Wet etching equipment, etching method, display panel and electronic device

Abstract

The present application provides a wet etching device, an etching method, a display panel, and an electronic device. The wet etching device includes: a chamber including a first opening and an inner wall; a blocking assembly disposed on the inner wall and above the first opening, the blocking assembly being configured to prevent the etching liquid adhering to the inner wall from flowing to the first opening and / or being transferred to the workpiece to be etched transferred to the first opening. By providing a blocking assembly above the product outlet of the box body of the wet etching device, it is possible to prevent the etching liquid adhering to the inner wall at the product outlet from dripping onto the workpiece to be etched output from the product outlet, thereby avoiding unnecessary etching or etching influence on the workpiece to be etched caused by the dripping etching liquid, and ensuring the product yield of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more particularly, to a wet etching device, an etching method, a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, TVs, laptops, and desktop computers due to their advantages of high image quality, power saving, thin body, and wide application range, and have become the mainstream in display devices. In the preparation process of traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of traditional OLED processes on display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0003] However, the manufacturing process of current OLED display products needs to be improved. Summary of the Invention

[0004] In order to overcome the above deficiencies in the prior art, the purpose of the present application is to provide a wet etching device, which includes:

[0005] A chamber, including a first port and an inner wall;

[0006] A blocking component disposed on the inner wall and above the first port, the blocking component being used to prevent the etching liquid adhering to the inner wall from flowing to the first port and / or being transferred to the workpiece to be etched at the first port.

[0007] In some possible implementation manners, the blocking component includes a collection groove, or the blocking component includes a baffle disposed on the inner wall and above the first port, and the baffle and the inner wall form a diversion groove with an upward opening,

[0008] and / or, the first port includes an outlet or an inlet, or there are multiple first ports, and the multiple first ports include an outlet and an inlet, and corresponding blocking components are respectively provided for the outlet and the inlet.

[0009] In some possible implementations, the width of the blocking component in the first direction is greater than the width of the component to be etched in the first direction; the first direction is parallel to the horizontal direction;

[0010] and / or, the width of the blocking component in the first direction is greater than the width of the first opening in the first direction.

[0011] In some possible implementations, the width of the blocking component in the first direction is greater than the width of the component to be etched in the first direction; the first direction is parallel to the horizontal direction;

[0012] and / or, the width of the blocking component in the first direction is less than the width of the first opening in the first direction.

[0013] In some possible implementations, in the vertical direction, the set height of the first side of the blocking component is greater than the set height of the second side of the blocking component; the first side and the second side of the blocking component are arranged along the length direction of the blocking component;

[0014] Or, in the vertical direction, the set height of the middle part of the blocking component is greater than the set heights of the two sides of the blocking component, and the middle part and the two sides of the blocking component are arranged along the length direction of the blocking component.

[0015] In some possible implementations, there are multiple blocking components, and the multiple blocking components are arranged side by side in the vertical direction.

[0016] In some possible implementations, the angle between the baffle and the inner wall is less than 90°;

[0017] In the vertical direction, the height of the side of the baffle away from the inner wall is greater than the height of the side of the baffle close to the inner wall.

[0018] In some possible implementations, the inner wall is provided with a receiving groove, and the baffle extends out of the receiving groove to prevent the etching liquid attached to the inner wall from flowing to the first opening; the baffle retracts into the receiving groove to remove the etching liquid attached to the outer wall of the baffle,

[0019] Or, the baffle is movably connected to the inner wall, and the baffle can extend out or retract relative to the inner wall back and forth.

[0020] In some possible implementations, the wet etching device further includes a liquid recovery component and an etching liquid spraying component located in the chamber;

[0021] The liquid recovery component is connected to the etching liquid spraying component;

[0022] The liquid recovery component includes a chemical liquid storage device, a power device, and a liquid recovery device;

[0023] The etching liquid in the blocking component flows into the liquid recovery device, and the liquid recovery device is connected to the chemical liquid storage device;

[0024] The power device is connected between the liquid medicine storage device and the etching liquid spraying component.

[0025] In some possible implementation manners, the wet etching device further includes a gas blowing component located near the first opening, and the gas blowing component is located inside and / or outside the chamber; the gas blowing component is used to blow air to remove the residual etching liquid on the workpiece to be etched.

[0026] Alternatively, the wet etching device further includes a gas blowing component located inside the chamber and near the first opening. When the distance between the workpiece to be etched and the first opening of the chamber is greater than a preset distance, the gas blowing component blows off the etching liquid on the outer wall of the blocking component; when the distance between the workpiece to be etched and the first opening of the chamber is less than or equal to the preset distance, the gas blowing component blows off the etching liquid medicine on the workpiece to be etched from the workpiece to be etched.

[0027] Another object of the present application is to provide a wet etching device, which includes:

[0028] A chamber, including a first opening and an inner wall;

[0029] A removing component, which is used to remove the etching liquid attached to the inner wall above the first opening.

[0030] Another object of the present application is to provide an etching method, which includes:

[0031] The transfer component transfers the workpiece to be etched to the spraying range of the etching liquid spraying component in the chamber, so that the etching liquid spraying component sprays the etching liquid medicine on the workpiece to be etched;

[0032] The transfer component transfers the workpiece to be etched to the first opening of the chamber, and a blocking component is arranged on the inner wall of the chamber and above the first opening. The blocking component is used to prevent the etching liquid attached to the inner wall from flowing to the workpiece to be etched transferred to the first opening.

[0033] In some possible implementation manners, before or after the transfer component transfers the workpiece to be etched to the first opening of the chamber, it further includes:

[0034] The transfer component transfers the workpiece to be etched to the blowing range of the gas blowing component, so that the gas blowing component blows off the etching liquid medicine on the workpiece to be etched from the workpiece to be etched;

[0035] Alternatively, before the transfer component transfers the workpiece to be etched to the first opening of the chamber, it further includes:

[0036] The transfer component transfers the workpiece to be etched to the blowing range of the first gas blowing component, so that the first gas blowing component blows off the etching liquid medicine on the workpiece to be etched from the workpiece to be etched;

[0037] After the transfer component transfers the workpiece to be etched to the first opening of the chamber, it further includes:

[0038] The transfer component transfers the workpiece to be etched to the spraying range of the second gas spraying component, so that the second gas spraying component blows the etching liquid medicine on the workpiece to be etched off the workpiece to be etched.

