Chip testing equipment

Abstract

The invention provides chip testing equipment, and relates to the technical field of chip testing. Each conveying mechanism comprises an annular linear motor and a plurality of testing jigs installed on the annular linear motor, and each testing jig moves among a feeding station, a testing station and a discharging station in a controlled mode. The function mechanism comprises a testing device arranged corresponding to the testing station, and the testing device is arranged to carry out functional testing on the tested chip when the testing jig moves to the testing station. According to the technical scheme, the mode that the annular linear motor drives the multiple test jigs to move is adopted, all the test jigs are independent and can move synchronously, each test jig can move independently, and compared with the mode that all the test jigs of a rotary table can only move synchronously, the annular linear motor is more flexible. In addition, the annular linear motor is provided with a linear segment, the linear segment is more beneficial to arrangement of a test station and can be better expanded, and the expansibility is good.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a testing device for a chip. Background Art

[0002] The KGD (Known Good Die) testing system is mainly applied to the dynamic and static parameter testing of power bare chips, and can screen the Dies after dicing, thereby improving the cumulative yield of Die packaging. It mainly consists of two parts: a chip handling device and a testing machine.

[0003] At present, there is a turntable type KGD testing system on the market, which drives a plurality of test fixtures to rotate through a turntable to test the chips to be tested. The current main disadvantage of the turntable type KGD testing system is that the expandability of the testing stations is poor, and the testing stations cannot be increased according to the testing requirements. Therefore, it is urgent to design a KGD testing system with better expandability. Summary of the Invention

[0004] An object of the present invention is to provide a testing device for a chip, so as to solve the technical problem of poor expandability of the chip testing device in the prior art.

[0005] A further object of the present invention is to improve the loading speed.

[0006] In particular, the present invention provides a testing device for a chip, including:

[0007] A loading mechanism for loading the chips to be tested;

[0008] At least one conveying mechanism, each of the conveying mechanisms includes a ring linear motor and a plurality of test fixtures mounted on the ring linear motor, the ring linear motor has a loading station, at least one unloading station and at least one testing station, and each of the test fixtures is independently controlled to move between the loading station, the testing station and the unloading station, and the test fixture is configured to receive the chips to be tested at the loading station;

[0009] At least one functional mechanism, each of the functional mechanisms corresponds to one of the conveying mechanisms, and each of the functional mechanisms includes a testing device corresponding to the testing station, and the testing device is configured to perform a functional test on the chips to be tested when the test fixture moves to the testing station;

[0010] An unloading mechanism is arranged on one side of the unloading station, and is configured to unload the chips to be tested that have completed the functional test when the test fixture moves to the unloading station.

[0011] Optionally, the loading mechanism includes:

[0012] The first turret includes a first turntable and a plurality of first suction members arranged at intervals along the circumferential side of the first turntable.

[0013] At least one set of loading components is installed beside the first turret. The first turntable is controllably rotated to drive a target first suction member among the plurality of first suction members to move to a target loading component among the at least one set of loading components, so that the target first suction member sucks the DUT (Device Under Test) chips on the target loading component and transports the DUT chips.

[0014] Optionally, the number of the loading components is three, and each set of the loading components is respectively used for loading the DUT chips in different packaging forms.

[0015] Among them, one set of loading components is used for loading the tray containing the DUT chips.

[0016] One set of loading components is used for loading the wafer with the DUT chips.

[0017] The remaining set of loading components is used for loading the tape of the reel-type chip feeder, and the tape has the DUT chips.

[0018] Optionally, the unloading mechanism includes:

[0019] A second turret, including a second turntable and a plurality of second suction members arranged at intervals along the circumferential side of the second turntable;

[0020] At least one set of unloading components is installed beside the second turret. The second turntable is controllably rotated to drive a target second suction member among the plurality of second suction members to move to the unloading station, so that the target second suction member adsorbs the DUT chips that have completed the test in the test fixture and transports them to a target unloading component among the at least one set of unloading components.

[0021] Optionally, each of the conveying mechanisms further includes a cleaning station, which is arranged between the test station and the unloading station. Each of the functional mechanisms further includes:

[0022] A cleaning device, installed at the cleaning station, for cleaning the test fixture.

[0023] Optionally, each of the conveying mechanisms further includes a rectifying station, which is located downstream of the loading station. Each of the functional mechanisms further includes:

[0024] A rectifying device, installed at the rectifying station, for adjusting the position of the DUT chips in the test fixture.

[0025] Optionally, each of the conveying mechanisms further includes a mold clamping station disposed downstream of the loading station. The test fixture includes a test base, and the test base includes an upper cover plate and a lower cover plate. Each of the functional mechanisms further includes:

[0026] A mold clamping device installed at the mold clamping station for clamping the upper cover plate and the lower cover plate of the test base.

[0027] Optionally, each of the conveying mechanisms further includes a replacement station. Each of the functional mechanisms further includes:

[0028] A replacement device installed at the replacement station for replacing the test base.

