Backboard structure and manufacturing method thereof, and solar cell and manufacturing method thereof

Abstract

The invention relates to a backboard structure and a manufacturing method thereof, and a solar cell and a manufacturing method thereof. The backboard structure is applied to the solar cell, and comprises a backboard which is provided with a lead-out hole; the leading-out end of the back plate lead is arranged in the leading-out hole in a penetrating manner; and the glass powder is filled between the hole wall of the lead-out hole and the lead-out end of the back plate lead, and is connected with the hole wall of the lead-out hole and the lead-out end of the back plate lead in a soldering and sealing manner. According to the backboard structure and the manufacturing method thereof, the solar cell and the manufacturing method thereof, the probability of contact between water vapor and oxygen and a solar cell device is greatly reduced, the packaging requirement of the solar cell is met, and the service life of the solar cell is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of solar cells, and particularly to a backplane structure and a manufacturing method thereof, a solar cell and a manufacturing method thereof. Background Art

[0002] In recent years, the problems of global energy shortage and environmental pollution have become increasingly prominent. As an ideal renewable energy source, solar cells have received more and more attention. A solar cell, also known as a photovoltaic cell, is a device that directly converts light energy into electrical energy through the photovoltaic effect or the photochemical effect. It has rapidly achieved a relatively high photoelectric conversion efficiency in the few years since its birth and has good application prospects.

[0003] With the development of solar cell technology, people have higher and higher requirements for the performance of solar cells, such as the efficiency, stability, service life, etc. of solar cells. The service life of traditional solar cells is relatively short. Therefore, how to improve the performance of solar cells and extend the service life of solar cells has become an urgent problem to be solved. Summary of the Invention

[0004] Based on this, in view of the above problems, it is necessary to provide a backplane structure with a long service life and a manufacturing method thereof, a solar cell and a manufacturing method thereof.

[0005] A backplane structure is applied to a solar cell. The backplane structure includes:

[0006] A backplane, on which lead-out holes are formed;

[0007] A backplane lead, and the lead-out end of the backplane lead penetrates through the lead-out hole; and

[0008] Glass powder is filled between the hole wall of the lead-out hole and the lead-out end of the backplane lead, and is hermetically welded and connected to the hole wall of the lead-out hole and the lead-out end of the backplane lead.

[0009] In some embodiments, the lead-in end of the backplane lead is located on the side of the backplane facing the solar cell device of the solar cell;

[0010] The backplane structure further includes a fixing adhesive layer, and the lead-in end of the backplane lead is adhesively bonded to the backplane through the fixing adhesive layer.

[0011] In some embodiments, there are two backplane leads, which are respectively a backplane positive lead and a backplane negative lead. The lead-out ends of the backplane positive lead and the backplane negative lead are arranged at intervals and penetrate through the same lead-out hole.

[0012] In some of these embodiments, there are two backplane leads, namely a backplane positive lead and a backplane negative lead respectively; there are two lead-out holes, namely a positive lead-out hole and a negative lead-out hole respectively;

[0013] The lead-out end of the backplane positive lead penetrates through the positive lead-out hole, and the lead-out end of the backplane negative lead penetrates through the negative lead-out hole.

[0014] A solar cell, comprising:

[0015] A carrier board structure, including a carrier board, solar cell devices and carrier board leads, where the solar cell devices and the carrier board leads are located on the same side of the carrier board; and

[0016] The backplane structure as described in any of the above embodiments, where the backplane structure is located on the side of the solar cell devices and the carrier board leads away from the carrier board;

[0017] Wherein, the carrier board leads are electrically connected between the lead-in end of the backplane leads and the solar cell devices.

[0018] In some of these embodiments, one side of the carrier board has a battery area and a non-battery area provided around the periphery of the battery area. The solar cell devices are located in the battery area, and the carrier board leads are located in the battery area and the non-battery area, or the carrier board leads are located in the non-battery area;

[0019] The lead-out holes are aligned with the battery area.

[0020] In some of these embodiments, the carrier board structure further includes a water and gas barrier adhesive layer and an insulating adhesive layer. The water and gas barrier adhesive layer at least covers the solar cell devices and the carrier board leads;

[0021] When the carrier board leads are located in the battery area and the non-battery area, the insulating adhesive layer is laminated between the water and gas barrier adhesive layer and the carrier board leads.

[0022] In some of these embodiments, the carrier board structure further includes a water and gas barrier adhesive layer and an insulating adhesive layer. The water and gas barrier adhesive layer at least covers the solar cell devices and the carrier board leads;

[0023] When the carrier board leads are located in the non-battery area, the insulating adhesive layer is laminated between the water and gas barrier adhesive layer and the backplane leads.

[0024] In some of these embodiments, one side of the carrier board has a battery area and a non-battery area provided around the periphery of the battery area. The solar cell devices are located in the battery area, and the carrier board leads are located in the non-battery area;

[0025] The lead-out hole is aligned with the non-battery area.

[0026] In some embodiments, one side of the carrier plate has a battery area, a non-battery area disposed around the outer periphery of the battery area, and an edge seal area disposed around the outer periphery of the non-battery area;

[0027] The solar cell device is located in the battery area, the carrier plate lead is located in the battery area and the non-battery area, or the carrier plate lead is located in the non-battery area; the carrier plate structure further includes an edge sealant layer, and the edge sealant layer is located in the edge seal area and is used to seal and connect the back plate and the carrier plate.

[0028] A manufacturing method of a back plate structure, the manufacturing method of the back plate structure includes:

[0029] Open a lead-out hole in the back plate;

[0030] Thread the lead-out end of the back plate lead through the lead-out hole;

[0031] Fill glass powder between the hole wall of the lead-out hole and the lead-out end of the back plate lead, and seal and connect the glass powder with the hole wall of the lead-out hole and the lead-out end of the back plate lead by soldering.

[0032] In some embodiments, the manufacturing method of the back plate structure further includes:

[0033] Bond the lead-in end of the back plate lead to the back plate with a fixing adhesive layer, and the lead-in end of the back plate lead is located on the side of the back plate facing the solar cell device of the solar cell.

[0034] In some embodiments, the manufacturing method of the solar cell includes:

[0035] Manufacture a back plate structure by using the manufacturing method of the back plate structure described above;

[0036] Manufacture a carrier plate structure: dispose a solar cell device and carrier plate leads on the same side of the carrier plate;

[0037] Dispose the back plate and the back plate lead in the back plate structure on the side of the solar cell device and the carrier plate leads facing away from the carrier plate, laminate the carrier plate and the back plate, and electrically connect the carrier plate leads between the solar cell device and the lead-in end of the back plate lead.

[0038] In some embodiments, the manufacturing of the carrier plate structure includes:

[0039] The solar cell device is disposed in the battery region on one side of the carrier board, and the carrier board leads are disposed in the battery region and the non-battery region on one side of the carrier board, or in the non-battery region, and the non-battery region is disposed around the outer periphery of the battery region;

[0040] Before laminating the carrier board and the backplane, it further includes: aligning the lead-out holes of the backplane with the battery region.

[0041] In some embodiments, the manufacturing carrier board structure further includes: covering at least the solar cell device and the carrier board leads with a water and gas barrier adhesive layer, and when the carrier board leads are located in the battery region and the non-battery region, an insulating adhesive layer is stacked between the water and gas barrier adhesive layer and the carrier board leads.

[0042] In some embodiments, the manufacturing carrier board structure further includes: covering at least the solar cell device and the carrier board leads with a water and gas barrier adhesive layer, and when the carrier board leads are located in the non-battery region, an insulating adhesive layer is stacked between the water and gas barrier adhesive layer and the backplane leads.

[0043] In the above-mentioned backplane structure and its manufacturing method, solar cell and its manufacturing method, by using glass powder to fill between the hole wall of the lead-out hole and the lead-out end of the backplane lead, and welding and sealing connection with the hole wall of the lead-out hole and the lead-out end of the backplane lead to form a vitreous body. During the welding and sealing process, the molten glass powder can be hermetically sealed and insulated with materials such as glass, ceramic, metal, semiconductor, etc., and can be tightly combined. Therefore, a good sealing effect can be formed between the lead-out end of the backplane lead and the hole wall of the lead-out hole. In addition, the welded and sealed vitreous body also has excellent chemical stability, high water resistance and high gas barrier properties. It is extremely difficult for external water vapor and oxygen to penetrate through the welded and sealed vitreous body and invade the interior of the solar cell, thereby greatly reducing the probability of water vapor and oxygen contacting the solar cell device, meeting the packaging requirements of the solar cell, and extending the service life of the solar cell. Description of the Drawings

[0044] Figure 1 It is a schematic structural diagram of a solar cell in some embodiments of the present application.

