Circuit arrangement having circuit board and temperature sensor arranged on circuit board
By using devices for determining the maximum temperature in the circuit arrangement structure to find out the maximum temperature, the problems of complex connections and increased system costs caused by non-uniform temperature distribution are solved, and effective temperature management and reduced information transmission consumption are achieved.
Patent Information
- Application Number
- CN202411784378.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-08
- Filing Date
- 2024-12-06
- Publication Date
- 2025-06-10
AI Technical Summary
In the circuit arrangement structure, the non-uniform temperature distribution leads to complex connections of temperature sensors, increasing system costs, and the prior art is difficult to effectively reduce the consumption of information transmission.
A circuit arrangement structure is designed in which the output ends of a plurality of temperature sensors are respectively connected to an input end of the device for determining the maximum temperature. The device for determining the maximum temperature determines the maximum temperature signal through a diode network or other circuit structure, and applies the signal to the output end of the circuit arrangement structure for processing by the controller.
By understanding the maximum temperature on the circuit board, effective temperature management is achieved, reducing system costs and reducing information transmission costs.
Smart Images
Figure CN120129150A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a circuit arrangement structure having a circuit board and an arrangement structure composed of conductor circuits and electrical components arranged on the circuit board, the electrical components being interconnected by the conductor circuits, wherein the components include a plurality of temperature sensors, by means of which the temperature at different parts of the circuit board can be detected, and wherein the circuit arrangement structure has an output. The output of the circuit arrangement structure is connected to the outputs of the respective temperature sensors. The measured temperature can be output via the output of the circuit arrangement structure for processing, for example, in a controller for controlling the circuit arrangement structure. Background Art
[0002] For example, a circuit arrangement structure having such a structure is used in the LED matrix headlamp or large-area LED display of a vehicle. The LED matrix headlamp has a circuit arrangement structure having LEDs arranged on a circuit carrier as electrical components. During the operation of such a circuit arrangement structure, a large amount of heat is generated, and the heat causes the components of the circuit arrangement structure to heat up. Excessive heating of the components can lead to damage to the components. In order to prevent the circuit arrangement structure from malfunctioning, it is necessary to prevent damage to the components. One means for preventing excessive heating can be to dissipate the heat by means of a cooling body or by cooling with a coolant after the heat appears. Another means for preventing excessive heating can be to prevent the occurrence of a large amount of heat. For example, this can be achieved through temperature management.
[0003] Through temperature management, it can be prevented that: in particular, a large amount of heat is generated by the components of the circuit arrangement structure so that the temperature of all components or some components rises so strongly that they are damaged. By using such temperature management, the electric power of the circuit arrangement structure can be reduced. The temperature is detected by temperature sensors. The outputs of the temperature sensors are connected to a controller via the output of the circuit arrangement structure, and temperature management is implemented on the controller. If there is a risk of damage to the circuit arrangement structure due to excessive temperature, the power of each component or some components or one of the components of the circuit arrangement structure is reduced by means of the controller, and thus the heat generated by the circuit arrangement structure is reduced.
[0004] The temperature distribution of a circuit arrangement is usually not uniform. In the case of a large-area circuit board, the temperatures at different parts or regions can be quite different. Especially in a circuit board with many LEDs and drivers, it is not easy to find a suitable location for the temperature sensor. In some known solutions, in which regions of the circuit arrangement the power must or should be reduced is determined with the aid of temperature sensors distributed on the circuit board. These temperature sensors detect the temperatures at different parts of the circuit board. The output terminals of the temperature sensors are then connected to the output terminal of the circuit arrangement. The output terminal of the circuit arrangement can in turn be connected to the input terminal of a controller, with which the circuit arrangement is controlled. The controller can then reduce the power based on the temperature measured in the region of the circuit arrangement.
[0005] As a result, the excessive temperature at the location where the high temperature occurs can be countered in a targeted manner. For each temperature sensor, at least one connection is required at the output terminal of the circuit arrangement and at the corresponding input terminal of the controller. This increases the number of required connections in the plug-in part, the number of lines in the cable harness, and the number of connections in the measurement input terminals in the controller. This results in an increase in system costs.
