PCB (Printed Circuit Board) test frame with double-probe test structure

Abstract

The invention relates to a PCB (Printed Circuit Board) test frame with a double-probe test structure. The PCB test frame comprises a wire board, a needle board and a plurality of test components, the test assembly comprises a first probe, a second probe, a first spring and a second spring, a plurality of first pinholes and a plurality of second pinholes are formed in the probe plate, each first pinhole and each second pinhole are adjacently formed in the probe plate, each first probe is arranged in each first pinhole, and each second probe is arranged in each second pinhole; a plurality of first placement grooves and second placement grooves are formed in the wire board, each first placement groove is aligned with one first needle hole correspondingly, each second placement groove is aligned with one second needle hole correspondingly, a first spring is arranged in each first placement groove, and a second spring is arranged in each second placement groove; each first probe movably abuts against a first spring, each second probe movably abuts against a second spring, and the first springs are electrically connected with the second springs; and each group of test assemblies is used for testing one bonding pad of the PCB.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board test fixtures, and particularly relates to a PCB board test fixture with a double-probe test structure. Background Art

[0002] In the existing large-size aluminum substrate, due to good heat dissipation of the base material, there are usually a large number of IC chips (Integrated Circuit Chip) designed on the circuit surface. Due to the encapsulation of these IC chip pins, the window openings designed on the PCB board (Printed Circuit Board) are usually very small, that is, the copper exposure size of the pads is very small. Most of the short sides of the copper exposure are less than 0.25 mm. However, due to the large size of the PCB board, most of them exceed 400×500 mm. Therefore, during the production process of the test fixture, the phenomenon of probe position deviation is likely to occur, resulting in the situation that the probes of the finished test fixture are misaligned when contacting the pads of the PCB board. This situation will affect the test results. Moreover, because the IC chips are distributed throughout the circuit surface of the PCB board, that is, there are multiple small pads on the PCB board, it is difficult to use the conventional method of dealing with deviations to handle this influence, thus resulting in the test fixture being unable to accurately use the probes to contact the pad positions of the PCB board for testing. Summary of the Invention

[0003] Based on this, it is necessary to provide a PCB board test fixture with a double-probe test structure.

[0004] The technical solution of the present invention to solve the above technical problems is as follows: A PCB board test fixture with a double-probe test structure includes: a wire board, a needle board, and a plurality of test components; each test component includes a first probe, a second probe, a first spring, and a second spring. A plurality of first needle holes and a plurality of second needle holes are formed on the needle board. Each first needle hole and a second needle hole are adjacently formed on the needle board. Each first probe is disposed in a first needle hole, and each second probe is disposed in the second needle hole; a plurality of first placement grooves and second placement grooves are formed on the wire board. Each first placement groove is correspondingly aligned with a first needle hole, and each second placement groove is correspondingly aligned with a second needle hole. A first spring is disposed in each first placement groove, and a second spring is disposed in each second placement groove. Each first probe is in movable abutment with a first spring, and each second probe is in movable abutment with a second spring. The first spring and the second spring are electrically connected; each group of test components is used to test a pad of the PCB board.

[0005] In one embodiment, the distance between the first probe and the second probe in the same test component ranges from 0.1 to 0.3 mm.

[0006] In one embodiment, the end of each first probe away from the wire board is a round head.

[0007] In one embodiment, the end of each second probe away from the wire board is a round head.

[0008] In one embodiment, the ends of the first probe and the second probe in each test component away from the wire board are flush.

[0009] In one embodiment, a plurality of mounting posts are provided on the wire board, and a plurality of mounting holes are formed in the needle board. Each mounting post is inserted into one of the mounting holes.

[0010] In one embodiment, a threaded hole is formed in the mounting post. After a bolt passes through the mounting hole, it is screwed into the threaded hole to fixedly connect the needle board and the wire board.

[0011] In one embodiment, a layer of nano-insulating layer is coated on the surfaces of each first probe and each second probe.

[0012] In one embodiment, insulating sleeves are sleeved on the outer surfaces of each first probe and each second probe.

[0013] In one embodiment, the insulating sleeve is made of ceramic.

