Testing device and testing method

Abstract

The invention relates to a testing device and a testing method.The testing device comprises a function testing clamp, an automatic equipment testing box, a testing accompanying plate and an upper computer, the testing device separates a high-speed signal testing circuit and a low-speed signal testing circuit from the function testing clamp, the low-speed signal testing circuit is integrated into the automatic equipment testing box, and the testing accompanying plate is connected with the upper computer; the high-speed signal test circuit is integrated to the test accompanying board, and after the function test fixture fixes the to-be-tested module, the pins of the to-be-tested module are connected to the automatic equipment test box and the test accompanying board, so that the automatic equipment test box and the test accompanying board can be controlled by the upper computer to perform function test on the to-be-tested module. The universality of the test device in testing the to-be-tested module and the reusability of the test circuit are improved.

Description

Technical Field

[0001] This application relates to the technical field of module testing, and particularly to a testing device and a testing method. Background Art

[0002] For the functional testing (Function-Test, FT for short) of modules packaged in ways such as Land Grid Array (LGA), M.2 package, and Leadless Chip Carriers (LCC) package, the existing testing solutions are generally as follows: design an FT fixture to lead out the pins to be tested of the module to the fixture board; customize and design the FT fixture board, and test some pins by adding peripheral circuits on the fixture board, and introduce the other part of the pins to the microcontroller unit (MCU) function board for testing. Therefore, for modules to be tested on different platforms, it is necessary to separately design a fixture board with corresponding test circuits, which has a high production difficulty and low reusability. Summary of the Invention

[0003] This application provides a testing device and a testing method to solve the technical problems that the testing device cannot be universal and has low reusability when testing modules to be tested.

[0004] In a first aspect, this application provides a testing device, which includes: a functional testing fixture, an automated equipment testing box, a co-testing board, and a host computer;

[0005] The functional testing fixture is used to fix the module to be tested and connect the pins of the module to be tested to the automated equipment testing box and / or the co-testing board; wherein, the automated equipment testing box includes a low-speed signal testing circuit, and the co-testing board includes a high-speed signal testing circuit;

[0006] The host computer is used to control the automated equipment testing box and / or the co-testing board to perform functional testing on the module to be tested.

[0007] Optionally, the functional testing fixture includes a fixture board, and the fixture board includes a socket structure unit, a first connector, and a second connector;

[0008] The socket structure unit is used to connect the first pin group of the module to be tested to the first connector and connect the second pin group of the module to be tested to the second connector; wherein, the first connector is used to connect the automated equipment testing box, and the second connector is used to connect the co-testing board.

[0009] Optionally, the socket structure unit includes a plurality of thimble pins. When the module to be tested is fixed to the socket structure unit, the pins of the module to be tested are connected to the thimble pins in a one-to-one correspondence.

[0010] Optionally, the automated equipment test box includes a microcontroller unit function board and a peripheral circuit board; the microcontroller unit function board is connected to the peripheral circuit board through a third connector;

[0011] The peripheral circuit board is configured to perform a function test on the low-speed signals of the module to be tested under the control of the microcontroller unit function board;

[0012] The companion test board is configured to perform a function test on the high-speed signals of the module to be tested under the control of the microcontroller unit function board.

[0013] Optionally, the automated equipment test box is detachably connected to the first connector, and the companion test board is detachably connected to the second connector.

[0014] Optionally, the peripheral circuit board is detachably connected to the third connector.

[0015] Optionally, the automated equipment test box further includes a power protection board, and the power protection board is configured to perform overvoltage and overcurrent protection on the microcontroller unit function board and the peripheral circuit board.

[0016] Optionally, the low-speed signal test circuit includes at least one of an audio test circuit, a general-purpose input / output test circuit, a subscriber identity module test circuit, a secure digital card test circuit, a digital-to-analog conversion test circuit, an analog-to-digital conversion test circuit, a USB2.0 interface test circuit, a serial port debugging test circuit, and a light-emitting diode test circuit;

[0017] The high-speed signal test circuit includes at least one of a mobile industry processor interface loop test circuit, a high-speed serial bus interface standard test circuit, a serial gigabit media independent interface test circuit, a TYPE-C interface test circuit, a USB3.0 interface test circuit, and an expansion circuit test circuit.

[0018] Optionally, the test device further includes a programmable power supply;

[0019] The programmable power supply is configured to supply power to the module to be tested, the automated equipment test box, the companion test board, and the host computer.

