Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device, and relates to the technical field of display, the display module comprises a first substrate, a backlight module, a flexible circuit board and inner sealing glue, and the inner sealing glue is located on the side, close to a bending part, of the first substrate and the backlight module; the inner sealing glue is in contact with the flexible circuit board, the first substrate and the backlight module. By means of the arrangement, due to the fact that the inner sealing glue has certain deformability, the space occupied by bending of the flexible circuit board can be reduced, and therefore the narrow frame design of a display product can be achieved; the connection stability in the display module can be improved, and buckling deformation of the flexible circuit board can be prevented; pulling of the flexible circuit board is reduced, and poor visual effects such as light leakage and dark-state local flicker of the display module are prevented; in addition, the sealing performance among the flexible circuit board, the first substrate and the backlight module is improved, dust and moisture are prevented from invading, and the reliability of the display module is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display module, a preparation method thereof, and a display device. Background Art

[0002] With the rapid development of the display field, various display products emerge in an endless stream. Among them, liquid crystal display panels are widely used due to their low power consumption and low manufacturing cost. In some usage scenarios, it is desired that the display product has a narrow border and a good display effect. Therefore, how to reduce the border width of the display product has become one of the technical problems to be solved at present. Summary of the Invention

[0003] In order to solve the above technical problems, the present disclosure provides a display module, a preparation method thereof, and a display device, so as to reduce the border width of the display product and improve the display effect.

[0004] In a first aspect, the present disclosure provides a display module, including:

[0005] A first substrate, including a first side and a second side disposed opposite to each other;

[0006] A backlight module, located on the first side of the first substrate;

[0007] A flexible circuit board, including a first straight portion, a second straight portion, and a bending portion, the first straight portion being connected to the second straight portion through the bending portion; the first straight portion is located on the second side of the first substrate, and the second straight portion is located on a side of the backlight module away from the first substrate;

[0008] An inner sealant, located on a side of the first substrate and the backlight module close to the bending portion; the inner sealant is in contact with the flexible circuit board, the first substrate, and the backlight module.

[0009] In a second aspect, based on the same inventive concept, the present disclosure provides a preparation method of a display module, including:

[0010] Providing a first substrate and a backlight module, the backlight module being located on the first side of the first substrate;

[0011] Coating an uncured inner sealant on a side surface of the first substrate and the backlight module;

[0012] Connect the flexible circuit board to the first substrate and the backlight module through the internal encapsulant. Wherein, the flexible circuit board includes a first straight portion, a second straight portion and a bending portion. The first straight portion is connected to the second straight portion through the bending portion. The first straight portion is located on the second side of the first substrate. The first side and the second side of the thin film transistor are arranged opposite to each other. The second straight portion is located on the side of the backlight module away from the first substrate;

[0013] Cure the internal encapsulant.

[0014] In a third aspect, based on the same inventive concept, the present disclosure provides a display device including the display module described in the first aspect.

[0015] The technical solution provided by the present disclosure has the following advantages compared with the prior art:

[0016] The present disclosure provides a display module, a preparation method thereof, and a display device. The display module includes a first substrate, a backlight module, a flexible circuit board, and an internal encapsulant. The first substrate and the backlight module are stacked. The first straight portion of the flexible circuit board is connected to the second side of the first substrate and is bent to the side of the backlight module away from the first substrate. The internal encapsulant is located on the side of the bending portion of the flexible circuit board close to the first substrate and the backlight module and is in contact with both the first substrate and the backlight module. With such an arrangement, since the internal encapsulant has a certain deformability, the width of the internal encapsulant can be compressed to bend the bending portion of the flexible circuit board to a position as close as possible to the first substrate and the backlight module, thereby reducing the space occupied by the bending of the flexible circuit board, which is beneficial to the realization of the narrow border design of the display product; at the same time, the flexible circuit board is fixedly connected to the first substrate and the backlight module, improving the connection stability in the display module and being beneficial to preventing the flexible circuit board from warping and deforming; and when bending the flexible circuit board, it is beneficial to reduce the pulling on the flexible circuit board, thereby preventing the first substrate, the flexible circuit board, and the backlight module from deforming, and being beneficial to preventing the display module from having poor visual effects such as light leakage and local flicker in the dark state, and thus being beneficial to improving the display effect of the display module; in addition, the internal encapsulant is in contact with both the first substrate and the backlight module, which is beneficial to improving the sealing performance between the flexible circuit board and the first substrate and the backlight module, preventing dust and moisture from invading, and improving the reliability of the display module. Description of the Drawings

[0017] The drawings here are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure and used together with the specification to explain the principles of the present disclosure.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 The following is a schematic diagram of a film layer of a display module in the prior art;

