Laser polishing device combining gas protection and substrate heat dissipation and using method

Abstract

The invention provides a laser polishing device combining gas protection and substrate heat dissipation and a using method. The device comprises a focus lens (1), a laser beam (2), a to-be-polished sample piece (3), a gas nozzle (4), a gas pipe (5), a high-pressure gas cylinder (6), a dust collector (7), a cooling liquid level (8), a metal substrate (9), an objective table (10), a water tank (11) and a laser (12). The invention further relates to a using method of the device. A micro-nano coarse structure is formed on the surface of the metal substrate through chemical etching, electrochemical etching or laser etching and the like, then a hydrophilic oxide layer is introduced through oxidation treatment or plasma treatment, and the super-hydrophilic performance of the metal substrate is further enhanced. The device has excellent liquid cooling capacity, gas protection performance and oxidation resistance, heat can be efficiently conducted and dissipated in the laser polishing process, the temperature uniformity of the surface of a sample is ensured, and overheating and oxidation phenomena are prevented.

Description

Technical Field

[0001] The present invention relates to the field of advanced manufacturing technology of aero-engines; in particular, it relates to a laser polishing device combining gas protection and substrate heat dissipation and a using method thereof. Background Art

[0002] Laser polishing is an advanced surface processing technology that uses a high-energy laser beam to locally melt and rapidly solidify the surface of a material, thereby achieving surface smoothing. Compared with traditional mechanical polishing and chemical polishing, laser polishing has significant advantages such as non-contact processing, high precision, and high efficiency, and is particularly suitable for processing high-performance materials that are difficult to handle, such as nickel-based alloys, titanium alloys, and ceramic matrix composites. With the continuous progress of aerospace technology, the role of laser polishing technology in improving the surface quality of key components and extending service life has become increasingly important, and it has become an indispensable important process in this field.

[0003] Taking IN718 nickel-based alloy as an example, this is a precipitation-hardened nickel-chromium-based superalloy, which is widely used in the manufacturing of key components such as aero-engine turbine blades, turbine disks, and rocket nozzles due to its excellent high-temperature strength, creep resistance, corrosion resistance, and good workability. However, such materials usually have characteristics such as high strength and high hardness and belong to typical difficult-to-machine materials. Traditional polishing methods are prone to problems such as surface oxidation, thermal damage, and microcracks during processing, while laser polishing technology overcomes these technical problems with its unique processing principle, but the heat dissipation and surface protection in its high-temperature processing environment still need to be further optimized. Summary of the Invention

[0004] The purpose of the present invention is to provide a laser polishing device combining gas protection and substrate heat dissipation and a using method thereof.

[0005] The present invention is achieved by the following technical solutions:

[0006] The present invention relates to a laser polishing device combining gas protection and substrate heat dissipation, including: a focusing lens 1, a laser beam 2, a sample to be polished 3, a gas nozzle 4, a gas pipe 5, a high-pressure gas cylinder 6, a vacuum cleaner 7, a coolant liquid level 8, a metal substrate 9, a stage 10, a water tank 11, and a laser 12;

[0007] Among them, the surface of the metal substrate 9 is provided with a coolant film composed of a micro-nano structure and a hydrophilic oxide layer;

[0008] The stage 10 is arranged in the water tank 11, and the metal substrate 9 is arranged at the upper end of the stage 10;

[0009] The sample to be polished 3 is placed on the metal substrate 9; the gas nozzle 4 and the vacuum cleaner 7 are respectively arranged at both ends of the sample to be polished 3; the focusing lens 1 is suspended above the sample to be polished 3.

[0010] The nozzle diameter of the gas nozzle 4 is 5 - 10 mm, and the gas flow rate is controlled at 15 - 30 L / min.