[0020] In a second aspect, the present application provides a test method, which is applied to the test device according to any one of the first aspect. The method includes:

[0021] When the module to be tested is fixed to the functional test fixture, the host computer controls the target pins of the module to be tested to output functional test signals;

[0022] The automated equipment test box or the accompanying test board tests the functional test signals to obtain test feedback signals;

[0023] The host computer generates the functional test results of the module to be tested according to the functional test signals and the test feedback signals.

[0024] In a third aspect, the present application provides an electronic device, including a processor, a communication interface, a memory, and a communication bus. Among them, the processor, the communication interface, and the memory complete mutual communication through the communication bus;

[0025] The memory is used to store computer programs;

[0026] The processor is used to implement the test method described in the second aspect embodiment when executing the program stored on the memory.

[0027] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the test method described in the second aspect embodiment.

[0028] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art: The test device provided by the embodiments of the present application includes: a functional test fixture, an automated equipment test box, an accompanying test board, and a host computer; the functional test fixture is used to fix the module to be tested and connect the pins of the module to be tested to the automated equipment test box and / or the accompanying test board; among them, the automated equipment test box includes a low-speed signal test circuit, and the accompanying test board includes a high-speed signal test circuit; the host computer is used to control the automated equipment test box and / or the accompanying test board to perform functional tests on the module to be tested. This test device separates the high-speed signal test circuit and the low-speed signal test circuit from the functional test fixture. The low-speed signal test circuit is integrated into the automated equipment test box, and the high-speed signal test circuit is integrated into the accompanying test board. After the functional test fixture fixes the module to be tested, it connects the pins of the module to be tested to the automated equipment test box and the accompanying test board, so that the host computer can control the automated equipment test box and the accompanying test board to perform functional tests on the module to be tested, improving the versatility of the test device when testing the module to be tested and the reusability of the test circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings here are incorporated into the description and form a part of this description, showing embodiments consistent with the present application and used together with the description to explain the principles of the present application.

[0030] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the drawings in the figures do not constitute a scale limitation.

[0032] Figure 1 It is a system architecture diagram of a test device provided by an embodiment of the present application;

[0033] Figure 2 It is a structural schematic diagram of a test device provided by another embodiment of the present application;

[0034] Figure 3 It is a composition schematic diagram of an automated equipment test box provided by an embodiment of the present application;

[0035] Figure 4 It is a schematic diagram of an automated equipment test box provided by an embodiment of the present application;

[0036] Figure 5 It is a schematic diagram of an accompanying test board provided by an embodiment of the present application;

[0037] Figure 6 It is a flow schematic diagram of a test method provided by an embodiment of the present application;

[0038] Figure 7 It is a structural schematic diagram of an electronic device provided by an embodiment of the present application. Specific embodiments

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0040] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0041] To solve the technical problem that the existing test device cannot be universal and has low reusability when testing a module under test, the present application provides a test device and a test method, which can separate the high-speed signal test circuit and the low-speed signal test circuit from the functional test fixture. The low-speed signal test circuit is integrated into the automated equipment test box, and the high-speed signal test circuit is integrated into the companion test board. After the functional test fixture fixes the module under test, it connects the pins of the module under test to the automated equipment test box and the companion test board, so that the upper computer can control the automated equipment test box and the companion test board to perform functional tests on the module under test, improving the universality of the test device when testing the module under test and the reusability of the test circuit.

[0042] The first embodiment of the present application provides a test device, which can be applied to a system architecture as Figure 1 shown. The system architecture at least includes a functional test fixture, an automated equipment test box, a companion test board, and an upper computer.

[0043] Among them, the functional test fixture is used to fix the module under test and connect the pins of the module under test to the automated equipment test box (abbreviated as ATE-BOX) and / or the companion test board (abbreviated as CPB); among them, the automated equipment test box includes a low-speed signal test circuit, and the companion test board includes a high-speed signal test circuit.

[0044] The upper computer is used to control the automated equipment test box and / or the companion test board to perform functional tests on the module under test.

[0045] This test device separates the high-speed signal test circuit and the low-speed signal test circuit from the functional test fixture. The low-speed signal test circuit is integrated into the automated equipment test box, and the high-speed signal test circuit is integrated into the companion test board. After the functional test fixture fixes the module under test, it connects the pins of the module under test to the automated equipment test box and the companion test board, so that the upper computer can control the automated equipment test box and the companion test board to perform functional tests on the module under test, improving the universality of the test device when testing the module under test and the reusability of the test circuit.

[0046] In a specific embodiment, the schematic structural diagram of the test device is as shown in Figure 2 , and next, the test device will be described in detail based on the schematic structural diagram of the test device.

