Light modulation plate, manufacturing method thereof and X-ray correlated imaging equipment

Abstract

The invention is suitable for the technical field of optics, and particularly relates to a light modulation plate, a manufacturing method thereof and X-ray correlated imaging equipment, and the manufacturing method comprises the following steps: determining a minimum structural unit according to the size parameter of each modulation unit in a modulation pattern; dividing each modulation unit into a series of modulation unit structures formed by the minimum structural units according to the size parameters of the minimum structural units; correcting each divided minimum structure unit to manufacture a sample plate; and etching the modulation pattern on the substrate by referring to the sample plate to obtain the light modulation plate. According to the manufacturing method of the light modulation plate provided by the invention, the modulation pattern is corrected, and a large-size structure in the modulation pattern is changed into a series of disconnected small-size structures, so that the whole light modulation plate can be etched at the same speed, and the deviation between each modulation unit and the modulation pattern is reduced to the minimum; a light modulation plate having a smaller difference from a designed modulation pattern can be obtained.

Description

Technical Field

[0001] The present invention belongs to the field of optical technology, and in particular relates to an optical modulation plate, a manufacturing method thereof, and an X-ray correlation imaging device. Background Art

[0002] X-rays can perform non-invasive imaging on objects and have extensive applications in fields such as industry and medicine. "Correlation imaging" is an imaging method based on the second-order coherence of the light field and using a single-pixel detector, also known as "ghost imaging" or "single-pixel imaging". Since an object can be imaged only with a single-pixel detector without spatial resolution ability, correlation imaging has a high signal-to-noise ratio of the obtained signal, a wide applicable wavelength range, and can reduce the number of measurements through special algorithms, and has great application potential in fields such as remote sensing and medicine. Therefore, X-ray correlation imaging combined with a correlation algorithm can reduce the radiation dose of X-rays while ensuring the imaging quality and reduce the requirements for the detector.

[0003] However, due to the manufacturing process, the etched pattern will have a large difference from the designed modulation pattern, and the modulation result of the X-ray modulation plate often has a large deviation from the designed modulation pattern, affecting the imaging quality; it is urgent to set up a new X-ray modulation plate. Summary of the Invention

[0004] An object of an embodiment of the present invention is to provide a manufacturing method of an optical modulation plate, aiming to solve the problem that the modulation effect of the existing X-ray modulation plate is affected by its manufacturing process, resulting in a large deviation between the imaging quality modulated by the X-ray modulation plate and the designed pattern.

[0005] The embodiment of the present invention is implemented as follows. A manufacturing method of an optical modulation plate, the manufacturing method includes the following steps:

[0006] Determine the minimum structural unit according to the size parameters of each modulation unit in the modulation pattern;

[0007] According to the size parameters of the minimum structural unit, divide each modulation unit into a series of modulation unit structures composed of the minimum structural unit;

[0008] Modify each divided minimum structural unit to make a template, where any two adjacent minimum structural units are not connected to each other;

[0009] Etch the modulation pattern on the substrate with reference to the template to obtain an optical modulation plate.

[0010] Preferably, the manufacturing method includes the following steps:

[0011] Determine the arrangement area of each modulation unit in the modulation pattern on the design drawing board;

[0012] Determine the minimum structural unit according to the size parameters of each modulation unit;

[0013] According to the size parameters of the minimum structural unit, divide each modulation unit into a series of modulation unit structures composed of the minimum structural unit;

[0014] Modify each divided minimum structural unit to make a template;

[0015] Etch the modulation pattern on the substrate with reference to the template to obtain an optical modulation plate.

[0016] Another object of the embodiments of the present invention is to provide an optical modulation plate, which is made by the manufacturing method of the optical modulation plate as described above. The optical modulation plate includes a substrate and a modulation pattern provided on the substrate. The modulation pattern includes a plurality of modulation units, and each of the modulation units is respectively arranged and composed of the same or different numbers of minimum structural units.

[0017] Another object of the embodiments of the present invention is to provide an X-ray correlation imaging device, which includes: an X-ray source, a detector, and the optical modulation plate as described above,

[0018] The X-ray source is used to emit X-rays to irradiate the object to be measured;

[0019] The detector is used to receive the transmitted light generated by the X-rays irradiating the object to be measured, and detect the received transmitted light;

[0020] The optical modulation plate is movably arranged on the optical path of the X-rays or the transmitted light, so that the optical modulation plate can move along the direction perpendicular to the optical path of the X-rays or the transmitted light, and is used to modulate the X-rays or the transmitted light.