[0014] The beneficial effects of the present invention are as follows: A PCB board test fixture with a dual-probe test structure provided by the present invention uses one test component to test at a pad position of the PCB board in contact. Since there are two probes on one test component, when using the test component to test the circuit board, even if there is a deviation in the probe position caused by manufacturing the PCB board test fixture, it can ensure that at least one probe can contact the pad position of the PCB board, thereby ensuring that each pad on the PCB board can be contacted and tested by the probes on the PCB board test fixture with a dual-probe test structure. The PCB board test fixture with a dual-probe test structure provided by the present application can ensure that each pad on the PCB board can be contacted and tested by at least one probe when testing the PCB board through the structure of setting two probes in the same test component, thereby ensuring that each pad on the PCB board can be tested, improving the accuracy of the test. Description of the Drawings

[0015] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0016] Figure 1 Flow schematic diagram of a PCB board test fixture with a dual-probe test structure according to an embodiment of the present invention;

[0017] Figure 2 Structural schematic diagram of a PCB board test fixture with a dual-probe test structure according to an embodiment of the present invention.

[0018] In the drawings, 10 is a PCB board test fixture with a dual-probe test structure; 100 is a wire board; 110 is a first placement groove; 120 is a second placement groove; 130 is a mounting post; 131 is a screw hole; 200 is a needle board; 210 is a first needle hole; 220 is a second needle hole; 230 is a mounting hole; 300 is a test component; 310 is a first probe; 320 is a second probe; 330 is a first spring; 340 is a second spring; 400 is an insulating sleeve. Detailed implementation manners

[0019] To facilitate the understanding of the present invention, the following will describe the present invention more comprehensively with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] In one embodiment, asFigure 1 and Figure 2 As shown in Figure 2 , a PCB board test fixture 10 with a double-probe test structure includes: a wire board 100, a pin board 200, and a plurality of test components 300; the test component 300 includes a first probe 310, a second probe 320, a first spring 330, and a second spring 340. A plurality of first pin holes 210 and a plurality of second pin holes 220 are formed on the pin board 200. Each of the first pin holes 210 and a second pin hole 220 are adjacently formed on the pin board 200. Each of the first probes 310 is disposed in a first pin hole 210, and each of the second probes 320 is disposed in the second pin hole 220. A plurality of first placement grooves 110 and second placement grooves 120 are formed on the wire board 100. Each of the first placement grooves 110 is correspondingly aligned with a first pin hole 210, and each of the second placement grooves 120 is correspondingly aligned with a second pin hole 220. A first spring 330 is disposed in each of the first placement grooves 110, and a second spring 340 is disposed in each of the second placement grooves 120. Each of the first probes 310 is in movable contact with a first spring 330, and each of the second probes 320 is in movable contact with a second spring 340. The first spring 330 and the second spring 340 are electrically connected. Each set of test components 300 is used to test a pad of the PCB board.

[0023] Specifically, when using the PCB board test fixture 10 with a dual-probe test structure to test a PCB board, first align and install the needle board 200 with the wire board 100 to ensure that each first probe 310 is aligned with a first spring 330, and each second probe 320 is aligned with a second spring 340. Then place the PCB board on the needle board 200. At this time, the first probe 310 and / or the second probe 320 on the same test assembly 300 can contact the pads of the PCB board, thereby testing the conductivity of the pads of the PCB board. By using one test assembly 300 to test at a pad position of the PCB board in contact, and a first probe 310 and a second probe 320 are provided on one test assembly 300, and the first probe 310 and the second probe 320 on the same test assembly 300 are arranged adjacent to each other. Therefore, when using the test assembly 300 to test the circuit board, even if there is a probe position deviation caused by the production and manufacture of the PCB board test fixture 10 with a dual-probe test structure, it can be ensured that at least one probe can contact the pad position of the PCB board, that is, to ensure that the first probe 310 and / or the second probe 320 contact the pad. Since the first spring 330 and the second spring 340 are connected to a wire for electrical connection, it is ensured that each pad on the PCB board can be contacted and tested by the probes on the PCB board test fixture 10 with a dual-probe test structure. The PCB board test fixture 10 with a dual-probe test structure provided in the present application, by setting two probes in the same test assembly 300, can ensure that each pad on the PCB board can be contacted and tested by at least one probe when testing the PCB board, thereby ensuring that each pad on the PCB board can be tested, and improving the accuracy of the test.

[0024] In this embodiment, by arranging the first probe 310 and the second probe 320 on the needle board 200 and arranging the first spring 330 and the second spring 340 on the wire board 100, that is, arranging the probes and the springs on different boards respectively, it is convenient for the installation of the probes and the springs, and it is also convenient for subsequent maintenance in case of problems.

[0025] In one embodiment, the needle board 200 is a multi-layer board. Specifically, the needle board 200 has three layers of board bodies, and each layer of board body is connected by a connecting column (not shown in the figure), and the distance between adjacent two board bodies is equal. Through the above setting, it is convenient to observe whether the first probe 310 or the second probe 320 is bent or broken.

