Processing method of superconducting magnet helium hole of CICC conductor

Abstract

The invention relates to the technical field of coil production of electromagnetic devices, and discloses a processing method of a superconducting magnet helium hole of a CICC conductor, and the processing method comprises the following steps: 1, positioning the position of the superconducting magnet helium hole in the CICC conductor; 2, the CICC conductor and a punching device are installed in a matched mode; 3, after the rotating speed of the first milling cutter is adjusted to a preset constant value, the first milling cutter is controlled to feed so as to mill and form a first milling hole; fourthly, a first milling cutter in the punching equipment is replaced with a second milling cutter, the pitching angle of the second milling cutter relative to the first milling hole is adjusted, the second milling cutter is controlled to feed so as to form a second milling hole, and visible cracks appear on the wall face of the second metal coating layer at the second milling hole; and 5, removing the residual part of the second metal coating layer and the first metal coating layer through manual back gouging to form a superconducting magnet helium hole which sequentially penetrates through the second metal coating layer and the first metal coating layer. Therefore, the damage risk of the cable main body is reduced.

Description

Technical Field

[0001] This application relates to the technical field of coil production of electromagnetic devices, and in particular to a processing method for helium holes of a superconducting magnet of a CICC conductor. Background Art

[0002] The coil is an important part of a magnetic confinement fusion device. The shape of a large superconducting coil is generally formed by winding a superconductor material. The CICC conductor is a commonly used superconducting coil conductor, and the CICC conductor is a multi-stage cable. After multiple sub-cables are stranded, they are wrapped with a stainless steel thin skin of a certain thickness for protection, and then inserted into a stainless steel tube and extruded into shape.

[0003] Currently, when the CICC conductor is applied to a magnetic confinement fusion device, a hole structure communicating with a helium tube needs to be processed on the CICC conductor, and welding processing of the helium tube is performed at the CICC conductor to serve as a channel for liquid helium inside the coil formed by connecting the CICC conductors.

[0004] Among them, the processing accuracy requirements of the hole structure are high, and damage to the cable body in the CICC conductor needs to be avoided. In related technologies, the hole structure is usually manually processed by an operator, which requires the operator to have rich operation experience. At the same time, the work intensity of the operator is high, and high concentration needs to be maintained during operation, resulting in a large work load for the operator. Summary of the Invention

[0005] This application aims to at least solve one of the technical problems existing in the prior art. To this end, an object of this application is to propose a processing method for helium holes of a superconducting magnet of a CICC conductor to reduce the risk of damage to the cable body during the processing process.

[0006] Processing method for superconducting magnet helium hole of CICC conductor according to an embodiment of the present application. The CICC conductor includes a cable body, a first metal coating layer and a second metal coating layer that are sequentially coated outside the cable body. The processing method includes the following steps: Step 1, draw a line to position the superconducting magnet helium hole on the CICC conductor; Step 2, install and cooperate the CICC conductor with a punching device to clamp and fix the conductor in the helium hole area transition section of the CICC conductor through the punching device, and align the first milling cutter on the punching device with the punching starting point of the superconducting magnet helium hole; Step 3, after adjusting the rotation speed of the first milling cutter to a preset constant value, control the first milling cutter to feed to mill the second metal coating layer to form a first milling hole, and visible cracks appear on the wall surface of the second metal coating layer at the first milling hole; Step 4, replace the first milling cutter in the punching device with a second milling cutter, adjust the pitching angle of the second milling cutter relative to the first milling hole, and control the second milling cutter to feed to mill the second metal coating layer to form a second milling hole; Step 5, lift out the punching device, and remove the remaining part of the second metal coating layer and the first metal coating layer by manual root cleaning to form the superconducting magnet helium hole that sequentially penetrates the second metal coating layer and the first metal coating layer.

[0007] According to some embodiments of the present application, in the step 1, it further includes: using an infrared level to accurately transfer the position of the superconducting magnet helium hole to the conductor in the helium hole area transition section, and marking the size of the superconducting magnet helium hole on the conductor in the helium hole area transition section.

[0008] According to some embodiments of the present application, the punching device has a base body, a conductor clamp and a milling device. The conductor clamp is arranged on the base body. The conductor clamp is used to clamp and fix the conductor in the helium hole area transition section in the step 2. The milling device is arranged on the base body with adjustable position. In the step 2, it further includes: after adjusting the milling device to be parallel to the conductor in the helium hole area transition section, clamp and fix the conductor in the helium hole area transition section through the conductor clamp.

[0009] According to some embodiments of the present application, the milling device has a universal side milling head. The universal side milling head is used to install the first milling cutter or the second milling cutter. In the step 4, it further includes: adjusting the universal side milling head to adjust the pitching angle of the second milling cutter relative to the first milling hole.

[0010] According to some embodiments of the present application, in the third step, controlling the first milling cutter to feed and mill the second metal cladding layer to form a first milling hole includes: controlling the punching device to feed the first milling cutter located at the starting point to reach a first feed depth value, and then controlling the first milling cutter to mill horizontally to a first position; after the first milling cutter mills horizontally to the first position, controlling the punching device to feed the first milling cutter to reach a second feed depth value, and then controlling the first milling cutter to mill horizontally to a second position; wherein, the second position coincides with the starting point in the feed direction of the first milling cutter, and the first milling cutter can be controlled to reciprocally feed and mill between the first position and the second position.

[0011] According to some embodiments of the present application, the helium hole of the superconducting magnet is an oblong hole, and the first position and the second position are respectively the edge positions on both sides in the length direction of the oblong hole.

