Microphone, control method and device thereof and electronic equipment

Abstract

The invention discloses a microphone, a control method and device thereof and electronic equipment, and belongs to the technical field of electronic equipment. The microphone comprises a fixed plate which is enclosed to form a first space; the back polar plate is at least partially opposite to the fixed plate, and at least two first electrodes are arranged on the back polar plate; the membrane is arranged in the first space, at least two second electrodes are arranged on the peripheral side of the membrane, and the at least two second electrodes and the at least two first electrodes are arranged in a one-to-one correspondence mode; the electric control deformation piece is arranged between the diaphragm and the fixed plate and is used for generating deformation to adjust the relative position between the diaphragm and the back polar plate; and the controller is electrically connected with the first electrode, the second electrode and the electric control deformation part, and the controller is used for obtaining a first capacitance value between the first electrode and the second electrode and adjusting the deformation quantity of the electric control deformation part according to the first capacitance value.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to a microphone, a control method, a device, and an electronic device thereof. Background Art

[0002] In existing intelligent electronic devices, silicon microphones are mainly used as sound pickup devices. The silicon microphone includes structures such as MEMS (Micro Electro Mechanical Systems) transducers and ASIC (Application Specific Integrated Circuit). Among them, the MEMS transducer includes a back plate and a diaphragm. The diaphragm vibrates under the action of sound waves, causing the distance between the diaphragm and the back plate to change, thereby collecting sound signals.

[0003] In related technologies, the diaphragm of the MEMS transducer needs to sense the tiny vibrations of sound waves. Therefore, external stress affects the sound pickup effect of the silicon microphone. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a microphone, a control method, a device, and an electronic device thereof, which solve the problem that external stress affects the sound pickup effect of the silicon microphone.

[0005] In a first aspect, the embodiments of this application provide a microphone, including: a fixing plate, which encloses to form a first space; a back plate, which is at least partially oppositely arranged with the fixing plate, and at least two first electrodes are arranged on the back plate; a diaphragm, which is arranged in the first space, and at least two second electrodes are arranged on the periphery of the diaphragm, and the at least two second electrodes are arranged in one-to-one correspondence with the at least two first electrodes; an electro-controlled deformation member, which is arranged between the diaphragm and the fixing plate, and the electro-controlled deformation member is used to generate deformation to adjust the relative position between the diaphragm and the back plate; a controller, which is electrically connected to the first electrode, the second electrode, and the electro-controlled deformation member, and the controller is used to obtain a first capacitance value between the first electrode and the second electrode, and adjust the deformation amount of the electro-controlled deformation member according to the first capacitance value.

[0006] In a second aspect, the embodiments of this application provide an electronic device, including: a housing, and the microphone in any of the above technical solutions, which is arranged in the housing.

[0007] In a third aspect, this application provides a control method of a microphone, which is applied to the electronic device in the second aspect. The control method of the microphone includes: obtaining a first capacitance value between the first electrode and the second electrode; adjusting the deformation amount of the electro-controlled deformation member according to the first capacitance value.

[0008] Fourth aspect, the present application provides a control device for a microphone, which is applied to the electronic device in the second aspect. The control device for the microphone includes: an acquisition module, configured to acquire a first capacitance value between a first electrode and a second electrode; an adjustment module, configured to adjust the deformation amount of the electro-controlled deformation member according to the first capacitance value.

[0009] In the embodiments of the present application, opposite first and second electrodes are provided in the microphone. The first electrode is provided on the back plate, and the second electrode is provided on the periphery of the diaphragm, and the second electrodes are arranged in one-to-one correspondence with the first electrodes. By detecting the first capacitance value between the first electrode and the second electrode, it can be determined whether the diaphragm deforms under the action of tensile stress. An electro-controlled deformation member capable of adjusting the deformation amount is further provided between the diaphragm and the fixing plate. When it is determined that the diaphragm deforms according to the first capacitance value, the deformation amount of the electro-controlled deformation member can be adjusted to offset the external tensile stress received by the diaphragm, reducing the influence of the external stress on the sound pickup effect of the microphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 1 shows one of the structural schematic diagrams of the microphone provided in some embodiments of the present application;

[0011] Figure 2 FIG. 2 shows another structural schematic diagram of the microphone provided in some embodiments of the present application;

[0012] Figure 3 FIG. 3 shows one of the structural schematic diagrams of the diaphragm provided in some embodiments of the present application;

[0013] Figure 4 FIG. 4 shows the structural schematic diagram of the back plate provided in some embodiments of the present application;

[0014] Figure 5 FIG. 5 shows the structural schematic diagram of the microphone with the diaphragm affected by tensile stress provided in some embodiments of the present application;

[0015] Figure 6a FIG. 6 shows one of the schematic diagrams of the diaphragm vibration provided in some embodiments of the present application;

[0016] Figure 6b FIG. 7 shows another schematic diagram of the diaphragm vibration provided in some embodiments of the present application;

[0017] Figure 7 FIG. 8 shows another structural schematic diagram of the diaphragm provided in some embodiments of the present application;

[0018] Figure 8 FIG. 9 shows the structural schematic diagram of the electronic device provided in some embodiments of the present application;

[0019] Figure 9The flowchart of the control method of the microphone provided in some embodiments of the present application is shown;

[0020] Figure 10 The structural block diagram of the control device of the microphone provided in some embodiments of the present application is shown.

[0021] Figures 1 to 8 The reference numerals are as follows:

[0022] 100 Microphone, 110 Fixed plate, 112 First space, 120 Back plate, 122 First electrode, 124 Third electrode, 130 Diaphragm, 132 Second electrode, 140 Electro-controlled deformation member, 150 Controller, 161 Base, 162 Substrate, 163 Sound inlet hole, 164 Housing, 165 Second space, 171 First isolation layer, 172 Second isolation layer, 181 First bonding point, 182 Second bonding point, 183 Connection line, 200 Electronic device, 202 Frame. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application belong to the scope of protection of the present application.