[0045] Figure 2 It is Figure 1 A schematic structural diagram of the backplane of the solar cell shown.

[0046] Figure 3 It is Figure 1 A schematic structural diagram of the cooperation of the fixing adhesive layer, backplane leads and vitreous body of the solar cell shown.

[0047] Figure 4 It is Figure 1Top view of the solar cell shown after removing the backsheet.

[0048] Figure 5 is Figure 4 Schematic structural diagram of the solar cell shown after removing the glass body, the positive backsheet lead, and the negative backsheet lead.

[0049] Figure 6 is Figure 5 Schematic structural diagram of the solar cell shown after removing the insulating adhesive layer.

[0050] Figure 7 is Figure 1 Cross-sectional view of the solar cell shown after being cut along the A-A direction.

[0051] Figure 8 is Figure 7 Enlarged schematic diagram of the local structure B in the solar cell shown.

[0052] Figure 9 is Figure 7 Enlarged schematic diagram of the local structure C in the solar cell shown.

[0053] Figure 10 Schematic structural diagram of the solar cell in some other embodiments of the present application.

[0054] Figure 11 is Figure 10 Schematic structural diagram of the solar cell shown after removing the backsheet.

[0055] Figure 12 is Figure 11 Schematic structural diagram of the solar cell shown after removing the glass body.

[0056] Figure 13 is Figure 12 Top view of the solar cell shown after removing the positive backsheet lead and the negative backsheet lead.

[0057] Figure 14 is Figure 10 Cross-sectional view of the solar cell shown after being cut along the D-D direction.

[0058] Figure 15 is Figure 14 Enlarged schematic diagram of the local structure E in the solar cell shown.

[0059] Figure 16 Schematic structural diagram of the solar cell in some other embodiments of the present application.

[0060] Figure 17 is Figure 16 Schematic structural diagram of the solar cell shown after removing the backsheet.

[0061] Figure 18 The Figure 17 structural schematic diagram of the solar cell shown after removing the glass body.

[0062] Figure 19 The Figure 18 top view of the solar cell shown after removing the fixing adhesive layer, the positive backplane lead, and the negative backplane lead.

[0063] Figure 20 The Figure 16 cross-sectional view of the solar cell shown after being cut along the F-F direction.

[0064] Figure 21 The Figure 20 magnified schematic diagram of the local structure G in the solar cell shown.

[0065] Figure 22 structural schematic diagram of the solar cell after removing the backplane, the edge sealant layer, and the fixing adhesive layer in some other embodiments of the present application.

[0066] Figure 23 structural schematic diagram of the solar cell after removing the backplane, the edge sealant layer, and the fixing adhesive layer in some other embodiments of the present application.

[0067] Figure 24 structural schematic diagram of the solar cell in some other embodiments of the present application.

[0068] Figure 25 The Figure 24 structural schematic diagram of the solar cell shown after removing the backplane.

[0069] Figure 26 The Figure 25 structural schematic diagram of the solar cell shown after removing the glass body and the fixing adhesive layer.

[0070] Figure 27 The Figure 26 structural schematic diagram of the solar cell shown after removing the positive backplane lead and the negative backplane lead.

[0071] Figure 28 The Figure 24 cross-sectional view of the solar cell shown after being cut along the H-H direction.

[0072] Figure 29 The Figure 28 magnified schematic diagram of the local structure J in the solar cell shown.

[0073] Figure 30 flow schematic diagram of the manufacturing method of the backplane structure in some embodiments of the present application.

[0074] Figure 31 Schematic flow diagram of the manufacturing method of a solar cell in some embodiments of the present application.

[0075] Figure 32 Schematic flow diagram of the manufacturing method of a solar cell in some other embodiments of the present application.

[0076] Figure 33 Schematic flow diagram of the manufacturing method of a solar cell in some further embodiments of the present application.

[0077] Figure 34 Schematic flow diagram of the manufacturing method of a solar cell in some other further embodiments of the present application.

[0078] Reference numerals in the drawings:

[0079] 1. Solar cell;

[0080] 10. Backplane structure; 20. Carrier board structure;

[0081] 11. Backplane; 111. Lead-out hole; 111a. Positive lead-out hole; 111b. Negative lead-out hole; 12. Backplane lead; 12a. Backplane positive lead; 12b. Backplane negative lead; 13. Glass body; 14. Fixing adhesive layer;

[0082] 21. Carrier board; 21a. Cell area; 21b. Non-cell area; 21c. Edge sealing area; 22. Solar cell device; 23. Carrier board busbar; 23a. Carrier board positive busbar; 23b. Carrier board negative busbar; 24. Carrier board string; 24a. Carrier board positive string; 24b. Carrier board negative string; 25. Water and gas barrier adhesive layer; 26. Insulating adhesive layer; 27. Edge sealing adhesive layer. Detailed implementation manners

[0083] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0084] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0085] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0086] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0087] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0088] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0089] Please refer to Figure 1 , this application provides a backplane structure 10, which is applied to the solar cell 1. Among them, the solar cell 1 can be but is not limited to a crystalline silicon solar cell, a cadmium telluride solar cell, a copper indium gallium tin solar cell, a perovskite solar cell, an organic solar cell, etc. For the convenience of description, in the following embodiments, the solar cell 1 is taken as an example of a perovskite solar cell for illustration.

[0090] Please refer to again Figure 1 , and at the same time refer to Figure 2 , Figure 3 and Figure 4 , the solar cell 1 includes a backplane structure 10 and a carrier structure 20. The carrier structure 20 includes a carrier 21 and a solar cell device 22. The backplane structure 10 includes a backplane 11, a backplane lead 12 and glass powder. Among them, an accommodation space for accommodating the solar cell device 22 is formed between the carrier 21 and the backplane 11. The backplane lead 12 is assembled on the backplane 11 and is used to output the electric energy of the solar cell 1. The glass powder is used to fill the gap between the backplane 11 and the backplane lead 12.

[0091] Specifically, an extraction hole 111 is formed on the backplane 11. The extraction end of the backplane lead 12 passes through the extraction hole 111. The glass powder is filled between the hole wall of the extraction hole 111 and the extraction end of the backplane lead 12 and is hermetically welded to the hole wall of the extraction hole 111 and the extraction end of the backplane lead 12.

[0092] The carrier 21 refers to a transparent plate member of the solar cell 1 disposed facing the sun. Exemplarily, the carrier 21 can be a plate member made of transparent materials such as glass and polyethylene terephthalate.

[0093] The solar cell device 22 is a component in the solar cell 1 that undergoes a photoelectric reaction with light. Taking the solar cell 1 as an example of a perovskite solar cell 1, the solar cell device 22 includes a hole transport layer, a light absorption layer and an electron transport layer stacked. Among them, the setting methods of the hole transport layer, the light absorption layer and the electron transport layer are conventional technologies in the art, so they will not be elaborated here.

[0094] The backplane 11 refers to the plate member disposed on the back side of the solar cell 1. The backplane 11 can be made of insulating materials such as glass, plastic, etc. To improve the tightness of the fusion between the backplane 11 and the glass powder, the backplane 11 is formed by using glass. The lead-out holes 111 formed on the backplane 11 can be waist-shaped holes, rectangular holes, circular holes, oval holes, etc., and the opening area of the lead-out holes 111 is in the range of 1 square millimeter (mm 2 ) to 500 square millimeters (mm 2 ).

[0095] The backplane lead 12 refers to the component that realizes the current transmission between the solar cell device 22 and the external circuit in the solar cell 1. Specifically, the introduction end of the backplane lead 12 is electrically connected to the solar cell device 22, and the lead-out end of the backplane lead 12 passes through the lead-out hole 111 on the backplane 11 and is electrically connected to the external circuit. Exemplarily, the backplane lead 12 can be a component made of a single metal (such as gold, silver, copper, aluminum, nickel, tin, etc.), an alloy or a metal oxide.

[0096] Taking the perovskite solar cell 1 as an example of the solar cell 1, the backplane lead 12 is used to transmit electrons or holes to the external circuit. Among them, there are generally two backplane leads 12, one of which is the backplane positive lead 12a, and the other is the backplane negative lead 12b. The lead-out end of the backplane positive lead 12a is connected to the positive pole of the external circuit, and the lead-out end of the backplane negative lead 12b is connected to the negative pole of the external circuit.

[0097] Please refer to Figure 1 , Figure 10 , Figure 16 and Figure 24 together. The lead-out end of the backplane lead 12 passes through the lead-out hole 111. It can be that the lead-out ends of the backplane positive lead 12a and the backplane negative lead 12b pass through the same lead-out hole 111, or it can also be that the lead-out ends of the backplane positive lead 12a and the backplane negative lead 12b pass through different lead-out holes 111, etc. Specifically, it can be set according to needs and is not limited here.