[0012] According to some embodiments of the present application, in the third step, after the cumulative feed amount of the first milling cutter during the reciprocating milling between the first position and the second position reaches a preset value, controlling the first milling cutter to the first position, and after feeding with a third feed depth value, controlling the first milling cutter to mill horizontally to the second position; after the first milling cutter mills horizontally to the second position, controlling the punching device to feed the first milling cutter to reach a fourth feed depth value, and then controlling the first milling cutter to mill horizontally to the first position; wherein, the fourth feed depth value is not less than the third feed depth value, and both the third feed depth value and the fourth feed depth value are less than the first feed depth value and the second feed depth value.

[0013] According to some embodiments of the present application, the first feed depth value is 0.3 mm, the second feed depth value is 0.3 mm, the third feed depth is 0.1 mm, and the fourth feed depth is 0.2 mm.

[0014] According to some embodiments of the present application, the second milling cutter is a dovetail groove milling cutter. In the fourth step, adjusting the pitch angle of the second milling cutter relative to the first milling hole includes: adjusting the second milling cutter to form a depression angle with the horizontal plane, and moving the second milling cutter to the root position at the upper part of the first milling hole; adjusting the second milling cutter to form an elevation angle with the horizontal plane, and moving the second milling cutter to the root position at the lower part of the first milling hole.

[0015] According to some embodiments of the present application, in the fourth step, controlling the second milling cutter to feed and mill the second metal cladding layer to form a second milling hole includes: controlling the single feed depth of the second milling cutter to be not greater than 0.1 mm.

[0016] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned by practice of the present application. Brief Description of the Drawings

[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 is a flowchart of a method for processing a superconducting magnet helium hole of a CICC conductor according to an embodiment of the present application; Figure 2 is a schematic cross-sectional view of a CICC conductor according to an embodiment of the present application; Figure 3 is a schematic diagram showing the cooperation of a CICC conductor and a second milling cutter according to an embodiment of the present application Figure 1 ; Figure 4 is a schematic diagram showing the cooperation of a CICC conductor and a second milling cutter according to an embodiment of the present application Figure 2 ; Figure 5 is a schematic diagram of a conductor in a transition section of a helium hole region according to an embodiment of the present application; Figure 6 is a schematic diagram of a multi-section conductor in a transition section of a helium hole region according to an embodiment of the present application; Figure 7 is a schematic structural diagram of a punching device according to an embodiment of the present application Figure 1 ; Figure 8 is a schematic structural diagram of a punching device according to an embodiment of the present application Figure 2 ; Figure 9 is a schematic diagram showing the cooperation of a punching device and a CICC conductor according to an embodiment of the present application; Figure 10 is a schematic diagram showing the partial cooperation of a punching device and a CICC conductor according to an embodiment of the present application; Figure 11 is a schematic top view of a coil winding production line according to an embodiment of the present application.

[0018] Reference Signs: Coil winding production line 1000; Rotary platform and mold 210; Automatic control console 300; Bending and forming device 400; Conductor support device 500; Sandblasting and cleaning device 600; Ultrasonic cleaning device 700; Conductor straightening device 800; Conductor feeding device 900; CICC conductor 100; Cable body 1; First metal cladding layer 2; Second metal cladding layer 3; First milling hole 31; Second milling hole 32; Superconducting magnet helium hole 10; Helium hole area transition section conductor 20; Punching device 200; Base body 4; Conductor clamp 5; Pre-tightening bolt 51; Milling device 6; Bracket 61; Power motor 62; Universal side milling head 63; Second milling cutter 7; Transverse adjustment device 81; Longitudinal adjustment device 82; Swing adjustment device 83. Specific implementation manner

[0019] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0020] Reference will be made below Figures 1 - 11 to describe a method for processing the superconducting magnet helium hole 10 of a CICC conductor 100 (Cable-in-Conduit Conductor: superconducting cable conductor) according to an embodiment of the present application. Among them, the above processing method is used to process and form the superconducting magnet helium hole 10 on the CICC conductor 100. The CICC conductor 100 includes a cable body 1 and a first metal cladding layer 2 and a second metal cladding layer 3 that are sequentially coated outside the cable body 1.

[0021] Coils are an important part of magnetic confinement fusion devices. The shape of large superconducting coils is generally formed by winding superconducting materials. The CICC conductor 100 is a commonly used superconducting coil conductor, and the CICC conductor 100 is a multi-stage cable. The above-mentioned cable body 1 is formed by stranding multiple sub-cables, and a certain thickness of stainless steel thin skin (i.e., the above-mentioned first metal cladding layer 2) is wrapped around the cable body 1 for protection, and then it is inserted into a stainless steel tube (i.e., the above-mentioned second metal cladding layer 3, such as: 316LN stainless steel tube) and extruded into shape.

[0022] Currently, when the CICC conductor 100 is applied to a magnetic confinement fusion device, it is necessary to process a hole structure for connecting the helium tube on the CICC conductor 100 and perform welding processing of the helium tube at the CICC conductor 100 to serve as a channel for liquid helium inside the coil formed by connecting the CICC conductors 100. Among them, the processing accuracy requirements of the hole structure are high, and it is necessary to avoid damage to the cable body 1 in the CICC conductor 100. In the related art, the hole structure is usually manually processed by an operator, resulting in the need for the operator to have rich operation experience. At the same time, the working intensity of the operator is high, and it is necessary to maintain a high degree of concentration for operation, making the working load of the operator relatively large.