[0029] Optionally, at least one of the conveying mechanisms includes a first conveying mechanism and a second conveying mechanism, and at least one functional mechanism includes a first functional mechanism and a second functional mechanism; wherein the first functional mechanism is correspondingly arranged with the first conveying mechanism, and the test device of the first functional mechanism is used for performing a high-temperature test on the chip under test; the second functional mechanism is correspondingly arranged with the second conveying mechanism, and the test device of the second functional mechanism is used for performing a normal-temperature test on the chip under test;

[0030] The test equipment further includes:

[0031] A transfer mechanism disposed between the first conveying mechanism and the second conveying mechanism and configured to controllably transfer the chip under test at the unloading station of the first conveying mechanism to the loading station of the second conveying mechanism.

[0032] Optionally, the first conveying mechanism and the second conveying mechanism are arranged along a first direction, the loading mechanism and the test device of the first functional mechanism are respectively arranged on both sides of the first conveying mechanism along a second direction, the unloading mechanism and the test device of the second functional mechanism are respectively arranged on both sides of the second conveying mechanism along the second direction, and the first direction is perpendicular to the second direction.

[0033] In the present invention, the test equipment includes a loading mechanism, at least one conveying mechanism, at least one functional mechanism, and an unloading mechanism. The loading mechanism and the unloading mechanism are respectively used for loading and unloading. Each conveying mechanism includes a ring linear motor and a plurality of test fixtures mounted on the ring linear motor. The ring linear motor has a loading station, at least one unloading station, and at least one test station. Each test fixture is controlled to move between the loading station, the test station, and the unloading station. The functional mechanism includes a test device corresponding to the test station. The test device is configured to perform a functional test on the chip under test when the test fixture moves to the test station. The above technical solution adopts the method of driving a plurality of test fixtures to move by a ring linear motor. Each test fixture is independent and can move synchronously or individually. Compared with the method that all test fixtures on the turntable can only move synchronously, the ring linear motor is more flexible. In addition, there is a straight section on the ring linear motor, which is more conducive to arranging test stations and can be better expanded, with good expandability.

[0034] Further, in the present invention, the unloading mechanism includes a second turret and at least one set of unloading components. The second turret includes a second turntable and a plurality of second suction attachments arranged at intervals along the circumference of the second turntable. The unloading components are installed beside the second turret. The second turntable is controlled to rotate to drive the target second suction attachment among the plurality of second suction attachments to move to the unloading station, so that the target second suction attachment adsorbs the chip under test that has completed the test in the test fixture and transports it to the target unloading component among at least one set of unloading components. The above technical solution replaces the loading method of the linear axis system with a turret to match the test speed of the ring linear motor. The time for the linear axis system to pick and place materials is the sum of the picking time, the axis movement time, and the placing time. The turret can perform the picking and placing actions synchronously. Compared with the linear axis system for picking and placing materials, the picking rhythm can be greatly improved, thereby improving the loading speed.

[0035] From the following detailed description of specific embodiments of the present invention in conjunction with the drawings, those skilled in the art will become more clearly aware of the above and other objects, advantages, and features of the present invention. Brief Description of the Drawings

[0036] Hereinafter, some specific embodiments of the present invention will be described in detail with reference to the drawings in an exemplary but non-limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0037] Figure 1 is a schematic structural diagram of a chip test device according to an embodiment of the present invention;

[0038] Figure 2 is a schematic structural diagram of a ring linear motor according to an embodiment of the present invention;

[0039] Figure 3 is a schematic structural diagram of a conveying mechanism according to an embodiment of the present invention;

[0040] Figure 4 is a schematic structural diagram of a conveying mechanism according to another embodiment of the present invention;

[0041] Figure 5 is a schematic structural diagram of a loading mechanism according to an embodiment of the present invention;

[0042] Figure 6 is a schematic structural diagram of a first turret according to an embodiment of the present invention;

[0043] Figure 7 is a schematic structural diagram of an unloading mechanism according to an embodiment of the present invention;

[0044] Figure 8 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present invention;

[0045] Figure 9 is a schematic structural diagram of a deviation rectifying device according to an embodiment of the present invention;

[0046] Figure 10 is a schematic structural diagram of a mold clamping device according to an embodiment of the present invention;

[0047] Figure 11 is a schematic structural diagram of a test fixture located at a test station according to an embodiment of the present invention;

[0048] Figure 12 is a schematic structural diagram of a cleaning device and a mold opening device according to an embodiment of the present invention;

[0049] Figure 13 is a schematic structural diagram of a replacement device according to an embodiment of the present invention.

[0050] Reference numerals:

[0051] 100-test equipment, 10-feeding mechanism, 20-conveying mechanism, 30-functional mechanism, 40-unloading mechanism, 50-transfer mechanism, 11-feeding assembly, 12-first turret, 13-first XY axis moving module, 14-second XY axis moving module, 121-first turntable, 122-first adsorption member, 21-annular linear motor, 22-test fixture, 23-electrical connector, 24-electrical assembly, 2 11-loading station, 212-correction station, 213-mold closing station, 214-replacement station, 215-testing station, 216-cleaning station, 217-unloading station, 218-probe detection station, 219-mold opening station, 221-upper cover, 222-lower cover, 223-transfer probe, 224-buckle, 225-quick change assembly, 226-floating assembly, 227-elastic part, 228-flow guide module, 31-test device, 311-driving mechanism, 312-PCB board, 32-probe detection device, 33-replacing device, 331-gripper, 332-XYZ axis moving module, 333-platform, 34-cleaning device, 341-fourth adsorption member, 35-mold opening device, 351-convex rod, 352-third driving member, 36-accommodating box, 37-correction device, 371-first driving member, 372- The second driving member, 373-connecting assembly, 374-third XY axis moving module, 375-third adsorption member, 38-mold clamping device, 381-cam member, 382-arc surface, 383-down-pressing structure, 384-pressing block, 41-second turret, 411-second turntable, 412-second adsorption member, 42-NG unloading structure, 43-unloading assembly, 51-rotating motor, 52-rotating table, 53-adsorption assembly. DETAILED DESCRIPTION

[0052] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0053] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0054] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0055] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features, that is, include one or more of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined. When a certain feature "includes or contains" a certain or certain features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0056] Unless otherwise clearly specified and defined, terms such as "connection" and "installation" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art should be able to understand the specific meanings of the above terms in the present invention according to specific circumstances.

[0057] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0058] Figure 1 is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present invention. Figure 2 is a schematic structural diagram of a ring linear motor 21 according to an embodiment of the present invention. Figure 3 is a schematic structural diagram of a conveying mechanism 20 according to an embodiment of the present invention. Figure 4 is a schematic structural diagram of the conveying mechanism 20 according to another embodiment of the present invention. As Figures 1 to 4As shown, in a specific embodiment, a test device 100 for a chip includes a loading mechanism 10, at least one conveying mechanism 20, at least one functional mechanism 30, and a unloading mechanism 40. The loading mechanism 10 is used to load the chips to be tested. Each conveying mechanism 20 includes a ring linear motor 21 and a plurality of test fixtures 22 mounted on the ring linear motor 21. The ring linear motor 21 has a loading station 211, at least one unloading station 217, and at least one test station 215. Each test fixture 22 moves independently between the loading station 211, the test station 215, and the unloading station 217, and the test fixture 22 is configured to receive the chips to be tested at the loading station 211. Each functional mechanism 30 corresponds to a conveying mechanism 20, and each functional mechanism 30 includes a test device 31 corresponding to the test station 215. The test device 31 is configured to perform a functional test on the chips to be tested when the test fixture 22 moves to the test station 215. The unloading mechanism 40 is arranged on one side of the unloading station 217 and is configured to unload the chips to be tested that have completed the functional test when the test fixture 22 moves to the unloading station 217. Here, each test fixture 22 can move along the ring linear motor 21 individually or synchronously. When the test fixture 22 moves to the loading station 211, the loading mechanism 10 places the chips to be tested on the test fixture 22 to complete the loading of the chips to be tested. Then the test fixture 22 moves along the ring linear motor 21 to the test station 215, so that the test device 31 tests the chips to be tested in the test fixture 22. After the chips to be tested are completed, the test fixture 22 continues to move along the ring linear motor 21 to the unloading station 217 for unloading the chips to be tested.

[0059] This embodiment adopts the method of driving a plurality of test fixtures 22 to move by the ring linear motor 21. Each test fixture 22 is independent and can move synchronously or individually. Compared with the method that all the test fixtures 22 on the turntable can only move synchronously, the ring linear motor 21 is more flexible. In addition, there are straight sections on the ring linear motor 21, which are more conducive to arranging the test stations 215 and can be better expanded, with good scalability.

[0060] In some embodiments, the ring linear motor 21 can be oval, as shown in Figure 3 , or square, as shown in Figure 4 , and can be specifically designed according to design requirements.

[0061] In some embodiments, the conveying mechanism 20 further includes an electrical component 24 and a plurality of electrical connectors 23. The electrical component 24 is arranged on the top of the ring linear motor 21. One end of each electrical connector 23 is connected to the electrical component 24, and the other end is connected to the test fixture 22, so that the electrical component 24 supplies power and gas to each test fixture 22.

[0062] In some embodiments, two test fixtures 22 move together as a whole, and each test fixture 22 houses a chip under test, so that two chips under test can be tested simultaneously, thereby improving the test efficiency.

[0063] In some embodiments, the number of test stations 215 of each ring linear motor 21 is three. The three test stations 215 perform different functional tests on the chips under test. Therefore, after the chip under test in the test fixture 22 completes the test at the previous test station 215, it still needs to move to the next test station 215 for the next test.

[0064] Figure 5 is a schematic structural diagram of the loading mechanism 10 according to an embodiment of the present invention. Figure 6 is a schematic structural diagram of the first turret 12 according to an embodiment of the present invention. As Figure 5 and Figure 6 shown, in some embodiments, the loading mechanism 10 includes a first turret 12 and at least one set of loading components 11. The first turret 12 includes a first turntable 121 and a plurality of first suction members 122 arranged at intervals along the circumferential side of the first turntable 121. The loading components 11 are installed beside the first turret 12. The first turntable 121 rotates controllably to drive the target first suction member 122 among the plurality of first suction members 122 to move to the target loading component 11 in at least one set of loading components 11, so that the target first suction member 122 sucks the chip under test on the target loading component 11 and transports the chip under test.