[0098] Glass powder is an inorganic amorphous hard ultra-fine particle powder. In production, raw materials such as high-temperature high-purity silica and alumina are used, and then through an ultra-clean production process, a glass transparent powder with a disordered structure is formed. It has stable chemical properties and is a super weather-resistant powder material with acid and alkali resistance, chemical inertness, and low expansion coefficient.

[0099] The glass powder can be hermetically welded and connected to the pore wall of the lead-out hole 111 and the lead-out end of the backplane lead 12 by means of high-temperature melting, sintering, laser, ultrasonic wave, etc. After the glass powder is hermetically welded, a vitreous body 13 is formed. The vitreous body 13 has electrical insulation and a coefficient of thermal expansion close to that of the backplane 11 made of glass, enabling the vitreous body 13 to tightly fit into the lead-out hole 111 and the vitreous body 13 to be well combined with the backplane 11.

[0100] In traditional technologies, filling is usually carried out using a film (such as ethylene-vinyl acetate copolymer, commonly known as EVA, polyethylene octene co-elastic body, commonly known as POE) or glue (silicone, epoxy resin), etc. Understandably, a curing operation is required after the glue is filled. Due to the weak water resistance and gas barrier properties of the film and glue, the solar cell 1 is still vulnerable to the intrusion of external water vapor, oxygen, etc., ultimately causing the solar cell 1 to decay and fail within the warranty period.

[0101] In this application, by using glass powder to fill between the pore wall of the lead-out hole 111 and the lead-out end of the backplane lead 12 and hermetically welding and connecting them to form the vitreous body 13, during the hermetic welding process, the molten glass powder can be hermetically sealed and insulated with materials such as glass, ceramics, metals, semiconductors, etc., and can be tightly combined. Therefore, a good sealing effect can be formed between the lead-out end of the backplane lead 12 and the pore wall of the lead-out hole 111. In addition, the hermetically welded vitreous body 13 also has excellent chemical stability, high water resistance and high gas barrier properties. It is extremely difficult for external water vapor and oxygen to penetrate through the hermetically welded vitreous body 13 and invade the interior of the solar cell 1, thereby greatly reducing the probability of water vapor and oxygen contacting the solar cell device 22, meeting the packaging requirements of the solar cell 1, and extending the service life of the solar cell 1.

[0102] Please refer to Figure 4 、 Figure 5 、 Figure 11 、 Figure 18 and Figure 25 , in some embodiments of this application, the lead-in end of the backplane lead 12 is located on the side of the backplane 11 facing the solar cell device 22 of the solar cell 1; the backplane structure 10 further includes a fixing adhesive layer 14, and the lead-in end of the backplane lead 12 is adhesively bonded to the backplane 11 through the fixing adhesive layer 14.

[0103] Among them, the fixing adhesive layer 14 is located inside the backplane 11 facing the solar cell device 22 of the solar cell 1 and is used to adhesively bond the two opposite surfaces of the lead-in end of the backplane lead 12 and the backplane 11.

[0104] Exemplarily, the fixing adhesive layer 14 can be an elastic double-sided adhesive, a solid adhesive layer formed after curing of a liquid colloid, and so on. Preferably, the fixing adhesive layer 14 is an elastic double-sided adhesive. The elastic double-sided adhesive is convenient to obtain materials and is convenient for bonding the introduction end of the backplane lead 12 and the backplane 11.

[0105] The cooperation of the fixing adhesive layer 14 and the vitreous body 13 can fix and tension both ends of the backplane lead 12. Then, after the backplane structure 10 is formed, the risk of deformation of the backplane lead 12 can be reduced, which is beneficial to improving the reliability of the manufacture of the backplane structure 10. In addition, the cooperation of the fixing adhesive layer 14 and the vitreous body 13 is beneficial to reducing the probability that the introduction end of the backplane lead 12 moves relative to the backplane 11 during the manufacture of the backplane structure 10, which helps to achieve the precise positioning of the backplane lead 12, thereby ensuring the reliability of the subsequent electrical connection between the introduction end of the backplane lead 12 and the solar cell 1.

[0106] Please refer to again Figure 10 and Figure 24 In some embodiments of the present application, there are two backplane leads 12, which are respectively a backplane positive lead 12a and a backplane negative lead 12b. The leading ends of the backplane positive lead 12a and the backplane negative lead 12b are arranged at intervals and pass through the same lead-out hole 111.

[0107] The leading ends of the backplane positive lead 12a and the backplane negative lead 12b pass through the same lead-out hole 111 at intervals and are insulated by the vitreous body 13. Moreover, the leading end of the backplane positive lead 12a is connected to the positive pole of the external circuit, and the leading end of the backplane negative lead 12b is connected to the negative pole of the external circuit.

[0108] In this design, only one lead-out hole 111 needs to be provided, which simplifies the structure of the backplane structure 10, reduces the manufacturing process and cost of the backplane structure 10, and is beneficial to improving the production efficiency.

[0109] Please refer to again Figure 1 and Figure 16 In some embodiments of the present application, there are two backplane leads 12, which are respectively a backplane positive lead 12a and a backplane negative lead 12b; there are two lead-out holes 111, which are respectively a positive lead-out hole 111a and a negative lead-out hole 111b; the leading end of the backplane positive lead 12a passes through the positive lead-out hole 111a, and the leading end of the backplane negative lead 12b passes through the negative lead-out hole 111b.

[0110] Wherein, between the hole wall of the positive lead-out hole 111a and the leading end of the backplane positive lead 12a, and between the hole wall of the negative lead-out hole 111b and the leading end of the backplane negative lead 12b, they are both connected by glass powder soldering seal.

[0111] Understandably, the lead-out ends of the backplane positive lead 12a and the backplane negative lead 12b pass through different lead-out holes 111, and the backplane positive lead 12a and the backplane negative lead 12b can also be insulated by the backplane 11, ensuring the reliability of the insulation between the backplane positive lead 12a and the backplane negative lead 12b.

[0112] Of course, the setting of the lead-out holes 111 is not limited to the above two methods. In some other embodiments, the lead-out holes 111 can also be three or more. The same backplane lead 12 passes through at least one lead-out hole 111 and is electrically connected to the external circuit. The lead-out holes 111 through which different backplane leads 12 pass can be exactly the same, partially the same, or completely different.

[0113] Please refer to again Figure 1 、 Figures 4 to 6 、 Figures 10 to 13 , Figures 16 to 19 , Figures 24 to 27 The present application also provides a solar cell 1, which includes a carrier plate structure 20 and the backplane structure 10 of any one of the above embodiments. The carrier plate structure 20 includes a carrier plate 21, a solar cell device 22, and carrier plate leads. The solar cell device 22 and the carrier plate leads are located on the same side of the carrier plate 21, and the backplane structure 10 is located on the side of the solar cell device 22 and the carrier plate leads away from the carrier plate 21; wherein, the carrier plate leads are electrically connected between the lead-in end of the component backplane lead 12 and the solar cell device 22.

[0114] The carrier plate leads can only include a carrier plate current-carrying part 24, or can also include a carrier plate current-carrying part 24 and a carrier plate busbar part 23 at the same time.

[0115] Take Figures 22 to 23 as an example, the carrier plate leads only include a carrier plate current-carrying part 24. The lead-in end of the backplane lead 12 is directly electrically connected to the solar cell 1 through the carrier plate current-carrying part 24.

[0116] Take Figures 1 to 21 ,and Figures 24 to 28 as an example, the carrier plate leads include a carrier plate current-carrying part 24 and a carrier plate busbar part 23 at the same time. In this embodiment, the lead-in end of the backplane lead 12 is electrically connected to the solar cell 1 through the carrier plate busbar part 23 and the carrier plate current-carrying part 24 in sequence. For the convenience of description, the following embodiments will be described by taking the carrier plate leads including a carrier plate current-carrying part 24 and a carrier plate busbar part 23 at the same time as an example.

[0117] The carrier plate current-carrying part 24 and the carrier plate busbar part 23 can be components made of a single metal (such as gold, silver, copper, aluminum, nickel, tin, etc.), an alloy, or a metal oxide. The carrier plate current-carrying part 24 and the carrier plate busbar part 23 are generally strip-shaped, and the width of both is in the range of 1 millimeter (mm) to 20 millimeters (mm).

[0118] Among them, there are two carrier plate current-carrying parts 24. Among the two carrier plate current-carrying parts 24, one is the carrier plate positive current-carrying part 24a, and the other is the carrier plate negative current-carrying part 24b. The carrier plate positive current-carrying part 24a is connected to the positive electrode of the solar cell device 22, and the carrier plate positive current-carrying part 24a is connected to the negative electrode of the solar cell device 22.