[0006] This is the origin of the present invention. Summary of the Invention
[0007] The present invention is based on the following task: to design a circuit arrangement such that temperature management of the circuit arrangement can be carried out in the case of a non-uniform temperature distribution during operation of the circuit arrangement, without each temperature sensor being connected to the controller via the output terminal of the circuit arrangement.
[0008] This task is solved according to the invention in that the circuit arrangement has a plurality of temperature sensors distributed on the circuit board and a device for determining the maximum temperature, wherein the output terminal of each temperature sensor is respectively connected to an input terminal of the device for determining the maximum temperature, and the output terminal of the device for determining the maximum temperature is connected to the output terminal of the circuit arrangement, and the device for determining the maximum temperature is suitable and arranged to determine from the temperature signals applied at the respective input terminals a temperature signal indicating the highest temperature, and to apply this temperature signal or another signal indicating the maximum temperature at the output terminal of the device for determining the maximum temperature and thus at the output terminal of the circuit arrangement. The signal applied at the output terminal of the circuit arrangement can be read into the controller and processed.
[0009] The present invention is first based on the recognition that for effective temperature management, it is sufficient to know the maximum temperature on the circuit board of the circuit arrangement. For this purpose, the temperatures measured at different parts of the circuit board can be transmitted to a controller, and the maximum temperature can be determined in the controller, so that the circuit arrangement can then be set such that the circuit arrangement or parts of the circuit arrangement do not overheat. Although an effective temperature management is achieved with such a solution, a reduction in cost cannot yet be achieved in terms of the cost of the information transmission from the circuit arrangement to the controller.
[0010] However, this cost can be reduced by the fact that the determination of the maximum temperature is not set in the controller, but according to the invention in a device provided for this purpose in the circuit arrangement.
[0011] The device for determining the maximum temperature of the circuit arrangement can have a diode network, a discrete transistor circuit, an operational amplifier circuit or an integrated circuit.
[0012] Such a diode network can have a plurality of series circuits, the series circuits including a resistance member and a resistance member with a negative temperature coefficient (thermal conductor), wherein the series circuits are connected in parallel to the input of the network for the supply voltage.
[0013] The resistance member can be connected to the connection for the high potential of the input for the supply voltage, and the resistance member with a negative temperature coefficient can be connected to the low potential of the supply voltage. In each series connection, the node between the resistance member and the resistance member with a negative temperature coefficient can be connected via a diode to the output of the circuit arrangement. These diodes can be connected in the blocking direction from the node of the series circuit to the output of the circuit arrangement. In addition, the connection for the high potential of the supply voltage for the diode network can be connected to the output of the circuit arrangement via a resistance member. Alternatively, this resistance member can also be arranged outside the circuit arrangement according to the invention, for example in the controller to which the circuit arrangement is connected. The resistance of this resistance member is much greater than the resistance of any resistance member of any of the series circuits in the series circuits. The resistance of the resistance members of the series circuits is preferably the same. The resistance of the resistance members with a negative temperature coefficient is also the same.
[0014] In an alternative embodiment of the diode network, a resistor member having a negative temperature coefficient may be connected at the connection for the high potential of the input for the supply voltage, and the resistor member may be connected to the low potential of the supply voltage. In each series connection, the node between the resistor member and the resistor member having a negative temperature coefficient may be connected via a diode to the output of the circuit arrangement. These diodes may be connected in the flow direction from the node of the series circuit to the output of the circuit arrangement. Furthermore, the connection for the low potential of the supply voltage for the diode network may be connected via a resistor member to the output of the circuit arrangement. The resistance of this resistor member is much greater than the resistance of any resistor member of any series circuit in the series circuit. The resistance of the resistor members of the series circuit is preferably the same. The resistance of the resistor members having a negative temperature coefficient is also the same. Description of the Drawings
[0015] An embodiment of the circuit arrangement according to the invention is shown in the drawings. In addition, two alternatives for the diode network are also shown in the drawings, which diode network may form a device for determining the maximum temperature of the circuit arrangement according to the invention. The drawings show:
[0016] Figure 1 A layout consisting of a controller and a circuit arrangement known from the prior art is shown;
[0017] Figure 2 A layout consisting of a controller and an embodiment of the circuit arrangement according to the invention is shown;
[0018] Figure 3 An embodiment showing a first alternative of the diode network for the circuit arrangement according to the invention; and
[0019] Figure 4 An embodiment showing a second alternative of the diode network for the circuit arrangement according to the invention. Detailed Description
[0020] Not only Figure 1 the layout shown in and known from the prior art but also Figure 2 the layout having the circuit arrangement M according to the invention shown in has a controller ECU and circuit arrangements M', M, wherein the circuit arrangements M', M have a plurality of temperature sensors S1, S2, S3, S4.
