Cooling plate and forming method thereof

Abstract

A cooling plate and a forming method of the cooling plate are used in a semiconductor processing device, a cooling water channel of the cooling plate is jointly defined by an annular bottom plate, an annular cover plate and reinforcing ribs, the reinforcing ribs are adopted as water channel partition plates of the cooling water channel, the effect of reinforcing the annular bottom plate and the annular cover plate is achieved, and in the vacuum brazing process, the cooling water channel partition plates are separated from the annular bottom plate and the annular cover plate. Even if the annular bottom plate and the annular cover plate are softened after high-temperature brazing, the reinforcing ribs still play a good reinforcing role, so that the reliability of the cooling plate after cooling water is introduced is ensured, and failure forms such as bulging of the cover plate or the bottom plate, weld cracking and the like are avoided. When vacuum brazing is carried out, the two layers of brazing material pieces are arranged in a segmented and staggered mode, the upper portion or the lower portion of the splicing seam of each layer of brazing material piece is covered with the brazing material pieces, after vacuum brazing, the annular bottom plate, the annular cover plate and the reinforcing ribs are fixedly connected to form a cooling water channel, seamless connection can be achieved, and the cooling water channel is not prone to deformation. And the welding flux joint is firm, reliable and free of deformation and cracking.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a cooling plate for a semiconductor processing device and a forming method thereof. Background Art

[0002] When using a semiconductor processing device to deposit a substrate, it is necessary to heat the substrate in the reaction chamber to a temperature required for the process. Usually, an infrared radiation heater is used to radiate heat to the substrate, and a reflector is arranged near the heater to adjust the distribution of the infrared radiation light emitted by the heater. At the same time, a water cooling plate is arranged inside the reflector to cool the reflector and prevent it from deforming and failing due to excessive temperature.

[0003] The water cooling plate includes a cover plate and a bottom plate with grooves. The cover plate is fixed to the grooves of the bottom plate by welding to form a water cooling channel. The cover plate and the bottom plate are usually made of materials with good thermal conductivity. For these materials, the welding effect and quality of ordinary argon arc welding are poor. Electron beam welding - laser welding and friction welding cannot directly weld the internal grooves. Vacuum brazing will heat up the entire water cooling plate, and after heating up, the original mechanical properties of the materials will decline, resulting in poor pressure resistance. The welded water cooling plate will bulge, and even the weld will crack, resulting in water leakage.

[0004] The statements herein only provide background art related to the present invention and do not necessarily constitute prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide a cooling plate and a forming method thereof for a semiconductor processing device, to ensure that the cooling plate after vacuum brazing is reliably welded and does not deform or crack, to enhance the strength of the cooling water channel with a reinforcing rib, to ensure the reliability of the cooling plate after introducing cooling water, and to avoid failure forms such as bulging of the cover plate or the bottom plate and cracking of the weld.

[0006] To achieve the above purpose, the present invention provides a cooling plate, comprising:

[0007] A ring-shaped bottom plate having a ring-shaped groove portion, and a step portion is formed between the side wall of the ring-shaped groove portion and the upper surface of the ring-shaped bottom plate;

[0008] A reinforcing rib, which is arranged in a ring shape as a whole and is located in the ring-shaped groove portion, and the height of the reinforcing rib is equal to the depth of the ring-shaped groove portion;

[0009] A ring-shaped cover plate, which is located above the ring-shaped groove portion, the ring-shaped cover plate is connected to the step surface of the step portion, and the ring-shaped cover plate is connected to the reinforcing rib;

[0010] The annular bottom plate, annular cover plate and reinforcing ribs together enclose a cooling water channel, the cooling water channel has a starting end and a terminating end, and the cooling water channel winds and coils between the starting end and the terminating end;

[0011] An inlet pipe, which communicates with the starting end of the cooling water channel;

[0012] An outlet pipe, which communicates with the terminating end of the cooling water channel;

[0013] Wherein, the starting end has a first radial width, the terminating end has a second radial width, and the radial width of the cooling water channel is less than the first radial width and / or the second radial width;

[0014] The sum of the first radial width and the second radial width is greater than the radial width of the annular groove portion;

[0015] The starting end and the terminating end are arranged in an interleaved and wrapped manner.

[0016] Optionally, the reinforcing ribs are integrally formed with the annular bottom plate, and the reinforcing ribs and the annular cover plate are fixedly connected by a brazing filler metal.

[0017] Optionally, the reinforcing ribs are integrally formed with the annular cover plate, and the reinforcing ribs and the annular bottom plate are fixedly connected by a brazing filler metal.

[0018] The width of the reinforcing ribs is less than or equal to 5 mm.

[0019] The lower surface of the annular cover plate and the step surface of the step portion are fixedly connected by a brazing filler metal.

[0020] The reinforcing ribs at the bent portions of the cooling water channel are arranged in a rounded corner structure.

[0021] The reinforcing ribs at the starting end and the terminating end of the cooling water channel are arranged in a rounded corner structure.

[0022] The equivalent diameter of the cross-section of the cooling water channel is greater than or equal to the inner diameter of the inlet pipe.

[0023] The annular cover plate has a water inlet through hole and a water outlet through hole;

[0024] The water inlet through hole is located above the starting end of the cooling water channel, and the water inlet through hole is fixedly connected to the inlet pipe by a brazing filler metal;

[0025] The water outlet through hole is located above the terminating end of the cooling water channel, and the water outlet through hole is fixedly connected to the outlet pipe by a brazing filler metal.

[0026] The annular bottom plate, annular cover plate and reinforcing ribs are made of a metal material with high thermal conductivity.

[0027] The brazing filler metal used is a nickel-based brazing filler metal or a silver-based brazing filler metal.