[0023] The processing method according to an embodiment of the present application includes the following steps: Step 1, draw a line to position the position of the superconducting magnet helium hole 10 on the CICC conductor 100; Step 2, install and cooperate the CICC conductor 100 with the punching device 200 to clamp and fix the conductor 20 in the transition section of the helium hole area in the CICC conductor 100 through the punching device 200, and correspond the first milling cutter on the punching device 200 to the punching starting point of the superconducting magnet helium hole 10; Step 3, after adjusting the rotation speed of the first milling cutter to a preset constant value, control the first milling cutter to feed to mill the second metal cladding layer 3 to form a first milling hole 31, and visible cracks appear on the wall surface of the second metal cladding layer 3 at the first milling hole 31; Step 4, replace the first milling cutter in the punching device 200 with a second milling cutter 7, adjust the pitching angle of the second milling cutter 7 relative to the first milling hole 31, and control the second milling cutter 7 to feed to mill the second metal cladding layer 3 to form a second milling hole 32; Step 5, lift out the punching device 200, and manually remove the remaining part of the second metal cladding layer 3 and the first metal cladding layer 2 to form a superconducting magnet helium hole 10 that penetrates the second metal cladding layer 3 and the first metal cladding layer 2 in sequence.

[0024] It should be noted that the CICC conductor 100 is on the production line where the coil is wound and formed when processing the superconducting magnet helium hole 10. When punching the CICC conductor 100 through the punching device 200, the punching device 200 can be arranged at the conductor 20 in the transition section of the helium hole area where the superconducting magnet helium hole 10 needs to be processed in the CICC conductor 100 by hoisting, so as to cooperate with the conductor 20 in the transition section of the helium hole area through the punching device 200 to realize the hole processing operation. Among them, the above-mentioned "conductor 20 in the transition section of the helium hole area" refers to the conductor part in the inter-pancake transition section of the CICC conductor 100 where the superconducting magnet helium hole 10 is processed.

[0025] In the processing method of the present application, the processing position where the superconducting magnet helium hole 10 needs to be opened in the CICC conductor 100 can be determined first based on the layout requirements of the helium tube, and the processing position of the superconducting magnet helium hole 10 can be marked and positioned on the CICC conductor 100, so as to facilitate the subsequent correspondence between the punching device 200 and the processing position of the superconducting magnet helium hole 10.

[0026] Furthermore, the CICC conductor 100 is installed and cooperated with the installation device, and the conductor 20 in the transition section of the helium hole area that needs to be punched is clamped and fixed through the punching device 200 to prevent the conductor 20 in the transition section of the helium hole area from shaking during the punching process, which helps to improve the processing accuracy of the superconducting magnet helium hole 10. At the same time, the first milling cutter provided on the punching device 200 can be corresponded to the punching position of the superconducting magnet helium hole 10, so as to facilitate the subsequent milling of the second metal cladding layer 3 on the CICC conductor 100 through the punching device 200.

[0027] Among them, the punching device 200 can be equipped with a variety of cutting tools, such as the first milling cutter and the second milling cutter 7 described above, so as to perform hole processing on the CICC conductor 100 through the first milling cutter and the second milling cutter 7 respectively.

[0028] During the processing of the second metal cladding layer 3 by the punching device 200, first adjust the rotation speed of the first milling cutter to a preset constant value (such as: 2000 rpm, 3000 rpm, etc., Revolutions Per Minute: revolutions per minute), and control the feeding of the first milling cutter to mill the second metal cladding layer 3 to form a first milling hole 31, so that visible cracks can appear on the wall surface of the second metal cladding layer 3 at the first milling hole 31.

[0029] After the first milling hole 31 is formed, install the second milling cutter 7 on the punching device 200 and adjust the second milling cutter 7 into the first milling hole 31, so as to further mill the second metal cladding layer 3 through the second milling cutter 7 and further increase the depth of the root position of the hole structure formed on the second metal cladding layer 3. Among them, before the second milling cutter 7 performs milling feed, it is also necessary to adjust the rotation speed to a preset constant value, and the milling rotation speed of the second milling cutter 7 can be the same as that of the first milling cutter.

[0030] It can be understood that the pitching angle of the milling action of the second milling cutter 7 at the first milling hole 31 makes the second milling hole 32 gradually expand from the milling part of the second milling cutter 7 towards the inner side of the CICC conductor 100 (that is, the side of the first metal cladding layer 2 relative to the second metal cladding layer 3), which can increase the operation space for subsequent operators to manually clear the root and reduce the difficulty of manual root clearing for operators. At the same time, after the first milling cutter drills holes in the second metal cladding layer 3 to avoid cracks, stop the punching device 200 to prevent the first milling cutter from directly piercing through the second metal cladding layer 3 and avoid the first milling cutter directly contacting the first metal cladding layer 2 and piercing through the first metal cladding layer 2 to cause damage to the cable body 1. Among them, the first metal cladding layer 2 is wrapped around the cable body 1 and is closely attached to the cable body 1, and the thickness of the first metal cladding layer 2 is relatively thin. If the first milling cutter contacts the first metal cladding layer 2, there is a risk of damaging the cable body 1. Therefore, in the processing method of the present application, stop the punching device 200 after visible cracks appear on the wall surface of the second metal cladding layer 3 to avoid damage to the cable body 1 caused by the first milling cutter.