[0021] The circuit arrangements M' and M have a circuit board and conductor circuits and electrical components arranged on the circuit board - the electrical components include temperature sensors S1, S2, S3, S4 - however, for the sake of clarity, these electrical components are not shown in the drawings except for the temperature sensors S1, S2, S3, S4 and the conductor circuits provided for connecting said temperature sensors. The components are interconnected by conductor circuits. The temperature sensors S1, S2, S3, S4 can be used to detect the temperature at different parts of the circuit board. The circuit arrangement has an output.
[0022] The output of the circuit arrangement M' ( Figure 1 ), known from the prior art, has an output with a plurality of connections, among which, within the circuit arrangement M', each connection is assigned to one of the temperature sensors S1, S2, S3, S4 and is connected to the output of this temperature sensor. Each connection of the output of the circuit arrangement M' is connected to a controller ECU. At each of these connections, the temperature signals T1, T2, T3, T4 of the temperature sensor S1, S2, S3, S4 connected to this connection are indicated.
[0023] The output of the circuit arrangement according to the invention ( Figure 2 ) has an output with a single connection. This connection is connected within the circuit arrangement M to a device MAX(T1,..., Tn) for determining the maximum temperature. The device has a plurality of inputs, among which, each input is connected to the output of one of the temperature sensors S1, S2, S3, S4. During operation of the circuit arrangement, the signals T1, T2, T3, T4, which indicate the temperature measured by the temperature sensors S1, S2, S3, S4, are applied at the inputs of the device MAX(T1,..., T4).
[0024] The device MAX(T1,..., Tn) for determining the maximum temperature ascertains from the temperature signals T1, T2, T3, T4 the signal indicating the maximum temperature and provides this signal or a signal Tmax at its output, from which the maximum temperature measured by the temperature sensors S1, S2, S3, S4 can be ascertained. The signal Tmax is applied at the connection of the output and is transmitted to the controller ECU.
[0025] For example, heat conductors, i.e., resistive components with a negative temperature coefficient, can be used as the temperature sensors S1, S2, S3, S4, as is the case for the circuit arrangement M variant shown in Figure 3 and Figure 4 .
[0026] Not only in accordance with Figure 3in the circuit arrangement M according to the invention and in accordance with Figure 4 in the circuit arrangement M according to the invention, a diode network is used. Each diode network has resistance members R1, R2, R3, R4, which together with sensors S1, S2, S3, S4 form series circuits S1, R1; S2, R2; S3, R3; S4, R4. A voltage is applied at the nodes between the resistance members R1, R2, R3, R4 and the sensors S1, S2, S3, S4, and this voltage forms a signal that indicates the temperature detected by the sensors S1, S2, S3, S4. The sensors S1, S2, S3, S4 are identical heat conductors. The resistance members R1, R2, R3, R4 are also identical.
[0027] In Figure 3 the circuit arrangement, the resistance members R1, R2, R3, R4 of the diode network are connected to the positive potential Vb of the supply voltage, and the sensors S1, S2, S3, S4 are connected to the negative potential of the supply voltage or to the reference potential Gnd. The nodes between the resistance members R1, R2, R3, R4 and the sensors S1, S2, S3, S4 are connected via the diodes D1, D2, D3, D4 of the diode network to the output of the circuit arrangement M, and a signal indicating the maximum temperature is applied at the output. The diodes D1, D2, D3, D4 are connected in the cut-off direction from the nodes to the output. In addition, a resistance member Rm is also arranged between the connection for the positive potential of the supply voltage and the output of the circuit arrangement M. The resistance of this resistance member Rm is much greater than the resistance of the resistance members R1, R2, R3, R4. Alternatively, this resistance member can also be arranged in the controller ECU.