[0024] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects. The character " / " generally means that the related objects before and after are in an "or" relationship.

[0025] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0026] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0027] The following Figures 1 to 10 , through specific embodiments and their application scenarios, the microphone, its control method, device, and electronic device provided by the embodiments of the present application will be described in detail.

[0028] In some embodiments of the present application, a microphone is provided. Figure 1 FIG. 1 shows one of the structural schematic diagrams of the microphone provided in some embodiments of the present application. Figure 2 FIG. 2 shows another structural schematic diagram of the microphone provided in some embodiments of the present application. Figure 3 FIG. 3 shows one of the structural schematic diagrams of the diaphragm provided in some embodiments of the present application. Figure 4 FIG. 4 shows the structural schematic diagram of the backplate provided in some embodiments of the present application. As Figure 1 , Figure 2 , Figure 3 and Figure 4 shown, the microphone 100 includes: a fixing plate 110, and the fixing plate 110 encloses a first space 112; a backplate 120, which is at least partially disposed opposite to the fixing plate 110, and at least two first electrodes 122 are provided on the backplate 120; a diaphragm 130, which is disposed in the first space 112, and at least two second electrodes 132 are provided on the peripheral side of the diaphragm 130, and the at least two second electrodes 132 are arranged in one-to-one correspondence with the at least two first electrodes 122; an electro-controlled deformation member 140, which is disposed between the diaphragm 130 and the fixing plate 110, and the electro-controlled deformation member 140 is used to generate deformation to adjust the relative position between the diaphragm 130 and the backplate 120; a controller 150, which is electrically connected to the first electrode 122, the second electrode 132, and the electro-controlled deformation member 140, and the controller 150 is used to obtain a first capacitance value between the first electrode 122 and the second electrode 132, and adjust the deformation amount of the electro-controlled deformation member 140 according to the first capacitance value.

[0029] In the embodiment of the present application, the microphone 100 includes a MEMS (Micro Electro Mechanical Systems) transducer. The transducer includes a back plate 120 and a diaphragm 130. The diaphragm 130 is disposed opposite to the back plate 120. The fixing plate 110 encloses to form a first space 112. The diaphragm 130 is located in the first space 112, and the back plate 120 and the fixing plate 110 are at least partially disposed opposite to each other. A first electrode 122 is provided on the back plate 120. A first space 112 is formed in the middle of the fixing plate 110, and there is a gap between the diaphragm 130 and the fixing plate 110. An electro-controlled deformation member 140 is disposed between the diaphragm 130 and the fixing plate 110. A second electrode 132 is further provided on the peripheral side of the diaphragm 130. The first electrode 122 and the second electrode 132 are disposed opposite to each other, that is, when the electro-controlled deformation member 140 is not controlled to generate deformation, the first electrode 122 and the second electrode 132 are disposed opposite to each other in the vertical direction.

[0030] Specifically, the middle part of the back plate 120 is disposed opposite to the first space 112 formed in the middle of the fixing plate 110, and the edge of the back plate 120 is disposed opposite to the fixing plate 110, ensuring that the first electrode 122 on the back plate 120 and the second electrode 132 on the peripheral side of the diaphragm 130 can be disposed opposite to each other, so as to form a parallel plate capacitor.

[0031] In the embodiment of the present application, the first electrode 122 and the second electrode 132 are electrodes disposed opposite to each other up and down, and a parallel plate capacitor is formed between the first electrode 122 and the second electrode 132. When the microphone 100 is subjected to the tensile stress transmitted by the circuit board, the diaphragm 130 undergoes tensile deformation, and then the diaphragm 130 will drive the second electrode 132 to displace. At this time, the first electrode 122 and the second electrode 132 will be misaligned, causing the facing area between the first electrode 122 and the second electrode 132 to change. Therefore, the controller 150 can determine whether the diaphragm 130 is deformed under the influence of the tensile stress by obtaining the first capacitance value between the first electrode 122 and the second electrode 132 and according to whether the first capacitance value changes.

[0032] Exemplarily, the controller 150 is electrically connected to the first electrode 122 and the second electrode 132, can obtain the first capacitance value between the first electrode 122 and the second electrode 132, and can determine whether the diaphragm 130 is deformed by comparing the first capacitance value with a preset capacitance value.

[0033] Figure 5 The structural schematic diagram of the microphone 100 under the influence of the tensile stress of the diaphragm 130 provided in some embodiments of the present application is shown, as Figure 5As shown, when the microphone 100 is subjected to the tensile stress transmitted by the circuit board, the diaphragm 130 undergoes tensile deformation. At this time, there is a dislocation between the second electrode 132 on the diaphragm 130 and the first electrode 122 on the back plate 120.

[0034] The diaphragm 130 can vibrate under the drive of sound waves. The distance between the vibrating diaphragm 130 and the back plate 120 changes, enabling the microphone 100 to complete sound pickup. Figure 6a Figure 5 shows one of the schematic diagrams of the vibration of the diaphragm 130 provided in some embodiments of the present application. Figure 6b Figure 7 shows another schematic diagram of the vibration of the diaphragm 130 provided in some embodiments of the present application. As Figure 6a and Figure 6b shown, the dashed lines A and B show the displacements generated by the vibration of the diaphragm 130. When the sound waves drive the diaphragm 130 to vibrate and generate displacements, the distance between the diaphragm 130 and the back plate 120 changes, changing the second capacitance value between the diaphragm 130 and the back plate 120. When the second capacitance value changes, a current signal is generated. At this time, the microphone 100 completes the sound pickup process.

