Rhinestone grinding and polishing self-adaptive control method and system

Abstract

The invention is suitable for the technical field of rhinestone grinding and polishing, and particularly relates to a rhinestone grinding and polishing self-adaptive control method and system.The method comprises the steps that when it is detected that a contact action is triggered, a grinding and polishing video is obtained; analyzing according to the grinding and polishing video to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain; wherein the first grinding and polishing characteristic chain is used for reflecting the content change when the polishing material enters the polishing area in the current rotation period, and the second grinding and polishing characteristic chain is used for reflecting the content change when the polishing material leaves the polishing area in the current rotation period; and node feature analysis is conducted according to the polishing area, the first grinding and polishing feature chain and the second grinding and polishing feature chain, and adding information is obtained. According to the rhinestone grinding and polishing self-adaptive control method and system, the content change, caused by the centrifugal effect, of the polishing material can be reduced, then the polishing gap of the rhinestone surface can be reduced, and finally the high-standard stability of the product quality is kept.

Description

Technical Field

[0001] This application belongs to the technical field of rhinestone grinding and polishing, and particularly relates to an adaptive control and system for rhinestone grinding and polishing. Background Art

[0002] Rhinestone grinding and polishing refers to the key technology of processing the surface of rhinestone blanks through grinding and polishing processes to improve the surface finish, light transmittance, and aesthetic appearance of rhinestone blanks.

[0003] In the related art, high-speed rotating grinding and polishing disks are usually used to achieve efficient grinding and polishing of the surface of rhinestone blanks. During the polishing process of rhinestones, polishing materials (such as polishing powder or polishing liquid) are generally added to the grinding and polishing disks. Due to the action of centrifugal force, the polishing materials originally evenly attached to the surface of the grinding and polishing disks will gather towards the edges, resulting in uneven distribution of the content of the polishing materials on the grinding and polishing disks. The uneven polishing materials will cause different degrees of polishing on the surface of the rhinestones, not only reducing the optical uniformity of the rhinestones and causing light and dark differences in the light transmission effect, but also possibly leaving scratches or polishing patterns on the surface, ultimately affecting the visual aesthetic appearance and product quality of the rhinestones. Summary of the Invention

[0004] The embodiments of this application provide an adaptive control method and system for rhinestone grinding and polishing, which can improve the problem that uneven polishing materials cause different degrees of polishing on the surface of rhinestones, resulting in light and dark differences in the light transmission effect, and ultimately affecting the visual aesthetic appearance and product quality of the rhinestones.

[0005] In a first aspect, the embodiments of this application provide an adaptive control method for rhinestone grinding and polishing, including:

[0006] When a contact action is detected to be triggered, obtain a grinding and polishing video; wherein, the contact action is used to reflect that the rhinestone material is placed in the limiting mechanism of the grinding and polishing disk of the grinding and polishing device, and the grinding and polishing video is used to reflect the distribution of the polishing materials on the grinding and polishing disk;

[0007] Analyze according to the grinding and polishing video to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain; wherein, the first grinding and polishing feature chain is used to reflect the change in the content of the polishing materials when entering the polishing area in the current rotation cycle, and the second grinding and polishing feature chain is used to reflect the change in the content of the polishing materials when leaving the polishing area in the current rotation cycle. The rotation cycle is used to reflect the time required for the grinding and polishing disk to complete one full rotation, and the polishing area is used to reflect the area surrounded by the limiting mechanism on the grinding and polishing disk;

[0008] Node feature analysis is performed based on the polishing area, the first polishing feature chain, and the second polishing feature chain to obtain addition information, where the addition information is used to reflect the addition amount of the polishing material in the next rotation cycle. The above technical solution in the embodiments of the present application has at least the following technical effects:

[0009] In the water drill polishing adaptive control method provided by the embodiments of the present application, when it is detected that the contact action for reflecting the placement of the water drill material in the limiting mechanism of the polishing disc of the polishing device is triggered, a polishing video for reflecting the distribution of the polishing material on the polishing disc is obtained. Then, analysis is performed based on the polishing video to obtain a first polishing feature chain for reflecting the content change of the polishing material when it enters the polishing area formed by the limiting mechanism surrounding the polishing disc in the current rotation cycle and a second polishing feature chain for reflecting the content change of the polishing material when it leaves the polishing area formed by the limiting mechanism surrounding the polishing disc in the current rotation cycle. Finally, analysis is performed through the polishing area, the first polishing feature chain, and the second polishing feature chain to obtain addition information for reflecting the addition amount of the polishing material in the next rotation cycle. This method can effectively analyze the polishing video to obtain the first polishing feature chain and the second polishing feature chain that can reflect the content change of the polishing material under different conditions of the polishing disc in the current rotation cycle. Then, node analysis is performed based on the first polishing feature chain, the second polishing feature chain, and the polishing area, so as to analyze and obtain the addition amount of the polishing material corresponding to the next rotation of the current rotation cycle. The control device then controls the addition device to add the polishing material in the polishing area in the next rotation cycle according to the addition amount, thereby reducing the content change of the polishing material caused by the centrifugal force, further reducing the polishing gap on the surface of the water drill, and finally keeping the product quality stable at a high standard.

[0010] In a possible implementation manner of the first aspect, the analyzing based on the polishing video to obtain the first polishing feature chain and the second polishing feature chain includes:

[0011] Obtain rotational speed information, where the rotational speed information is used to reflect the rotational speed of the polishing disc;

[0012] Process the polishing video according to the rotational speed information to obtain an image set, where the image set is used to reflect the set of images of each frame in the current rotation cycle in the polishing video;

[0013] Analyze based on the image set to obtain the first polishing feature chain and the second polishing feature chain.

[0014] In a possible implementation manner of the first aspect, the analyzing based on the image set to obtain the first polishing feature chain and the second polishing feature chain includes:

[0015] Analyze according to the image set to obtain a plurality of contact contents and a plurality of away contents; wherein, the contact content is used to indicate the content when the polishing material enters the polishing area as reflected by each frame of the image in the image set, and the away content is used to indicate the content when the polishing material leaves the polishing area as reflected by each frame of the image in the image set;

[0016] Sort a plurality of the contact contents in time series to obtain a first polishing feature chain;

[0017] Sort a plurality of the away contents in time series to obtain a second polishing feature chain.

[0018] In a possible implementation manner of the first aspect, the analyzing according to the polishing area, the first polishing feature chain and the second polishing feature chain to obtain additional information includes:

[0019] Analyze according to the initial node feature of the first polishing feature chain to obtain a first content ratio; wherein, the first content ratio is used to reflect the content distribution when the polishing material first enters the polishing area in the current rotation cycle; wherein, the initial node feature is used to reflect the content change of the earliest polishing material in the first polishing feature chain and the second polishing feature chain;

[0020] Analyze according to the initial node feature of the second polishing feature chain to obtain a second content ratio; wherein, the second content ratio is used to reflect the content distribution when the polishing material leaves the polishing area in the current cycle;

[0021] Analyze according to the polishing area, the first polishing feature chain, the second polishing feature chain, the first content ratio and the second content ratio to obtain additional information.

