Large-current intelligent electronic preheating relay

Abstract

The invention discloses a large-current intelligent electronic preheating relay. A control module is used for receiving and processing an instruction signal sent by an ECU; the voltage acquisition module is used for acquiring power supply voltage and output end voltage; the LDO module is used for converting voltage into MCU power supply; the MCU module adopts a single-chip microcomputer U1 and is used for receiving input of the control module so as to control the driving module and the indicating lamp module. The electronic preheating relay with the current sampling function is provided, and the circuit is timely cut off and the relay is protected by detecting the current of the circuit in real time under the conditions of overload, short circuit and the like. Meanwhile, when the relay does not work, the relay enters a dormant state, the whole circuit generates microampere-level current, power loss is reduced, a reverse connection protection function is achieved, and therefore the vehicle safety problem caused by the fact that the relay does not have the reverse connection protection function and the current sampling function and is high in power consumption in the prior art is solved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic preheating relays, in particular to a large-current intelligent electronic preheating relay. Background Art

[0002] When a diesel engine is started in cold state, the temperature of the injected fuel is too low, resulting in poor ignition performance or even failure to start. Therefore, a preheating system is required to improve the starting performance of the engine. The preheating device heats the air or fuel in the cylinder, increases the temperature in the cylinder, improves the combustion conditions, and thus helps the diesel engine start in a low temperature environment. It can open or close the circuit when receiving a control signal, thereby controlling the power on and off of the heating device. This ensures that the engine reaches a suitable operating temperature when starting.

[0003] The existing preheating relay has no current sampling function. In actual use, short circuits, overloads and other situations often occur and cannot be monitored in real time. There are problems such as unreliable overload protection, inaccurate protection against poor contact, and long short-circuit protection capabilities. In extreme cases, the sudden output of large current causes high temperature, damages the line, and even causes serious accidents such as fires of the entire vehicle.

[0004] The traditional preheating relay is in standby mode when not working, generating a current consumption of tens of milliamperes. Long standby time will cause the battery to run out of power and fail to start.

[0005] Due to misoperation, the positive and negative poles of the power supply are reversed, and the current flows from the source to the drain of the MOSFET. The parasitic diode of the MOSFET will generate huge power consumption, the heating wire will continue to heat, and the temperature will rise rapidly, causing damage to the relay; when the heater end and the power supply are reversed, the product can heat normally, but when the MOSFET is turned off, the heating wire is still heating and cannot be turned off, making the relay uncontrollable.

[0006] Therefore, a high-current intelligent electronic preheating relay is proposed. Summary of the invention

[0007] The object of the present invention is to provide a large current intelligent electronic preheating relay to solve the problems raised in the above background technology.

[0008] To achieve the above object, the present invention provides the following technical solution: a high current intelligent electronic preheating relay, comprising:

[0009] The control module is used to receive and process the command signal sent by the ECU;

[0010] The voltage acquisition module is used to acquire the power supply voltage and the output terminal voltage;

[0011] The LDO module is used to convert voltage into power supply for MCU;

[0012] The MCU module uses a single-chip microcomputer U1, which is used to receive the input of the control module and then control the drive module and the indicator light module;

[0013] The drive module controls the MOSFET switch according to the collected current to protect the system;

[0014] The indicator light module is used to display faults;

[0015] The execution module is used to detect the current situation in real time and feedback it to the drive module.

[0016] Preferably: The control module includes a first input terminal IN1 and a second input terminal IN2;

[0017] A resistor R24 is provided between the first input terminal IN1 and the second input terminal IN2;

[0018] A resistor R25 and a resistor R29 are connected to the first input terminal IN1 and grounded, and both ends of the resistor R29 are connected in parallel with a capacitor C18 and grounded;

[0019] A resistor R26 and a resistor R32 are connected to the second input terminal IN2 and grounded, and both ends of the resistor R32 are connected in parallel with a capacitor C17 and grounded;

[0020] The resistor R25, the resistor R29 and the capacitor C18 are connected to the PIN11 pin of the single-chip microcomputer U1, and the resistor R26, the resistor R32 and the capacitor C17 are connected to the PIN12 pin of the single-chip microcomputer U1.

