Cooling module

Abstract

A cooling module is provided with a substrate to which an actuator for energizing an auxiliary device mounted on a vehicle is mounted, and a module case for holding the substrate, the module case having a flow path case in which a cooling flow path through which a cooling liquid flows is formed, and a heat conduction member provided across the substrate and the cooling flow path.

Description

Technical Field

[0001] The present invention relates to a cooling module for cooling a driver that powers auxiliary equipment mounted on a vehicle. Background Art

[0002] Conventionally, various auxiliary equipment (such as an electric pump, a valve device, etc.) have been mounted on a vehicle. Such auxiliary equipment is powered by a driver. As a technology related to such auxiliary equipment and a driver, for example, there is the technology described in Patent Document 1 whose source is shown below.

[0003] Patent Document 1 describes an electric motor drive device. The electric motor drive device includes a motor unit, a first cover member, a circuit board, a second cover member, and a heat conduction member. The motor unit is covered by a cover portion of the first cover member, and a circuit board is provided on the outer surface side of the first cover member. The circuit board functions as a control board for controlling the operation of the motor unit. Further, in the circuit board, a heating element is mounted on a surface facing the motor unit, and a second cover member is provided via a heat conduction member on a surface opposite to the surface on which the heating element is mounted. A flow path through which oil flows is formed on the outer surface side of the second cover member, and it is configured such that heat from the heating element mounted on the circuit board is released to the oil via the heat conduction member and the second cover member. Patent Document

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022 - 78388 Summary of the Invention

[0005] In the electric motor drive device described in Patent Document 1, the heating element mounted on the circuit board exchanges heat with the oil flowing on the outer surface side of the second cover member. However, since the second cover member is provided with a convex portion having a space inside, the cooling efficiency may be reduced due to this space.

[0006] Therefore, there is a need for a cooling module with excellent cooling effect.

[0007] The characteristic structure of the cooling module according to the present invention is as follows: It includes a substrate on which a driver that powers auxiliary equipment mounted on a vehicle is mounted, and a module housing that holds the substrate. The module housing has a flow path housing in which a cooling flow path through which a coolant flows is formed inside, and a heat conduction member is provided across the substrate and the cooling flow path.

[0008] If such a characteristic structure is adopted, a state in which a substrate, a heat conduction component, and a cooling flow path are laminated is formed, enabling miniaturization. In addition, since a heat conduction component is provided across the substrate on which the driver is mounted and the cooling flow path, the heat generated by the driver mounted on the substrate can be released to the coolant flowing in the cooling flow path via the heat conduction component. Therefore, the driver can be appropriately cooled, and a cooling module with excellent cooling effect can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. is a side cross-sectional view of the cooling module. Figure 2 FIG. is a view when observing the substrate from above. Figure 3 FIG. is a perspective view of a heat sink. Figure 4 FIG. is a perspective view of a heat sink. Figure 5 FIG. is a perspective view of a heat sink. Figure 6 FIG. is a perspective view of a heat sink. Figure 7 FIG. is a perspective view of a heat sink. DETAILED DESCRIPTION

[0010] The cooling module according to the present invention is configured to be able to cool a driver mounted on a substrate. Hereinafter, the cooling module 1 of the present embodiment will be described.

[0011] Figure 1 FIG. is a side cross-sectional view of the cooling module 1. As Figure 1 shown, the cooling module 1 is configured to include a substrate 20, a module housing 30, and a heat sink (an example of a "heat conduction component") 50. FIG. Figure 2 shows a view when observing the substrate 20 from above.

[0012] A driver 82 for energizing an auxiliary device 2 mounted on a vehicle is mounted on the substrate 20. The auxiliary device 2 mounted on the vehicle refers to a machine that assists in driving an auxiliary power source (for example, an engine, a rotating electric machine), and the above power source (driving) causes the vehicle equipped with the cooling module 1 to travel. As such an auxiliary device 2, there are, for example, a generator, a radiator, an oil pump, a water pump, a motor for driving these pumps, a valve device, and the like. Although a plurality of the above auxiliary devices 2 are mounted on the vehicle, in the present embodiment, as the plurality of auxiliary devices 2, a water pump 3 and a valve device 4 are included.