[0031] After the second milling hole 32 is machined on the CICC conductor 100, the punching device 200 can be separated from the CICC conductor 100 to reserve sufficient operating space on the side of the CICC conductor 100 where the second milling hole 32 is formed. The operator can use a special tool to manually chamfer the second milling hole 32 to remove the remaining part of the second metal coating layer 3 at the second milling hole 32 of the CICC conductor 100 and the first metal coating layer 2 corresponding to the second milling hole 32, so as to form a superconducting magnet helium hole 10 that penetrates the second metal coating layer 3 and the first metal coating layer 2 from the outside to the inside, realizing the machining of the superconducting magnet helium hole 10.

[0032] It should be noted that the special tools used by the operator include but are not limited to a die grinder (such as: a handheld oil-free die grinder), needle-nose pliers, tungsten carbide scriber, etc.

[0033] In the method for machining the superconducting magnet helium hole 10 of the CICC conductor 100 in the embodiment of the present application, through the cooperation of the punching device 200 and manual operation, first, the CICC conductor 100 is milled by the punching device 200 to sufficiently reduce the thickness of the second metal coating layer 3 until the second metal coating layer 3 cracks, and then the operator manually chamfers to form the superconducting magnet helium hole 10, thereby reducing the risk of damage to the cable body 1 while reducing the operation difficulty and workload of the operator, and through the pitching and yaw angle milling operations of the second milling cutter 7, the local material removal can be performed on the position where it is difficult to clean the root of the first milling hole 31, significantly reducing the difficulty of subsequent manual chamfering and improving the chamfering efficiency of the operator.

[0034] At the same time, during the machining process of the superconducting magnet helium hole 10, by scribing and positioning the machining position of the superconducting magnet helium hole 10, and the clamping cooperation between the punching device 200 and the conductor 20 in the transition section of the helium hole area, the punching accuracy of the punching device 200 for the CICC conductor 100 is improved.

[0035] In some embodiments of the present application, step one further includes: accurately transferring the position of the superconducting magnet helium hole 10 to the conductor 20 in the transition section of the helium hole area by using an infrared level, and marking the size of the superconducting magnet helium hole 10 on the conductor 20 in the transition section of the helium hole area. Among them, the marking method can be line marking.

[0036] During the marking process, the surface of the conductor 20 in the transition section of the helium hole area can be marked first by the infrared level, and the error is controlled within the range of 1 mm. A scriber is used in cooperation with a positioning tooling to perform line marking on the length and width dimensions of the superconducting magnet helium hole 10 to ensure the accuracy of subsequent hole machining by the punching device 200.

[0037] Combined with Figure 7 and Figure 8As shown, in some embodiments of the present application, the punching device 200 has a base body 4, a conductor clamp 5, and a milling device 6. The conductor clamp 5 is arranged on the base body 4 and is used to clamp and fix the conductor 20 of the transition section of the helium hole region in the second step. The milling device 6 is arranged on the base body 4 with adjustable position.

[0038] Among them, the conductor clamp 5 can be fixedly matched with the base body 4 so that after the conductor 20 of the transition section of the helium hole region is clamped by the conductor clamp 5, the position of the conductor 20 of the transition section of the helium hole region relative to the base body 4 is kept fixed, and the position of the milling device 6 on the base body 4 can be further adjusted to correspond the tool mounted on the milling device 6 to the hole processing position in the conductor 20 of the transition section of the helium hole region.

[0039] In the punching device, a lateral adjustment device 81, a longitudinal adjustment device 82, and a swing adjustment device 83 are arranged between the base body 4 and the milling device 6. The lateral adjustment device 81 can adjust the relative position between the milling device 6 and the base body 4 in the lateral direction. The longitudinal adjustment device 82 can adjust the relative position between the milling device 6 and the base body 4 in the longitudinal direction. The swing adjustment device 83 can adjust the horizontal position of the milling device 6 relative to the base body 4, so as to facilitate the corresponding arrangement of the milling device 6 and the hole processing position.

[0040] It should be noted that both the lateral adjustment direction and the longitudinal adjustment direction are direction adjustments in the same horizontal plane, and the lateral adjustment direction is perpendicular to the longitudinal adjustment direction. The longitudinal adjustment direction is also the inner and outer direction of the CICC conductor 100. The milling device 6 is longitudinally adjusted to move the milling device 6 closer to or farther from the CICC conductor 100. Under the action of the swing adjustment device 83, the milling device 6 can be driven to swing relative to the base body 4 around the first axis, so as to realize the adjustment of the inclination angle of the milling device 6 relative to the horizontal plane. At the same time, the above-mentioned adjustment devices (such as: the lateral adjustment device 81, the longitudinal adjustment device 82, the swing adjustment device 83) can be composed of worm gears, gear structures, etc. The specific structure of the adjustment device is not limited here.

[0041] Refer to Figure 7 As shown, the milling device 6 has a bracket 61 and a power motor 62. The bracket 61 is the installation carrier of the power motor 62. The power motor 62 is used to drive the tool to rotate to realize the milling function of the milling device 6, and the bracket 61 is connected and matched with the base body 4 through the above-mentioned adjustment device, so as to adjust the position of the power motor 62 and the tool arranged on the power motor 62 by adjusting the position of the bracket 61 relative to the base body 4. Among them, the conductor clamp 5 is arranged on one side of the power motor 62 for installing the tool.

[0042] Further, step two further includes: after adjusting the milling device 6 to be parallel to the conductor 20 of the transition section of the helium hole area, clamping and fixing the conductor 20 of the transition section of the helium hole area by means of the conductor clamp 5. Thus, the conductor 20 of the transition section of the helium hole area is fixed by the conductor clamp 5.