[0119] Such as Figure 6 、 Figure 13 、 Figure 19 and Figure 27 As shown, the solar cell device 22 is generally arranged in a rectangular structure, and the carrier plate positive current-carrying part 24a and the carrier plate negative current-carrying part 24b are arranged at intervals along the width direction of the solar cell device 22 on the opposite sides of the solar cell device 22.

[0120] There are two carrier plate current-collecting parts 23. Among the two carrier plate current-collecting parts 23, one is the carrier plate positive current-collecting part 23a, and the other is the carrier plate negative current-collecting part 23b. The carrier plate positive current-collecting part 23a is connected between the leading-in end of the backplane positive lead 12a and the carrier plate positive current-carrying part 24a, and the carrier plate negative current-collecting part 23b is connected between the leading-in end of the backplane negative lead 12b and the carrier plate negative current-carrying part 24b.

[0121] Such as Figure 6 and Figure 27 As shown, both the carrier plate positive current-collecting part 23a and the carrier plate negative current-collecting part 23b extend along the width direction of the solar cell device 22, and the two are arranged at intervals. The carrier plate positive current-collecting part 23a and the carrier plate negative current-collecting part 23b can be located at one end of the solar cell device 22 along its length direction at the same time, and do not overlap with the orthographic projection of the solar cell device 22 in its own thickness direction. Such as Figure 13 and Figure 19 As shown, the carrier plate positive current-collecting part 23a and the carrier plate negative current-collecting part 23b overlap with the orthographic projection of the solar cell device 22 in its own thickness direction. One end of the carrier plate positive current-collecting part 23a overlaps above the carrier plate positive current-carrying part 24a, and the leading-in end of the backplane positive lead 12a overlaps above the other end of the carrier plate positive current-collecting part 23a; the leading-in end of the carrier plate negative current-collecting part 23b overlaps above the carrier plate negative current-carrying part 24b, and the leading-in end of the backplane negative lead 12b overlaps above the leading-out end of the carrier plate negative current-collecting part 23b.

[0122] In this application, the solar cell 1 including the backplane structure 10 of any one of the above embodiments has the effects of any one of the above embodiments, so it will not be elaborated here.

[0123] Please refer to Figure 1 、 Figure 4 、 Figures 10 to 11 , Figures 16 to 17 ,Figures 22 to 23 , Figures 24 to 25 In some embodiments of the present application, one side of the carrier plate 21 has a battery region 21a and a non-battery region 21b disposed around the outer periphery of the battery region 21a. The solar cell device 22 is located in the battery region 21a, the carrier plate leads are located in the battery region 21a and the non-battery region 21b, or the carrier plate leads are located in the non-battery region 21b. The lead-out hole 111 is aligned with the battery region 21a.

[0124] Among them, the backplane lead 12 is aligned with the battery region 21a.

[0125] When the carrier plate leads are located in the battery region 21a and the non-battery region 21b, both the carrier plate positive current series part 24a and the carrier plate negative current series part 24b are located in the non-battery region 21b, and both the carrier plate positive current collecting part 23a and the carrier plate negative current collecting part 23b are located in the battery region 21a. Specifically, as shown in Figure 11 and Figure 17 .

[0126] Taking Figure 4 and Figure 25 as an example, the carrier plate leads include a carrier plate positive current series part 24a, a carrier plate negative current series part 24b, a carrier plate positive current collecting part 23a, and a carrier plate negative current collecting part 23b. The carrier plate positive current series part 24a, the carrier plate negative current series part 24b, the carrier plate positive current collecting part 23a, and the carrier plate negative current collecting part 23b are all located in the non-battery region 21b. At this time, it is considered that the carrier plate leads are located in the non-battery region 21b.

[0127] Taking Figure 22 and Figure 23 as an example, the carrier plate leads only include a carrier plate positive current series part 24a and a carrier plate negative current series part 24b. The carrier plate positive current series part 24a and the carrier plate negative current series part 24b are both located in the non-battery region 21b. At this time, it is also considered that the carrier plate leads are located in the non-battery region 21b. A component being located within the battery region 21a means that the component is disposed on the carrier plate 21 and the positive projection of the component in the thickness direction of the solar cell device 22 falls within the battery region 21a.

[0128] A component being located within the non-battery region 21b means that the component is disposed on the carrier plate 21 and the positive projection of the component in the thickness direction of the solar cell device 22 falls within the non-battery region 21b.

[0129] A component being located within the battery region 21a and the non-battery region 21b means that the component is disposed on the carrier plate 21 and the positive projection of the component in the thickness direction of the solar cell device 22 partially falls within the battery region 21a and partially falls within the non-battery region 21b.

[0130] If the lead-out hole 111 is aligned with the battery region 21a, then the backplane lead 12 will also be aligned with the battery region 21a.

[0131] In this embodiment, since the battery region 21a is the region where the solar cell device 22 is mainly disposed, and the solar cell device 22 is the main working component of the solar cell 1, considering the energy density, the area of the battery region 21a should be much larger than that of the non-battery region 21b. Thus, on the premise of ensuring the alignment of the lead-out hole 111 with the battery region 21a, the opening position can be set more flexibly to meet diverse manufacturing requirements.

[0132] Please refer to Figures 11 to 15 , and Figures 16 to 21 , in some embodiments of the present application, the carrier plate structure 20 further includes a moisture and gas barrier adhesive layer 25 and an insulating adhesive layer 26. The moisture and gas barrier adhesive layer 25 covers at least the solar cell device 22 and the carrier plate leads. When the carrier plate leads are located in the battery region 21a and the non-battery region 21b, the insulating adhesive layer 26 is stacked between the moisture and gas barrier adhesive layer 25 and the carrier plate leads.

[0133] When the insulating adhesive layer 26 is stacked between the moisture and gas barrier adhesive layer 25 and the carrier plate leads, the insulating adhesive layer 26 is stacked between the moisture and gas barrier adhesive layer 25 and the carrier plate positive busbar portion 23a, and between the moisture and gas barrier adhesive layer 25 and the carrier plate negative busbar portion 23b. Moreover, the insulating adhesive layer 26 stacked between the moisture and gas barrier adhesive layer 25 and the carrier plate positive busbar portion 23a, and the insulating adhesive layer 26 stacked between the moisture and gas barrier adhesive layer 25 and the carrier plate negative busbar portion 23b can be connected as a whole or can be separately provided.

[0134] Preferably, the moisture and gas barrier adhesive layer 25 covers the region of the non-battery region 21b where the carrier plate busbars 23 and the carrier plate series connection portions 24 are not provided, and the moisture and gas barrier adhesive layer 25 also covers the solar cell device 22, the carrier plate busbars 23, and the carrier plate series connection portions 24. It should be noted that a vacancy should be left in the region where the carrier plate busbar 23 contacts the backplane lead 12 so that the backplane lead 12 can contact and be electrically connected to the carrier plate busbar 23.

[0135] The moisture and gas barrier adhesive layer 25 can be the above-mentioned adhesive film or glue, and the adhesive film or glue can block a certain amount of water vapor and oxygen. Since the overall formed by the cooperation of the backplane 11, the carrier plate 21, and the glass body 13 itself already has high water resistance and high gas barrier properties, and the amount of water vapor and oxygen that can penetrate is extremely small. Combining with the moisture and gas barrier adhesive layer 25, the water vapor and oxygen finally contacting the solar cell device 22, the carrier plate busbars 23, and the carrier plate series connection portions 24 are even less, meeting the encapsulation requirements of the solar cell 1 and extending the service life of the solar cell 1.

[0136] The insulating adhesive layer 26 can be a single-sided adhesive, a double-sided adhesive, or other adhesive layers with insulating functions.

[0137] To Figure 15 andFigure 21 For example, from a local view, from top to bottom, they are: the backplane 11, the fixed adhesive layer 14, the lead-in end of the backplane lead 12, the portion of the carrier busbar 23 in contact with the backplane 11, the insulating adhesive layer 26, the water-blocking and gas-blocking adhesive layer 25, the solar cell device 22 and the carrier 21 (in the actual manufacturing process, the manufacturing process is: forming the solar cell device 22 on the carrier 21 → covering the solar cell device 22 with the water-blocking and gas-blocking adhesive layer 25 → covering the water-blocking and gas-blocking adhesive layer 25 with the insulating adhesive layer 26 → arranging the carrier busbar 23 on the insulating adhesive layer 26 → covering the carrier busbar 23 with the water-blocking and gas-blocking adhesive layer 25, but note that the area where the carrier busbar 23 contacts the backplane lead 12 is left empty).