[0021] Preferably: The voltage acquisition module includes two parts: power supply voltage acquisition and output terminal voltage acquisition;

[0022] The power supply voltage acquisition includes a resistor R27, a resistor R30 and a capacitor C19. Both ends of the resistor R30 are connected in parallel with the capacitor C19 and grounded, and the resistor R27 and the resistor R30 are connected to the PIN2 pin of the single-chip microcomputer U1;

[0023] The output terminal voltage acquisition includes a resistor R28 and a resistor R31, and the resistor R28 and the resistor R31 are connected to the PIN1 pin of the single-chip microcomputer U1.

[0024] Preferably: The LDO module includes a chip U2; The PIN1 pin of the chip U2 is connected to the diode D2 and the emitter of the triode Q1. The base of the triode Q1 is connected to the zener diode ZD1, the capacitor C3 and the resistor R2. The collector of the triode Q1 is connected to the resistor R1, and the resistor R1 and the resistor R2 are connected to the VS input;

[0025] The PIN1 pin of the chip U2 is also connected to capacitors C6 and C7. The PIN2 pin of the chip U2 is grounded, and the PIN5 pin of the chip U2 is connected to capacitor C5.

[0026] Preferably: The PIN4 pin of the single-chip microcomputer U1 in the MCU module is connected to resistor R3 and capacitor C2, and a capacitor C4 is connected between the PIN7 and PIN9 pins of the single-chip microcomputer U1.

[0027] Preferably: The driving module includes a single-chip microcomputer U3; a resistor R15 is connected between the PIN1 and PIN6 pins of the single-chip microcomputer U3. The PIN2, PIN3, PIN4, and PIN5 pins of the single-chip microcomputer U3 are respectively connected to the PIN18, PIN20, PIN17, and PIN13 pins of the single-chip microcomputer U1;

[0028] The PIN6 pin of the single-chip microcomputer U3 is also connected to resistor R18 and is connected to the PIN14 pin of the single-chip microcomputer U1. The PIN10 pin of the single-chip microcomputer U3 is connected to resistor R19 and is connected to the PIN8 pin of the single-chip microcomputer U1. A resistor R23 is connected between the PIN18 and PIN19 pins of the single-chip microcomputer U3. A thermistor R22 is connected between the PIN19 and PIN20 pins of the single-chip microcomputer U3;

[0029] The PIN25 pin of the single-chip microcomputer U3 receives the B+ terminal, and is connected to the voltage VS output by diode D3 and resistor R17. At the same time, it is connected to capacitor C11, and is also connected to capacitors C12, C13, and C14. A capacitor C10 is connected between the PIN28 and PIN29 pins of the single-chip microcomputer U3.

[0030] Preferably: The execution module includes an MOS transistor Q3; the source electrode of the MOS transistor Q3 is connected to the B+ terminal. The gate electrode of the MOS transistor Q3 is connected to the negative electrode of the zener diode ZD2 and one end of the resistor R8. The positive electrode of the zener diode ZD2 is connected to the B+ terminal. The other end of the resistor R8 is connected to the PIN27 pin of the single-chip microcomputer U3. The drain electrode of the MOS transistor Q3 is connected to one ends of a resistor R10, a resistor R11, and a resistor R9. The other end of the resistor R9 is connected to the PIN21 pin of the single-chip microcomputer U3. The drain electrode of an MOS transistor Q4 is connected to the resistor R10 and the resistor R11. The other end of the resistor R12 is connected to the PIN20 pin of the single-chip microcomputer U3. A capacitor C8 is connected between the resistor R9 and the resistor R12;

[0031] One end of a resistor R14 is connected to the gate of the MOS transistor Q4, and the other end of the resistor R14 is connected to the PIN24 pin of the single-chip microcomputer U3. A resistor R16 is connected between the gate and the source of the MOS transistor Q4. One end of a resistor R33 is connected to the source of the MOS transistor Q4 and is connected to the PIN23 pin of the single-chip microcomputer U3. The source of the MOS transistor Q4 is also connected to a capacitor C20, a resistor R20, a diode D4, P1, and a heating wire.

