Welding device and method for mobile phone mainboard machining

Abstract

The welding device comprises a welding mechanism, the welding mechanism comprises a mounting frame, an integrated power supply device rotationally arranged in the mounting frame and an electric welding pen connected with the integrated power supply device, and an electric welding head is arranged at one end of the electric welding pen; and the auxiliary welding assembly comprises an extension frame arranged on the side wall of the electric welding pen and an installation cylinder installed in the extension frame, the installation cylinder is obliquely installed in the extension frame, and one end of the installation cylinder is located on one side of the electric welding head. According to the mobile phone main board welding device, the auxiliary welding assembly is arranged, an electric welding pen can be held by one hand to conduct soldering tin welding machining in the welding process, a control key is pressed to control a servo motor to operate in the welding process, an anti-skid piece in a mounting cylinder rotates to convey a soldering tin wire in the mounting cylinder, and meanwhile a mobile phone main board can be limited through a machining frame; welding is more convenient, and the welding effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile phone motherboard processing and welding, in particular to a welding device and method for mobile phone motherboard processing. Background Technique

[0002] The mobile phone motherboard is the core component of the mobile phone, responsible for connecting and controlling various hardware devices of the mobile phone, such as the processor, memory, storage, camera, and sensors, etc. It is one of the core components inside the mobile phone, similar to the "motherboard" of a computer, but designed specifically for mobile phones, integrating various functions of the mobile phone. During the processing of the mobile phone motherboard, a soldering pen is required for soldering. The components are welded to the mobile phone motherboard through the soldering pen to complete the welding process of the mobile phone motherboard. During this process, a welding device for mobile phone motherboard processing is needed.

[0003] During the soldering and welding process of mobile phone motherboard processing, it is necessary to hold the soldering pen in one hand and the solder wire in the other hand to weld the components. The two-handed operation is not convenient enough, and the mobile phone motherboard cannot be held firmly during the welding process, so the stability of the mobile phone motherboard cannot be guaranteed, and it is very easy to have a poor welding effect. In order to make the welding more convenient and have a better welding effect, a welding device for mobile phone motherboard processing is proposed. Summary of the Invention

[0004] The purpose of the present invention is to provide a welding device and method for mobile phone motherboard processing to solve the problems mentioned in the above background technique, that is, the two-handed operation is not convenient enough, and the mobile phone motherboard cannot be held firmly during the welding process, so the stability of the mobile phone motherboard cannot be guaranteed, and it is very easy to have a poor welding effect.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: A welding device for mobile phone motherboard processing includes a welding mechanism, including a mounting frame and an integrated power supply device rotatably installed inside the mounting frame, and a soldering pen connected to the integrated power supply device. One end of the soldering pen is provided with a soldering head; an auxiliary welding component, including an extension frame provided on the side wall of the soldering pen and a mounting cylinder installed inside the extension frame. The mounting cylinder is obliquely installed inside the extension frame, and one end of the mounting cylinder is located on one side of the soldering head; a servo motor is fixedly installed on one side of the extension frame. The output end of the servo motor is fixedly installed with a mounting shaft, and an anti-slip member is installed on the side wall of the mounting shaft. The anti-slip member is located inside the mounting cylinder; a plurality of fourth springs are fixedly installed on the inner wall of the mounting cylinder. One end of the fourth spring is fixedly installed with a pressing plate. The pressing plate is an arc-shaped member, and the pressing plate corresponds to the anti-slip member; The main board fixing mechanism includes a processing frame that slides at the bottom of the mounting frame and an elastic member disposed inside the processing frame, and the elastic member is an arc-shaped member; The placing assembly includes a placing frame mounted on one side of the mounting frame and a clamping plate disposed on one side of the placing frame.

[0006] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: an installation ring is fixedly installed on the side wall of the installation shaft, and a plurality of third springs are fixedly installed on the side wall of the installation ring, and the other ends of the third springs are fixedly installed on the inner wall of the anti-slip member.

[0007] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: a fan is fixedly installed inside the integrated power supply device, a grille is fixedly installed on one side of the integrated power supply device, a protective rod is fixedly installed on the surface of the grille, and a first control member and a second control member are installed on one side of the integrated power supply device.

[0008] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: a control key is fixedly installed on one side of the electric welding pen, and the control key is connected to the servo motor through a wire.

[0009] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: a rotating shaft is rotatably connected to the inner wall of the mounting frame, one end of the rotating shaft is fixedly installed on one side of the integrated power supply device, and the integrated power supply device is rotatably connected inside the mounting frame through the rotating shaft.