[0035] In the embodiments of the present application, the microphone 100 further includes a controller 150, and the controller 150 can be an ASIC (Application Specific Integrated Circuit). The controller 150 is electrically connected to the first electrode 122, the second electrode 132, and the electro-controlled deformation member 140. The controller 150 can obtain the first capacitance value between the first electrode 122 and the second electrode 132 through the electrical connection with the first electrode 122 and the second electrode 132. When the controller 150 obtains that the first capacitance value has changed, it determines that there is a dislocation between the first electrode 122 and the second electrode 132, that is, the diaphragm 130 has undergone deformation under the action of the tensile stress.

[0036] The electro-controlled deformation member 140 is connected between the diaphragm 130 and the fixing plate 110. The controller 150 is electrically connected to the electro-controlled deformation member 140 and can adjust the voltage or current applied to the electro-controlled deformation member 140 to cause the electro-controlled deformation member 140 to deform and offset the deformation generated by the diaphragm 130 under the influence of the tensile stress. Specifically, the diaphragm 130 is connected to the fixing plate 110 through the electro-controlled deformation member 140. When the electro-controlled deformation member 140 deforms, a force opposite to the tensile stress can be applied to the diaphragm 130, thereby offsetting the tensile stress.

[0037] Exemplarily, the electrically controlled deformable member 140 can be selected from a piezoelectric material and a shape memory alloy. When the electrically controlled deformable member 140 is a deformable member made of a piezoelectric material, the piezoelectric effect of the piezoelectric material is utilized to adjust its deformation amount by applying a voltage to the electrically controlled deformable member 140. When the electrically controlled deformable member 140 is a deformable member made of a shape memory alloy, the resistive thermal effect of the shape memory alloy is utilized to adjust its deformation amount by applying a voltage to the electrically controlled deformable member 140.

[0038] It should be noted that the number of the first electrodes 122 and the second electrodes 132 is at least two, the number of the first electrodes 122 is the same as that of the second electrodes 132, and at least two first electrodes 122 are located at different positions on the back plate 120. Accordingly, the corresponding at least two second electrodes 132 are arranged in one-to-one correspondence with the first electrodes 122, so as to improve the judgment accuracy of whether the diaphragm 130 deforms according to the change of the capacitance value between the first electrode 122 and the second electrode 132.

[0039] In the embodiment of the present application, opposite first electrodes 122 and second electrodes 132 are arranged in the microphone 100. The first electrodes 122 are arranged on the back plate 120, the second electrodes 132 are arranged on the periphery of the diaphragm 130, and the second electrodes 132 are arranged in one-to-one correspondence with the first electrodes 122. Whether the diaphragm 130 deforms under the action of tensile stress can be judged by detecting the first capacitance value between the first electrode 122 and the second electrode 132. An electrically controlled deformable member 140 capable of adjusting the deformation amount is further arranged between the diaphragm 130 and the fixing plate 110. When it is determined that the diaphragm 130 deforms according to the first capacitance value, the deformation amount of the electrically controlled deformable member 140 can be adjusted to offset the external tensile stress received by the diaphragm 130, reducing the influence of the external stress action on the sound pickup effect of the microphone 100.

[0040] Such as Figure 2 and Figure 3 As shown, in some embodiments of the present application, the number of the electrically controlled deformable members 140 is at least two. Among them, at least two electrically controlled deformable members 140 and at least two second electrodes 132 are both distributed along the periphery of the diaphragm 130.

[0041] In the embodiments of the present application, the number of the electro-controlled deformation members 140 is at least two, and the at least two electro-controlled deformation members 140 are distributed along the circumferential side of the diaphragm 130. Since at least two second electrodes 132 are also distributed along the circumferential side of the diaphragm 130, the second electrodes 132 at different positions can cooperate with the corresponding first electrodes 122 to detect the tensile stress of the diaphragm 130 at different positions, and can control the electro-controlled deformation members 140 at different positions to deform, so as to offset the tensile stress at the diaphragm 130 in different directions. Therefore, according to the detection results of at least two pairs of second electrodes 132 and the first electrodes, the electro-controlled deformation members 140 at corresponding positions can be selectively controlled to deform, so as to offset the tensile stress received by the diaphragm 130 in different directions.

[0042] Exemplarily, the at least two electro-controlled deformation members 140 are evenly distributed along the circumferential side of the diaphragm 130. Specifically, for example, the diaphragm 130 is circular, the number of the electro-controlled deformation members 140 is 8, and the 8 electro-controlled deformation members 140 are centrally symmetrically distributed with the center of the diaphragm 130 as the center point.

[0043] It should be noted that the number of the electro-controlled deformation members 140 may be the same as or different from the number of the second electrodes 132.

[0044] In the embodiments of the present application, the number of the electro-controlled deformation members 140 and the number of the second electrodes 132 are both multiple, which realizes the detection of the tensile stress received by the diaphragm 130 in multiple directions by the cooperation of the second electrodes 132 at different positions and the corresponding first electrodes 122, and based on the detection results, the electro-controlled deformation members 140 that need to be controlled among the multiple electro-controlled deformation members 140 arranged on the circumferential side of the diaphragm 130 are selected, so as to control the deformation amount of the electro-controlled deformation members 140 at the corresponding positions and ensure the accuracy of offsetting the tensile stress at the diaphragm 130.

[0045] As Figure 2 and Figure 3 shown, in some embodiments of the present application, the electro-controlled deformation members 140 and the second electrodes 132 are in one-to-one correspondence. One end of each electro-controlled deformation member 140 is respectively connected to the second electrode 132 corresponding to the electro-controlled deformation member 140, and the other end of each electro-controlled deformation member 140 is respectively connected to the fixing plate 110.