[0065] The common test equipment 100 on the market at present is mainly a linear KGD test system, which uses linear motion modules such as linear motors to carry out loading and unloading of chips. The current main features of the linear KGD test system are: good expandability of test stations, support for dual-Die testing, but limited by the speed of the linear motor moving parts for picking and placing materials, the picking and placing cycle is generally no more than 2 s / pcs. Without considering the test time and calculating according to dual-Die, the limit UPH (units per hour) ≤ 3600 pcs / h.

[0066] In this embodiment, in order to match the test speed of the ring linear motor 21, a turret is used instead of the loading method of the linear axis system. The time for picking and placing materials of the linear axis system is the sum of the picking time, the axis movement time, and the placing time. The turret can synchronize the picking and placing actions. Compared with the picking and placing of the linear axis system, the picking cycle can be greatly improved, thereby improving the loading speed.

[0067] In some embodiments, the number of the loading components 11 is three groups, and each group of loading components 11 is respectively used for loading the DUT chips with different packaging methods. Among them, one group of loading components 11 is used for loading the tray carrying the DUT chips. One group of loading components 11 is used for loading the wafer with the DUT chips. The remaining group of loading components 11 is used for loading the tape of the reel-type chip feeder, and the tape has the DUT chips. It can be understood that the testing device 100 of this embodiment can meet the loading requirements of the DUT chips with three different packaging methods.

[0068] Specifically, the three groups of loading components 11 are arranged along the Y-axis direction and are all arranged in parallel. The loading component 11 for loading the tape of the reel-type chip feeder is arranged between the other two loading components 11. In other embodiments, the positions of the three groups of loading components 11 can also be determined according to specific design requirements. In addition, since the first turntable 121 drives the first suction member 122 to move in a circular shape, the three loading positions of the three groups of loading components 11 are respectively arranged at three equal division points of the circle, and the loading station 211 is located at the remaining equal division point. That is to say, the loading positions of the three groups of loading components 11 and the loading station 211 are respectively located at the four equal division points of the first turntable 121 and are arranged at 90° respectively.

[0069] In some embodiments, due to the particularity of the wafer and tray loading, during loading, there are multiple DUT chips on the entire wafer, and there are also multiple DUT chips on the entire tray. When each first suction member 122 performs loading, the position where it reaches the same loading component 11 is fixed. Therefore, it is necessary to design the tray carrying the DUT chips and the wafer carrying the DUT chips to be movable, so that when the previous DUT chip is taken away, the next DUT chip can be moved to the corresponding loading position through its own movement. Therefore, this embodiment is provided with a first XY-axis moving module 13 and a second XY-axis moving module 14. Among them, the first XY-axis moving module 13 is connected to the carrier of the wafer, so as to controllably drive the wafer to move along the X-axis and Y-axis directions. The second XY-axis moving module 14 is connected to the tray, so as to controllably drive the tray to move along the X-axis and Y-axis directions.

[0070] Figure 7 It is a schematic structural diagram of a blanking mechanism 40 according to an embodiment of the present invention. As Figure 7 shown, and refer to Figure 5, the blanking mechanism 40 includes a second turret 41 and at least one set of blanking components 43. The second turret 41 includes a second turntable 411 and a plurality of second suction attachments 412 arranged at intervals along the circumferential side of the second turntable 411. The blanking components 43 are installed beside the second turret 41. The second turntable 411 rotates controllably to drive the target second suction attachment 412 among the plurality of second suction attachments 412 to move to the blanking station 217, so that the target second suction attachment 412 adsorbs the tested chip completed in the test fixture 22 and transports it to the target blanking component 43 among at least one set of blanking components 43.

[0071] In this embodiment, not only does the loading mechanism 10 use a turret to replace the loading method of a linear shaft system, but the blanking mechanism 40 also uses a turret to replace the blanking method of a linear shaft system, which can improve the blanking cycle and increase the blanking speed.

[0072] In this embodiment, the number of the blanking components 43 is one set, and one set of blanking components 43 is used to convey the wafer with the tested chip completed for blanking. In other embodiments, the number of the blanking components 43 can also be set to two sets. The other set can be the blanking method of a tray, and this tray is used to blank the normal tested chips after the test. When adding the tray blanking method, the blanking component 43 of the tray is arranged at Figure 1 the rightmost position, which is equivalent to being arranged along the X-axis direction with the conveying mechanism 20.

[0073] In some embodiments, referring to Figure 7 , an NG blanking structure 42 is provided at the second turret 41 for blanking the tested chips with poor test results, and a tray is used for blanking.