[0039] Another object of the present application is to provide an etching method, including:

[0040] The transfer component transfers the workpiece to be etched from the inlet of the chamber to the spraying range of the etching liquid spraying component, so that the etching liquid spraying component sprays the etching liquid medicine onto the workpiece to be etched;

[0041] When the distance between the workpiece to be etched and the first port of the chamber is greater than a preset distance, the first gas spraying component blows off the etching liquid on the inner wall of the chamber near the first port of the chamber;

[0042] When the distance between the workpiece to be etched and the first port of the chamber is less than or equal to the preset distance, adjust the spraying direction of the first gas spraying component, so that the first gas spraying component blows the etching liquid medicine on the workpiece to be etched off the workpiece to be etched; or, when the distance between the workpiece to be etched and the first port of the chamber is less than or equal to the preset distance, the second gas spraying component blows the etching liquid medicine on the workpiece to be etched off the workpiece to be etched; the first port includes an outlet or an inlet.

[0043] Another object of the present application is to provide a display panel, at least one film layer in the display panel is etched and formed by the wet etching equipment provided by the present application; the display panel includes:

[0044] A substrate;

[0045] An isolation structure on one side of the substrate, the isolation structure encloses a plurality of isolation openings; the isolation structure includes a receiving portion, a supporting portion and a shielding portion which are sequentially stacked along the direction away from the substrate, and the orthographic projections of the supporting portion and the receiving portion on the substrate are located within the orthographic projection of the shielding portion on the substrate; the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the receiving portion on the substrate;

[0046] A plurality of light-emitting devices, at least part of the light-emitting devices are located in the corresponding isolation openings.

[0047] Another object of the present application is to provide an electronic device, the electronic device includes a display panel made by the wet etching equipment provided by the present application, or the electronic device includes a display panel made by the etching method provided by the present application, or the electronic device includes the display panel provided by the present application.

[0048] Compared with the prior art, the present application has the following beneficial effects:

[0049] The present application provides a wet etching device, an etching method, a display panel, and an electronic device. By providing a blocking component above the first opening of the chamber of the wet etching device, it is possible to prevent the etching liquid adhering to the inner wall above the first opening from dripping onto the workpiece to be etched passing through the first opening, thereby avoiding unnecessary etching or etching influence on the workpiece to be etched by the dripping etching liquid and ensuring the product yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0051] Figure 1 Schematic diagram of a wet etching device in the related art;

[0052] Figure 2 Schematic diagram of an existing related display panel;

[0053] Figure 3 Overall schematic diagram of the wet etching device provided by the present application;

[0054] Figure 4 One of the sectional schematic diagrams of the wet etching device provided by the present application;

[0055] Figure 5 Another sectional schematic diagram of the wet etching device provided by the present application;

[0056] Figure 6 Another sectional schematic diagram of the wet etching device provided by the present application;

[0057] Figure 7 Another sectional schematic diagram of the wet etching device provided by the present application;

[0058] Figure 8 Another sectional schematic diagram of the wet etching device provided by the present application;

[0059] Figure 9 Another sectional schematic diagram of the wet etching device provided by the present application;

[0060] Figure 10 Another sectional schematic diagram of the wet etching device provided by the present application;

[0061] Figure 11 Another sectional schematic diagram of the wet etching device provided by the present application;

[0062] Figure 12a Another sectional schematic diagram of the wet etching device provided by the present application;

[0063] Figure 12b The tenth cross-sectional schematic diagram of the wet etching equipment provided by this application;

[0064] Figure 13 One of the step flow schematic diagrams of the etching method provided by this application;

[0065] Figure 14 The second step flow schematic diagram of the etching method provided by this application;

[0066] Figure 15 The schematic diagram of the display panel provided by this application.

[0067] Icons: 111 - Substrate; 112 - Array functional layer; 120 - First electrode; 130 - Pixel defining layer; 140 - Isolation structure; 141 - Support part; 142 - Blocking part; 143 - Receiving part; 810 - Light emitting device; 910 - Isolation opening; 150 - Light emitting functional layer; 160 - Second electrode; 170 - Encapsulation unit; 180 - First encapsulation layer; 190 - Second encapsulation layer; 200 - Box body; 300 - Spray component; 100 - Component to be etched; 701 - Etching droplet; 210 - Inner wall; 201 - First opening; 2011 - Outlet; 2012 - Inlet; 220 - Blocking component; 221 - Baffle; 211 - First inner wall; 212 - Second inner wall; 231 - Accommodation groove; 310 - Liquid knife nozzle; 320 - Spray nozzle; 500 - Gas blowing component; 400 - Liquid recovery component; 410 - Chemical liquid storage device; 420 - Power device; 600 - Conveyor component. Detailed implementation manners

[0068] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are some, but not all, of the embodiments of this application. Usually, the components of the embodiments of this application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0069] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application that is claimed, but merely represents selected embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application.

[0070] It should be noted that: Similar reference numerals and letters denote similar items in the following accompanying drawings. Therefore, once an item is defined in one accompanying drawing, it does not need to be further defined and explained in subsequent accompanying drawings.

[0071] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and should not be construed as indicating or implying relative importance.

[0072] It should be noted that, without conflict, different features in the embodiments of the present application may be combined with each other.

[0073] During the manufacturing process of a display panel, some film layers need to be patterned through wet etching operations. Please refer to Figure 1 , the wet etching operation usually needs to be performed in a closed box body 200'. The etching liquid spraying assembly 300' sprays the etching liquid onto the workpiece to be etched 100' (such as a display panel). After the wet etching operation is completed, the workpiece to be etched 100' is sent out from the outlet 2011' on the box body 200' and enters the next manufacturing process.

[0074] It has been found through research that during the spraying process of the etching liquid, some etching liquid droplets 701' may splash and adhere to the inner wall 210'. During the process of sending out the workpiece to be etched 100' after the wet etching operation is completed, the etching liquid adhering to the inner wall 210' above the outlet 2011' may drip onto the workpiece to be etched 100', causing secondary etching of the workpiece to be etched 100' and affecting the product yield.

[0075] For example, please refer to Figure 2 , in some related display panels, an isolation structure 140' with isolation openings 910' is provided above the pixel defining layer 130'. When depositing the light-emitting material layer and the conductive material layer to form the light-emitting functional layer 150' and the second electrode 160' of the light-emitting device 810', the light-emitting material layer and the conductive material layer between different isolation openings 910' can be disconnected, so that the light-emitting functional layer 150' and the second electrode 160' can be formed by etching after the whole layer is deposited.