[0028] According to Figure 3The circuit arrangement M can be most easily explained for the case where the sensor S1 measures the highest temperature while the temperatures at the other sensors S2, S3, S4 are very low. The resistance of the thermal conductor or sensor S1 is very low compared to the resistances of the thermal conductors or sensors S2, S3, S4. Due to the voltage dividers between the resistance elements R2, R3, R4 and the sensors S2, S3, S4, a potential close to the positive potential Vb of the supply voltage appears at the nodes between the resistance elements R2, R3, R4 and the sensors S2, S3, S4, and due to the voltage divider between the resistance element R1 and the sensor S1, a potential close to the reference potential of the supply voltage appears at the node between the resistance element R1 and the sensor S1. Since the element Rm conducts hardly at all and has a very high resistance, a voltage Tmax close to the positive potential of the supply voltage first appears at the output. However, if the voltage T1 is very low now due to the increasing temperature at the sensor S1, the diode D1 will conduct and the voltage T1 appears at the output increased by the voltage drop across the diode D1. Thus, the voltage Tmax at the output corresponds to the voltage T1 increased by the diode voltage. In this idealized view, the current through Rm is not considered. The deviation between the voltage Tmax and the voltage T1 is systematic and can be compensated for in the controller ECU when evaluating the temperature signal.
[0029] In Figure 4 the circuit arrangement, the sensors S1, S2, S3, S4 are connected to the positive potential Vb of the supply voltage, and the resistance elements R1, R2, R3, R4 of the diode network are connected to the negative potential of the supply voltage or to the reference potential Gnd. The nodes between the sensors S1, S2, S3, S4 and the resistance elements R1, R2, R3, R4 are connected via the diodes D1, D2, D3, D4 of the diode network to the output of the circuit arrangement M, and the signal indicating the maximum temperature is applied at the said output. The diodes D1, D2, D3, D4 are connected in the flow direction from the nodes to the output. Furthermore, a resistance element Rm is arranged between the output of the circuit arrangement M and the connection to the reference potential Gnd for the supply voltage. The resistance of this resistance element Rm is much greater than the resistances of the resistance elements R1, R2, R3, R4.
[0030] According to Figure 4The circuit arrangement M can also be most easily explained for the case where the sensor S1 measures the highest temperature while the temperatures at the other sensors S2, S3, and S4 are very low. The resistance of the thermal conductor or sensor S1 is very low compared to the resistances of the thermal conductors or sensors S2, S3, and S4. Due to the voltage dividers between the sensors S2, S3, and S4 and the resistance elements R2, R3, and R4, a potential close to the reference potential Gnd of the supply voltage appears at the nodes between the resistance elements R2, R3, and R4 and the sensors S2, S3, and S4. And due to the voltage divider between the sensor S1 and the resistance element R1, a potential close to the positive potential of the supply voltage appears at the node between the sensor S1 and the resistance element R1. Since the component Rm conducts hardly at all and has a very high resistance, a voltage Tmax close to the reference potential Gnd of the supply voltage first appears at the output. However, if the voltage T1 is now very large due to the increasing temperature at the sensor S1, the diode D1 will conduct and the voltage T1 will appear at the output with the voltage drop across the diode D1 subtracted. Thus, the voltage Tmax at the output corresponds to the voltage T1 with the diode voltage subtracted. In this idealized view, the current through Rm is not considered. The deviation between the voltage Tmax and the voltage T1 is systematic and can be compensated for in the controller ECU when evaluating the temperature signals.