[0074] Figure 8 is a schematic structural diagram of a transfer mechanism 50 according to an embodiment of the present invention. As Figure 8 shown, and referring to Figure 1 , in some embodiments, at least one conveying mechanism 20 includes a first conveying mechanism and a second conveying mechanism, and at least one functional mechanism 30 includes a first functional mechanism and a second functional mechanism; wherein the first functional mechanism is correspondingly arranged with the first conveying mechanism, and the testing device 31 of the first functional mechanism is used to perform a high-temperature test on the tested chip; the second functional mechanism is correspondingly arranged with the second conveying mechanism, and the testing device 31 of the second functional mechanism is used to perform a normal-temperature test on the tested chip. Here, the first conveying mechanism is Figure 1 the left conveying mechanism 20 in Figure 1 , and the second conveying mechanism is

[0075] The test device 100 further includes a transfer mechanism 50. The transfer mechanism 50 is disposed between the first conveying mechanism and the second conveying mechanism, and is configured to controllably transfer the chip under test at the discharging station 217 of the first conveying mechanism to the loading station 211 of the second conveying mechanism. It can be understood that the test device 100 of this embodiment can not only perform normal temperature testing on the chip under test, but also perform high temperature testing on the chip under test. Refer to Figure 1 , the test device 31 on the left is for high temperature testing, and the test device 31 on the right is for normal temperature testing.

[0076] In some embodiments, the rotation directions of the first conveying mechanism and the second conveying mechanism are the same. In other embodiments, the rotation directions of the first conveying mechanism and the second conveying mechanism can also be set to be different, which is specifically determined according to the design requirements.

[0077] In other embodiments, the number of the conveying mechanisms 20 and the number of the functional mechanisms 30 can also be determined according to the specific design requirements.

[0078] In some embodiments, the transfer mechanism 50 includes a rotating motor 51 and a rotating table 52 connected to the rotating motor 51. There are two groups of adsorption components 53 arranged at 180° on the rotating table 52. After one group of adsorption components 53 adsorbs the chip under test at the discharging station 217 of the first conveying mechanism, the rotating motor 51 drives the rotating table 52 to rotate 180°, so as to move the chip under test on the first conveying mechanism to the loading station 211 of the second conveying mechanism, thereby realizing the transfer of the chip under test between the first conveying mechanism and the second conveying mechanism. Here, each group of adsorption components 53 includes two suction nozzles, so that two chips under test in two test fixtures 22 can be adsorbed simultaneously, and the transfer of two chips under test can be carried out simultaneously, which can improve the transfer efficiency.

[0079] In some embodiments, the first conveying mechanism and the second conveying mechanism are arranged along a first direction, the loading mechanism 10 and the test device 31 of the first functional mechanism are respectively arranged on both sides of the first conveying mechanism along a second direction, the unloading mechanism 40 and the test device 31 of the second functional mechanism are respectively arranged on both sides of the second conveying mechanism along the second direction, and the first direction is perpendicular to the second direction. Here, the first direction is the X-axis direction, and the second direction is the Y-axis direction. It can be understood that the entire test device 100 is arranged in a square shape.

[0080] In some embodiments, the loading mechanism 10 and the unloading mechanism 40 are arranged along the X-axis direction, and the test devices 31 of the first functional mechanism and the second functional mechanism are arranged along the X-axis direction. In other embodiments, the overall layout of the test device 100 can also be determined according to the specific design requirements.

[0081] Figure 9 is a schematic structural diagram of a deviation correction device 37 according to an embodiment of the present invention. AsFigure 9 as shown, and referring to Figure 2 , in some embodiments, each conveying mechanism 20 further includes a rectifying station 212 located downstream of the loading station 211. Each functional mechanism 30 further includes a rectifying device 37 installed at the rectifying station 212 for adjusting the position of the chip under test in the test fixture 22. That is, when the test fixture 22 finishes loading the chip under test at the loading station 211, the test fixture 22 moves to the rectifying station 212, and the rectifying device 37 adjusts the position of the chip under test.

[0082] In some embodiments, the rectifying device 37 includes a third adsorbing member 375, a first driving member 371, a connecting component 373, and a second driving member 372. The third adsorbing member 375 is used to adsorb the chip under test on the test fixture 22. The third adsorbing member 375 and the first driving member 371 are arranged at an interval in the vertical direction. The first driving member 371 is connected to the third adsorbing member 375 through the connecting component 373. The first driving member 371 drives the connecting component 373 to drive the third adsorbing member 375 to rotate, thereby realizing the angle adjustment of the chip under test. Here, the connecting component 373 can be a structure of a synchronous belt and a synchronous pulley. In addition, the rectifying device 37 further includes a third XY-axis moving module 374 for driving the third adsorbing member 375 to move along the X-axis and Y-axis directions to adjust the position of the chip under test. The second driving member 372 is arranged above the third adsorbing member 375 for driving the third adsorbing member 375 to move along the Z-axis direction. The second driving member 372 first drives the third adsorbing member 375 to move downward so that the third adsorbing member 375 adsorbs the chip under test on the test fixture 22, and then drives the third adsorbing member 375 to move upward, using the first driving member 371 to drive the third adsorbing member 375 to rotate, thereby adjusting the angle of the third adsorbing member 375. After the angle adjustment is completed, the second adsorbing member 412 controls the third adsorbing member 375 to move downward again so that the third adsorbing member 375 places the chip under test with the adjusted position back on the test fixture 22.

[0083] This embodiment is equivalent to making the first driving member 371 and the third adsorbing member 375 into a split type, and then driving the third adsorbing member 375 to move up and down through the second driving member 372. The second driving member 372 does not need to drive the first driving member 371 to move up and down, thereby reducing the burden on the second driving member 372. On the basis of being able to realize the rotational adjustment of the third adsorbing member 375, the driving accuracy of the second driving member 372 can be improved, accurately controlling the moving distance of the third adsorbing member 375 and avoiding damaging the chip.