[0020] Figure 2 The following is a schematic plan view of a display module provided by an embodiment of the present disclosure;

[0021] Figure 3 The following is a schematic diagram of a film layer of a display module provided by an embodiment of the present disclosure;

[0022] Figure 4 The following is a schematic diagram of a film layer of a first substrate and a backlight module provided by an embodiment of the present disclosure;

[0023] Figure 5 The following is another schematic diagram of a film layer of a display module provided by an embodiment of the present disclosure;

[0024] Figure 6 The following is yet another schematic diagram of a film layer of a display module provided by an embodiment of the present disclosure;

[0025] Figure 7 The following is another schematic plan view of a display module provided by an embodiment of the present disclosure;

[0026] Figure 8 The following is a schematic plan view of a backlight module provided by an embodiment of the present disclosure;

[0027] Figure 9 The following is yet another schematic diagram of a film layer of a display module provided by an embodiment of the present disclosure;

[0028] Figure 10 The following is a schematic flowchart of a preparation method of a display module provided by an embodiment of the present disclosure;

[0029] Figure 11 The following is a schematic diagram of a film layer of a display module after performing step S10 of the preparation method of the display module;

[0030] Figure 12 The following is a schematic diagram of a film layer of a display module after performing step S20 of the preparation method of the display module;

[0031] Figure 13 The following is a schematic plan view of a display device provided by an embodiment of the present disclosure. Detailed implementation manners

[0032] In order to more clearly understand the above-mentioned objects, features and advantages of the embodiments of the present disclosure, the solutions of the embodiments of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.

[0033] In the following description, many specific details are set forth in order to fully understand the embodiments of the present disclosure, but the embodiments of the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all the embodiments.

[0034] The inventors found in the research that in display products, when fixing a flexible circuit board, dot-line glue is usually used to achieve mechanical fixation of the flexible circuit board and avoid warping or detachment of the flexible circuit board. Figure 1 The following shows a schematic diagram of a film layer of a display module in the prior art. Please refer to Figure 1 , a line of glue 40' is used to fix the flexible circuit board 30'. The line of glue 40' is connected to the substrate 10' and the flexible circuit board 30'. The width of the line of glue 40' along the first direction F1' is relatively large, resulting in a relatively large width occupied by the bending of the flexible circuit board 30', which is not conducive to reducing the border of the display product. At the same time, the line of glue 40' is cured by ultraviolet light irradiation. It is necessary to cure the line of glue 40' before bending the flexible circuit board 30'. When the flexible circuit board 30' is bent after curing, if the flexible circuit board 30' is forcibly pulled, problems such as poor connection contact, substrate deformation, and backlight module deformation may occur, and then problems such as light leakage and local flicker in the dark state may occur, affecting the display effect of the display product.

[0035] Therefore, how to solve the above problems has become one of the technical problems to be solved at the present stage.

[0036] In order to solve the above technical problems, the present disclosure provides a display module, a preparation method thereof, and a display device, so as to reduce the border width of the display product and improve the display effect.

[0037] Figure 2 The following shows a schematic plan view of a display module provided by an embodiment of the present disclosure. Figure 3 The following shows a schematic diagram of a film layer of a display module provided by an embodiment of the present disclosure. Please refer to Figure 2 and Figure 3, the present disclosure provides a display module 100, which includes a first substrate 10, a backlight module 20, a flexible circuit board 30, and an inner sealant 40. Among them, the first substrate 10 includes a first side and a second side that are oppositely arranged; the backlight module 20 is located on the first side of the first substrate 10; the flexible circuit board 30 includes a first straight portion 31, a second straight portion 32, and a bending portion 33, and the first straight portion 31 is connected to the second straight portion 32 through the bending portion 33; the first straight portion 31 is located on the second side of the first substrate 10, and the second straight portion 32 is located on the side of the backlight module 20 away from the first substrate 10; the inner sealant 40 is located on the side of the first substrate 10 and the backlight module 20 close to the bending portion 33; the inner sealant 40 is in contact with the flexible circuit board 30, the first substrate 10, and the backlight module 20.