[0010] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: an installation cavity is opened inside the mounting frame, a first spring is fixedly installed on the inner wall of the installation cavity, a clamping member is fixedly installed at one end of the first spring, and a plurality of clamping grooves adapted to the clamping member are opened on the side wall of the rotating shaft.

[0011] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: a sliding groove is opened at the bottom of the mounting frame, the processing frame is slidably connected inside the sliding groove, a processing groove is opened at the top of the processing frame, a moving groove is opened on the inner wall of the processing groove, a guide rail is fixedly installed on the inner wall of the moving groove, both ends of the elastic member are fixedly installed with sliders, the sliders are slidably connected to the side wall of the guide rail, a second spring is installed on the side wall of the guide rail, one end of the second spring is in contact with the slider, and the other end of the second spring is in contact with the moving groove.

[0012] As a preferred solution of the welding device for mobile phone main board processing of the present invention, wherein: a connecting shaft is rotatably connected to one side of the placing frame through a torsion spring, the clamping plate is fixedly installed on the side wall of the connecting shaft, and a protective pad is fixedly installed on the inner wall of the clamping plate.

[0013] As a preferred solution of the welding device for mobile phone motherboard processing in the present invention, wherein: a fixing frame is fixedly installed on the side wall of the installation frame, a winding disc is rotatably connected inside the fixing frame, a connecting wire is wound inside the winding disc, and the electric soldering pen is connected to the integrated power supply device through the connecting wire.

[0014] A method for using a welding device for mobile phone motherboard processing includes the following steps: Step (A): Before use, slide the processing frame out from the sliding groove at the bottom of the installation frame, then toggle the integrated power supply device to adjust the air outlet position of the fan in the integrated power supply device so that the fan is aligned with the processing groove in the processing frame. Then take the electric soldering pen from the placement rack and insert the solder wire into the installation cylinder. Step (B): During use, adjust the rotation of the first control member to control the fan speed according to specific conditions, and rotate the second control member to control the temperature of the electric soldering pen. Step (C): During the processing, first place the mobile phone motherboard to be welded into the processing groove at the top of the processing frame, so that the elastic member in the processing groove clamps the mobile phone motherboard. Then hold the electric soldering pen with one hand for solder welding processing. During the welding process, control the operation of the servo motor by pressing the control key, so that the anti-slip member in the installation cylinder rotates to convey the solder wire in the installation cylinder. The fan accelerates the cooling of the solder, thereby quickly completing the welding processing of the mobile phone motherboard components.

[0015] Compared with the prior art, the beneficial effects of the present invention are: By setting the auxiliary welding assembly, the present invention can perform solder welding processing by holding the electric soldering pen with one hand during the welding process. During the welding process, control the operation of the servo motor by pressing the control key, so that the anti-slip member in the installation cylinder rotates to convey the solder wire in the installation cylinder. At the same time, the mobile phone motherboard can be limited by the processing frame, making the welding more convenient and the welding effect better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the installation structure of the integrated power supply device of the present invention; Figure 3 It is a schematic diagram of one side structure of the present invention; Figure 4 It is a partial sectional view structure diagram of the installation frame of the present invention; Figure 5 It is a partial sectional view structure diagram of the processing frame of the present invention; Figure 6 It is a schematic diagram of the structure of the electric soldering pen of the present invention; Figure 7 It is a partial sectional view structure diagram of the extension frame and the installation cylinder of the present invention; Figure 8 This is a schematic structural diagram of the placement rack of the present invention.

[0017] In the figure: 1. Mounting rack; 11. Slide groove; 12. Rotating shaft; 13. Mounting cavity; 14. First spring; 15. Clamping part; 16. Clamping groove; 2. Integrated power supply device; 21. Grille; 22. Protective rod; 23. Fan; 24. First control part; 25. Second control part; 3. Electric welding pen; 31. Connecting wire; 32. Fixed rack; 33. Reel; 34. Electric welding head; 4. Processing rack; 41. Processing groove; 42. Movable groove; 43. Guide rail; 44. Slide block; 45. Second spring; 46. Elastic part; 5. Placement rack; 51. Connecting shaft; 52. Clamping plate; 53. Protective pad; 6. Control key; 61. Extension rack; 62. Servo motor; 63. Mounting cylinder; 64. Mounting shaft; 65. Mounting ring; 66. Third spring; 67. Anti-slip part; 68. Fourth spring; 69. Pressure plate. Specific embodiments