[0022] In a possible implementation manner of the first aspect, the analyzing according to the polishing area, the first polishing feature chain, the second polishing feature chain, the first content ratio and the second content ratio to obtain additional information includes:

[0023] Analyze based on the first polishing feature chain and the second polishing feature chain to obtain a first polishing change and a second polishing change; wherein, the first polishing change is used to reflect the difference between the content of the polishing material when it leaves the output end of the limiting mechanism and the content of the polishing material when it reaches the input end of the limiting mechanism after rotation, and the second polishing change is used to reflect the difference between the content of the polishing material when it reaches the input end of the limiting mechanism and the content of the polishing material when it leaves the output section of the limiting mechanism after rotation;

[0024] Analyze based on the polishing area, the first content ratio, and the first polishing change to obtain a first addition amount;

[0025] Analyze based on the first content ratio, the second content ratio, and the second polishing change to obtain a second addition amount;

[0026] Process the first addition amount and the second addition amount to obtain addition information.

[0027] In a possible implementation manner of the first aspect, the analyzing based on the first polishing feature chain and the second polishing feature chain to obtain a first polishing change and a second polishing change includes:

[0028] Compare the initial node feature in the second polishing feature chain with the last node feature in the first polishing feature chain to obtain a first polishing change; wherein, the last node feature is used to reflect the content change of the polishing material at the very end in the first polishing feature chain and the second polishing feature chain;

[0029] Compare the initial node feature in the first polishing feature chain with the initial node feature in the second polishing feature chain to obtain a second polishing change.

[0030] In a possible implementation manner of the first aspect, the analyzing based on the polishing area, the first content ratio, and the first polishing change to obtain a first addition amount includes:

[0031] Analyze based on the first polishing change and the polishing area to obtain a change compensation amount; wherein, the change compensation amount is used to reflect the content change value of the polishing material when it leaves the output end of the limiting mechanism and the content of the polishing material when it reaches the input end of the limiting mechanism after rotation;

[0032] Process the first content ratio and the change compensation amount to obtain a first addition amount.

[0033] In a possible implementation of the first aspect, analyzing the first polishing change and the polishing area to obtain a change compensation amount includes:

[0034] Obtain an addition position; wherein, the addition position is used to reflect the position where the addition device of the polishing device adds the polishing material to the polishing disc;

[0035] Analyze the addition position and the polishing area to obtain a position ratio; wherein, the position ratio is used to reflect the ratio between the distance that the polishing material rotates from the addition position to the polishing area and the distance that the polishing material rotates from the polishing area to the addition position;

[0036] Analyze the position ratio and the first polishing change to obtain a change compensation amount.

[0037] In a possible implementation of the first aspect, analyzing the first content ratio, the second content ratio and the second polishing change to obtain a second addition amount includes:

[0038] Process the first content ratio and the second content ratio to obtain a uniform compensation amount; wherein, the uniform compensation amount is used to reflect the content change value of the polishing material when it reaches the input end of the limiting mechanism and the polishing material that leaves the output section of the limiting mechanism after rotation;

[0039] Process the uniform compensation amount and the second polishing change to obtain a second addition amount.

[0040] In a second aspect, an embodiment of the present application provides a water drill polishing adaptive control system, including:

[0041] An acquisition module, configured to acquire a polishing video when a contact action is triggered; wherein, the contact action is used to reflect that a water drill material is placed in a limiting mechanism of a polishing disc of a polishing device, and the polishing video is used to reflect the distribution of the polishing material on the polishing disc;

[0042] A first analysis module, configured to analyze according to the polishing video to obtain a first polishing feature chain and a second polishing feature chain; wherein, the first polishing feature chain is used to reflect the content change when the polishing material enters the polishing area in the current rotation cycle, and the second polishing feature chain is used to reflect the content change when the polishing material leaves the polishing area in the current rotation cycle, the rotation cycle is used to reflect the time required for the polishing disc to complete one full rotation, and the polishing area is used to reflect the area enclosed by the limiting mechanism on the polishing disc;

[0043] A second analysis module, configured to perform node feature analysis based on the polishing area, the first abrasive polishing feature chain, and the second abrasive polishing feature chain to obtain addition information, where the addition information is used to reflect the addition amount of the polishing material in the next rotation cycle.

[0044] In a third aspect, an embodiment of the present application provides a rhinestone abrasive polishing device, including an abrasive polishing device and a control device. The abrasive polishing device is electrically connected to the control device. The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the method according to any one of the above first aspects.

[0045] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, it implements the method according to any one of the above first aspects.

[0046] In a fifth aspect, an embodiment of the present application provides a computer program, and when the computer program runs on a rhinestone abrasive polishing device, it causes the rhinestone abrasive polishing device to execute the rhinestone abrasive polishing adaptive control method according to any one of the above first aspects.

[0047] It can be understood that the beneficial effects of the above second aspect to fifth aspect can refer to the relevant descriptions in the above first aspect, and will not be elaborated here. Description of the Drawings

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0049] Figure 1 It is a schematic flowchart of a rhinestone abrasive polishing adaptive control method provided by an embodiment of the present application;

[0050] Figure 2 It is a schematic implementation flowchart of a rhinestone abrasive polishing adaptive control method provided by an embodiment of the present application;

[0051] Figure 3 It is a schematic structural diagram of a rhinestone abrasive polishing adaptive control system provided by an embodiment of the present application;

[0052] Figure 4 It is a schematic structural diagram of a control device of a rhinestone abrasive polishing device provided by an embodiment of the present application. Detailed Embodiments

[0053] In the following description, for the purpose of illustration rather than limitation, specific details such as specific system architectures, technologies, etc. are presented to provide a thorough understanding of the embodiments of the present application. However, those skilled in the art should understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from obscuring the description of the present application.

[0054] It should be understood that when used in the specification and the appended claims of the present application, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0055] It should also be understood that the term "and / or" as used in the specification and the appended claims of the present application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0056] As used in the specification and the appended claims of the present application, the term "if" can be interpreted as "when" or "once" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "if determined" or "if [the described condition or event] is detected" can be interpreted as meaning "once determined" or "in response to determining" or "once [the described condition or event] is detected" or "in response to detecting [the described condition or event]" depending on the context.

[0057] In addition, in the description of the specification and the appended claims of the present application, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0058] Reference to "an embodiment" or "some embodiments" or the like described in the specification of the present application means that a specific feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in an embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprising", "including", "having", and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way.

[0059] In the related art, the surface of a rhinestone blank is usually polished efficiently by a high-speed rotating polishing disc. During the polishing process of the rhinestone, polishing materials (such as polishing powder or polishing liquid) are generally added to the polishing disc. Due to the centrifugal force, the polishing materials originally evenly attached to the surface of the polishing disc will gather towards the edge, resulting in uneven distribution of the content of the polishing materials on the polishing disc. The uneven polishing materials will cause different degrees of polishing on the surface of the rhinestone, not only reducing the optical uniformity of the rhinestone and causing light and dark differences in the light transmission effect, but also possibly leaving scratches or polishing patterns on the surface, ultimately affecting the visual beauty and product quality of the rhinestone.