[0038] It should be noted that Figure 2 only the display module 100 with a rectangular structure is taken as an example for illustration, and the actual shape of the display module 100 is not limited. In some other embodiments of the present disclosure, the display module 100 may also be embodied as other feasible shapes such as a circle, a rounded rectangle, etc. Optionally, the display module 100 provided in this embodiment may be a liquid crystal display (LCD) module, and the first substrate 10 includes a liquid crystal display panel, and the backlight module 20 can be used to provide a uniform, stable, and controllable light source for the first substrate 10. Figure 4 Shown is a schematic diagram of a film layer of the first substrate and the backlight module provided by an embodiment of the present disclosure. The structural schematic of the first substrate 10 and the backlight module 20 can be generally referred to Figure 4 , the first substrate 10 includes an array substrate 11 and a color filter substrate 12 that are oppositely arranged, and liquid crystal 13 located between the array substrate 11 and the color filter substrate 12; the backlight module 20 includes a substrate 21 and a backlight 22, and the backlight module 20 is located on one side of the first substrate 10. For the specific structures of the first substrate 10 and the backlight module 20, reference can also be made to the existing related technologies, and the present disclosure will not elaborate herein. In some embodiments, the first substrate 10 can be connected to a main board or other components, such as a driving circuit, a touch circuit, etc. The flexible circuit board 30 transmits signals and power between these components. Due to the bendability of the flexible circuit board 30, by introducing the flexible circuit board 30 into the display module 100, at least part of the signals in the display module 100 can be led to the non-light-emitting surface side of the display module 100 through the flexible circuit board 30, reducing the occupied border space of the display module 100, and thus being beneficial to shortening the border of the display module 100.

[0039] In the display module 100 provided by the embodiments of the present disclosure, the first substrate 10 and the backlight module 20 are stacked. The first flat portion 31 of the flexible circuit board 30 is connected to the second side of the first substrate 10, bent to the side of the backlight module 20 away from the first substrate 10, and the second flat portion 32 is located on the side of the backlight module 20 away from the first substrate 10. The inner sealant 40 is located on the side of the bent portion 33 of the flexible circuit board 30 close to the first substrate 10 and the backlight module 20, and is in contact with both the first substrate 10 and the backlight module 20. With such a setting, since the inner sealant has a certain deformability, the width of the inner sealant 40 along the first direction F1 can be compressed to bend the bent portion 33 of the flexible circuit board 30 to a position as close as possible to the first substrate 10 and the backlight module 20, thereby reducing the space occupied by the bending of the flexible circuit board 30, which is further beneficial to achieving a narrow bezel design of the display product. At the same time, the flexible circuit board 30 is fixedly connected to the first substrate 10 and the backlight module 20, improving the connection stability between the first substrate 10, the backlight module 20, and the flexible circuit board 30 in the display module 100, which is beneficial to preventing the flexible circuit board 30 from warping and deforming. And when bending the flexible circuit board 30, it is beneficial to reduce the pulling on the flexible circuit board 30, thereby preventing the first substrate 10, the flexible circuit board 30, and the backlight module 20 from deforming, reducing the possibility of poor contact between the flexible circuit board 30 and the first substrate 10, and thus being beneficial to preventing the display module 100 from having poor visual effects such as light leakage and local flicker in the dark state, and therefore being beneficial to improving the display effect of the display module 100. In addition, the inner sealant 40 is in contact with both the first substrate 10 and the backlight module 20, which is beneficial to improving the sealing performance between the flexible circuit board 30 and the first substrate 10 and the backlight module 20, preventing dust and moisture from invading, and improving the reliability of the display module 100.

[0040] Please continue to refer to Figure 2 and Figure 3 In an alternative embodiment of the present disclosure, the inner sealant 40 is a thermosetting adhesive. It should be noted that a thermosetting adhesive is an adhesive that forms a cross-linked structure through a chemical reaction triggered by heating. In this embodiment, since the inner sealant 40 is a thermosetting adhesive, the inner sealant 40 can be cured after the flexible circuit board 30 is bent. In this way, when bending the flexible circuit board 30, the inner sealant 40 still has a certain deformability, which is beneficial to reducing the pulling on the flexible circuit board 30, thereby reducing the possibility of poor contact between the flexible circuit board 30 and the first substrate 10, and improving the reliability of the display module 100.

[0041] Please refer to Figure 3 Optionally, in the first direction F1, the length of the region where the flexible circuit board 30 does not overlap with the first substrate 10 is L1, and L1 < 0.9 mm. The first direction F1 is parallel to the plane where the first substrate 10 is located and points from the first flat portion 31 or the second flat portion 32 of the flexible circuit board 30 to the bent portion 33.