[0046] In the embodiment of the present application, the number of the electro-controlled deformation members 140 is the same as the number of the second electrodes 132, and the electro-controlled deformation members 140 are connected between the second electrodes 132 and the fixing plate 110, that is, the electro-controlled deformation members 140 and the second electrodes 132 are connected in sequence in the direction from the fixing plate 110 to the diaphragm 130, ensuring that one electro-controlled deformation member 140 is provided between each second electrode 132 and the fixing plate 110. When it is detected that the first capacitance value between a pair of first electrodes 122 and second electrodes 132 changes, the controller 150 adjusts the deformation amount of the electro-controlled deformation member 140 connected thereto, improving the accuracy of canceling the tensile stress at the diaphragm 130.

[0047] Specifically, at least two second electrodes 132 are evenly distributed along the circumferential side wall of the diaphragm 130, and at least two first electrodes 122 are arranged at corresponding positions of the second electrodes 132. Since the second electrodes 132 are evenly distributed at different positions on the circumferential side of the diaphragm 130, the displacement generated by the diaphragm 130 in different directions can be determined by detecting the capacitance value between the first electrodes 122 and the second electrodes 132, improving the accuracy of judging whether the diaphragm 130 is stretched. Since a corresponding electro-controlled deformation member 140 is provided between each second electrode 132 and the fixing plate 110, the deformation amount of the electro-controlled deformation member 140 at the position of each second electrode 132 can be adjusted separately.

[0048] Exemplarily, the number of the first electrodes 122, the second electrodes 132, and the electro-controlled deformation members 140 is 8, and the 8 second electrodes 132 are distributed in a circular array on the circumferential side of the diaphragm 130.

[0049] Figure 7 FIG. shows the second structural schematic diagram of the diaphragm 130 provided in some embodiments of the present application, as Figure 7 shown, in some embodiments of the present application, at least two second electrodes 132 are connected to the diaphragm 130, and at least two electro-controlled deformation members 140 are connected to the diaphragm 130, wherein at least one second electrode 132 is provided between any two adjacent electro-controlled deformation members 140.

[0050] In the embodiment of the present application, the number of the electro-controlled deformation members 140 is multiple, and both ends of each electro-controlled deformation member 140 are respectively connected to the diaphragm 130 and the fixing plate 110. When the electro-controlled deformation member 140 deforms, the deformation generated by the electro-controlled deformation member 140 can cause the diaphragm 130 to undergo tensile deformation or contraction deformation, that is, the deformation generated by the electro-controlled deformation member 140 can directly act on the diaphragm 130, thereby canceling the tensile stress received by the diaphragm 130.

[0051] There are multiple electro-controlled deformation components 140, and the number of the second electrodes 132 is also multiple. At least one second electrode 132 is arranged between any two adjacent electro-controlled deformation components 140, ensuring that there is a second electrode 132 between every two electro-controlled deformation components 140. By arranging the second electrodes 132 between two adjacent electro-controlled deformation components 140, it can be ensured that multiple second electrodes 132 can detect the tensile stress of the diaphragm 130 in multiple directions, and when multiple electro-controlled deformation components 140 deform, they can respectively offset the tensile stress received by the diaphragm 130 in multiple different directions.

[0052] Exemplarily, the number of both the second electrodes 132 and the electro-controlled deformation components 140 is 8. The 8 second electrodes 132 are distributed in a circular array on the circumferential side of the diaphragm 130, and the 8 electro-controlled deformation components 140 are also distributed in a circular array on the circumferential side of the diaphragm 130, and there is a second electrode between two adjacent electro-controlled deformation components 140.

[0053] As Figure 1 and Figure 4 shown, in some embodiments of the present application, the microphone 100 further includes: a third electrode 124, the third electrode 124 is arranged on the back plate 120, and the third electrode 124 is arranged opposite to the diaphragm 130, and at least two first electrodes 122 are evenly distributed along the circumferential side of the third electrode 124.

[0054] In the embodiment of the present application, the microphone 100 further includes a third electrode 124 arranged on the back plate 120. The third electrode 124 and the diaphragm 130 arranged opposite to each other form a parallel plate capacitor. The controller 150 is electrically connected to the third electrode 124 and the diaphragm 130. The controller 150 can acquire the current signal output by the parallel plate capacitor formed by the third electrode 124 and the diaphragm 130, so as to acquire the sound signal collected by the microphone 100.

[0055] Exemplarily, both the third electrode 124 and the first electrode 122 are arranged on the side of the back plate 120 facing away from the diaphragm 130.

[0056] Specifically, when the sound wave drives the diaphragm 130 to vibrate and generate displacement, the distance between the diaphragm 130 and the third electrode 124 on the back plate 120 is changed, the second capacitance value between the diaphragm 130 and the third electrode 124 is changed, and a current signal is generated when the second capacitance value changes, thereby converting the sound signal into a current signal.

[0057] In the embodiments of the present application, a plurality of first electrodes 122 are evenly distributed on the peripheral side of the third electrode 124, and a plurality of first electrodes 122 are spaced apart from the third electrode 124, so that multiple pairs of first electrodes 122 and the second electrode 132 can detect the deformation generated by the diaphragm 130 in multiple directions. Since the plurality of first electrodes 122 are spaced apart from the third electrode 124, it will not affect the sound pickup of the microphone 100.

[0058] As Figure 3 and Figure 4 shown, in some embodiments of the present application, the area and shape of the first side surface of the first electrode 122 and the second side surface of the second electrode 132 are the same, wherein the first side surface and the second side surface are arranged opposite to each other.

