Ultrasonic imaging method, device and equipment for closing resistor disc and medium
The detection of the closing resistor sheet through high and low frequency ultrasonic imaging technology solves the problem of difficulty in effectively evaluating the internal structure and electrode coating status of the closing resistor sheet in the prior art, and achieves higher detection accuracy and image quality.
Patent Information
- Application Number
- CN202510313636.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-06-13
AI Technical Summary
The prior art is difficult to effectively verify and detect the internal structure and electrode coating conditions of the closing resistor sheet, resulting in poor operating reliability.
The closing resistor sheet is scanned by high-frequency and low-frequency ultrasonic probes, and the surface amplitude imaging and acoustic imaging are obtained respectively, and the two are centered and high-low fused to generate high-low-frequency fused ultrasonic images.
The image quality of the closing resistor sheet ultrasonic imaging can be improved, and the internal tissue and surface electrode coating conditions can be more accurately evaluated, thereby improving the accuracy of detection.
Smart Images
Figure CN120142475A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of image processing, and in particular, to an ultrasonic imaging method, device, equipment and medium for closing resistor chips. Background Art
[0002] With the rapid development of ultra-high voltage and extra-high voltage, switchgear equipped with closing resistors such as Gas Insulated Switchgear (GIS), Hybrid Gas Insulated Switchgear (HGIS), and tank circuit breakers has been widely used. However, due to the special internal structure and complex mechanism of the circuit breaker closing resistor, the operating reliability is not ideal. There is an urgent need for a complete and effective inspection and detection method for closing resistor chips. Summary of the Invention
[0003] The purpose of the present application is to provide an ultrasonic imaging method, device, equipment and medium for closing resistor chips, so as to improve the image quality of ultrasonic imaging of closing resistor chips.
[0004] To achieve the above purpose, the present application provides the following solutions:
[0005] In a first aspect, the present application provides an ultrasonic imaging method for closing resistor chips, including:
[0006] Obtaining a surface amplitude image obtained by ultrasonic scanning of a target closing resistor chip by a high-frequency probe; the surface amplitude image is used to characterize the electrode coating peeling condition of the target closing resistor chip;
[0007] Obtaining a sound velocity image obtained by ultrasonic scanning of the target closing resistor chip by a low-frequency probe; the sound velocity image is used to characterize the tissue dispersion of the target closing resistor chip;
[0008] Centrally aligning the surface amplitude image and the sound velocity image;
[0009] Assigning the surface amplitude at the position where the surface amplitude in the surface amplitude image exceeds a set defect threshold after central alignment to the corresponding position in the sound velocity image after central alignment to obtain a high-low frequency fusion ultrasonic image.
[0010] Optionally, obtaining a surface amplitude image obtained by ultrasonic scanning of a target closing resistor chip by a high-frequency probe specifically includes:
[0011] Obtaining the surface amplitudes at various positions obtained by ultrasonic scanning of the target closing resistor chip by a high-frequency probe, and the surface amplitudes at various positions form a surface amplitude matrix;
[0012] Mapping the surface amplitude matrix to a grayscale matrix ranging from 0 to 65535 to obtain the surface amplitude imaging.
[0013] Optionally, mapping the surface amplitude matrix to a grayscale matrix ranging from 0 to 65535 to obtain the surface amplitude imaging, and the formula used is: new_A = (A - min(A)) / (max(A) - min(A)) × 65535;
[0014] Wherein, A is the surface amplitude matrix, and new_A is the mapped surface amplitude grayscale matrix.
[0015] Optionally, obtaining the sound velocity imaging obtained by ultrasonic scanning of the target closing resistor chip with a low-frequency probe, specifically including:
[0016] Obtaining the sound velocity values at each position obtained by ultrasonic scanning of the target closing resistor chip with a low-frequency probe;
[0017] Performing color mapping on the sound velocity values at each position to obtain the sound velocity imaging.