[0011] The present invention also relates to a method for using the laser polishing device combining gas protection and substrate heat dissipation as described above, including the following steps:

[0012] Step 1, the untreated metal substrate plate is successively subjected to ultrasonic cleaning to remove surface dirt and oil stains, drying, laser etching or etching with an etching solution, rinsing with deionized water to remove surface debris and impurities, and placed in an oxidation solution for oxidation treatment;

[0013] Step 2, the metal substrate 9 is placed on the stage 10 and coolant is added until a thin coolant film is formed on the surface of the metal substrate 9;

[0014] Step 3, the sample to be polished 3 is ultrasonically cleaned to remove surface dirt and oil stains and dried;

[0015] Step 4, the sample to be polished 3 pretreated by ultrasonic cleaning and drying is placed in the middle of the metal substrate 9 in the water tank 11 (the surface of the sample to be polished faces the laser head, and the other side is partially immersed in the coolant on the metal substrate). Due to the presence of the coolant film on the surface of the metal substrate 9, the bottom of the sample can be partially immersed in the coolant, and the surface of the metal substrate 9 to be polished faces the laser beam 2 of the focusing lens 1;

[0016] Step 5, adjust the position of the focusing lens 1 to the working focal length;

[0017] Step 6, turn on the vacuum cleaner 7, the high-pressure gas cylinder 6 of the protective gas, and the laser 12 in sequence, and modulate the parameters for polishing;

[0018] Step 7, turn off the laser 12, the high-pressure gas cylinder 6 and the vacuum cleaner 7, clean the water tank 11 and the stage 10, and take out the sample for cleaning and drying.

[0019] Preferably, in Step 1, the ultrasonic cleaning is specifically: ultrasonic cleaning with ethanol for 20 - 30 min; the material of the metal substrate plate is a conductive metal such as copper or aluminum.

[0020] Preferably, in Step 1, the drying temperature is 250 - 300 °C, and the drying time is 25 - 30 min.

[0021] Preferably, in step 1, the specific method of laser etching or etching solution etching is as follows: Use a high-precision laser to etch micro-nano-level concave and convex structures on the surface of the metal substrate 9 or form complex micro-nano-level structures on the surface through treatment with acid-base solutions.

[0022] Preferably, in step 1, the oxidation treatment is specifically as follows: Introduce a hydrophilic oxide layer on the surface of the metal substrate 9 to enhance the superhydrophilic performance of the surface.

[0023] Preferably, in step 2, the coolant is a water-based coolant (such as deionized water, alcohol), a fluorinated liquid, and silicone oil; the stage 10 is made of materials with good thermal conductivity such as copper, aluminum, titanium, stainless steel, and aluminum alloy.

[0024] Preferably, in step 3, the ultrasonic cleaning is specifically as follows: Use ethanol for ultrasonic cleaning for 20 - 30 min; and the specimen is a heat-resistant metal or superalloy material such as nickel-based superalloy, iron-based superalloy, and aluminum alloy; the drying temperature is 250 - 300 °C, and the drying time is 25 - 30 min.

[0025] Preferably, in step 5, the working focal length of the focusing lens is 170 - 180 mm.

[0026] Preferably, in step 6, the pipe diameter D of the vacuum cleaner is 20 - 40 mm, the wind speed at the hood opening is V1 = 0.4 - 0.6 m / s, and the wind speed inside the hood: V2 < 3 m / s.

[0027] The laser 12 used in the present invention is a YAG solid laser, a CO 2 pulse laser, or a semiconductor laser; its laser wavelength range is 200 nm - 10.6 μm, and the output power range is 10% - 100%; a circular laser spot or a square laser spot is selected for laser processing. The diameter of the circular laser spot is 1 mm - 20 mm, and the side length of the square laser spot is 1 mm - 25 mm; the pulse width range is 2 ns - 400 ns, the pulse frequency range is 10 Hz - 5000 kHz, the scanning speed range is 1000 mm / s - 9000 mm / s, and the line spacing range is 0.01 mm - 5 mm; the average laser power density range is 50 W / cm 2 ~500 W / cm 2 ; The laser scanning path consists of two mutually orthogonal bow-shaped trajectories, where each bow-shaped trajectory scans sequentially in a predetermined direction, and the scanning directions of the two bow-shaped trajectories are perpendicular to each other.

[0028] The present invention has the following advantages:

[0029] (1) Significantly improved heat dissipation efficiency: The device of the present invention constructs a super-hydrophilic micro-nano structure on the surface of the metal-based heat sink, greatly improving the wettability and heat transfer efficiency of the coolant, enabling it to quickly absorb and carry away the heat generated during the laser polishing process; in addition, this device combines gas protection cooling and partial immersion cooling methods to achieve multi-dimensional collaborative heat dissipation. Compared with traditional single cooling technologies (such as gas cooling or liquid cooling), it has higher heat dissipation efficiency and more uniform heat distribution, ensuring that the temperature in the processing area is always within the ideal range.