[0028] The present invention also provides a forming method for a cooling plate, comprising the following steps:

[0029] Providing a brazing filler metal sheet, the brazing filler metal sheet being annular, having an edge region and a hollowed-out region, and an arc-shaped rib connected to the edge region being provided in the hollowed-out region;

[0030] Positioning the brazing filler metal sheet, providing at least one positioning pin on the step surface of the annular bottom plate or the lower surface of the annular cover plate, and opening positioning holes at corresponding positions on the brazing filler metal sheet;

[0031] Laying the brazing filler metal sheet, laying the brazing filler metal sheet on the annular bottom plate, sleeving the positioning holes on the brazing filler metal sheet on the positioning pins, making the arc-shaped rib coincide with the reinforcing rib, and making the edge region coincide with the step surface of the step portion;

[0032] Placing the annular cover plate on the brazing filler metal sheet and pressing it tightly;

[0033] Performing vacuum brazing to fixedly connect the annular bottom plate, the annular cover plate and the reinforcing rib to form a cooling water channel.

[0034] The brazing filler metal sheet comprises a first-layer annular brazing filler metal sheet and a second-layer annular brazing filler metal sheet that overlap up and down;

[0035] The first-layer annular brazing filler metal sheet is composed of a plurality of first-layer sector-shaped brazing filler metal sheets spliced together to form a first splicing seam, and the first splicing seam is located at a first splicing position; the second-layer annular brazing filler metal sheet is composed of a plurality of second-layer sector-shaped brazing filler metal sheets spliced together to form a second splicing seam, and the second splicing seam is located at a second splicing position; the first splicing position and the second splicing position do not coincide in the circumferential direction.

[0036] The number of the first-layer sector-shaped brazing filler metal sheets constituting the first-layer annular brazing filler metal sheet and the number of the second-layer sector-shaped brazing filler metal sheets constituting the second-layer annular brazing filler metal sheet are both 4 to 10.

[0037] The thicknesses of the first-layer annular brazing filler metal sheet and the second-layer annular brazing filler metal sheet are both less than or equal to 0.1 mm.

[0038] The method for laying the brazing filler metal sheet comprises:

[0039] Laying the first-layer annular brazing filler metal sheet on the annular bottom plate, making the arc-shaped rib of the first-layer annular brazing filler metal sheet coincide with the reinforcing rib, and making the edge region of the first-layer annular brazing filler metal sheet coincide with the step surface of the step portion;

[0040] Lay the second-layer annular brazing sheet on the first-layer annular brazing sheet, aligning the arc edge of the second-layer annular brazing sheet with the reinforcing rib, aligning the edge region of the second-layer annular brazing sheet with the step surface of the step portion, and covering the first splicing seam with the second-layer fan-shaped annular brazing sheet and covering the second splicing seam with the first-layer fan-shaped annular brazing sheet.

[0041] The method for laying the brazing sheet further includes: fixing by dispensing glue between the brazing sheet and the step surface of the annular bottom plate, and fixing by dispensing glue between the first-layer annular brazing sheet and the second-layer annular brazing sheet.

[0042] When the reinforcing rib is integrally formed with the annular bottom plate, fix by dispensing glue between the brazing sheet and the reinforcing rib.

[0043] The positioning pin is arranged on the annular bottom plate. When laying the brazing sheet, put the positioning hole on the brazing sheet over the positioning pin; alternatively, the positioning pin is arranged on the annular cover plate. When placing the annular cover plate on the brazing sheet, put the positioning hole on the brazing sheet over the positioning pin.

[0044] The positions where the positioning pin and the positioning hole are arranged correspond to the positions opposite to the starting end and / or the terminating end of the cooling water channel and the bent portion of the cooling water channel.

[0045] The positions where the positioning pin and the positioning hole are arranged correspond to the position of the step portion of the annular bottom plate.

[0046] The brazing sheet is formed by die cutting or laser cutting.

[0047] The present invention also provides a semiconductor processing device, comprising:

[0048] A reaction chamber surrounded by an upper chamber cover, a lower chamber cover and an intermediate base ring, wherein the upper chamber cover and the lower chamber cover are made of quartz material;

[0049] A base arranged in the reaction chamber for carrying a substrate;

[0050] A plurality of heaters arranged outside the reaction chamber, and the heaters are arranged in an annular array;

[0051] An annular reflector arranged between the annularly arranged heaters, and the cooling plate is arranged in the annular reflector;

[0052] An air inlet and an air outlet arranged on the intermediate base ring.

[0053] The present invention uses ribs as the water channel partitions of the cooling water channels, which play a role in strengthening the annular bottom plate and the annular cover plate. During the vacuum brazing process, even if the annular bottom plate and the annular cover plate become soft after high-temperature brazing, the ribs still play a good strengthening role, ensuring the reliability of the cooling plate after introducing cooling water, and avoiding failure forms such as bulging of the cover plate or the bottom plate and cracking of the weld seam. The present invention arranges the double-layer brazing filler metal sheets in a segmented and offset manner, so that the splicing seams of each layer of brazing filler metal sheets are covered by brazing filler metal sheets above or below. After vacuum brazing, seamless connection can be achieved, ensuring that the solder joints are firm, reliable, and do not deform or crack. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 FIG. is a schematic structural diagram of a semiconductor processing device provided by the present invention.

[0055] Figure 2 FIG. is a schematic structural diagram of a cooling plate provided by the present invention.

[0056] Figure 3 is Figure 2 a partial cross-sectional structural diagram of

[0057] Figure 4 FIG. is a schematic structural diagram of the cooling water channel.

[0058] Figure 5 FIG. is a schematic structural diagram of the brazing filler metal sheet.