[0013] The water pump 3 circulates the coolant in the cooling flow path 70. The cooling flow path 70 is provided in communication with a device other than a power source such as an engine, a rotating electric machine, etc., a generator, a battery, etc., and the coolant discharged from the water pump 3 is supplied via the cooling flow path 70. The coolant is cooling water such as long-life coolant (LLC), insulating oil such as paraffin-based, or refrigerant condensate such as hydrofluorocarbons (HFC), hydrofluoroolefins (HFO). Thereby, the supply target of the coolant (engine, rotating electric machine, generator, battery, etc.) can be cooled. As Figure 1 shown, in the present embodiment, two water pumps 3 are provided. When distinguishing between them, one water pump 3 is referred to as water pump 3A and the other water pump 3 is referred to as water pump 3B for description.

[0014] The valve device 4 is configured to be able to adjust the amount of the coolant flowing in the cooling flow path 70. As Figure 1 shown, the valve device 4 is provided in the cooling flow path 70. The valve device 4 can be configured to adjust the amount of the coolant sucked by the water pump 3 or switch the flow path, or can be configured to adjust the amount of the coolant discharged from the water pump 3 or switch the flow path. In the present embodiment, the valve device 4 is provided in the cooling flow path 70 where the water pump 3A is provided.

[0015] In the present embodiment, as Figure 1 shown, a motor 81 for driving the valve device 4 is provided on the substrate 20. In the present embodiment, a gear 81C is provided at one end of the rotating shaft 81B of the rotor 81A of the motor 81. A gear 81D for reducing the rotational speed of the motor 81 is provided so as to mesh with the gear 81C, and is configured to mesh the gear 81D with a gear 4B provided on the rotating shaft 4A of the valve device 4. Thereby, the motor 81 can drive the valve device 4.

[0016] In addition, the motor 81 is provided such that the other end of the rotating shaft 81B penetrates the substrate 20 and is supported by the substrate 20 via the motor housing 81F. Regarding the fixation between the motor housing 81F and the substrate 20, for example, it can be fixedly fastened using bolts, or can be fixed by other methods. In addition, the electrical connection between the motor 81 and the substrate 20 can be made by inserting a press-fit 22 into a through hole 21 provided in the substrate 20.

[0017] The driver 82 supplies power to the motor 81 and the water pump 3. The motor 81 in the present embodiment drives the valve device 4. Therefore, the driver 82 supplies power to the motor 81 to operate the valve device 4. The driver 82 can be configured to include a plurality of arm portions having high-side switching elements and low-side switching elements connected in series with each other such as an H-bridge, a three-phase inverter, etc.

[0018] An operation instruction is transmitted from a control unit (not shown) to each of the drivers 82. The operation instruction includes instruction values such as rotational speed and output torque, and the driver 82 is controlled based on the above instruction values. Thereby, a current having a current value corresponding to the instruction value flows from the driver 82 to the coil of the motor 81 of the drive valve device 4 or the coil of the motor (not shown) of the water pump 3.

[0019] In the present embodiment, a plurality of drivers 82 for energizing each of the plurality of auxiliary devices 2 are mounted on the substrate 20. In Figure 1 , as the driver 82, a driver 82A for energizing the motor 81, a driver 82B for energizing the motor of the water pump 3A, and a driver 82C for energizing the motor of the water pump 3B are shown.

[0020] In the present embodiment, the motor 81, the driver 82A, the driver 82B, and the driver 82C are mounted on the substrate 20. Although the driver 82A, the driver 82B, and the driver 82C are constituted by switching elements, the terminals of the switching elements can be fixed by soldering to the lands provided on the substrate 20. Of course, the terminals of the switching elements can also be inserted and fixed to the through holes provided on the substrate 20.

[0021] In addition, a control unit (not shown) for controlling at least one of the plurality of drivers 82 may be mounted on the substrate 20. For example, in the case of driving the motor 81 and the water pump 3 by PWM control, the control unit for controlling at least one of the plurality of drivers 82 corresponds to a PWM control unit. The control unit is not limited to the PWM control unit, and may be, for example, a power supply control unit provided at the input stage of the driver 82 and capable of blocking the power supplied to the driver 82.