[0030] (2) Precise thermal management: The device of the present invention integrates a real-time temperature monitoring and feedback system, which can monitor the temperature distribution in the processing area in real time through sensors and automatically adjust the coolant flow rate and gas injection intensity according to the feedback, thereby achieving precise thermal management; in addition, this device focuses on the local cooling of the processing area, avoiding problems such as overcooling or interference with the laser beam path caused by traditional liquid immersion cooling, ensuring that the processing process is more stable and controllable.

[0031] (3) Significantly improved processing quality: The device of the present invention forms an inert gas protection layer in the processing area through the gas protection system, effectively preventing material oxidation or thermal damage caused by high temperature, thereby improving the surface finish and performance of the processed surface; in addition, the efficient heat dissipation and precise temperature control functions of this device can avoid defects such as surface micro-cracks and deformation caused by heat accumulation, significantly reducing the surface roughness of the processed surface and greatly improving the overall processing quality.

[0032] (4) Strong applicability: The device of the present invention is applicable to a variety of metal materials (such as aluminum alloy, stainless steel, copper alloy, etc.) and can meet the processing requirements of workpieces with different sizes and shapes. It has a wide range of applications, covering multiple fields such as aerospace, automotive manufacturing, and precision instruments; in addition, this device adopts a modular design, supports rapid disassembly and flexible adjustment, and can be easily integrated into existing laser processing equipment to adapt to different laser powers and process requirements, with extremely strong industrial adaptability. Brief Description of the Drawings

[0033] Figure 1 It is a schematic structural diagram of the laser polishing device combining gas protection and substrate heat dissipation of the present invention;

[0034] Reference numerals in the drawings: 1 - focusing lens, 2 - laser beam, 3 - sample to be polished, 4 - gas nozzle, 5 - gas pipe, 6 - high-pressure gas cylinder, 7 - vacuum cleaner, 8 - coolant liquid level, 9 - metal substrate, 10 - stage, 11 - water tank, 12 - laser. Detailed Description of the Invention

[0035] The present invention will be described in detail below with reference to specific embodiments. It should be noted that the following embodiments are only further descriptions of the present invention, but the protection scope of the present invention is not limited to the following embodiments.

[0036] Example 1

[0037] This example relates to a laser polishing device that combines gas protection and substrate heat dissipation, as shown in Figure 1 Figure 7, including: focusing mirror 1, laser beam 2, sample to be polished 3, gas nozzle 4, trachea 5, high-pressure gas cylinder 6, vacuum cleaner 7, coolant liquid level 8, metal substrate 9, carrier table 10, water tank 11, laser 12;

[0038] Among them, the surface of the metal substrate 9 is provided with a coolant film composed of a micro-nano structure and a hydrophilic oxide layer;

[0039] The carrier table 10 is arranged in the water tank 11, and the metal substrate 9 is arranged at the upper end of the carrier table 10;

[0040] The sample to be polished 3 is placed on the metal substrate 9; the gas nozzle 4 and the vacuum cleaner 7 are respectively arranged at both ends of the sample to be polished 3 in a matching manner; the focusing mirror 1 is suspended above the sample to be polished 3.

[0041] The nozzle diameter of the gas nozzle 4 is 5 - 10 mm, and the gas flow rate is controlled at 15 - 30 L / min.

[0042] This embodiment also relates to a method for using a laser polishing device that combines gas protection and substrate heat dissipation, and the specific steps are as follows:

[0043] Step 1, Place the sample of the smooth and flat copper plate after ultrasonic cleaning with ethanol in a drying oven and dry it at 250 °C for 25 min;

[0044] Step 2, Place the copper substrate after ultrasonic cleaning and drying pretreatment on the carrier table 10 of the laser, and use a nanosecond fiber laser to perform laser ablation processing on the surface of the sample. The laser wavelength is 1064 nm, the maximum repetition frequency is 1000 kHz, the pulse width is 4 - 200 ns, the maximum scanning speed is 8000 mm / s, and the maximum power is 20 W. The laser processing process is carried out in the air, and the spot diameter on the surface of the target material during the processing is 50 μm;

[0045] Step 3, Put the etched copper plate into an ethanol solution for cleaning to remove surface metal debris and impurities;

[0046] Step 4, Put the cleaned copper plate into a high-temperature furnace and heat it at 300 °C for 60 min. The heated copper plate cools naturally in the furnace;

[0047] Step 5, Place the processed copper plate on the carrier table 10 in the water tank 11 of the laser 12, and add deionized water to just submerge the copper plate;

[0048] Step 6: Cut the 2-mm-thick IN718 nickel-based alloy after 8-mesh sandblasting into 20-mm × 20-mm square plates.