[0138] During the high-temperature lamination process of the backplane 11 and the carrier 21, the water-blocking and gas-blocking adhesive layer 25 is easy to melt, causing the carrier runner 23 to contact and short-circuit with the solar cell device 22. In addition, the backplane leads 12 and the carrier runner 23 are usually made of metal materials such as metal, metal alloy, metal oxide, etc., which are limited by the production process and are prone to burrs. If the burrs pierce the water-blocking and gas-blocking adhesive layer 25 and contact with the solar cell device 22, it will also cause a short circuit inside the solar cell 1 and the solar cell 1 will fail. Therefore, in the process of manufacturing the solar cell 1, the adverse effects caused by the melting of the water-blocking and gas-blocking adhesive layer 25 and the burrs of the carrier runner 23 should be carefully considered. When the carrier runner 23 is set in the battery area 21a, the insulating adhesive layer 26 is stacked between the water-blocking and gas-blocking adhesive layer 25 and the carrier runner 23. The insulating adhesive layer 26 can prevent the insulating adhesive layer 26 from contacting the solar cell device 22, thereby achieving insulation between the carrier runner 23 and the solar cell device 22.

[0139] Please refer to Figures 4 to 9 ,as well as Figure 22 and Figure 23 In some embodiments of the present application, when the carrier lead is located in the non-battery area 21 b , the insulating adhesive layer 26 is stacked between the water- and gas-blocking adhesive layer 25 and the backplane lead 12 .

[0140] The insulating rubber layer 26 is stacked between the water-blocking and gas-blocking rubber layer 25 and the back plate lead 12. It can be understood that an insulating rubber layer 26 is stacked between the water-blocking and gas-blocking rubber layer 25 and the back plate positive lead 12a, and between the water-blocking and gas-blocking rubber layer 25 and the back plate negative lead 12b.

[0141] Please refer to Figure 9, Viewed locally, from top to bottom, they are: the backplane 11, the part of the backplane lead 12 between its introduction end and extraction end, the insulating adhesive layer 26, the water and air barrier adhesive layer 25, the solar cell device 22, and the carrier plate 21. It can be seen that when the carrier plate lead is located in the non-battery area 21b, during the high-temperature lamination process of the backplane 11 and the carrier plate 21, only the backplane lead 12 has the risk of passing through the molten water and air barrier adhesive layer 25 and contacting the solar cell device 22.

[0142] By laminating the insulating adhesive layer 26 between the water and air barrier adhesive layer 25 and the backplane lead 12, the insulating adhesive layer 26 can prevent the backplane lead 12 from contacting the solar cell device 22, achieving insulation between the backplane lead 12 and the solar cell device 22, and further improving the reliability of the operation of the solar cell 1.

[0143] Please refer to Figure 24 and Figure 25 , In some embodiments of the present application, one side of the carrier plate 21 has a battery area 21a and a non-battery area 21b provided around the outer periphery of the battery area 21a. The solar cell device 22 is located in the battery area 21a, and the carrier plate lead is located in the non-battery area 21b. The lead-out hole 111 is aligned with the non-battery area 21b.

[0144] Specifically, as shown in Figure 28 and Figure 29 , both the carrier plate busbar portion 23 and the backplane lead 12 are located in the non-battery area 21b, so there is no need to consider the situation where the carrier plate busbar portion 23 and the backplane lead 12 contact and short-circuit the solar cell device 22 due to the melting of the water and air barrier adhesive layer 25 during the high-temperature lamination process of the backplane 11 and the carrier plate 21. Therefore, in this embodiment, there is no need to provide the insulating adhesive layer 26.

[0145] When the lead-out hole 111 is aligned with the non-battery area 21b, the backplane lead 12 is led out from a position near the edge of the backplane 11. Combining with the embodiment where the lead-out hole 111 is aligned with the battery area 21a, the setting position of the lead-out hole 111 is flexible and variable, which is convenient for the manufacture of the backplane structure 10.

[0146] Please refer to again Figure 4 , Figure 11 , Figure 17 and Figure 25, in some embodiments of the present application, one side of the carrier plate 21 has a battery area 21a, a non-battery area 21b disposed around the outer periphery of the battery area 21a, and an edge seal area 21c disposed around the outer periphery of the non-battery area 21b; the solar cell device 22 is located in the battery area 21a, the carrier plate leads are located in the battery area 21a and the non-battery area 21b, or the carrier plate leads are located in the non-battery area 21b; the carrier plate structure 20 further includes an edge sealant layer 27, and the edge sealant layer 27 is located in the edge seal area 21c and is used to seal and connect the back plate 11 and the carrier plate 21.

[0147] The edge sealant layer 27 can be an epoxy-based encapsulant, a silicone-based encapsulant, a polyurethane encapsulant, an ultraviolet light-curing encapsulant, ethylene-vinyl acetate copolymer, polyvinyl butyral, ethylene-octene copolymer, polyisobutylene, and polyolefin-based encapsulants or materials modified by doping the above materials with each other, etc. The edge sealant layer 27 is a closed frame type, and the width range is within the range of 1 millimeter (mm) to 20 millimeters (mm).

[0148] The edge sealant layer 27 is attached to the back plate 11 and the carrier plate 21 and is used to seal the back plate 11 and the carrier plate 21 to form a sealed accommodation space between the back plate 11 and the carrier plate 21. In this way, the solar cell device 22 can be sealed in the accommodation space to reduce the interference of external moisture and oxygen on the operation of the solar cell device 22.

[0149] Please refer to again Figures 1 to 4 and at the same time, please refer to Figure 30 , the present application also provides a manufacturing method of the back plate structure 10 for manufacturing the back plate structure 10 of any one of the above embodiments. The manufacturing method of the back plate structure 10 includes:

[0150] Step 100: Open a lead-out hole 111 on the back plate 11;

[0151] Step 200: Thread the lead-out end of the back plate lead 12 through the lead-out hole 111;

[0152] Step 300: Fill glass powder between the hole wall of the lead-out hole 111 and the lead-out end of the back plate lead 12, and weld and seal the glass powder to the hole wall of the lead-out hole 111 and the lead-out end of the back plate lead 12.

[0153] Specifically, one, two or even more lead-out holes 111 can be formed on the backplane 11 by means of cutting, drilling, or die firing. There are two backplane leads 12, namely a backplane positive lead 12a and a backplane negative lead 12b respectively. Taking the case where only one lead-out hole 111 is formed on the backplane 11 as an example, the lead-out ends of the backplane positive lead 12a and the backplane negative lead 12b are both inserted through the same lead-out hole 111; taking the case where two lead-out holes 111 are formed on the backplane 11 as an example, the lead-out ends of the backplane positive lead 12a and the backplane negative lead 12b are respectively inserted through different lead-out holes 111.

[0154] Insert the lead-out ends of the backplane leads 12 into the lead-out holes 111. After filling glass powder between the hole wall of the lead-out hole 111 and the backplane leads 12, weld and seal the glass powder to the hole wall of the lead-out hole 111 and the lead-out ends of the backplane leads 12, so that the glass powder melts and seals the gap between the hole wall of the lead-out hole 111 and the backplane leads 12.

[0155] After the welding and sealing is completed, check the welding and sealing situation to ensure a better welding and sealing effect. For example, check whether there are cracks or holes at the positions where the glass body 13 contacts the backplane 11 and where the glass body 13 contacts the backplane leads 12, and whether there is any loosening between the glass body 13, the backplane 11 and the backplane leads 12.

[0156] In this application, by filling glass powder between the hole wall of the lead-out hole 111 and the lead-out ends of the backplane leads 12 and welding and sealing the glass powder to the hole wall of the lead-out hole 111 and the lead-out ends of the backplane leads 12, during the welding and sealing process, the molten glass powder can be mutually sealed and insulated with materials such as glass, ceramics, metals, and semiconductors, and can be tightly combined. Therefore, a good sealing effect can be formed between the lead-out ends of the backplane leads 12 and the hole wall of the lead-out hole 111. In addition, the welded and sealed glass body 13 also has better chemical stability, high water resistance, and high gas barrier properties. It is extremely difficult for external water vapor and oxygen to penetrate through the welded and sealed glass body 13 and invade the inside of the solar cell 1, thereby greatly reducing the probability of water vapor and oxygen contacting the solar cell device 22, meeting the packaging requirements of the solar cell 1, and extending the service life of the solar cell 1.

[0157] Please refer to Figure 4 , Figure 5 , Figure 11 , Figure 18 and Figure 25 , and at the same time refer to Figure 30 , in some embodiments of this application, the manufacturing method of the backplane structure 10 further includes:

[0158] Step 400: Bond the lead-in ends of the backplane leads 12 to the backplane 11 with the fixing adhesive layer 14. The lead-in ends of the backplane leads 12 are located on the side of the backplane 11 facing the solar cell device 22 of the solar cell 1.