[0043] Referring to Figure 7 As shown, in the conductor clamp 5, the conductor clamp 5 is formed with a mounting groove for accommodating and arranging the above-mentioned conductor 20 of the transition section of the helium hole area. And a pre-tightening bolt 51 is provided in the conductor clamp 5. The pre-tightening bolt 51 penetrates through the wall surface of the mounting groove and is used for clamping and fixing the conductor 20 of the transition section of the helium hole area, so as to improve the clamping and fixing reliability of the conductor clamp 5 for the conductor 20 of the transition section of the helium hole area.

[0044] Wherein, when the conductor 20 of the transition section of the helium hole area extends in an arc shape, an appropriate amount of spacer blocks can be arranged in the mounting groove for filling to ensure the clamping stability of the conductor clamp 5 for the conductor 20 of the transition section of the helium hole area.

[0045] As Figure 7 shown, in a further embodiment of the present application, the milling device 6 has a universal side milling head 63, and the universal side milling head 63 is used for installing the first milling cutter or the second milling cutter 7.

[0046] It can be understood that the universal side milling head 63 is connected to the output end of the power motor 62 and is used for installing the cutting tool. The angle of the cutting tool can be adjusted through the universal side milling head 63 so as to adjust the pitching angle of the second milling cutter 7.

[0047] Further, step four further includes: adjusting the universal side milling head 63 to adjust the pitching angle of the second milling cutter 7 relative to the first milling hole 31, so as to adjust the second milling cutter 7 to an angle suitable for milling the root of the first milling hole 31, realizing further inwardly tapered milling at the first milling hole 31, increasing the opening range of the hole structure towards the inside, and reducing the operation difficulty of the operator.

[0048] In some embodiments of the present application, in step three, controlling the first milling cutter to feed and milling the second metal cladding layer 3 to form the first milling hole 31 includes: controlling the punching device 200 to feed the first milling cutter located at the starting point to reach the first feed depth value, and then controlling the first milling cutter to mill horizontally to the first position; after the first milling cutter mills horizontally to the first position, controlling the punching device 200 to feed the first milling cutter to reach the second feed depth value, and then controlling the first milling cutter to mill horizontally to the second position.

[0049] Wherein, the second position coincides with the starting point in the feed direction of the first milling cutter, and the first milling cutter can be controlled to reciprocally feed and mill between the first position and the second position. Thus, the first milling hole 31 is formed by milling the second metal cladding layer 3 with the first milling cutter.

[0050] Specifically, the first milling cutter starts feeding from its starting point. After the feeding depth of the first milling cutter reaches the first feeding depth value, the first milling cutter is moved horizontally to the first position to form a hole structure with an oval opening through the first milling cutter. After the first milling cutter reaches the first position, the first milling cutter is further controlled to feed. After the feeding depth of the first milling cutter reaches the second feeding depth value, the first milling cutter is controlled to mill horizontally to the second position (i.e., the position corresponding to the starting point in the feeding direction), thereby deepening the depth of the hole structure. Thus, by repeatedly performing the above operations, the feeding depth of the first milling cutter can be gradually increased, and the first milling hole 31 can be machined to a preset depth.

[0051] Referring to Figure 5 and Figure 10 As shown, in a further embodiment of the present application, the superconducting magnet helium hole 10 is an oval hole, and the first position and the second position are respectively the edge positions on both sides of the oval hole in the length direction. Thus, the first milling cutter can be reciprocally moved between the first position and the second position, and the feeding action of the first milling cutter is performed first before each translation, such as: controlling the first milling cutter to feed a first preset depth value, controlling the first milling cutter to feed a second depth value.

[0052] In some embodiments of the present application, in step three, after the cumulative feed amount during the reciprocating milling of the first milling cutter between the first position and the second position reaches a preset value, the first milling cutter is controlled to the first position, and after feeding at a third feed depth value, the first milling cutter is controlled to mill horizontally to the second position; after the first milling cutter mills horizontally to the second position, the punching device 200 is controlled to feed the first milling cutter to reach a fourth feed depth value, and then the first milling cutter is controlled to mill horizontally to the first position.

[0053] Wherein, the fourth feed depth value is not less than the third feed depth value, and both the third feed depth value and the fourth feed depth value are less than the first feed depth value and the second feed depth value.

[0054] Thus, after the cumulative feed amount of the first milling cutter reaches the preset value, the feed amount of the first milling cutter each time can be adjusted to the third feed depth value and the fourth feed depth value, and the second metal cladding layer 3 is further milled by the first milling cutter until obvious visible cracks are seen at the second metal cladding layer 3, and the milling action of the first milling cutter is stopped.

[0055] It should be noted that the cumulative feed of the first milling cutter needs to be less than the wall thickness of the second metal coating layer 3 before milling. That is to say, the cumulative feed of the first milling cutter is L1, and the wall thickness of the second metal coating layer 3 is L2, where L2 > L1, to prevent the second metal coating layer 3 from being directly penetrated due to the excessive single feed of the first milling cutter. Among them, the difference between L2 and L1 is preferably 0.5 mm, but is not limited thereto.

[0056] It can be understood that when the first milling cutter feeds at the first feed depth value or the second feed depth value each time, the feed depth of the first milling cutter is relatively large, thereby improving the processing efficiency of the first milling hole 31; when the first milling cutter feeds at the third feed depth value or the fourth feed depth value each time, the remaining wall thickness at the corresponding hole structure of the second metal coating layer 3 is relatively small. The second metal coating layer 3 can be prevented from being directly penetrated by the first milling cutter by reducing the single feed depth of the first milling cutter, facilitating the second metal coating layer 3 to be maintained in a state where obvious visible cracks are formed.