[0032] Preferably, the indicator module includes a triode Q5; the collector of the triode Q5 is connected to a light-emitting diode LED1 and a resistor R13 and receives a 3.3V power supply input. The base of the triode Q5 is connected to a resistor R34 and is connected to the PIN10 pin of the single-chip microcomputer U1. A resistor R21 is connected between the base and the emitter of the triode Q5 and is grounded.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows: An electronic preheating relay with a current sampling function is provided. By detecting the circuit current in real time, when an overload or short circuit occurs, the circuit is cut off in time to protect the relay. At the same time, when the relay is not working, it enters the sleep state, and the entire circuit generates a microampere-level current, reducing power consumption. Moreover, it also has an anti-reverse connection protection function, thereby overcoming the vehicle safety problems caused by the lack of anti-reverse connection protection function, current sampling function, and high power consumption in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the control module of the present invention;

[0035] Figure 2 It is a schematic diagram of the indicator module of the present invention;

[0036] Figure 3 It is a schematic diagram of the voltage acquisition module of the present invention;

[0037] Figure 4 It is a schematic diagram of the MCU module of the present invention;

[0038] Figure 5 It is a schematic diagram of the LDO module of the present invention;

[0039] Figure 6 It is a schematic diagram of the drive module of the present invention;

[0040] Figure 7 It is a schematic diagram of the execution module of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0042] Please refer toFigures 1-7 , the present invention provides a technical solution:

[0043] As Figure 1 shown, there is a control module; a resistor R24 is provided between the first input terminal IN1 and the second input terminal IN2. IN1 is grounded through R25 and R29, IN2 is grounded through R26 and R32. A connection terminal connected to the PIN11 pin of the U1 single-chip microcomputer in the MCU module is provided between R25 and R29, and a connection terminal connected to the PIN12 pin of the U1 single-chip microcomputer in the MCU module is provided between R26 and R32. C18 is connected in parallel across both ends of R29 and grounded, C17 is connected in parallel across both ends of R32 and grounded, C18 is connected to the PIN11 pin of the U1 single-chip microcomputer in the MCU module, and C17 is connected to the PIN12 pin of the U1 single-chip microcomputer in the MCU module.

[0044] As Figure 2 shown, there is an indicator light module; the indicator light module receives a 3.3V power supply input, is connected to the collector of Q5 through R13 and LED1. The base of Q5 is connected to the PIN10 pin of the U1 single-chip microcomputer in the MCU module through R34 and is grounded through R21, and the emitter of Q5 is grounded.

[0045] As Figure 3 shown, there is a voltage acquisition module; this module includes two parts: power supply voltage acquisition and output terminal voltage acquisition. Among them, the power supply voltage acquisition part receives the voltage at the drain of Q3 in the execution module, is grounded through R27 and R30. C19 is connected in parallel across both ends of R30 and grounded. A connection terminal connected to the PIN2 pin of the U1 single-chip microcomputer in the MCU module is provided between R27 and R30. The output terminal voltage acquisition part receives the output voltage of the PIN23 pin of the U3 single-chip microcomputer in the drive module, is grounded through R28 and R31. A connection terminal connected to the PIN1 pin of the U1 single-chip microcomputer in the MCU module is provided between R28 and R31.