[0159] The fixing adhesive layer 14 is preferably an elastic double-sided adhesive tape.

[0160] Among them, step 400 can be executed before step 100, step 200 and step 300, or after step 100, step 200 and step 300, or after step 100 and before step 200 and step 300, etc. The specific execution can be selected according to different production processes.

[0161] The lead-in end of the backplane lead 12 is glued to a specific position on the backplane 11, and it is necessary to ensure that the glue is firm and will not fall off, and the lead-in end of the backplane lead 12 can subsequently contact and connect with the carrier lead of the carrier structure 20. It can be understood that the specific position is a pre-designed fixed position of the backplane lead 12.

[0162] The fixed adhesive layer 14 and the glass body 13 cooperate to fix and tighten the two ends of the backplane lead 12. After the backplane structure 10 is formed, the risk of deformation of the backplane lead 12 can be reduced, which is beneficial to improving the reliability of the manufacturing of the backplane structure 10. In addition, the fixed adhesive layer 14 and the glass body 13 cooperate to reduce the probability of the lead-in end of the backplane lead 12 moving relative to the backplane 11 during the manufacturing process of the backplane structure 10, which helps to achieve accurate positioning of the backplane lead 12, thereby ensuring the reliability of the subsequent electrical connection between the lead-in end of the backplane lead 12 and the solar cell 1.

[0163] Please refer againPlease refer again Figure 1 , Figures 4 to 6 , Figures 10 to 13 , Figures 16 to 19 , Figures 24 to 27 , and refer to Figure 31 The present application also provides a method for manufacturing a solar cell 1, which is used to manufacture the solar cell 1 described in any one of the above embodiments. The method for manufacturing the solar cell 1 comprises:

[0164] Step 10: manufacturing the back plate structure 10 by using the manufacturing method of the back plate structure 10 described in any one of the above embodiments;

[0165] Step 20: Manufacturing the carrier structure 20: Arranging the solar cell device 22 and the carrier lead on the same side of the carrier 21;

[0166] Step 30: Arrange the backplane 11 and the backplane leads 12 in the backplane structure 10 on the side of the solar cell device 22 and the carrier leads away from the carrier 21, assemble and laminate the carrier 21 and the backplane 11, and electrically connect the carrier leads between the solar cell device 22 and the lead-in end of the backplane leads 12.

[0167] Among them, step 10 and step 20 can be executed synchronously or asynchronously. Step 30 can be executed before step 10, or can also be executed after step 10, and can be specifically set according to needs.

[0168] Laminating the carrier plate 21 and the backplane 11 and electrically connecting the carrier plate leads between the introduction ends of the solar cell device 22 and the backplane leads 12 may specifically include the steps of: first laminating the carrier plate 21 and the backplane 11. At the same time, in an embodiment where the carrier plate lead has a carrier plate busbar portion 23, align the carrier plate busbar portion 23 and the backplane lead 12 so that the carrier plate busbar portion 23 is in electrical contact with the backplane lead 12. After that, laminate the carrier plate 21 and the backplane 11. Finally, the carrier plate busbar portion 23 and the backplane lead 12 can be strengthened by welding, and the electrical connection between the carrier plate busbar portion 23 and the backplane lead 12 can be achieved.

[0169] Laminating the carrier plate 21 and the backplane 11 and electrically connecting the carrier plate leads between the introduction ends of the solar cell device 22 and the backplane leads 12 may also specifically include the steps of: first laminating the carrier plate 21 and the backplane 11. At the same time, in an embodiment where the carrier plate lead only has a carrier plate series connection portion 24, align the carrier plate series connection portion 24 and the backplane lead 12 so that the carrier plate series connection portion 24 is in electrical contact with the backplane lead 12. After that, laminate the carrier plate 21 and the backplane 11. Finally, the carrier plate series connection portion 24 and the backplane lead 12 can be strengthened by welding, and the electrical connection between the carrier plate series connection portion 24 and the backplane lead 12 can be achieved.

[0170] The manufacturing of the solar cell 1 includes process route one and process route two. Process route one is that the carrier plate structure 20 and the backplane structure 10 are separately manufactured and then laminated. In process route one, step 30 is executed after step 10. Process route two is that after the carrier plate structure 20 is manufactured, first laminate the carrier plate 21 and the backplane 11, and finally fill with glass powder and perform soldering connection. That is to say, in process route two, step 30 is executed before step 10.

[0171] In addition, it is worth mentioning that in process route one and process route two, the manufacturing methods of the carrier plate structure 20 are the same.

[0172] In this application, the manufacturing method of the solar cell 1 including the manufacturing method of the backplane structure 10 in any of the above embodiments has the effects of the embodiments having the manufacturing method of the backplane structure 10 in any of the above, so it will not be elaborated here.

[0173] Please refer to Figure 1 、 Figure 4 、 Figures 10 to 11 , Figures 16 to 17 , Figures 22 to 26 ,and at the same time refer to Figure 32, in some embodiments of the present application, step 20 of manufacturing the carrier structure 20 includes: disposing the solar cell device 22 in the battery region 21a on one side of the carrier 21, and disposing the carrier leads in the battery region 21a and the non-battery region 21b on one side of the carrier 21, or in the non-battery region, where the non-battery region 21b is disposed around the outer periphery of the battery region 21a;

[0174] Before step 30 of laminating the carrier 21 and the backsheet 11, it further includes: aligning the lead-out hole 111 of the backsheet 11 with the battery region 21a.

[0175] In this embodiment, since the battery region 21a is the region of the solar cell device 22, and the solar cell device 22 is the main functional component of the solar cell 1, considering the energy density, the area of the battery region 21a should be much larger than the area of the non-battery region 21b. In this design, by aligning the lead-out hole 111 with the battery region 21a, the lead-out hole 111 and the backsheet leads 12 can be aligned with the battery region 21a at multiple positions. In this way, the lead-out hole 111, the backsheet leads 12, and the carrier busbar 23 can be set and assembled more flexibly to meet the requirements of various installation positions.

[0176] Please refer to Figures 11 to 15 , and Figures 16 to 21 , and also refer to Figure 33 , in some embodiments of the present application, step 20 of manufacturing the carrier structure 20 further includes: covering at least the solar cell device 22 and the carrier leads with a moisture and oxygen barrier adhesive layer 25, and when the carrier leads are located in the battery region 21a and the non-battery region 21b, an insulating adhesive layer 26 is stacked between the moisture and oxygen barrier adhesive layer 25 and the carrier leads.

[0177] Preferably, the moisture and oxygen barrier adhesive layer 25 covers the region of the non-battery region 21b that does not carry the carrier busbar 23 and the carrier string 24, and also covers the solar cell device 22, the carrier busbar 23, and the carrier string 24. It should be noted that a gap should be left in the region where the carrier busbar 23 overlaps with the backsheet leads 12 so that the backsheet leads 12 and the carrier busbar 23 can be in contact and electrically connected.

[0178] The moisture and oxygen barrier adhesive layer 25 can be the above-mentioned adhesive film or glue, and the adhesive film or glue can block a certain amount of water vapor and oxygen. Since the overall formed by the backsheet 11, the carrier 21, and the glass body 13 itself already has high water resistance and high gas barrier properties, and very little water vapor and oxygen can penetrate. Combining with the moisture and oxygen barrier adhesive layer 25, even less water vapor and oxygen finally come into contact with the solar cell device 22, the carrier busbar 23, and the carrier string 24, meeting the packaging requirements of the solar cell 1 and extending the service life of the solar cell 1.

[0179] The insulating adhesive layer 26 can be a single-sided adhesive, a double-sided adhesive, or other adhesive layers with insulating functions.

[0180] Taking Figure 15 and Figure 21 as an example, from a local perspective, from top to bottom in sequence are: the backplane 11, the fixing adhesive layer 14, the introduction end of the backplane lead 12, the part on the carrier board busbar portion 23 that contacts the backplane 11, the insulating adhesive layer 26, the water and air barrier adhesive layer 25, the solar cell device 22, and the carrier board 21. The process of manufacturing the carrier board structure 20 includes: forming the solar cell device 22 on the carrier board 21 → covering the water and air barrier adhesive layer 25 on the solar cell device 22 → covering the insulating adhesive layer 26 on the water and air barrier adhesive layer 25 → arranging the carrier board busbar portion 23 on the insulating adhesive layer 26 → covering the water and air barrier adhesive layer 25 on the carrier board busbar portion 23, but note that a vacancy is left in the area where the carrier board busbar portion 23 contacts the backplane lead 12.

[0181] When the carrier board busbar portion 23 is arranged in the battery area 21a, the insulating adhesive layer 26 is stacked between the water and air barrier adhesive layer 25 and the carrier board busbar portion 23. The insulating adhesive layer 26 can prevent the insulating adhesive layer 26 from contacting the solar cell device 22, achieving insulation between the carrier board busbar portion 23 and the solar cell device 22.