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to Figures 1 - 8 , a welding device for mobile phone motherboard processing, including A welding mechanism, including a mounting rack 1 and an integrated power supply device 2 rotatably arranged inside the mounting rack 1, and an electric welding pen 3 connected to the integrated power supply device 2, with an electric welding head 34 provided at one end of the electric welding pen 3; An auxiliary welding assembly, including an extension rack 61 provided on the side wall of the electric welding pen 3 and a mounting cylinder 63 installed inside the extension rack 61. The mounting cylinder 63 is obliquely installed inside the extension rack 61, and one end of the mounting cylinder 63 is located on one side of the electric welding head 34; A servo motor 62 is fixedly installed on one side of the extension rack 61. An output end of the servo motor 62 is fixedly installed with a mounting shaft 64. An anti-slip part 67 is installed on the side wall of the mounting shaft 64, and the anti-slip part 67 is located inside the mounting cylinder 63; A plurality of fourth springs 68 are fixedly installed on the inner wall of the mounting cylinder 63. One end of each fourth spring 68 is fixedly installed with a pressure plate 69. The pressure plate 69 is an arc-shaped part, and the pressure plate 69 corresponds to the anti-slip part 67; A main board fixing mechanism, including a processing rack 4 slidably arranged at the bottom of the mounting rack 1 and an elastic part 46 arranged inside the processing rack 4. The elastic part 46 is an arc-shaped part; A placement assembly, including a placement rack 5 installed on one side of the mounting rack 1 and a clamping plate 52 arranged on one side of the placement rack 5.

[0020] In this embodiment, an installation ring 65 is fixedly installed on the side wall of the installation shaft 64, and a plurality of third springs 66 are fixedly installed on the side wall of the installation ring 65. The other ends of the third springs 66 are fixedly installed on the inner wall of the anti-slip member 67. One side of the electric soldering pen 3 is fixedly installed with a control key 6, and the control key 6 is connected to the servo motor 62 through a wire; Among them, a fixing frame 32 is fixedly installed on the side wall of the installation frame 1. A winding disc 33 is rotatably connected inside the fixing frame 32. A connecting wire 31 is wound inside the winding disc 33. The electric soldering pen 3 is connected to the integrated power supply device 2 through the connecting wire 31; It should be noted that the installation cylinder 63 can be used to place the solder wire. After the solder wire is placed inside the installation cylinder 63, the solder wire can be directly conveyed to the soldering head 34 at one end of the electric soldering pen 3 through the installation cylinder 63 for heating and melting welding. By setting the third spring 66, the anti-slip member 67, the fourth spring 68 and the pressing plate 69, the solder wire inside the installation cylinder 63 can be clamped. Then, by setting the servo motor 62, it can be used to control the rotation of the installation shaft 64. By setting the control key 6, it can be used to control the operation of the servo motor 62. The rotation of the installation shaft 64 can drive the anti-slip member 67 connected thereto through the third spring 66 to rotate, so as to convey the solder wire inside the installation cylinder 63. By holding the electric soldering pen 3 with one hand and pressing the control key 6, the single-handed soldering operation can be carried out more conveniently.

[0021] In this embodiment, a fan 23 is fixedly installed inside the integrated power supply device 2. A grille 21 is fixedly installed on one side of the integrated power supply device 2. A protective rod 22 is fixedly installed on the surface of the grille 21. A first control member 24 and a second control member 25 are installed on one side of the integrated power supply device 2; It should be noted that by setting the first control member 24, rotating the first control member 24 can be used to control the power supply output of the integrated power supply device 2 to the fan 23, so as to adjust the rotation of the fan 23. By setting the second control member 25, rotating the second control member 25 can control the power supply output of the integrated power supply device 2 to the electric soldering pen 3, so as to adjust the welding temperature of the electric soldering pen 3. By setting the fan 23, the cooling of the solder can be accelerated, so that the welding is more efficient.

[0022] In this embodiment, a rotating shaft 12 is rotatably connected to the inner wall of the installation frame 1. One end of the rotating shaft 12 is fixedly installed on one side of the integrated power supply device 2. The integrated power supply device 2 is rotatably connected inside the installation frame 1 through the rotating shaft 12; Among them, an installation cavity 13 is opened inside the installation frame 1. A first spring 14 is fixedly installed on the inner wall of the installation cavity 13. One end of the first spring 14 is fixedly installed with a clamping member 15. A plurality of clamping grooves 16 that fit with the clamping member 15 are opened on the side wall of the rotating shaft 12; It should be noted that the clamping member 15 and the clamping groove 16 are both triangular in shape. The first spring 14 can be provided to support the clamping member 15 so that the clamping member 15 can be clamped in the clamping groove 16. This can fix the rotating shaft 12 after rotation without affecting the rotation of the rotating shaft 12, thereby preventing the integrated power supply device 2 from rotating at will.