[0059] Figure 6 and Figure 7 FIG. is a schematic diagram of laying double-layer brazing filler metal sheets. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0060] The following specifically describes the preferred embodiments of the present invention according to Figures 1 to 7 ,

[0061] Such as Figure 1As shown, the present invention provides a semiconductor processing apparatus which, as an epitaxial device, performs deposition processing on a substrate, and is used to grow a single-crystal material having the same lattice arrangement as the substrate on a single-crystal substrate, mainly for forming the drain and source in a device, filling deep trenches, and growing a bare silicon epitaxial layer. The semiconductor processing apparatus includes: an intermediate base ring 1, an upper chamber cover 2 disposed above the intermediate base ring 1, and a lower chamber cover 3 disposed below the intermediate base ring 1. Both the upper chamber cover 2 and the lower chamber cover 3 are made of quartz material. The intermediate base ring 1, the upper chamber cover 2, and the lower chamber cover 3 jointly enclose a reaction chamber 4 of the semiconductor processing apparatus. An upper chamber shell 5 is disposed outside the upper chamber cover 2. Correspondingly, a lower chamber shell 6 is disposed outside the lower chamber cover 3. The upper chamber shell 5 and the lower chamber cover 3 jointly form the housing of the semiconductor processing apparatus. Both the upper chamber shell 5 and the lower chamber cover 6 are made of metal material. A first accommodation space 4-1 is formed between the outer wall of the upper chamber cover 2 and the inner wall of the upper chamber shell 5. A second accommodation space 4-2 is formed between the outer wall of the lower chamber cover 3 and the inner wall of the lower chamber shell 6. A pedestal 7 is disposed in the reaction chamber 4. The upper surface of the pedestal 7 is used to carry a substrate 8. The lower surface of the pedestal 7 is supported by a bracket 9, and the bracket 9 is used to drive the pedestal 7 and the substrate 8 to rotate. An air inlet 10 and an air outlet 11 are oppositely disposed on the lateral sides of the intermediate base ring 1. The air inlet 10 is used to introduce process gas, and the air outlet 11 is used to discharge the remaining gas after the processing is completed. A plurality of heaters 12 are disposed in the first accommodation space 4-1 and the second accommodation space 4-2 outside the reaction chamber 4. The heaters 12 can adopt heating lamps. The heaters 12 disposed in the first accommodation space 4-1 are arranged in a ring. The infrared radiation emitted by the heaters 12 can pass through the upper chamber cover 2 to reach the substrate 8, heating the substrate 8 so that a chemical deposition reaction occurs in the process gas environment. The heaters 12 disposed in the second accommodation space 4-2 are also arranged in a ring. The infrared radiation emitted by the heaters 12 can pass through the lower chamber cover 3 to reach the pedestal 7, heating the pedestal 7, thereby heating the substrate 8 to assist the film-forming reaction on the surface of the substrate 8. A ring-shaped reflector 13 is disposed between the heaters 12, which is used to adjust the distribution of the infrared radiation light emitted by the heaters 12, thereby adjusting the heat reaching the substrate 8 and the pedestal 7. A ring-shaped cooling plate (not shown in the figure) is disposed in the ring-shaped reflector 13, which is used to cool the ring-shaped reflector 13.

[0062] As Figure 2As shown, the cooling plate 14 includes an annular bottom plate 101, which has grooves. The annular cover plate 102 is fixedly connected to the annular bottom plate 101 by welding, so as to form a plurality of cooling water channels in the grooves. The cooling plate 14 is made of materials with good thermal conductivity, such as aluminum, brass, copper, etc. For these materials, the welding effect and quality of ordinary argon arc welding are poor. Electron beam welding - laser welding and friction welding have certain requirements for the external shape of parts, and it is impossible to directly weld the internal grooves. Therefore, vacuum brazing is one of the few options. However, vacuum brazing will heat up the entire cooling plate 14 (the welding temperature of aluminum is greater than 400 degrees Celsius, and the welding temperature of copper is greater than 700 degrees Celsius). After heating up, the original mechanical properties of the material will decline. Especially for copper, after the high temperature of brazing, the copper material will become soft, resulting in poor pressure resistance. The annular cover plate 102 after welding will bulge, and even the weld will crack, resulting in water leakage.

[0063] Based on this, as Figure 3 and Figure 4 shown, the cooling plate 14 provided by the present invention is provided with a reinforcing rib 103. The reinforcing rib 103 is arranged in an annular groove portion 104 inside the annular bottom plate 101, and the structure of the reinforcing rib 103 cooperating with the annular groove portion 104 is also arranged in an overall annular shape. The side wall of the annular groove portion 104 and the upper surface of the annular bottom plate 101 form a stepped portion 105. The annular cover plate 102 is arranged above the annular groove portion 104, and the bottom surface of the annular cover plate 102 is fixedly connected to the stepped surface of the stepped portion 105 by vacuum brazing, so that the annular bottom plate 101 and the annular cover plate 102 are hermetically connected. The height of the reinforcing rib 103 is equal to the depth of the annular groove portion 104, so that the bottom surface of the annular cover plate 102 is also fixedly connected to the top surface of the reinforcing rib 103 by vacuum brazing, so that the annular bottom plate 101, the annular cover plate 102 and the reinforcing rib 103 are connected into one body by brazing filler metal, and together enclose a cooling water channel 106. The cooling water channel 106 has a starting end 107 and a terminating end 108, and the cooling water channel 106 winds and coils between the starting end 107 and the terminating end 108. An inlet through hole and an outlet through hole (not shown in the figure) are arranged on the annular cover plate 102. The inlet through hole is directly above the starting end 107 of the cooling water channel 103. Vacuum brazing is carried out to fixedly connect the inlet through hole to the inlet pipe 109 (as Figure 2 shown), so that the starting end 107 is communicated with the inlet pipe 109. Correspondingly, the outlet through hole is directly above the terminating end 108 of the cooling water channel 106. Vacuum brazing is carried out to fixedly connect the outlet through hole to the outlet pipe 110 (as Figure 2are fixedly connected as shown, so that the termination end 108 communicates with the water outlet pipe 110. The water inlet pipe 109 and the water outlet pipe 110 are connected to a circulating water pump (not shown in the figure) located outside the reaction chamber 4. The cooling water from the circulating water pump enters the cooling water channel 106 along the starting end 107 through the water inlet pipe 109, circulates along the arrangement shape of the cooling water channel 106, and finally enters the water outlet pipe 110 from the termination end 108 and returns to the circulating water pump. This process is repeated to achieve the cooling of the cooling plate 14, and thus the cooling of the annular reflector 13. In the present invention, the reinforcing rib 103 is used as the water channel partition of the cooling water channel 106, which plays a role in strengthening the annular bottom plate 101 and the annular cover plate 102. During the vacuum brazing process, even if the annular bottom plate 101 and the annular cover plate 102 become soft after high-temperature brazing, the reinforcing rib 103 still plays a good strengthening role, ensuring the reliability of the cooling plate after the cooling water is introduced, and avoiding failure forms such as bulging of the cover plate or bottom plate and cracking of the weld seam.