[0026] In one embodiment, a plurality of small light beads are arranged on the side of the bottom plate, and each small light bead is electrically connected to the first probe and the second probe in the same test component. Specifically, the small light beads are used to indicate whether the first probe and / or the second probe is in contact with the pad of the PCB board. When the first probe and / or the second probe is in contact with the pad of the PCB board, the circuit is turned on at this time, so there will be current flowing through the first probe and / or the second probe, thereby causing the small light beads electrically connected to the first probe and the second probe to light up. Whether the small light beads light up or not can help the user determine whether the first probe and the second probe are in contact with the pad. Through the above arrangement, it is convenient for the user to determine whether the first probe and the second probe are in contact with the pad of the PCB board and are working properly.

[0027] In one embodiment, the first probe 310 and the second probe 320 are detachably arranged on the needle board 200. Specifically, by detachably arranging the first probe 310 and the second probe 320, it is convenient to replace them when the first probe 310 and the second probe 320 are damaged.

[0028] In order to ensure that at least one of the first probe 310 and the second probe 320 in the same test component 300 can be in contact with the pad of the PCB board, in one embodiment, the distance between the first probe 310 and the second probe 320 in the same test component 300 ranges from 0.1 to 0.3 mm. Specifically, through the above arrangement, the distance between the first probe 310 and the second probe 320 in the same test component 300 is set within a reasonable range, which can ensure that at least one of the first probe 310 and the second probe 320 in the same test component 300 can be in contact with the pad of the PCB board, avoiding the situation where both the first probe 310 and the second probe 320 are not in contact with the pad of the PCB board, and improving the accuracy of the test.

[0029] In order to reduce the wear of the first probe 310 on the pad of the PCB board, in one embodiment, as Figure 2 shown, the end of each first probe 310 away from the wire board 100 is a round head. Specifically, by setting the end of the first probe 310 in contact with the PCB board as a round head, the contact surface of the round head can increase the contact area between the first probe 310 and the PCB board, thereby reducing the pressure, that is, reducing the wear of the first probe 310 on the pad position of the PCB board.

[0030] In order to reduce the wear of the second probe 320 on the pad of the PCB board, in one embodiment, as Figure 2As shown, one end of each of the second probes 320 away from the wire board 100 is a round head. Specifically, by setting the end of the second probe 320 in contact with the PCB board as a round head, the contact surface of the round head can increase the contact area between the second probe 320 and the PCB board, thereby reducing the pressure, that is, reducing the wear of the second probe 320 on the pad position of the PCB board.

[0031] To ensure that both the first probe 310 and the second probe 320 in the same test component 300 can contact the PCB board, in one embodiment, as Figure 2 shown, one end of the first probe 310 and the second probe 320 in each test component 300 away from the wire board 100 is flush. Specifically, by arranging the first probe 310 and the second probe 320 flush, when the PCB board is placed on the needle board 200, it can be ensured that the first probe 310 and the second probe 320 contact the PCB board at the first time, and it can be ensured that the first probe 310 and the second probe 320 in the same test component 300 can contact the PCB board simultaneously, improving the accuracy of the first probe 310 and the second probe 320 contacting the pads.

[0032] To accurately install the needle board 200 on the wire board 100, in one embodiment, as Figure 1 shown, a plurality of mounting posts 130 are provided on the wire board 100, and a plurality of mounting holes 230 are formed on the needle board 200, and each mounting post 130 is inserted into one mounting hole 230. Specifically, when the needle board 200 needs to be installed on the wire board 100, as long as the mounting post 130 on the wire board 100 is aligned with the mounting hole 230 on the needle board 200, and then the mounting post 130 is inserted into the mounting hole 230, the needle board 200 can be accurately installed on the wire board 100.

[0033] To firmly install the needle board 200 on the wire board 100, in one embodiment, a screw hole 131 is formed in the mounting post 130, and after a bolt passes through the mounting hole 230, it is screwed into the screw hole 131 to fixedly connect the needle board 200 and the wire board 100. Specifically, through the above method, the needle board 200 is fixedly installed on the wire board 100 using bolts, so that the needle board 200 can be firmly installed on the wire board 100 and is also convenient for disassembly.

[0034] In this embodiment, the mounting hole 230 has a large hole and a small hole. The aperture of the large hole is larger than that of the small hole, and the large hole communicates with the small hole. The mounting post 130 can only be inserted into the large hole, and the bolt passes through the small hole into the large hole, and in the large hole, the bolt is screwed to the side wall of the threaded hole 131.