[0021] The X-ray correlation imaging device applying the optical modulation plate in the embodiments of the present invention can ensure a high imaging quality through a simple structure, has low manufacturing process requirements and is relatively simple, thereby reducing the production cost.

[0022] The manufacturing method of an optical modulation plate provided by the embodiments of the present invention can modify the modulation pattern, change the large-size structure therein into a series of non-connected small-size structures, enable the entire optical modulation plate to be etched at the same speed, minimize the deviation between each modulation unit and the modulation pattern, have low requirements for the manufacturing process, and can obtain an optical modulation plate with a smaller difference from the designed modulation pattern under the same manufacturing process conditions, thereby achieving a higher imaging quality. Description of the Drawings

[0023] Figure 1 It is a flowchart of a manufacturing method of an optical modulation plate provided by an embodiment of the present invention;

[0024] Figure 2 Flow chart of another method for manufacturing a light modulation plate provided by an embodiment of the present invention;

[0025] Figure 3 Process step diagram of a manufacturing process of a light modulation plate provided by an embodiment of the present invention;

[0026] Figure 4 Comparison diagram of a first arrangement area and a second arrangement area in an embodiment of the present invention;

[0027] Figure 5 Comparison diagram of a light modulation plate and a modulation pattern in an embodiment;

[0028] Figure 6 Optical path schematic diagram of an X-ray correlation imaging provided by an embodiment of the present invention;

[0029] Figure 7 Another optical path schematic diagram of an X-ray correlation imaging provided by an embodiment of the present invention;

[0030] Figure 8 Process schematic diagram of obtaining a single-pixel detector value by irradiating an object to be measured with a modulated speckle in an embodiment of the present invention;

[0031] In the drawings: 100 - light modulation plate; 200 - object to be measured; 101 - X-ray source; 102 - detector. Detailed implementation manners

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0033] It can be understood that the terms "first", "second", etc. used in the present application may be used herein to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are only used to distinguish a first element from another element.

[0034] The following describes the specific implementation of the present invention in detail with reference to specific embodiments.

[0035] As shown in Figure 1 、 Figure 3 , a flow chart of a method for manufacturing a light modulation plate provided by an embodiment of the present invention includes:

[0036] S102: Determine a minimum structural unit according to the size parameters of each modulation unit in the modulation pattern;

[0037] S104: According to the size parameters of the minimum structural unit, divide each modulation unit into a series of modulation unit structures composed of the minimum structural units;

[0038] S106: Modify each of the divided minimum structural units to make a template, where any two adjacent minimum structural units are not connected to each other;

[0039] S108: Refer to the template to etch the modulation pattern on the substrate to obtain a light modulation plate.

[0040] In the embodiment of the present invention, when making a light modulation plate, by modifying the modulation pattern and modifying the large-size structure of the modulation unit therein into a series of non-connected small-size structures, the entire light modulation plate can be etched at the same speed, minimizing the deviation between each modulation unit and the modulation pattern. The light modulation plate 100 Figure 6 (shown) manufactured by this manufacturing method has lower requirements for the manufacturing process compared with conventional modulation devices. Under the same manufacturing process conditions, a light modulation plate with a smaller difference from the modulation pattern can be obtained, thereby achieving higher imaging quality and reducing the requirements for the detector.

[0041] In an example of this embodiment, as Figure 3 shown, the modulation pattern includes four modulation units, which are respectively denoted as the first unit, the second unit, the third unit, and the fourth unit, arranged in sequence from top to bottom. The first unit is a pattern of an entire white part, the second unit is a pattern of horizontal stripes at intervals, the third unit is a pattern of equally divided light and dark parts, and the fourth unit is a pattern of unequally divided light and dark parts. Of course, some of the units can be composed of different numbers of minimum structural units; the pattern sizes of individual units are the same, but the light transmittance for X-rays can be different. The minimum structural unit refers to the cell of the white part in the modulation unit. As Figure 3 shown, this cell is a square cell with equal length and width dimensions; in addition, the white part in the modulation unit indicates that light can pass through, and the black part in the modulation unit indicates light shielding to prevent light from passing through, so that light passing through the modulation unit can form light and dark modulation dark spots; the positions of the white part and the black part in each modulation unit are different, which also makes the formed modulation dark spots different, and a series of modulation dark spots that meet the design requirements can be generated and irradiated onto the object to be measured. The size parameters of each modulation unit refer to the size of the white part in each modulation unit, and the size parameters of the minimum structural unit are the size of the square cell. Obviously, when the modulation pattern includes other numbers of modulation units, the above arrangement and setting method can also be used for the layout of each modulation unit, and then each modulation unit can be modified. This embodiment is not limited thereto.