[0042] Specifically, at least a part of the flexible circuit board 30 does not overlap with the first substrate 10 in the third direction F3 (the thickness direction of the display module). The length of the non-overlapping area in the first direction F1 is L1. The non-overlapping area between the flexible circuit board 30 and the first substrate 10 can be understood as the area occupied by the bending of the flexible circuit board 30. When the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 is ≥ 0.9 mm, the length of the area occupied by the bending of the flexible circuit board 30 in the first direction F1 is relatively large, which is not conducive to reducing the border of the display module 100. In this embodiment, the inner sealant 40 is provided to fix the flexible circuit board 30 to one side of the first substrate 10 and the backlight module 20. The inner sealant 40 has a certain deformability before curing, which is conducive to reducing the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10, making L1 < 0.9 mm. In this way, it is conducive to reducing the area occupied by the bending of the flexible circuit board 30, and thus conducive to reducing the border of the display module 100. An optional embodiment provided by the present disclosure is that the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 in the first direction F1 = 0.3 mm; another optional embodiment provided by the present disclosure is that the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 in the first direction F1 = 0.45 mm; still another optional embodiment provided by the present disclosure is that the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 in the first direction F1 is set to 0.4 mm ≤ L1 ≤ 0.5 mm. Another optional embodiment provided by the present disclosure is that the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 in the first direction F1 is set to 0.2 mm ≤ L1 ≤ 0.6 mm. Another optional embodiment provided by the present disclosure is that the length L1 of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 in the first direction F1 is set to L1 < 0.7 mm.

[0043] It should be noted that Figure 3 In the illustrated embodiment, the angle between the first straight portion 31 and the bent portion 33 is the same as or approximately the same as the angle between the second straight portion 32 and the bent portion 33, and the bent portion 33 can be considered as a plane. The present disclosure only takes this as an example for illustration and is not limited thereto. In some other embodiments, the angle between the first straight portion 31 and the bent portion 33 can be smaller than the angle between the second straight portion 32 and the bent portion 33. Figure 5 The following shows another film layer schematic diagram of the display module provided by the embodiment of the present disclosure. Please refer to Figure 5, the distance between the bent portion 33 of the flexible circuit board 30 and the edge of the backlight module 20 gradually decreases along the thickness direction of the display module 100. In this way, it is further beneficial to reduce the space occupied by the bending of the flexible circuit board 30, and thus beneficial to narrow the frame width of the display module 100. In some other embodiments, the bent portion 33 may be in an arc shape, Figure 6 The following is another schematic diagram of the film layer of the display module provided by the embodiment of the present disclosure. Please refer to Figure 6 , the bending form of the arc surface of the bent portion 33 is beneficial to reducing the bending degree of the flexible circuit board 30, thereby improving the reliability of the line transmission in the flexible circuit board 30.

[0044] Figure 7 The following is another schematic plan view of the display module provided by the embodiment of the present disclosure, Figure 8 The following is a schematic plan view of the backlight module provided by the embodiment of the present disclosure. Please refer to Figure 7 and Figure 8 , in an alternative embodiment of the present disclosure, the backlight module 20 includes a first region A1 and a second region A2. The first region A1 is located on at least one side of the second region A2 along the second direction F2; in the first direction F1, at least a part of the first region A1 of the backlight module 20 overlaps with the bent portion 33 of the flexible circuit board 30, and the second region A2 of the backlight module 20 does not overlap with the bent portion 33 of the flexible circuit board 30; the first direction F1 is parallel to the plane where the backlight module 20 is located and points from the first straight portion 31 or the second straight portion 32 of the flexible circuit board 30 to the bent portion 33, and the second direction F2 is parallel to the plane where the backlight module 20 is located and perpendicular to the first direction F1; in the first direction F1, the length S1 of the first region A1 of the backlight module 20 is less than the length S2 of the second region A2.

[0045] Specifically, the backlight module 20 includes a first region A1 and a second region A2 arranged along the second direction F2. In the first direction F1, the bent portion 33 of the flexible circuit board 30 overlaps with the first region A1 and does not overlap with the second region A2. The embodiment of the present disclosure sets the length S1 of the first region A1 of the backlight module 20 along the first direction F1 to be less than the length S2 of the second region A2 along the first direction F1. That is to say, in this embodiment, in the corresponding region of the flexible circuit board 30, the length of the backlight module 20 is appropriately shortened, so as to make room for the bent portion 33 of the flexible circuit board 30, which is beneficial to reducing the space occupied by the bending of the flexible circuit board 30 (reducing the length of the region where the flexible circuit board 30 does not overlap with the first substrate 10 along the first direction F1), and thus beneficial to reducing the frame of the display module 100.

[0046] It should be noted that, Figure 7 and Figure 8In the illustrated embodiment, the backlight module 20 provides a bending space for the flexible circuit board 30. Part of the edge of the first region A1 is retracted to form a special-shaped backlight module 20. Regarding the shape of the first substrate 10, in some alternative embodiments, the first substrate 10 has the same shape as the backlight module 20. In some other alternative embodiments, the first substrate 10 has a different shape from the backlight module 20. The present disclosure does not make specific limitations. It is only required that the orthographic projection of the first substrate 10 on the plane where the display module is located is within the orthographic projection of the backlight module 20 on the plane where the display module is located.

