a , the outer insulating member 1780 a , and the signal conductor 1760 a cut away;

[0053] Fig.21A is a perspective view of a portion of a signal conductor 1760a of the connector module 1700;

[0054] Fig.21B is a side view of the compliant portion 1766a of the signal conductor 1760a;

[0055] Fig. 22 is a top view of a first conductive layer 2202 of an alternative substrate 2200 configured to receive a portion of an electrical connector according to some embodiments;

[0056] Fig.23 Yes Fig. 22Top view of a portion of a substrate 2200 having a first conductive layer 2202 . DETAILED DESCRIPTION

[0057] The inventors have developed techniques for manufacturing electrical connectors and electronic assemblies capable of supporting high-speed signals and having high density (including at 112Gb / s and higher). These techniques include the design of a mounting interface for the connector that enables operation at high frequencies without resonance or other degradation of signal integrity. The mounting interface can be used in a connector having a separate shielding module with a pair of signal conductors, thereby providing low crosstalk and good impedance control. In some embodiments, the connector footprint of a printed circuit board can be integrated with the connector mounting interface to provide a compact footprint and efficient wiring channels with low mode conversion, which the inventors have recognized and understood can limit the operating range of the interconnect system.

[0058] In some embodiments, the signal conductor of the connector can be connected at its distal edge to a pad on the surface of a substrate, an example of which is a printed circuit board (PCB). In some embodiments, the signal conductor can be pressure mounted to the PCB. The signal conductor can have a compliant portion extending perpendicular to the surface of the printed circuit board so that when the connector is pressed against the PCB, the signal conductor compresses, wherein the compliant portion generates a spring force that presses the edge of the signal conductor against the pad.

[0059] The signal conductors can be shaped to reliably form an edge-to-pad pressure-mount connection. In some embodiments, for example, the distal ends of the signal conductors can be sharpened or otherwise formed with a tip that can penetrate an oxide layer or other contaminants on the pad. Alternatively or additionally, the signal conductors can be configured to twist when they are compressed. Twisting can further aid in penetrating oxides or other contaminants on the pad.

[0060] In some embodiments, edge-to-pad connections may be made using surface mount soldering techniques.

[0061] In some embodiments, the signal conductors of the connector can be configured to carry differential signals. Pairs of signal conductors can pass through the connector, wherein the middle portion of the signal conductors is arranged for broadside coupling. Broadside coupling in a right-angle connector can provide a low-skew interconnect when a pair of signal conductors are aligned in a row direction parallel to an edge of a PCB where the connector is mounted.

[0062] Since variations in geometry along a signal path may result in impedance changes, mode conversions, or other artifacts that degrade signal integrity, high signal integrity can be achieved by aligning the mounting ends of the signal conductors with the middle portions of the signal conductors adjacent to the mounting interface. Edge-to-pad mounting to pads of a PCB - the pads are similarly aligned with those middle portions of the signal conductors - avoids variations in geometry along the signal path and similarly promotes signal integrity.

[0063] Although the pads of the connector footprint on the PCB are positioned to align with the signal conductors within the connector, the signal vias connecting the pads to the traces within the PCB can be positioned so that the traces can be efficiently routed out of the connector footprint. The inventors have recognized and appreciated techniques for providing good signal integrity (even at high frequencies) and efficient routing, which facilitates cost-effective design of electronic systems using the connector. Appropriate transition regions within the PCB can enable pads positioned to align with the signal conductors of the connector to connect with vias positioned for efficient routing of signal traces in the PCB while providing good signal integrity.

[0064] The transition region can include paired pads aligned in a first line and paired through holes aligned in a second line. The first line can be transverse to the second line. In some embodiments, the first line and the second line can be orthogonal, supporting broadside coupling within the connector and vertical routing channels within the PCB. The pads and through holes can be connected to the surface traces. The conductive layer below the PCB can be connected to ground, which can provide a ground plane below the surface traces. The ground plane in this position can provide low mode conversion and other desired signal integrity characteristics during the transition.

[0065] As a result, even if the signal conductors in corresponding pairs within the connector are aligned in the row direction, the paired signal vias can be aligned in the column direction, thereby supporting the vertical routing of signal traces out of the connector footprint. In addition, since the signal vias do not accept press-fits, they can be small, such as less than 12 mils in diameter. Small diameter vias enable wide routing channels, which enables more traces per layer to be routed out of the connector footprint and reduces the number of layers required to route all signals out of the connector footprint. Such a design provides both efficient trace routing and high signal integrity.

[0066] These techniques can be used alone or in any suitable combination. Due to the improved electrical characteristics achieved by these techniques, the electrical connectors and electronic components described herein can be configured to operate at high bandwidths to obtain high data transfer rates. For example, the electrical connectors and electronic components described herein can operate at 40 GHz or above and can have a bandwidth of at least 50 GHz, such as up to and including a frequency of 56 GHz and / or a bandwidth in the range of 50 GHz to 60 GHz. For example, such electrical connectors and electronic components can transfer data at a rate of up to 112 Gb / s.

[0067] Go to the attached picture, Figure 1 and FIG. 2A to FIG. 2B An electrical connector of an electrical interconnect system according to some embodiments is shown. Figure 1 is a perspective view of an electrical interconnect system 100 including a first mating connector and a second mating connector, which are here configured to directly attach an orthogonal connector 102a and a right angle connector 102b. Figure 2A is a perspective view of the electrical connector 102a, Figure 2B 1 is a perspective view of electrical connector 102b, which shows the mating interface and mounting interface of those connectors. In the illustrated embodiment, the mating interfaces are complementary so that connector 102a mates with connector 102b. In the illustrated embodiment, the mounting interfaces are similar because each mounting interface includes an array of press-fit contact tails configured for mounting to a printed circuit board. In an alternative embodiment, some or all of the contact tails of connectors 102a and 102b can be configured for edge-to-pad mounting, such as by pressure mounting to a conductive pad on a substrate surface. Alternatively or additionally, some or all of the contact tails can be configured for soldering to a conductive pad on a substrate using a butt joint. These optional tail configurations can be used for one or both signal conductors in the connector, and the contact tails of the connector shield can be press-fit parts.

[0068] In the example shown, each of the connectors is a right angle connector, and each connector can have broadside coupled signal conductor pairs, where the conductors of the signal conductor pairs are aligned in the row direction for low intra-pair skew. Each pair can be partially or fully surrounded by a shield. Similar techniques and materials can be used to manufacture the electrical connectors 102a and 102b. For example, the electrical connectors 102a and 102b can include substantially the same sheet 130 ( Figure 4A , Figure 5 , FIG. 6A to FIG. 6B ). The electrical connectors 102a and 102b having the wafer 130 that can be manufactured and / or assembled in the same process can have a low manufacturing cost.

[0069] exist Figure 1In the embodiment shown in FIG. 1 , the first connector 102a includes a first sheet 130a, which includes one or more individual sheets 130 positioned side by side. The sheet 130 includes one or more connector modules 200, each of which may include a pair of signal conductors and a shield for the pair. The connector modules are further described herein, including reference Fig. 10B Description of the connector module.

[0070] The wafer 130 also includes a wafer housing 132a that holds the connector module 200. The wafers are held together side by side so that the contact tails extending from the wafer 130 of the first connector 102a form a first contact tail array 136a. The contact tails of the first contact tail array 136a can be configured for mounting to a substrate, such as those described herein (including with reference to FIG. 11A to FIG. 11C and FIG. 12A to FIG. 12D 1) substrate 1100 or 1200 as described above. In some embodiments, the contact tail array 136 can be configured to compress in the direction in which the electrical connector 102a is pressed to be mounted to the substrate. The first contact tail array 136a can include contact tails configured for press-fit insertion. Alternatively or in addition, some or all of the contact tails can be configured for pressure mounting or surface mount soldering. In other embodiments, some or all of the contact tails can have other mounting configurations for mounting to a conductor within a printed circuit board or cable.

[0071] In the illustrated embodiment, further described herein - including with reference to Figure 2A Described is a first connector 102a including an extender housing 120 with an extender module 300 within the extender housing 120. In the illustrated embodiment, the first connector 102a includes a signal conductor having a contact tail that forms part of a first contact tail array 136a. The signal conductor has an intermediate portion that engages the contact tail to a mating end. In the illustrated embodiment, the mating end is configured to mate with another signal conductor in the extender module 300. In some embodiments, there may be a separable interface to the extender module 300. In other embodiments, the interface may be configured for a single mating without the need for unmating and re-mating. The signal conductor in the extender module 300 also has a mating end that forms a Figure 2A The mating interface of connector 102a is visible in FIG. The ground conductor similarly extends from sheet 130a, through extender module 300, to Figure 2A The mating interface of connector 102a is visible in FIG.

[0072] The second connector 102b includes a second sheet 130b, which includes one or more sheets 130 positioned side by side. The sheets 130 of the second sheet 130b can be configured as described for the first sheet 130a. For example, the sheets 130 of the second sheet 130b have a sheet housing 132b. In addition, the second contact tail array 136b of the second connector 102b is formed by the contact tails of the conductive elements in the second sheet 130b. As with the first contact tail array 136a, some or all of the contact tails of the second contact tail array 136b can be configured to be compressed in the direction in which the electrical connector 102b is pressed to be mounted to the substrate. Alternatively or in addition, some or all of the contact tails of the contact tail array 136b can be configured for press-fit insertion, compression mounting, solder mounting or any other mounting configuration for mounting to a conductor in a printed circuit board or cable.

[0073] like Figure 1 As shown in , the first contact tail array 136a faces a first direction, and the second contact tail array 136b faces a second direction perpendicular to the first direction. Therefore, when the first contact tail array 136a is mounted to a first substrate (e.g., a printed circuit board) and the second contact tail array 136b is mounted to a second substrate, the surface of the first substrate and the surface of the second substrate can be perpendicular to each other. In addition, the first connector 102a and the second connector 102b are mated along a third direction perpendicular to each of the first direction and the second direction. During the process of mating the first connector 102a with the second connector 102b, one or both of the first connector 102a and the second connector 102b move toward the other connector along the third direction.

[0074] It should be understood that although Figure 1 102a and 102b are shown in a directly attached orthogonal configuration, but the connectors described herein may be suitable for other configurations. For example, FIG. 3E to FIG. 3F The connector shown in has a mating interface that is angled in relative directions and can be used in a coplanar configuration. Fig.15 It is shown that the construction techniques as described herein can be used in a backplane, midplane or mezzanine configuration. However, it is not required to use the mating interface in a board-to-board configuration. Fig.16 It is shown that some or all of the signal conductors within the connector can be terminated to a cable, thereby creating a cable connector or a hybrid cable connector. Other configurations are also possible.

[0075] like Figure 2AAs shown in , the first electrical connector 102a includes an extender module 300, which provides a mating interface for the first connector 102a. For example, the mating portion of the extender module 300 forms a first mating end array 134a. In addition, the extender module 300 can be mounted to the connector module 200 of the first thin sheet 130a. The extender housing 120 holds the extender module 300, surrounding at least a portion of the extender module 300. Here, the extender housing 120 surrounds the mating interface and includes a groove 122 for receiving the second connector 102b. The extender housing 120 may also include a hole through which the extender module 300 extends.

[0076] like Figure 2B As shown in , the second electrical connector 102b has a front housing 110b that is shaped to fit within an opening in the extender housing 120. As further described herein, including with reference to Figure 4B As depicted, the second sheet 130b is attached to the front housing 110b.

[0077] The front housing 110b provides a mating interface for the second connector 102b. For example, the front housing 110b includes a protrusion 112, which is configured to be received in a groove of the extender housing 120. The mating ends of the signal conductors of the sheet 130b are exposed in the holes 114b of the front housing 110b, forming a second mating end array 134b so that the mating ends can engage with the signal conductors of the sheet 130a of the first connector 102a. For example, the extender module 300 extends from the first connector 102a and can be received by the paired signal conductors of the second connector 102b. The grounding conductors of the sheet 130b are similarly exposed in the holes 114b and can similarly mate with the grounding conductors in the extender module 300, which in turn are connected to the grounding conductors in the sheet 130a.

[0078] exist FIG. 2A to FIG. 2B , the first connector 102a is configured to receive the second connector 102b. As shown, the groove 122 of the extender housing 120 is configured to receive the protrusion 112 of the front housing 110b. In addition, the hole 114b is configured to receive the mating portion of the extender module 300.

[0079] It should be understood that in some embodiments, the first thin sheet 130a of the first connector 102a and the second thin sheet 130b of the second connector 102b can be substantially the same. For example, the first connector 102a can include a front housing 110a that can receive the thin sheet from one side and can be configured similarly to the corresponding side of the front housing 110b. The opposite side of the front housing 110a can be configured for attachment to the extender housing 120, so that the front housing 110a is disposed between the first thin sheet 130a and the extender housing 120. The front housing 110a is further described herein, including further describing the front housing 110a with reference to FIG.

[0080] The front housing 110b can be configured to mate with the extender housing 120. In some embodiments, the extender housing 120 can be configured so that features that may latch to a feature can slide in and out when inserted into one side of the extender housing 120 to support separable mating when the features that may latch to a feature are inserted into the opposite side of the extender housing 120. In such a configuration, the same component can be used for the front housing 110a or the front housing 110b. Using an extender module to interface between the same connectors allows a single type of connector to be manufactured to be used on each side of the electrical interconnect system, thereby reducing the cost of producing the electrical interconnect system. Even if the front housing 110a and the front housing 110b are shaped differently to support fixed attachment to the extender housing 120 or sliding engagement with the extender housing 120, efficiencies are achieved by using a thin sheet that can be manufactured using the same tooling as both the connector 102a and the connector 102b. For example, if the front housing 110a and the extender housing 120 are made as a single component, similar efficiencies can be achieved in other configurations.