[0042] As Figure 3As shown, it is a process step diagram of a light modulation plate provided by an embodiment of the present invention; Figure 3 In [diagram], a represents the modulation pattern to be designed, b represents arranging each modulation unit of the modulation pattern in a certain order, c represents dividing each modulation unit into a series of modulation unit structures composed of the minimum structural unit according to the size parameters of the minimum structural unit; d represents correcting each divided minimum structural unit to make a template.

[0043] In one embodiment, due to the high penetrability of X-rays, only elements with high atomic numbers can absorb X-rays, such as iron, cobalt, nickel, copper, zinc, molybdenum, silver, cadmium, tin, tantalum, tungsten, platinum, gold, lead, etc. For different materials, corresponding etching methods can be adopted; the light modulation plate 100 is manufactured. Therefore, according to the different substrates, the methods used for etching can be graphic electroplating or ion beam etching, etc.

[0044] In an example of this embodiment, the material of the substrate can be copper material or gold material;

[0045] When using copper material to make the light modulation plate, the "graphic electroplating method" of a printed circuit board (PCB) can be used, that is, a board with copper foil attached to a plastic substrate. First, a layer of lead-tin resist layer is pre-plated on the part of the copper foil to be retained on the outer layer of the board (that is, the part that needs to absorb X-rays), and then the remaining copper foil is etched away chemically, thus forming a copper modulation plate with a modulation pattern, that is, the light modulation plate 100 is manufactured.

[0046] When using gold material to make the light modulation plate 100, the ion beam etching method can be used. Specifically, a board with gold foil grown on the substrate is used. Photoresist is coated on the board, and patterning is carried out using a photoresist. The part of the gold foil to be retained on the board is solidified, and the other parts of the photoresist are cleaned; then high-energy ions (such as argon ions) are used to bombard the board, so that the part of the gold foil not protected by the photoresist falls off from the board, thus forming a gold modulation plate with a modulation pattern, that is, the light modulation plate 100 is manufactured.

[0047] For the above two etching methods, as Figure 5 shown, where a represents the etched light modulation plate (basic size specification is 1 mm); b represents a certain modulation unit obtained by etching (basic size specification is 500 μm); c represents the designed modulation pattern corresponding to this modulation unit (basic size specification is 500 μm); since etching also occurs laterally while etching deep into the substrate material, the etched pattern will have a large difference from the designed modulation pattern, especially in the scenario where small-sized structures need to be etched, as Figure 3 shown;

[0048] In order to solve the problem that there is a large difference between the etched pattern and the designed modulation pattern, in another embodiment provided by the present invention, after step S104, a correction step S106 is added: correcting each divided minimum structural unit to make a template;

[0049] In this embodiment, the correction of each divided minimum structural unit includes: adding a border to each divided minimum structural unit so that any two adjacent minimum structural units are not connected to each other, as Figure 3 shown.

[0050] In this embodiment, the modulation pattern can be corrected, and the large-size structures constituting the modulation unit are changed to a series of non-connected small-size structures, which can make the sizes of the parts of the entire optical modulation plate that need to be etched consistent, etch at the same speed, and minimize the deviation between each modulation unit and the modulation pattern. It overcomes the problem that the conventional etching method will also etch laterally while etching deep into the material, resulting in a large difference between the etched pattern of the manufactured optical modulation plate and the designed modulation pattern, and the modulation result of the X-ray modulation plate often has a large deviation from the designed modulation pattern, thus affecting the imaging quality.

[0051] As Figure 2 shown, as a preferred embodiment of the present invention, the manufacturing method includes the following steps:

[0052] S202: Determine the arrangement area of each modulation unit in the modulation pattern on the design drawing board;

[0053] S204: Determine the minimum structural unit according to the size parameters of each modulation unit;

[0054] S206: Divide each modulation unit into a series of modulation unit structures composed of minimum structural units according to the size parameters of the minimum structural unit;

[0055] S208: Correct each divided minimum structural unit to make a template;

[0056] S210: Etch the modulation pattern on the substrate with reference to the template to obtain the optical modulation plate 100.