[0047] Please continue to refer to Figure 7 , in an alternative embodiment of the present disclosure, on one side close to the bending portion 33 of the flexible circuit board 30, the edges of the first region A1 of the backlight module 20 and the first substrate 10 are flush within the process error range.

[0048] It should be noted that there is a certain process error when the first substrate 10 and the backlight module 20 are aligned and bonded. In this embodiment, the edges of the first region A1 of the backlight module 20 and the first substrate 10 being flush within the process error range means that the distance between the edges of the first region A1 of the backlight module 20 and the first substrate 10 is within a threshold range, and the above threshold range is determined by the process error range. Exemplarily, the distance between the edges of the first region A1 of the backlight module 20 and the first substrate 10 is less than or equal to 0.05 mm. The present disclosure is only illustrated by this example and is not limited thereto.

[0049] Specifically, in this embodiment, by reducing the length of the backlight module 20 in the corresponding area of the flexible circuit board 30, a space is provided for the bending portion 33 of the flexible circuit board 30, which is beneficial to reducing the space occupied by the bending of the flexible circuit board 30, and thus beneficial to reducing the border of the display module 100. At the same time, setting the edges of the first region A1 of the backlight module 20 and the first substrate 10 to be flush can avoid the stepped misalignment between the edges of the first substrate 10 and the backlight module 20, which is beneficial to preventing the edge of the backlight module 20 from affecting the bending of the flexible circuit board 30. In addition, the edges of the first substrate 10 and the backlight module 20 being flush provides a continuous and flat bonding surface for the inner sealant 40, which is beneficial to the uniform coverage of the inner sealant 40, thereby enhancing the dust and moisture protection performance and improving the reliability of the display module 100.

[0050] It should be noted that in this embodiment, the edge of the first region A1 of the backlight module 20 is flush with the edge of the first substrate 10 within the process error range, which means that the edge of the first region A1 of the backlight module 20 close to the bending portion 33 of the flexible circuit board 30 is flush with the edge of the first substrate 10 close to the bending portion 33 of the flexible circuit board 30 within the process error range. For the edges of the backlight module 20 and the first substrate 10 away from the bending portion 33 of the flexible circuit board 30 along the first direction F1, an optional implementation provided by the present disclosure is that along the first direction F1, the edge of the first substrate 10 away from the bending portion of the flexible circuit board is located between the two opposite edges of the backlight module 20 along the first direction F1. In this way, the edge of the backlight module 20 extends beyond the edge of the first substrate 10 to form physical protection for the first substrate 10, which is beneficial to preventing the first substrate 10 from being impacted and improving the reliability of the display module.

[0051] In the present disclosure, the flexible circuit board 30 is connected to the first substrate 10 and bent at the position of the first region A1. At the corresponding position of the second region A2 that does not overlap with the flexible circuit board 30, the length S2 of the second region A2 of the backlight module 20 is greater than the length S1 of the first region A1. In the region where the flexible circuit board 30 is not provided, the length of the backlight module 20 is greater than the length of the first substrate 10, forming a physical protection barrier for the first substrate 10, which is beneficial to preventing the edge of the first substrate 10 from being damaged by external impact, affecting the display effect of the display module 100, and thus beneficial to improving the impact resistance of the display module 100.

[0052] In order not to affect the bending of the flexible circuit board 30 and at the same time provide as perfect protection as possible for the first substrate 10, the present disclosure sets the distance between the second region A2 of the backlight module 20 and the bending portion 33 of the flexible circuit board 30. Optionally, in the second direction F2, the distance between the second region A2 of the backlight module 20 and the bending portion 33 of the flexible circuit board 30 is L2, and 0.2 mm ≤ L2 ≤ 0.3 mm.

[0053] Specifically, when the distance L2 between the second region A2 of the backlight module 20 and the bent portion 33 of the flexible circuit board 30 is less than 0.2 mm, it may affect the normal bending of the flexible circuit board 30; when the distance L2 between the second region A2 of the backlight module 20 and the bent portion 33 of the flexible circuit board 30 is greater than 0.3 mm, the protection ability of the backlight module 20 for the first substrate 10 decreases; therefore, the present disclosure sets 0.2 mm ≤ L2 ≤ 0.3 mm. Such a setting is beneficial for making space for the bending of the flexible circuit board 30 and for improving the protection ability of the backlight module 20 for the first substrate 10. An optional implementation provided by the present disclosure is that the distance L2 between the second region A2 of the backlight module 20 and the bent portion 33 of the flexible circuit board 30 is 0.25 mm; another optional implementation provided by the present disclosure is that the distance L2 between the second region A2 of the backlight module 20 and the bent portion 33 of the flexible circuit board 30 is 0.22 mm; still another optional implementation provided by the present disclosure is that the distance L2 between the second region A2 of the backlight module 20 and the bent portion 33 of the flexible circuit board 30 is 0.28 mm.