[0031] Not only by using the circuit arrangement M according to Figure 3 but also by using the circuit arrangement M according to Figure 4 can a voltage Tmax be provided at its output, from which the controller can ascertain the maximum temperature of the circuit arrangement M. List of reference signs
[0032] M Circuit arrangement according to the invention
[0033] M' Circuit arrangement according to the prior art
[0034] MAX(T1, T2, T3, T4) Device for determining the maximum temperature
[0035] S1 Sensor
[0036] S2 Sensor
[0037] S3 Sensor
[0038] S4 Sensor
[0039] R1 Resistance element
[0040] R2 Resistance element
[0041] R3 Resistance element
[0042] R4 Resistance element
[0043] Rm Resistance component
[0044] D1 Diode
[0045] D2 Diode
[0046] D3 Diode
[0047] D4 Diode
[0048] Positive potential of the Vb supply voltage
[0049] Reference potential of the Gnd supply voltage
[0050] Voltage T1 indicating the temperature at sensor S1
[0051] Voltage T2 indicating the temperature at sensor S2
[0052] Voltage T3 indicating the temperature at sensor S3
[0053] Voltage T4 indicating the temperature at sensor S4
[0054] Voltage Tmax indicating the temperature at the output terminal
Claims
1. A circuit arrangement (M), comprising a circuit board and an arrangement of conductor tracks and electrical components arranged on the circuit board, wherein the electrical components are connected to one another via the conductor tracks, wherein: The components include temperature sensors (S1, S2, S3, S4), with which the temperature at different locations of the circuit board can be detected, wherein the circuit arrangement (M) has an output and the output of the circuit arrangement (M) is connected to the output of the temperature sensors (S1, S2, S3, S4), It is characterized in that The circuit arrangement has a device for determining a maximum temperature (MAX (T1, T2, T3, T4)), wherein an output of each temperature sensor (S1, S2, S3, S4) is respectively connected to an input of the device for determining a maximum temperature (MAX (T1, T2, T3, T4)), and an output of the device for determining a maximum temperature (MAX (T1, T2, T3, T4)) is connected to an output of the circuit arrangement (M), the device for determining a maximum temperature (MAX (T1, T2, T3, T4)) being suitable and designed for, - determining, from the temperature signals (T1, T2, T3, T4) applied at the input terminals, a temperature signal indicating the highest temperature, and The temperature signal or another signal indicating the maximum temperature (Tmax) is applied to the output of the means for determining the maximum temperature and thus to the output of the circuit arrangement (M).
2. The circuit arrangement (M) according to claim 1, characterized in that The device for determining a maximum temperature (MAX(T1, T2, T3, T4)) comprises a diode network, a discrete transistor circuit, an operational amplifier circuit or an integrated circuit.
3. The circuit arrangement (M) according to claim 2, characterized in that The diode network has a plurality of resistor components (R1, R2, R3, R4), each of which is arranged in series with a resistor component (S1, S2, S3, S4) with a negative temperature coefficient as a temperature sensor, wherein the series circuit is connected in parallel to an input of a network for a supply voltage.
4. The circuit arrangement (M) according to claim 3, characterized in that The resistance members (R1, R2, R3, R4) are connected at a connection portion for a high potential (Vb) of an input terminal for a supply voltage, and resistance members (S1, S2, S3, S4) having a negative temperature coefficient are connected to a low potential (Gnd) of the supply voltage.
5. The circuit arrangement (M) according to claim 3, characterized in that A resistance member (S1, S2, S3, S4) having a negative temperature coefficient is connected at a connection portion for a high potential (Vb) of an input terminal for a supply voltage, and the resistance member (R1, R2, R3, R4) is connected to a low potential (Gnd) of the supply voltage.
6. The circuit arrangement (M) according to claim 4 or 5, characterized in that Each node between one of the resistance elements (R1, R2, R3, R4) and one of the resistance elements (S1, S2, S3, S4) with a negative temperature coefficient is connected to an output of the circuit arrangement (M) via a diode (D1, D2, D3, D4).
7. The circuit arrangement (M) according to claims 4 and 6, characterized in that The diodes (D1, D2, D3, D4) are connected in a blocking direction from a node of the series circuit to an output of the circuit arrangement.
8. The circuit arrangement (M) according to claim 7, characterized in that A connection for a high potential (Vb) of the supply voltage of the diode network is connected to an output of the circuit arrangement (M) via a resistance component (Rm).
9. The circuit arrangement (M) according to claim 5 and 6, characterized in that The diodes (D1, D2, D3, D4) are connected in the flow direction from a node of the series circuit to an output of the circuit arrangement (M).
10. The circuit arrangement (M) according to claim 9, characterized in that A connection for a low potential (Gnd) of the supply voltage of the diode network is connected to an output of the circuit arrangement (M) via a resistor component (Rm).