[0060] To solve the above problems, an embodiment of the present application provides a method and system for self-adaptive control of rhinestone polishing. In this method, when it is detected that the contact action of the limiting mechanism of the polishing disc for placing the rhinestone material in the polishing device is triggered, a polishing video for reflecting the distribution of the polishing materials on the polishing disc is obtained. Then, the polishing video is analyzed to obtain a first polishing feature chain for reflecting the change in the content of the polishing materials when they enter the polishing area formed by the limiting mechanism surrounding the polishing disc in the current rotation cycle and a second polishing feature chain for reflecting the change in the content of the polishing materials when they leave the polishing area formed by the limiting mechanism surrounding the polishing disc in the current rotation cycle. Finally, through the analysis of the polishing area, the first polishing feature chain, and the second polishing feature chain, addition information for reflecting the addition amount of the polishing materials in the next rotation cycle is obtained. This method can effectively analyze the polishing video to obtain the first polishing feature chain and the second polishing feature chain that can reflect the change in the content of the polishing materials under different conditions of the polishing disc in the current rotation cycle. Then, through node analysis based on the first polishing feature chain, the second polishing feature chain, and the polishing area, the addition amount of the polishing materials corresponding to the next rotation of the current rotation cycle can be analyzed. The control device then controls the addition device to add polishing materials in the polishing area in the next rotation cycle according to the addition amount, so as to reduce the change in the content of the polishing materials caused by the centrifugal force, and further reduce the polishing gap on the surface of the rhinestone, and finally keep the product quality stable at a high standard.

[0061] The method for self-adaptive control of rhinestone polishing provided by the embodiment of the present application can be applied to rhinestone polishing equipment. At this time, the rhinestone polishing equipment is the execution subject of the method for self-adaptive control of rhinestone polishing provided by the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the rhinestone polishing equipment.

[0062] The rhinestone grinding and polishing equipment includes a grinding and polishing device and a control device. The grinding and polishing device is electrically connected to the control device. The grinding and polishing device includes a grinding and polishing mechanism, a feeding mechanism, and a camera mechanism. The grinding and polishing mechanism is mechanically connected to the feeding mechanism. The camera mechanism is arranged above the grinding and polishing mechanism. The grinding and polishing mechanism includes a grinding and polishing disc, a fixing mechanism, and a limiting mechanism. The fixing mechanism is mechanically connected to the grinding and polishing disc. The limiting mechanism is mechanically connected to the fixing mechanism. The grinding and polishing disc is used for contact grinding and polishing of rhinestones. For example, the grinding and polishing disc can be a diamond grinding and polishing disc or a ceramic grinding and polishing disc, etc. The fixing mechanism is used to fix the rhinestones at the limiting mechanism. For example, the fixing mechanism can be mechanical clamping fixation or vacuum pump adsorption fixation, etc. The limiting mechanism is used to limit the movement range of the rhinestones. For example, the limiting mechanism can be stop block limiting or slider guide limiting, etc. The feeding mechanism is used to add polishing materials to the grinding and polishing mechanism. For example, the feeding mechanism can be a peristaltic pump, a vibrating feeder, or a screw feeder, etc. The camera mechanism is used to take real-time pictures of the grinding and polishing disc. For example, the camera mechanism can be a high-speed industrial camera or a high-frame rate camera, etc. The control device is used to supervise and control the rhinestone grinding and polishing process.

[0063] For example, the control device can be a station (STAION, ST) in a WLAN, and can be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a desktop computer, a smart large screen, a computing device, or other processing devices connected to a wireless modem, a computer, a laptop computer, a handheld computing device. For example, a mobile terminal in a 5G network or a mobile terminal in a future evolved Public Land Mobile Network (PLMN), etc.

[0064] To better understand the rhinestone grinding and polishing adaptive control method provided in the embodiments of the present application, the following provides an exemplary introduction to the specific implementation process of the rhinestone grinding and polishing adaptive control method provided in the embodiments of the present application.

[0065] Figure 1 and Figure 2 shows a schematic flowchart of the rhinestone grinding and polishing adaptive control method provided in the embodiments of the present application. Please refer to Figure 1 and Figure 2 , the rhinestone grinding and polishing adaptive control method includes:

[0066] S100, when it is detected that a contact action is triggered, obtain a grinding and polishing video; wherein, the contact action is used to reflect that the rhinestone material is placed in the limiting mechanism of the grinding and polishing disc of the grinding and polishing device, and the grinding and polishing video is used to reflect the distribution of the polishing materials on the grinding and polishing disc.

[0067] It can be understood that the grinding and polishing video records the dynamics of the grinding and polishing disc by means of a camera device at a preset frame rate. The preset frame rate refers to the pre-set frame rate. The frame rate refers to the number of pictures played per second. The shooting angle of the grinding and polishing video is the angle facing the grinding and polishing disc from a top-down perspective. The polishing material refers to a substance that improves the smoothness and gloss of the surface of the rhinestone through physical actions such as friction or grinding. For example, the polishing material can be polishing liquid or polishing powder, etc.

[0068] S200. Analyze according to the grinding and polishing video to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain; wherein, the first grinding and polishing feature chain is used to reflect the change in the content of the polishing material when it enters the polishing area in the current rotation cycle, and the second grinding and polishing feature chain is used to reflect the change in the content of the polishing material when it leaves the polishing area in the current rotation cycle. The rotation cycle is used to reflect the time required for the grinding and polishing disc to complete one full rotation, and the polishing area is used to reflect the area enclosed by the limiting mechanism on the grinding and polishing disc.

[0069] Exemplarily, the rotation speed of the grinding and polishing disc can be obtained, and then the grinding and polishing video can be processed according to the rotation speed to obtain a set of images of each frame in the current rotation cycle in the grinding and polishing video, and then analyze according to the set of images of each frame in the current rotation cycle in the grinding and polishing video to obtain the first grinding and polishing feature chain and the second grinding and polishing feature chain.

[0070] It is also possible to establish a spatio-temporal mapping relationship between the grinding and polishing video and the rotation cycle, use a motion trajectory tracking algorithm to capture the dynamic boundary of the polishing area, and then determine the critical frame sequence of the material entering and leaving the polishing area through gray histogram detection, and the local contrast sudden increase feature at the moment of contact. Use image processing technology to analyze the initial distribution density of the polishing material on the grinding and polishing disc reflected in the image to obtain the first grinding and polishing feature chain and the second grinding and polishing feature chain.

[0071] In a possible implementation manner, in step S200, analyzing according to the grinding and polishing video to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain includes:

[0072] S210. Obtain rotation speed information; wherein, the rotation speed information is used to reflect the rotation speed of the grinding and polishing disc.

[0073] It can be understood that there is a corresponding rotation speed of the grinding and polishing disc for different grinding and polishing processes. There is a corresponding rotation speed of the grinding and polishing disc for different materials of rhinestone materials.

[0074] Exemplarily, the rotational speed information can be manually input by a human. The rotational speed information can also be directly obtained from a rotational speed database. The rotational speed database refers to a database that contains the rotational speeds of polishing discs corresponding to different polishing processes and different materials of rhinestones during polishing. These data can be obtained through means such as laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining the data, the collected data is sorted, classified, and archived, useful information and rules are extracted, and then the relevant data is saved to the database to form a rotational speed database.