[0018] In a second aspect, the present application provides an ultrasonic imaging device for a closing resistor chip. The ultrasonic imaging device for the closing resistor chip applies the ultrasonic imaging method for the closing resistor chip according to any one of the above, and the ultrasonic imaging device for the closing resistor chip includes:
[0019] A surface amplitude imaging acquisition module, configured to acquire the surface amplitude imaging obtained by ultrasonic scanning of the target closing resistor chip with a high-frequency probe; the surface amplitude imaging is used to characterize the electrode coating peeling condition of the target closing resistor chip;
[0020] A sound velocity imaging acquisition module, configured to acquire the sound velocity imaging obtained by ultrasonic scanning of the target closing resistor chip with a low-frequency probe; the sound velocity imaging is used to characterize the tissue dispersion of the target closing resistor chip;
[0021] An image centering alignment module, configured to center-align the surface amplitude imaging and the sound velocity imaging;
[0022] An image fusion module, configured to assign the surface amplitude at the position where the surface amplitude in the centered surface amplitude imaging exceeds the set defect threshold to the corresponding position in the centered sound velocity imaging to obtain a high-low frequency fused ultrasonic image.
[0023] Optionally, the high-frequency probe is a high-frequency 10 MHz probe, and the low-frequency probe is a low-frequency 1 MHz probe.
[0024] Optionally, the ultrasonic scanning is ultrasonic C-scanning.
[0025] Optionally, the high-frequency probe is a high-frequency water immersion focusing probe.
[0026] In a third aspect, the present application provides a computer device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the ultrasonic imaging method of the closing resistor chip described in any one of the above.
[0027] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the ultrasonic imaging method of the closing resistor chip described in any one of the above are implemented.
[0028] According to the specific embodiments provided by the present application, the following technical effects are disclosed:
[0029] The present application provides an ultrasonic imaging method, device, equipment and medium for a closing resistor chip. The surface amplitude at the position where the surface amplitude in the surface amplitude imaging after centered alignment exceeds the set defect threshold is assigned to the corresponding position in the sound velocity imaging after centered alignment, so as to obtain a high-low frequency fusion ultrasonic image. By fusing high and low frequencies, the information of the image is enriched, the problem that it is difficult to simultaneously evaluate the internal tissue of the material and the peeling off of the surface electrode coating with the detection result of a single-frequency probe is overcome, the image quality of ultrasonic imaging is improved, and thus the accuracy of detecting the closing resistor chip is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.
[0031] Figure 1 It is a schematic flowchart of an ultrasonic imaging method for a closing resistor chip provided by an embodiment of the present application;
[0032] Figure 2 It is a schematic diagram of an A-scan signal of a certain point of a closing resistor chip obtained by a high-frequency 10 MHz probe provided by an embodiment of the present application;
[0033] Figure 3 It is a schematic diagram of an A-scan signal of a certain point of a closing resistor chip obtained by a low-frequency 1 MHz probe provided by an embodiment of the present application;
[0034] Figure 4 It is a schematic diagram of surface amplitude imaging obtained based on the data to be processed obtained by a high-frequency 10 MHz probe provided by an embodiment of the present application;
[0035] Figure 5Schematic diagram of sound velocity imaging obtained from the data to be processed acquired by a 1 MHz low-frequency probe according to an embodiment of the present application;
[0036] Figure 6 Schematic diagram of high-low frequency fusion image provided by an embodiment of the present application;
[0037] Figure 7 Schematic structural diagram of an ultrasonic imaging device for a closing resistor sheet provided by an embodiment of the present application;
[0038] Figure 8 Schematic structural diagram of a computer device provided by an embodiment of the present application. Detailed implementation manners
[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0040] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners.
[0041] The present application provides an ultrasonic imaging method for a closing resistor sheet, as Figure 1 shown, the ultrasonic imaging method for the closing resistor sheet includes:
[0042] Step 101: Obtain a surface amplitude imaging obtained by ultrasonic scanning of a target closing resistor sheet with a high-frequency probe; the surface amplitude imaging is used to characterize the electrode coating peeling condition of the target closing resistor sheet.