[0047] In one embodiment, the test device further includes a programmable power supply, which is used to supply power to the module to be tested, the automated equipment test box, the accompanying test board, and the host computer.

[0048] In one embodiment, the functional test fixture includes a fixture board, and the fixture board includes a socket structure unit, a first connector, and a second connector.

[0049] The socket structure unit can also be referred to as the SOCKET structure. The SOCKET structure is used to connect the first pin group of the module to be tested to the first connector, and the second pin group of the module to be tested to the second connector; wherein, the first connector is used to connect the automated equipment test box, and the second connector is used to connect the accompanying test board.

[0050] In this embodiment, the module to be tested can be fixed to the functional test fixture through the SOCKET structure, and the fixing method is not limited. For example, it can be fixed by clamping or fixing parts. At the same time, the SOCKET structure can connect a part of the pins (the first pin group) in the module to be tested to the first connector, and a part of the pins (the second pin group) to the second connector. Since the first connector is connected to the ATE - BOX and the second connector is connected to the accompanying test board, the host computer can control the ATE - BOX and the accompanying test board to perform functional tests on the module to be tested.

[0051] In one embodiment, the socket structure unit includes a plurality of thimbles. When the module to be tested is fixed to the socket structure unit, the pins of the module to be tested are connected to the thimbles one by one.

[0052] In this embodiment, the SOCKET structure can include a plurality of thimbles. The thimbles are designed elastically. When the module to be tested is fixed to the SOCKET structure, the thimbles contact and are compressed by the pins of the module to be tested, forming a good conduction path. The other end of the thimble is connected to the first connector or the second connector, so as to conveniently and quickly lead out the pins of the module to be tested to the first connector or the second connector through the thimbles.

[0053] In one embodiment, the automated equipment test box includes a micro - control unit function board (abbreviated as MCU function board) and a peripheral circuit board (which can be abbreviated as T1), as shown in Figure 3 , and the MCU function board is connected to the peripheral circuit board T1 through a third connector.

[0054] The peripheral circuit board T1 is used to perform functional tests on the low-speed signals of the module under test under the control of the MCU function board, and the co-test board is used to perform functional tests on the high-speed signals of the module under test under the control of the microcontroller unit function board.

[0055] In this embodiment, the MCU function board and the peripheral circuit board T1 are separately designed and connected through the third connector, which can modularize the automated equipment test box. For example, both the peripheral circuit board and the MCU function board can be detachably connected to the third connector. When other test devices need them, the MCU function board or the peripheral circuit board T1 can be separately disassembled and used, improving the reusability of the components.

[0056] In one embodiment, the automated equipment test box is detachably connected to the first connector, and the co-test board is detachably connected to the second connector.

[0057] In this embodiment, the connection between the ATE-BOX and the first connector can also be a detachable connection, and the connection between the co-test board and the second connector can also be a detachable connection, making the components modular. If the peripheral circuit is designed on the fixture board, due to the limited area of the fixture board, the structural design requirements for the fixture board are very high. In this embodiment, the high-speed signal test circuit and the low-speed signal test circuit are no longer designed on the fixture board, but separated from the functional test fixture. The low-speed signal test circuit is integrated into the automated equipment test box, and the high-speed signal test circuit is integrated into the co-test board. Moreover, both the ATE-BOX and the co-test board are detachably connected to the corresponding connectors. For example, when the co-test board is not needed, it is not connected. On the premise of being convenient to connect, the expandability of the functional test is improved, and the reusability of the test circuit is also improved.

[0058] In one embodiment, the low-speed signal test circuit, such as Figure 4 can include any combination of one or more of an audio (AUDIO) test circuit, a general-purpose input / output test circuit (General Purpose Input / Output, abbreviated as GPIO), a subscriber identity module (Subscriber Identity Module, abbreviated as SIM) test circuit, a secure digital card (Secure Digital Card, abbreviated as SD) test circuit, a digital-to-analog conversion (DAC) test circuit, an analog-to-digital conversion (ADC) test circuit, a USB2.0 interface test circuit, a serial port debugging (DEBUG_UART) test circuit, and a light-emitting diode (LED) test circuit.

[0059] The high-speed signal test circuit, such as Figure 5, may include any combination of one or more of a Mobile Industry Processor Interface LOOP (abbreviated as MIPI-LOOP) test circuit, a peripheral component interconnect express (abbreviated as PCIE) test circuit, a Serial Gigabit Media Independent Interface (abbreviated as SGMII) test circuit, a TYPE-C interface test circuit, a USB3.0 interface test circuit, and an Extended Circuit test circuit.