[0081] The electrical connector as described herein may be formed with Figure 2A and Figure 2B Different numbers of signal conductors are shown in . Figure 3A 3 is a front view of a third electrical connector 302a having an extender housing 320 according to an alternative embodiment. Although the third electrical connector 302a is shown as having fewer signal pairs than the first electrical connector 102a, the third electrical connector 302a may be assembled in other ways using components as described with reference to the first electrical connector 102a. For example, the electrical connector 302a may be assembled from an extender housing 320a and a third sheet 330a having a third mating end array 334a and a third contact tail array 336a, and the extender housing 320a, the third sheet 330a, the third mating end array 334a, and the third contact tail array 336a may be configured in the manner described herein with reference to the extender housing 120, the first sheet 130a, the first mating end array 134a, and the first contact tail array 136a.

[0082] In some embodiments, the third connector 302a can be configured to be adjacent to a substrate, such as those described herein (including with reference to FIG. 11A to FIG. 11C and FIG. 12A to FIG. 12D The right angle connector is mounted on the edge of the substrate 1100 or 1200 described above. Figure 3A In the illustrated embodiment, the paired contact tails of the third contact tail array 336a can be configured for mounting to a substrate. In some embodiments, the contact tails of the third contact tail array 336a are configured for insertion into a hole (e.g., a plated through hole) in the substrate. In some embodiments, some or all of the contact tails of the third contact tail array 336a are configured for, for example, connecting to the conductive pads of the substrate in an edge-to-pad configuration using surface mount soldering techniques and / or using a butt joint. Alternatively or additionally, some or all of the contact tails can support pressure mounted contacts. The contact tails configured for pressure mounting can extend between 6 mils and 12 mils from the housing of the connector 302a or from the organizer of the housing, and can be pushed back into the housing when the housing is pressed against the substrate for mounting, thereby generating a spring force for pressure mounting.

[0083] In the illustrated embodiment, pairs of mating ends of the third mating end array 334a are connected along parallel lines 338a and are disposed at a 45 degree angle relative to each of the mating column direction 340a and the mating row direction 342a.

[0084] Figure 3B is configured with Figure 3A 302a is shown in the figure. Although the fourth electrical connector 302b is shown as having fewer signal pairs than the second electrical connector 102b, the fourth electrical connector 302b can be configured in other ways in the manner described with reference to the second electrical connector 302b. For example, the electrical connector 302b can be assembled from a front housing 310b and a fourth thin sheet 330b having a fourth mating end array 334b ​​and a fourth contact tail array 336b. These components can be configured in the manner described herein with reference to the front housing 310b, the second thin sheet 130b, the second mating end array 134b, and the second contact tail array 136b.

[0085] exist Figure 3BIn some embodiments, the fourth electrical connector 302b may also be configured to be mounted to a substrate. In some embodiments, the fourth connector 302b includes an edge connector configured to be mounted adjacent to an edge of a substrate (e.g., a printed circuit board). The contact tails of the fourth contact tail array 336b may be configured to be mounted to a substrate. In some embodiments, the contact tails of the fourth contact tail array 336b may be configured to be inserted into a hole (e.g., a plated through-hole) in a substrate. In some embodiments, some or all of the contact tails of the fourth contact tail array 336b may be configured to be connected to a pad of the substrate in an edge-to-pad configuration, such as by surface mount soldering. Alternatively or additionally, some or all of the contact tails may support pressure mounted contacts.

[0086] The front housing 310b includes a hole 314b in which the mating ends of the paired signal conductors of the fourth sheet 330b are positioned so that the signal conductors from the connector 302a can be inserted into the hole 314b to mate with the signal conductors of the fourth sheet 330b. The ground conductors of the fourth sheet 330b are similarly exposed in the hole 314b for mating with the ground conductors from the connector 302a.

[0087] The fourth mating end array 334b ​​includes rows extending along a row direction 342b and spaced apart from each other in a column direction 340b perpendicular to the row direction 342b. The paired mating ends of the fourth mating end array 334b ​​are aligned along parallel lines 338b. In the illustrated embodiment, the parallel lines 338b are arranged at an angle of 45 degrees relative to the row direction 342b.

[0088] In the illustrated embodiment, the mating ends of the signal conductors of the second wafer are connected along parallel lines 338b that are disposed at a 45 degree angle relative to each of the mating column direction 340b and the mating row direction 342b.

[0089] Figure 3C yes Figure 3A A bottom view of the electrical connector 302a, and Figure 3D Yes Figure 3C An enlarged view of the connector is shown. FIG. 3C to FIG. 3D A contact tail array 336a of the electrical connector 302a is shown, including contact tails 312a corresponding to signal conductors and shield contact tails 316a.

[0090] Pairs of contact tails 312a are positioned in rows along row direction 344a and in columns along column direction 346a. Each pair of contact tails 312a is shown in a broadside coupled configuration along row direction 346a. Shield tails 316a may extend from an electromagnetic shield of a connector module including the contact tails 312a.

[0091] Thus, the shield tails 316a are also positioned in rows along the row direction 344a and in columns along the column direction 346a. The shield tails 316a are angularly offset relative to the contact tails 312a. For example, the shield tails 316a are shown as being positioned at a 45 degree angle relative to the row direction 344a and the column direction 346a. In the illustrated embodiment, there are four shield contact tails 316a for each pair of signal contact tails 312a. For example, such a configuration corresponds to Fig. 7A The connector shown is formed from a shield module. For example, contact tail array 336a includes contact tails of an array of such shield modules. Figure 3C and Figure 3D The configuration shown in corresponds to a 4×4 array of such modules. The technology as described herein enables the modules to be closely spaced in the plane of the array. Here, the contact tails of the mounting interface of each module fit in an area of ​​2.4 mm×2.4 mm, so that the modules are spaced at a pitch of 2.4 mm or less in the row and column directions.

[0092] As shown, shield tail 316a includes a press-fit end that is configured to compress in a direction perpendicular to the direction in which connector 302a is pressed to be mounted to a substrate. For example, the press-fit end can be configured to compress when inserted into a plated through-hole having walls that are perpendicular to the surface of the PCB to which the connector is mounted, so that the press-fit end exerts an outward force on the walls of the through-hole, thereby forming an electrical connection and providing mechanical retention. Other retention forces can be provided by fasteners or other structures of the connector. For example, the lower surface of the connector housing can include a hole 350 that receives a screw or other fastener inserted through the PCB to which the connector is mounted. In use, as shown in FIG. Figure 3D The connector with the mounting interface shown can be mounted on a PCB or other substrate by inserting the shield tail 316a into the through hole in the PCB. Since the PCB can be made with pads positioned relative to these through holes, inserting the shield tail 316a of the connector module into the through hole can position the module so that the contact tail 312a of the module is aligned with the corresponding pad. The press-fit on the shield tail 316a can provide sufficient retention force to maintain the position of the contact tail 312a until the fastener is inserted into the hole 350 that fixes the connector to the PCB. In an embodiment where the contact tail 312a is soldered to the pad, the shield tail 316a can keep the contact tail 312a in place during soldering.

[0093] Figure 3DShown is an embodiment in which contact tail 312a is configured for pressure installation. Signal contact tail 312a and shield tail 316a both extend through lower surface 352 of connector, in this example, lower surface 352 can be the surface of organizer or compliant shield such as compliant shield 170 described below. The opening through which signal contact tail 312a extends can be shaped to facilitate pressure installation connection. When connector is mounted to substrate, the contact configured for pressure installation connection can be compressed and can be retracted into connector housing. Therefore, the opening can be large enough to enable contact tip to slide relative to housing, while still providing support for mating end.

[0094] In some embodiments, the contact can be configured so that the contact tail rotates when it is retracted into the housing. The rotation can help break up oxides or remove other contaminants on the pad surface and can promote better electrical connection. The opening can be configured to enable the contact tail to rotate. Figure 3D In the example of FIG. 1 , the opening through which the contact tail 312a passes has a first region 354a on one side of the contact tail and a second region 354b diametrically opposite the region 354a. This configuration limits translational movement of the contact tail 312a relative to the central axis of the shrink tail, but allows rotation about the central axis. The regions 354a and 354b can be shaped to enable rotation of 5 to 25 degrees, for example 10 to 20 degrees.

[0095] Similar to connectors 102a and 102b, Figure 1 To Figure 2, FIG. 3A to FIG. 3B Connectors 302a and 302b are shown having a direct attach orthogonal configuration. FIG. 3E to FIG. 3F Electrical connectors 102c' and 102d' having a coplanar configuration are shown. When connector 102c' is mated with connector 102d', substrate 104c' and substrate 104d' can be coplanar. Substrates 104c' and 104d' on which connectors 102c' and 102d' are mounted can be aligned in parallel. In this example, connectors 102c' and 102d' differ from connectors 102a, 102b, and 302a and 302b in that the mating interfaces of connectors 102c' and 102d' are angled in relative directions, while the mating interfaces of connectors 102a, 102b, and 302a and 302b are angled in the same direction. Connectors 102c' and 102d' can be constructed in other ways in the manner described for connectors 102a, 102b, and 302a and 302b.

[0096] The mating end arrays 134c' and 134d' can be adapted to be in a coplanar configuration. FIG. 3A to FIG. 3B, the mating ends of the mating end array 134c' are positioned along parallel lines 138c' and the mating ends of the mating end array 134d' are positioned along parallel lines 138d'. FIG. 3E to FIG. 3F In FIG. 1 , parallel lines 138c′ and 138d′ are perpendicular to each other because mating end arrays 134c′ and 134d′ are shown facing in the same direction. FIG. 3A to FIG. 3B The direct attach orthogonal configuration shown in the figure uses the same connector on both sides, but can be FIG. 3E to FIG. 3F A variation of the same connector used in a coplanar configuration is shown.

[0097] In some embodiments, the relative positions of the pairs of mating ends of the mating end array 134c' can be rotated 90 degrees relative to the relative positions of the pairs of mating ends of the mating end array 134d'. In some embodiments, the parallel lines 138c' can be set at an angle of 45 degrees counterclockwise (e.g., +45 degrees) relative to the mating row direction 142c', and the parallel lines 138d' can be set at an angle of 45 degrees clockwise (e.g., -45 degrees or +135 degrees counterclockwise) relative to the mating row direction 142d'. It should be understood that, alternatively, the parallel lines 138d' can be set at an angle of 45 degrees counterclockwise (e.g., +45 degrees) relative to the mating row direction 142d', and the parallel lines 138c' can be set at an angle of 45 degrees clockwise (e.g., -45 degrees or +135 degrees counterclockwise) relative to the mating row direction 142c'.

[0098] Figure 4A and Figure 4B They are Figure 1 as well as FIG. 2A to FIG. 2B A partial exploded view of the electrical connectors 102a and 102b. Figure 4A In this illustrated embodiment, the extender housing 120 is shown removed from the front housing 110 a to illustrate the front housing 110 a and the array of extender modules 300 .

[0099] In the illustrated embodiment, the front housing 110a is attached to the sheet 130. The front housing 110a can be formed, for example, using a dielectric such as plastic in one or more molding processes. As also shown, the front housing 110a includes a protrusion 112a, which is configured here to latch the front housing 110a to the extender housing 120. For example, the protrusion 112a can be received in the opening 124 of the extender housing 120. The extender module 300 is shown as protruding from the front housing 110a. The extender module 300 can be mounted to the signal conductors of the sheet 130 to form a mating array 134a. Engaging the protrusion 112a in the opening 124 can be achieved by applying a force that exceeds the mating force required to press the connectors 102a and 102b together to mate or to separate those connectors when unmating. Therefore, the extender housing 120 can be fixed to the front housing 110a during operation of the connectors 102a and 102b.

[0100] The aperture of the extender housing 120 may be sized to allow the mating end of the extender module 300 to extend through the aperture of the extender housing 120. The mating ends of the signal conductors and ground conductors of the extender module 300 may then be exposed within a cavity serving as a mating interface region defined by the walls of the extender housing 120. The opposite ends of the signal conductors and ground conductors within the extender module 300 may be electrically coupled to the corresponding signal conductors and ground conductors within the sheet 130a. In this manner, the connectors between the signal conductors and ground conductors within the sheet 130a and the connector 102b are inserted into the mating interface region.

[0101] The extender housing 120 may be formed, for example, using a dielectric such as plastic in one or more molding processes. In the illustrated embodiment, the extender housing 120 includes a recess 122. The recess 122 is configured to receive the protrusion 112b ( Figure 4B ). The sliding of the protrusions 112b in the grooves 122 can help align the mating array 134a of the first electrical connector 102a with the mating array 134b of the second electrical connector 102b before sliding the two connectors into a mating configuration.

[0102] Figure 4B yes Figure 1 FIG. 1 is a partial exploded view of the second electrical connector 102 b. Here, the front housing 110 b is shown separated from the sheet 130 b. Figure 4BAs shown in , the thin slices 130b of the second electrical connector 102b are each formed by a plurality of connector modules 200. In the illustrated embodiment, each thin slice has eight connector modules. The mating ends 202 of the connector modules 200 extend from the thin slice housing 132b to form a mating end array 134b. When the front housing 110b is attached to the thin slice 130b, the mating end array 134b extends into the front housing 110b. The mating ends 202 are accessible through corresponding holes 114b.