[0046] As Figure 4The MCU module shown; it includes single-chip microcomputer U1, resistor R3, capacitors C2 and C4. The PIN1 pin of the single-chip microcomputer U1 needs to be connected to R28, R31 and D5 in the voltage acquisition module; the PIN2 pin of the single-chip microcomputer U1 needs to be connected to R27, R30, C19 and D6 in the voltage acquisition module; the PIN4 pin of the single-chip microcomputer U1 is respectively connected to 3.3V power supply through R3 and grounded through C2; the PIN7 pin of the single-chip microcomputer U1 is grounded and connected to one end of C4; the PIN9 pin of the single-chip microcomputer U1 is connected to the other end of C4 and 3.3V power supply; the PIN10 pin of the single-chip microcomputer U1 needs to be connected to the base of Q5, C15 and R21 in the indicator light module; the PIN11 pin of the single-chip microcomputer U1 needs to be connected to D7, C18, R25 and R29 in the control module; the PIN12 pin of the single-chip microcomputer U1 needs to be connected to D8, C17, R26 and R32 in the control module; the PIN13 pin of the single-chip microcomputer U1 needs to be connected to the PIN5 pin of the single-chip microcomputer U3 in the drive module; the PIN14 pin needs to be connected to R18 in the drive module; the PIN17 pin needs to be connected to the PIN4 pin of the single-chip microcomputer U3 in the drive module; the PIN18 pin needs to be connected to the PIN2 pin of the single-chip microcomputer U3 in the drive module; the PIN20 pin needs to be connected to the PIN3 pin of the single-chip microcomputer U3 in the drive module.

[0047] As Figure 5 The LDO module shown; this module receives VS input and is connected to the base of Q1 through R2, the collector of Q1 through R1. The base of Q1 is grounded through the parallel connection of ZD1 and C3. The emitter of Q1 is connected to the PIN1 pin of U2 through D2. The PIN1 pin of U2 is grounded through the parallel connection of C6 and C7. The PIN2 pin of U2 is grounded. The PIN5 pin of U2 is grounded through C5 and outputs 3.3V voltage.

[0048] As Figure 6The driving module shown in the figure; this module includes a single-chip microcomputer U3, R15, R18, R19, C16, C10, C11, C12, C13, C14, R17, D3, an R22 thermistor, and R23. The PIN1 pin of the single-chip microcomputer U3 needs to be connected to the 3.3V power supply and R15; the PIN2 pin needs to be connected to the PIN18 pin of the U1 single-chip microcomputer in the MCU module; the PIN3 pin needs to be connected to the PIN20 pin of the U1 single-chip microcomputer in the MCU module; the PIN4 pin needs to be connected to the PIN17 pin of the U1 single-chip microcomputer in the MCU module; the PIN5 pin needs to be connected to the PIN13 pin of the U1 single-chip microcomputer in the MCU module; the PIN6 pin needs to be connected to R15 and connected to the PIN14 pin of the U1 single-chip microcomputer in the MCU module through R18; the PIN7 and PIN8 pins are both grounded, and the PIN10 pin is connected to the PIN8 pin of the U1 single-chip microcomputer in the MCU module through R19; the PIN12 pin is grounded through C16; the PIN13 pin is grounded; the PIN18 pin is connected to the PIN19 pin through R23; the PIN19 pin is connected to the PIN20 pin through the R22 thermistor; the PIN20 pin needs to be connected to C8 and R12 in the execution module; the PIN21 pin needs to be connected to C8 and R9 in the execution module; the PIN23 pin needs to be connected to R28 in the voltage acquisition module and R33 in the execution module; the PIN24 pin needs to be connected to R14 in the execution module; the PIN25 pin receives the voltage VS output by B+ through D3 and R17 and is connected to C11, and is grounded in parallel through C12, C13, and C14; the PIN27 pin is connected to C11 and is grounded in parallel through C12, C13, and C14; the PIN28 pin is connected to the PIN29 pin through C10; the PIN33 pin is grounded.

[0049] As Figure 7 The execution module shown in the figure; this module is mainly composed of a set of sampling circuits and a set of back-to-back MOSFET connections. This execution module receives the B+ input and is connected to the source electrode of Q3 and the positive electrode of ZD2. The gate electrode of Q3 is connected to the negative electrode of ZD2 and R8, and R8 is connected to the PIN27 pin of the single-chip microcomputer U3 in the driving module. The drain electrode of Q3 is connected to the drain electrode of Q4 through the sampling circuit. The sampling circuit includes R10, R11, R9, R12, and C8. The drain electrode of Q3 is connected to R10 and R11 and is connected to the PIN21 pin of the U3 single-chip microcomputer in the driving module through R9; the drain electrode of Q4 is connected to R10 and R11 and is connected to the PIN20 pin of the U3 single-chip microcomputer in the driving module through R12. R9 and R12 are connected through C8. The gate electrode of Q4 is connected to one end of R16 and is connected to the PIN24 pin of the single-chip microcomputer U3 through R14. The source electrode of Q4 is connected to the other end of R16 and is connected to the PIN23 pin of U3 through R33 and is grounded in parallel through C20, R20, D4, and P1. The source electrode of Q4 is connected to the heating wire 1.