[0043] Step 102: Obtain a sound velocity imaging obtained by ultrasonic scanning of the target closing resistor sheet with a low-frequency probe; the sound velocity imaging is used to characterize the tissue dispersion of the target closing resistor sheet.
[0044] Step 103: Center-align the surface amplitude imaging and the sound velocity imaging.
[0045] Step 104: Assign the surface amplitude at the position where the surface amplitude in the surface amplitude imaging exceeds the set defect threshold after center alignment to the corresponding position in the sound velocity imaging after center alignment to obtain a high-low frequency fusion ultrasonic image.
[0046] In this application, ultrasonic scanning is performed on the target closing resistor chip to obtain high- and low-frequency data to be processed. The effective information of the two results is fused to obtain a high-low frequency fusion imaging result, providing an effective detection method for the quality uniformity detection of the closing resistor chip.
[0047] In an exemplary embodiment, step 101 specifically includes: obtaining the surface amplitudes at each position obtained by ultrasonic scanning the target closing resistor chip with a high-frequency probe, and the surface amplitudes at each position form a surface amplitude matrix; mapping the surface amplitude matrix into a gray matrix of 0 to 65535 to obtain the surface amplitude imaging, where the water surface amplitude is set to 0. The gray matrix is a 16-bit gray matrix.
[0048] Mapping the surface amplitude matrix into a gray matrix of 0 to 65535 to obtain the surface amplitude imaging, and the formula used is: new_A = (A - min(A)) / (max(A) - min(A)) × 65535.
[0049] Where A is the surface amplitude matrix and new_A is the mapped surface amplitude gray matrix.
[0050] In an exemplary embodiment, step 102 specifically includes: obtaining the sound velocity values at each position obtained by ultrasonic scanning the target closing resistor chip with a low-frequency probe; performing color mapping on the sound velocity values at each position to obtain the sound velocity imaging, where the sound velocity of water is set to 0.
[0051] The ultrasonic scanning in step 101 and step 102 is specifically ultrasonic C-scanning.
[0052] The high-frequency probe is a high-frequency 10 MHz probe, and the low-frequency probe is a low-frequency 1 MHz probe.
[0053] Since the low-frequency probe has less attenuation in the target closing resistor, an ultrasonic scan obtains a sound velocity matrix composed of the sound velocity values at each position, and color mapping the sound velocity matrix to obtain the sound velocity imaging.
[0054] The high-frequency 10 MHz probe is more sensitive to the surface state of the workpiece, but the high-frequency signal has too much attenuation when propagating in the closing resistor chip, and the A-scan signal cannot see the scattering situation and bottom wave of the ultrasonic wave inside the material. The A-scan signal of a certain point on the closing resistor chip obtained by the high-frequency 10 MHz probe is as Figure 2 shown. The sound beam of the low-frequency 1 MHz probe is wider and is not sensitive to the surface state of the workpiece. However, since the low frequency can penetrate the resistor chip and the A-scan signal can see the bottom wave, the low-frequency probe is more sensitive to the dispersion of the internal structure of the closing resistor chip. The A-scan signal of a certain point on the closing resistor chip obtained by the low-frequency 1 MHz probe is as Figure 3 shown.
[0055] The electrode coating of the closing resistor chip is an important medium for resistance conduction. The shedding of the electrode coating will affect the normal operation of the resistor.
[0056] In an exemplary embodiment, the high-frequency probe is a high-frequency water-immersion focused probe. Surface amplitude imaging is to focus the high-frequency water-immersion focused probe on the surface of the target closing resistor chip to obtain a surface amplitude matrix. The shedding of the electrode coating will affect the surface amplitude at this position, and the surface amplitude matrix is imaged to characterize the shedding of the electrode coating on the surface of the closing resistor chip. Specifically, use the water-immersion focused probe in the water-immersion ultrasonic system to perform ultrasonic C-scan imaging on the target closing resistor chip. The water-immersion ultrasonic system includes a water-immersion focused probe, a pulse generator, a signal acquisition card, a motion control card, and a scanning frame. Among them, the water-immersion focused probe is used to transmit and receive ultrasonic signals, the pulse generator generates pulse excitation, and the acquisition card is used to filter the analog signal and then convert it into a digital signal, that is, to obtain the scan data to be processed.