[0103] The contact tails 206 extend from the sheet housing 132b in a direction perpendicular to the direction in which the mating ends 202 extend so as to form a contact tail array 136b. The connector module 200 also includes an electromagnetic shield 210 to provide isolation for electrical signals carried by signal pairs adjacent to the connector module 200. In the illustrated embodiment, the shield also has a structure forming the mating contact portion mating end 202 and a structure forming the contact tails within the contact tail array 136b. The electromagnetic shield can be formed of a conductive material such as a metal plate bent and formed into the illustrated shape so as to form a conductive shield.

[0104] Figure 5 is a partially exploded view of the electrical connector 102 with the compliant shield 170 and without the front housing. The inventors have recognized and appreciated that the pair of contact tails 206 and / or the pair of electromagnetic shield tails 220 passing through the compliant shield 170 can improve signal integrity in the electrical connector 102 .

[0105] The pairs of contact tails 206 of the contact tail array 136 can extend through the compliant shield 170. In embodiments where the conductive elements in the connector are configured for press-fitting, they can extend far enough beyond the compliant shield in an uncompressed state so that when the compliant shield is compressed between the connector and the substrate to which the connector is mounted, the conductive elements are compressed a sufficient distance to generate sufficient force to make a reliable press-fit connection. The distance can be, for example, between 5 mils and 15 mils. The force generated can be, for example, between 20 grams and 60 grams.

[0106] The compliant shield 170 may include lossy and / or conductive portions and may also include insulating portions. The contact tails 206 may pass through openings or insulating portions of the compliant shield 170 and may be insulated from the lossy or conductive portions. The ground conductor within the connector 102 may be electrically coupled to the lossy or conductive portions, for example, by passing through or pressing against the electromagnetic shield tails 220 of the lossy or conductive portions.

[0107] In some embodiments, the conductive portion may be compliant so that when the connector 102 is mounted to a printed circuit board, the thickness of the conductive portion may be reduced when the conductive portion is pressed between the connector 102 and the printed circuit board. Compliance may result from the material used, and may, for example, be generated by an elastomer filled with conductive particles or conductive foam. When a force is applied to such materials, they may decrease in volume or may be displaced to render them compliant. The conductive and / or lossy portion may be, for example, a conductive elastomer, such as a silicone elastomer filled with conductive particles such as particles of silver, gold, copper, nickel, aluminum, nickel-plated graphite, or combinations thereof, or alloys thereof. Alternatively or additionally, such a material may be a conductive open-cell foam, such as a polyethylene foam plated with copper and nickel.

[0108] If present, the insulation may also be compliant.Alternatively or additionally, the compliant material may be thicker than the insulation of compliant shield 170 so that the compliant material may extend from the mounting interface of connector 102 to the surface of a printed circuit board to which connector 102 is mounted.

[0109] The compliant material can be positioned to align with pads on the surface of the printed circuit board to which the pairs of contact tails 206 of the contact tail array 136 are to be attached or inserted through. Those pads can be connected to ground structures within the printed circuit board so that when the electrical connector 102 is attached to the printed circuit board, the compliant material contacts the ground pads on the surface of the printed circuit board.

[0110] The conductive or lossy portions of the compliant shield 170 can be positioned to make electrical connections with the electromagnetic shield 210 of the connector module 200. Such connections can be made, for example, by the electromagnetic shield tails 220 passing through and contacting the lossy or conductive portions. Alternatively or additionally, in embodiments where the lossy or conductive portions are compliant, those portions can be positioned to press against the electromagnetic shield tails 220 or other structures extending from the electromagnetic shield when the electrical connector 102 is attached to a printed circuit board.

[0111] The insulating portions 176 may be organized into rows along the row direction 172 and the column direction 174. When the pairs of contact tails 206 of the contact tail array 136 extend through the insulating portions 176, the row direction 172 of the compliant shield 170 may be substantially aligned with the contact tail row direction 146, and the column direction 174 of the compliant shield 170 may be substantially aligned with the contact tail column direction 144.

[0112] In the illustrated embodiment, the conductive members 178 join the insulating portions 176 and are positioned between the rows of the contact tail array 136. In this location, the shield tails 220 may contact the electromagnetic shield tails 220 either because they press against the tails when compressed or because the shield tails 220 pass through the conductive members 178.

[0113] Fig. 6A is a perspective view of the wafer 130 of the electrical connector 102. In the illustrated embodiment, the wafer housing 132 is formed of two housing members 133a and 133b. Figure 6B 1 is a perspective view of the sheet 130 with the sheet housing member 133a cut away. Fig. 6A and 6B As shown in FIG. 1 , the wafer 130 includes a connector module 200 between two wafer housing members 133a and 133b. In the illustrated embodiment, the wafer housing members 133a and 133b hold the connector module 200 in the wafer 130.

[0114] In some embodiments, the sheet housing members 133a and 133b can be formed of or include a lossy conductive material such as a conductively plated plastic or an insulating material. The inventors have recognized and appreciated that the use of lossy conductive materials to implement the sheet housing members 133a and 133b provides damping for undesirable resonant modes in and between the connector modules 200, thereby improving the signal integrity of the signals carried by the electrical connector 102.

[0115] Any suitable lossy material may be used for these and other structures that are "lossy". Materials that conduct but have some loss or absorb electromagnetic energy in the frequency range of interest through another physical mechanism are generally referred to as "lossy" materials in this article. Electrically lossy materials can be formed of lossy dielectric materials and / or poorly conductive materials and / or lossy magnetic materials. Magnetic lossy materials can be formed, for example, from materials that are traditionally regarded as ferromagnetic materials, such as those materials that have a magnetic loss tangent greater than about 0.05 in the frequency range of interest. "Magnetic loss tangent" is the ratio of the imaginary part to the real part of the complex electromagnetic permeability of the material. Actual lossy magnetic materials or mixtures containing lossy magnetic materials can also exhibit useful amounts of dielectric loss or conduction loss effects over a portion of the frequency range of interest. Electrically lossy materials can be formed from materials that are traditionally regarded as dielectric materials, such as those materials that have an electrical loss tangent greater than about 0.05 in the frequency range of interest. "Electrical loss tangent" is the ratio of the imaginary part to the real part of the complex dielectric constant of the material. Electrically lossy materials may also be formed from materials that are generally considered to be conductors but are relatively poor conductors in the frequency range of interest, the materials containing conductive particles or conductive regions that are sufficiently dispersed that they do not provide high electrical conductivity or are otherwise prepared to have properties that result in relatively poor bulk conductivity compared to a good conductor, such as copper, in the frequency range of interest.

[0116] Electrically lossy materials typically have a bulk conductivity of about 1 Siemens / meter to about 10,000 Siemens / meter and preferably about 1 Siemens / meter to about 5,000 Siemens / meter. In some embodiments, materials with a bulk conductivity between about 10 Siemens / meter and about 200 Siemens / meter can be used. As a specific example, a material with a conductivity of about 50 Siemens / meter can be used. However, it should be understood that the conductivity of the material can be selected empirically or through electrical simulation using known simulation tools to determine a suitable conductivity that provides suitable low crosstalk and suitable low signal path attenuation or insertion loss.

[0117] An electrically lossy material may be a partially conductive material, such as a material having a surface resistivity between 1 Ω / square and 100,000 Ω / square. In some embodiments, the electrically lossy material has a surface resistivity between 10 Ω / square and 1000 Ω / square. As a specific example, the material may have a surface resistivity between approximately 20 Ω / square and 80 Ω / square.

[0118] In some embodiments, an electrically lossy material is formed by adding a filler containing conductive particles to an adhesive. In such embodiments, a lossy member can be formed by molding or otherwise forming an adhesive with a filler into a desired form. Examples of conductive particles that can be used as fillers to form electrically lossy materials include carbon or graphite or other types of particles formed into fibers, flakes, nanoparticles. Metals or other particles in the form of powders, flakes, fibers can also be used to provide appropriate electrically lossy properties. Alternatively, a combination of fillers can be used. For example, metal-plated carbon particles can be used. Silver and nickel are metal coatings suitable for fibers. Coated particles can be used alone or in combination with other fillers such as carbon flakes. The adhesive or matrix can be any material that will solidify, cure, or can be used to position the filler material in other ways. In some embodiments, the adhesive can be a thermoplastic material that is traditionally used to make electrical connectors to facilitate molding the electrically lossy material into a desired shape and position as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymers (LCP) and nylon. However, many alternative forms of adhesive materials can be used. A curable material such as epoxy resin may be used as the adhesive. Alternatively, a material such as a thermosetting resin or adhesive may be used.

[0119] Furthermore, while the above-described binder materials can be used to create an electrically lossy material by forming a binder around a conductive particulate filler, the invention is not limited thereto. For example, the conductive particles can be impregnated into a formed matrix material or can be coated onto a formed matrix material, such as by applying a conductive coating to a plastic part or a metal part. As used herein, the term "binder" includes a material that encapsulates a filler, is impregnated with a filler, or otherwise serves as a base for holding a filler.

[0120] Preferably, the filler will be present in a sufficient volume percentage to allow for the creation of a conductive path from particle to particle. For example, when metal fibers are used, the fibers may be present in an amount of about 3% to 40% by volume. The amount of filler may affect the conductive properties of the material.

[0121] Filling materials are available commercially, such as from Celanese Corporation under the trade name Materials sold, which can be filled with carbon fiber or stainless steel wire. Lossy materials, such as lossy conductive carbon-filled adhesive preforms, such as those sold by Techfilm of Billerica, Massachusetts, USA, can also be used. Such preforms can include epoxy resin adhesives filled with carbon fiber and / or other carbon particles. The adhesive surrounds the carbon particles, which can be used as reinforcing materials for the preforms. Such preforms can be inserted into connector sheets to form all or part of the housing. In some embodiments, the preforms can be adhered by adhesives in the preforms, and the adhesives can be cured during the heat treatment process. In some embodiments, the adhesive can take the form of a separate conductive or non-conductive adhesive layer. In some embodiments, the adhesive in the preform can be alternatively or additionally used to fix one or more conductive elements such as foil strips to lossy materials.

[0122] Various forms of reinforcing fibers, in woven or nonwoven form, coated or uncoated, may be used. Nonwoven carbon fibers are a suitable material. Other suitable materials such as customized blends sold by RTP Company may be used, as the present invention is not limited in this respect.

[0123] In some embodiments, the lossy portion can be manufactured by stamping a preform or sheet of lossy material. For example, the lossy portion can be formed by stamping a preform as described above with an appropriate opening pattern. However, other materials can be used instead of or in addition to such a preform. For example, a sheet of ferromagnetic material can be used.

[0124] However, the lossy portion may be formed in other ways. In some embodiments, the lossy portion may be formed by interleaving layers of lossy and conductive material, such as metal foil. The layers may be rigidly attached to each other, such as by using an epoxy or other adhesive, or may be held together in any other suitable manner. The layers may have the desired shape before being secured to each other, or may be stamped or otherwise formed after they are held together. As another alternative, the lossy portion may be formed by plating a plastic or other insulating material with a lossy coating, such as a diffused metal coating.

[0125] like Fig. 6A As shown in , the connector module 200 is aligned along the mating column direction 140. Figure 6B As shown in FIG. 1 , the connector module 200 includes a mating end 202 and a mounting end where the contact tails 206 of the signal conductors in the module are exposed. The mating end and the mounting end of the module 200 are connected by an intermediate portion 204. The connector module 200 also includes an electromagnetic shield 210 having an electromagnetic shield tail 220 and an electromagnetic shield mating end 212 at the mounting end and the mating end of the module, respectively.

[0126] In the illustrated embodiment, the mating ends of the signal conductors of each connector module are separated at the mating end 202 along parallel lines 138 that are at a 45 degree angle relative to the mating column direction 140 .

[0127] In the illustrated embodiment, the contact tails 206 of the signal conductors within the connector module are positioned in columns along the contact tail column direction 144, and the pairs of contact tails 206 are also separated along the contact tail column direction 144. As shown, the contact tail column direction 144 is perpendicular to the mating column direction 140. However, it should be understood that the mating end and the mounting end can have any desired relative orientation. According to various embodiments, the contact tails 206 can be edge-coupled or broadside-coupled.

[0128] Fig. 7A is a perspective view of a representative connector module 200. Figure 6B As shown in , the sheet can include a column of connector modules 200. Each of the connector modules can be in a separate row at the mating interface and the mounting interface of the connector. In a right-angle connector, the modules in each row can have a middle portion 204 of different lengths. In some embodiments, the mating end and the mounting end can be the same.

[0129] like Fig. 7AAs shown in , electromagnetic shielding members 210a and 210b are disposed around an inner insulating member 230. In the illustrated embodiment, the electromagnetic shielding member 210 completely covers the connector module 200 on two sides, with gaps 218 on the remaining two sides such that only partial coverage is provided on those sides. The inner insulating member 230 is exposed through the gaps 218. However, in some embodiments, the electromagnetic shielding member 210 may completely cover the insulating member 230 on 4 sides. The gaps 218 may be relatively narrow so as not to allow any significant amount of electromagnetic energy to pass through the gaps. The gaps may, for example, be less than half the wavelength of the highest frequency in the intended operating range of the connector, or in some embodiments, the gaps may, for example, be less than one quarter the wavelength of the highest frequency in the intended operating range of the connector. The signal conductors within the connector module 200 are described herein, including with reference to FIG. 10A to FIG. 10C The signal conductors in the connector module 200 are shown. The electromagnetic shielding member 210 may be a conductive shielding member. For example, the electromagnetic shielding member 210 may be stamped from a metal sheet.