[0057] In this embodiment, compared with the previous embodiment, step S202 is added: thereby better arranging each modulation unit in the modulation pattern, making the light transmission amounts of local modulation unit sets in the overall modulation pattern tend to be approximate, and there will be no situation where the light transmission amounts differ greatly. It can also make the subsequent selection of the substrate be determined with reference to the specifications of the design drawing board, avoiding the mismatch between the substrate and the modulation pattern or causing waste of the substrate.

[0058] As Figure 4As shown, as a preferred embodiment of the present invention, the manufacturing method further includes: determining the arrangement areas of the modulation units in the modulation pattern on the design drawing board, where the arrangement areas include a first arrangement area A and a second arrangement area B, and the etching time of the modulation pattern in the first arrangement area A is the same as that of the modulation pattern in the second arrangement area B.

[0059] In this embodiment, by designing the arrangement areas on the design drawing board as the first arrangement area A and the second arrangement area B, on the one hand, when performing substrate etching, the design of the design drawing board can be referred to, which is convenient for positioning the substrate and selecting the starting and ending points of etching. On the other hand, it also enables the modulation units to be more evenly distributed on the substrate, making the structural strength of the substrate more uniform and preventing the center of gravity of the substrate from shifting excessively, which is not conducive to the movement of the optical modulation plate during modulation of speckle.

[0060] In an example of this embodiment, the number of white cells in the first arrangement area A is the same as the number of white cells in the second arrangement area B, so that double-gun etching can be used during photolithography etching, improving the production speed and not affecting the etching quality of each modulation unit, because the cells in each modulation unit are the same and the etching time required for each cell is the same.

[0061] As Figure 6 、 Figure 7 As shown, as another embodiment provided by the present invention, an optical modulation plate 100 is made by using the manufacturing method of the optical modulation plate described in any one of the above.

[0062] In this embodiment, the optical modulation plate 100 includes a substrate and a modulation pattern provided on the substrate. The modulation pattern includes a plurality of modulation units, and each of the modulation units is respectively arranged and composed of the same or different minimum structural units. When manufacturing the optical modulation plate 100, by correcting the modulation pattern and changing the large-size structure of the modulation unit therein to a series of non-connected small-size structures, the entire optical modulation plate can be etched at the same speed, minimizing the deviation of each modulation unit from the designed modulation pattern. The manufactured optical modulation plate 100 is also closer to the design requirements. Compared with conventional modulation devices, this optical modulation plate has lower requirements for the manufacturing process, that is, it does not require etching at different speeds; under the same manufacturing process conditions, an optical modulation plate with a smaller difference from the modulation pattern can be obtained, so that the imaging device using this optical modulation plate can achieve higher imaging quality, and also reduces the requirements for the detector in the imaging device, reducing costs.

[0063] In an example of this embodiment, each of the modulation units is respectively composed of an arrangement of the same number of minimum structural units, and the areas of the white portions (light-transmitting portions, which can also be regarded as the portions to be etched during etching) in each modulation unit are different, so that the modulation dark spots modulated by each modulation unit are different, constituting a series of modulation dark spots, which are irradiated onto the object to be measured to realize imaging of the object to be measured.

[0064] In another example of this embodiment, each of the modulation units is respectively composed of an arrangement of different numbers of minimum structural units, and the sizes of the modulation dark spots modulated by each modulation unit can also be different.

[0065] Furthermore, any two adjacent minimum structural units in each of the modulation units are not connected to each other. In this way, during etching, each modulation unit composed of the minimum structural units can be etched at the same speed, without the need to adjust the etching speed to adapt to different light-transmitting portions. Therefore, the entire optical modulation plate can also be etched at the same speed, minimizing the deviation between each modulation unit and the modulation pattern, preventing the etched modulation plate from being different from the modulation pattern, and thus ensuring the imaging quality of the imaging device using this optical modulation plate.

[0066] As Figure 6 、 Figure 7 shown, as another embodiment provided by the present invention, an X-ray correlation imaging device, the X-ray correlation imaging device includes: an X-ray source 101, a detector 102, and an optical modulation plate 100 as described in any one of the above.

[0067] The X-ray source 101 is configured to emit X-rays and irradiate an object to be measured 200.

[0068] The detector 102 is configured to receive the transmitted light generated by the X-rays irradiating the object to be measured 200 and detect the received transmitted light.