[0054] Figure 9 The following is still another film layer schematic diagram of the display module provided by the embodiment of the present disclosure. Please refer to Figure 9 Optionally, the display module further includes a reinforcing layer 50, and the reinforcing layer 50 is located on the side of the first straight portion 31 of the flexible circuit board 30 away from the first substrate 10; at least a part of the reinforcing layer 50 does not overlap with the first substrate 10 in the third direction F3, and in the first direction F1, the length L3 of the region where the reinforcing layer 50 does not overlap with the first substrate 10, L3 < 0.45 mm; the first direction F1 is parallel to the plane where the backlight module 20 is located and points from the first straight portion 31 or the second straight portion 32 of the flexible circuit board 30 to the bent portion 33.

[0055] It should be noted that the reinforcing layer 50 can enhance the strength of the connection between the flexible circuit board 30 and the first substrate 10, which is conducive to preventing the flexible circuit board 30 from loosening or breaking, thereby ensuring the stability of signal transmission. The reinforcing layer 50 is usually made of a material with a certain mechanical strength. Optionally, the material of the reinforcing layer 50 can be polyimide, epoxy resin, plastic, etc. These materials are usually not easily bent. Since the reinforcing layer 50 is located on the side of the flexible circuit board 30 away from the first substrate 10, it will affect the flexibility of the overlapping area between the flexible circuit board 30 and the reinforcing layer 50. Therefore, in this embodiment, by setting the length of the non-overlapping area between the reinforcing layer 50 and the first substrate 10, the occupied space for bending the flexible circuit board 30 is reduced, that is, the length of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 along the first direction F1 is reduced. When the length L3 of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is ≥ 0.45 mm, the length of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 is relatively long, which is not conducive to reducing the frame width of the display module 100. Therefore, in the embodiment of the present disclosure, the length L3 of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is set to be < 0.45 mm. In this way, while improving the connection strength between the flexible circuit board 30 and the first substrate 10, the length of the non-overlapping area between the flexible circuit board 30 and the first substrate 10 is reduced, that is, the influence on the occupied space for bending the flexible circuit board 30 is reduced, which is conducive to reducing the frame width of the display module 100. An optional embodiment provided by the present disclosure is that the length L3 of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is = 0.2 mm; another optional embodiment provided by the present disclosure is that the length L3 of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is = 0.3 mm; still another optional embodiment provided by the present disclosure is that the length L3 of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is ≤ 0.4 mm; yet another optional embodiment provided by the present disclosure is that the length of the non-overlapping area between the reinforcing layer 50 and the first substrate 10 is 0.15 mm ≤ L3 ≤ 0.25 mm.

[0056] It should be noted that Figure 9 As shown in the figure, the reinforcing layer 50 is not in direct contact with the first substrate 10. In some other embodiments, at least part of the reinforcing layer 50 is in direct contact with the first substrate 10, and at least part of the reinforcing layer 50 is in direct contact with the flexible circuit board. In this way, it is beneficial to strengthen the connection between the flexible circuit board 30 and the first substrate 10.

[0057] Please continue to refer to Figure 9 In an optional embodiment of the present disclosure, the display module further includes an ink layer 60. The ink layer 60 is located on the side of the flexible circuit board 30 close to the backlight module 20. In the thickness direction of the flexible circuit board 30, the ink layer 60 and the reinforcing layer 50 at least partially overlap; the ink layer 60 includes photosensitive ink.

[0058] It should be noted that the ink layer 60 is disposed on the surface of the traces of the flexible circuit board 30 for isolating adjacent circuits and avoiding open circuits. As a physical barrier, the ink layer 60 is beneficial to reducing mechanical damage to the circuits during assembly or use, and at the same time is also beneficial to isolating substances such as oxygen and moisture in the air to prevent oxidation and corrosion of the circuits. The overlapping of the ink layer 60 and the reinforcing layer 50 is beneficial to strengthening the protection of the flexible circuit board 30, improving the reliability of the flexible circuit board 30, and thus being beneficial to improving the reliability of the display product. In this embodiment, the ink layer 60 includes photosensitive ink, which is generated by developing. The generation accuracy is relatively high, which is beneficial to alignment with the reinforcing layer 50 and provides more reliable protection for the flexible circuit board 30. At the same time, the photosensitive ink forms an elastic film layer after curing, and has good bending performance. Setting the photosensitive ink on the surface of the flexible circuit board 30 is also beneficial to improving the reliability of the flexible circuit board 30.