[0130] Fig. 7A The transition region 208 of the connector module 200 is shown. In the transition region 208, the mating end 202 is connected to the intermediate portion 204.

[0131] The electromagnetic shield members 210a and 210b include an electromagnetic shield tail 220 and an electromagnetic shield mating end 212 at the mating end 202, the electromagnetic shield tail 220 extending from the module 200 parallel to and along the sides of the contact tail 206 of the signal conductor within the module 200. The electromagnetic shield mating end 212 surrounds the mating end of the signal conductor.

[0132] The electromagnetic shield mating end 212 is embossed with an outward protrusion 214 in the transition region 208 and an inward protrusion 216 at the mating end 202. Therefore, the outward protrusion 214 is disposed between the middle portion 204 and the inward protrusion 216. The electromagnetic shield mating end 212 embossed with the outward protrusion 214 offsets the change in impedance along the length of the connector module 200 associated with the shape change of the connector module 200 in the transition region. For example, at frequencies between 45 GHz and 56 GHz, the impedance along the signal path through the connector module 200 can be between 90 ohms and 100 ohms. In some embodiments, the electromagnetic shield members 210a and 210b can define a plurality of contact tails 206 that surround the middle portion 204 and the contact tails 206 and have a thickness of less than 2.6 mm. 2 The cross-sectional area of ​​the area, for example FIG. 7A to FIG. 7B The square areas of electromagnetic shields 211a, 211b, and 221c are shown in FIG. In some embodiments, these areas can be configured to support TE frequencies greater than 56 GHz.1,0 resonant modes that enable reliable signal propagation at speeds of at least 112 Gb / s on a differential pair.

[0133] The electromagnetic shield mating end 212 embossed with the inward projection 216 provides a more constant impedance between a first operating state in which the connector module 200 is firmly pressed against a mating connector and a second operating state in which the connector module 200 is partially disengaged such that there is a gap between the connector module 200 and the mating connector, but the connectors are close enough to mate the signal conductors in those connectors. In some embodiments, the impedance change between the fully mated configuration and the partially disengaged configuration of the mating end 202 is less than 5 ohms at the operating frequency of the connector, for example, in the range of 45 GHz to 56 GHz. Figure 7B is a structure in which the outer insulating members 180a and 180b and the inner insulating member 230 are removed Figure 6B A perspective view of a connector module 200 is shown.

[0134] FIG. 8A to FIG. 8B 2 are a perspective view and a side view of the connector module 200 with the electromagnetic shielding members 210a and 210b cut away, respectively. FIG. 8A to FIG. 8B As shown in , outer insulating members 280a and 280b are disposed on opposite sides of the inner insulating member 230. The outer insulating members 280a and 280b can be formed using a dielectric material such as plastic. The protrusion 232 of the inner insulating member 230 is disposed closer to the contact tail 206 than the mating end 202 and extends in a direction opposite to the direction along which the contact tail 206 extends.

[0135] The mating end 202 of the signal conductor within the connector module 200 includes compliant receptacles 270a and 270b, each having mating arms 272a and 272b. In the illustrated embodiment, the compliant receptacles 270a and 270b are configured to receive and contact the mating portion of the signal conductor of the mating connector between the mating arms 272a and 272b.

[0136] Also like FIG. 8A to FIG. 8BAs shown in, the insulating portion of the connector module 200 can insulate the sockets 270a and 270b from each other. These insulating portions can also position the sockets 270a and 270b and provide holes, through which the mating portion of the mating connector can enter the sockets 270a and 270b. These insulating portions can be formed as a part of the insulating member 230. In the embodiment shown, the inner insulating member 230 has an extension 234, and the extension 234 includes arms 236a and 236b. The extension 234 extends beyond the compliant sockets 270a and 270b in the direction of its elongation at the mating end 202. The arms 236a and 236b are spaced farther than the mating end 202. The hole of the extension 234 can be configured to receive the wire passing therethrough so that the wire extends into the compliant sockets 270a and 270b. For example, the gap between the arms 272a and 272b of the compliant sockets 270a and 270b can be aligned with the hole.

[0137] FIG. 9A to FIG. 9B 2 are a perspective view and a side view of the connector module 200 with the electromagnetic shielding members 210a and 210b and the outer insulating members 280a and 280b cut away, respectively. FIG. 9A to FIG. 9B As shown in , the connector module 200 includes a signal conductor 260, which is shown here as a signal conductor 260a and 260b implemented as a differential pair. When the connector module 200 is assembled, the signal conductor 260a can be disposed between the outer insulating member 280a and the inner insulating member 230, and the signal conductor 260b can be disposed between the outer insulating member 280b and the inner insulating member 230.

[0138] One or more of the inner insulating member 230 and the outer insulating members 280a and 280b may include features to hold the insulating components together, thereby securely positioning the signal conductor 260 within the insulating structure. In the illustrated embodiment, the first retaining member 240 and the second retaining member 242 of the inner insulating member 230 may extend into openings in the outer insulating members 280a and 280b. In the illustrated embodiment, the first retaining member 240 is disposed adjacent to the mating end 202 and extends in a direction perpendicular to the direction along which the mating end 202 extends. The second retaining member 242 is disposed adjacent to the contact tail 206 and extends in a direction perpendicular to the direction along which the contact tail 206 extends.

[0139] The middle portions of the signal conductors 260a and 260b are on opposite sides of the inner insulating member 230. In the illustrated embodiment, the signal conductors 260a and 260b are each stamped from a sheet of metal and then bent into a desired shape. The middle portion is flat, and the thickness of the middle portion is equal to the thickness of the sheet of metal. Therefore, the middle portion has opposite broadsides that are joined together by edges that are thinner than the broadsides. In this embodiment, the middle portions are aligned broadside to broadside to provide broadside coupling within the module 200.

[0140] exist FIG. 9A to FIG. 9B 2, the signal conductor 260 includes a mating end 262, an intermediate portion 264, a compliant portion 266 located at the mating end 202, the intermediate portion 204, and the contact tail 206 of the connector module 200. As shown, the mating end 262 includes compliant receptacles 270a and 270b. The mounting end includes a compliant portion 266 that is configured to compress in the direction in which the connector is pressed to connect to the substrate, as included herein with reference to FIG. 10A to FIG. 10C Described.

[0141] The transition region 268 of the signal conductor 260 connects the mating end 262 to the intermediate portion 264. In the transition region 268, the angular position about an axis parallel to the longitudinal dimension of the pair of signal conductors 260a and 260b changes. The angular distance between the signal conductors 260a and 260b can remain the same, for example at 180 degrees. In the illustrated embodiment, the angular position of the signal conductors 260a and 260b changes 45 degrees within the transition region 268, so that the pair is angularly twisted considering crossing the transition region 268.

[0142] The inner insulating member 230 can be shaped to accommodate a pair of signal conductors having such a transition region. In some embodiments, the signal conductors 260 can be disposed in grooves on opposite sides of the inner insulating member 230. The transition regions 268 of the signal conductors 260 can be disposed within transition guides of the grooves.

[0143] FIG. 10A to FIG. 10C Shows FIG. 9A to FIG. 9B The signal conductors 260a and 260b of the connector module 200 are shown in FIG. Fig. 10A is a perspective view of signal conductors 260a and 260b, Fig. 10B is an enlarged view of the compliant portions 266a and 266b of the signal conductors 260a and 260b, and Fig. 10C 260a and 260b are front views of the signal conductors 260a and 260b. FIG. 10A to FIG. 10CAs shown, mating ends 262a and 262b extend in a first direction, while compliant portions 266a and 266b extend in a second direction at right angles to the first direction. Compliant portions 266a and 266b link contact tails (here formed as sharp tips 1050a and 1050b) to the middle of the signal conductor.

[0144] In some embodiments, each signal conductor can be stamped and formed into a metal sheet with uniform thickness, and each segment of the signal conductor can have the same thickness. For example, the thickness can be, for example, between 2 mils and 4 mils. However, in some embodiments, the thickness of the beam at the mating end 262a and 262b can be greater than the thickness of the compliance portion 266a and 266b that produces the desired contact force at the tip 1050a and 1050b, to achieve a reliable connection from the mating connector to the contact. In such an embodiment, the mating end 262a and 262b can be thicker than the compliance portion of the contact tail 266a and 266b. The signal conductor can be formed in this configuration, for example, by stamping the stamped portion of the compliance portion 266a and 266b.

[0145] In the illustrated embodiment, the compliance portions 266a and 266b may include portions configured to compress in a direction in which the signal conductors 260a and 260b extend close to the compliance portions 266a and 266b. In the illustrated embodiment, the direction is perpendicular to the surface of the printed circuit board to which the connector is mounted. For example, the compliance portions 266a and 266b may be configured such that when the connector including the compliance portions 266a and 266b approaches the substrate in the mounting direction, the compliance portions 266a and 266b may be compressed in the mounting direction. In some embodiments, the compliance portions 266a and 266b may be compressed so that when a force is applied to the tips 1050a and 1050b in this direction, the tips 1050a and 1050b retract toward the housing of the electrical connector. In some embodiments, the compliant portions 266a and 266b can be compressed in a direction perpendicular to the dimensions (eg, row and column directions) of the contact tail array including the compliant portions 266a and 266b.

[0146] In some embodiments, the compliant portions 266a and 266b can be configured as a serpentine 1001 as shown in FIG. 10. The serpentine 1001 is shown as including a plurality of arcuate segments separated by openings. In some embodiments, the serpentine 1001 can include between 4 and 8 segments. These segments can be compressed by reducing the openings between the arcuate segments.

[0147] As shown, serpentine 1001 can terminate in sharp tips 1050a and 1050b. In some embodiments, the tips can include gold plating.

[0148] like Fig. 10B As shown, the compliance portion 266b includes a first bend 1002 and a second bend 1004. The bends 1002 and 1004 of the compliance portion 266b are shown as being spaced apart from each other by a first distance. When the compliance portion 266b is mounted to a surface, the distance between the bends 1002 and 1004 decreases as the bend 1004 is compressed toward the bend 1002. Therefore, when the connector with the compliance portions 266a and 266b is pressed against the substrate, the bends 1002 and 1004 are spaced closer together. As shown in the bends, 1002 and 1004 are conductive. When the bends 1002 and 1004 are compressed together, the bends 1002 and 1004 can form physical contact, and / or can be sufficiently close together so that the signal carried by the signal conductors 260a and 260b can pass through the compliance portions 266a and 266b with little or no degradation. The compression of the segments also creates a spring force that urges the tips 1050a and 1050b toward the substrate against which the connector is pressed.

[0149] In some embodiments, the compliant portions 266a and 266b can rotate when compressed. The rotation can be imparted by cutting tapered edges on the segments forming the compliant portions 266a and 266b so that when the segments are pressed together, one segment can ride on the tapered edge of an adjacent segment so that the segments—which may be coplanar in an uncompressed state—can move out of plane. For example, in Fig. 10B In some embodiments, the compliant portions 266a and 266b can be configured to generate a force between 20 grams and 60 grams when compressed. In some embodiments, the compliant portions 266a and 266b can be configured to generate a force between 25 grams and 45 grams when compressed.

[0150] Here, each signal conductor 260a and 260b is configured to carry a component of a differential signal. Signal conductors 260a and 260b can each be formed as a single, integral conductive element, which can be stamped from a metal sheet. However, in some embodiments, signal conductors 260a and 260b can each be formed by a plurality of conductive elements that are fused, welded, soldered or otherwise joined together. For example, portions of signal conductors 260a and 260b, such as contact tails 266a and 266b and mating ends 262a and 262b, can be formed using a superelastic conductive material.

[0151] Superelastic materials may include shape memory materials that undergo a reversible martensitic phase transformation when a suitable mechanical driving force is applied. The phase transformation may be a diffusionless solid-solid phase transformation with an associated shape change; the shape change allows the superelastic material to adapt to relatively large strains compared to conventional (i.e., non-superelastic) materials, so superelastic materials typically exhibit a much larger elastic limit than conventional materials. The elastic limit is defined herein as the maximum strain to which a material can be reversibly deformed without yielding. Conventional conductors typically exhibit an elastic limit of up to 1%, while superelastic conductive materials may have an elastic limit of up to 7% or 8%. Therefore, superelastic conductive materials can be made smaller without sacrificing the ability to withstand considerable strain. In addition, some superelastic conductive materials can also return to their original form when exposed to a transformation temperature specific to the material, even when the strain exceeds its elastic limit. In contrast, conventional conductors are typically permanently deformed once the strain exceeds their elastic limit.

[0152] Such materials can enable signal conductors that are small but provide a sturdy structure. Such materials facilitate reducing the width of the electrical conductors of the electrical connector, which can result in reduced spacing between the electrical conductors and the electromagnetic shields of the electrical connectors in the connector module 300. For example, in some embodiments, the superelastic member can have a diameter between 20 mils, such as between 8 mils and 14 mils (or an effective diameter resulting from a cross-sectional area having an area of ​​a circle equal to the diameter), or in some embodiments, the superelastic member can have a diameter between 5 mils and 8 mils, or the superelastic member can have a diameter within any sub-range of the range between 5 mils and 14 mils.