[0057] In a specific embodiment of the present application, the first feed depth value is 0.3 mm, the second feed depth value is 0.3 mm, the third feed depth is 0.1 mm, and the fourth feed depth is 0.2 mm.

[0058] It can be understood that if the single feed amount remains at the first feed depth value or the second feed depth value when the cumulative feed depth of the first milling cutter reaches the preset value, there will be a risk of the second metal coating layer 3 being directly penetrated. In the present application, by adjusting the single feed amount of the first milling cutter, the wall surface can be prevented from being directly penetrated by the first milling cutter due to excessive single feed amount, improving the hole processing reliability of the punching device 200.

[0059] Combined Figure 3 and Figure 4 As shown, in some embodiments of the present application, the second milling cutter 7 is a dovetail groove milling cutter. In step four, adjusting the pitch angle of the second milling cutter 7 relative to the first milling hole 31 includes: adjusting the second milling cutter 7 to form a depression angle with the horizontal plane and moving the second milling cutter 7 to the root position above the first milling hole 31; adjusting the second milling cutter 7 to form an elevation angle with the horizontal plane and moving the second milling cutter 7 to the root position below the first milling hole 31.

[0060] Thus, the second milling hole 32 can be formed by further milling the root of the first milling hole 31 with the second milling cutter 7. The depth of the second milling hole 32 at the root position of the hole structure is slightly larger than that of the first milling hole 31, thereby reducing the difficulty of subsequent manual root cleaning by the operator.

[0061] Referring to Figure 3As shown, when the second milling cutter 7 is arranged to be inclined downward relative to the first milling hole 31, the second milling cutter 7 has a downward depression angle relative to the horizontal direction, so that the root position of the upper part of the first milling hole 31 can be milled; referring to Figure 4 As shown, when the second milling cutter 7 is arranged to be inclined upward relative to the first milling hole 31, the second milling cutter 7 has an upward elevation angle relative to the horizontal direction, so that the root position of the lower part of the first milling hole 31 can be milled.

[0062] In a further embodiment of the present application, in step four, controlling the second milling cutter 7 to feed to mill the second metal cladding layer 3 to form the second milling hole 32 includes: controlling the single feed depth of the second milling cutter 7 to be no more than 0.1 mm, which can be 0.05 mm, 0.08 mm, etc.

[0063] It can be understood that after the second metal cladding layer 3 is milled by the first milling cutter, visible cracks have been formed in the wall surface area of the second metal cladding layer 3 corresponding to the first milling hole 31. If the single feed amount of the second milling cutter 7 is too large, there will be a risk that the second milling cutter 7 penetrates the second metal cladding layer 3. By controlling the single feed depth of the second milling cutter 7 within the range of 0.1 mm, the risk of the second metal cladding layer 3 being penetrated by the second milling cutter 7 can be reduced while milling the root of the first milling hole 31, the hole processing reliability of the punching device 200 can be improved, and the risk of the cable body 1 being damaged by the tool can be reduced.

[0064] In some embodiments of the present application, the total feed depth of the second milling hole 32 is less than the wall thickness of the second metal cladding layer 3, so as to prevent the second tool from passing through the second metal cladding layer 3.

[0065] It should be noted that in the CICC conductor 100, after the second metal cladding layer 3 is covered on the cable body 1 covered with the first metal cladding layer 2, the second metal cladding layer 3 needs to be extruded. Therefore, there will be slight differences in the thickness of the second metal cladding layer 3 at different positions. By controlling the cumulative feed depth of the tool within the wall thickness range of the second metal cladding layer 3, the tool can be effectively prevented from passing through the second metal cladding layer 3.

[0066] In some embodiments of the present application, the first milling cutter can be configured as a tungsten steel milling cutter.

[0067] In some embodiments of the present application, after the second milling hole 32 is formed by the punching device 200, the tool can be withdrawn from the second milling hole 32, and the conductor fixture 5 can be released from clamping and fixing the CICC conductor 100, so as to facilitate the separation of the punching device 200 from the CICC conductor 100 to further perform step five.

[0068] In step five of the embodiment of the present application, an operator can use a handheld electric grinder to further process the second milling hole 32 to remove the remaining stainless steel skin of the second metal coating layer 3 at the second milling hole 32 until the first metal coating layer 2 appears. It should be emphasized that in the straight region and the arc region of the second milling hole 32, precise removal is required and careful inspection is carried out.

[0069] Further, after exposing the first metal coating layer 2, the operator uses a tungsten steel scribing needle to pierce the first metal layer, and further uses an oblique mouth needle-nose pliers to pull out from the second metal coating layer 3 and the first metal coating layer 2 at the second milling hole 32 to complete the processing of the superconducting magnet helium hole 10. It should be noted that the above manual operation can be repeated to ensure the removal effect of the first metal coating layer 2 and the second metal coating layer 3.

[0070] Combined with Figure 6 and Figure 9 As shown, it should be noted that during the processing of the superconducting magnet helium hole 10, the second milling hole 32 can be formed on the helium hole region transition conductor 20 of the CICC conductor 100 by a punching device 200 first, or after multiple second milling holes 32 are formed on the same helium hole region transition conductor 20, the punching device 200 is lifted away, so that the operator can manually clear the roots of the multiple second milling holes 32 respectively to further improve the processing efficiency of the superconducting magnet helium hole 10.