[0023] In this embodiment, a slide groove 11 is provided at the bottom of the mounting frame 1, the processing frame 4 is slidably connected inside the slide groove 11, a processing groove 41 is provided at the top of the processing frame 4, a movable groove 42 is provided on the inner wall of the processing groove 41, a guide rail 43 is fixedly installed on the inner wall of the movable groove 42, sliders 44 are fixedly installed at both ends of the elastic member 46, the slider 44 is slidably connected to the side wall of the guide rail 43, a second spring 45 is installed on the side wall of the guide rail 43, one end of the second spring 45 is in contact with the slider 44, and the other end of the second spring 45 is in contact with the movable groove 42; It should be noted that, by setting the slide groove 11, the processing frame 4 can be slidably placed in the slide groove 11 at the bottom of the mounting frame 1, which is convenient for the storage of the processing frame 4; by setting the processing groove 41, it can be used to place the mobile phone motherboard that needs to be welded; by setting the guide rail 43, the slider 44 can slide in the movable groove 42; by setting the second spring 45, the slider 44 can be pushed to one side; by pressing the mobile phone motherboard into the processing groove 41, the elastic member 46 is bent and deformed, and with the supporting force of the second spring 45, the elastic member 46 can elastically clamp the side wall of the mobile phone motherboard in the processing groove 41.

[0024] In this embodiment, one side of the placement rack 5 is rotatably connected to a connecting shaft 51 through a torsion spring, a clamping plate 52 is fixedly mounted on the side wall of the connecting shaft 51, and a protective pad 53 is fixedly mounted on the inner wall of the clamping plate 52; It should be noted that by setting a torsion spring, the clamp 52 can be rotated to one side, and the two clamps 52 can cooperate to clamp the welding pen 3 on one side of the placement rack 5, so that the welding pen 3 can be conveniently placed and taken out, and the protective pad 53 can be provided to protect the surface of the welding pen 3 during the clamping process.

[0025] The method for using the welding device for processing a mobile phone mainboard of the present invention comprises the following steps: Step (A), before use, slide the processing frame 4 out of the bottom slide groove 11 of the mounting frame 1, then move the integrated power supply device 2 to adjust the air outlet position of the fan 23 in the integrated power supply device 2, so that the fan 23 is aligned with the processing groove 41 in the processing frame 4, then remove the welding pen 3 from the placement frame 5, and insert the solder wire into the mounting tube 63; Step (B), when in use, adjust and rotate the first control member 24 to control the speed of the fan 23 and rotate the second control member 25 to control the temperature of the welding pen 3 according to the specific situation; Step (C): During the processing, first place the mobile phone motherboard to be welded into the processing groove 41 at the top of the processing rack 4, so that the elastic member 46 in the processing groove 41 clamps the mobile phone motherboard. Then, you can hold the electric welding pen 3 with one hand to perform soldering welding processing. During the welding process, control the operation of the servo motor 62 by pressing the control key 6, so that the anti-slip member 67 in the mounting cylinder 63 rotates to convey the solder wire in the mounting cylinder 63. The fan 23 can accelerate the cooling of the solder, so as to quickly complete the welding processing of the mobile phone motherboard components.

[0026] In summary, the welding device for mobile phone motherboard processing can perform soldering welding processing by holding the electric welding pen 3 with one hand during the welding process through the setting of the auxiliary welding component. During the welding process, control the operation of the servo motor 62 by pressing the control key 6, so that the anti-slip member 67 in the mounting cylinder 63 rotates to convey the solder wire in the mounting cylinder 63. At the same time, the mobile phone motherboard can be limited by the processing rack 4, making the welding more convenient and the welding effect better.

[0027] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A welding device for processing a mobile phone motherboard, characterized in that: include, A welding mechanism, comprising a mounting frame (1), an integrated power supply device (2) rotating inside the mounting frame (1), and an electric welding pen (3) connected to the integrated power supply device (2), wherein one end of the electric welding pen (3) is provided with an electric welding head (34); An auxiliary welding assembly, comprising an extension frame (61) arranged on the side wall of the electric welding pen (3) and a mounting tube (63) mounted inside the extension frame (61), wherein the mounting tube (63) is obliquely mounted inside the extension frame (61), and one end of the mounting tube (63) is located on one side of the electric welding head (34); A servo motor (62) is fixedly mounted on one side of the extension frame (61), a mounting shaft (64) is fixedly mounted on the output end of the servo motor (62), a side wall of the mounting shaft (64) is mounted with an anti-slip member (67), and the anti-slip member (67) is located inside the mounting tube (63); A plurality of fourth springs (68) are fixedly mounted on the inner wall of the mounting tube (63); a pressure plate (69) is fixedly mounted on one end of the fourth spring (68); the pressure plate (69) is an arc-shaped member, and the pressure plate (69) corresponds to the anti-slip member (67); The mainboard fixing mechanism comprises a processing frame (4) sliding on the bottom of the mounting frame (1) and an elastic member (46) arranged inside the processing frame (4), wherein the elastic member (46) is an arc-shaped member; The placement assembly comprises a placement frame (5) mounted on one side of the mounting frame (1) and a clamping plate (52) arranged on one side of the placement frame (5).

2. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: A mounting ring (65) is fixedly mounted on the side wall of the mounting shaft (64), a plurality of third springs (66) are fixedly mounted on the side wall of the mounting ring (65), and the other end of the third spring (66) is fixedly mounted on the inner wall of the anti-slip member (67).

3. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: A fan (23) is fixedly mounted inside the integrated power supply device (2), a grille (21) is fixedly mounted on one side of the integrated power supply device (2), a protective rod (22) is fixedly mounted on the surface of the grille (21), and a first control component (24) and a second control component (25) are mounted on one side of the integrated power supply device (2).

4. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: A control key (6) is fixedly mounted on one side of the welding pen (3), and the control key (6) is connected to the servo motor (62) via a wire.

5. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: The inner wall of the mounting frame (1) is rotatably connected to a rotating shaft (12), one end of the rotating shaft (12) is fixedly mounted on one side of the integrated power supply device (2), and the integrated power supply device (2) is rotatably connected to the inside of the mounting frame (1) via the rotating shaft (12).

6. The welding device for processing a mobile phone mainboard according to claim 5, characterized in that: The mounting frame (1) has a mounting cavity (13) formed inside, a first spring (14) is fixedly mounted on the inner wall of the mounting cavity (13), a clamping member (15) is fixedly mounted on one end of the first spring (14), and a plurality of clamping grooves (16) that fit with the clamping member (15) are formed on the side wall of the rotating shaft (12).

7. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: A slide groove (11) is provided at the bottom of the mounting frame (1), the processing frame (4) is slidably connected inside the slide groove (11), a processing groove (41) is provided at the top of the processing frame (4), a movable groove (42) is provided on the inner wall of the processing groove (41), a guide rail (43) is fixedly installed on the inner wall of the movable groove (42), sliders (44) are fixedly installed at both ends of the elastic member (46), the sliders (44) are slidably connected to the side walls of the guide rails (43), a second spring (45) is installed on the side walls of the guide rails (43), one end of the second spring (45) is in contact with the slider (44), and the other end of the second spring (45) is in contact with the movable groove (42).

8. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: One side of the placement rack (5) is rotatably connected to a connecting shaft (51) via a torsion spring, the clamping plate (52) is fixedly mounted on the side wall of the connecting shaft (51), and a protective pad (53) is fixedly mounted on the inner wall of the clamping plate (52).

9. The welding device for processing a mobile phone motherboard according to claim 1, characterized in that: A fixing frame (32) is fixedly mounted on a side wall of the mounting frame (1); a winding reel (33) is rotatably connected inside the fixing frame (32); a connecting wire (31) is wound inside the winding reel (33); and the welding pen (3) is connected to the integrated power supply device (2) via the connecting wire (31).

10. A method for using the welding device for processing a mobile phone motherboard according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step (A), before use, slide the processing frame (4) out of the slide groove (11) at the bottom of the mounting frame (1), then move the integrated power supply device (2), adjust the air outlet position of the fan (23) in the integrated power supply device (2), so that the fan (23) is aligned with the processing groove (41) in the processing frame (4), then remove the electric welding pen (3) from the placement frame (5), and insert the solder wire into the mounting tube (63); Step (B), during use, adjusting and rotating the first control member (24) to control the speed of the fan (23), and rotating the second control member (25) to control the temperature of the welding pen (3); In step (C), during the processing, the mobile phone mainboard to be welded is first placed in the processing groove (41) at the top of the processing frame (4), so that the elastic member (46) in the processing groove (41) clamps the mobile phone mainboard, and then the electric welding pen (3) is held in one hand to perform soldering processing. During the welding process, the servo motor (62) is controlled by pressing the control key (6) to rotate the anti-slip member (67) in the installation cylinder (63) to transport the solder wire in the installation cylinder (63), and the fan (23) accelerates the cooling of the solder, thereby quickly completing the welding processing of the mobile phone mainboard components.

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