[0069] The optical modulation plate 100 is movably disposed on the optical path of the X-rays or the transmitted light, so that the optical modulation plate 100 can move along a direction perpendicular to the optical path of the X-rays or the transmitted light, and is used to modulate the X-rays or the transmitted light.

[0070] In this embodiment, when the optical modulation plate 100 in the X-ray correlation imaging device is manufactured, each of the modulation units therein is corrected, so that the large-size structure of each modulation unit is changed to a series of unconnected small-size structures, which is convenient for etching the modulation pattern, enabling the entire optical modulation plate 100 to be etched at the same speed, minimizing the deviation between each modulation unit and the modulation pattern; preventing the modulation pattern of the etched optical modulation plate 100 from being different from the designed modulation pattern, and thus ensuring the imaging quality of the X-ray correlation imaging device.

[0071] In an example of this embodiment, the optical modulation plate 100 is movably disposed on the optical path of the X-ray, which belongs to the pre-modulation mode; the optical modulation plate 100 is movably disposed on the optical path of the transmitted light, which belongs to the post-modulation mode. There is no distinction between the two modes, and they can be flexibly selected according to the actual on-site needs during use; it is not limited thereto.

[0072] In another example of this embodiment, the X-ray source 101 can adopt common instruments on the market, such as: X-ray tubes, X-ray generators, or X-ray diffractometers, etc. The detector 102 can be a single-pixel detector, and the detector 102 can also be one of a photodiode, a photomultiplier tube, or an avalanche photodiode. An avalanche photodiode is preferred, but it is not limited thereto.

[0073] In another example of this embodiment, the X-ray correlation imaging device further includes a housing structure (not shown in the figure) for encapsulating the X-ray source 101, the optical modulation plate 100, and the detector 102.

[0074] In this example, the housing structure can be a circular cavity housing, a square cavity housing, a support structure composed of multiple frames, or an integrated structure composed of multiple cylinders. A circular cavity housing is preferred; and the housing structure or the integrated structure can be sealed or non-sealed; the manufacturing material of the housing structure can be a plastic material, or a metal material, a transparent material, etc.

[0075] In an example of this embodiment, the X-ray correlation imaging device further includes a driving member, which is disposed in the housing structure and is in transmission connection with the optical modulation plate for driving the optical modulation plate to move; the driving member can adopt a micro motor, a servo motor, or a linear motor, and specific limitations are not made here.

[0076] In this example, a computer is connected to the driving member and the detector, so that when the optical modulation plate is driven to move by the driving member, the beat of the modulation unit can be switched to adapt to the detection frequency of the detector, and better imaging of the object to be measured can be achieved.

[0077] In one embodiment, the detector 102 detecting the received transmitted light includes:

[0078] Measuring the total light intensity of the received transmitted light;

[0079] Performing reconstruction calculation on the measurement result through a related algorithm to obtain an image of the object to be measured.

[0080] In this embodiment, the device is based on the principle of X-ray correlation imaging. In an example scenario, the optical path of X-ray correlation imaging is as Figure 6As shown, the X-ray source 101 emits light (X-rays) with a uniform intensity distribution and irradiates the optical modulation plate 100. The optical modulation plate 100 is composed of multiple modulation units. When X-rays irradiate each modulation unit, the transmitted light forms modulated speckles with alternating bright and dark patterns. Move the optical modulation plate 100, and the X-rays irradiate different modulation units, thereby generating a series of modulated speckles. The series of modulated speckles are sequentially irradiated on the object to be measured 200. The transmitted light of the object to be measured 200 is measured by a single-pixel detector without spatial resolution ability for the total light intensity, and reconstruction calculations are performed to obtain the image of the object to be measured.

[0081] The described optical modulation plate 100 is fabricated according to the required modulation pattern I t (x, y), where i represents the i-th modulation pattern and (x, y) represents spatial coordinates. During the measurement process, N modulated speckles are used for N measurements. The light intensity value collected by the single-pixel detector is denoted as S i , then there is

[0082] S i = ∫∫T(x, y)I t (x, y)dxdy

[0083] where T(x, y) represents the spatial distribution of the transmittance of the object to be measured, as Figure 8 shown;

[0084] When reconstructing the image Image(x, y) of the object to be measured, a correlation algorithm can be used:

[0085]

[0086] where δS i = S i - <s>, indicating the fluctuations in the light intensity collected by the single-pixel detector, <s>It is the average light intensity value collected by the single-pixel detector after N - times modulation. In some scenarios, compressive sensing algorithms, deep learning algorithms, etc. can also be used. Additionally, if special emission speckles are used, relevant algorithms can be used for reconstruction. For example, when emitting Hadamard speckles, the Hadamard transform algorithm can be used; when emitting Fourier speckles, the inverse Fourier transform algorithm can be used; when using discrete cosine speckles, the inverse discrete cosine transform algorithm can be used, etc.