[0049] Step 7: Place the cut IN718 specimens in anhydrous ethanol and ultrasonically clean them for 25 min to remove surface metal debris and impurities.

[0050] Step 8: Place the cleaned IN718 specimens in an oven and dry them at 250°C for 25 min.

[0051] Step 9: Take out the dried specimens and place them at the center of the copper substrate in the laser water tank.

[0052] Step 10: Turn on the vacuum cleaner 7.

[0053] Step 11: Turn on the argon gas and control the gas flow rate at 20 L / min.

[0054] Step 12: Turn on the laser 12, set the power to 90 W, the spacing to 0.15 mm, and the linear velocities to 60 mm / s, 90 mm / s, 120 mm / s, and 150 mm / s, and perform a bow-shaped cross scan for each group.

[0055] Step 13: Turn off the laser 12, the argon gas, and the vacuum cleaner 7, and take out the samples.

[0056] Example 2

[0057] This example relates to a method for using a laser polishing device that combines gas protection and substrate heat dissipation. The specific steps are as follows:

[0058] Step 1: Place the specimen of the smooth and flat copper plate after ultrasonic cleaning with ethanol in a drying oven and dry it at 250°C for 25 min.

[0059] Step 2: Place the copper substrate after ultrasonic cleaning and pre-drying on the stage 10 of the laser 12, and perform laser ablation processing on the sample surface using a nanosecond fiber laser. The laser wavelength is 1064 nm, the maximum repetition frequency is 1000 kHz, the pulse width is 4 - 200 ns, the maximum scanning speed is 8000 mm / s, and the maximum power is 20 W. The laser processing is carried out in air, and the spot diameter on the surface of the target material during the processing is 50 μm.

[0060] Step 3: Place the etched copper plate in an ethanol solution for cleaning to remove surface metal debris and impurities.

[0061] Step 4: Place the cleaned copper plate in a 3% hydrogen peroxide solution and let it stand for 15 min.

[0062] Step 5: After rinsing the processed copper plate with deionized water, place it on the stage 10 in the upper water tank 11 of the laser 12, and add deionized water to just submerge the copper plate.

[0063] Step 6: Cut the 2mm-thick IN718 nickel-based alloy after 8-mesh sandblasting into 20mm×20mm square plates.

[0064] Step 7: Place the cut IN718 specimens in absolute ethanol and ultrasonically clean them for 25 minutes to remove surface metal debris and impurities.

[0065] Step 8: Place the cleaned IN718 specimens in an oven and dry them at 250°C for 25 minutes.

[0066] Step 9: Take out the dried specimens and place them at the center position of the copper substrate in the water tank 11 of the laser 12.

[0067] Step 10: Turn on the vacuum cleaner 7.

[0068] Step 11: Turn on the argon gas and control the gas flow rate at 20 L / min.

[0069] Step 12: Turn on the laser 12, set the power to 90 W, the spacing to 0.15 mm, and the linear speeds to 60 mm / s, 90 mm / s, 120 mm / s, and 150 mm / s respectively, and perform a group of bow-shaped cross scans.

[0070] Step 13: Turn off the laser 12, the argon gas, and the vacuum cleaner, and take out the samples.

[0071] Example 3

[0072] This example relates to a method for using a laser polishing device that combines gas protection and substrate heat dissipation. The specific steps are as follows:

[0073] Step 1: Place the specimens of the smooth and flat copper plate after ultrasonic cleaning with ethanol in a drying oven and dry them at 250°C for 25 minutes.

[0074] Step 2: Place the copper substrate after ultrasonic cleaning and pre-drying in a 25% nitric acid solution and etch it for 5 minutes.

[0075] Step 3: Rinse the etched copper plate with deionized water to remove surface metal debris and impurities.