[0064] The material of the reinforcing rib 103 is the same as that of the annular bottom plate 101 and the annular cover plate 102, and all use metal materials with high thermal conductivity, such as aluminum, brass, copper, etc. In actual processing, in an embodiment of the present invention, the reinforcing rib 103 can be integrally formed with the annular bottom plate 101 in advance. The reinforcing rib 103 is located in the annular groove portion 104, and then the annular cover plate 102 is placed on the top of the reinforcing rib 103 for vacuum brazing. The brazing filler metal uses nickel-based brazing filler metal or silver-based brazing filler metal, so that the reinforcing rib 103 is fixedly connected to the annular cover plate 102 through the brazing filler metal, and the stepped surface of the stepped portion 105 of the annular cover plate 102 and the annular bottom plate 101 is also fixedly connected together through the brazing filler metal. The reinforcing rib 103 is tightly connected to the annular cover plate 102 through vacuum brazing, which plays a role in strengthening the annular bottom plate 101 and the annular cover plate 102. During the vacuum brazing process, even if the annular cover plate 102 becomes soft after high-temperature brazing, the reinforcing rib 103 still plays a good strengthening role, ensuring the reliability of the cooling plate after the cooling water is introduced, and avoiding failure forms such as bulging of the cover plate or bottom plate and cracking of the weld seam.

[0065] Accordingly, in another embodiment of the present invention, the reinforcing rib 103 is integrally formed with the annular cover plate 102 in advance, and then the annular cover plate 102 is turned over so that the reinforcing rib 103 is placed in the annular groove portion 104 of the annular bottom plate 101, and the annular cover plate 102 is lapped on the step surface of the step portion 105 of the annular bottom plate 101 for vacuum brazing, so that the reinforcing rib 103 is fixedly connected to the annular groove portion 104 through a brazing filler metal, and at the same time, the annular cover plate 102 is also fixedly connected to the step surface of the step portion 105 of the annular bottom plate 101 through a brazing filler metal. The reinforcing rib 103 is tightly connected to the annular bottom plate 101 through vacuum brazing, which plays a role in strengthening the annular bottom plate 101 and the annular cover plate 102. During the vacuum brazing process, even if the annular bottom plate 101 becomes soft after high-temperature brazing, the reinforcing rib 103 still plays a good strengthening role, ensuring the reliability of the cooling plate after the cooling water is introduced, and avoiding failure forms such as bulging of the cover plate or bottom plate and cracking of the weld seam.

[0066] In order to ensure that the cooling water can flow smoothly in the cooling water channel 106 of the cooling plate 14, it is necessary to reasonably set the width of the cooling water channel 106 according to the width of the annular groove portion 104, and reasonably set the number of the cooling water channels 106 arranged in parallel. As Figure 4 shown, the width w of the reinforcing rib 103 is less than or equal to 5 mm, and the equivalent diameter of the cross-section of the cooling water channel 106 is greater than or equal to the inner diameter of the water inlet pipe 109. The equivalent diameter of the cross-section refers to the total area of all the cooling water channels 106 on the radial cross-section of an annular groove portion 104, and the total area is equal to the cross-sectional area of the annular groove portion 104 minus the cross-sectional area of the reinforcing rib 103. Setting the equivalent diameter of the cross-section of the cooling water channel 106 to be greater than or equal to the inner diameter of the water inlet pipe 109 can avoid excessive resistance to the water flow due to the cooling water channel 106 being too narrow, ensure that the cooling water entering the cooling water channel 106 through the water inlet pipe 109 can flow smoothly to the water outlet pipe 110, and balance the temperature distribution of the cooling plate 14 to ensure the cooling capacity of the cooling plate 14. Appropriately increasing the widths of the starting end 107 and the ending end 108 of the cooling water channel 106 can expand the widths of the starting end 107 and the ending end 108 simultaneously, or can separately expand the width of the starting end 107 or the ending end 108. As Figure 4As shown, the starting end 107 has a first radial width d1, the terminating end 108 has a second radial width d2, and the cooling water channel 106 has a radial width d. Let both the first radial width d1 and the second radial width d2 be greater than the radial width d of the cooling water channel 106. Or, let the first radial width d1 be greater than the radial width d of the cooling water channel 106, and let the sum of the first radial width d1 and the second radial width d2 be greater than the radial width D of the annular groove portion 104. Or, let the second radial width d2 be greater than the radial width d of the cooling water channel 106, and let the sum of the first radial width d1 and the second radial width d2 be greater than the radial width D of the annular groove portion 104. The widths of the starting end 107 and the terminating end 108 of the cooling water channel 106 cannot be infinitely widened and cannot exceed the width of the annular groove portion 104. Let the first radial width d1 be less than the radial width D of the annular groove portion 104, and let the second radial width d2 be less than the radial width D of the annular groove portion 104. By increasing the widths of the starting end 107 and the terminating end 108 of the cooling water channel 106, the capacities of the starting end 107 and the terminating end 108 are expanded. Because the increase in width leads to an increase in the cross-sectional area. At the same time, by arranging the starting end 107 and the terminating end 108 of the cooling water channel 106 adjacent to each other and arranging the starting end 107 and the terminating end 108 in a Tai Chi structure of interlaced wrapping. Since the temperature of the cooling water input into the starting end 107 by the water inlet pipe 109 is low, and after passing through the coiled cooling water channel 106 in the cooling plate 14 and absorbing heat, finally the temperature of the cooling water in the terminating end 108 is higher than the temperature of the cooling water in the starting end 107. Therefore, by arranging the starting end 107 and the terminating end 108 adjacent to each other and wrapping them, heat conduction can occur when they come into contact with each other, thereby balancing the temperatures of the cooling water in the starting end 107 and the terminating end 108, avoiding the formation of a temperature gradient along the circumferential direction of the cooling plate 14, and equalizing the temperature distribution of the cooling plate 14 to prevent device deformation caused by uneven temperature. Arranging the starting end 107 and the terminating end 108 of the cooling water channel 106 adjacent to each other and interlacedly wrapping them can also make the most of the limited space in the annular groove portion 104, enabling the device to be arranged most compactly and efficiently within the limited space and saving costs. Further, the reinforcing ribs 103 at the starting end 107 and the terminating end 108 of the cooling water channel 106 are both set to a rounded corner structure, and at the same time, the reinforcing ribs 103 at the bending portion of the cooling water channel 106 are set to a rounded corner structure to reduce the resistance to the flow of cooling water, prevent the formation of a dead zone in the travel of the cooling water at the turning of the cooling channel 106, avoid causing local temperature non-uniformity of the cooling plate 14, and make the temperature distribution of the cooling plate 14 uniform to ensure the cooling capacity of the cooling plate 14.