[0022] From the viewpoints of heat dissipation and load resistance, such a substrate 20 is constituted by a rigid substrate. In particular, by using a printed circuit board to constitute the above substrate 20, the substrate can be realized at low cost.

[0023] The module housing 30 holds the substrate 20. The module housing 30 is constituted by, for example, resin. The module housing 30 has a flow path housing 40 described later. The substrate 20 is held on the outer surface 41 of the flow path housing 40. A convex portion 42 protruding from the outer surface 41 is provided on the outer surface 41 of the flow path housing 40, and the substrate 20 is fixedly fastened by bolts 43 in a state of being placed on the convex portion 42. In addition, as described above, the rotary shaft 81B of the motor 81 is supported by a bearing in a state where a gear 81C is provided at one end and the other end is inserted into a concave portion 44 formed in the outer surface 41. Further, in the present embodiment, the rotary shaft 81E of the gear 81D is also supported by a bearing in a state of being inserted into a concave portion 45 formed in the outer surface 41.

[0024] Furthermore, a plurality of wall portions 48 standing upright from the outer surface 41 are formed in the flow path housing 40, and the top plate 46 is supported across the plurality of wall portions 48. Thus, the substrate 20 is accommodated in the space 47 surrounded by the flow path housing 40, the wall portions 48, and the top plate 46. In addition, a bus bar 80 is formed in the flow path housing 40 by insert molding, and power is supplied to the designated pads of the substrate 20 from the bus bar 80 via a press fitting. In Figure 1 the example of, a wiring electrically connected to the bus bar 80 is provided inside the wall portion 48 and forms a connector portion 49 so as to protrude toward the side opposite to the space 47 in the wall portion 48. Thus, the power of the bus bar 80 can be taken out via the connector portion 49.

[0025] In the present embodiment, the module housing 30 holds, in addition to the substrate 20, the water pumps 3A, 3B, and the valve device 4 on the basis of the substrate 20. In the present embodiment, the water pumps 3A and 3B are arranged such that the blade portions 3A1 and 3B1 are on the cooling flow path 70 side in the module housing 30, and the valve device 4 is arranged such that the valve portion 4C is on the cooling flow path 70 side in the module housing 30.

[0026] The above-described cooling flow path 70 is formed inside the flow path housing 40, and the coolant flows in the cooling flow path 70. The flow path housing 40 is made of resin, and the cooling flow path 70 can be formed by, for example, drilling the cross section.

[0027] The radiator 50 is provided across the substrate 20 and the cooling flow path 70. In the present embodiment, one side of the radiator 50 is attached to the substrate 20 by a gap filler 54, and the other side of the radiator 50 is provided in a state of being exposed to the cooling flow path 70. As Figure 2 shown, the radiator 50 can be attached to the back side of, for example, the area of the substrate 20 where the driver 82 is mounted. In addition, it can be configured such that when the substrate 20 is viewed from above, at least in the portion where the cooling flow path 70 overlaps with the radiator 50, the cooling flow path 70 extends more outward than the radiator 50. That is, the cooling flow path 70 can be configured such that when the substrate 20 is viewed from above, the radiator 50 overlaps with the cooling flow path 70. Thus, the heat from the driver 82 can be easily transferred to the radiator 50. It should be noted that a sealing member 56 (e.g., an O-ring) can be provided on the flange portion 55 of the radiator 50.

[0028] In the present embodiment, the radiator 50 is provided in the flow path housing 40 and has fins 51 standing upright toward the inside of the cooling flow path 70. Thus, the radiator 50 to which the heat from the driver 82 is transferred can be directly cooled by the coolant flowing in the cooling flow path 70. Therefore, the driver 82 can be cooled more efficiently. In the radiator 50, asFigure 3 As shown, the fin 51 can be configured to stand upright in a state crossing (preferably orthogonal) to the flow direction of the coolant flowing in the cooling flow path 70, such as Figure 4 As shown, the fin 51 can also be configured to stand upright in a state parallel to the flow direction of the coolant flowing in the cooling flow path 70.