[0076] Among them, the isolation structure 140' generally includes a receiving portion 143', a supporting portion 141', and a shielding portion 142' that are stacked in a direction away from the substrate 111'. Under normal circumstances, the receiving portion 143' needs to protrude compared to the supporting portion 141' so that the second electrode 160' can be lapped with the receiving portion 143' to ensure that the second electrode 160' and the isolation structure 140' can be electrically connected. However, if in the above etching operation, the dripping etching liquid causes secondary etching of the receiving portion 143', it will cause the receiving portion 143' to shrink compared to the supporting portion 141' (as shown by the circular dotted line frame in Figure 2 ), which will further cause the second electrode 160' to be unable to effectively lap with the receiving portion 143', resulting in dark spots in the display panel and affecting the product yield.

[0077] In view of this, this embodiment provides a solution that can improve the yield of the wet etching operation of the display panel. The solution provided in this embodiment will be elaborated in detail below.

[0078] Please refer to Figure 3 , Figure 3 which is a perspective schematic diagram of a wet etching device provided in this embodiment. The wet etching device may include a box body 200 that forms a chamber and other etching operation components disposed in the chamber. The workpiece to be etched 100 (such as a display panel) can complete the wet etching operation in this chamber.

[0079] The chamber includes an inner wall 210 and a first opening 201.

[0080] For example, the first opening 201 may include an outlet 2011 for outputting the workpiece to be etched 100 that has completed wet etching. The workpiece to be etched 100 (such as a display panel) usually completes wet etching in a horizontally placed state in the box body 200 and leaves the box body 200 through the outlet 2011 along the horizontal product output direction after the wet etching operation. Optionally, the first opening 201 may further include an inlet 2012 disposed opposite to the outlet 2011. Alternatively, there are multiple first openings 201, and the multiple first openings 201 include the outlet 2011 and the inlet 2012.

[0081] In this embodiment, the wet etching device may further include a blocking component 220. The blocking component 220 is disposed on the inner wall 210 and above the first opening 201. The blocking component 220 is used to prevent the etching liquid attached to the inner wall 210 above the first opening 201 from flowing to the first opening 201 and / or being transmitted to the workpiece to be etched 100 passing through the first opening 201. The blocking component 220 is used to prevent the etching liquid attached to the inner wall 210 above the first opening 201 from flowing to the workpiece to be etched. That is, the blocking component 220 is used to prevent the etching liquid attached to the inner wall 210 above the first opening 201 from dripping onto the workpiece to be etched 100 output from or passing through the first opening 201.

[0082] Based on the above design, in the wet etching equipment provided in this embodiment, by arranging a blocking component 220 above the first opening 201 of the box body 200 of the wet etching equipment, the etching liquid adhering to the inner wall 210 above the first opening 201 can be intercepted by the blocking component 220 when dripping downward, avoiding unnecessary secondary etching or etching influence caused by the etching liquid dripping onto the workpiece to be etched 100 when the workpiece to be etched 100 passes through the first opening 201, thereby ensuring the product yield of the display panel.

[0083] For example, the first opening 201 may include an outlet 2011. At least a part of the blocking component 220 is arranged on the inner wall 210 and above the outlet 2011.

[0084] For example, the first opening 201 may include an inlet 2012. At least a part of the blocking component 220 is arranged on the inner wall 210 and above the inlet 2012.

[0085] For example, a plurality of first openings 201 include an outlet 2011 and an inlet 2012. Corresponding blocking components 220 are arranged corresponding to both the outlet 2011 and the inlet 2012.

[0086] For example, the blocking component 220 includes a collecting groove to collect the etching liquid on the inner wall 210 above the first opening 201.

[0087] In some possible implementation manners, please refer to Figure 4 , Figure 4 For Figure 3 is a partial sectional view in the X direction in

[0088] Thus, after the etching liquid droplets 701 remaining on the inner wall 210 fall into the diversion groove, they can flow along the diversion groove, thereby better avoiding the etching liquid droplets 701 falling onto the workpiece to be etched 100 sent out from the first opening 201.

[0089] In some possible implementation manners, please refer to Figure 5 , Figure 5 For Figure 3 is a sectional view in the Y direction in

[0090] For example, in the horizontal direction, the width W1 of the baffle 221 perpendicular to the product output direction (which can be the conveying direction of the workpiece to be etched or the extending direction of the conveying path) is greater than the width W2 of the workpiece to be etched 100 perpendicular to the product output direction. That is, in the above-mentioned width direction, the baffle 221 can cover the workpiece to be etched 100, so as to comprehensively block the etching solution dripping above the workpiece to be etched 100.

[0091] Optionally, the width W1 of the blocking component 220 in the first direction is greater than the width W3 of the first port 201 in the first direction. For example, the width W1 of the baffle 221 in the first direction is greater than the width W3 of the first port 201 in the first direction.

[0092] For example, in the horizontal direction, the width W1 of the baffle 221 perpendicular to the product output direction is greater than the width W3 of the first port 201 perpendicular to the product output direction.

[0093] In some possible implementation manners, please refer to Figure 6 , the width W1 of the blocking component 220 in the first direction is less than the width W3 of the first port 201 in the first direction. For example, the width W1 of the baffle 221 in the first direction is less than the width W3 of the first port 201 in the first direction.

[0094] For example, the width W1 of the baffle 221 in the first direction is less than the width W4 of the inner wall 210 provided with the first port 201 in the first direction.

[0095] For example, in the horizontal direction, the width W1 of the baffle 221 perpendicular to the product output direction is less than the width W4 of the inner wall 210 provided with the first port 201 perpendicular to the product output direction.

[0096] For example, the inner wall 210 includes a first inner wall 211 for setting the baffle 221 and second inner walls 212 located on both sides of the first inner wall 211 in the horizontal direction. In the Figure 6 shown X direction, there is a gap between at least one end of the baffle 221 forming the diversion groove and the second inner wall 212. In this way, the etching solution collected in the diversion groove can drip and be recycled downward from at least one end of the diversion groove.