[0153] In addition to enabling wiring channels in the row and column directions, more compact connector modules may have undesirable resonant modes at high frequencies, which may exceed the desired operating frequency range of the electrical connector. Undesirable resonant frequency modes within the operating frequency range of the electrical connector may be reduced accordingly, which provides increased signal integrity for signals carried by the connector module.

[0154] In some embodiments, the contact tails of the contact tail array 336a (or 336b, 136a, 136b, etc.) may include a superelastic (or pseudo-elastic) material. Depending on the particular embodiment, the superelastic material may have a suitable intrinsic conductivity or may be made suitable for conductivity by coating or attaching to a conductive material. For example, a suitable conductivity may be in the range of about 1.5 μΩcm to about 200 μΩcm. Examples of superelastic materials that may have a suitable intrinsic conductivity include, but are not limited to, metal alloys such as copper-aluminum-nickel, copper-aluminum-zinc, copper-aluminum-manganese-nickel, nickel-titanium (e.g., nitinol), and nickel-titanium-copper. Additional examples of potentially suitable metal alloys include Ag-Cd (approximately 44-49 at% Cd), Au-Cd (approximately 46.5-50 at% Cd), Cu-Al-Ni (approximately 14-14.5 wt%, approximately 3-4.5 wt% Ni), Cu-Au-Zn (approximately 23-28 at% Au, approximately 45-47 at% Zn), Cu-Sn (approximately 15 at% Sn), Cu-Zn (approximately 38.5-41.5 wt% Zn), Cu-Zn-X (X = Si, Sn, Al, Ga, approximately 1-5 at% X), Ni-Al (approximately 36-38 at% Al), Ti-Ni (approximately 49-51 at% Ni), Fe-Pt (approximately 25 at% Pt), and Fe-Pd (approximately 30 at% Pd).

[0155] In some embodiments, a particular superelastic material may be selected for its mechanical response rather than its electronic properties, and a particular superelastic material may not have suitable inherent conductivity. In such embodiments, the superelastic material may be coated with a more conductive metal such as silver to improve conductivity. For example, the coating may be applied using a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, or any other suitable coating process, as the present disclosure is not limited in this regard. The coated superelastic material may also be particularly beneficial in high frequency applications where a large portion of the electrical conduction occurs near the surface of the conductor.

[0156] In some embodiments, a connector element including a superelastic material can be formed by attaching the superelastic material to a conventional material, which can have a higher conductivity than the superelastic material. For example, the superelastic material can be employed only in portions of the connector element that may be subject to large deformations, while other portions of the connector that do not deform significantly during operation of the connector can be made of conventional (highly conductive) materials.

[0157] The inventors have recognized and appreciated that using superelastic conductive materials to implement portions of an electrical connector enables smaller structures that are still strong enough to withstand the operational requirements of the electrical connector, and thus can facilitate higher signal conductor density within the portion made of superelastic material. This tighter spacing can be achieved by an interconnect system. For example, as described herein, including reference Fig. 12A As depicted, the mounting footprint for receiving the electrical connector 302a on the substrate may be adapted to receive a high density contact tail array 336b.

[0158] Due to the transition region 268, the mating ends 262a and 262b are separated from each other along the line 138, while the intermediate portions 264a and 264b adjacent to the mating ends 262a and 262b are separated along the mating row direction 142. As shown, for example, Figure 5 , the connector 102 may be configured such that all modules 200 are positioned in a row extending along the row direction 142. All modules may include similarly oriented mating ends such that for each module, the mating ends of the signal conductors will be separated from each other along a line parallel to the line 138.

[0159] The relative positions of the signal conductors 260a and 260b change along the transition region 268 such that at a first end of the transition region 268 adjacent to the mating ends 262a and 262b, the signal conductors 260a and 260b are aligned along the first parallel line 138, and at a second end of the transition region 268 adjacent to the intermediate portions 264a and 264b, the signal conductors 260a and 260b are aligned along the mating row direction 142. In the example shown, the transition region 268 provides a 45 degree twist between the line 138 and the mating row direction 142. Within the transition region 268, the signal conductor 260a extends away from the contact tail column direction 144, and the signal conductor 260b extends toward the contact tail column direction 144.

[0160] Although the relative positions of the signal conductors 260a and 260b vary over the transition region, the signal integrity of a pair of signal conductors can be enhanced by configuring the module 200 to keep each of the signal conductors 260a and 260b adjacent to the same corresponding shielding member 210a or 210b over the entire transition region. Alternatively or in addition, the spacing between the signal conductors 260a and 260b and the corresponding shielding member 210a or 210b can be relatively constant over the transition region. For example, in some embodiments, the spacing between the signal conductors and the shielding member can vary by no more than 30%, 20%, or 10%.

[0161] Module 200 may include one or more features that provide for such relative positioning and spacing of signal conductors and shielding members. Fig. 7A and Fig. 10A and Fig. 10C As can be seen from the comparison of the shield members 210a and 210b, the shield members 210a and 210b have a generally planar shape in the middle portion 204, which is parallel to the middle portion 264 of the corresponding signal conductor 260a or 260b. The shield mating end 212 can be formed from the same metal sheet as the middle portion, wherein the shield mating end 212 is twisted relative to the middle portion 204. The twisting of the shield member can have the same angle and / or the same angular twist rate as the signal conductor, ensuring that each signal conductor and the same shield member are adjacent to the same signal conductor throughout the transition area.

[0162] In addition, as in Fig. 10A and Fig. 10C As can be seen in FIG. 1 , the mating ends 262a and 262b are formed by rolling a conductive material of a metal sheet from which the signal conductor 260 is formed into a generally tubular configuration. The material is rolled toward a centerline between the mating ends 262a and 262b. Such a configuration allows the flat surface of the signal conductor to face outward toward the shield member, which may help maintain a constant spacing between the signal conductor and the shield member, even in a torsion region.

[0163] It should be understood that the spacing between the signal conductors 260a and 260b can be substantially constant in units of distance. Alternatively, the spacing can provide a substantially constant impedance. In this case, for example, where the signal conductor is wider, such as due to being rolled into a tube, the spacing relative to the shield can be adjusted to ensure that the impedance of the signal conductor is substantially constant.

[0164] Fig.17A is a side view of a portion of an alternative connector module 1700 that may be included in an electrical connector according to some embodiments. Fig. 17B yes Fig.17A 1700. In some embodiments, the connector module 1700 may include a connector as described herein. FIG. 6B to FIG. 10C The connector module 200 may be configured in the manner described above. Fig.17A and Fig. 17B In the embodiment, the connector module 1700 includes FIG. 17A to FIG. 17B 1706a and 1706b, the electromagnetic shield members 1710a and 1710b including the electromagnetic shield tail 1720, the outer insulating members 1780a and 1780b, the inner insulating member 1730, and the signal conductors 1760a and 1760b having the contact tails 1706a and 1706b. The signal conductors 1760a and 1760b are further described herein, including the combination FIG. 19A to FIG. 21B Signal conductors 1760a and 1760b are further depicted.

[0165] like Fig.17AAs shown, electromagnetic shielding members 1710a and 1710b may include grooves 1712 that protrude toward signal conductors 1760a and 1760b. In some embodiments, grooves 1712 may provide a closer spacing between electromagnetic shielding members 1710a and signal conductors 1760a. In some embodiments, grooves 1712 may extend parallel to signal conductors 1760a and 1760b, for example Fig.17A As shown, the groove 1712 is shown following the right angle bend of the signal conductor 1760a.

[0166] In some embodiments, the connector module 1700 may include one or more insulating members configured to control the rotation of the contact tails 1706a and 1706b when the contact tails 1706a and 1706b are compressed. The contact tails 1706a and 1706b may include a serpentine portion (e.g., serpentine portion 2101, Fig.21A ), which has segments that are compressed together when the contact tails are compressed. The inventors have recognized that compression such that each segment contacts its adjacent segments results in desired electrical characteristics, and have further recognized that controlling the rotation of the contact tails 1706a and 1706b can prevent compression and / or stress on the contact tails 1706a and 1706b that might otherwise prevent the contact tails from compressing into a state having desired electrical characteristics. In some embodiments, the insulating member of the connector module 1700 can be configured to control the contact tails 1706a and 1706b to rotate in the same direction when compressed. In some embodiments, and as further described herein, including in combination Fig.21A and Fig.21B As further described, the contact tails 1706a and 1706b can be configured to rotate against the substrate about the insertion axis while being compressed against the substrate along the insertion axis.

[0167] In some embodiments, the insulating member of the connector module 1700 may include a protrusion configured to abut the contact tails 1706a and 1706b when the contact tails 1706a and 1706b are rotated about the insertion axis toward the protrusion. Fig. 17B As shown, the outer insulating member 1780 includes protrusions 1784a and 1784b that protrude toward the contact tails 1706a and 1706b, respectively. Fig. 17BAs also shown in FIG. 1 , inner insulating member 1730 includes protrusions 1738a and 1738b that protrude toward signal conductors 1706a and 1706b, respectively. In the example shown, protrusion 1784a is offset from protrusion 1738a in a direction perpendicular to the direction in which contact tail 1706a is spaced from contact tail 1706b. In the configuration shown, contact tails 1706a and 1706b can be configured to move in the same direction (e.g., about the insertion axis) when inserted against the substrate along the insertion axis. Fig. 17B counterclockwise in the direction of rotation.

[0168] It should be understood that in some embodiments, protrusion 1784a can be aligned with protrusion 1738a, protrusion 1738b and / or protrusion 1784b, but the embodiments described herein are not limited in this regard.

[0169] Fig.18 is a structure in which the electromagnetic shielding member 1710a is cut away Fig.17A A side view of a portion of the connector module 1700 is shown. Fig.18 , the outer insulation member 1780a includes a groove 1782, which may be configured to receive the groove 1712 of the electromagnetic shielding member 1710a.

[0170] Fig.19A The electromagnetic shielding member 1710a and the outer insulating member 1780a are cut away. Fig.17A A side view of a portion of connector module 1700 is shown. Fig.19B is a perspective view of connector module 1700. Fig.19A and Fig.19B The signal conductor 1760a and the compliant portion 266a of the signal conductor 1760a are shown positioned in the groove of the inner insulating member 1730. Fig.19A , the intermediate portion 1764a of the signal conductor 1760a is shown as being circularly facing the right-angle bend. Fig.19A A portion of a compliant receptacle 1770a that serves as a mating end for signal conductor 1760a is also shown, and compliant receptacle 1770a may be configured in the manner described herein with respect to compliant receptacle 270a of connector module 200. Fig.19A and Fig.19B, the inner insulating member 1730 is shown to include a protrusion 1732, retaining members 1734a and 1734b, and protrusions 1736a, 1736b, and 1738a configured to engage the signal conductor 1760a. In some embodiments, the retaining members 1734a and 1734b and the protrusions 1736a, 1736b, and 1738a can be configured to control the rotation of the contact tail 1706a around the insertion axis when the contact tail 1706a is compressed along the insertion axis.

[0171] Fig. 20 The electromagnetic shielding member 1710a, the outer insulating member 1780a and the signal conductor 1760a are cut away. Fig.19B A perspective view of a portion of the connector module 1700. Fig. 20 As shown, in some embodiments, the protrusions 1736a, 1736b, and 1738a can extend along the contact tail 1706a in the elongated direction of the contact tail 1706a.

[0172] Fig.21A is a perspective view of a portion of the signal conductor 1760a of the connector module 1700. Fig.21B is a side view of a compliant portion 1766a of a signal conductor 1760a. In some embodiments, the compliant portion 1766a may include a combination of Fig. 10B The compliant portion 266a may be configured in the manner described above. Fig.21A and Fig.21B , the compliant portion 1766a includes a serpentine portion 2101, a first bend 2102, a second bend 2104, and a tab 2106. In some embodiments, similar to the compliant portion 266a, the compliant portion 1766a can be configured to compress in a direction in which the signal conductor 1760 elongates about the compliant portion 1766. In some embodiments, the compliant portion 1766a can rotate (e.g., about the axis 2152a) when compressed.

[0173] exist Fig.21A and Fig.21B In an embodiment, the serpentine 2101 resembles a ladder, wherein the track is cut on alternating sides between each rung. The cut track is bent into tabs 2106, which are inclined in opposite directions on opposite sides. In this configuration, when the contact is compressed, each rung and a section of track on one side can be compressed backward toward the track behind the cut rung. The rear edge of the cut rung is pushed out of the contact plane as it travels along the inclined portion of the tab 2106 behind it. When the tab is inclined in the opposite direction, the opposite side of the contact will deflect in the opposite direction perpendicular to the plane of the undeflected contact, thereby rotating the contact.

[0174] In contrast to the sharp tip 1050a of the compliant portion 266a, the compliant portion 1766a includes a rounded tip 2150a, which in some embodiments can include gold plating. In some embodiments, the rounded tip 2150a can be configured to physically contact the conductive pad on the substrate over a larger area, thereby making it easier to land the rounded tip 2150a on the conductive pad during installation and also reducing the impedance of the mounting interface between the connector module 1700 and the conductive pad.

[0175] In some embodiments, the compliant portion 1766a can have fewer than 6 bends. The inventors have recognized that it is advantageous to include a small number of bends in the compliant portion because doing so makes the mounting interface more reliable. For example, in some embodiments, the failure of a pair of adjacent bends of the compliant portion to contact each other can result in an impedance increase of up to 7 ohms (Ω), which can create an impedance mismatch problem. By including fewer bends in the compliant portion, such as fewer than 8 bends, fewer than 7 bends, or fewer than 6 bends, the fewer bends of the compliant portion may not contact each other, thereby reducing the possibility of such impedance discontinuity at the mounting interface.