[0067] In an embodiment of the present invention, the forming method of the cooling plate 14 comprises the following steps:

[0068] Step S1: Provide a brazing sheet 15;

[0069] As Figure 5 shown, the brazing sheet 15 is annular, the brazing sheet 15 has an edge region 1501 and a hollow region 1502, and an arc-shaped rib 1503 connected to the edge region 1501 is arranged in the hollow region 1502. The number and position of the arc-shaped ribs 1503 match the number and position of the reinforcing ribs 103.

[0070] Brazing solder is generally narrow-width coil material. The cost of a large-area integral brazing sheet is relatively high. Moreover, the cooling plate 14 in the present invention is annular. Correspondingly, the brazing sheet 15 is also annular. If an integral brazing sheet is used to obtain the required annular brazing sheet, the brazing solder in the cut-off middle part cannot be reused, resulting in waste. In addition, if an integral brazing sheet is used, the thickness of the brazing sheet needs to be increased relatively to ensure the welding quality and welding stability, and increasing the thickness of the welding sheet further increases the cost. Therefore, the integral single-layer brazing solder is not the most cost-effective choice in terms of economy.

[0071] Based on this, the brazing sheet 15 provided by the present invention is composed of a double-layer brazing sheet. The thickness of each layer of the brazing sheet is less than or equal to 0.1 mm, and each layer of the brazing sheet is composed of split multi-segment sheets. The brazing sheet 15 is processed and formed by using a die cutting or laser cutting.

[0072] As Figure 6 shown, the first-layer annular brazing sheet 15-1 comprises a plurality of first-layer sector-shaped brazing sheets 1505. The number of the first-layer sector-shaped brazing sheets 1505 is generally set to 4 to 10. All the first-layer sector-shaped brazing sheets 1505 together form a complete first-layer annular brazing sheet 15-1. A first splicing seam 1506 is formed between adjacent first-layer sector-shaped brazing sheets 1505. As Figure 7As shown, the second-layer annular solder sheet 15-2 includes multiple second-layer sector-shaped annular solder sheets 1507. The number of the second-layer sector-shaped annular solder sheets 1507 is the same as that of the first-layer sector-shaped annular solder sheets 1505, and is generally set to 4 to 10 pieces. All the second-layer sector-shaped annular solder sheets 1507 together form a complete second-layer annular solder sheet 15-2, and a second splicing seam 1508 is formed between adjacent second-layer sector-shaped annular solder sheets 1507. Comparing the shape of the second-layer annular solder sheet 15-2 formed by multiple second-layer sector-shaped annular solder sheets 1507 with the shape of the first-layer annular solder sheet 15-1 formed by multiple first-layer sector-shaped annular solder sheets 1505, it can be found that multiple second splicing seams 1508 on the second-layer annular solder sheet 15-2 do not coincide with multiple first splicing seams 1506 on the first-layer annular solder sheet 15-1 in the vertical direction. That is, after the first-layer annular solder sheet 15-1 and the second-layer annular solder sheet 15-2 are sequentially overlapped and laid at the position to be welded, the first splicing seams 1506 on the first-layer annular solder sheet 15-1 will be covered by the second-layer sector-shaped annular solder sheets 1507 on the second-layer annular solder sheet 15-2, thereby achieving seamless welding.

[0073] Step S2, solder sheet positioning;

[0074] As Figure 6 and Figure 7As shown, in this embodiment, the reinforcing rib 103 is integrally formed with the annular bottom plate 101. At least one positioning pin 16 is provided on the stepped surface of the annular bottom plate 101. Corresponding positions on the first-layer annular brazing sheet 15-1 and corresponding positions on the second-layer annular brazing sheet 15-2 are provided with positioning holes 1504. The diameter of the positioning hole 1504 is equal to the diameter of the positioning pin 16. By arranging the positioning pin 16 on the stepped surface of the annular bottom plate 101, whether the reinforcing rib 103 is integrally formed with the annular bottom plate 101 or with the annular cover plate 102, the brazing sheet can be sleeved on the positioning pin 16 located on the stepped surface through the positioning hole 1504, and the operation is convenient and reliable. At least one positioning pin 16 is provided at a position opposite to the starting end 107 of the cooling water channel 106 relative to the bending portion of the cooling water channel 106, or at least one positioning pin 16 is provided at a position opposite to the terminating end 108 of the cooling water channel 106 relative to the bending portion of the cooling water channel 106. Since the reinforcing rib 103 at the bending portion of the cooling water channel 106 is provided with a rounded corner structure, the reinforcing ribs 103 at the starting end 107 and the terminating end 108 of the cooling water channel 106 are also provided with rounded corner structures, and the areas of the starting end 107 and the terminating end 108 of the cooling water channel 106 are relatively large, so a relatively large space is formed between the starting end 107 (terminating end 108) and the bending portion of the cooling water channel 106. By arranging the positioning pin 16 in this space, the space is reasonably utilized, the layout is made compact, and the processing operation is facilitated. At the same time, by arranging the positioning pin 16 in the space around the starting end 107 and the terminating end 108 of the cooling water channel 106, accurate positioning of the water inlet and the water outlet of the cooling water channel 106 can be achieved, so as to accurately weld the starting end 107 and the terminating end 108 of the cooling water channel 106, and ensure that the water inlet pipe 109 and the water outlet pipe 110 are accurately positioned and installed and connected to the starting end 107 and the terminating end 108 subsequently.