[0057] Closing resistor chips are mainly applied to switchgear in ultra-high voltage and extra-high voltage transmission systems, such as gas-insulated switchgear (GIS), hybrid gas-insulated switchgear (HGIS), and tank circuit breakers. These devices are widely used in lines with voltage levels of 750 kV and above, and their main function is to suppress the closing inrush current and transient overvoltage during the opening and closing of the circuit breaker. Specifically, the closing resistor is inserted several milliseconds before the main contacts of the circuit breaker are closed and is short-circuited and withdrawn several milliseconds after the main contacts are closed, thereby effectively reducing the switching overvoltage.
[0058] Reasons for the need for a water-immersion ultrasonic system.
[0059] 1. Nondestructive testing requirements: The internal structure of the closing resistor chip is complex, and it is prone to damage or cracks due to factors such as mechanical shock and electric field force during operation, which may lead to failures. Traditional testing methods such as radiographic testing are difficult to detect directional cracks and cannot judge the stress state. Therefore, a more efficient and accurate nondestructive testing method is needed.
[0060] 2. Advantages of the water-immersion ultrasonic system:
[0061] 1) High-precision detection: The water-immersion ultrasonic system can accurately detect minute defects inside the closing resistor chip, such as cracks and pores, through the propagation and reflection characteristics of ultrasonic waves in water.
[0062] 2) Comprehensive coverage: The system can achieve full-round detection of the closing resistor chip, avoiding missed detections caused by detection dead angles.
[0063] 3) Real-time and rapidity: Ultrasonic testing technology features fast detection speed and real-time feedback of results, making it suitable for rapid assessment of closing resistor chips with complex structures.
[0064] 4) Safety and environmental protection: The immersion ultrasonic system has no electromagnetic radiation and is harmless to the human body, meeting the environmental protection requirements of modern detection technologies.
[0065] Applicability for composite material detection: Closing resistor chips are usually made of composite materials. The immersion ultrasonic system can effectively detect internal defects of composite materials and evaluate their mechanical properties and microstructures through acoustic parameters. This method is applicable not only to quality control during the production stage but also to maintenance detection during the operation stage.
[0066] In this application, the to-be-processed scan data is obtained by high-frequency probes and low-frequency probes respectively; surface amplitude imaging is obtained based on the to-be-processed data obtained by the high-frequency probes, as Figure 4 shown; sound velocity imaging is obtained based on the to-be-processed data obtained by the low-frequency probes, as Figure 5 shown.
[0067] Due to the differences in ultrasonic C-scanning, the surface amplitude imaging and the sound velocity imaging may be located either on the left or on the right. For subsequent fusion steps, the center points of each image are calculated to center the images.
[0068] The process of centering the images is as follows: find the coordinates (x, y) of non-zero points, calculate the center position (center_x, center_y) of non-zero points, determine the target center position (target_x, target_y), calculate the translation offset (shift_x, shift_y), and re-place the non-zero points at the new positions (new_x, new_y).
[0069] center_x = ∑x i 、center_y = ∑y i .
[0070] shift_x = target_x - center_x, shift_y = target_y - center_y.
[0071] new_x = shift_x + x, new_y = shift_y + y.
[0072] Among them, x i is the abscissa of the i-th point, and y i is the ordinate of the i-th point.
[0073] Since both the surface amplitude imaging and the sound velocity imaging are obtained by ultrasonic C-scanning, the result of C-scanning is a set of A-scan signals. Each A-scan signal can be used to calculate the corresponding surface amplitude and sound velocity values at the corresponding positions. Therefore, the surface amplitude and the sound velocity are naturally aligned, and the sizes and pixel dimensions of the images are the same, except that the images are not centered.