[0075] S220, process the polishing video according to the rotational speed information to obtain an image set; wherein, the image set is used to reflect the set of images of each frame in the current rotation period in the polishing video.

[0076] It can be understood that the image set is a set of multiple images in each rotation period of the polishing video.

[0077] Exemplarily, the rotational speed period can be obtained by processing the rotational speed, and then the polishing video can be processed according to the rotational speed period, marks are made at the time points corresponding to the rotational speed period in the polishing video, the polishing video is segmented into multiple video sets through the marked points, and then frame extraction is performed on each video set corresponding to each rotation period in the multiple video sets, and finally an image set is obtained.

[0078] S230, analyze according to the image set to obtain a first polishing feature chain and a second polishing feature chain.

[0079] Exemplarily, by analyzing the image set, the content of the polishing material entering the polishing area reflected by each frame of the image in the image set and the content of the polishing material leaving the polishing area reflected by each frame of the image in the image set can be obtained. Then, by sorting the content of the polishing material entering the polishing area reflected by each frame of the image in the image set in time series, a first polishing feature chain is obtained. At the same time, by sorting the content of the polishing material leaving the polishing area reflected by each frame of the image in the image set in time series, a second polishing feature chain is obtained.

[0080] It is also possible to perform spatio-temporal calibration and noise filtering on the image set, use an image segmentation tool to perform pixel-level segmentation on the polished area, establish a polar coordinate system under the rotation cycle synchronization mechanism, and dynamically calibrate the spatial positions of the entrance contact detection line and the exit away detection line. For the material entry stage, a fan-shaped analysis area is constructed inside the contact detection line. By fusing the abrasive probability map and the motion optical flow data, the spatio-temporal distribution of the contact content is calculated frame by frame, and wavelet transform is used to eliminate the interference of liquid splashing, generating a first polishing feature chain based on the rotation phase. The data points of the first polishing feature chain include normalized concentration values, local gradients, and frequency domain energy features, accurately characterizing the dynamic supply characteristics of the material entering the polishing area. At the same time, an annular monitoring area is set outside the exit detection line. Combining background difference and particle trajectory tracking techniques, a retention effect compensation factor is introduced to calculate the away content, and through a non-linear mapping model, a second polishing feature chain reflecting the abrasive detachment behavior is formed.

[0081] With such settings, by monitoring and recording the rotation speed information of the polishing disc to process the polishing video, precise analysis of each rotation cycle during the polishing process can be achieved. By analyzing the obtained first polishing feature chain and the second polishing feature chain, the dynamic change of the content of the polishing material on the polishing disc during the polishing process can be further understood.

[0082] In a possible implementation manner, in step S230, analyzing based on the image set to obtain the first polishing feature chain and the second polishing feature chain includes:

[0083] S231, analyzing based on the image set to obtain a plurality of contact contents and a plurality of away contents; wherein, the contact content is used to indicate the content when the polishing material enters the polishing area reflected by each frame of the image in the image set, and the away content is used to indicate the content when the polishing material leaves the polishing area reflected by each frame of the image in the image set.

[0084] It can be understood that since the polishing disc is rotating in real time and the positions of the polishing material on the polishing disc are different, the content of the polishing material entering the polishing area reflected by each frame of the image in the image set is different. That is, each frame of the image in the image set corresponds to a contact content.

[0085] Exemplarily, multiple frames of an image set can be aligned according to the rotation phase angle. A dynamic ROI (region of interest) is set at the boundary of the polishing area. The first-side boundary where the polishing material enters the polishing area is defined as the contact detection line (corresponding to the material flowing into the polishing area), and the second-side boundary where the polishing material leaves the polishing area is defined as the away detection line (corresponding to the material discharge interface). Finally, the geometric features of the edge of the polishing disc are detected by the Hough transform. Combining with the physical dimension parameters of the limiting mechanism, the coordinates of the detection line are mapped into the image coordinate system, and finally the contact content corresponding to each frame of the image and the away content corresponding to each frame are formed. The first-side boundary is different from the second-side boundary.

[0086] S232, sort multiple contact contents in time series to obtain the first polishing feature chain.

[0087] It can be understood that each contact content corresponds to a frame image, and each frame image corresponds to a frame sequence. The frame sequence refers to the playing sequence.

[0088] Exemplarily, a mapping relationship is established between the contact content corresponding to each frame of the image and time. The cubic spline interpolation algorithm is used to compensate the data for the time sequence gap caused by video frame loss. Then, the contact content corresponding to each frame of the image is sorted in a sequence of increasing time, so as to form the first polishing feature chain.

[0089] S233, sort multiple away contents in time series to obtain the second polishing feature chain.

[0090] Exemplarily, a mapping relationship is established between the away content corresponding to each frame of the image and time. The cubic spline interpolation algorithm is used to compensate the data for the time sequence gap caused by video frame loss. Then, the away content corresponding to each frame of the image is sorted in a sequence of increasing time, so as to form the second polishing feature chain.

[0091] With such a setting, by analyzing each frame of the image set, the content of the polishing material when entering and leaving the polishing area can be quantitatively measured. Sorting the contact content in time series to construct the first polishing feature chain and sorting the away content in time series to construct the second polishing feature chain helps to identify the periodic changes of the polishing material in different states during a rotation cycle in the polishing process.

[0092] S300, perform node feature analysis based on the polishing area, the first polishing feature chain and the second polishing feature chain to obtain added information; wherein, the added information is used to reflect the added amount of the polishing material in the next rotation cycle.

[0093] It can be understood that the added information refers to the added amount of the polishing material added to the adding device in the next rotation cycle of the current rotation cycle of the polishing disc.

[0094] Exemplarily, by analyzing the first polishing feature chain, the content distribution reflecting the first entry of the polishing material into the polishing area in the current rotation cycle can be obtained. At the same time, by analyzing the second polishing feature chain, the content distribution reflecting the departure of the polishing material from the polishing area in the current cycle can be obtained. Then, through the content distribution of the first entry of the polishing material into the polishing area in the current rotation cycle, the content distribution of the departure of the polishing material from the polishing area in the current cycle, the polishing area, the first polishing feature chain, and the second polishing feature chain, the addition amount can be finally obtained.

[0095] It is also possible to locate the key nodes of the polishing area, horizontally compare the real-time parameter differences between the two polishing feature chains, establish a dynamic correction model in combination with the historical consumption rate, and finally convert the trend change of the node features into a linear proportionality coefficient, which is directly superimposed on the reference addition amount. The reference addition amount is the preset addition amount of the polishing material. It can be input manually by a person. It can also be directly obtained by adding a database. The addition database refers to a database containing the addition amounts of the polishing material corresponding to different polishing processes and different materials of rhinestones during polishing. These data can be obtained through means such as laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining the data, the collected data is sorted, classified, and archived, useful information and rules are extracted, and the relevant data is saved into the database to form an addition database.