[0084] Figure 10 is a schematic structural diagram of a mold closing device 38 according to an embodiment of the present invention. As Figure 10 shown, and referring toFigure 2 , each conveying mechanism 20 further includes a mold clamping station 213, the mold clamping station 213 is arranged downstream of the loading station 211, the test fixture 22 includes a test base, the test base includes an upper cover plate 221 and a lower cover plate 222, each functional mechanism 30 further includes a mold clamping device 38, the mold clamping device 38 is installed at the mold clamping station 213 and is used to clamp the upper cover plate 221 and the lower cover plate 222 of the test base. It can be understood that the test base of this embodiment includes an upper cover plate 221 and a lower cover plate 222 that are rotatably connected. When the test base is at the loading station 211 and the rectifying station 212, the upper cover plate 221 is in an open state. However, during testing, the upper cover plate 221 needs to be closed with the lower cover plate 222, that is, in a closed state, to perform the test. Therefore, a device capable of clamping the upper cover plate 221 and the lower cover plate 222 needs to be designed.

[0085] In some embodiments, the mold clamping device 38 includes a cam member 381 and a downward pressing structure 383. The cam member 381 has an arc surface 382. The downward pressing structure 383 includes at least one pressing block 384. The number of pressing blocks 384 is the same as the number of test fixtures 22 and is arranged in one-to-one correspondence. When the test fixture 22 moves to the mold clamping station 213, the side of the upper cover plate 221 of the test base away from the lower cover plate 222 will abut against the arc surface 382 of the cam member 381. As the test fixture 22 continues to rotate following the annular linear motor 21, the upper cover plate 221 will move along the arc surface 382, thereby rotating in the direction closer to the lower cover plate 222. When the upper cover plate 221 moves away from the arc surface 382, there is only a small gap between the upper cover plate 221 and the lower cover plate 222. In order to make the upper cover plate 221 and the lower cover plate 222 better clamped, the downward pressing structure 383 can be used to press down, so that the pressing block 384 abuts against the upper cover plate 221, thereby driving the upper cover plate 221 to continue rotating until it is closed with the lower cover plate 222.

[0086] Figure 11 is a schematic structural diagram of the test fixture 22 located at the test station 215 according to an embodiment of the present invention. As Figure 11 shown, in some specific embodiments, the test device 31 includes a test machine and at least one driving mechanism 311. Each driving mechanism 311 corresponds to a test station 215. The test machine includes a PCB board 312. The test fixture 22 further includes a transfer probe 223, and the transfer probe 223 is installed on the PCB board 312. The driving mechanism 311 is arranged above the corresponding test station 215. A flow guiding module 228 is installed in the lower cover plate 222 of the test base, and the flow guiding module 228 penetrates through the lower cover plate 222. When the test fixture 22 moves to the test station 215, the driving mechanism 311 drives the test base to move downward, so that the flow guiding module 228 contacts the transfer probe 223, thereby electrically connecting the test base to the test machine.

[0087] In this embodiment, the way that the diversion module 228 contacts the transfer probe 223 is adopted, which effectively shortens the circuit length during chip testing, reduces the stray inductance in the test loop, and improves the chip testing performance.

[0088] In some embodiments, the test fixture 22 further includes a floating component 226. The floating component 226 is located below the lower cover plate 222 and is detachably connected to the lower cover plate 222. The floating component 226 is configured to expand and contract along the moving direction of the test base. Under the action of the floating component 226, the test base can move up and down more smoothly.

[0089] In some embodiments, the floating component 226 includes at least one elastic member 227 arranged vertically. The elastic member 227 is configured to drive the test base to reset when the external force applied to the test base is removed. That is to say, when the tested chip is completed, the test base is automatically reset through the elastic member 227, so that the test base is separated from the transfer probe 223 and can move to the next working station.

[0090] In some embodiments, the test fixture 22 further includes a quick-change component 225. The quick-change component 225 includes a first quick-change part installed at the bottom of the test base and a second quick-change part installed at the top of the floating component 226. The first quick-change part and the second quick-change part have a connected state that cooperates with each other and a separated state that separates from each other. In this embodiment, by installing the quick-change component 225 between the floating component 226 and the test base, the rapid replacement requirement caused by the damage of the test base due to die explosion during the test process can be met, the replacement efficiency and convenience of the test base can be improved, and the on-line processing time when the test base is abnormal can be shortened. And according to different chip designs, the test base can be disassembled and assembled as a whole, which is convenient for model change. Usually, for the damage recovery of the test base caused by testing, operations such as confirming the state of the test base, grinding and cleaning the carrier, and replacing the test probe need to be performed. Even if manually replacing the offline spare parts, it takes at least about 10 minutes. The test base of this embodiment can automatically replace the entire test base, and the replacement time is within 1 minute, greatly reducing the replacement time.

[0091] In some embodiments, the quick-change component 225 can be unlocked and locked by compressed air, which is convenient for the rapid replacement requirement of the test base in case of abnormality.