[0060] In this embodiment, the low-speed signal test circuit integrated into the ATE-BOX can be configured as needed, and the high-speed signal test circuit integrated into the companion board can also be configured as needed. It should be understood that the low-speed signal test circuit integrated into the ATE-BOX may also include other low-speed signal test circuits such as a JIG-CON test circuit, and the high-speed signal test circuit integrated into the companion board may also include other high-speed signal test circuits such as a CPB-CON test circuit, so that the functional test of the test device is more comprehensive and universal.

[0061] In one embodiment, the automated equipment test box further includes a Power Protect Board (abbreviated as PPB), which is used to provide overvoltage and overcurrent protection for the microcontroller unit function board and the peripheral circuit board.

[0062] In this embodiment, the ATE-BOX further includes a power protection board, so as to provide overvoltage protection and overcurrent protection for the MCU function board and the peripheral circuit board. Of course, functions such as under-voltage detection and adjustable protection threshold can also be performed, without limitation, so as to improve the safety during the functional test.

[0063] In the above embodiments of the present application, the host computer can be an industrial control computer or a personal computer PC. A tool software is installed in the host computer. Next, examples of low-speed signal test and high-speed signal test will be given respectively.

[0064] When testing low-speed signals, the tool software sends AT commands to control the PIN of the module under test to output high / low levels; the voltage signal is collected by the MCU function board after passing through the fixture board and the ATE-BOX, and the voltage value is sent back to the tool software through the serial port; the tool software compares the collected voltage with the threshold. If it is within the threshold, the low-speed signal test of this PIN passes (PASS), and it is judged that its path is normal. It should be noted that the test schemes for each low-speed signal (such as SIM, SD, AUDIO) all rely on the peripheral circuit board T1 in the ATE-BOX for auxiliary testing, which will not be listed one by one here.

[0065] When testing high-speed signals, such as testing MIPI_LOOP, the tool software controls the PIN under test of the module under test to output MIPI signals, such as Display Serial Interface (DSI) signals; the DSI signals are input to the MIPI signal conversion circuit on the CPB after passing through the fixture board, and are converted into Camera Serial Interface (CSI) signals; the CSI signals are sent back to the module after passing through the fixture board, received by the CAMERA of the module, and sent to the tool software. The tool software judges whether the DSI signals output by the module are consistent with the CSI signals received; if they are consistent, the MIPI_LOOP test passes. The test principles for other high-speed signals are similar (the module sends high-speed signals, which are converted by the peripheral circuit on the CPB and then sent back to the module, and the module judges whether the signals it sends and receives are consistent, or sends them to the tool software for judgment), and all use the loopback scheme for testing, which will not be listed one by one here.

[0066] In each embodiment of the present application, the high-speed signal test circuit, the low-speed signal test circuit are separated from the fixture board. The low-speed signal test circuit is integrated into the ATE-BOX, and the high-speed signal test circuit is integrated into the CPB. Both adopt a normalized design, which improves their reusability and expandability, and reduces the manufacturing difficulty and cost of the fixture board.

[0067] Based on the same technical concept, the second embodiment of the present application provides a test method, as Figure 6 applied to the test device described in any one of the first embodiments, the test method includes:

[0068] Step 601, when the module under test is fixed to the functional test fixture, the host computer controls the target pin of the module under test to output a functional test signal;

[0069] Step 602, the automated equipment test box or the accompanying test board tests the functional test signal to obtain a test feedback signal;

[0070] Step 603: The host computer generates the functional test result of the module to be tested based on the functional test signal and the test feedback signal.

[0071] In this test method, with the module to be tested fixed on the functional test fixture, the host computer controls the target pins of the module to be tested to output the functional test signal; the automated equipment test box or the accompanying test board tests the functional test signal to obtain the test feedback signal; the host computer generates the functional test result of the module to be tested based on the functional test signal and the test feedback signal. Since the used test device separates the high-speed signal test circuit and the low-speed signal test circuit from the functional test fixture, integrates the low-speed signal test circuit into the automated equipment test box, and integrates the high-speed signal test circuit into the accompanying test board, after the functional test fixture fixes the module to be tested, it connects the pins of the module to be tested to the automated equipment test box and the accompanying test board, so that the host computer can control the automated equipment test box and the accompanying test board to perform functional tests on the module to be tested, making this test method simply and efficiently complete the functional test of the module to be tested.