[0097] In some possible implementation manners, please refer to Figure 7 , in the vertical direction Z, the set height of the first side of the blocking component 220 is greater than the set height of the second side of the blocking component 220. The first side and the second side of the blocking component 220 are arranged along the length direction of the blocking component 220 (which can be parallel to the direction X). In the vertical direction, the set height of one side of the baffle 221 is greater than the set height of the other side of the baffle 221.

[0098] In this way, the etching liquid collected in the diversion groove formed by the baffle 221 can flow towards the end with a lower set height of the baffle 221 and drip from this side to the bottom of the box body 200, thereby better avoiding the deposition and overflow of the etching liquid in the diversion groove.

[0099] For example, in the vertical direction, the set height in the middle of the blocking component 220 is equal to the set height on both sides of the blocking component 220. For example, in the vertical direction, the set height in the middle of the baffle 221 is equal to the set height on both sides of the blocking component 220.

[0100] For example, in the vertical direction, the side of the blocking component 220 close to the first opening 201 is at the same height as the upper side of the first opening 201. For example, in the vertical direction, the side of the baffle 221 close to the first opening 201 is at the same height as the upper side of the first opening 201, so as to collect the etching liquid attached to the inner wall above the first opening 201 to the greatest extent.

[0101] In some other possible implementation manners, please refer to Figure 8 , in the vertical direction, the set height in the middle of the blocking component 220 is greater than the set height on both sides of the blocking component 220. For example, in the vertical direction, the set height in the middle of the baffle 221 is greater than the set height on both sides of the baffle 221. For example, the middle and both sides of the blocking component 220 are arranged along the length direction of the blocking component (which can be parallel to the direction X).

[0102] In this way, the etching liquid collected in the diversion groove formed by the baffle 221 can flow towards both ends of the baffle 221 and drip from both ends to the bottom of the box body 200, thereby better avoiding the deposition and overflow of the etching liquid in the diversion groove.

[0103] In some other possible implementation manners, please refer to Figure 9 , there are multiple blocking components 220, and the multiple blocking components 220 are arranged side by side in the vertical direction. Or, multiple baffles 221 are arranged side by side in the vertical direction.

[0104] In this way, the etching liquid remaining at different positions of the inner wall 210 can be shared and converge into different diversion grooves, avoiding excessive overflow of the etching liquid converged in a single diversion groove.

[0105] In some possible implementation manners, please refer to Figure 10 , the included angle between the baffle 221 and the inner wall 210 is less than 90°. For example, in the vertical direction, the height of the side of the baffle 221 away from the inner wall 210 is greater than the height of the side of the baffle 221 close to the inner wall 210.

[0106] That is, the bottom of the diversion groove formed by the baffle 221 is not horizontally arranged. In this way, the etching liquid droplets 701 converged in the diversion groove can better converge and flow with each other, avoiding the residue of the etching liquid droplets 701 in the diversion groove.

[0107] In some possible implementations, please refer to Figure 11 , a receiving groove 231 is provided on the inner wall 210, and the baffle 221 extends out of the receiving groove 231 to prevent the etching liquid attached to the inner wall 210 from flowing to the first port, so as to collect the etching liquid attached to the inner wall 210 and avoid the etching liquid attached to the inner wall 210 from dripping onto the workpiece to be etched; the baffle 221 is withdrawn into the receiving groove 231 to remove or scrape off the etching liquid attached to the outer side wall of the baffle 221, so as to avoid the accumulation of the etching liquid on the outer side wall of the baffle 221 away from the inner wall 210 and dripping onto the workpiece to be etched. The baffle can contact the side wall of the receiving groove 231 to remove the etching liquid on the outer side wall of the baffle 221.

[0108] For example, when the distance between the workpiece 100 to be etched and the first port of the chamber is greater than a preset distance, the baffle 221 is withdrawn into the receiving groove 231. For example, when the distance between the workpiece 100 to be etched and the first port of the chamber is less than or equal to the preset distance, the baffle 221 extends out of the receiving groove 231.

[0109] For example, when the workpiece 100 to be etched is not at the first port of the chamber or is far from the first port, the baffle 221 is withdrawn into the receiving groove 231. For example, when the workpiece 100 to be etched passes through the first port of the chamber, the baffle 221 extends out of the receiving groove 231.

[0110] For example, for the baffle corresponding to the outlet, when the workpiece 100 to be etched is not at the outlet of the chamber or is far from the outlet, the baffle 221 is withdrawn into the receiving groove 231. For example, when the workpiece 100 to be etched passes through the outlet of the chamber, the baffle 221 extends out of the receiving groove 231, so as to prevent the etching liquid on the inner wall 210 from dripping onto the workpiece 100 to be etched.

[0111] For example, for the baffle corresponding to the inlet, when the workpiece 100 to be etched is not at the inlet of the chamber or is far from the inlet, the baffle 221 is withdrawn into the receiving groove 231. For example, when the workpiece 100 to be etched passes through the inlet of the chamber, the baffle 221 extends out of the receiving groove 231, so as to prevent the etching liquid on the inner wall 210 from dripping onto the workpiece 100 to be etched.

[0112] For example, when the baffle 221 extends out of the receiving groove 231, the included angle between the baffle 221 and the inner wall 210 is less than 90°. For example, when the baffle 221 extends out of the receiving groove 231, in the vertical direction, the height of the side of the baffle 221 away from the inner wall 210 is greater than the height of the side of the baffle 221 close to the inner wall 210.

[0113] For example, please refer to Figure 11 , the baffle 221 is movably connected to the inner wall 210, and the baffle 221 can extend out or retract back and forth relative to the inner wall 210.

[0114] For example, during the process of spraying the etching solution, the baffle 221 can retract relative to the inner wall 210, thereby preventing the etching liquid from splashing outside the baffle 221; during the process of outputting the workpiece to be etched 100, the baffle 221 can extend relative to the inner wall 210, thereby blocking the etching liquid on the inner wall 210 from dripping onto the workpiece to be etched 100.

[0115] In some possible implementation manners, please refer to Figure 12a , the wet etching device further includes an etching solution spraying assembly 300 located in the chamber.

[0116] For example, the etching solution spraying assembly 300 may include a liquid knife nozzle 310 near the side of the inlet 2012 and a plurality of spray nozzles 320 located in the middle of the chamber.

[0117] Optionally, the wet etching device further includes a liquid recovery assembly 400. The liquid recovery assembly 400 is connected to the etching solution spraying assembly 300.