[0176] In some embodiments, the angle at which the tabs 2106 of the compliant portion 1766 are inclined relative to the uncompressed plane of the contact can reduce the average magnitude and variability of any impedance discontinuity. In some embodiments, each of the tabs 2106 can be inclined relative to the axis 2152a at an angle less than 45 degrees. For example, by reducing the angle at which the spring portion of the compliant portion 1766a is bent, such as less than 45 degrees, less than 35 degrees, or 30 degrees, when the compliant portion 1766 is compressed, the spring portion 2106 will be less likely to contact the adjacent bend of the compliant portion 1766, thereby further reducing the possibility of impedance discontinuity when the connector module 1700 is mounted to a substrate. According to some embodiments, the tabs 2106 can be inclined at an angle between 20 degrees and 45 degrees in absolute value, or in some embodiments, between 25 degrees and 40 degrees.

[0177] Return to Fig. 10A , the signal conductors 260a and 260b in each module are shown as being broadside coupled. In a right-angle connector, broadside coupling of the signal conductors of each differential pair (aligned in a row direction parallel to the edge of the PCB to which the connector is mounted) can provide desired electrical performance. Alignment in the row direction allows the two signal conductors in each pair to have the same length. In contrast, a pair of signal conductors aligned in the column direction may require signal conductors of different lengths, which may result in skew within the pair. Since skew within a pair may degrade signal integrity, alignment of a pair of signal conductors in the row direction can promote signal integrity. As shown, for example in Fig. 6A and Figure 6B In one embodiment, a connector module as described herein may be incorporated into a connector wherein broadside coupled signal couplings are aligned in the row direction.

[0178] However, the inventors have recognized and understood that, using conventional connector installation techniques, the configuration of the connector footprint for effectively routing traces out of the PCB to which such a connector is mounted may be incompatible with the signal conductors coupled to the broadside within the connector. An effective configuration of the PCB may have paired signal vias aligned in a vertical direction perpendicular to the edge of the PCB. Typically, in an electronic system, a connector is mounted to the edge of a PCB, and other components to which the connector is connected via traces in the PCB are mounted inside the PCB. In order to connect between the connector and these components, the traces within the PCB may be routed from vias that are coupled to the signal conductors of the connector in a direction perpendicular to the edge of the PCB. However, for the connector footprint, the traces are typically routed in a routing channel parallel to the direction in which the signal vias are separated. Such routing is caused by the separation of the vias to which the signal conductors are attached in the same direction as the signal conductors.

[0179] Typically, the ends of the signal conductors in the connector are aligned with the vias in the PCB to which the connector is mounted. For connectors with broadside coupled signal conductors in each pair aligned in the row direction, the corresponding signal vias in the PCB extend in a direction parallel to the edge rather than perpendicular to the edge. Therefore, achieving low-skew broadside coupling in the connector typically results in routing channels within the connector footprint being parallel to the edge, which may not be efficient for certain systems.

[0180] The inventors have recognized and appreciated that, although a broadside coupled connector has signal conductors in each pair separated in the row direction, the signal vias coupled to those signal conductors can be positioned for a more efficient routing channel perpendicular to the edge. This configuration can be achieved by a shift in the orientation of the signal conductors within the top layer of the PCB.

[0181] FIG. 11A to FIG. 11C 1 and 10 are side perspective, top perspective, and top views, respectively, of a portion of a substrate 1100 configured to receive an electrical connector using edge-to-pad mounting for signal conductors. For example, the substrate 1100 may be configured to connect to a FIG. 3A to FIG. 3D The electrical connector 302a or 302b. Fig.11A , Fig. 11B and Fig. 11C The portion shown in the figure may correspond to a structure in the substrate that connects the tail of the signal conductor and the shield of the connector module. Therefore, the portion shown may correspond to the footprint of one module and may be replicated for each similar module of the connector mounted to the substrate.

[0182] In some embodiments, substrate 1100 may be a printed circuit board. Fig.11A , Fig. 11B and Fig. 11C Only two layers of the printed circuit board implementing the transition region are shown. The printed circuit board may have other layers on which signal traces are routed and other ground layers separating these layers, which are not shown for simplicity.

[0183] The substrate 1100 includes a first conductive layer 1102 and a second conductive layer 1104 separated from the first conductive layer 1102 by an insulating layer 1101. For example, the first conductive layer 1102 and the second conductive layer 1104 may be disposed on opposite surfaces of the insulating layer 1101. The substrate 1100 may also include one or more through holes, such as through holes 1108 and 1112. The substrate 1100 may include FIG. 11A to FIG. 11C The array of portions shown in FIG. 1 and / or additional conductive layers such as a third conductive layer, as described herein, including reference to Figures 12A to 12D Described.

[0184] The conductive layers of substrate 1100 may be configured to couple to an electrical connector. For example, first conductive layer 1102, which may be the topmost layer of substrate 1100, includes conductive contact pads 1106 that may be configured to attach to and / or electrically connect to contact tails of an electrical connector. FIG. 11A to FIG. 11C As shown, the contact pad 1106 can be configured to receive a pair of contact tails carrying differential signal components and provide the differential signal components to the through hole 1108. In this example, the contact pad 1106 can be positioned to align with the distal edges of the contact tails of a pair of signal conductors configured for broadside coupling in a connector, such as FIG. 10A to FIG. 10C As shown. The contact pads 1106 may be exposed to facilitate physical contact between the contact pads 1106 and the contact tails of the connector when installed. The contact pads may be plated with gold or other precious metals, or other oxidation-resistant plating, to achieve a reliable pressure-mounted connection.

[0185] In one example, the contact tails of the connector may be pressure mounted to the contact pads 1106 (eg, FIG. 10A to FIG. 10C In another example, the contact tail of the connector can be soldered to the contact pad 1106 using a butt joint. In some embodiments, the diameter of the contact pad 1106 can be between 10 mils and 14 mils, or in some embodiments between 11 mils and 13 mils.

[0186] Portions of the first conductive layer 1102 may be configured to contact the ground structure of the connector mounted to the substrate 1100. For example, some positions of the ground plane portion 1114 may be configured to receive the electromagnetic shielding tail of the electrical connector. When the connector is installed, such a portion may be exposed to facilitate physical contact between the exposed portion and the shielding tail. In the illustrated embodiment, connection is made with a press-fit contact tail extending from the shield of each module. The shielding contact tail may be inserted into the through hole 1112.

[0187] The ground plane portion 1114 can be electrically connected to the through hole 1112, so that the through hole 1112 is a ground through hole. The signal through hole 1108 can be electrically isolated from the ground portion 1114. As shown, the through hole 1108 is within the opening of the ground plane portion 1114. Similar openings in other ground plane layers within the printed circuit board can be arranged concentrically with the signal through hole 1108, which can separate the through hole 1108 from the ground structure of the substrate 1100. In contrast, the ground through hole 1112 can be electrically coupled to the second conductive layer 1104, which can also be grounded. In some embodiments, the ground through hole 1112 can have a drill diameter less than 16 mils but greater than 10 mils to accommodate a press fit.

[0188] The signal via 1108 can be electrically coupled to a third conductive layer and / or another conductive layer of the substrate 1100, which can be used as a signal routing layer. FIG. 12A to FIG. 12D ) can be positioned adjacent to the second conductive layer 1104, for example with a second insulating layer positioned between the second conductive layer and the third conductive layer, or an additional insulating layer can be positioned between the second conductive layer and the third conductive layer.

[0189] In some embodiments, the through hole 1108 can have a drilled diameter of less than 10 mils. In some embodiments, the through hole 1108 can have a drilled diameter between 7 mils and 9 mils. FIG. 11A to FIG. 11C As shown, the contact pads 1106 are spaced apart from each other along a first line 1140, and the through holes 1108 are spaced apart from each other along a second line 1142. In some embodiments, the first line 1140 and the second line 1142 can be arranged at an angle of at least 45 degrees relative to each other. FIG. 11A to FIG. 11C 1, the first line 1140 and the second line 1142 are perpendicular to each other. For example, the line 1140 can be parallel to the edge of the PCB adjacent to the illustrated footprint. The line 1142 can be perpendicular to the edge.

[0190] Conductive trace 1110 connects contact pad 1106 to via 1108. In the illustrated embodiment, conductive trace 1110 is elongated at an angle of approximately 45 degrees relative to second line 1142. Conductive trace 1110 can be used to gradually transition the relative positioning of contact pad 1106 to the relative positioning of via 1108. Portion 1118 of second conductive layer 1104 can be positioned adjacent to conductive trace 1110, with insulating layer 1101 separating portion 1118 from conductive trace 1110.

[0191] In some embodiments, the second conductive layer 1104 can be spaced within a few millimeters of the first conductive layer 1102 to provide a ground reference for the conductive trace 1110. Portion 1118 can accommodate the transition from the relative positioning of the contact pad 1106 to the relative positioning of the through hole 1108. The ground reference - coupled to both the shield within the connector that serves as a reference for the signal conductors in the connector and the ground plane that serves as a ground reference for the traces within the substrate - enables continuity of the ground current referenced to the path carrying the differential signal throughout the transition. This ground reference further facilitates the transition of the signal path without mode conversion or other undesirable signal integrity characteristics. Avoiding mode conversion for each pair of connector modules having a shield can avoid exciting resonances within the shield of the module and provide improved signal integrity. In addition, the straight-through configuration of the mounting end of the signal conductor (e.g., as described above) Fig. 10A ) enables the maximum dimension of the shield to be smaller than that of a module including transitions or other geometric changes. In the illustrated embodiment, for each connector module, the shield can be substantially square. Such a configuration can provide high frequencies of the lowest resonant modes supported by the shield, which further facilitates high frequency operation of the connector.

[0192] For example, the signal conductors of the mounted connector can be broadside coupled to each other adjacent to the substrate 1100, with the signal conductors spaced apart from each other along the first line 1140. Rather than transitioning the broadside coupled signal conductors to edge coupled contact tails for mounting to the substrate 1100, the connector can have broadside coupled contact tails and the transition can be made using traces 1110 so that the signals are edge coupled at the vias 1108. In some embodiments, the electrical connector mounted to the substrate 1100 can transmit differential signals with a pull-out loss of less than -40 dB over a frequency range of 25 GHz to 56 GHz.

[0193] FIG. 12A to FIG. 12D Shown include FIG. 11A to FIG. 11C Portions of an exemplary substrate 1200 of an array of portions of substrate 1100 are shown. Fig. 12A is a top view of the first conductive layer 1202 of the substrate 1200, Fig. 12Bis a top view of the second conductive layer 1204 of the substrate 1200, Fig. 12C is a top view of the third conductive layer 1220 of the substrate 1200, and Fig.12D is a cross-sectional view of a portion of substrate 1200 showing insulating layer 1201 and conductive layers 1202 , 1204 , and 1220 .

[0194] exist Fig. 12A In the embodiment, the first conductive layer 1202 includes a connector footprint having regions arranged in rows along a row direction 1240 and in columns along a column direction 1242. Each region of the connector footprint may include FIG. 11A to FIG. 11C The conductive layer 1102 is shown as a portion. Fig. 12A As shown, each region includes a pair of signal vias 1208 and a pair of conductive contact pads 1206, and a trace 1210 interconnecting one of the pair of signal vias 1208 with one of the pair of contact pads 1206. The vias 1208, the contact pads 1206, and the traces 1210 may be referred to herein as FIG. 11A to FIG. 11C The conductive layer 1202 is also shown as including ground vias 1212. Fig. 12B A second conductive layer 1204 is shown, which is disposed on a side of the insulating layer 1201 opposite to the first conductive layer 1202 .

[0195] For example, the spacing between the through holes 1208 and / or the grounding through holes 1212 on the substrate 1200 can be adapted to match the spacing of the paired contact tails and / or electromagnetic shielding tail pairs of the electrical connector 102. Therefore, tighter spacing between signal conductors and / or smaller spacing between signal conductors and ground conductors will produce a more compact footprint. Alternatively or additionally, more space will be available for wiring channels. In addition, tighter spacing can reduce the maximum size of the shielding shell of the module to be installed in the footprint, thereby increasing the operating frequency range of the connector.

[0196] In some implementations, the contact tails of the electrical connector 102 (or 302a, 302b, etc.) may be implemented with a superelastic conductive material, which may enable smaller vias and tighter spacing between adjacent pairs than conventional contact tails.

[0197] This close spacing can be achieved with thin contact tails, such as can be achieved with, for example, a superelastic wire having a diameter of less than 10 mils. In some embodiments, the contact tails of the connectors described herein can be configured to be inserted into a plated hole formed with an unplated diameter of less than or equal to 20 mils. In some embodiments, the contact tails can be configured to be inserted into a through hole drilled with an unplated diameter of less than or equal to 10 mils. In some embodiments, the contact tails can each have a width between 6 mils and 20 mils. In some embodiments, the contact tails can each have a width between 6 mils and 10 mils, or in other embodiments, the contact tails can each have a width between 8 mils and 10 mils. In some embodiments, each area of ​​the connector footprint can have a width of less than 2.5 mm. 2 For example, columns of connector footprints may be separated by less than 2.5 mm center-to-center in the column direction 1242 , and rows of connector footprints may be separated by less than 2.5 mm center-to-center in the row direction 1240 .