[0096] In a possible implementation manner, in step S300, node feature analysis is performed according to the polishing area, the first polishing feature chain, and the second polishing feature chain to obtain addition information, including:

[0097] S310, analyze according to the initial node features of the first polishing feature chain to obtain the first content ratio; wherein, the first content ratio is used to reflect the content distribution of the polishing material when it first enters the polishing area in the current rotation cycle; wherein, the initial node features are used to reflect the content change of the polishing material at the very beginning in the first polishing feature chain and the second polishing feature chain.

[0098] It can be understood that the initial node features of the first polishing feature chain refer to the node features in the first polishing feature chain that reflect the content distribution of the polishing material when it first enters the contact detection line in a rotation cycle.

[0099] Exemplarily, at the moment when the polishing disk rotation cycle is triggered accurate to the microsecond level, the content of the polishing material recorded for the first time when the polishing material enters the contact detection line can be determined by performing time-domain matching between the encoder zero signal and the first polishing feature chain, and finally, through background noise compensation and motion blur correction, the first content ratio can be obtained.

[0100] S320. Analyze based on the initial node features of the second polishing feature chain to obtain the second content ratio, where the second content ratio is used to reflect the content distribution of the polishing material leaving the polishing area in the current rotation cycle.

[0101] It can be understood that the initial node features of the second polishing feature chain refer to the node features in the second polishing feature chain that reflect the content distribution recorded for the first time when the polishing material leaves the detection line.

[0102] Exemplarily, the process of obtaining the second content ratio can be obtained through steps similar to those in S310 for analyzing the first content ratio through the first polishing feature chain, which will not be elaborated here.

[0103] S330. Analyze based on the polishing area, the first polishing feature chain, the second polishing feature chain, the first content ratio, and the second content ratio to obtain the addition information.

[0104] Exemplarily, the first difference reflecting the content of the polishing material when leaving the output end of the limiting mechanism and the content of the polishing material when reaching the input end of the limiting mechanism after rotation and the second difference reflecting the content of the polishing material when reaching the input end of the limiting mechanism and the content of the polishing material when leaving the output section of the limiting mechanism after rotation can be obtained through analyzing the first polishing feature chain and the second polishing feature chain. Then, analyze based on the polishing area, the first content ratio, and the first difference to obtain the first addition amount. At the same time, analyze based on the first content ratio, the second content ratio, and the second difference to obtain the second addition amount. Finally, process the first addition amount and the second addition amount to obtain the addition information. The first addition amount is used to offset the gap in the content change due to the polishing material not entering the polishing area. The second addition amount is used to offset the gap in the content change due to the polishing material entering the polishing area.

[0105] The addition information can also be obtained by training to establish a calculation model. That is, input the polishing area, the first polishing feature chain, the second polishing feature chain, the first content ratio, and the second content ratio into the calculation model, and the calculation model will output the corresponding addition information. The training process of the calculation model can use the data obtained by processing the polishing area, the first polishing feature chain, the second polishing feature chain, the first content ratio, the second content ratio, and the corresponding addition information as the training data set of the calculation model, and then input the training data set of the calculation model into the calculation model for training and learning to finally obtain the calculation model.

[0106] With such a setting, by analyzing the initial node features of the grinding and polishing feature chain, the use of the polishing material can be monitored and adjusted in real time, ensuring the accuracy and efficiency of the polishing process, thereby improving production efficiency and product quality, reducing the cost losses caused by reworking or re-preparing the rhinestones that do not meet the standards, and providing data support for the continuous improvement of the production process.

[0107] In a possible implementation manner, in step S330, analysis is performed based on the polishing area, the first grinding and polishing feature chain, the second grinding and polishing feature chain, the first content ratio, and the second content ratio to obtain addition information, including:

[0108] S331, analyze according to the first grinding and polishing feature chain and the second grinding and polishing feature chain to obtain the first grinding and polishing change and the second grinding and polishing change; wherein, the first grinding and polishing change is used to reflect the difference between the content of the polishing material when it leaves the output end of the limiting mechanism and the content of the polishing material when it reaches the input end of the limiting mechanism after rotation, and the second grinding and polishing change is used to reflect the difference between the content of the polishing material when it reaches the input end of the limiting mechanism and the content of the polishing material when it leaves the output section of the limiting mechanism after rotation. The input end of the limiting mechanism refers to the opening of the enclosure area of the limiting mechanism for the polishing material to enter the polishing area in the rotation direction of the grinding and polishing disc. The output end of the limiting mechanism refers to the opening of the enclosure area of the limiting mechanism for the polishing material to leave the polishing area in the rotation direction of the grinding and polishing disc.

[0109] It can be understood that due to the rotation of the grinding and polishing disc, the polishing material that has not been ground and polished in the polishing area will tend to move from the center of the grinding and polishing disc to the edge at the first speed, while the polishing material that has been ground and polished in the polishing area will tend to move from the center of the grinding and polishing disc to the edge at the second speed due to the pressing force applied by the fixing mechanism. The first speed is different from the second speed.

[0110] Exemplarily, the first grinding and polishing change can be obtained by comparing the initial node features in the first grinding and polishing feature chain with the initial node features in the second grinding and polishing feature chain, and the second grinding and polishing change can be obtained by comparing the initial node features in the second grinding and polishing feature chain with the last node features in the first grinding and polishing feature chain. The last node feature of the first grinding and polishing feature chain refers to the node feature in the first grinding and polishing feature chain that reflects the content distribution recorded last when the polishing material enters the contact detection line in a rotation cycle.

[0111] It is also possible to establish a timeline, divide the rotation period of the polishing material within the limiting mechanism into two key nodes, namely the arrival moment of the input end and the departure moment of the output end. Then, by aligning the content value at the departure moment of the output end corresponding to the first polishing feature chain with the content value at the arrival moment of the input end after rotation, and aligning the content value at the arrival moment of the input end of the second polishing feature chain with the content value at the departure moment of the output end after rotation, and finally comparing the mutually aligned content values, the first polishing change and the second polishing change can be obtained.

[0112] In a possible implementation manner, in step S331, analyzing according to the first polishing feature chain and the second polishing feature chain to obtain the first polishing change and the second polishing change includes:

[0113] S3311, comparing the initial node feature in the second polishing feature chain with the last node feature in the first polishing feature chain to obtain the first polishing change; wherein, the last node feature is used to reflect the content change of the polishing material at the last position in the first polishing feature chain and the second polishing feature chain.

[0114] It can be understood that the first polishing change = the content of the polishing material reflected by the initial node feature in the second polishing feature chain - the content of the polishing material reflected by the last node feature in the first polishing feature chain.

[0115] Exemplarily, if the initial node feature in the second polishing feature chain is 80%, where 80% refers to the degree of the content of the polishing material reflected by the initial node feature in the second polishing feature chain accounting for the uniform content. Since the uniform polishing material is located everywhere on the polishing disc before starting to polish the rhinestone, the uniform content can be regarded as 1. The last node feature in the first polishing feature chain is 60%, then the first polishing change is 20% (80% - 60%), indicating that the content change of the polishing material not in the polishing area after the rotation of the polishing disc is 20%, and so on.