[0118] The liquid recovery assembly 400 includes a chemical solution storage device 410, a power device 420, and a liquid recovery device 250; the etching liquid in the blocking assembly 220 is blocked from flowing into the liquid recovery device 250, and the liquid recovery device 250 is connected to the chemical solution storage device 410; the power device 420 is connected between the chemical solution storage device 410 and the etching solution spraying assembly 300.

[0119] For example, the liquid recovery device 250 is located at the bottom of the box body 200 or the chamber, and the liquid recovery device 250 is connected to the chemical solution storage device 410. The liquid recovery device 250 can be used to converge the etching solution at the bottom of the box body 200 or the chamber and make the etching solution enter the chemical solution storage device 410. The chemical solution storage device 410 is also connected to the power device 420. After the sprayed etching liquid in the wet etching operation flows to the bottom of the box body 200, it enters the chemical solution storage device 410, and the power device 420 can pump the etching solution in the chemical solution storage device 410 into the etching solution spraying assembly 300 for reuse. For example, the power device 420 is connected between the chemical solution storage device 410 and the etching solution spraying assembly 300.

[0120] In some possible implementation manners, the wet etching device further includes a gas blowing assembly 500 located near the first port 201. The gas blowing assembly 500 is located inside and / or outside the chamber, and the gas blowing assembly 500 is used to blow off the residual etching liquid on the workpiece to be etched 100.

[0121] For example, the gas blowing assembly is used to blow air to remove the residual etching solution on the workpiece to be etched.

[0122] Alternatively, the wet etching device further includes a gas blowing assembly located inside the chamber and near the first opening 201. When the distance between the workpiece to be etched and the first opening 201 of the chamber is greater than a preset distance, the gas blowing assembly 500 blows off the etching liquid on the outer wall of the blocking assembly 220 to prevent the accumulation of the etching liquid on the outer wall of the blocking assembly 220 and its dripping onto the workpiece to be etched. When the distance between the workpiece to be etched 100 and the first opening 201 of the chamber is less than or equal to the preset distance, the etching solution on the workpiece to be etched 100 is blown off from the workpiece to be etched.

[0123] For example, please refer to Figure 12b , the gas blowing assembly 500 may include a first gas blowing assembly 510 located inside the chamber (which may be inside the first chamber) and a second gas blowing assembly 520 located outside the chamber (which may be outside the first chamber or inside another chamber, such as inside the second chamber). For example, the first gas blowing assembly 510 and the second gas blowing assembly 520 may be located in different chambers.

[0124] For example, the wet etching device further includes a gas blowing assembly located inside the chamber and near the first opening 201. When the distance between the workpiece to be etched and the first opening 201 of the chamber is greater than a preset distance (for example, when the workpiece to be etched is not at the first opening at this time), the gas blowing assembly 500 blows off the etching liquid on the outer wall of the blocking assembly 220. When the distance between the workpiece to be etched and the first opening 201 of the chamber is less than or equal to the preset distance (for example, when the workpiece to be etched will pass through the first opening at this time), the etching solution on the workpiece to be etched is blown off from the workpiece to be etched.

[0125] Optionally, the wet etching device provided in this embodiment may further include a transfer assembly 600 disposed inside the box body 200 or the chamber. For example, the transfer assembly 600 may include a plurality of rollers for carrying and transporting the workpiece to be etched 100.

[0126] This embodiment also provides a wet etching device, which includes:

[0127] A chamber, including a first opening 201 and an inner wall 210;

[0128] A removal assembly for removing the etching liquid adhering to the inner wall 210 above the first opening 201.

[0129] For example, the removal component may include one or more of a squeegee and a gas blowing component. By providing the removal component in the wet etching apparatus, the etching liquid adhering to the inner wall above the first opening can be removed, reducing or avoiding the dripping of the etching liquid adhering to the inner wall onto the workpiece to be etched passing through the first opening, thereby avoiding unnecessary etching or etching effects on the workpiece to be etched by the dripping etching liquid and ensuring the product yield of the display panel. For example, when the distance between the workpiece to be etched and the first opening 201 of the chamber is greater than a preset distance, the gas blowing component 500 blows off the etching liquid on the inner wall 210; when the distance between the workpiece to be etched and the first opening 201 of the chamber is less than or equal to the preset distance, the etching liquid medicine on the workpiece to be etched is blown off from the workpiece to be etched.

[0130] For example, when the distance between the workpiece to be etched and the outlet 2011 of the chamber is greater than a preset distance (for example, when the workpiece to be etched is not at the outlet 2011 at this time), the gas blowing component 500 blows off the etching liquid on the inner wall 210; when the distance between the workpiece to be etched and the outlet 2011 of the chamber is less than or equal to the preset distance (for example, when the workpiece to be etched will pass through the outlet 2011 at this time), the etching liquid medicine on the workpiece to be etched is blown off from the workpiece to be etched. The gas blowing component 500 corresponding to the outlet 2011 may be located inside the chamber.

[0131] For example, the gas blowing component 500 corresponding to the outlet 2011 may be located outside the chamber. After the workpiece to be etched passes through the outlet 2011, the gas blowing component 500 located outside the chamber blows off the etching liquid medicine on the workpiece to be etched from the workpiece to be etched.

[0132] For example, when the distance between the workpiece to be etched and the inlet 2022 of the chamber is greater than a preset distance (for example, when the workpiece to be etched is not at the inlet at this time), the gas blowing component 500 blows off the etching liquid on the inner wall 210; when the distance between the workpiece to be etched and the inlet 2022 of the chamber is less than or equal to the preset distance (for example, when the workpiece to be etched will pass through the inlet at this time), the etching liquid medicine on the workpiece to be etched is blown off from the workpiece to be etched. The gas blowing component 500 corresponding to the inlet 2022 may be located inside the chamber.

[0133] This embodiment can be combined with some or all of the features in the above embodiments, which will not be elaborated here.

[0134] Please refer to Figure 13 , this embodiment also provides an etching method, and the wet etching apparatus in the above embodiment can adopt this etching method. The method may include the following steps.

[0135] Step S110, the transfer component 600 transfers the workpiece to be etched 100 to the spraying range of the etching liquid spraying component 300 in the chamber, so that the etching liquid spraying component 300 sprays the etching liquid medicine onto the workpiece to be etched 100.