[0198] Fig. 12C A third conductive layer 1220 is shown, which may be a wiring layer of the substrate 1220. For example, Fig.12D As shown in the schematic cross-section of , some or all of the signal vias 1208 can be connected to the third conductive layer 1220, and traces 1230 can route signals from the vias 1208 to other portions of the substrate 1220. For example, the third conductive layer can support connection to one or more electronic devices (e.g., a microprocessor and / or memory device) and / or other electrical connectors (mounted in the central portion of the PCB and to which the traces 1230 can be connected). The signal vias 1208 can terminate at the wiring layer to which they are connected. This configuration can be achieved by back-drilling the portion of the signal via that extends beyond the wiring layer. The ground via 1212 can also extend partially into the PCB, such as only to the extent required to accommodate a press-fit. However, in other embodiments, the signal vias and / or ground vias can be larger than the ground vias. Fig.12D The shown extends further into the PCB.

[0199] like Fig. 12C As shown, traces 1230 may extend between pairs of vias 1208 in adjacent columns along a column direction 1242, perpendicular to an edge 1209 of the board adjacent to the connector footprint. Fig. 12C As can be seen in FIG. 1 , each routing layer supports a routing channel wide enough to route two pairs of traces through the channel. In some embodiments, the connector footprint may have one routing layer for every two rows that must be routed out of the footprint. Since adding routing layers to a printed circuit board may increase cost, efficient routing of two rows per layer may result in a lower cost PCB.

[0200] Fig. 22 2202 is a top view of a portion of an alternative substrate configured to receive a portion of an electrical connector according to some embodiments. In some embodiments, the conductive layer 2202 may be formed as described herein. FIG. 12A to FIG. 12C For example, in some embodiments, the substrate including the conductive layer 2202 may further include a second conductive layer and / or a third conductive layer, wherein the second conductive layer may be configured in a manner described herein in conjunction with the conductive layer 2202. Fig. 12B The third conductive layer is configured in the manner described for the second conductive layer 1204, and the .... Fig. 12C The third conductive layer 1220 is configured in the manner described above.

[0201] like Fig. 22 As shown, the conductive layer 2202 includes a connector footprint having areas arranged in rows along a row direction 2240 and in columns along a column direction 2242 . Fig. 22 Each region is shown to include a pair of signal vias 2208 and a pair of conductive contact pads 2206, and a trace 2210 interconnecting one of the pair of signal vias 2208 with one of the pair of contact pads 2206. Conductive layer 2202 is also shown to include ground vias 2212. Fig. 22 As also shown in FIG. 2 , the conductive layer 2202 includes auxiliary vias 2214 located on three sides of the signal via 2208. In some embodiments, the auxiliary vias 2214 can be configured to provide additional electromagnetic shielding between adjacent pairs of signal vias 2208. For example, the auxiliary vias 2214 can extend from the conductive layer 2202 to the second conductive layer and / or the third conductive layer of the substrate. In some embodiments, the auxiliary vias 2214 can have a smaller diameter than the ground vias 2212, which can allow the auxiliary vias 2214 to be positioned at locations that are too small to accommodate the ground vias 2212. For example, in some embodiments, the ground vias 2212 can have a drill diameter less than 16 mils and greater than 10 mils, and the auxiliary vias 2214 can have a drill diameter less than 10 mils, such as less than 8 mils and greater than 5 mils.

[0202] Fig.23 Yes Fig. 22 A top view of an area of ​​substrate 2200 having conductive layer 2202. Fig.23 In the embodiment, the conductive layer 2202 further includes a conductive trace 2230, which may include a conductive trace 2230 in combination with Fig. 12C For example, in some embodiments, trace 2230 can be disposed on the third conductive surface of substrate 2200 and include a Fig. 22The conductive layer 2202 is shown extending through the signal via 2208. Fig.23 As shown, the second conductive layer of the substrate 2200 including the ground plane is hidden from view to illustrate the positioning of the trace 2230 relative to the signal via 2208, the ground via 2212, and the auxiliary via 2214. For example, in Fig.23 , the trace 2230 is routed between two ground vias 2212 and then between the ground via 2212 and the auxiliary via 2214. In some embodiments, the illustrated configuration can provide increased shielding for the trace 2230.

[0203] FIG. 13A to FIG. 13B A portion of an electronic assembly 1300 including an electrical connector and substrate 1100 is shown. Fig.13A 13 is an exploded view showing the contact tails 1312 of the electrical connector away from the substrate 1100 . Fig. 13B The contact tail 1312 is shown with the contact pad 1106 and connected to the through hole 1108 of the substrate 1100. The contact tail 1312 can be configured for edge-to-pad mounting. In some embodiments, the contact tail 1312 can be configured for pressure mounting. In some embodiments, the contact tail 1312 can be configured to mount the contact pad 1106 using a butt joint that is welded in place.

[0204] Using this edge-to-pad connection for the signal conductors in each pair enables broadside coupling within a compact shield. FIG. 14A to FIG. 14B This is a partial exploded view. FIG. 14C to FIG. 14D is a perspective view of the electronic component 1300 with a portion of the shield member 1320 cut away. FIG. 14A to FIG. 14B Also shown is a shield member 1320 of the electrical connector, which is disposed around the contact tails 1312. For example, the shield member 1320 and the contact tails 1312 can be part of the same connector module of the electrical connector. Fig.14A In FIG. 1 , the shield member 1320 is shown separated from the substrate 1100, while the contact tails 1312 are shown pressed against the contact pads 1106 of the substrate 1100. Fig. 14B 13, shield member 1320 and contact tail 1311 are both shown as being separated from substrate 1100. In each case, the distal portion of the contact tail extending from shield member 1322 is not shown. The distal end can be a press fit as described above. Alternatively or additionally, the distal end can be electrically connected to a ground structure in substrate 1100 in other ways, such as using a pressure mount or surface mount soldering.

[0205] Fig.14A and Fig. 14BA single shield member 1320 is shown surrounding the pair of signal conductors. The shield around each differential pair may be interrupted by one or more slots such as slot 1450 over some or all of the length of the signal conductors. Here, the slots are shown aligned with the midpoints of the differential pairs. Such slots may be formed, for example, by cutting away material from a monolithic member. Alternatively or additionally, the slots may be formed by forming the shield member 1320 into multiple pieces that collectively partially surround the pair, leaving the slots as shown.

[0206] exist Fig. 14C , a portion of the shield member 1320 is cut away, showing that the shield tail 1322 of the shield member 1320 is connected to the portion 1114 of the substrate 1100, which may be a ground plane.

[0207] exist Fig.14D , a portion of the shield member 1320 and half of each contact tail 1312 are cut away, showing that the contact tail 1312 is connected to the contact pad 1106 .

[0208] Fig.15 Shown is a header connector 2120 that can be mounted to a printed circuit board formed with a module 2130, for example, which can be formed using the construction techniques described above. In this example, the header connector 2120 has a mating interface identical to the mating interface of the connector 102a. In the illustrated embodiment, both have mating ends of paired signal conductors aligned along parallel lines at 45 degree angles relative to the column direction and / or row direction of the mating interface. Therefore, the header connector 2120 can be mated with a connector in the form of a connector 102b.

[0209] However, the mounting interface 2124 of the header connector 2120 is in a different orientation relative to the mating interface than the mounting interface of the connector 102a. Specifically, the mounting interface 2124 is parallel to the mating interface 2122 rather than perpendicular to the mating interface 2122. Nevertheless, the mounting interface can include an edge-to-pad connection between a signal conductor and a substrate such as a PCB. The signal conductor can support broadside coupling so that the shield can be configured to suppress low frequency resonances as described above.

[0210] The head connector 2120 can be suitable for use in a backplane, a midplane, a mezzanine, and other such configurations. For example, the head connector 2120 can be mounted to a backplane, a midplane, or other substrates, which are perpendicular to a daughter card or other printed circuit board to which a right-angle connector such as connector 102b is attached. Alternatively, the head connector 2120 can receive a mezzanine connector having the same mating interface as connector 102b. The mating end of the mezzanine connector can face a first direction, and the contact tail of the mezzanine connector can face a direction opposite to the first direction. For example, the mezzanine connector can be mounted to a printed circuit board that is parallel to the substrate on which the head connector 2120 is mounted. In some embodiments, the contact tail of the head connector 2120 can be configured to compress in the direction in which the head connector 212 is attached or mounted to the substrate.

[0211] exist Fig.15 In the embodiment shown in FIG. 2 , the header connector 2120 has a housing 2126 that can be formed of an insulating material such as molded plastic. However, some or all of the housing 2126 can be formed of a lossy or conductive material. The bottom plate of the housing 2126 through which the connector module passes can, for example, be formed of or include a lossy material that is coupled to an electromagnetic shield of the connector module 2130. As another example, the housing 2126 can be a die-cast metal or a metal-plated plastic.

[0212] The housing 2126 may have features that enable mating with the connector. In the illustrated embodiment, the housing 2126 has features that enable mating with the connector 102b, similar to the housing 120. Thus, the portion of the housing 2126 that provides the mating interface is as described above in conjunction with the housing 120 and the connector 102b. Figure 2A The mounting interface 2124 of the housing 2126 is suitable for mounting to a printed circuit board.

[0213] Such a connector can be formed by inserting connector modules 2130 in rows and columns into housing 2126. Each module can have mating contact portions 2132a and 2132b, which can be shaped similarly to mating portions 304a and 304b, respectively. Mating contact portions 2132a and 2132b can be similarly made of small diameter superelastic wire.

[0214] The modularity of the components as described herein can support other connector configurations using the same or similar components. Those connectors can be easily configured to mate with the connectors as described herein. For example, Fig.16A modular connector is shown in which some of the connector modules are configured for terminating cables, such as twin-axial cables, rather than having contact tails configured for mounting to a printed circuit board. However, those portions of the connector configured for mounting to a PCB can use the edge-to-pad mounting techniques described herein for high frequency operation.

[0215] exist Fig.16 In the example of , the connector has a wafer assembly 2204, a cable wafer 2206, and a housing 2202. In this example, the cable wafer 2206 can be positioned side by side with the wafer in the wafer assembly 2204 and inserted into the housing 2202 in the same manner as the wafer is inserted into the housing 110 or 120 to provide a mating interface with a socket or pin, respectively. In an alternative embodiment, Fig.16 The connector can be a hybrid cable connector as shown, having a side-by-side wafer assembly 2204 and a cable wafer 2206, or in some embodiments, having some modules in the wafer configured for attachment to a tail of a printed circuit board and other modules having a tail configured for terminating a cable.

[0216] Through the cable configuration, signals passing through the mating interface of the connector can be coupled to other components within the electronic system that includes the connector 2200. Such an electronic system may include a printed circuit board to which the connector 2200 is mounted. Signals passing through the mating interface in the module mounted to the printed circuit board can be transferred to other components also mounted to the printed circuit board via traces in the printed circuit board. Other signals passing through the mating interface in the cable modules can be routed to other components in the system via cables terminated to those modules. In some systems, the other ends of those cables may be connected to components on other printed circuit boards that cannot be reached via traces in the printed circuit board.

[0217] In other systems, those cables may be connected to components on the same printed circuit board where other connector modules are mounted. Such a configuration may be useful because connectors as described herein support signals having frequencies that can reliably traverse a printed circuit board only on relatively short traces. High frequency signals, such as signals carrying 56 Gbps or 112 Gbps, are significantly attenuated in traces on the order of 6 inches long or longer. Therefore, a system may be implemented in which a connector mounted to a printed circuit board has cable connector modules for such high frequency signals, wherein the cables terminated to those cable connector modules are also connected at the midplane of the printed circuit board, such as 6 inches or more from an edge or other location on the printed circuit board where the connector is mounted. In some embodiments, Fig.16The contact tails of the connector may be configured to be compressed in a direction in which the connector is mounted or attached to a substrate.

[0218] exist Fig.16 In the example of , the pairs at the mating interface do not rotate relative to the row direction or the column direction. However, a connector with one or more cable sheets can be achieved by rotating the mating interface as described above. For example, the mating ends of paired signal conductors can be arranged at a 45 degree angle relative to the mating row direction and / or the mating column direction. The mating column direction for the connector can be a direction perpendicular to the board mounting interface, and the mating row direction can be a direction parallel to the board mounting interface.

[0219] Furthermore, it should be understood that although Fig.16 The cable connector modules are shown to be in only one slice and all slices have only one type of connector module, but neither is a limitation of the modular technology described herein. For example, the connector modules of the top row or the connector modules of the row can be cable connector modules, while the remaining rows can have connector modules configured for mounting to a printed circuit board.

[0220] Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art.

[0221] For example, FIG. 6B to FIG. 10C The connector module 200 in FIG. 17 is shown to include a signal conductor 260 and an electromagnetic shielding member 210, the signal conductor 260 includes a compliant portion 266, the electromagnetic shielding member 210 includes an electromagnetic shielding tail 220 configured as a press-fit end, and FIG. Fig.21B The connector module 1700 in is shown as including a signal conductor 1760 and an electromagnetic shield member 1710, the signal conductor 1760 including a compliant portion 1766, and the electromagnetic shield member 1710 including an electromagnetic shield tail 1720 configured as a press-fit end. However, it should be understood that the electromagnetic shield tail 220 and / or 1720 may alternatively or additionally include a compliant portion (e.g., configured in the manner described herein for the compliant portion 266 and / or 1766). According to various embodiments, the connector module described herein may include a compliant signal portion and a press-fit shield tail, a compliant shield tail and a press-fit signal portion, and / or a compliant shield tail and a compliant signal portion.