[0029] Such a radiator 50 can be formed integrally on the module housing 30. In this case, with the module housing 30 and the flow path housing 40 joined, the radiator 50 can be opposed to the cooling flow path 70.

[0030] As described above, by providing the radiator 50 across the substrate 20 on which the driver 82 is mounted and the cooling flow path 70 formed inside the flow path housing 40, the driver 82 can be appropriately cooled. In addition, even when a plurality of drivers 82 are provided on the substrate 20, cooling can be appropriately performed, so that the cooling module 1 can be miniaturized.

[0031] [Other Embodiments] Next, other embodiments of the cooling module 1 will be described.

[0032] In the above embodiment, the case where a plurality of drivers 82 are mounted on the substrate 20 has been described. However, the number of drivers 82 mounted on the substrate 20 may be one.

[0033] In the above embodiment, the case where a control unit for controlling at least one of the plurality of drivers 82 is mounted on the substrate 20 has been described. However, the control unit may not be mounted on the substrate 20.

[0034] In the above embodiment, the case where the auxiliary device 2 includes the water pump 3 and the valve device 4 has been described. However, the auxiliary device 2 can be configured to include either the water pump 3 or the valve device 4, and the auxiliary device 2 can also be configured not to include both the water pump 3 and the valve device 4.

[0035] In the above embodiment, the case where the substrate 20 is supported by the outer surface 41 of the flow path housing 40 has been described. However, the substrate 20 can also be supported by a part different from the outer surface 41 of the flow path housing 40. For example, it can be supported in a state separated from the outer surface 41.

[0036] In the above embodiment, the case where the radiator 50 has fins 51 standing upright toward the inside of the cooling flow path 70 has been described. However, as Figure 5 shown, the radiator 50 can also be configured to have a plate-like member 52 exposed to the inside of the cooling flow path 70. In addition, in Figure 5In [the figure], a configuration in which the radiator 50 has two plate-like members 52 is shown, but the number of plate-like members 52 can also be set according to the pressure resistance of the radiator 50 with respect to the coolant flowing in the cooling flow path 70 and the heat exchange efficiency. Specifically, it can be configured such that, as shown in Figure 5 although the pressure resistance increases, the heat exchange efficiency also increases by reducing the number of plate-like members 52, and it can also be configured such that, as shown in Figure 6 the number of plate-like members 52 is increased so that although the heat conversion efficiency decreases, the pressure resistance decreases. In addition, although not shown, the number of plate-like members 52 can be one.

[0037] In addition, for example, as shown in Figure 7 the radiator 50 can be configured to have a plurality of pins 53 instead of the fins 51. These fins 51, plate-like members 52, and pins 53 can be combined, and their respective heights can also be changed for configuration.

[0038] In the above-described embodiment, the radiator 50 was cited as an example of the heat conduction component, but the heat conduction component only needs to be a component that conducts heat, and it does not have to be the radiator 50.

[0039] [Summary of the Above Embodiment] Hereinafter, the summary of the cooling module 1 described above will be described.

[0040] (1) The cooling module 1 includes a substrate 20 on which a driver 82 for energizing an auxiliary device 2 mounted on a vehicle is installed, and a module housing 30 that holds the substrate 20. The module housing 30 has a flow path housing 40 in which a cooling flow path 70 for coolant to flow is formed inside, and a radiator (heat conduction component) 50 is provided across the substrate 20 and the cooling flow path 70.

[0041] According to this structure, a state in which the substrate 20, the radiator 50, and the cooling flow path 70 are laminated is formed, enabling miniaturization. In addition, since the radiator 50 is provided across the substrate 20 on which the driver 82 is installed and the cooling flow path 70, the heat generated by the driver 82 installed on the substrate 20 can be released into the coolant flowing in the cooling flow path 70 via the radiator 50. Therefore, the driver 82 can be appropriately cooled, and thus a cooling module 1 with excellent cooling effect can be realized.