[0072] As Figure 7 shown, an embodiment of the present application provides an electronic device, including a processor 111, a communication interface 112, a memory 113, and a communication bus 114. Among them, the processor 111, the communication interface 112, and the memory 113 complete mutual communication through the communication bus 114.

[0073] The memory 113 is used to store computer programs.

[0074] In an embodiment of the present application, when the processor 111 executes the program stored on the memory 113, it implements the test method provided by any one of the foregoing method embodiments.

[0075] The communication bus mentioned in the above terminal may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of convenience of representation, only a thick line is used in the figure, but it does not mean that there is only one bus or one type of bus.

[0076] The communication interface is used for communication between the above terminal and other devices.

[0077] The memory may include a Random Access Memory (RAM), or may also include non-volatile memory, such as at least one disk memory. Optionally, the memory may also be at least one storage device located far from the aforementioned processor.

[0078] The aforementioned processor may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0079] The embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the testing method provided in any one of the foregoing method embodiments.

[0080] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0081] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the essence of the above technical solution, or the part that contributes to the related technology, can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0082] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless the order of performance is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0083] It should be understood that the specific embodiments described herein are merely for explaining the present application and are not used to limit the present application. In the description, the suffixes such as "module", "component", or "unit" used to denote elements are only for the convenience of explaining the present application and have no specific meaning in themselves. Therefore, "module", "component", or "unit" may be used interchangeably.

[0084] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A testing device, characterized in that: The test device comprises: a functional test fixture, an automated equipment test box, a test board and a host computer; The functional test fixture is used to fix the module to be tested, and connect the pins of the module to be tested to the automated equipment test box and / or the accompanying test board; wherein the automated equipment test box includes a low-speed signal test circuit, and the accompanying test board includes a high-speed signal test circuit; The host computer is used to control the automation equipment test box and / or the companion test board to perform a functional test on the module to be tested.

2. The testing device according to claim 1, characterized in that: The functional test fixture comprises a fixture plate, and the fixture plate comprises a socket structure unit, a first connector and a second connector; The socket structure unit is used to connect the first pin group of the module to be tested to the first connector, and to connect the second pin group of the module to be tested to the second connector; wherein the first connector is used to connect the automation equipment test box, and the second connector is used to connect the companion test board.

3. The testing device according to claim 2, characterized in that: The socket structure unit comprises a plurality of ejector pins. When the module to be tested is fixed to the socket structure unit, the pins of the module to be tested are connected to the ejector pins in a one-to-one correspondence.

4. The testing device according to claim 1, characterized in that: The automated equipment test box comprises a micro control unit function board and a peripheral circuit board; the micro control unit function board is connected to the peripheral circuit board via a third connector; The peripheral circuit board is used to perform functional testing on the low-speed signal of the module to be tested under the control of the micro control unit function board; The companion test board is used to perform functional tests on the high-speed signals of the module to be tested under the control of the microcontroller function board.

5. The testing device according to claim 2, characterized in that: The automated equipment test box is detachably connected to the first connector, and the companion test board is detachably connected to the second connector.

6. The testing device according to claim 4, characterized in that: The peripheral circuit board is detachably connected to the third connector.

7. The testing device according to claim 4, characterized in that: The automation equipment test box also includes a power protection board, which is used to protect the micro control unit function board and the peripheral circuit board from overvoltage and overcurrent.

8. The testing device according to claim 1, characterized in that: The low-speed signal test circuit includes at least one of an audio test circuit, a general input and output test circuit, a user identification card test circuit, a secure digital card test circuit, a digital-to-analog conversion test circuit, an analog-to-digital conversion test circuit, a USB2.0 interface test circuit, a serial port debugging test circuit and a light-emitting diode test circuit; The high-speed signal test circuit includes at least one of a mobile industry processor interface loop test circuit, a high-speed serial bus interface standard test circuit, a serial gigabit media independent interface test circuit, a TYPE-C interface test circuit, a USB3.0 interface test circuit and an expansion circuit test circuit.

9. The testing device according to claim 1, characterized in that: The test device also includes a program-controlled power supply; The program-controlled power supply is used to supply power to the module to be tested, the automation equipment test box, the accompanying test board and the host computer.

10. A testing method, characterized in that: Applied to the testing device according to any one of claims 1 to 9, the method comprising: When the module to be tested is fixed on the functional test fixture, the host computer controls the target pin of the module to be tested to output a functional test signal; The automated equipment test box or accompanying test board tests the functional test signal to obtain a test feedback signal; The host computer generates a functional test result of the module to be tested according to the functional test signal and the test feedback signal.

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