[0071] Combined with Figures 1 - 10 Describe the processing process of the superconducting magnet helium hole 10 according to a specific embodiment of the present application: Use an infrared level to lead the helium hole processing center line to the surface of the helium hole region transition conductor 20 of the CICC conductor 100 and mark it, and control the transfer error within the range of 1 mm. Use a drawing needle and a positioning tooling to draw and position the length and width dimensions of the superconducting magnet helium hole 10; Install the punching device 200, adjust the position of the milling device 6 in the punching device 200, and after the position adjustment is completed, fix the milling device 6 on the seat body 4, and further clamp and fix the helium hole region transition conductor 20 by the conductor clamp 5; Install the first milling cutter on the universal side milling head 63, and the diameter deviation of the first milling cutter from the diameter of the superconducting magnet helium hole 10 is ≤ 0.2 mm. Move the position of the first milling cutter to the punching starting point, and the starting point position is the marked edge position of the helium hole drawing; Feed the first milling cutter at a speed of 3000 rpm. When the scale on the punching device 200 shows that the punching depth increases by 0.3 mm (i.e., the above-mentioned first feed depth value), control the first milling cutter to horizontally mill until the first position on the line. Also feed the first milling cutter at a speed of 3000 rpm. When the scale on the punching device 200 shows that the punching depth increases by 0.3 mm (i.e., the above-mentioned second feed depth value), control the first milling cutter to horizontally mill to the second position. Wherein, this step can be repeatedly executed until the cumulative feed depth dimension of the first milling hole 31 reaches the preset value and then stop milling; Further, continue to feed the first milling cutter at a speed of 3000 rpm. The single feed depth of the first milling cutter is 0.1 mm (i.e., the above-mentioned third feed depth value), and further control the first milling cutter to horizontally mill to the second position. Then, similarly control the single feed depth of the first milling cutter to be 0.2 mm (i.e., the above-mentioned fourth feed depth value) at 3000 rpm, and then further control the first milling cutter to horizontally mill to the first position. This step can be repeatedly executed until obvious visible cracks appear at the second metal cladding layer 3, and immediately stop milling; Replace the tool with the second milling cutter 7, adjust the second milling cutter 7 to form a depression angle with the horizontal plane, and then move the second milling cutter 7 to the root position above the first milling hole 31 to start milling the root depth of the first milling hole 31. The single feed depth shall not be greater than 0.1 mm. Then, make the second milling cutter 7 form an elevation angle with the horizontal plane, and casually move the second milling cutter 7 to the root position below the first milling hole 31 to start milling the root depth of the first milling hole 31. The single feed depth shall not be greater than 0.1 mm to machine and form the second milling hole 32; Remove the punching device 200, and the operator manually clears the root to machine and form the superconducting magnet helium hole 10 on the CICC conductor 100.

[0072] Compared with the prior art, the processing method of the superconducting magnet helium hole 10 of the CICC conductor 100 according to the embodiment of the present application has at least the following advantages: (1) The punching device 200 is clamped and matched with the CICC conductor 100, which can avoid the CICC conductor 100 from shaking during the machining process, ensure the hole machining accuracy, and during the punching process, the root of the hole structure formed by rough machining is processed by multiple tools (i.e., the first milling cutter and the second milling cutter 7) to remove local materials at the root position of the superconducting magnet helium hole 10, reducing the difficulty of subsequent manual root clearing and helping to improve the root clearing efficiency; (2) During the milling process of the first milling cutter, the single feed amount of the first milling cutter is adjusted to prevent the first milling cutter from penetrating the second metal cladding layer 3 and damaging the cable body 1, effectively reducing the risk of damage to the cable body 1 and improving the reliability of the processing process of the superconducting magnet helium hole 10.

[0073] Refer to Figure 11 as shown Figure 11 In the figure, a coil winding production line 1000 is shown. The coil winding production line 1000 is used to process a CICC conductor 100 to form a superconducting coil.

[0074] Among them, the coil winding production line 1000 includes: a rotary platform and a mold 210, an automatic control console 300, a bending and forming device 400, a conductor support device 500, a sandblasting and cleaning device 600, an ultrasonic cleaning device 700, a conductor straightening device 800, and a conductor feeding device 900.

[0075] Specifically, the conductor feeding device 900 can be used to feed the conductor to be processed at a constant feeding speed. The conductor straightening device 800 is used to straighten the conductor and further convey it to one side of the ultrasonic cleaning device 700 and the sandblasting and cleaning device 600, so as to ultrasonically clean the straightened conductor through the ultrasonic cleaning device 700 and further perform sandblasting and cleaning treatment on the conductor through the sandblasting and cleaning device 600.

[0076] Furthermore, the conductor after sandblasting and cleaning treatment can be conveyed to one side of the bending and forming device 400. A plurality of groups of conductor support devices 500 are arranged between the bending and forming device 400 and the sandblasting and cleaning device 600 to support the conductor on the conveying path through the conductor support devices 500.

[0077] Among them, the bending and forming device 400 can be used to measure the feeding length of the conductor and bend and form the conductor according to the contour of the coil. The rotary platform and the mold 210 are used to track the movement trajectory of the coil winding and forming, drop the mold conductor and bear the weight of the coil, and control the flatness and outer contour of the coil through the rotary platform work surface and the winding mold in the rotary platform and the mold 210.

[0078] Refer to Figure 11 , an automatic control console 300 is also provided in the coil winding production line 1000. The automatic control console 300 can be used to communicate with other devices in the coil winding production line 1000 (such as: the bending and forming device 400, the sandblasting and cleaning device 600, the ultrasonic cleaning device 700, the conductor straightening device 800, the conductor feeding device 900, etc.) to achieve automatic control of other devices.