[0059] Based on the same inventive concept, the present disclosure provides a method for manufacturing a display module. Figure 10 The following is a schematic flow chart of a method for manufacturing a display module provided by an embodiment of the present disclosure. Figure 11 The following is a schematic diagram of a film layer of a display module after performing step S10 of the method for manufacturing a display module. Figure 12 The following is a schematic diagram of a film layer of a display module after performing step S20 of the method for manufacturing a display module. Please refer to Figure 3 , Figures 10 to 12 The method for manufacturing a display module includes:

[0060] Step S10: Provide a first substrate 10 and a backlight module 20, and the backlight module 20 is located on the first side of the first substrate 10. For a schematic diagram of the film layer of the display module after performing step S10, please refer to Figure 11 ;

[0061] Step S20: Coat uncured inner sealant 40 on one side of the first substrate 10 and the backlight module 20. For a schematic diagram of the film layer of the display module after performing step S20, please refer to Figure 12 ;It should be noted that Figure 12 the display module shown in

[0062] Step S30: Bend the flexible circuit board 30 and connect it to the first substrate 10 and the backlight module 20 through the inner sealant 40. The flexible circuit board 30 includes a first straight portion 31, a second straight portion 32, and a bending portion 33. The first straight portion 31 is connected to the second straight portion 32 through the bending portion 33. The first straight portion 31 is located on the second side of the first substrate 10, and the first side and the second side of the thin-film transistor are disposed opposite to each other. The second straight portion 32 is located on the side of the backlight module 20 away from the first substrate 10. For the film layer schematic diagram of the display module after performing Step S30, please refer to Figure 3 ;

[0063] Step S40: Cure the inner sealant 40.

[0064] It should be noted that the manufacturing method of the display module provided by the present disclosure includes but is not limited to Steps S10 to S40.

[0065] Specifically, in the manufacturing method of the display module provided by the present disclosure, before the flexible circuit board 30 is bent, the uncured inner sealant 40 is applied to the sides of the first substrate 10 and the backlight module 20, and then the flexible circuit board 30 is bent to form the first straight portion 31, the second straight portion 32, and the bending portion 33. The curing treatment of the inner sealant 40 is performed after the flexible circuit board 30 is bent. In this way, when the flexible circuit board 30 is bent, the inner sealant 40 still has a certain deformability. When the flexible circuit board 30 is bent, the bending portion 33 of the flexible circuit board 30 can be bent to a position as close as possible to the first substrate 10 and the backlight module 20, which is beneficial to reducing the bending space occupied by the flexible circuit board 30, and thus beneficial to reducing the frame width of the display module. At the same time, since the inner sealant 40 is not cured temporarily when the flexible circuit board 30 is bent, the pulling on the flexible circuit board 30 can be avoided or reduced, thereby preventing the first substrate 10, the flexible circuit board 30, and the backlight module 20 from deforming, reducing the possibility of poor contact between the flexible circuit board 30 and the first substrate 10, and thus being beneficial to preventing the display module from having poor visual effects such as light leakage and local flicker in the dark state, and thus beneficial to improving the display effect of the display module.

[0066] Based on the same inventive concept, the present disclosure provides a display device Figure 13 Shown is a plan view of a display device provided by an embodiment of the present disclosure. Please refer to Figure 13 , the display device 200 includes a display module 100, and the display module 100 is any one of the display modules 100 provided by the present disclosure.

[0067] It should be noted that for the embodiments of the display device 200 provided in the embodiments of the present application, reference may be made to the embodiments of the above-mentioned display panel 100, and repeated descriptions will not be elaborated. The display device 200 provided by the present application may be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a navigator, or any product and component with a display function.

