Semiconductor module

Abstract

The invention provides a semiconductor module capable of functioning as a plurality of types of power converters with a simple structure. The semiconductor module includes a bridge circuit including a plurality of switching elements, a first connection terminal pair, a second connection terminal pair, a third connection terminal pair, a fourth connection terminal pair, a first wiring, a second wiring, a third wiring, a fourth wiring, and a fifth wiring. The bridge circuit has a first upper and lower arm connecting the first wiring and the second wiring, and a second upper and lower arm connecting the third wiring and the second wiring, and a fourth wiring connecting a connection point between the upper arm and the lower arm of the first upper and lower arm and the fifth terminal. A fifth wiring connects a connection point between the upper arm and the lower arm of the second upper and lower arm and the sixth terminal.

Description

Technical Field

[0001] The present invention relates to a semiconductor module. Background Art

[0002] A first converter and a second converter are combined via a transformer to form an isolated DC-DC converter, which is disclosed in Patent Document 1.

[0003] [Prior Art Documents]

[0004] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2020-150574 Summary of the Invention

[0006] [Problems to be Solved by the Invention]

[0007] In the structure described in Patent Document 1, since the interfaces on the transformer side of both the first converter and the second converter are input / output parts for AC power, it is difficult for the first converter and the second converter to function as a DC-DC converter.

[0008] The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor module that can function as various power converters with a simple structure.

[0009] [Means for Solving the Problems]

[0010] The present invention provides a semiconductor module, comprising: external connection terminals; wirings connected to the external connection terminals; and a full-bridge circuit including a plurality of switching elements, wherein the external connection terminals include: a first connection terminal pair including a first terminal and a second terminal; a second connection terminal pair including a third terminal and a fourth terminal; a third connection terminal pair including a fifth terminal and a sixth terminal; and a fourth connection terminal pair including a seventh terminal and an eighth terminal, the wirings include: a first wiring connecting the first terminal and the third terminal; a second wiring connecting the second terminal and the eighth terminal; a third wiring connecting the fourth terminal and the seventh terminal; a fourth wiring connected to the fifth terminal; and a fifth wiring connected to the sixth terminal, the full-bridge circuit has: a first upper and lower arm connecting between the first wiring and the second wiring; and a second upper and lower arm connecting between the third wiring and the second wiring, the fourth wiring connects a connection point between the upper arm and the lower arm of the first upper and lower arm and the fifth terminal, and the fifth wiring connects a connection point between the upper arm and the lower arm of the second upper and lower arm and the sixth terminal.

[0011] The present invention provides a semiconductor module, comprising: external connection terminals; wirings connected to the external connection terminals; and a half-bridge circuit including a plurality of switching elements, wherein the external connection terminals include: a first connection terminal pair including a first terminal and a second terminal; a second connection terminal pair including a third terminal and a fourth terminal; a third connection terminal pair including a fifth terminal and a sixth terminal; and a fourth connection terminal pair including a seventh terminal and an eighth terminal, the wirings include: a first wiring connecting between the first terminal and the third terminal; a second wiring connecting between the second terminal and the eighth terminal; a third wiring connecting between the fourth terminal and the seventh terminal; a fourth wiring connected to the fifth terminal; a fifth wiring connected to the sixth terminal; and a sixth wiring connecting between the second wiring and the third wiring, the half-bridge circuit has upper and lower arms that connect between the first wiring and the second wiring, the fourth wiring connects a connection point between the upper arm and the lower arm of the half-bridge circuit to the fifth terminal, and the fifth wiring connects the sixth wiring to the sixth terminal.

[0012] [Advantages of the Invention]

[0013] In the present invention, it is possible to function as various power converters with a simple structure. Description of the Drawings

[0014] Figure 1 It is a schematic diagram showing the semiconductor module in the embodiment.

[0015] Figure 2 It is a schematic diagram showing the semiconductor module of the first modification.

[0016] Figure 3 It is a diagram for explaining the case where the semiconductor module of the first modification is driven as a DC-DC converter.

[0017] Figure 4 It is a diagram for explaining the case where the semiconductor module of the first modification is driven as an AC-DC converter.