[0074] Set a defect threshold, which is the unacceptable surface amplitude loss value. It is considered that when the surface amplitude is lower than the set defect threshold, the surface electrode coating has serious peeling.
[0075] In an exemplary embodiment, step 104 specifically includes: extracting the positions and surface amplitudes where the surface amplitudes in the surface amplitude imaging exceed the set defect threshold after center alignment, assigning the surface amplitudes at each extracted position to the sound velocity imaging according to the corresponding positions. The sound velocity imaging after re - assignment is a high - low frequency fused ultrasonic image. The re - assigned positions are the positions lower than the set defect threshold, and the assigned values are the surface amplitudes of the surface amplitude imaging at these positions, realizing the high - low frequency fused imaging characterization of the quality uniformity of the closing resistor sheet based on the ultrasonic method. The high - low frequency fused ultrasonic image is as Figure 6 shown.
[0076] Based on the same inventive concept, the embodiment of the present application also provides an ultrasonic imaging device for a closing resistor sheet for implementing the ultrasonic imaging method of the closing resistor sheet involved above. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the ultrasonic imaging device for the closing resistor sheet provided below can refer to the limitations of the ultrasonic imaging method for the closing resistor sheet in the above text, and will not be repeated here.
[0077] In an exemplary embodiment, as Figure 7 shown, an ultrasonic imaging device for a closing resistor sheet is provided. The ultrasonic imaging device for the closing resistor sheet applies the ultrasonic imaging method of any one of the above - mentioned closing resistor sheets. The ultrasonic imaging device for the closing resistor sheet includes:
[0078] A surface amplitude imaging acquisition module, configured to obtain a surface amplitude imaging obtained by ultrasonic scanning of a target closing resistor sheet through a high - frequency probe; the surface amplitude imaging is used to characterize the peeling condition of the electrode coating of the target closing resistor sheet.
[0079] A sound velocity imaging acquisition module, configured to obtain a sound velocity imaging obtained by ultrasonic scanning of the target closing resistor sheet through a low - frequency probe; the sound velocity imaging is used to characterize the tissue dispersion of the target closing resistor sheet.
[0080] An image center alignment module, configured to center - align the surface amplitude imaging and the sound velocity imaging.
[0081] An image fusion module, configured to assign the surface amplitudes at the positions where the surface amplitudes in the surface amplitude imaging after center alignment exceed the set defect threshold to the corresponding positions of the sound velocity imaging after center alignment to obtain a high - low frequency fused ultrasonic image.
[0082] The high - frequency probe is a 10 - MHz high - frequency probe, and the low - frequency probe is a 1 - MHz low - frequency probe.
[0083] The ultrasonic scan is an ultrasonic C-scan.
[0084] The high-frequency probe is a high-frequency water immersion focused probe.
[0085] In an exemplary embodiment, a computer device is provided. The computer device can be a server or a terminal, and its internal structure diagram can be as Figure 8 shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, abbreviated as I / O), and a communication interface. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store ultrasonic imaging data of closing resistor chips. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it implements an ultrasonic imaging method for closing resistor chips.
[0086] Those skilled in the art can understand that Figure 8 the structure shown in
[0087] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program, which when executed by a processor implements the steps in the above method embodiments.
[0088] In an exemplary embodiment, a computer program product is provided, including a computer program, which when executed by a processor implements the steps in the above method embodiments.
[0089] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.
[0090] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.
[0091] The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., and are not limited thereto. The processors involved in the embodiments provided in this application can be general-purpose processors, central processors, graphics processors, digital signal processors, data processing logics of programmable logics, etc., and are not limited thereto.
[0092] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.
[0093] In this article, specific examples are used to elaborate on the principles and implementation modes of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation modes and application scopes. In summary, the content of this specification should not be construed as a limitation to this application.