[0059] In the embodiments of the present application, the areas of the first side surface and the second side surface of the first electrode 122 opposite to the second electrode 132 are the same, and the shapes are also the same, which can ensure that when the first electrode 122 is misaligned with the second electrode 132, the first capacitance value between the first electrode 122 and the second electrode 132 will change, avoiding the detection failure caused by the different areas between the first side surface and the second side surface of the first electrode 122 opposite to the second electrode 132.

[0060] Exemplarily, the shapes of the first side surface and the second side surface are both rectangles. The long sides of the first side surface are arranged opposite to the long sides of the second side surface and have the same size, and the short sides of the first side surface are arranged opposite to the short sides of the second side surface and have the same size.

[0061] As Figure 1 and Figure 2 shown, in some embodiments of the present application, the microphone 100 further includes: a base 161, a fixing plate 110 is arranged on the base 161; a substrate 162, the base 161 and the controller 150 are arranged on the substrate 162, and a sound inlet hole 163 is formed on the substrate 162, and the sound inlet hole 163 corresponds to the diaphragm 130; a housing 164, the housing 164 is arranged on the substrate 162, and the housing 164 and the substrate 162 enclose a second space 165, and the base 161 and the controller 150 are located in the second space 165.

[0062] In the embodiments of the present application, the microphone 100 further includes a base 161, a substrate 162, and a housing 164. The substrate 162 is used to carry the base 161, and the base 161 is used to carry the MEMS transducer and the controller 150. Specifically, the base 161 is disposed on the substrate 162, and the fixing plate 110 is disposed on the base 161. The fixing plate 110 can be directly connected to the base 161, or the fixing plate 110 is connected to the base 161 through other isolation structures. The diaphragm 130 is embedded in the first space 112 formed by enclosing the fixing plate 110. The back plate 120 is disposed on the fixing plate 110. The housing 164 is snap-fitted on the substrate 162. The housing 164 and the substrate 162 enclose a second space 165. The base 161, the controller 150, and the MEMS transducer are located in the second space 165. A sound inlet hole 163 is formed in the substrate 162. External sound waves enter the interior of the microphone 100 through the sound inlet hole 163. By disposing the sound inlet hole 163 opposite to the diaphragm 130, it is possible to make the external sound waves drive the diaphragm 130 to move after entering the interior of the microphone 100, thereby improving the sound pickup effect of the microphone 100.

[0063] Exemplarily, the controller 150 can be an ASIC. The controller 150 is electrically connected to the back plate 120, the diaphragm 130, the first electrode 122, the second electrode 132, the third electrode 124, and the electro-controlled deformation member 140. The controller 150 is fixed on the substrate 162, and the encapsulating glue covers the controller 150 to insulate and isolate the controller 150.

[0064] As Figure 2 and Figure 5 shown, in some embodiments of the present application, the microphone 100 further includes: a first isolation layer 171, the first isolation layer is located between the base 161 and the fixing plate 110; a second isolation layer 172, the second isolation layer 172 is located between the back plate 120 and the fixing plate 110.

[0065] In the embodiments of the present application, the microphone 100 further includes a first isolation layer 171 and a second isolation layer 172. The first isolation layer 171 is disposed between the base 161 and the fixing plate 110, and the first isolation layer 171 is used for insulating isolation between the base 161 and the fixing plate 110. The second isolation layer 172 is disposed between the fixing plate 110 and the back plate 120, and the second isolation layer 172 is used for insulating isolation between the fixing plate 110 and the back plate 120. By providing the first isolation layer 171 and the second isolation layer 172 in the microphone 100, the insulation performance between the various structural components in the MEMS transducer can be improved, and the operation stability of the microphone 100 can be improved.

[0066] Exemplarily, the first insulating layer and the second insulating layer may be insulating oxides, specifically, for example: silicon dioxide. The sizes of the first insulating layer and the second insulating layer are at the micron level, and the sizes of the first insulating layer and the second insulating layer can be set according to the size and sensitivity of the diaphragm 130.

[0067] As Figure 1 , Figure 2 and Figure 5 shown, in some embodiments of the present application, the microphone 100 further includes: a first bonding pad 181 disposed on the back plate 120, and the first bonding pad 181 is electrically connected to the first electrode 122; a second bonding pad 182 disposed on the fixing plate 110, and the second bonding pad 182 is electrically connected to the electro-controlled deformation member 140 and the second electrode 132; a connecting wire 183, the first end of the connecting wire 183 is respectively connected to the first bonding pad 181 and the second bonding pad 182, and the second end of the connecting wire 183 is connected to the controller 150. The controller 150 is configured to obtain a first capacitance value through the first bonding pad 181, and adjust the voltage value at the electro-controlled deformation member 140 through the second bonding pad 182.

[0068] It should be noted that the first bonding pad 181 and the second bonding pad 182 are solder joints of the circuit board bonding process, which are used for electrical connection between electrical components. The bonding process is a wire bonding method in the chip manufacturing process.

[0069] In the embodiments of the present application, a first bonding pad 181 and a second bonding pad 182 are further provided in the MEMS transducer of the microphone 100, and the controller 150 is connected to the first bonding pad 181 and the second bonding pad 182 through the connecting wire 183 respectively. The first bonding pad 181 is located on the back plate 120, and the second bonding pad 182 is located on the fixing plate 110. The controller 150 is electrically connected to the first electrode 122 through the connecting wire 183 and the first bonding pad 181, and is electrically connected through the connecting wire 183 and the second bonding pad 182. The controller 150 can be electrically connected to the first electrode 122 and the second electrode 132 through the first bonding pad 181 and the second bonding pad 182 respectively, so as to obtain the first capacitance value between the first electrode 122 and the second electrode 132, and monitor whether the diaphragm 130 is affected by the tensile stress according to whether the first capacitance value changes. The controller 150 is electrically connected to the electro-controlled deformation member 140 through the connecting wire 183 and the second bonding pad 182. The controller 150 can apply a voltage to the electro-controlled deformation member 140 through the second bonding pad 182 to cause the electro-controlled deformation member 140 to deform, so as to offset the tensile stress received by the diaphragm 130.