[0075] Step S3: Lay the brazing sheet;

[0076] As Figure 6As shown, first lay the first-layer annular brazing sheet 15-1; put the positioning holes 1504 on the first-layer annular brazing sheet 15-1 over the positioning pins 16 on the stepped surface, and lay all the first-layer sector-shaped brazing sheets 1505 in the first-layer annular brazing sheet 15-1 onto the annular bottom plate 101, making the arc-shaped edges 1503 on the first-layer sector-shaped brazing sheets 1505 coincide with the reinforcing ribs 103, and making the edge regions 1501 on the first-layer sector-shaped brazing sheets 1505 coincide with the stepped surface of the stepped portion. Adopt dot gluing between the first-layer annular brazing sheet 15-1 and the stepped surface of the annular bottom plate 101, and also adopt dot gluing between the first-layer annular brazing sheet 15-1 and the reinforcing ribs 103. Adopting dot gluing can prevent the brazing sheet from shifting and ensure the reliability of subsequent welding;

[0077] As Figure 7 shown, then lay the second-layer annular brazing sheet 15-2; put the positioning holes 1504 on the second-layer annular brazing sheet 15-2 over the positioning pins 16 on the stepped surface, and lay all the second-layer sector-shaped brazing sheets 1507 in the second-layer annular brazing sheet 15-2 onto the first-layer sector-shaped brazing sheets 1505 in the first-layer annular brazing sheet 15-1. Similarly, make the arc-shaped edges 1503 on the second-layer sector-shaped brazing sheets 1507 coincide with the reinforcing ribs 103, and make the edge regions 1501 on the second-layer sector-shaped brazing sheets 1507 coincide with the stepped surface of the stepped portion. And all the first splicing seams 1506 in the first-layer annular brazing sheet 15-1 are located below the second-layer sector-shaped brazing sheets 1507, and all the second splicing seams 1508 in the second-layer annular brazing sheet 15-2 are located above the first-layer sector-shaped brazing sheets 1505. Adopt dot gluing between the first-layer annular brazing sheet 15-1 and the second-layer annular brazing sheet 15-2.

[0078] By arranging the double-layer brazing sheets in a segmented and offset manner, the splicing seams of each layer of brazing sheet are covered by brazing sheets above or below. After vacuum brazing, seamless connection can be achieved, ensuring that the solder joints are firm, reliable, and do not deform or crack.

[0079] Step S4, place the annular cover plate 102;

[0080] Place the annular cover plate 102 (as Figure 2Place it on the second-layer annular brazing sheet 15-2 as shown and press it tightly; in order to weld the water inlet pipe and the water outlet pipe subsequently, it is also necessary to pre-open a water inlet through hole (not shown in the figure) and a water outlet through hole (not shown in the figure) on the annular cover plate 102. The water inlet through hole is located above the starting end 107 of the cooling water channel 106, and the water outlet through hole is located above the terminating end 108 of the cooling water channel 106.

[0081] Step S5: Perform vacuum brazing;

[0082] Make the annular bottom plate 101, the annular cover plate 102 and the reinforcing rib 103 be fixedly connected by brazing material to form the cooling water channel 106.

[0083] Step S6: Forming the water inlet pipe and the water outlet pipe;

[0084] Cut the brazing sheet according to the bottom surface shapes of the water inlet pipe 109 and the water outlet pipe 110, lay the cut brazing sheet at the water inlet through hole and the water outlet through hole, place the water inlet pipe 109 and the water outlet pipe 110 (as Figure 2 shown) on the brazing sheet, perform vacuum brazing, make the water inlet pipe 109 be fixedly connected with the water inlet through hole, make the water outlet pipe 110 be fixedly connected with the water outlet through hole, so that the starting end 107 of the cooling water channel 106 is communicated with the water inlet pipe 109, and the terminating end 108 of the cooling water channel 106 is communicated with the water outlet pipe 110.

[0085] The present invention uses a reinforcing rib as the water channel partition of the cooling water channel, which plays a role in strengthening the annular bottom plate and the annular cover plate. During the vacuum brazing process, even if the annular bottom plate and the annular cover plate become soft after high-temperature brazing, the reinforcing rib still plays a good strengthening role, ensuring the reliability of the cooling plate after introducing cooling water, and avoiding failure forms such as bulging of the cover plate or the bottom plate and cracking of the weld seam. The present invention arranges the double-layer brazing sheets in a segmented and staggered manner, so that the splicing seam of each layer of brazing sheet is covered by the brazing sheet above or below. After vacuum brazing, seamless connection can be achieved, ensuring that the solder connection is firm and reliable and does not deform or crack.

[0086] In another embodiment of the present invention, the reinforcing rib 103 is arranged on the lower surface of the annular cover plate 102, and the reinforcing rib 103 is integrally formed with the annular cover plate 102. Then the forming method of the cooling plate 14 includes the following steps:

[0087] Step S1: Provide the brazing sheet 15;

[0088] Provide the first-layer annular brazing sheet 15-1 and the second-layer annular brazing sheet 15-2. The structures of the first-layer annular brazing sheet 15-1 and the second-layer annular brazing sheet 15-2 are the same as those described above and will not be elaborated here.

[0089] Step S2, positioning the brazing solder sheet;

[0090] At least one positioning pin 16 is provided on the lower surface of the annular cover plate 102, and the position of the positioning pin 16 corresponds to the position of the stepped surface of the annular bottom plate 101, and the position of the positioning pin 16 corresponds to the position where the starting end 107 of the cooling water channel 106 is opposite to the bent portion of the cooling water channel 106 or the position where the terminating end 108 of the cooling water channel 106 is opposite to the bent portion of the cooling water channel 106. Positioning holes 1504 are formed at corresponding positions on the first-layer annular brazing solder sheet 15-1 and at corresponding positions on the second-layer annular brazing solder sheet 15-2, and the diameter of the positioning holes 1504 is equal to the diameter of the positioning pins 16.