[0068] As can be seen from the above embodiments, the display module, its manufacturing method, and the display device provided by the present invention at least achieve the following beneficial effects:

[0069] The present disclosure provides a display module, its manufacturing method, and a display device. The display module includes a first substrate, a backlight module, a flexible circuit board, and an inner sealant. The first substrate and the backlight module are stacked. The first flat portion of the flexible circuit board is connected to the second side of the first substrate and is bent to the side of the backlight module away from the first substrate. The inner sealant is located on the side of the bent portion of the flexible circuit board close to the first substrate and the backlight module and is in contact with both the first substrate and the backlight module. With such a setting, since the inner sealant has a certain deformability, the width of the inner sealant can be compressed to bend the bent portion of the flexible circuit board to a position as close as possible to the first substrate and the backlight module, thereby reducing the space occupied by the bending of the flexible circuit board, which is beneficial to realizing the narrow bezel design of the display product. At the same time, the flexible circuit board is fixedly connected to the first substrate and the backlight module, improving the connection stability in the display module and being beneficial to preventing the flexible circuit board from warping and deforming. Also, when bending the flexible circuit board, it is beneficial to reduce the pulling force on the flexible circuit board, thereby preventing the first substrate, the flexible circuit board, and the backlight module from deforming, and being beneficial to preventing the display module from having poor visual effects such as light leakage and local flicker in the dark state, and thus being beneficial to improving the display effect of the display module. In addition, the inner sealant is in contact with both the first substrate and the backlight module, which is beneficial to improving the sealing between the flexible circuit board and the first substrate and the backlight module, preventing dust and moisture from invading, and improving the reliability of the display module.

[0070] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the above elements.

[0071] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described above, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that: include: A first substrate including a first side and a second side disposed opposite to each other; a backlight module, located on the first side of the first substrate; A flexible circuit board, comprising a first straight portion, a second straight portion and a bent portion, wherein the first straight portion is connected to the second straight portion through the bent portion; the first straight portion is located on the second side of the first substrate, and the second straight portion is located on a side of the backlight module away from the first substrate; The inner sealing glue is located on one side of the first substrate and the backlight module close to the bending portion; the inner sealing glue is in contact with the flexible circuit board, the first substrate and the backlight module.

2. The display module according to claim 1, characterized in that: The inner sealing glue is a thermosetting glue.

3. The display module according to claim 1, characterized in that: In the first direction, the length of the region where the flexible circuit board and the first substrate do not overlap is L1, and L1<0.9 mm; The first direction is parallel to the plane where the first substrate is located, and points from the first straight portion or the second straight portion of the flexible circuit board to the bent portion.

4. The display module according to claim 3, characterized in that: 0.4mm≤L1≤0.5mm.

5. The display module according to claim 1, characterized in that: The backlight module includes a first area and a second area, wherein the first area is located on at least one side of the second area along a second direction; In a first direction, at least a portion of the first area of ​​the backlight module overlaps with the bent portion of the flexible circuit board, and the second area of ​​the backlight module does not overlap with the bent portion of the flexible circuit board; The first direction is parallel to the plane where the backlight module is located, and points from the first straight portion or the second straight portion of the flexible circuit board to the bent portion, and the second direction is parallel to the plane where the backlight module is located and perpendicular to the first direction; In the first direction, the length of the first area of ​​the backlight module is smaller than the length of the second area.

6. The display module according to claim 5, characterized in that: On a side close to the bent portion of the flexible circuit board, an edge of the first region of the backlight module is flush with an edge of the first substrate within a process error range.

7. The display module according to claim 5, characterized in that: In the second direction, a distance between the second area of ​​the backlight module and the bending portion of the flexible circuit board is L2, and 0.2 mm≤L2≤0.3 mm.

8. The display module according to claim 1, characterized in that: It also includes a reinforcement layer, the reinforcement layer is located on a side of the first straight portion of the flexible circuit board away from the first substrate; In the first direction, the length of the region where the reinforcing layer and the first substrate do not overlap is L3, and L3<0.45 mm; The first direction is parallel to the plane where the backlight module is located, and points from the first straight portion or the second straight portion of the flexible circuit board to the bent portion.

9. The display module according to claim 8, characterized in that: 0.15mm≤L3≤0.25mm.

10. The display module according to claim 8, characterized in that: It also includes an ink layer, the ink layer is located on a side of the flexible circuit board close to the backlight module, and in the thickness direction of the flexible circuit board, the ink layer and the reinforcement layer at least partially overlap; The ink layer includes photosensitive ink.

11. A method for preparing a display module, characterized in that: include: Providing a first substrate and a backlight module, wherein the backlight module is located on a first side of the first substrate; Applying uncured inner sealant on the first substrate and one side of the backlight module; Connecting the flexible circuit board to the first substrate and the backlight module through the inner sealant, wherein the flexible circuit board comprises a first straight portion, a second straight portion and a bent portion, the first straight portion is connected to the second straight portion through the bent portion, the first straight portion is located on the second side of the first substrate, the first side and the second side of the first substrate are arranged opposite to each other, and the second straight portion is located on a side of the backlight module away from the first substrate; The inner sealing glue is cured.

12. A display device, characterized in that: A display module comprising any one of claims 1 to 10.

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