[0070] In some embodiments of the present application, the electro-controlled deformation member 140 includes at least one of the following: a piezoelectric material deformation member, a shape memory alloy deformation member.

[0071] In the embodiments of the present application, the electrically controlled deformable member 140 may be a piezoelectric material deformable member. By utilizing the piezoelectric characteristics of the piezoelectric material, a voltage is applied to the electrically controlled deformable member 140 to cause the electrically controlled deformable member 140 to deform.

[0072] Exemplarily, the electrically controlled deformable member 140 is a piezoelectric material deformable member. When the diaphragm 130 is not affected by the tensile stress, there is no need to apply a voltage to the piezoelectric material deformable member. At this time, the piezoelectric material deformable member maintains its original size. When the diaphragm 130 is affected by the tensile stress, a voltage is applied to the piezoelectric material deformable member to cause the piezoelectric material deformable member to elongate, so as to offset the tensile stress received by the diaphragm 130.

[0073] In the embodiments of the present application, the electrically controlled deformable member 140 may be a shape memory alloy deformable member, that is, the electrically controlled deformable member 140 is made of a shape memory alloy material. By utilizing the characteristic that the shape memory alloy material deforms under the influence of temperature, the temperature at the shape memory alloy material is adjusted to cause the electrically controlled deformable member 140 to deform.

[0074] Exemplarily, by applying a voltage to the shape memory alloy deformable member, due to the influence of the internal resistance of the shape memory alloy deformable member, the shape memory alloy deformable member generates heat by itself and deforms.

[0075] Exemplarily, the shape memory alloy deformable member includes a resistor and a shape memory alloy structure. The shape memory alloy structure is disposed adjacent to the resistor. By applying a voltage to the resistor, the heat generated by the resistor is transferred to the shape memory alloy structure, causing the shape memory alloy structure to deform.

[0076] It should be noted that the shape memory alloy deformable member may be a double-layer structure, one layer is shortened by heat, and the other layer is elongated by heat. Specifically, the shape memory alloy deformable member includes a first deformable member, a second deformable member, and a heat insulation structure. The heat insulation structure is disposed between the first deformable member and the second deformable member. When it is necessary to control the elongation of the shape memory alloy deformable member, a voltage is applied to the first deformable member to cause the first deformable member to elongate under the influence of its own internal resistance heat generation. When it is necessary to control the shortening of the shape memory alloy deformable member, a voltage is applied to the second deformable member to cause the second deformable member to shorten under the influence of its own internal heat generation. The heat insulation structure is between the first deformable member and the second deformable member, which can prevent the heat generation of the first deformable member from affecting the second deformable member, and prevent the heat generation of the second deformable member from affecting the first deformable member.

[0077] In some embodiments of the present application, an electronic device is provided. Figure 8 The structural schematic diagram of the electronic device provided in some embodiments of the present application is shown. As Figure 8 shown, the electronic device 200 includes: a housing 202, and the microphone 100 in any of the above embodiments, and thus has all the beneficial technical effects of the microphone 100 in any of the above embodiments, which will not be elaborated here.

[0078] Exemplarily, the sound inlet hole 163 of the microphone 100 is provided on the housing 202.

[0079] In the embodiments of the present application, the electronic device may be a portable electronic device such as a mobile phone or a tablet computer.

[0080] In some embodiments of the present application, a method for controlling a microphone is provided, which is applied to the electronic device in any of the above embodiments. Figure 9 The flowchart of the method for controlling a microphone provided in some embodiments of the present application is shown. As Figure 9 shown, the method for controlling a microphone includes:

[0081] Step 902, obtaining a first capacitance value between the first electrode and the second electrode;

[0082] In the embodiments of the present application, the microphone includes a MEMS transducer, and the transducer includes a back plate and a diaphragm. The diaphragm is disposed opposite to the back plate. A first electrode is provided on the back plate. A first space is formed in the middle of the fixing plate, and the diaphragm is disposed in the first space, and there is a gap between the diaphragm and the fixing plate. An electro-controlled deformation member is disposed between the diaphragm and the fixing plate, and a second electrode is further provided on the peripheral side of the diaphragm. The first electrode and the second electrode are disposed opposite to each other, that is, when the electro-controlled deformation member is not controlled to generate deformation, the first electrode and the second electrode are disposed opposite to each other in the vertical direction.

[0083] The first electrode and the second electrode are electrodes disposed opposite to each other up and down, and a parallel plate capacitor is formed between the first electrode and the second electrode. When the microphone is subjected to the tensile stress transmitted from the circuit board, the diaphragm undergoes tensile deformation, and then the diaphragm will drive the second electrode to displace. At this time, the first electrode and the second electrode will be misaligned, so that the facing area between the first electrode and the second electrode changes. Therefore, by obtaining the first capacitance value between the first electrode and the second electrode and determining whether the first capacitance value changes, it can be determined whether the diaphragm is deformed under the influence of the tensile stress.

[0084] Step 904, adjusting the deformation amount of the electro-controlled deformation member according to the first capacitance value.

[0085] In the embodiments of the present application, the controller is electrically connected to the first electrode, the second electrode, and the electro-controlled deformation member. The controller can obtain the first capacitance value between the first electrode and the second electrode by being electrically connected to the first electrode. When the controller obtains that the first capacitance value changes, it is determined that the first electrode and the second electrode are misaligned, that is, the diaphragm has been deformed under the action of the tensile stress.