[0042] (2) In the cooling module 1 described in (1), preferably, the radiator 50 is integrally formed with the module housing 30, and the radiator 50 faces the cooling flow path 70 in a state where the module housing 30 is joined to the flow path housing 40.

[0043] According to this structure, the radiator 50 can be easily assembled relative to the cooling flow path 70.

[0044] (3) In the cooling module 1 described in (1), preferably, a plurality of drivers 82 for energizing each of the plurality of auxiliary devices 2 are mounted on the substrate 20, and a control unit for controlling at least one of the plurality of drivers 82 is further mounted.

[0045] According to this structure, it is possible to cool the plurality of drivers 82 collectively mounted on the substrate 20. In addition, since the driver 82 and the control unit for controlling the driver 82 can be mounted close to each other on the substrate 20, the device including the control unit can be miniaturized.

[0046] (4) In the cooling module 1 described in (3), preferably, the plurality of auxiliary devices 2 include a water pump (pump) 3 for circulating the coolant in the cooling flow path 70 and a valve device 4 capable of adjusting the amount of the coolant flowing in the cooling flow path 70 or switching the flow path, and the substrate 20 is supported by the outer surface 41 of the flow path housing 40.

[0047] According to this structure, the coolant flowing through the water pump 3 and the valve device 4 can be used to cool, for example, the driver 82 for driving the water pump 3 and the valve device 4 or the motor for driving them. Therefore, there is no need to separately provide a structure for cooling the driver 82, and miniaturization can be achieved.

[0048] (5) In the cooling module 1 described in (1) to (4), preferably, the radiator 50 has fins 51 erected upright toward the inside of the cooling flow path 70.

[0049] According to this structure, the fins 51 can be brought into contact with the coolant flowing in the cooling flow path 70. Therefore, the fins 51 to which the heat from the substrate 20 is transferred can be directly cooled by the coolant, and the cooling efficiency can be further improved.

[0050] (6) In the cooling module 1 described in (1) to (4), the radiator 50 may have a plate-like member 52 exposed to the inside of the cooling flow path 70.

[0051] According to this structure, the plate-like member 52 can be brought into contact with the coolant flowing in the cooling flow path 70. Therefore, the plate-like member 52 to which the heat from the substrate 20 is transferred can be directly cooled by the coolant, and the cooling efficiency can be further improved. In addition, since it is only necessary to provide the plate-like member 52 on the radiator 50, it is easy to process. Industrial availability

[0052] The present invention can be used for a cooling module for cooling a driver that energizes an auxiliary device mounted on a vehicle. Symbol description

[0053] 1: Cooling module, 2: Auxiliary device, 3: Water pump (pump), 4: Valve device, 20: Substrate, 30: Module housing, 40: Flow path housing, 41: Outer surface, 50: Radiator (heat conduction component), 51: Fins, 52: Plate-like component, 70: Cooling flow path, 82: Driver.

Claims

1. A cooling module, comprising: a substrate on which a driver for energizing an auxiliary device mounted on a vehicle is installed; and a module housing that holds the substrate, the module housing having a flow path housing in which a cooling flow path for allowing a coolant to flow is formed inside, a heat conduction component being provided across the substrate and the cooling flow path.

2. The cooling module according to claim 1, wherein the heat conduction component is integrally formed with the module housing, and in a state where the module housing is joined to the flow path housing, the heat conduction component faces the cooling flow path.

3. The cooling module according to claim 1, wherein a plurality of the drivers for energizing respective ones of the plurality of auxiliary devices are installed on the substrate, and a control unit for controlling at least one of the plurality of drivers is further installed.

4. The cooling module according to claim 3, wherein the plurality of auxiliary devices include a pump for causing the coolant to flow in the cooling flow path and a valve device capable of adjusting the amount of the coolant flowing in the cooling flow path or switching the flow path, the substrate is supported by an outer surface of the flow path housing.

5. The cooling module according to any one of claims 1 to 4, wherein the heat conduction component has fins that are vertically provided toward the inside of the cooling flow path.

6. The cooling module according to any one of claims 1 to 4, wherein the heat conduction component has a plate-like component that is exposed to the inside of the cooling flow path.

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