[0087] In another exemplary scenario, the optical path of X - ray correlation imaging is as Figure 7 shown. The post - modulation mode is adopted. Specifically, the X - rays from the X - ray source first irradiate the object to be measured, and the image of the object to be measured is modulated successively by the optical modulation plate, and then detected by the single - pixel detector.

[0088] In the above two exemplary scenarios, modulation is performed through the optical modulation plate 100. Since the optical modulation plate 100 overcomes the deviation between the modulation units and the modulation pattern required by the design or reduces the deviation to the minimum during manufacturing, the imaging quality of the X - ray correlation imaging device is guaranteed.

[0089] In the above - mentioned embodiments of the present invention, a manufacturing method of an optical modulation plate is provided, and an optical modulation plate is provided based on this manufacturing method. The difference between the modulation pattern in the optical modulation plate and the designed modulation pattern is small, which can guarantee the imaging quality; in the manufacturing method of this optical modulation plate, when manufacturing the optical modulation plate, by correcting the modulation pattern, the large - size structure of the modulation unit is corrected into a series of non - connected small - size structures, which can etch the entire optical modulation plate at the same speed, minimize the deviation between each modulation unit and the modulation pattern. At the same time, the requirements for the manufacturing process are low, so that under the same manufacturing process conditions, an optical modulation plate with a smaller difference from the modulation pattern can be obtained.

[0090] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.< / s> < / s>

Claims

1. A method for manufacturing a light modulation plate, characterized in that: The production method comprises the following steps: Determine the minimum structural unit according to the size parameters of each modulation unit in the modulation pattern; According to the size parameter of the minimum structural unit, each modulation unit is divided into a series of modulation unit structures composed of the minimum structural units; The divided minimum structural units are modified to form a template, wherein any two adjacent minimum structural units are not connected to each other; The modulation pattern is etched on the substrate with reference to the sample to produce a light modulation plate.

2. The method for manufacturing a light modulation plate according to claim 1, characterized in that: The manufacturing method also includes: determining the arrangement area of ​​each modulation unit in the modulation pattern on the design drawing board, the arrangement area includes a first arrangement area and a second arrangement area, and the etching time of the modulation pattern in the first arrangement area is the same as the etching time of the modulation pattern in the second arrangement area.

3. The method for manufacturing a light modulation plate according to claim 1, characterized in that: The modifying of each divided minimum structural unit includes: adding a border to each divided minimum structural unit.

4. The method for manufacturing a light modulation plate according to claim 1, characterized in that: The etching method is a pattern electroplating method or an ion beam etching method.

5. A light modulation plate, characterized in that: The light modulator plate is manufactured by the light modulator plate manufacturing method as described in any one of claims 1-4.

6. The light modulation panel according to claim 5, characterized in that The optical modulation plate comprises a substrate and a modulation pattern arranged on the substrate. The modulation pattern comprises a plurality of modulation units, and each of the modulation units is composed of an arrangement of minimum structural units of the same or different numbers.

7. The light modulation panel according to claim 6, characterized in that: Any two adjacent minimum structural units in each of the modulation units are not connected to each other.

8. An X-ray correlation imaging device, characterized in that: The X-ray correlation imaging device comprises: an X-ray source, a detector and a light modulation plate as described in any one of claims 5 to 7, The X-ray source is used to emit X-rays to irradiate the object to be measured; The detector is used to receive the transmitted light generated by the X-ray irradiation to the object to be measured, and detect the received transmitted light; The light modulator is movably arranged on the optical path of the X-ray or the transmitted light, so that the light modulator can move along a direction perpendicular to the optical path of the X-ray or the transmitted light, for modulating the X-ray or the transmitted light.

9. The X-ray correlation imaging device according to claim 8, characterized in that: The detector detects the received transmitted light, including: Measuring the total intensity of the received transmitted light; The measurement results are reconstructed and calculated through relevant algorithms to obtain the image of the object to be measured.

10. The X-ray correlation imaging device according to claim 8 or 9, characterized in that: The detector is a single-pixel detector.

Images