[0086] The electro-controlled deformation member is connected between the diaphragm and the fixing plate, and the controller is electrically connected to the electro-controlled deformation member to adjust the voltage or current applied to the electro-controlled deformation member, so that the electro-controlled deformation member generates deformation to offset the deformation generated by the diaphragm under the influence of the tensile stress.

[0087] It should be noted that the number of the first electrodes and the second electrodes is at least two, the number of the first electrodes is the same as that of the second electrodes, and at least two first electrodes are located at different positions on the back plate, and then the corresponding at least two second electrodes are arranged in one-to-one correspondence with the first electrodes, so that the accuracy of judging whether the diaphragm is deformed according to the change of the capacitance value between the first electrode and the second electrode can be improved.

[0088] In the embodiment of the present application, opposite first electrodes and second electrodes are arranged in the microphone. The first electrodes are arranged on the back plate, the second electrodes are arranged on the periphery of the diaphragm, and the second electrodes are arranged in one-to-one correspondence with the first electrodes. Whether the diaphragm is deformed under the action of tensile stress can be judged by detecting the first capacitance value between the first electrode and the second electrode. An electronically controlled deformation component capable of adjusting the deformation amount is also arranged between the diaphragm and the fixing plate. When it is determined that the diaphragm is deformed according to the first capacitance value, the deformation amount of the electronically controlled deformation component can be adjusted to offset the external tensile stress received by the diaphragm, reducing the influence of the external stress action on the sound pickup effect of the microphone.

[0089] In some embodiments of the present application, adjusting the deformation amount of the electronically controlled deformation component according to the first capacitance value includes: when the first capacitance value is outside the target range, adjusting the voltage value at the electronically controlled deformation component until the first capacitance value is within the target range.

[0090] In the embodiment of the present application, the target range of the first capacitance value is the range of the capacitance value when the first electrode and the second electrode are facing each other. When the first capacitance value is within the target range, it is determined that the first electrode and the second electrode are in a facing state, that is, the diaphragm is not affected by tensile stress. When the first capacitance value is outside the target range, it is determined that the first electrode and the second electrode are misaligned, that is, the diaphragm is affected by tensile stress. At this time, the deformation amount of the electronically controlled deformation component needs to be adjusted. By applying a voltage to the electronically controlled deformation component, the electronically controlled deformation component is deformed, so as to offset the tensile stress received by the diaphragm.

[0091] It should be noted that when applying a voltage to the electronically controlled deformation component to adjust the deformation amount of the electronically controlled deformation component, the first capacitance value is continuously monitored. When the first capacitance value enters the target range, it is determined that the tensile stress received by the diaphragm has been offset.

[0092] In the embodiment of the present application, the electronically controlled deformation component can be a piezoelectric material deformation component. Utilizing the piezoelectric property of the piezoelectric material, by applying a voltage to the electronically controlled deformation component, the electronically controlled deformation component is deformed.

[0093] In the embodiments of the present application, the electrically controlled deformable member may be a shape memory alloy deformable member, that is, the electrically controlled deformable member is made of a shape memory alloy material. By utilizing the characteristic that the shape memory alloy material deforms under the influence of temperature, the temperature at the position of the shape memory alloy material is adjusted to cause the electrically controlled deformable member to deform.

[0094] Specifically, when the first capacitance value is outside the target range, a voltage is applied to the shape memory alloy deformable member. Affected by the internal resistance of the shape memory alloy deformable member, the shape memory alloy deformable member generates heat by itself and deforms.

[0095] Specifically, the shape memory alloy deformable member includes a resistor and a shape memory alloy structure. The shape memory alloy structure is arranged adjacent to the resistor. When the first capacitance value is outside the target range, a voltage is applied to the resistor, and the heat generated by the resistor is transferred to the shape memory alloy structure, causing the shape memory alloy structure to deform.

[0096] In the embodiments of the present application, it is detected whether the first capacitance value is within the target range. When it is detected that the first capacitance value is outside the target range, a voltage is applied to the electrically controlled deformable member to cause the electrically controlled deformable member to deform, and the amount of deformation of the electrically controlled deformable member can be adjusted to offset the external tensile stress received by the diaphragm, further reducing the influence of the external stress on the sound pickup effect of the microphone.

[0097] In some embodiments, the shape memory alloy deformable member may be a bilayer structure, one layer shrinks when heated, and the other layer elongates when heated. Specifically, the shape memory alloy deformable member includes a first deformable member, a second deformable member, and a heat insulation structure. The heat insulation structure is arranged between the first deformable member and the second deformable member.

[0098] Specifically, when the first capacitance value is outside the target range and it is necessary to control the shape memory alloy deformable member to elongate, a voltage is applied to the first deformable member to cause the first deformable member to elongate under the influence of its own internal resistance heating. When the first capacitance value is outside the target range and it is necessary to control the shape memory alloy deformable member to shorten, a voltage is applied to the second deformable member to cause the second deformable member to shorten under the influence of its own internal heating. The heat insulation structure is between the first deformable member and the second deformable member, which can prevent the heat generated by the first deformable member from affecting the second deformable member, and prevent the heat generated by the second deformable member from affecting the first deformable member.

[0099] For the microphone control method provided in the embodiments of the present application, the execution subject may be the control device of the microphone. In the embodiments of the present application, taking the control device of the microphone executing the microphone control method as an example, the microphone control method provided in the embodiments of the present application is described.

[0100] In some embodiments of the present application, a control device of a microphone is provided, which is applied to the electronic device in any of the above embodiments. Figure 10The structural block diagram of the control device of the microphone provided in some embodiments of the present application is shown. As Figure 10 shown, the control device 1000 of the microphone includes:

[0101] An acquisition module 1002, configured to acquire a first capacitance value between a first electrode and a second electrode;

[0102] An adjustment module 1004, configured to adjust the deformation amount of the electro-controlled deformation member according to the first capacitance value.