[0079] It should be noted that the above-mentioned conductor is the CICC conductor 100. The punching device 200 for punching the superconducting magnet helium holes 10 on the CICC conductor 100 can be arranged at the circumferential outer position of the rotary platform and the mold 210 to punch the CICC conductor 100 arranged on the rotary platform and the mold 210.

[0080] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0081] In the description of the present application, the "first feature" and "second feature" may include one or more of such features.

[0082] In the description of the present application, the meaning of "a plurality of" is two or more.

[0083] In the description of the present application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween.

[0084] In the description of the present application, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature.

[0085] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0086] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for machining a helium hole in a superconducting magnet of a CICC conductor, characterized in that: The CICC conductor includes a cable body and a first metal coating layer and a second metal coating layer sequentially covering the cable body. The processing method includes the following steps: Step 1: Draw a line on the CICC conductor to locate the position of the helium hole of the superconducting magnet; Step 2: Install and cooperate the CICC conductor with a punching device, so that the punching device clamps and fixes the transition section conductor of the helium hole region in the CICC conductor, and aligns the first milling cutter on the punching device with the punching starting point of the helium hole of the superconducting magnet; Step 3: after adjusting the rotation speed of the first milling cutter to a preset constant value, controlling the first milling cutter to feed so as to mill the second metal cladding layer to form a first milling hole, and visible cracks appear on the wall surface of the second metal cladding layer at the first milling hole; Step 4: replacing the first milling cutter in the punching device with a second milling cutter, adjusting the pitch angle of the second milling cutter relative to the first milling hole, and controlling the feed of the second milling cutter to mill the second metal cladding layer to form a second milling hole; Step 5: lift out the drilling device, and remove the remaining part of the second metal cladding layer and the first metal cladding layer by manual root cleaning to form the superconducting magnet helium hole that sequentially penetrates the second metal cladding layer and the first metal cladding layer.

2. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 1, characterized in that: The step one also includes: An infrared level is used to accurately transfer the position of the superconducting magnet helium hole to the helium hole region transition section conductor, and the size of the superconducting magnet helium hole is marked on the helium hole region transition section conductor.

3. The method for machining a helium hole of a superconducting magnet of a CICC conductor according to claim 1, characterized in that: The punching device comprises a seat, a conductor clamp and a milling device, wherein the conductor clamp is arranged on the seat, and the conductor clamp is used to clamp and fix the conductor of the transition section of the helium hole area in the step 2, and the position of the milling device is adjustable on the seat, and the step 2 also includes: After the milling device is adjusted to be parallel to the helium hole region transition section conductor, the helium hole region transition section conductor is clamped and fixed by the conductor clamp.

4. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 3, characterized in that: The milling device has a universal side milling head, and the universal side milling head is used to install the first milling cutter or the second milling cutter. The step 4 also includes: The universal side milling head is adjusted to adjust the pitch angle of the second milling cutter relative to the first milling hole.

5. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 3, characterized in that: In the step three, controlling the first milling cutter to feed to mill the second metal cladding layer to form a first milling hole includes: After controlling the punching device to feed the first milling cutter located at the starting point to reach a first feeding depth value, controlling the first milling cutter to mill horizontally to a first position; After the first milling cutter mills horizontally to a first position, the punching device is controlled to feed the first milling cutter to a second feeding depth value, and then the first milling cutter is controlled to mill horizontally to a second position; wherein, The second position and the starting point coincide with each other in the feeding direction of the first milling cutter, and the first milling cutter can be controlled to perform reciprocating feeding and milling between the first position and the second position.

6. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 5, characterized in that: The helium hole of the superconducting magnet is an oblong hole, and the first position and the second position are edge positions on both sides of the oblong hole in the length direction respectively.

7. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 5, characterized in that: In the step three, after the accumulated feed amount of the first milling cutter during the reciprocating milling process between the first position and the second position reaches a preset value, Controlling the first milling cutter to the first position, and controlling the first milling cutter to mill horizontally to a second position after feeding at a third feed depth value; After the first milling cutter mills horizontally to the second position, the punching device is controlled to feed the first milling cutter to a fourth feeding depth value, and then the first milling cutter is controlled to mill horizontally to the first position; wherein, The first milling cutter can be controlled to reciprocate between the first position and the second position, the fourth feed depth value is not less than the third feed depth value, and the third feed depth value and the fourth feed depth value are both less than the first feed depth value and the second feed depth value.

8. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 7, characterized in that: The first feed depth value is 0.3 mm, the second feed depth value is 0.3 mm, the third feed depth is 0.1 mm, and the fourth feed depth is 0.2 mm.

9. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 1, characterized in that: The second milling cutter is a dovetail slot milling cutter. In the step 4, adjusting the pitch angle of the second milling cutter relative to the first milling hole comprises: Adjusting the second milling cutter to form a depression angle with the horizontal plane, and moving the second milling cutter to the root position of the upper part of the first milling hole; The second milling cutter is adjusted to have an elevation angle with respect to a horizontal plane, and the second milling cutter is moved to a root position at a lower portion of the first milling hole.

10. The method for machining a helium hole in a superconducting magnet of a CICC conductor according to claim 9, characterized in that: In the step 4, controlling the second milling cutter to feed to mill the second metal cladding layer to form a second milling hole comprises: The single feeding depth of the second milling cutter is controlled to be no greater than 0.1 mm.

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