[0116] S3312, comparing the initial node feature in the first polishing feature chain with the initial node feature in the second polishing feature chain to obtain the second polishing change.

[0117] It can be understood that the second polishing change = the content of the polishing material reflected by the initial node feature in the first polishing feature chain - the content of the polishing material reflected by the initial node feature in the second polishing feature chain.

[0118] Exemplarily, if the initial node feature in the first polishing feature chain is 95% and the initial node feature in the second polishing feature chain is 80, then the second polishing change is 15% (95% - 80%), indicating that the content change of the polishing material in the polishing area after the rotation of the polishing disc is 15%, and so on.

[0119] With such a setting, it is possible to analyze in real time the change in the content of the polishing material generated by the rotation of the polishing disc, so as to numerically ensure the stability of polishing, thereby improving the efficiency and quality of the polishing process and reducing resource waste.

[0120] S332. Analyze based on the polishing area, the first content ratio, and the first polishing change to obtain the first addition amount.

[0121] Exemplarily, it is possible to analyze based on the first polishing change and the polishing area to obtain the degree of replenishment of the polishing material when it leaves the output end of the limiting mechanism and when it reaches the input end of the limiting mechanism after rotation. Then, process based on the degree of replenishment of the polishing material when it leaves the output end of the limiting mechanism and when it reaches the input end of the limiting mechanism after rotation and the first content ratio to obtain the first addition amount.

[0122] It is also possible to obtain the first addition amount by training and establishing an analysis model. That is, input the polishing area, the first content ratio, and the first polishing change into the analysis model, and the analysis model then outputs the corresponding first addition amount. The training process of the analysis model can use the data obtained by processing the polishing area, the first content ratio, the first polishing change, and the corresponding first addition amount as the training data set of the analysis model, and then input the training data set of the analysis model into the analysis model for training and learning to finally obtain the time model.

[0123] In a possible implementation manner, in step S332, analyzing based on the polishing area, the first content ratio, and the first polishing change to obtain the first addition amount includes:

[0124] S3321. Analyze based on the first polishing change and the polishing area to obtain the change replenishment amount; wherein, the change replenishment amount is used to reflect the change value of the content of the polishing material when it leaves the output end of the limiting mechanism and when it reaches the input end of the limiting mechanism after rotation.

[0125] It can be understood that since the speed of the polishing disc does not change, the change in the content of the polishing material when it leaves the output end of the limiting mechanism and when it reaches the input end of the limiting mechanism after rotation is the same in each rotation cycle.

[0126] Exemplarily, it is possible to analyze the position where the addition device for reflecting the polishing device adds the polishing material to the polishing disc and the polishing area to obtain the ratio between the arc length where the addition position reaches the polishing area after rotation and the arc length where the polishing area reaches the addition position after rotation, and then analyze based on this ratio and the first polishing change to obtain the change replenishment amount.

[0127] It is also possible to analyze the position where the polishing material is added to the polishing disc by the adding device for reflecting the polishing device and the polishing area, and compare the angle value between the first line diameter formed by the position where the polishing material is added to the polishing disc by the adding device for reflecting the polishing device and the center of the polishing disc and the second line diameter formed by the polishing area and the center of the polishing disc with the circumferential angle to obtain an angle ratio, and then process according to the angle ratio and the first polishing change to obtain a change compensation amount.

[0128] In a possible implementation manner, in step S3321, analyzing according to the first polishing change and the polishing area to obtain a change compensation amount includes:

[0129] S33211, obtaining the adding position; where the adding position is used to reflect the position where the adding device of the polishing device adds the polishing material to the polishing disc.

[0130] It can be understood that the adding position refers to the position where the polishing material added by the adding mechanism is located in the polishing disc. It can be represented by the arc length value between the polishing area and the position where the polishing material added by the adding mechanism is located in the polishing disc in the rotation direction of the polishing disc. It can also be represented by an angle. When the adding position is represented by an angle, it can be represented by the angle between the first diameter line formed by the marked point and the center of the polishing disc and the second diameter line formed by the adding position and the center of the polishing disc. The marked point is an arbitrary point preset on the polishing disc.

[0131] S33212, analyzing according to the adding position and the polishing area to obtain a position ratio; where the position ratio is used to reflect the ratio between the distance that the polishing material rotates from the adding position to the polishing area and the distance that the polishing material rotates from the polishing area to the adding position.

[0132] It can be understood that the position ratio = the second arc length ÷ the first arc length. The first arc length is the arc length that the adding position rotates to reach the polishing area, and the second arc length is the arc length that the polishing area rotates to reach the adding position. The first arc length and the second arc length together constitute the circumference of the polishing disc.

[0133] Exemplarily, if the first arc length is The second arc length is Then the position ratio is And so on.

[0134] S33213, analyzing according to the position ratio and the first polishing change to obtain a change compensation amount.

[0135] It can be understood that the calculation formula for the change compensation amount is: Where M is the change compensation amount, a is the position ratio, and N is the first polishing change.

[0136] Exemplarily, if the position ratio is 2 and the first polishing change is 20%, then the change compensation amount is 6.67% (1÷3×20%), which means that the polishing material added at the added position to offset the change in the content of the polishing material caused by the rotation of the polishing disc is 6.67% of the uniform content, and so on.

[0137] With such a setting, by analyzing the position ratio and the first polishing change, the change compensation amount is obtained, which not only ensures the uniform distribution of the polishing material on the polishing disc, but also improves the adaptability and consistency of the polishing process, thereby enhancing the product quality and production efficiency.

[0138] S3322. Process according to the first content ratio and the change compensation amount to obtain the first addition amount.

[0139] It can be understood that the first addition amount = (uniform ratio - first content ratio) + change compensation amount. The uniform ratio is 1.

[0140] Exemplarily, if the first content ratio is 95% and the change compensation amount is 6.67%, then the first addition amount is 11.67% [(1 - 95%) + 6.67%], which means that the content of the polishing material lost in the polishing area after entering the polishing area is 11.67% of that before entering, and so on.

[0141] With such a setting, by analyzing the material distribution before the polishing material enters the polishing area and starts polishing during the polishing process and the material used to supplement the uneven distribution of the polishing material caused by the rotation of the polishing disc, the precise control and optimization of the addition of the polishing material can be achieved, thereby maintaining the stability and efficiency of the polishing process.

[0142] S333. Analyze according to the first content ratio, the second content ratio and the second polishing change to obtain the second addition amount.

[0143] Exemplarily, the first content ratio and the second content ratio can be processed to obtain the degree of supplement of the polishing material when it reaches the input end of the limiting mechanism and the polishing material that leaves the output section of the limiting mechanism after rotation, and then the second addition amount can be obtained according to the degree of supplement of the polishing material when it reaches the input end of the limiting mechanism and the polishing material that leaves the output section of the limiting mechanism after rotation and the second polishing change.

[0144] It is also possible to process the second polishing change and the first content ratio to obtain the consumption rate of the polishing material during the polishing process, and then process the second content ratio and the consumption rate of the polishing material during the polishing process to obtain the second addition amount.