Claims
1. A method for ultrasonic imaging of a closing resistor, characterized in that: The ultrasonic imaging method of the closing resistor comprises: Acquire a surface amplitude image obtained by ultrasonically scanning a target closing resistor piece through a high-frequency probe; the surface amplitude image is used to characterize the electrode coating shedding condition of the target closing resistor piece; Acquire a sound velocity image obtained by ultrasonically scanning the target closing resistor piece through a low-frequency probe; the sound velocity image is used to characterize the tissue dispersion of the target closing resistor piece; Centering the surface amplitude imaging and the sound velocity imaging; The surface amplitude at the position where the surface amplitude exceeds the set defect threshold in the surface amplitude imaging after center alignment is assigned to the corresponding position of the sound velocity imaging after center alignment to obtain a high- and low-frequency fused ultrasonic image.
2. The ultrasonic imaging method of the closing resistor according to claim 1, characterized in that: Obtaining surface amplitude imaging by ultrasonically scanning the target closing resistor using a high-frequency probe, specifically including: Obtaining the surface amplitude at each position by ultrasonically scanning the target closing resistor piece with a high-frequency probe, wherein the surface amplitude at each position constitutes a surface amplitude matrix; The surface amplitude matrix is mapped to a grayscale matrix of 0 to 65535 to obtain the surface amplitude imaging.
3. The ultrasonic imaging method of the closing resistor according to claim 2, characterized in that: The surface amplitude matrix is mapped to a grayscale matrix of 0 to 65535 to obtain the surface amplitude imaging, and the formula used is: new_A = (A-min(A)) / (max(A)-min(A))×65535; Among them, A is the surface amplitude matrix, and new_A is the mapped surface amplitude grayscale matrix.
4. The ultrasonic imaging method of a closing resistor according to claim 1, characterized in that: Acquiring a sound velocity imaging obtained by ultrasonically scanning the target closing resistor piece through a low-frequency probe, specifically includes: Obtaining sound velocity values at various positions by ultrasonically scanning the target closing resistor piece with a low-frequency probe; The sound velocity imaging is obtained by color mapping the sound velocity values at each position.
5. An ultrasonic imaging device for a closing resistor, characterized in that: The ultrasonic imaging device of the closing resistor piece adopts the ultrasonic imaging method of the closing resistor piece according to any one of claims 1 to 4, and the ultrasonic imaging device of the closing resistor piece comprises: A surface amplitude imaging acquisition module is used to obtain a surface amplitude imaging obtained by ultrasonically scanning a target closing resistor piece with a high-frequency probe; the surface amplitude imaging is used to characterize the electrode coating shedding condition of the target closing resistor piece; A sound velocity imaging acquisition module, used to obtain a sound velocity imaging obtained by ultrasonically scanning the target closing resistor piece through a low-frequency probe; the sound velocity imaging is used to characterize the tissue dispersion of the target closing resistor piece; An image centering alignment module, used for centering the surface amplitude imaging and the sound velocity imaging; The image fusion module is used to assign the surface amplitude at the position where the surface amplitude exceeds the set defect threshold in the surface amplitude imaging after centering alignment to the corresponding position of the sound velocity imaging after centering alignment to obtain a high- and low-frequency fused ultrasonic image.
6. The ultrasonic imaging device of the closing resistor according to claim 5, characterized in that: The high-frequency probe is a high-frequency 10 MHz probe, and the low-frequency probe is a low-frequency 1 MHz probe.
7. The ultrasonic imaging device of the closing resistor according to claim 5, characterized in that: The ultrasonic scan is an ultrasonic C scan.
8. The ultrasonic imaging device of the closing resistor according to claim 5, characterized in that: The high-frequency probe is a high-frequency water immersion focusing probe.
9. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the ultrasonic imaging method for a closing resistor according to any one of claims 1 to 4.
10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the ultrasonic imaging method of the closing resistor according to any one of claims 1 to 4 is implemented.