[0182] Please refer to Figures 4 to 9 simultaneously, and also refer to Figure 34 In some embodiments of the present application, the step of manufacturing the carrier board structure 20 further includes: covering at least the solar cell device 22 and the carrier board leads with the water and air barrier adhesive layer 25, and when the carrier board leads are located in the non-battery area 21b, stacking the insulating adhesive layer 26 between the water and air barrier adhesive layer 25 and the backplane lead 12.

[0183] Taking Figure 9 as an example, from a local perspective, from top to bottom in sequence are: the backplane 11, the part of the backplane lead 12 between its own introduction end and the extraction end, the insulating adhesive layer 26, the water and air barrier adhesive layer 25, the solar cell device 22, and the carrier board 21. The process of manufacturing the carrier board structure 20 includes: forming the solar cell device 22 and the carrier board busbar portion 23 on the carrier board 21 → covering the water and air barrier adhesive layer 25 on the solar cell device 22 and the carrier board busbar portion 23 (note that a vacancy is left in the area where the carrier board busbar portion 23 contacts the backplane lead 12) → covering the insulating adhesive layer 26 on the water and air barrier adhesive layer 25. After that, after the carrier board structure 20 is set up, the backplane lead 12 is arranged on the insulating adhesive layer 26, and the extraction end of the backplane lead 12 contacts the carrier board busbar portion 23.

[0184] By stacking an insulating adhesive layer 26 between the water and air barrier adhesive layer 25 and the backplane lead 12, the insulating adhesive layer 26 can prevent the backplane lead 12 from contacting the solar cell device 22, achieving insulation between the backplane lead 12 and the solar cell device 22, and further improving the reliability of the operation of the solar cell 1.

[0185] Please refer to Figure 24 and Figure 25 , in some embodiments of the present application, step 20 of manufacturing the carrier structure 20 includes:

[0186] Disposing the solar cell device 22 in the battery area 21a on one side of the carrier 21, disposing carrier leads on the battery area 21a and the non-battery area 21b on one side of the carrier 21, or in the non-battery area 21b, and the non-battery area 21b is disposed around the outer periphery of the battery area 21a;

[0187] Before step 30 of laminating the carrier 21 and the backplane 11, it further includes: aligning the lead-out hole 111 of the backplane 11 with the non-battery area 21b.

[0188] When the lead-out hole 111 is aligned with the non-battery area 21b, the backplane lead 12 is led out from a position near the edge of the backplane 11. Combining with the above embodiment where the lead-out hole 111 is aligned with the battery area 21a, the setting position of the lead-out hole 111 is flexible and variable, facilitating the manufacture of the backplane structure 10.

[0189] Please refer to again Figure 4 , Figure 11 , Figure 17 and Figure 25 , in some embodiments of the present application, step 20 of manufacturing the carrier structure 20 further includes: disposing the solar cell device 22 in the battery area 21a on one side of the carrier 21, disposing the carrier leads 23 on the battery area 21a and the non-battery area 21b on one side of the carrier 21, or in the non-battery area 21b, and disposing an edge sealant layer 27 for sealing and connecting the backplane 11 and the carrier 21 at the edge seal area 21c on one side of the carrier 21; wherein, the non-battery area 21b is disposed around the outer periphery of the battery area 21a, and the edge seal area 21c is disposed around the outer periphery of the non-battery area 21b.

[0190] The edge sealant layer 27 can be an epoxy-based encapsulant, a silicone-based encapsulant, a polyurethane encapsulant, an ultraviolet light-curable encapsulant, ethylene-vinyl acetate copolymer, polyvinyl butyral, ethylene-octene copolymer, polyisobutylene, and polyolefin-based encapsulants or materials modified by doping the above materials with each other, etc. The edge sealant layer 27 is in a closed frame shape, and the width range is within 1 millimeter (mm) to 20 millimeters (mm).

[0191] The edge sealant layer 27 is attached to the back plate 11 and the carrier plate 21 and is used to seal the back plate 11 and the carrier plate 21, so as to form a sealed accommodation space between the back plate 11 and the carrier plate 21. In this way, the solar cell device 22 can be sealed in the accommodation space to reduce the interference of external moisture and oxygen on the operation of the solar cell device 22.

[0192] Next, taking the solar cell 1 with the lead-out hole 111 aligned with the non-cell region 21b manufactured by the process route 1 and the process route 2 respectively as an example, the specific manufacturing method of the solar cell 1 will be described in detail. In the process route 1 and the process route 2, the manufacturing method of the carrier plate structure 20 is the same.

[0193] Manufacturing method of the carrier plate structure 20: (1) Grinding and cleaning the carrier plate 21; (2) Preparing solar components in the cell region 21a of the carrier plate 21; (3) Preparing the carrier plate current collector 24 and the carrier plate bus bar 23 in the non-cell region 21b of the carrier plate 21 (it should be noted that the position of the carrier plate bus bar 23 should be designed in advance to ensure that it can partially overlap with the back plate lead 12 after lamination); (4) Laying a water and air barrier adhesive layer 25 on the solar cell device 22, the carrier plate bus bar 23, and the carrier plate current collector 24 of the cell (it should be noted that a gap should be left in the overlapping area between the carrier plate bus bar 23 and the back plate lead 12 so that the back plate lead 12 and the carrier plate bus bar 23 can contact and achieve connection); (5) Setting an edge sealant layer 27 in the edge seal region 21c of the carrier plate 21.

[0194] In the process route 1, the carrier plate structure 20 and the back plate structure 10 are manufactured separately. The back plate structure 10 is manufactured by using the manufacturing method of the back plate structure 10 in any one of the above embodiments. The specific manufacturing method of the back plate structure 10 is: (1) Drilling a lead-out hole 111 in the back plate 11; (2) Inserting the lead-out end of the back plate lead 12 into the lead-out hole 111; (3) Filling glass powder between the hole wall of the lead-out hole 111 and the lead-out end of the back plate lead 12, and welding and sealing the glass powder to the hole wall of the lead-out hole 111 and the lead-out end of the back plate lead 12; (4) Gluing the lead-in end of the back plate lead 12 to the back plate 11 with a fixing adhesive layer 14, and the lead-in end of the back plate lead 12 is located on the side of the back plate 11 facing the solar cell device 22 of the solar cell 1.

[0195] After the carrier plate structure 20 and the back plate structure 10 are manufactured, the following operations are carried out: (1) Aligning the carrier plate 21 and the back plate 11 vertically and laminating them; (2) Putting the laminated plates into a laminator for lamination; (3) Welding or bonding the back plate lead 12 and the carrier plate bus bar 23; (4) Checking the welding or bonding situation.

[0196] In Process Route 2, after the carrier structure 20 is manufactured, the backplane structure 10 is manufactured on the basis of the carrier structure 20. The backplane structure 10 is manufactured by using the manufacturing method of the backplane structure 10 in any one of the above embodiments. Specifically, after the carrier structure 20 is manufactured, the following operations are performed: (1) The backplane lead 12 is welded or bonded to the carrier busbar portion 23; (2) Check the welding or bonding condition; (3) The carrier 21 and the backplane 11 are aligned up and down for laminating, and the lead-out end of the backplane lead 12 is led out from the lead-out hole 111 of the backplane 11; (4) Fill the glass powder into the lead-out hole 111; (5) Hermetically seal and connect the glass powder, the lead-out end of the backplane lead 12 and the hole wall of the lead-out hole 111; (6) Check the hermetic sealing condition; (7) Put the laminated backplane 11 and the carrier 21 into a laminator for lamination.

[0197] In Process Route 2, the following matters need to be noted: (1) The vitreous body 13 formed after the glass powder is welded is well combined with the backplane 11, and there should be no cracks or holes inside the vitreous body 13 and at the contact position with the backplane 11; (2) The vitreous body 13 should be well combined with the backplane lead 12, without loosening, and there should be no cracks or holes at the contact position; (3) Use the fixing adhesive layer 14 to paste the backplane lead 12 at a specific position on the backplane 11, ensure that the paste is firm and will not fall off, and ensure that the carrier busbar portion 23 and the backplane lead 12 overlap in position after lamination.