[0035] To prevent the first probe 310 and the second probe 320 in different test components 300 from being short-circuited, in one embodiment, a layer of nano-insulating layer (not shown in the figure) is coated on the surfaces of each of the first probes 310 and each of the second probes 320. Specifically, the thickness of the nano-insulating layer is small. Therefore, coating the nano-insulating layer on the surfaces of the first probe 310 and the second probe 320 respectively will not affect the cross-sectional areas of the first probe 310 and the second probe 320, and the nano-insulating layer has good insulating effect, which can prevent the short-circuit between the first probe 310 and the second probe 320 in different test components 300, and improves the detection accuracy.

[0036] To further prevent the first probe 310 and the second probe 320 in different test components 300 from being short-circuited, in one embodiment, as Figure 2 shown, insulating sleeves 400 are sleeved on the outer surfaces of each of the first probes 310 and each of the second probes 320. Specifically, the cost of the insulating sleeve 400 is low, and the insulating sleeve 400 has good insulating effect. Therefore, sleeving the insulating sleeve 400 on each of the first probes 310 and each of the second probes 320 respectively can further prevent the short-circuit between the first probe 310 and the second probe 320 in different test components 300, and improves the detection accuracy.

[0037] In this embodiment, the insulating sleeve 400 is made of ceramic. Specifically, ceramic has good insulating effect. Therefore, choosing ceramic to make the insulating sleeve 400 also has good insulating effect.

[0038] In order to accurately fix the PCB board on the needle board, in one embodiment, a clamping assembly is provided on the needle board. Specifically, the clamping assembly includes two clamping blocks and two lead screws. Two cavities are formed inside the needle board, and two waist-shaped holes are formed on the surface of the needle board. Each waist-shaped hole communicates with one of the cavities. The two lead screws are respectively rotatably arranged in the two cavities. Each clamping block passes through one of the waist-shaped holes and is connected to one of the lead screws. A threaded hole is formed in each clamping block, and each lead screw is screwed into the threaded hole in one of the clamping blocks. The two clamping blocks are arranged opposite to each other, and by rotating the two lead screws, the two clamping blocks are driven to move closer to or away from each other. Through the above arrangement, the positions of the two clamping blocks can be adjusted, so that the PCB board can be fixedly arranged on the needle board by the two clamping blocks.

[0039] Compared with the prior art, the present invention has at least the following advantages: By providing the structure of the first probe and the second probe in the same test assembly, when testing the PCB board, it can be ensured that at least one probe contacts the pad of the PCB board, thereby ensuring that each test assembly of the PCB board test fixture with a dual-probe test structure can contact a pad of the PCB board, and ensuring that each pad on the PCB board can be tested.

[0040] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0041] The above-described embodiments only express several embodiments of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A PCB board test stand with a double probe test structure, characterized in that: include: Wire board, pin board and several test components; The test assembly comprises a first probe, a second probe, a first spring and a second spring, a plurality of first pinholes and a plurality of second pinholes are provided on the needle plate, each of the first pinholes and a second pinhole are adjacently provided on the needle plate, each of the first probes is arranged in one of the first pinholes, and each of the second probes is arranged in one of the second pinholes; A plurality of first placement grooves and second placement grooves are formed on the line board, each of the first placement grooves is aligned with a first pinhole, each of the second placement grooves is aligned with a second pinhole, a first spring is arranged in each of the first placement grooves, a second spring is arranged in each of the second placement grooves, each of the first probes is movably abutted against a first spring, each of the second probes is movably abutted against a second spring, and the first spring and the second spring are electrically connected; each group of test components is used to test a pad of a PCB board.

2. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: The distance between the first probe and the second probe in the same test assembly ranges from 0.1 to 0.3 mm.

3. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: One end of each of the first probes away from the line board is a round head.

4. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: One end of each of the second probes away from the line plate is a round head.

5. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: The first probe and the second probe in each of the test assemblies are flush with one end away from the wiring board.

6. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: The line plate is provided with a plurality of mounting posts, the needle plate is provided with a plurality of mounting holes, and each of the mounting posts is inserted into one of the mounting holes.

7. The PCB board test stand with a double probe test structure according to claim 6, characterized in that: A screw hole is provided in the mounting column, and a bolt is passed through the mounting hole and then screwed into the screw hole to fix the needle plate and the wire plate.

8. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: The surface of each of the first probes and each of the second probes is coated with a nano insulating layer.

9. The PCB board test stand with a double probe test structure according to claim 1, characterized in that: The outer surfaces of each of the first probes and each of the second probes are sleeved with an insulating sleeve.

10. The PCB board test stand with a double probe test structure according to claim 9, characterized in that: The insulating sleeve is made of ceramic.

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