[0091] Step S3, laying the brazing solder sheet;

[0092] First, lay the first-layer annular brazing solder sheet 15-1; lay all the first-layer sector-shaped brazing solder sheets 1505 in the first-layer annular brazing solder sheet 15-1 on the annular bottom plate 101, so that the edge region 1501 on the first-layer sector-shaped brazing solder sheet 1505 coincides with the stepped surface of the stepped portion, and fix them by dispensing glue between the first-layer annular brazing solder sheet 15-1 and the stepped surface of the annular bottom plate 101;

[0093] Then, lay the second-layer annular brazing solder sheet 15-2; lay all the second-layer sector-shaped brazing solder sheets 1507 in the second-layer annular brazing solder sheet 15-2 on the first-layer sector-shaped brazing solder sheets 1505 in the first-layer annular brazing solder sheet 15-1. Similarly, make the edge region 1501 on the second-layer sector-shaped brazing solder sheet 1507 coincide with the stepped surface of the stepped portion, and all the first splicing seams 1506 in the first-layer annular brazing solder sheet 15-1 are located below the second-layer sector-shaped brazing solder sheets 1507, and all the second splicing seams 1508 in the second-layer annular brazing solder sheet 15-2 are located above the first-layer sector-shaped brazing solder sheets 1505, and fix them by dispensing glue between the first-layer annular brazing solder sheet 15-1 and the second-layer annular brazing solder sheet 15-2.

[0094] Step S4, placing the annular cover plate 102;

[0095] Place the annular cover plate 102 (such as Figure 2Place it on the second-layer annular brazing sheet 15-2 (as shown). When placing the annular cover plate 102 on the second-layer annular brazing sheet 15-2, pass the positioning pin 16 through the positioning holes 1504 on the first-layer annular brazing sheet 15-1 and the second-layer annular brazing sheet 15-2. The reinforcing rib 103 integrally formed with the annular cover plate 102 enters the annular groove portion 104 in the annular bottom plate 101, and press the arc-shaped edges 1503 on the first-layer annular brazing sheet 15-1 and the second-layer annular brazing sheet 15-2 to the bottom of the reinforcing rib 103.

[0096] Step S5: Perform vacuum brazing;

[0097] Fix the annular bottom plate 101, the annular cover plate 102 and the reinforcing rib 103 by brazing to form a cooling water channel 106.

[0098] Step S6: Form the water inlet pipe and the water outlet pipe;

[0099] Cut the brazing sheet according to the bottom surface shape of the water inlet pipe 109 and the water outlet pipe 110, lay the cut brazing sheet at the water inlet through-hole and the water outlet through-hole, place the water inlet pipe 109 and the water outlet pipe 110 (as Figure 2 shown) on the brazing sheet, perform vacuum brazing, fix the water inlet pipe 109 to the water inlet through-hole, and fix the water outlet pipe 110 to the water outlet through-hole, so that the starting end 107 of the cooling water channel 106 is communicated with the water inlet pipe 109, and the terminating end 108 of the cooling water channel 106 is communicated with the water outlet pipe 110.

[0100] The present invention uses a reinforcing rib as a water channel partition of the cooling water channel, which plays a role in strengthening the annular bottom plate and the annular cover plate. During the vacuum brazing process, even if the annular bottom plate and the annular cover plate become soft after high-temperature brazing, the reinforcing rib still plays a good strengthening role, ensuring the reliability of the cooling plate after passing through cooling water, and avoiding failure forms such as bulging of the cover plate or the bottom plate and cracking of the weld seam. The present invention arranges the double-layer brazing sheets in a segmented and staggered manner, so that the splicing seams of each layer of brazing sheet are covered by brazing sheets above or below. After vacuum brazing, seamless connection can be achieved, ensuring that the solder connection is firm and reliable and does not deform or crack.

[0101] It should be noted that in the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0102] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0103] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0104] It should also be understood that the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. As used in the specification of this application and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0105] It should be further understood that the term "and / or" used in the specification of this application and the appended claims refers to any combination and all possible combinations of one or more of the related listed items, and includes these combinations.

[0106] As used in this specification and the appended claims, the term "if" can be construed contextually as "when" or "once" or "in response to determining" or "in response to detecting". Similarly, the phrase "if determined" or "if [described condition or event] is detected" can be construed contextually to mean "once determined" or "in response to determining" or "once [described condition or event] is detected" or "in response to detecting [described condition or event]".

[0107] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A cooling plate, characterized in that, it comprises: a ring-shaped bottom plate having a ring-shaped groove portion, and a stepped portion is formed between the side wall of the ring-shaped groove portion and the upper surface of the ring-shaped bottom plate; reinforcing ribs, which are arranged in an overall annular shape and are located in the ring-shaped groove portion, and the height of the reinforcing ribs is equal to the depth of the ring-shaped groove portion; a ring-shaped cover plate, which is located above the ring-shaped groove portion, the ring-shaped cover plate is connected to the stepped surface of the stepped portion, and the ring-shaped cover plate is connected to the reinforcing ribs; the ring-shaped bottom plate, the ring-shaped cover plate and the reinforcing ribs jointly enclose a cooling water channel, the cooling water channel has a starting end and a terminating end, and the cooling water channel winds and coils between the starting end and the terminating end; an inlet pipe communicating with the starting end of the cooling water channel; an outlet pipe communicating with the terminating end of the cooling water channel; wherein, the starting end has a first radial width, the terminating end has a second radial width, and the radial width of the cooling water channel is less than the first radial width and / or the second radial width; the sum of the first radial width and the second radial width is greater than the radial width of the ring-shaped groove portion; the starting end and the terminating end are arranged in an interlaced and wrapped manner.

2. The cooling plate according to claim 1, characterized in that, the reinforcing ribs and the ring-shaped bottom plate are integrally formed, and the reinforcing ribs and the ring-shaped cover plate are fixedly connected by a brazing filler metal.

3. The cooling plate according to claim 1, characterized in that, the reinforcing ribs and the ring-shaped cover plate are integrally formed, and the reinforcing ribs and the ring-shaped bottom plate are fixedly connected by a brazing filler metal.

4. The cooling plate according to claim 2 or 3, characterized in that, the width of the reinforcing ribs is less than or equal to 5 mm.

5. The cooling plate according to claim 1, characterized in that, the lower surface of the ring-shaped cover plate and the stepped surface of the stepped portion are fixedly connected by a brazing filler metal.