[0050] Functions of each module

[0051] When any of the PIN12 and PIN11 pins of the single-chip microcomputer U1 receives a high level, the MCU module is awakened, and the drive module is awakened through PIN13, PIN17, PIN18, and PIN20. The drive module turns on Q3 through PIN27; at the same time, the MCU module sends a working instruction to the drive module, making the PIN24 of the drive module output a high level to turn on Q4 of the execution module. At this time, the execution module starts to work, heating the heating wire, and the PIN10 pin of the MCU module outputs a high level to control the indicator module to be always on.

[0052] The drive module detects the voltages at both ends of the sampling resistors R10 and R11 in the execution module through PIN21 and PIN20. The drive module amplifies the voltage signal and converts it into a current signal through an internal operational amplifier circuit. When the collected current is greater than 240A and lasts for 1s, it enters the overload protection. The drive module immediately turns off Q3 and Q4 for protection, and finally feeds back the fault information to the MCU module through the PIN6 pin. The PIN10 pin of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0053] The drive module detects the voltages at both ends of the sampling resistors R10 and R11 in the execution module through PIN21 and PIN20. The drive module amplifies the voltage signal and converts it into a current signal through an internal operational amplifier circuit. When the collected current is greater than 267A, it enters the hardware short-circuit protection. The drive module immediately turns off Q3 and Q4, and finally feeds back the fault information to the MCU module through the PIN6 pin. The PIN10 pin of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0054] When any of the PIN12 and PIN11 pins of the single-chip microcomputer U1 receives a high level and the MCU module is awakened while the drive is in the sleep state, the MCU collects the power supply voltage and the output voltage through the voltage acquisition module, obtains the power supply voltage and the output voltage. When the output voltage is greater than the power supply voltage, it enters the power supply and load heating wire short-circuit protection. The PIN10 pin of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0055] When the positive and negative poles of the power supply are reversely connected, Q3 and Q4 of the execution module are turned off. At this time, the B+ voltage goes from the heating wire to the source electrode of Q4, flows through the parasitic diode of Q4 to the sampling resistors R10 and R11, and then flows into the drain electrode of Q3. Since Q3 is in the off state, the voltage cannot pass through. Therefore, at this time, no current is generated in the entire power circuit, realizing the reverse connection protection. After the power supply is reversely connected for a period of time and returns to the normal connection state, the relay can still work normally.

[0056] When the power supply is reversely connected to the heating wire of the load, Q3 and Q4 of the execution module are turned off. At this time, the B+ voltage goes from the heating wire to the source electrode of Q4, flows through the parasitic diode of Q4 to the sampling resistors R10 and R11, and then flows into the drain electrode of Q3. Since Q3 is in the off state and the voltage cannot pass through, at this time, no current is generated in the entire power circuit, realizing the reverse connection protection of the power supply and the load. After being reversely connected for a period of time and restored to the normal connection state, the relay can still work normally.