[0136] Step S120: The transfer component 600 transfers the workpiece to be etched 100 to the first opening of the chamber. A blocking component 220 is provided on the inner wall 210 of the chamber and above the first opening 201. The blocking component 220 is used to prevent the etching liquid adhering to the inner wall 210 from flowing onto the workpiece to be etched 100 transferred to the first opening 201.

[0137] For example, step S110 can be before or after step S120, and this embodiment does not limit this. Step S110 can be before step S120, and the first opening 201 can include an outlet. Step S110 can be after step S120, and the first opening 201 can include an inlet.

[0138] In some possible implementation manners, before or after step S120, step S210 can also be included.

[0139] Step S210: The transfer component 600 transfers the workpiece to be etched 100 to the blowing range of the gas blowing component 500, so that the gas blowing component 500 blows the etching chemical solution on the workpiece to be etched 100 off the workpiece to be etched 100.

[0140] That is, before or after sending the workpiece to be etched 100 out of the chamber, the remaining etching liquid on the workpiece to be etched 100 is blown off by the gas blowing component 500.

[0141] For example, step S210 is executed before or after the transfer component 600 transfers the workpiece to be etched 100 to the outlet of the chamber.

[0142] For example, after the transfer component 600 transfers the workpiece to be etched 100 to the inlet of the chamber and before the transfer component 600 transfers the workpiece to be etched 100 to the spraying range of the etching liquid spraying component 300 in the chamber, step S210 is executed. After the workpiece to be etched 100 is sent into the chamber, the remaining etching liquid on the workpiece to be etched 100 (for example, including the etching liquid dripping from the inner wall above the first opening) is blown off by the gas blowing component.

[0143] Or, before step S120, step S220 can also be included.

[0144] Step S220: The transfer component 600 transfers the workpiece to be etched 100 to the blowing range of the first gas blowing component, so that the first gas blowing component blows the etching chemical solution on the workpiece to be etched off the workpiece to be etched;

[0145] Or, after step S120, step S230 can also be included.

[0146] Step S230: The transfer component 600 transfers the workpiece to be etched 100 to the blowing range of the second gas blowing component, so that the second gas blowing component blows the etching chemical solution on the workpiece to be etched off the workpiece to be etched.

[0147] That is, before the workpiece 100 to be etched is sent out of the chamber, the residual etching liquid on the workpiece 100 is blown off by the first gas blowing assembly. After the workpiece 100 to be etched is sent out of the chamber, the residual etching liquid on the workpiece 100 is blown off by the second gas blowing assembly (for example, including the etching liquid dripping from the inner wall above the first opening).

[0148] For example, before the transfer assembly 600 transfers the workpiece 100 to be etched to the outlet of the chamber, step S220 is executed. After the transfer assembly 600 transfers the workpiece 100 to be etched to the outlet of the chamber, step S230 is executed.

[0149] The transfer assembly 600 transfers the workpiece 100 to be etched to the inlet of the chamber, and then, the transfer assembly 600 transfers the workpiece 100 to be etched to the blowing range of the gas blowing assembly 500, and then, the transfer assembly 600 transfers the workpiece 100 to be etched to the outlet of the chamber.

[0150] Please refer to Figure 14 In addition, this embodiment further provides an etching method, which may include the following steps.

[0151] Step S310: The transfer assembly 600 transfers the workpiece 100 to be etched from the inlet of the chamber to the spraying range of the etching liquid spraying assembly 300, so that the etching liquid spraying assembly 300 sprays the etching liquid medicine on the workpiece 100.

[0152] Step S320: When the distance between the workpiece 100 to be etched and the first opening 201 of the chamber is greater than a preset distance, the gas blowing assembly 500 blows off the etching liquid on the inner wall 210 of the chamber near the first opening 201.

[0153] Step S330: When the distance between the workpiece 100 to be etched and the first opening 201 of the chamber is less than or equal to the preset distance, the blowing direction of the gas blowing assembly 500 is adjusted, so that the gas blowing assembly 500 blows off the etching liquid medicine on the workpiece 100 from the workpiece 100.

[0154] That is, in this embodiment, the gas blowing assembly 500 can be reused. When the distance between the workpiece 100 to be etched and the first opening 201 of the chamber is greater than the preset distance, the gas blowing assembly 500 blows off the etching liquid on the inner wall 210 above the first opening 201 of the chamber, thereby preventing the etching liquid on the inner wall 210 above the first opening 201 from dripping onto the workpiece 100 and causing unnecessary secondary etching to the workpiece 100.

[0155] For example, step S320 and step S330 can be before, after or during step S310, and this embodiment does not limit this.

[0156] For example, when the distance between the workpiece 100 to be etched and the outlet of the chamber is greater than a preset distance (for example, when the workpiece to be etched is not at the outlet at this time), the gas blowing assembly 500 blows off the etching liquid on the inner wall 210 of the chamber near the outlet of the chamber; and / or, when the distance between the workpiece 100 to be etched and the outlet of the chamber is less than or equal to the preset distance (for example, when the workpiece to be etched will pass through the outlet at this time), the blowing direction of the gas blowing assembly 500 is adjusted so that the gas blowing assembly 500 blows off the etching solution on the workpiece 100 from the workpiece 100.

[0157] This embodiment also provides an etching method, which may include the following steps.

[0158] Step S410, the transfer assembly 600 transfers the workpiece 100 to be etched from the inlet of the chamber to the spraying range of the etching solution spraying assembly 300, so that the etching solution spraying assembly 300 sprays the etching solution onto the workpiece 100.

[0159] Step S420, when the distance between the workpiece 100 to be etched and the first port 201 of the chamber is greater than a preset distance, the first gas blowing assembly 510 blows off the etching liquid on the inner wall 210 of the chamber near the first port 201 of the chamber.

[0160] Step S430, when the distance between the workpiece 100 to be etched and the first port 201 of the chamber is less than or equal to the preset distance, the blowing direction of the first gas blowing assembly 510 is adjusted so that the first gas blowing assembly 510 blows off the etching solution on the workpiece 100 from the workpiece 100; or, when the distance between the workpiece 100 to be etched and the first port 201 of the chamber is less than or equal to the preset distance, the second gas blowing assembly 520 blows off the etching solution on the workpiece 100 from the workpiece 100; the first port 201 includes the outlet 2011 or the inlet 2022.