[0198] In the process of laminating the carrier 21 and the backplane 11 in Process Route 1 and Process Route 2, the following matters need to be noted: (1) When aligning the carrier 21 and the backplane 11 during lamination, ensure that the position of the carrier busbar portion 23 partially overlaps with the backplane lead 12; (2) After lamination, there are two ways for the carrier busbar portion 23 and the backplane lead 12 to be combined and form an electrical connection. The first is that the combination position has adhesiveness and they are adhered to each other after lamination; the second is to use laser, ultrasonic wave or a combination of both for welding; (3) After the backplane lead 12 is welded or bonded to the carrier busbar portion 23, the appearance of the welding position is good, without residues, debris, fractures, holes, cracks; (4) After the backplane lead 12 is welded or bonded to the carrier busbar portion 23 and is subjected to vibration or impact, it does not fall off or become loose and has a certain mechanical strength; (5) After the backplane lead 12 is welded or bonded to the carrier busbar portion 23, it is necessary to ensure good electrical conductivity and no open circuit caused by false soldering or bad soldering; (6) After lamination, the edge sealant layer 27 should have no abnormalities such as bubbles, delamination, tearing, etc.

[0199] The backplane structure 10, the manufacturing method of the backplane structure 10, the solar cell 1 and the manufacturing method of the solar cell 1 provided in this application have the following advantages:

[0200] (1) Improve the water and oxygen sealing performance: Use glass powder to weld and seal the lead-out hole 111. Utilize the high water resistance and high gas barrier property of the vitreous body 13 formed by glass powder welding to prevent the intrusion of external water vapor and oxygen.

[0201] (2) Improve production efficiency: In Process Route 1, the backplane 11 and the carrier plate 21 can be manufactured separately and then laminated together, saving time, reducing the complexity of the process, and greatly improving production efficiency.

[0202] (3) Low cost: Using low-cost glass powder is lower in cost compared to the traditional water and gas barrier adhesive layer 25 and glue.

[0203] (4) Pollution-free: Traditional adhesive films and glues release harmful organic gases during the curing process, while no harmful gases are released during the glass powder welding and sealing process.

[0204] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0205] The above-described embodiments only represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

[0206] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the indication of the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment, but can be executed at different moments. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

Claims

1. A backplane structure, applied to solar cells, It is characterized in that The back plate structure comprises: A back plate (11) having an outlet hole (111) formed thereon; A backplane lead (12), the lead-out end of the backplane lead (12) being inserted into the lead-out hole (111); and Glass powder is filled between the hole wall of the lead-out hole (111) and the lead-out end of the backplane lead (12), and is welded and connected to the hole wall of the lead-out hole (111) and the lead-out end of the backplane lead (12).

2. The backplane structure according to claim 1, It is characterized in that The lead-in end of the backplane lead (12) is located on a side of the backplane (11) facing the solar cell device (22) of the solar cell; The backplane structure also includes a fixing glue layer (14), and the lead-in end of the backplane lead (12) is glued to the backplane (11) through the fixing glue layer (14).

3. The backplane structure according to claim 1, It is characterized in that There are two back plate leads (12), which are respectively a back plate positive lead (12a) and a back plate negative lead (12b); the lead-out ends of the back plate positive lead (12a) and the back plate negative lead (12b) are arranged at intervals and pass through the same lead-out hole (111).

4. The backplane structure according to claim 1, It is characterized in that There are two back plate leads (12), which are respectively a back plate positive electrode lead (12a) and a back plate negative electrode lead (12b); there are two lead-out holes (111), which are respectively a positive electrode lead-out hole (111a) and a negative electrode lead-out hole (111b); The lead-out end of the back plate positive electrode lead (12a) is inserted through the positive electrode lead-out hole (111a), and the lead-out end of the back plate negative electrode lead (12b) is inserted through the negative electrode lead-out hole (111b).

5. A solar cell, It is characterized in that include: A carrier structure (20), comprising a carrier (21), a solar cell device (22) and carrier leads, wherein the solar cell device (22) and the carrier leads are located on the same side of the carrier (21); and The backplane structure as claimed in any one of claims 1 to 4, wherein the backplane structure is located on a side of the solar cell device (22) and the carrier lead away from the carrier (21); Wherein, the carrier lead is electrically connected between the lead-in end of the backplane lead (12) and the solar cell device (22).

6. The solar cell according to claim 5, It is characterized in that One side of the carrier (21) has a battery area (21a) and a non-battery area (21b) arranged around the periphery of the battery area (21a), the solar cell device (22) is located in the battery area (21a), the carrier lead is located in the battery area (21a) and the non-battery area (21b), or the carrier lead is located in the non-battery area (21b); The lead-out hole (111) is aligned with the battery area (21a).

7. The solar cell according to claim 6, It is characterized in that The carrier structure (20) further includes a water and gas barrier adhesive layer (25) and an insulating adhesive layer (26), and the water and gas barrier adhesive layer (25) covers at least the solar cell device (22) and the carrier leads; When the carrier leads are located in the cell region (21a) and the non-cell region (21b), the insulating adhesive layer (26) is stacked between the water and gas barrier adhesive layer (25) and the carrier leads.

8. The solar cell according to claim 6, wherein, The carrier structure (20) further includes a water and gas barrier adhesive layer (25) and an insulating adhesive layer (26), and the water and gas barrier adhesive layer (25) covers at least the solar cell device (22) and the carrier leads; When the carrier leads are located in the non-cell region (21b), the insulating adhesive layer (26) is stacked between the water and gas barrier adhesive layer (25) and the backplane leads (12).

9. The solar cell according to claim 5, wherein, One side of the carrier (21) has a cell region (21a) and a non-cell region (21b) provided around the outer periphery of the cell region (21a). The solar cell device (22) is located in the cell region (21a), and the carrier leads are located in the non-cell region (21b); The lead-out hole (111) is aligned with the non-cell region (21b).

10. The solar cell according to claim 5, wherein, One side of the carrier (21) has a cell region (21a), a non-cell region (21b) provided around the outer periphery of the cell region (21a), and an edge sealing region (21c) provided around the outer periphery of the non-cell region (21b); The solar cell device (22) is located in the cell region (21a), the carrier leads are located in the cell region (21a) and the non-cell region (21b), or the carrier leads are located in the non-cell region (21b); the carrier structure (20) further includes an edge sealing adhesive layer (27), and the edge sealing adhesive layer (27) is located in the edge sealing region (21c) and is used for sealing and connecting the backplane (11) and the carrier (21).

11. A manufacturing method of a backplane structure, wherein, The manufacturing method of the backplane structure includes: Opening a lead-out hole (111) on the backplane (11); Threading the lead-out end of the backplane leads (12) through the lead-out hole (111); Filling glass powder between the hole wall of the lead-out hole (111) and the lead-out end of the backplane leads (12), and hermetically connecting the glass powder with the hole wall of the lead-out hole (111) and the lead-out end of the backplane leads (12) by soldering.

12. The manufacturing method of the backplane structure according to claim 11, wherein, It further includes: Gluing the lead-in end of the backplane leads (12) to the backplane (11) with a fixing adhesive layer (14), and the lead-in end of the backplane leads (12) is located on the side of the backplane (11) facing the solar cell device (22) of the solar cell.

13. A manufacturing method of a solar cell, characterized in that, the manufacturing method of the solar cell includes: manufacturing a backplane structure by using the manufacturing method of the backplane structure described in claim 11 or 12 above; manufacturing a carrier structure (20): disposing a solar cell device (22) and carrier leads on the same side of a carrier (21); disposing a backplane (11) and backplane leads (12) in the backplane structure on a side of the solar cell device (22) and the carrier leads facing away from the carrier (21), laminating the carrier (21) and the backplane (11) by combining sheets, and electrically connecting the carrier leads between an introduction end of the solar cell device (22) and the backplane leads (12).

14. The manufacturing method of a solar cell according to claim 13, characterized in that, the manufacturing of the carrier structure (20) includes: disposing the solar cell device (22) in a cell region (21a) on one side of the carrier (21), disposing the carrier leads in the cell region (21a) and a non-cell region (21b) on one side of the carrier (21), or in the non-cell region (21b), and the non-cell region (21b) is disposed around an outer periphery of the cell region (21a); before laminating the carrier (21) and the backplane (11) by combining sheets, further including: aligning a lead-out hole (111) of the backplane (11) with the cell region (21a).

15. The manufacturing method of a solar cell according to claim 14, characterized in that, the manufacturing of the carrier structure (20) further includes: covering at least the solar cell device (22) and the carrier leads with a water and gas barrier adhesive layer (25), and when the carrier leads are located in the cell region (21a) and the non-cell region (21b), laminating an insulating adhesive layer (26) between the water and gas barrier adhesive layer (25) and the carrier leads.

16. The manufacturing method of a solar cell according to claim 14, characterized in that, the manufacturing of the carrier structure (20) further includes: covering at least the solar cell device (22) and the carrier leads with a water and gas barrier adhesive layer (25), and when the carrier leads are located in the non-cell region (21b), laminating an insulating adhesive layer (26) between the water and gas barrier adhesive layer (25) and the backplane leads (12).

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