[0076] Step 4: Put the cleaned copper plate into a NaOH solution prepared according to sodium hydroxide (NaOH): 0.5 mol / L: hydrogen peroxide (H 2 O 2 , 30%): Add it to the NaOH solution at a volume ratio of 1:10 (i.e., 100 mL of H 2 O2 Oxidize in a solution (adding 1 L of NaOH solution) for 10 min and then wash with deionized water;

[0077] Step 5: Place the treated copper plate on the stage 10 in the water tank 11 of the laser 12, and add deionized water until it just covers the copper plate;

[0078] Step 6: Cut the 2-mm-thick IN718 nickel-based alloy after 8-mesh sandblasting into 20-mm × 20-mm square plates;

[0079] Step 7: Place the cut IN718 specimens in absolute ethanol and ultrasonically clean for 25 min to remove surface metal debris and impurities;

[0080] Step 13: Place the cleaned IN718 specimens in an oven and dry at 250 °C for 25 min;

[0081] Step 9: Take out the dried specimens and place them at the center of the copper substrate in the water tank 11 of the laser 12;

[0082] Step 10: Turn on the vacuum cleaner 7;

[0083] Step 11: Turn on the argon gas and control the gas flow rate at 20 L / min.

[0084] Step 12: Turn on the laser 12, set the power to 90 W, the spacing to 0.15 mm, and the linear speeds to 60 mm / s, 90 mm / s, 120 mm / s, and 150 mm / s, and perform a bow-shaped cross-scan for each group.

[0085] Step 13: Turn off the laser 12, the argon gas, and the vacuum cleaner 7, and take out the samples.

[0086] Example 4

[0087] This example relates to a method for using a laser polishing device that combines gas protection and substrate heat dissipation, and the specific steps are as follows:

[0088] Step 1: Place the specimens of the smooth and flat copper plate after ultrasonic cleaning with ethanol in a drying oven and dry at 250 °C for 25 min;

[0089] Step 2: Place the copper substrate after ultrasonic cleaning and pre-drying in a solution prepared by dissolving ferric chloride powder at a mass ratio of 40% in deionized water, and etch at a constant temperature of 40 °C for 15 min;

[0090] Step 3: Rinse the etched copper plate with deionized water to remove surface metal debris and impurities;

[0091] Step 4: Put the cleaned copper plate into a 10% nitric acid solution for oxidation treatment for 2 minutes, and then wash it with deionized water.

[0092] Step 5: Place the treated copper plate on the stage 10 in the water tank 11 of the laser 12, and add deionized water until it just covers the copper plate.

[0093] Step 6: Cut the 2mm thick IN718 nickel-based alloy after 8-mesh sandblasting into 20mm * 20mm square plates.

[0094] Step 7: Place the cut IN718 sample in absolute ethanol and ultrasonically clean it for 25 minutes to remove surface metal debris and impurities.

[0095] Step 8: Place the cleaned IN718 sample in an oven and dry it at 250°C for 25 minutes.

[0096] Step 9: Take out the dried sample and place it at the center position of the copper substrate in the water tank 11 of the laser 12.

[0097] Step 10: Turn on the vacuum cleaner 7.

[0098] Step 11: Turn on the argon gas and control the gas flow rate at 20 L / min.

[0099] Step 12: Turn on the laser 12, set the power to 90W, the spacing to 0.15mm, and the linear speeds to 60mm / s, 90mm / s, 120mm / s, and 150mm / s respectively, and perform a bow-shaped cross-scan for each group.

[0100] Step 13: Turn off the laser 12, the argon gas, and the vacuum cleaner 7, and take out the sample.

[0101] In summary, in order to address the problems of heat accumulation, surface oxidation, and insufficient cooling efficiency during the laser polishing process, the present invention proposes and develops a superhydrophilic micro-nano structure metal-based heat dissipation device that combines gas protection cooling and partial immersion cooling. By constructing a superhydrophilic micro-nano structure on the surface of the metal substrate, the wettability and heat dissipation efficiency of the coolant are significantly improved. At the same time, combined with inert gas protection, surface oxidation at high temperatures is effectively prevented. In addition, the combined action of the coolant and the gas can quickly reduce the temperature of the processing area, avoid thermal damage, and ensure the stability of the laser path, thereby significantly improving the processing efficiency and surface quality.