6. The cooling plate according to claim 1, characterized in that, the reinforcing ribs at the bent portion of the cooling water channel are arranged in a rounded corner structure.

7. The cooling plate according to claim 1, characterized in that, the reinforcing ribs at the starting end of the cooling water channel and the reinforcing ribs at the terminating end are arranged in a rounded corner structure.

8. The cooling plate according to claim 1, characterized in that, the equivalent diameter of the cross-section of the cooling water channel is greater than or equal to the inner diameter of the inlet pipe.

9. The cooling plate according to claim 1, characterized in that, the ring-shaped cover plate has a water inlet through hole and a water outlet through hole; the water inlet through hole is located above the starting end of the cooling water channel, and the water inlet through hole is fixedly connected to the inlet pipe by a brazing filler metal; the water outlet through hole is located above the terminating end of the cooling water channel, and the water outlet through hole is fixedly connected to the outlet pipe by a brazing filler metal.

10. The cooling plate according to claim 1, characterized in that, the ring-shaped bottom plate, the ring-shaped cover plate and the reinforcing ribs are made of a metal material with high thermal conductivity.

11. The cooling plate according to claim 1, characterized in that, the brazing filler metal is a nickel-based brazing filler metal or a silver-based brazing filler metal.

12. A forming method of the cooling plate according to any one of claims 1-11, characterized in that, it comprises the following steps: Provide a brazing solder sheet, which is annular, has an edge region and a hollow region, and an arc-shaped rib connected to the edge region is provided in the hollow region; Position the brazing solder sheet. At least one positioning pin is provided on the stepped surface of the annular bottom plate or the lower surface of the annular cover plate, and positioning holes are formed at corresponding positions of the brazing solder sheet; Lay the brazing solder sheet. Lay the brazing solder sheet on the annular bottom plate, put the positioning holes on the brazing solder sheet over the positioning pins, align the arc-shaped rib with the reinforcing rib, and align the edge region with the stepped surface of the stepped portion; Place the annular cover plate on the brazing solder sheet and press it tightly; Perform vacuum brazing to fixedly connect the annular bottom plate, the annular cover plate and the reinforcing rib to form a cooling water channel.

13. The forming method of the cooling plate according to claim 12, characterized in that, the brazing solder sheet includes a first-layer annular brazing solder sheet and a second-layer annular brazing solder sheet which overlap up and down; the first-layer annular brazing solder sheet is composed of a plurality of first-layer sector-shaped brazing solder sheets spliced together to form a first splicing seam, and the first splicing seam is located at a first splicing position; the second-layer annular brazing solder sheet is composed of a plurality of second-layer sector-shaped brazing solder sheets spliced together to form a second splicing seam, and the second splicing seam is located at a second splicing position; the first splicing position and the second splicing position do not coincide in the circumferential direction.

14. The forming method of the cooling plate according to claim 13, characterized in that, the number of the first-layer sector-shaped brazing solder sheets constituting the first-layer annular brazing solder sheet and the number of the second-layer sector-shaped brazing solder sheets constituting the second-layer annular brazing solder sheet are both 4 to 10.

15. The forming method of the cooling plate according to claim 13, characterized in that, the thicknesses of the first-layer annular brazing solder sheet and the second-layer annular brazing solder sheet are both less than or equal to 0.1 mm.

16. The forming method of the cooling plate according to claim 13, characterized in that, the method of laying the brazing solder sheet includes: Lay the first-layer annular brazing solder sheet on the annular bottom plate, align the arc-shaped rib of the first-layer annular brazing solder sheet with the reinforcing rib, and align the edge region of the first-layer annular brazing solder sheet with the stepped surface of the stepped portion; Lay the second-layer annular brazing solder sheet on the first-layer annular brazing solder sheet, align the arc-shaped rib of the second-layer annular brazing solder sheet with the reinforcing rib, and align the edge region of the second-layer annular brazing solder sheet with the stepped surface of the stepped portion, and the first splicing seam is covered by the second-layer sector-shaped brazing solder sheet, and the second splicing seam is covered by the first-layer sector-shaped brazing solder sheet.

17. The forming method of the cooling plate according to claim 16, characterized in that, the method of laying the brazing solder sheet further includes: fixing by dispensing glue between the brazing solder sheet and the stepped surface of the annular bottom plate, and fixing by dispensing glue between the first-layer annular brazing solder sheet and the second-layer annular brazing solder sheet.

18. The forming method of the cooling plate according to claim 17, characterized in that, When the reinforcing rib is integrally formed with the annular bottom plate, dotting is used for fixation between the brazing solder sheet and the reinforcing rib.

19. The forming method of the cooling plate as described in claim 16, characterized in that the positioning pin is arranged on the annular bottom plate, and when laying the brazing solder sheet, the positioning hole on the brazing solder sheet is sleeved on the positioning pin; or, the positioning pin is arranged on the annular cover plate, and when placing the annular cover plate on the brazing solder sheet, the positioning hole on the brazing solder sheet is sleeved on the positioning pin.

20. The forming method of the cooling plate as described in claim 19, characterized in that the setting positions of the positioning pin and the positioning hole correspond to the positions opposite to the starting end and / or the terminating end of the cooling water channel and the bending part of the cooling water channel.

21. The forming method of the cooling plate as described in claim 20, characterized in that the setting positions of the positioning pin and the positioning hole correspond to the position of the stepped part of the annular bottom plate.

22. The forming method of the cooling plate as described in any one of claims 12 - 21, characterized in that the brazing solder sheet is formed by die cutting or laser cutting.

23. A semiconductor processing device, characterized in that it includes: a reaction chamber surrounded by an upper chamber cover, a lower chamber cover and an intermediate base ring, and the upper chamber cover and the lower chamber cover are made of quartz materials; a base arranged in the reaction chamber, and the base is used for carrying a substrate; a plurality of heaters arranged outside the reaction chamber, and the heaters are arranged in a ring; a ring-shaped reflector arranged between the heaters arranged in a ring, and the ring-shaped reflector is provided with a cooling plate as described in any one of claims 1 - 11; an air inlet and an air outlet arranged on the intermediate base ring.

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