[0145] In a possible implementation, in step S333, analyzing according to the first content ratio, the second content ratio and the second polishing change to obtain the second addition amount includes:

[0146] S3331. Comparing the first content ratio with the second content ratio to obtain a uniform make-up amount; wherein, the uniform make-up amount is used to reflect the change value of the content of the polishing material when it reaches the input end of the limiting mechanism and the content of the polishing material that leaves the output section of the limiting mechanism after rotation.

[0147] It can be understood that the uniform make-up amount = the first content ratio - the second content ratio.

[0148] Exemplarily, if the first content ratio is 95 and the second content ratio is 80%, then the uniform make-up amount is 15% (95% - 80%), indicating that the addition amount of the polishing material used to offset the change in the content of the polishing material caused by the rotation of the polishing disc when the polishing material first enters the polishing area is 15% of the uniform content, and so on.

[0149] S3332. Processing the uniform make-up amount and the second polishing change to obtain the second addition amount.

[0150] It can be understood that the second addition amount = the uniform make-up amount + the second polishing change.

[0151] Exemplarily, if the uniform make-up amount is 15% and the second polishing change is 15%, then the second addition amount is 30% (15% + 15%), indicating that the content of the polishing material that has not been lost in the polishing area after leaving the polishing area is 30% of that before entering, and so on.

[0152] With such a setting, by analyzing the first content ratio and the second content ratio, calculating the uniform make-up amount, and then combining the second polishing change to obtain the second addition amount, the refined management of the polishing material replenishment process is realized. The introduction of the uniform make-up amount ensures the uniform replenishment of the material during the polishing process, thereby maintaining the stability and consistency of the polishing effect.

[0153] S334. Processing the first addition amount and the second addition amount to obtain addition information.

[0154] It can be understood that the addition information = the first addition amount + the second addition amount.

[0155] Exemplarily, if the first addition amount is 11.67% and the second addition amount is 30%, then the addition information is 41.67% (11.67% + 30%), indicating that the content of the polishing material that the addition device needs to add to the polishing disc is 41.67% of the uniform content, and so on.

[0156] With such settings, by comprehensively considering the first polishing change, the second polishing change, and the content ratio, the first addition amount and the second addition amount can be generated, providing a numerical reference for the material replenishment amount of the polishing device. By adding information, intelligent decision-making support can be provided for adding polishing materials during the polishing process, thereby improving the product quality of the polishing process.

[0157] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not imply the order of execution. The execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0158] Corresponding to the water drill polishing adaptive control method described in the above embodiments, an embodiment of the present application further provides a water drill polishing adaptive control system. Each module of the water drill polishing adaptive control system can implement each step of the water drill polishing adaptive control method. Figure 3 The block diagram of the water drill polishing adaptive control system provided by the embodiment of the present application is shown. For the sake of convenience of description, only the parts related to the embodiment of the present application are shown.

[0159] Refer to Figure 3 , the water drill polishing adaptive control system includes:

[0160] An acquisition module, configured to acquire a polishing video when a contact action is detected; wherein, the contact action is used to reflect that the water drill material is placed in the limiting mechanism of the polishing disc of the polishing device, and the polishing video is used to reflect the distribution of the polishing material on the polishing disc.

[0161] A first analysis module, configured to analyze according to the polishing video to obtain a first polishing feature chain and a second polishing feature chain; wherein, the first polishing feature chain is used to reflect the content change when the polishing material enters the polishing area in the current rotation cycle, and the second polishing feature chain is used to reflect the content change when the polishing material leaves the polishing area in the current rotation cycle. The rotation cycle is used to reflect the time required for the polishing disc to complete one full rotation, and the polishing area is used to reflect the area surrounded by the limiting mechanism on the polishing disc.

[0162] A second analysis module, configured to perform node feature analysis according to the polishing area, the first polishing feature chain, and the second polishing feature chain to obtain addition information; wherein, the addition information is used to reflect the addition amount of the polishing material in the next rotation cycle.

[0163] It should be noted that for the information interaction, execution process, etc. between the above systems / modules, since they are based on the same concept as the method embodiments of the present application, their specific functions and the technical effects brought about can be specifically referred to in the method embodiment part, and will not be elaborated here.

[0164] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the above division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the system is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of this application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiment and will not be elaborated here.

[0165] An embodiment of the present application also provides a rhinestone grinding and polishing device, which includes a grinding and polishing device and a control device, and the grinding and polishing device is electrically connected to the control device. Figure 4 It is a schematic structural diagram of the control device 4 provided in an embodiment of the present application. As Figure 4 shown, the control device 4 of this embodiment includes: at least one processor 40 ( Figure 4 only one is shown in the figure), at least one memory 41 ( Figure 4 only one is shown in the figure), and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, the control device 4 implements the steps in any of the foregoing embodiments of the rhinestone grinding and polishing adaptive control method, or the functions of each module / unit in each embodiment of the above system.

[0166] Exemplarily, the computer program 42 can be divided into one or more modules / units. The one or more modules / units are stored in the memory 41 and executed by the processor 40 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of completing specific functions, and these instruction segments are used to describe the execution process of the computer program 42 in the control device 4.

[0167] The control device 4 can be a computing device such as a desktop computer, a notebook, a palm computer, and a cloud server. The control device 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art can understand that Figure 4The control device 4 is merely an example and does not constitute a limitation on the control device 4. It may include more or fewer components than those shown in the figure, or combine certain components, or different components. For example, it may also include input / output devices, network access devices, buses, etc.

[0168] The processor 40 may be a central processing unit (CPU). The processor 40 may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0169] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as the hard disk or memory of the control device 4. In other embodiments, the memory 41 may also be an external storage device of the control device 4, such as a plug-in hard disk equipped on the control device 4, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Further, the memory 41 may also include both the internal storage unit and the external storage device of the control device 4. The memory 41 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or will be output.

[0170] An embodiment of the present application also provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0171] An embodiment of the present application provides a computer program product, and when the computer program product runs on a diamond drill grinding and polishing device, the diamond drill grinding and polishing device implements the steps in any of the above method embodiments.

[0172] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such understanding, to implement all or part of the processes in the above-mentioned embodiment methods of this application, a computer program can be used to instruct the relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form, etc. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the rhinestone grinding and polishing equipment, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk, or an optical disc, etc.

[0173] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0174] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0175] In the embodiments provided in this application, it should be understood that the disclosed rhinestone grinding and polishing adaptive control system and equipment can be implemented in other ways. For example, the above-described embodiments of the rhinestone grinding and polishing adaptive control system are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces, and the indirect couplings or communication connections of the devices or units can be in an electrical, mechanical or other forms.