[0092] Figure 12 It is a schematic structural diagram of a cleaning device 34 and a mold opening device 35 according to an embodiment of the present invention. As Figure 12 shown, and referring to Figure 2 , in some embodiments, each conveying mechanism 20 further includes a mold opening device 35. The mold opening device 35 is arranged at the mold opening station 219.

[0093] In some embodiments, the lower cover plate 222 of the test socket is provided with a buckle 224 for engaging with the upper cover plate 221, thereby realizing the mold clamping of the upper cover plate 221 and the lower cover plate 222. The mold opening device 35 includes a third driving member 352 and at least one convex rod 351. Each convex rod 351 corresponds to a test fixture 22. When the test fixture 22 moves to the mold opening station 219, the third driving member 352 of the mold opening device 35 drives the convex rod 351 to extend, abuts against the buckle 224 of the corresponding test socket, and applies an external force to the buckle 224, so that the buckle 224 is disengaged from the upper cover plate 221, and the upper cover plate 221 is opened, realizing the mold opening of the test socket.

[0094] In some embodiments, each conveying mechanism 20 further includes a cleaning station 216, which is arranged between the test station 215 and the blanking station 217, specifically, between the mold opening station 219 and the blanking station 217. Each functional mechanism 30 further includes a cleaning device 34, which is installed at the cleaning station 216 for cleaning the test fixture 22. Here, mainly for the situation where the measured chip may explode after the test is completed, the cleaning device 34 needs to clean the exploded measured chip on the test fixture 22. If there is no situation of die explosion, the cleaning device 34 does not need to clean the test socket, and the test socket directly moves to the blanking station 217.

[0095] In some embodiments, the cleaning device 34 includes at least one fourth adsorbing member 341 and a receiving box 36 for placing the exploded measured chip. After the test socket of the test fixture 22 is mold-opened, the fourth adsorbing member 341 adsorbs the exploded measured chip and places it in the receiving box 36, thereby realizing the cleaning of the test socket.

[0096] Figure 13 It is a schematic structural diagram of the replacement device 33 according to an embodiment of the present invention. As Figure 13 shown, and referring to Figure 2 , each conveying mechanism 20 further includes a replacement station 214, and each functional mechanism 30 further includes a replacement device 33, which is installed at the replacement station 214 for replacing the test socket. In this embodiment, the replacement station 214 is arranged between the mold clamping station 213 and the test station 215. In other embodiments, the replacement station 214 can also be arranged at other positions, which is specifically determined according to the design requirements.

[0097] In some embodiments, the replacement device 33 includes an XYZ-axis movement module 332, a gripper 331, and a platform 333 for placing the test socket. Driven by the XYZ-axis movement module 332, the gripper 331 grabs the test socket on the replacement station 214 and places the test socket on the platform 333, then grabs a new test socket on the platform 333 and returns it to the replacement station 214, thereby realizing the replacement of the test socket.

[0098] See Figure 2 and Figure 3 , in some embodiments, each conveying mechanism 20 further includes a probe detection station 218, and the probe detection station 218 is arranged between the unloading station 217 and the loading station 211. Each functional mechanism 30 further includes a probe detection device 32. When the test fixture 22 moves to the probe detection station 218, the probe detection device 32 detects the test probes on the test socket. If it is found that there are problems with the test probes, affecting the normal use of the test socket, then the test socket will directly move to the replacement station 214, and the replacement device 33 is used to replace the test socket. If there are no problems with the test probes, then the test socket will move to the loading station 211 for loading the chip under test and be recycled.

[0099] In this embodiment, when high-temperature and normal-temperature tests need to be performed on the chip under test, the chip under test is loaded from the loading station 211 of the first conveying mechanism, that is, loaded by using the first turret 12. After the loading is completed, the first conveying mechanism sequentially transports the chip under test to the alignment station 212, the mold clamping station 213, the test station 215, the mold opening station 219, the cleaning station 216, and the unloading station 217, and enables the test device 31 of the first functional mechanism to perform a high-temperature test on the chip under test. After the high-temperature test is completed, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. Then, the second conveying mechanism sequentially transports the test fixture 22 to the alignment station 212, the mold clamping station 213, the test station 215, the mold opening station 219, the cleaning station 216, and the unloading station 217, and enables the test device 31 of the second functional mechanism to perform a normal-temperature test on the chip under test. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thereby completing the test.

[0100] When only high-temperature testing of the chip under test is required, the chip under test is loaded at the loading station 211 of the first conveying mechanism, that is, loaded by using the first turret 12. After the loading is completed, the first conveying mechanism sequentially transports the chip under test to the alignment station 212, the mold closing station 213, the testing station 215, the mold opening station 219, the cleaning station 216 and the unloading station 217, and enables the testing device 31 of the first functional mechanism to perform high-temperature testing on the chip under test. After the high-temperature testing is completed, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. The test fixture 22 directly moves along the circular linear motor 21 of the second conveying mechanism to the unloading station 217 for unloading, and no normal-temperature testing is required. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thus completing the testing.