[0161] For example, a corresponding gas blowing assembly 500 and / or a blocking assembly 220 may be provided at the outlet 2011.

[0162] For example, a corresponding gas blowing assembly 500 and / or a blocking assembly 220 may be provided at the inlet 2022.

[0163] For example, a corresponding removing assembly and / or a blocking assembly 220 may be provided at the outlet 2011.

[0164] For example, a corresponding removing assembly and / or a blocking assembly 220 may be provided at the inlet 2022.

[0165] For example, step S420 and step S430 may be before, after or during step S410, and this embodiment does not limit this.

[0166] For example, when the distance between the component 100 to be etched and the outlet 2011 of the chamber is greater than a preset distance (for example, when the component to be etched is not at the outlet at this time), the first gas blowing assembly 510 blows off the etching liquid on the inner wall 210 of the chamber near the outlet 2011 of the chamber. And / or, when the distance between the component 100 to be etched and the outlet 2011 of the chamber is less than or equal to the preset distance (for example, when the component to be etched will pass through the outlet at this time), the blowing direction of the first gas blowing assembly 510 is adjusted so that the first gas blowing assembly 510 blows off the etching solution on the component 100 to be etched from the component 100 to be etched; or, when the distance between the component 100 to be etched and the outlet 2011 of the chamber is less than or equal to the preset distance (for example, when the component to be etched will pass through the outlet at this time), the second gas blowing assembly 520 blows off the etching solution on the component 100 to be etched from the component 100 to be etched. The first gas blowing assembly 510 and the second gas blowing assembly 520 can share or be connected to the same gas source or gas channel.

[0167] Please refer to Figure 15 , this embodiment also provides a display panel, and at least one film layer in the display panel is etched and formed by the wet etching device provided in this embodiment.

[0168] Optionally, the display panel provided in this embodiment may include a substrate 111 and an isolation structure 140.

[0169] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or, the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0170] Optionally, an array functional layer 112 may further be disposed on one side of the substrate 111. The array functional layer 112 may include a plurality of film layer structures, such as a buffer layer, an active layer, a plurality of conductive layers, a plurality of insulating layers, and a planarization layer. The plurality of film layer structures of the array functional layer 112 may form a plurality of thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors may cooperate with each other to form a plurality of pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuit.

[0171] The isolation structure 140 is located on one side of the substrate 111. For example, the isolation structure 140 can be located on the side of the array functional layer 112 away from the substrate 111. The isolation structure 140 encloses to form a plurality of isolation openings 910; the isolation structure 140 includes a receiving portion 143, a supporting portion 141, and a shielding portion 142 that are sequentially stacked in a direction away from the substrate 111. The orthographic projections of the supporting portion 141 and the receiving portion 143 on the substrate 111 are located within the orthographic projection of the shielding portion 142 on the substrate 111; the orthographic projection of the supporting portion 141 on the substrate 111 is located within the orthographic projection of the receiving portion 143 on the substrate 111.

[0172] Optionally, under the same etching conditions, the etching resistance of the supporting portion 141 is weaker than that of the shielding portion 142;

[0173] Optionally, the material of the supporting portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium, and / or the material of the receiving portion 143 includes molybdenum.

[0174] Optionally, the display panel provided in this embodiment may further include a pixel defining layer 130. The pixel defining layer 130 is located between the isolation structure 140 and the substrate 111. For example, the pixel defining layer 130 is located between the isolation structure 140 and the array functional layer 112. The pixel defining layer 130 includes pixel openings. The orthographic projection of the pixel openings on the substrate 111 is located within the orthographic projection of the isolation openings 910 on the substrate 111, that is, the pixel openings and the isolation openings 910 are in communication.

[0175] In some possible implementation manners, the display panel further includes a plurality of light-emitting devices 810, and at least a part of the light-emitting devices 810 is located in the corresponding isolation openings 910.

[0176] Optionally, the light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 that are sequentially stacked in a direction away from the substrate 111. The receiving portion 143 has conductivity, and the second electrode 160 is in contact with the receiving portion 143.

[0177] The first electrode 120 can be connected to the pixel driving circuit in the array functional layer 112. The second electrode 160 can be connected to the common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0178] Optionally, the second electrode 160 is further in contact with the supporting portion 141.

[0179] Optionally, the display panel provided in this embodiment further includes a plurality of encapsulation units 170. The encapsulation units 170 are located on the side of the corresponding light-emitting devices 810 away from the substrate 111. At least a part of the encapsulation units 170 is located within the isolation openings 910, and at least another part is located on the side of the isolation structure 140 away from the substrate 111.

[0180] Optionally, the display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on the side of the encapsulation units 170 and the isolation structure 140 away from the substrate 111.

[0181] Optionally, the materials of the encapsulation units 170 and the second encapsulation layer 190 include inorganic materials; the material of the first encapsulation layer 180 includes organic materials.

[0182] Optionally, the material of the encapsulation units 170 includes inorganic materials, and / or the material of the second encapsulation layer 190 includes inorganic materials, and / or the material of the first encapsulation layer 180 includes organic materials. For example, the encapsulation units 170 and the second encapsulation layer 190 can be formed by Chemical Vapor Deposition (CVD), and the third encapsulation layer can be formed by Ink-jet Printing (IJP).

[0183] In some possible implementation manners, the display panel provided in this embodiment may further include film layer structures such as an optical film (e.g., a polarizer), a transparent adhesive layer (e.g., an optical adhesive layer), and a cover plate located on the side of the second encapsulation layer 190 away from the substrate 111.

[0184] This application also provides an electronic device. The electronic device includes the display panel provided in this application, or includes a display panel manufactured by the manufacturing method of the display panel provided in this application. The electronic device may include devices with display functions such as mobile phones, tablet computers, smart wearable devices, televisions, laptop computers, and monitors.

[0185] This application also provides an electronic device. The electronic device includes a display panel manufactured by the wet etching device provided in this embodiment, or the electronic device includes the display panel provided in this embodiment. The electronic device may include devices with display functions such as mobile phones, tablet computers, smart wearable devices, televisions, laptop computers, and monitors.

[0186] In summary, for the wet etching device, etching method, display panel, and electronic device provided in this application, by providing a blocking component above the product outlet of the box body of the wet etching device, it is possible to prevent the etching liquid adhering to the inner wall at the product outlet from dripping onto the workpiece to be etched output from the product outlet, thereby avoiding unnecessary etching of the workpiece to be etched by the dripping etching liquid and ensuring the product yield of the display panel.