[0176] The unit described as a separation component may or may not be physically separated. The component displayed as a unit may or may not be a physical unit, that is, it may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0177] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A water drill grinding and polishing adaptive control method, characterized in that: include: When it is detected that the contact action is triggered, a grinding and polishing video is obtained; wherein the contact action is used to reflect that the diamond material is placed in the limiting mechanism of the grinding and polishing disc of the grinding and polishing device, and the grinding and polishing video is used to reflect the distribution of the polishing material on the grinding and polishing disc; According to the grinding and polishing video, a first grinding and polishing feature chain and a second grinding and polishing feature chain are obtained; wherein the first grinding and polishing feature chain is used to reflect the content change of the polishing material when it enters the polishing area in the current rotation cycle, and the second grinding and polishing feature chain is used to reflect the content change of the polishing material when it leaves the polishing area in the current rotation cycle, the rotation cycle is used to reflect the time required for the grinding and polishing disc to complete a full rotation, and the polishing area is used to reflect the area formed by the limiting mechanism on the grinding and polishing disc; A node feature analysis is performed based on the polishing area, the first grinding and polishing feature chain, and the second grinding and polishing feature chain to obtain addition information; wherein the addition information is used to reflect the addition amount of the polishing material in the next rotation cycle.

2. The water drill grinding and polishing adaptive control method according to claim 1, characterized in that: The analyzing the grinding and polishing video to obtain the first grinding and polishing feature chain and the second grinding and polishing feature chain includes: Obtaining rotation speed information; wherein the rotation speed information is used to reflect the rotation speed of the polishing disc; The polishing video is processed according to the rotation speed information to obtain an image set; wherein the image set is used to reflect the set of images of each frame in the polishing video in the current rotation cycle; The image set is analyzed to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain.

3. The water drill grinding and polishing adaptive control method according to claim 2, characterized in that: The step of analyzing the image set to obtain a first grinding and polishing feature chain and a second grinding and polishing feature chain includes: Analyzing the image set to obtain a plurality of contact contents and a plurality of distance contents; wherein the contact content is used to indicate the content of the polishing material reflected by each frame of the image set when it enters the polishing area, and the distance content is used to indicate the content of the polishing material reflected by each frame of the image set when it leaves the polishing area; Sorting the plurality of contact contents in time series to obtain a first grinding and polishing feature chain; The plurality of remote contents are sorted in time series to obtain a second grinding and polishing feature chain.

4. The water drill grinding and polishing adaptive control method according to claim 1, characterized in that: The analyzing according to the polishing area, the first grinding and polishing feature chain and the second grinding and polishing feature chain to obtain the added information includes: Analyzing the initial node characteristics of the first grinding and polishing feature chain to obtain a first content ratio; wherein the first content ratio is used to reflect the content distribution of the polishing material entering the polishing area for the first time in the current rotation cycle; wherein the initial node characteristics are used to reflect the content change of the polishing material at the very beginning in the first grinding and polishing feature chain and the second grinding and polishing feature chain; Analyze the initial node characteristics of the second grinding and polishing characteristic chain to obtain a second content ratio; wherein the second content ratio is used to reflect the content distribution of the polishing material leaving the polishing area in the current rotation cycle; The addition information is obtained by analyzing the polishing area, the first grinding and polishing feature chain, the second grinding and polishing feature chain, the first content ratio and the second content ratio.

5. The water drill grinding and polishing adaptive control method according to claim 4, characterized in that: The adding information is obtained by analyzing the polishing area, the first grinding and polishing feature chain, the second grinding and polishing feature chain, the first content ratio and the second content ratio, including: The first polishing feature chain and the second polishing feature chain are analyzed to obtain a first polishing change and a second polishing change; wherein the first polishing change is used to reflect the difference between the content of the polishing material when it leaves the output end of the limiting mechanism and the content of the polishing material when it arrives at the input end of the limiting mechanism after rotation, and the second polishing change is used to reflect the difference between the content of the polishing material when it arrives at the input end of the limiting mechanism and the content of the polishing material when it leaves the output section of the limiting mechanism after rotation; Analyze the polishing area, the first content ratio and the first grinding and polishing change to obtain a first addition amount; Analyze the first content ratio, the second content ratio and the second polishing change to obtain a second addition amount; Addition information is obtained by processing the first addition amount and the second addition amount.

6. The water drill grinding and polishing adaptive control method according to claim 5, characterized in that: The first polishing feature chain and the second polishing feature chain are analyzed to obtain a first polishing change and a second polishing change, including: Comparing the initial node feature in the second grinding and polishing feature chain with the last node feature in the first grinding and polishing feature chain to obtain a first grinding and polishing change; wherein the last node feature is used to reflect the change in the content of the polishing material at the last position in the first grinding and polishing feature chain and the second grinding and polishing feature chain; The initial node features in the first grinding and polishing feature chain are compared with the initial node features in the second grinding and polishing feature chain to obtain a second grinding and polishing change.

7. The water drill grinding and polishing adaptive control method according to claim 5, characterized in that: The first addition amount is obtained by analyzing the polishing area, the first content ratio and the first grinding and polishing change, including: The change compensation amount is obtained by analyzing the first grinding and polishing change and the polishing area; wherein the change compensation amount is used to reflect the change value of the content of the polishing material when it leaves the output end of the limiting mechanism and arrives at the input end of the limiting mechanism after rotation; The first content ratio and the variable supplement amount are processed to obtain a first addition amount.

8. The water drill grinding and polishing adaptive control method according to claim 7, characterized in that: The step of analyzing the first grinding and polishing change and the polishing area to obtain a change compensation amount includes: Acquire an adding position; wherein the adding position is used to reflect the position at which the adding device of the grinding and polishing device adds the polishing material to the grinding and polishing disc; The position ratio is obtained by analyzing the adding position and the polishing area; wherein the position ratio is used to reflect the ratio between the distance from the adding position to the polishing area after rotation and the distance from the polishing area to the adding position after rotation; The change compensation amount is obtained by analyzing the position proportion and the first grinding and polishing change.

9. The water drill grinding and polishing adaptive control method according to claim 5, characterized in that: The second addition amount is obtained by analyzing the first content ratio, the second content ratio and the second grinding and polishing change, including: Processing is performed according to the first content ratio and the second content ratio to obtain a uniform compensation amount; wherein the uniform compensation amount is used to reflect the content of the polishing material when it reaches the input end of the limiting mechanism and the content change value of the polishing material at the output section of the limiting mechanism after rotation; The second addition amount is obtained by processing according to the uniform supplement amount and the second polishing change.

10. A water drill grinding and polishing adaptive control system, characterized in that: include: An acquisition module, when detecting that a contact action is triggered, acquires a grinding and polishing video; wherein the contact action is used to reflect that the diamond material is placed in the limiting mechanism of the grinding and polishing disc of the grinding and polishing device, and the grinding and polishing video is used to reflect the distribution of the polishing material on the grinding and polishing disc; A first analysis module is used to analyze the polishing video to obtain a first polishing feature chain and a second polishing feature chain; wherein the first polishing feature chain is used to reflect the content change of the polishing material when it enters the polishing area in the current rotation cycle, and the second polishing feature chain is used to reflect the content change of the polishing material when it leaves the polishing area in the current rotation cycle, the rotation cycle is used to reflect the time required for the polishing disc to complete a complete rotation, and the polishing area is used to reflect the area formed by the limiting mechanism on the polishing disc; The second analysis module is used to perform node feature analysis based on the first grinding and polishing feature chain and the second grinding and polishing feature chain to obtain addition information; wherein the addition information is used to reflect the addition amount of the polishing material in the next rotation cycle.

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