[0101] When only normal-temperature testing of the chip under test is required, the chip under test is loaded at the loading station 211 of the first conveying mechanism, that is, loaded by using the first turret 12. The test fixture 22 directly moves along the circular linear motor 21 of the first conveying mechanism to the unloading station 217, and no high-temperature testing is required. Then, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. Then, the second conveying mechanism sequentially transports the test fixture 22 to the alignment station 212, the mold closing station 213, the testing station 215, the mold opening station 219, the cleaning station 216 and the unloading station 217, and enables the testing device 31 of the second functional mechanism to perform normal-temperature testing on the chip under test. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thus completing the testing.

[0102] At this point, those skilled in the art should recognize that although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and determined to cover all these other variations or modifications.

Claims

1. A chip testing device, characterized in that: include: A loading mechanism, used for loading the chip under test; At least one conveying mechanism, each of the conveying mechanisms comprises an annular linear motor and a plurality of test fixtures mounted on the annular linear motor, the annular linear motor has a loading station, at least one unloading station and at least one testing station, each of the test fixtures is independently controlled to move between the loading station, the testing station and the unloading station, and the test fixture is configured to receive the chip under test at the loading station; At least one functional mechanism, each of which corresponds to one of the conveying mechanisms, each of which comprises a testing device arranged corresponding to the testing station, the testing device being arranged to perform a functional test on the chip under test when the testing fixture moves to the testing station; The unloading mechanism is arranged at one side of the unloading station and is configured to unload the chip under test that has completed the functional test when the test fixture moves to the unloading station.

2. The test device according to claim 1, characterized in that The feeding mechanism comprises: The first rotating tower comprises a first rotating disk and a plurality of first adsorption members arranged at intervals along the circumference of the first rotating disk. At least one group of loading components is installed on the side of the first turret, and the first turntable rotates in a controlled manner to drive a target first adsorption member among the multiple first adsorption members to move to a target loading component in at least one group of the loading components, so that the target first adsorption member absorbs the chip to be tested on the target loading component and transports the chip to be tested.

3. The testing device according to claim 2, characterized in that The number of the loading components is three, and each group of the loading components is used to load the chips under test in different packaging methods; Among them, a set of loading components is used to load the tray carrying the chip under test; A set of loading components is used to transport the wafer with the chip under test for loading; The remaining group of the loading components is used to convey the tape of the roll chip feeder for loading, and the tape has the chip to be tested.

4. The test device according to any one of claims 1 to 3, characterized in that: The unloading mechanism comprises: A second rotating tower, comprising a second rotating disk and a plurality of second adsorption members arranged at intervals along a circumference of the second rotating disk; At least one group of unloading components is installed on the side of the second turret, and the second turntable rotates in a controlled manner to drive a target second adsorption member among the plurality of second adsorption members to move to the unloading station, so that the target second adsorption member adsorbs the tested chip in the test fixture and transports it to the target unloading component in at least one group of the unloading components.

5. The testing device according to claim 4, characterized in that Each of the conveying mechanisms further includes a cleaning station, which is arranged between the testing station and the unloading station, and each of the functional mechanisms further includes: A cleaning device is installed at the cleaning station and is used to clean the test fixture.

6. The testing device according to any one of claims 1 to 3, characterized in that: Each of the conveying mechanisms further includes a deviation correction station, which is located downstream of the feeding station, and each of the functional mechanisms further includes: A deflection correction device is installed at the deflection correction station and is used to adjust the position of the chip under test in the test fixture.

7. The testing device according to any one of claims 1 to 3, characterized in that: Each of the conveying mechanisms further includes a mold clamping station, which is arranged downstream of the loading station. The test fixture includes a test seat, which includes an upper cover plate and a lower cover plate. Each of the functional mechanisms further includes: A mold clamping device is installed at the mold clamping station and is used to clamp the upper cover plate and the lower cover plate of the test seat.

8. The testing device according to any one of claims 1 to 3, characterized in that: Each of the conveying mechanisms further includes a replacement station, and each of the functional mechanisms further includes: A replacement device is installed at the replacement station and is used to replace the test socket.

9. The testing device according to any one of claims 1 to 3, characterized in that: At least one of the conveying mechanisms includes a first conveying mechanism and a second conveying mechanism, and at least one of the functional mechanisms includes a first functional mechanism and a second functional mechanism; wherein the first functional mechanism is arranged corresponding to the first conveying mechanism, and the test device of the first functional mechanism is used to perform a high temperature test on the chip under test; the second functional mechanism is arranged corresponding to the second conveying mechanism, and the test device of the second functional mechanism is used to perform a normal temperature test on the chip under test; The testing equipment also includes: The transfer mechanism is arranged between the first conveying mechanism and the second conveying mechanism, and is arranged to controllably transport the chip under test at the unloading station of the first conveying mechanism to the loading station of the second conveying mechanism.

10. The testing device according to claim 9, characterized in that The first conveying mechanism and the second conveying mechanism are arranged along a first direction, the loading mechanism and the testing device of the first functional mechanism are respectively arranged on both sides of the first conveying mechanism along a second direction, the unloading mechanism and the testing device of the second functional mechanism are respectively arranged on both sides of the second conveying mechanism along the second direction, and the first direction is perpendicular to the second direction.

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