[0222] Such changes, modifications and improvements are intended to be part of this disclosure and are intended to fall within the spirit and scope of the present invention. In addition, although the advantages of the present invention are pointed out, it should be understood that not every embodiment of the present invention will include each described advantage. Some embodiments may not implement and may not implement any feature described as advantageous in this article in some cases. Therefore, the above description and accompanying drawings are only examples.

[0223] The various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the previously described embodiments, and therefore the various aspects of the present invention are not limited in their application to the details and arrangements of the components set forth in the previous description or shown in the accompanying drawings. For example, the various aspects described in one embodiment may be combined in any manner with the various aspects described in other embodiments.

[0224] In addition, the present invention can be implemented as a method that provides an example. The actions performed as part of the method can be ordered in any suitable manner. Therefore, the following embodiments can be constructed, in which the actions are performed in an order different from the order shown, even if shown as sequential actions in illustrative embodiments, the embodiments can still include performing some actions simultaneously.

[0225] The use of ordinal terms such as "first", "second", "third", etc. in the claims to modify claim elements does not itself mean any priority, precedence or order of one claim element relative to another claim element or the temporal order of the actions of performing the method, but is merely used as a mark to distinguish one claim element with a certain name from another element with the same name (but using ordinal terms), thereby distinguishing the elements of the claim.

[0226] As defined and used herein, all definitions should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0227] Unless explicitly indicated to the contrary, the indefinite articles "a" and "an" as used herein in the specification and claims should be understood to mean "at least one".

[0228] As used herein in the specification and claims, the phrase "at least one" when referring to a list of one or more elements should be understood to mean at least one element selected from any one or more elements in the list of elements, but not necessarily including each and every element specifically listed in the list of elements, and not excluding any combination of elements in the list of elements. This definition also allows that elements other than the elements specifically identified in the list of elements to which the phrase "at least one" refers may optionally be present, whether related or unrelated to those elements specifically identified.

[0229] As used herein in the specification and claims, the phrase "and / or" should be understood to mean "either or both" of the elements so combined, i.e., elements that exist in combination in some cases and separately in other cases. Multiple elements listed with "and / or" should be interpreted in the same way, i.e., "one or more" of the elements so combined. In addition to the elements explicitly identified by the "and / or" clause, other elements may optionally be present, regardless of whether they are related or unrelated to those elements explicitly identified. Thus, as a non-limiting example, when used with an open-ended term such as "including", a reference to "A and / or B" may refer to only A (optionally including elements other than B) in one embodiment; to only B (optionally including elements other than A) in another embodiment; to both A and B (optionally including other elements) in yet another embodiment; and so on.

[0230] As used herein in the specification and claims, "or" should be understood to have the same meaning as "and / or" as defined above. For example, when separating items in a list, "or" or "and / or" should be understood to be inclusive, i.e., including at least one of a plurality of elements or lists of elements, but also including more than one of a plurality of elements or lists of elements, and optionally including other unlisted items. Only explicitly indicating the opposite terms such as "only one of ... " or "just one of ... " or when used in the claims, "consisting of ... " will refer to including exactly one element in a plurality of elements or lists of elements. In general, the term "or" as used herein should only be interpreted as indicating exclusive alternatives (i.e., "one or the other, but not both") before exclusive terms such as "any one", "one of ... ", "only one of ... " or "just one of ... ". When used in the claims, "consisting essentially of ... " should have its ordinary meaning used in the field of patent law.

[0231] In addition, the words and terms used herein are for descriptive purposes and should not be considered as limiting. The use of "includes," "comprising," or "having," "containing," "involving," and variations thereof herein is intended to encompass the items listed thereafter and their equivalents and additional items.

[0232] The present invention provides the following inventive concepts:

[0233] 1. An electrical connector, comprising:

[0234] a pair of signal conductors having contact tails adapted to connect to a surface of the substrate in an insertion direction,

[0235] Wherein the contact tail is configured to be compressed in the insertion direction when mounted to the surface of the substrate.

[0236] 2. The electrical connector according to Inventive Concept 1, wherein the contact tail is configured to rotate when compressed.

[0237] 3. The electrical connector according to inventive concept 1, wherein each of the contact tails includes a portion having a first bend adjacent to a second bend,

[0238] Wherein, the part is configured such that:

[0239] Before the contact tail is mounted to the surface, the first bend and the second bend are spaced apart from each other by a first distance in the insertion direction; and

[0240] When the contact tail is mounted to the surface, the first bend and the second bend are spaced apart from each other by a second distance in the insertion direction, the second distance being shorter than the first distance.

[0241] 4. The electrical connector according to inventive concept 3, wherein:

[0242] The portions are configured such that when the first bend and the second bend are spaced apart from each other by the second distance, the first bend and the second bend are in physical contact with each other.

[0243] 5. The electrical connector according to inventive concept 4, wherein:

[0244] The parts are configured such that:

[0245] When the first bent portion and the second bent portion are spaced apart from each other by the first distance, the first bent portion and the second bent portion are electrically coupled to each other through a third bent portion; and

[0246] The physical contact of the first bend and the second bend shorts the third bend.

[0247] 6. An electrical connector including a mounting surface, comprising:

[0248] case;

[0249] a plurality of conductive elements held within the housing, each conductive element of the plurality of conductive elements comprising:

[0250] Mating contact part,

[0251] contact tails extending from the housing at the mounting surface,

[0252] a compliant portion coupled to the contact tail, and

[0253] coupling the mating contact portion to the middle portion of the compliant portion,

[0254] in:

[0255] The intermediate portion is held within the housing, and

[0256] The compliant portion is movable relative to the housing in a direction perpendicular to the mounting surface.

[0257] 7. The electrical connector according to inventive concept 6, wherein:

[0258] Each of the compliant portions includes a plurality of arcuate segments.

[0259] 8. The electrical connector according to inventive concept 7, wherein:

[0260] The compliant portion of each conductive element of the plurality of conductive elements is configured to compress within the housing when a force in a direction toward the housing is exerted on the contact tail of the conductive element.

[0261] 9. The electrical connector according to inventive concept 7, wherein:

[0262] The contact tail extends from the housing in a first direction; and

[0263] Each of the compliant portions is elongated in the first direction and includes a plurality of segments separated by openings in the conductive element in the first direction.

[0264] 10. The electrical connector according to inventive concept 9, wherein:

[0265] The plurality of segments number between four and eight for each of the compliant portions.

[0266] 11. The electrical connector according to inventive concept 6, wherein:

[0267] Each compliant portion of the plurality of compliant portions is configured to generate a force between 20 grams and 60 grams when compressed.

[0268] 12. The electrical connector according to inventive concept 11, wherein:

[0269] Each compliant portion of the plurality of compliant portions is configured to generate a force of between 25 grams and 45 grams when compressed.

[0270] 13. The electrical connector according to inventive concept 6, wherein:

[0271] The contact tail includes a sharp tip.

[0272] 14. The electrical connector according to inventive concept 6, wherein:

[0273] The contact tail includes a tip; and

[0274] The tip includes a plating comprising gold.

[0275] 15. The electrical connector according to inventive concept 6, wherein:

[0276] The contact tails extend between 6 mils and 12 mils from the housing.

[0277] 16. The electrical connector according to inventive concept 15, wherein:

[0278] The housing includes an organizer, and the contact tails extend from the organizer.

[0279] 17. The electrical connector according to inventive concept 6, wherein:

[0280] The contact tail extends from the housing in a first direction;

[0281] The conductive element includes a portion within the housing and extending in the first direction; and

[0282] The compliant portion is disposed within the portion extending in the first direction.

[0283] 18. The electrical connector according to inventive concept 6, further comprising:

[0284] A plurality of shield members at least partially surround a subset of the plurality of conductive elements.

[0285] 19. The electrical connector according to inventive concept 18, wherein:

[0286] The contact tails extend from the housing at the mounting surface; and

[0287] The plurality of shield members include a press fit extending from the housing at the mounting surface.

[0288] 20. The electrical connector according to inventive concept 18, wherein:

[0289] The electrical connector includes a plurality of modules, each module including a subset of the subsets of the plurality of conductive elements and a shield member of the plurality of shield members.

[0290] 21. The electrical connector according to inventive concept 20, wherein:

[0291] The plurality of modules are arranged in rows and columns with a row pitch of less than 2.5 mm and a column pitch of less than 2.5 mm.

[0292] 22. The electrical connector according to inventive concept 18, wherein:

[0293] The contact tails extend from the housing at the mounting surface; and

[0294] The connector further includes a compliant conductive member adjacent to the mounting surface; and

[0295] The plurality of shielding members are electrically coupled to the compliant conductive member.

[0296] 23. The electrical connector according to inventive concept 22, wherein:

[0297] The plurality of shield members include protrusions mechanically coupled to the compliant conductive member.

[0298] 24. The electrical connector according to inventive concept 23, wherein the conductive element is thicker at the mating contact portion than at the compliant portion.

[0299] 25. The electrical connector according to inventive concept 6, wherein:

[0300] The plurality of conductive elements include broadsides; and

[0301] The plurality of conductive elements are arranged in a plurality of pairs, wherein the wide sides of the middle portions of the conductive elements in each pair face each other.

[0302] 26. The electrical connector according to inventive concept 25, wherein:

[0303] The broadsides of the intermediate portions of the conductive elements in each pair are separated in a row direction; and

[0304] The contact tails of the conductive elements in each pair are separated in the row direction.

[0305] 27. The electrical connector according to inventive concept 26, wherein:

[0306] The mating contact portions of the conductive elements in each pair are separated along lines transverse to the row direction.

[0307] 28. The electrical connector according to inventive concept 27, wherein:

[0308] The mating contact portions of the conductive elements in each pair are separated along a line that is at an angle of 45 degrees relative to the row direction.

[0309] 29. The electrical connector according to inventive concept 27, wherein:

[0310] The mating contact portions of the conductive elements in each pair are separated along a line that is at a 90 degree angle relative to the row direction.

[0311] 30. The electrical connector according to inventive concept 27, further comprising:

[0312] A plurality of shield members at least partially surround the plurality of pairs of the conductive elements.

[0313] 31. The electrical connector according to inventive concept 30, wherein:

[0314] The plurality of shield members define an area surrounding the intermediate portion and the contact tails in each of the plurality of pairs, the area having a thickness of less than 2.6 mm 2 cross-sectional area.

[0315] 32. The electrical connector according to inventive concept 31, wherein:

[0316] The area defined by the plurality of shielding members is a square.

[0317] 33. The electrical connector according to inventive concept 30, wherein:

[0318] The shielding member is configured to support TE having a frequency greater than 56 GHz 1,0 Resonance mode.

[0319] 34. A method of manufacturing an electronic component, the method comprising:

[0320] A connector including a plurality of signal conductors is mounted to a substrate including a surface having pads thereon by:

[0321] pressing the connector toward the surface of the substrate such that portions of the contact tails of the plurality of signal conductors are compressed as the signal conductors are pressed against the pads on the surface of the substrate; and

[0322] The connector is attached to the substrate with the portion of the contact tail compressed.

[0323] 35. The method of inventive concept 34, wherein attaching the connector to the substrate comprises engaging a press-fit extending from the connector in a hole in the substrate.

[0324] 36. The method of inventive concept 34, wherein attaching the connector to the substrate comprises: securing the connector to the substrate with a fastener.

Claims

1. An electrical connector, comprising: a pair of signal conductors having contact tails adapted to connect to a surface of a substrate in an insertion direction, wherein the contact tails are configured to be compressed in the insertion direction when mounted to the surface of the substrate.

2. The electrical connector according to claim 1, wherein, the contact tails are configured to rotate when compressed.

3. The electrical connector according to claim 1, wherein, each of the contact tails includes a portion having a first bend adjacent to a second bend, wherein the portion is configured such that: before the contact tail is mounted to the surface, the first bend and the second bend are spaced apart from each other by a first distance in the insertion direction; and when the contact tail is mounted to the surface, the first bend and the second bend are spaced apart from each other by a second distance in the insertion direction, the second distance being shorter than the first distance.

4. The electrical connector according to claim 3, wherein: the portion is configured such that when the first bend and the second bend are spaced apart by the second distance, the first bend and the second bend are in physical contact with each other.

5. The electrical connector according to claim 4, wherein: the portion is configured such that: when the first bend and the second bend are spaced apart by the first distance, the first bend and the second bend are electrically coupled to each other through a third bend; and the physical contact of the first bend and the second bend shorts out the third bend.

6. An electrical connector including a mounting surface, comprising: a housing; a plurality of conductive elements held within the housing, each of the plurality of conductive elements including: a mating contact portion, a contact tail extending from the housing at the mounting surface, a compliant portion coupled to the contact tail, and an intermediate portion coupling the mating contact portion to the compliant portion, wherein: the intermediate portion is held within the housing, and the compliant portion is movable relative to the housing in a direction perpendicular to the mounting surface.

7. The electrical connector according to claim 6, wherein: each of the compliant portions includes a plurality of arcuate segments.

8. The electrical connector according to claim 7, wherein: the compliant portion of each of the plurality of conductive elements is configured to be compressed within the housing when a force in a direction towards the housing is applied to the contact tail of the conductive element.

9. The electrical connector according to claim 7, wherein: the contact tail extends from the housing in a first direction; and each of the compliant portions is elongated in the first direction and includes a plurality of segments separated by an opening in the conductive element in the first direction.

10. The electrical connector according to claim 9, wherein: for each of the compliant portions, the number of the plurality of segments is between 4 and 8.

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