[0057] When there is poor contact between the power supply and the power terminal, the drive module detects the voltage across the sampling resistors R10 and R11 in the execution module through PIN21 and PIN20. The drive module amplifies the voltage signal through the internal operational amplifier circuit and converts it into a current signal. The MCU module reads the current value of the sampling circuit through the pins PIN13, PIN17, PIN18, and PIN20. When the current value is less than 32A, the MCU module determines that there is poor contact of the device. The MCU module sends a heating-off instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply of the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0058] When there is poor contact between the grounding terminal, the heating wire and the terminal, the drive module detects the voltage across the sampling resistors R10 and R11 in the execution module through PIN21 and PIN20. The drive module amplifies the voltage signal through the internal operational amplifier circuit and converts it into a current signal. The MCU module reads the current value of the sampling circuit through the pins PIN13, PIN17, PIN18, and PIN20. When the output terminal voltage / current value > 1Ω, it enters the poor contact protection. The MCU module sends a heating-off instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply of the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0059] When the load heating wire is open-circuited, the drive module detects the voltages across the sampling resistors R10 and R11 in the execution module through PIN21 and PIN20. The drive module amplifies the voltage signal through an internal operational amplifier circuit and converts it into a current signal. The MCU module reads the current value of the sampling circuit through the pins PIN13, PIN17, PIN18, and PIN20. The MCU module collects the power supply voltage and the output voltage through the voltage acquisition module. When the output voltage / current value is greater than 1KΩ, the MCU module determines that the load is open-circuited. The MCU module sends a heating shutdown instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply to the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0060] The drive module obtains the MOSFET temperature through PIN18, PIN19, and PIN20. The MCU module reads the MOSFET temperature value through the pins PIN13, PIN17, PIN18, and PIN20. When the temperature is greater than 115°C, the MCU module determines overheating. The MCU module sends a heating shutdown instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply to the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0061] The MCU module's voltage acquisition module collects the power supply voltage. When the voltage is greater than 32.5V, the MCU module determines overvoltage. The MCU module sends a heating shutdown instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply to the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0062] The MCU module's voltage acquisition module collects the power supply voltage. When the power supply voltage is less than 7.5V, the MCU module determines undervoltage. The MCU module sends a heating shutdown instruction through the pins PIN13, PIN17, PIN18, and PIN20 of U1. The PIN24 of the drive module outputs a low level to cut off the power supply to the heating wire. The PIN10 of the MCU module outputs high and low levels to control the indicator module to flash quickly for alarm.

[0063] When the low levels are detected on the PIN11 and PIN12 pins of the MCU module, a heating shutdown instruction is sent through the PIN13, PIN17, PIN18, and PIN20 pins of U1, the PIN24 output of the drive module outputs a low level to cut off the power supply to the heating wire, and the PIN10 pin of the MCU module outputs a low level to control the indicator module to turn off. Then, a drive sleep instruction is sent through the PIN13, PIN17, PIN18, and PIN20 pins of U1 to make the drive module enter the sleep state. Then, the MCU module enters the self-sleep state, and the current of the entire circuit is at the microamp level, achieving a low-power sleep state.

[0064] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high current intelligent electronic preheating relay, characterized in that: include: The control module is used to receive and process the command signal sent by the ECU; The voltage acquisition module is used to collect power supply voltage and output terminal voltage; The LDO module is used to convert voltage into power supply for MCU; The MCU module uses a single-chip microcomputer U1, which is used to receive input from the control module and then control the drive module and the indicator light module; The driving module controls the MOSFET switch according to the collected current to protect the system; The indicator light module is used to display faults; The execution module is used to detect the current situation in real time and feed back to the driving module.

2. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The control module includes a first input terminal IN1 and a second input terminal IN2; A resistor R24 ​​is provided between the first input terminal IN1 and the second input terminal IN2; The first input terminal IN1 is connected to a resistor R25 and a resistor R29 and is grounded, and both ends of the resistor R29 are connected in parallel with a capacitor C18 and are grounded; The second input terminal IN2 is connected to a resistor R26 and a resistor R32 and is grounded, and both ends of the resistor R32 are connected in parallel with a capacitor C17 and are grounded; The resistor R25, the resistor R29 and the capacitor C18 are connected to the PIN11 pin of the single-chip computer U1, and the resistor R26, the resistor R32 and the capacitor C17 are connected to the PIN12 pin of the single-chip computer U1.

3. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The voltage acquisition module includes two parts: power supply voltage acquisition and output terminal voltage acquisition; The power supply voltage acquisition includes a resistor R27, a resistor R30 and a capacitor C19, both ends of the resistor R30 are connected in parallel with the capacitor C19 and grounded, and the resistor R27 and the resistor R30 are connected to the PIN2 pin of the single-chip computer U1; The output terminal voltage acquisition includes a resistor R28 and a resistor R31, and the resistor R28 and the resistor R31 are connected to the PIN1 pin of the single chip computer U1.

4. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The LDO module includes a chip U2; The PIN1 pin of the chip U2 is connected to a diode D2 and the emitter of a transistor Q1, the base of the transistor Q1 is connected to a voltage stabilizing diode ZD1, a capacitor C3 and a resistor R2, the collector of the transistor Q1 is connected to a resistor R1, and the resistor R1 and the resistor R2 are connected to a VS input; The PIN1 pin of the chip U2 is also connected to capacitors C6 and C7, the PIN2 pin of the chip U2 is grounded, and the PIN5 pin of the chip U2 is connected to capacitor C5.

5. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The PIN4 pin of the single-chip microcomputer U1 in the MCU module is connected to a resistor R3 and a capacitor C2, and the capacitor C4 is connected between the PIN7 and PIN9 pins of the single-chip microcomputer U1.

6. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The driving module includes a single chip microcomputer U3; A resistor R15 is connected between the PIN1 and PIN6 pins of the single-chip microcomputer U3, and the PIN2, PIN3, PIN4 and PIN5 pins of the single-chip microcomputer U3 are respectively connected to the PIN18, PIN20, PIN17 and PIN13 pins of the single-chip microcomputer U1; The PIN6 pin of the single-chip microcomputer U3 is also connected to a resistor R18 and connected to the PIN14 pin of the single-chip microcomputer U1, the PIN10 pin of the single-chip microcomputer U3 is connected to a resistor R19 and connected to the PIN8 pin of the single-chip microcomputer U1, a resistor R23 is connected between the PIN18 and PIN19 pins of the single-chip microcomputer U3, and a thermistor R22 is connected between the PIN19 and PIN20 pins of the single-chip microcomputer U3; The PIN25 pin of the single-chip microcomputer U3 receives the B+ terminal, and is connected to the voltage VS output by the diode D3 and the resistor R17, and is also connected to the capacitor C11, and is also connected to the capacitor C12, the capacitor C13 and the capacitor C14. The capacitor C10 is connected between the PIN28 and PIN29 pins of the single-chip microcomputer U3.

7. A high current intelligent electronic preheating relay according to claim 6, characterized in that: The execution module includes a MOS tube Q3; The source of the MOS tube Q3 is connected to the B+ terminal, the gate of the MOS tube Q3 is connected to the cathode of the voltage stabilizing diode ZD2 and one end of the resistor R8, the anode of the voltage stabilizing diode ZD2 is connected to the B+ terminal, the other end of the resistor R8 is connected to the PIN27 pin of the single-chip computer U3, the drain of the MOS tube Q3 is connected to the resistor R10, the resistor R11 and one end of the resistor R9, the other end of the resistor R9 is connected to the PIN21 pin of the single-chip computer U3, the resistor R10 and the resistor R11 are connected to the drain of the MOS tube Q4, the drain of the MOS tube Q4 is also connected to one end of the resistor R12, the other end of the resistor R12 is connected to the PIN20 pin of the single-chip computer U3, and the capacitor C8 is connected between the resistor R9 and the resistor R12; The gate of the MOS tube Q4 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to the PIN24 pin of the single-chip computer U3, a resistor R16 is connected between the gate and the source of the MOS tube Q4, the source of the MOS tube Q4 is connected to the resistor R33 and connected to the PIN23 pin of the single-chip computer U3, and the source of the MOS tube Q4 is also connected to the capacitor C20, the resistor R20, the diode D4, P1 and the heating wire.

8. A high current intelligent electronic preheating relay according to claim 1, characterized in that: The indicator light module includes a transistor Q5; The collector of the transistor Q5 is connected to the light-emitting diode LED1 and the resistor R13 and receives a 3.3V power supply input, the base of the transistor Q5 is connected to the resistor R34 and is connected to the PIN10 pin of the microcontroller U1, and a resistor R21 is connected between the base and the emitter of the transistor Q5 and is grounded.

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