[0187] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0188] The above-described embodiments only represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A wet etching device, characterized in that, The wet etching equipment includes: A chamber, including a first opening and an inner wall; A blocking component disposed on the inner wall and above the first opening, the blocking component being configured to prevent the etching liquid adhering to the inner wall from flowing to the first opening and / or the workpiece to be etched conveyed to the first opening; The blocking component includes a baffle disposed on the inner wall and above the first opening, the baffle and the inner wall forming a diversion groove with an upward opening, and the angle between the baffle and the inner wall being less than 90°; In the vertical direction, the height of the side of the baffle away from the inner wall is greater than the height of the side of the baffle close to the inner wall.

2. The wet etching equipment according to claim 1, characterized in that The first opening includes an outlet or an inlet, or the first opening is plural, and the plural first openings include an outlet and an inlet, and corresponding blocking components are respectively provided for the outlet and the inlet.

3. The wet etching equipment according to claim 1, characterized in that, The width of the blocking component in a first direction is greater than the width of the workpiece to be etched in the first direction; the first direction is parallel to the horizontal direction; And / or, the width of the blocking component in the first direction is greater than the width of the first opening in the first direction.

4. The wet etching apparatus according to claim 1, wherein The width of the blocking component in a first direction is greater than the width of the workpiece to be etched in the first direction; the first direction is parallel to the horizontal direction; And / or, the width of the blocking component in the first direction is less than the width of the first opening in the first direction.

5. The wet etching equipment according to claim 1, characterized in that, In the vertical direction, the installation height of the first side of the blocking component is greater than the installation height of the second side of the blocking component; the first side and the second side of the blocking component are arranged along the length direction of the blocking component; Or, in the vertical direction, the installation height of the middle part of the blocking component is greater than the installation heights of both sides of the blocking component, and the middle part and both sides of the blocking component are arranged along the length direction of the blocking component.

6. The wet etching equipment according to claim 1, characterized in that The blocking components are plural, and the plural blocking components are arranged side by side in the vertical direction.

7. The wet etching equipment according to claim 1, wherein, The inner wall is provided with a receiving groove, and the baffle extends out of the receiving groove to prevent the etching liquid adhering to the inner wall from flowing to the first opening; the baffle is withdrawn into the receiving groove to remove the etching liquid adhering to the outer side wall of the baffle, Or, the baffle is movably connected to the inner wall, and the baffle can extend out or retract back and forth relative to the inner wall.

8. The wet etching equipment according to claim 1, characterized in that, The wet etching equipment further includes a liquid recovery component and an etching liquid spraying component located in the chamber; The liquid recovery component is connected to the etching liquid spraying component; The liquid recovery component includes a chemical liquid storage device, a power device and a liquid recovery device; The etching liquid in the blocking component flows into the liquid recovery device, and the liquid recovery device is connected to the chemical liquid storage device; The power device is connected between the chemical liquid storage device and the etching liquid spraying component.

9. The wet etching equipment according to claim 1, wherein The wet etching equipment further includes a gas blowing component near the first opening, and the gas blowing component is located inside and / or outside the chamber; the gas blowing component is configured to blow gas to remove the residual etching liquid on the workpiece to be etched. Alternatively, the wet etching device further includes a gas blowing assembly located inside the chamber and near the first port. When the distance between the workpiece to be etched and the first port of the chamber is greater than a preset distance, the gas blowing assembly blows off the etching liquid on the outer wall of the blocking assembly; when the distance between the workpiece to be etched and the first port of the chamber is less than or equal to the preset distance, the gas blowing assembly blows off the etching solution on the workpiece to be etched from the workpiece to be etched.

10. An etching method, characterized in that, Comprising: The transfer assembly transfers the workpiece to be etched to the spraying range of the etching solution spraying assembly in the chamber, so that the etching solution spraying assembly sprays the etching solution onto the workpiece to be etched; The transfer assembly transfers the workpiece to be etched to the first port of the chamber. A blocking assembly is provided on the inner wall of the chamber and above the first port. The blocking assembly is used to prevent the etching liquid attached to the inner wall from flowing to the workpiece to be etched transferred to the first port; the blocking assembly includes a baffle plate provided on the inner wall and above the first port. The baffle plate and the inner wall form a diversion groove with an upward opening. The included angle between the baffle plate and the inner wall is less than 90°; in the vertical direction, the height of the side of the baffle plate away from the inner wall is greater than the height of the side of the baffle plate close to the inner wall.

11. The etching method according to claim 10, wherein Before or after the transfer assembly transfers the workpiece to be etched to the first port of the chamber, it further includes: The transfer assembly transfers the workpiece to be etched to the blowing range of the gas blowing assembly, so that the gas blowing assembly blows off the etching solution on the workpiece to be etched from the workpiece to be etched; Alternatively, before the transfer assembly transfers the workpiece to be etched to the first port of the chamber, it further includes: The transfer assembly transfers the workpiece to be etched to the blowing range of the first gas blowing assembly, so that the first gas blowing assembly blows off the etching solution on the workpiece to be etched from the workpiece to be etched; After the transfer assembly transfers the workpiece to be etched to the first port of the chamber, it further includes: The transfer assembly transfers the workpiece to be etched to the blowing range of the second gas blowing assembly, so that the second gas blowing assembly blows off the etching solution on the workpiece to be etched from the workpiece to be etched.

12. A display panel, characterized in that, At least one film layer in the display panel is etched and formed by the wet etching device according to any one of claims 1-9; the display panel includes: A substrate; An isolation structure on one side of the substrate. The isolation structure encloses a plurality of isolation openings; the isolation structure includes a receiving portion, a supporting portion, and a shielding portion that are sequentially stacked in a direction away from the substrate. The orthographic projections of the supporting portion and the receiving portion on the substrate are located within the orthographic projection of the shielding portion on the substrate; the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the receiving portion on the substrate; A plurality of light-emitting devices, at least a part of which is located in the corresponding isolation opening.

13. An electronic device, characterized in that, The electronic device includes a display panel manufactured by the wet etching device according to any one of claims 1-9, or the electronic device includes a display panel manufactured by the etching method according to any one of claims 10-11, or the electronic device includes the display panel according to claim 12.

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