[0103] In the embodiments of the present application, a relative first electrode and a second electrode are arranged in the microphone. The first electrode is arranged on the back plate, and the second electrode is arranged on the periphery of the diaphragm, and the second electrode is arranged corresponding to the first electrode one by one. By detecting the first capacitance value between the first electrode and the second electrode, it can be determined whether the diaphragm deforms under the action of tensile stress. An electro-controlled deformation member capable of adjusting the deformation amount is also arranged between the diaphragm and the fixing plate. When it is determined that the diaphragm deforms according to the first capacitance value, the deformation amount of the electro-controlled deformation member can be adjusted to offset the external tensile stress received by the diaphragm, reducing the influence of the external stress on the sound pickup effect of the microphone.

[0104] In some embodiments of the present application, the adjustment module 1004 is further configured to adjust the voltage value at the electro-controlled deformation member until the first capacitance value is within the target range when the first capacitance value is outside the target range.

[0105] In the embodiments of the present application, it is detected whether the first capacitance value is within the target range. When it is detected that the first capacitance value is outside the target range, by applying a voltage to the electro-controlled deformation member to cause the electro-controlled deformation member to deform, the deformation amount of the electro-controlled deformation member can be adjusted to offset the external tensile stress received by the diaphragm, further reducing the influence of the external stress on the sound pickup effect of the microphone.

[0106] The control device of the microphone provided in the embodiments of the present application can implement each process implemented in the above method embodiments. To avoid repetition, it will not be elaborated here.

[0107] It should be noted that in this article, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, device, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, device, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, device, article or device including the element.

[0108] In addition, it should be noted that the devices and the scope of the devices in the embodiments of the present application are not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described devices may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, the features described with reference to certain examples may be combined in other examples.

[0109] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-described example devices can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions for causing a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the devices of the various embodiments of the present application.

[0110] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A microphone, characterized in that: include: A fixing plate, wherein the fixing plate encloses and forms a first space; A back plate, disposed at least partially opposite to the fixed plate, and at least two first electrodes are disposed on the back plate; A diaphragm is arranged in the first space, and at least two second electrodes are arranged on the periphery of the diaphragm, and the at least two second electrodes are arranged in a one-to-one correspondence with the at least two first electrodes; An electrically controlled deformable member, disposed between the diaphragm and the fixed plate, the electrically controlled deformable member being used to generate deformation to adjust the relative position between the diaphragm and the back plate; A controller is electrically connected to the first electrode, the second electrode and the electrically-controlled deformable member, and is used to obtain a first capacitance value between the first electrode and the second electrode, and adjust the deformation amount of the electrically-controlled deformable member according to the first capacitance value.

2. The microphone according to claim 1, characterized in that The number of the electrically-controlled deformable members is at least two, and the at least two electrically-controlled deformable members and the at least two second electrodes are distributed along the circumference of the diaphragm.

3. The microphone according to claim 2, characterized in that The electrically-controlled deformation members correspond to the second electrodes one by one, one end of each electrically-controlled deformation member is connected to the second electrode corresponding to the electrically-controlled deformation member, and the other end of each electrically-controlled deformation member is connected to the fixing plate; or At least two of the second electrodes are connected to the diaphragm, and at least two of the electrically-controlled deformable members are connected to the diaphragm, wherein at least one of the second electrodes is arranged between any two adjacent electrically-controlled deformable members.

4. The microphone according to claim 1, characterized in that Also includes: A third electrode is disposed on the back plate, and the third electrode is disposed opposite to the diaphragm, and at least two of the first electrodes are evenly distributed along the circumference of the third electrode.

5. The microphone according to any one of claims 1 to 4, characterized in that: Also includes: A base, wherein the fixing plate is arranged on the base; A substrate, the base and the controller are arranged on the substrate, a sound inlet hole is opened on the substrate, and the sound inlet hole corresponds to the diaphragm; A shell is arranged on the substrate, the shell and the substrate are enclosed to form a second space, and the base and the controller are located in the second space.

6. The microphone according to any one of claims 1 to 4, characterized in that: Also includes: A first bonding point is arranged on the back plate, and the first bonding point is electrically connected to the first electrode; A second bonding point is arranged on the fixing plate, and the second bonding point is electrically connected to the electrically controlled deformation member and the second electrode; A connecting line, wherein the first end of the connecting line is connected to the first bonding point and the second bonding point respectively, and the second end of the connecting line is connected to the controller, and the controller is used to obtain the first capacitance value through the first bonding point, and adjust the voltage value at the electrically controlled deformation element through the second bonding point.

7. An electronic device, characterized in that: include: Frame; The microphone according to any one of claims 1 to 6 is provided in the frame.

8. A method for controlling a microphone, characterized in that: Applied to the electronic device according to claim 7, the microphone control method comprises: Acquire a first capacitance value between the first electrode and the second electrode; The deformation amount of the electrically-controlled deformable member is adjusted according to the first capacitance value.

9. The microphone control method according to claim 8, characterized in that: The step of adjusting the deformation amount of the electrically-controlled deformable member according to the first capacitance value comprises: When the first capacitance value is outside the target range, the voltage value at the electrically-controlled deformation member is adjusted until the first capacitance value is within the target range.

10. A control device for a microphone, characterized in that: Applicable to the electronic device according to claim 7, the microphone control device comprises: An acquisition module, used for acquiring a first capacitance value between the first electrode and the second electrode; An adjustment module is used to adjust the deformation amount of the electrically-controlled deformable member according to the first capacitance value.

11. The microphone control device according to claim 10, characterized in that: The adjustment module is further configured to adjust the voltage value at the electrically-controlled deformation member when the first capacitance value is outside a target range, until the first capacitance value is within the target range.

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