[0102] The heat dissipation device of the present invention is not only applicable to the laser polishing of IN718 nickel-based alloy, but also can be extended to the surface processing of other key materials in the aerospace field, such as titanium alloy, aluminum-lithium alloy, and high-performance composite materials, etc. In the future, by combining intelligent sensing and automation control technologies, this device is expected to achieve real-time monitoring and dynamic adjustment of the processing process, further improving the processing accuracy and reliability. As a green and efficient auxiliary technology, this device will provide important support for high-end manufacturing in the aerospace field and show broad application prospects in other high-end manufacturing fields.

[0103] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific implementation manners, and those skilled in the art can make various deformations or modifications within the scope of the claims, which does not affect the essence of the present invention.

Claims

1. A laser polishing device combining gas protection and substrate heat dissipation, characterized in that: include: Focusing mirror (1), laser beam (2), sample to be polished (3), gas nozzle (4), gas pipe (5), high-pressure gas cylinder (6), vacuum cleaner (7), coolant level (8), metal substrate (9), stage (10), water tank (11), laser (12); Wherein, a cooling liquid film consisting of a micro-nano structure and a hydrophilic oxide layer is provided on the surface of the metal substrate (9); The loading platform (10) is arranged in the water tank (11), and the metal substrate (9) is arranged on the upper end of the loading platform (10); The sample to be polished (3) is placed on a metal substrate (9); a gas nozzle (4) and a vacuum cleaner (7) are respectively arranged at two ends of the sample to be polished (3); and a focusing mirror (1) is suspended above the sample to be polished (3).

2. A method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 1, characterized in that: The following steps are involved: Step 1, the untreated metal substrate plate is successively subjected to ultrasonic cleaning to remove surface dirt and oil stains, drying, laser etching or etching with an etching solution, and rinsed with deionized water to remove surface debris and impurities, and then placed in an oxidizing solution for oxidation treatment; Step 2, placing the metal substrate (9) on the stage (10) and adding cooling liquid until a thin cooling liquid film is formed on the surface of the metal substrate (9); Step 3, ultrasonically clean the dirt and oil stains on the surface of the sample to be polished (3), and dry it; Step 4, placing the sample to be polished (3) after ultrasonic cleaning and drying pretreatment in the middle of the metal substrate (9) in the water tank (11), with the side of the metal substrate (9) to be polished facing the laser beam (2) of the focusing mirror (1); Step 5, adjusting the position of the focusing lens (1) to a working focal length; Step 6, sequentially turning on the vacuum cleaner (7), the high-pressure gas cylinder (6) of the protective gas, and the laser (12), and modulating the parameters for polishing; Step 7, turn off the laser (12), high-pressure gas cylinder (6) and vacuum cleaner (7), clean the water tank (11) and the stage (10), take out the sample for cleaning and drying.

3. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 1, the ultrasonic cleaning is specifically: using ethanol for ultrasonic cleaning for 20 to 30 minutes; the material of the metal substrate plate is copper or aluminum, which is a metal with good thermal conductivity.

4. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 1, the drying temperature is 250-300° C., and the drying time is 25-30 min.

5. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 1, the specific method of laser etching or etching liquid etching is: using a high-precision laser to etch a micro-nanoscale concave-convex structure on the surface of the metal substrate (9) or treating the surface with an acid-base solution to form a complex micro-nanoscale structure.

6. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 1, the oxidation treatment specifically includes: introducing a hydrophilic oxide layer on the surface of the metal substrate (9).

7. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 2, the coolant is water-based coolant, fluorinated liquid and silicone oil.

8. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 3, the sample to be polished is a high-temperature resistant metal or superalloy material such as a nickel-based high-temperature alloy, an iron-based high-temperature alloy, or an aluminum alloy.

9. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 5, the inert gas used is any one or a combination of helium, neon and argon, the nozzle diameter is 5-10 mm, and the gas flow rate is controlled at 15-30 L / min.

10. The method for using the laser polishing device combining gas protection and substrate heat dissipation as claimed in claim 2, characterized in that: In step 6, the pipe diameter D of the vacuum cleaner is 20-40 mm, the wind speed at the hood opening is V1=0.4-0.6 m / s, and the wind speed inside the hood is V2<3 m / s.

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