[0018] Figure 5 It is a schematic diagram showing the semiconductor module of the second modification.

[0019] Figure 6 It is a schematic diagram showing the semiconductor module of the third modification.

[0020] [Description of Reference Numerals]

[0021] 1 Semiconductor module

[0022] 2 External connection terminals

[0023] 3 Wirings

[0024] 4 Bridge circuit

[0025] 11 First connection terminal pair

[0026] 12 Second connection terminal pair

[0027] 13 Third connection terminal pair

[0028] 14 Fourth connection terminal pair

[0029] 21 First terminal

[0030] 22 Second terminal

[0031] 23 Third terminal

[0032] 24 Fourth terminal

[0033] 25 Fifth terminal

[0034] 26 Sixth terminal

[0035] 27 Seventh terminal

[0036] 28 Eighth terminal

[0037] 31 First wiring

[0038] 32 Second wiring

[0039] 33 Third wiring

[0040] 34 Fourth wiring

[0041] 35 Fifth wiring

[0042] 41 First upper and lower arm

[0043] 42 Second upper and lower arm Detailed implementation mode

[0044] Hereinafter, the semiconductor module in the embodiment of the present invention will be specifically described. In addition, the present invention is not limited to the embodiments described below.

[0045] Figure 1 It is a schematic diagram showing the semiconductor module in the embodiment. The semiconductor module 1 is a module capable of forming various power converters by switching wiring. The semiconductor module 1 includes an external connection terminal 2, a wiring 3, and a bridge circuit 4.

[0046] The external connection terminal 2 is a terminal for connecting to an external circuit. The external connection terminal 2 includes a first connection terminal pair 11, a second connection terminal pair 12, a third connection terminal pair 13, and a fourth connection terminal pair 14. The first connection terminal pair 11 includes a first terminal 21 and a second terminal 22. The second connection terminal pair 12 includes a third terminal 23 and a fourth terminal 24. The third connection terminal pair 13 includes a fifth terminal 25 and a sixth terminal 26. The fourth connection terminal pair 14 includes a seventh terminal 27 and an eighth terminal 28.

[0047] The wiring 3 is wiring connected to the external connection terminal 2. The wiring 3 includes a first wiring 31 connected to the first terminal 21, a second wiring 32 connected to the second terminal 22, a third wiring 33 connected to the fourth terminal 24, a fourth wiring 34 connected to the fifth terminal 25, and a fifth wiring 35 connected to the sixth terminal 26. The first wiring 31 connects the first terminal 21 and the third terminal 23. The second wiring 32 connects the second terminal 22 and the eighth terminal 28. The third wiring 33 connects the fourth terminal 24 and the seventh terminal 27. One end of the fourth wiring 34 is connected to the fifth terminal 25, and the other end is connected to the bridge circuit 4. One end of the fifth wiring 35 is connected to the sixth terminal 26, and the other end is connected to the bridge circuit 4.

[0048] The bridge circuit 4 is a full-bridge circuit having a plurality of switching elements. The bridge circuit 4 is composed of four switching elements SW1 to SW4 that form two upper and lower arms 41 and 42. Each of the upper and lower arms 41 and 42 has two switching elements. Diodes are anti-parallel connected to each of the switching elements. Each of the switching elements is composed of an IGBT. Each of the switching elements performs a switching operation according to a control signal from the control device.

[0049] The first upper and lower arm 41 is an upper and lower arm formed by connecting the first switching element SW1 and the second switching element SW2 in series. In the first upper and lower arm 41, the first switching element SW1 is the upper arm, and the second switching element SW2 is the lower arm. The first upper and lower arm 41 connects between the first wiring 31 and the second wiring 32.

[0050] The second upper and lower arm 42 is an upper and lower arm formed by connecting the third switching element SW3 and the fourth switching element SW4 in series. In the second upper and lower arm 42, the third switching element 43 is the upper arm, and the fourth switching element SW4 is the lower arm. The second upper and lower arm 42 connects between the third wiring 33 and the second wiring 32.

[0051] In the bridge circuit 4, wiring 3 is respectively connected to the connection points of the paired switching elements with each other. A fourth wiring 34 is connected to the connection point between the first switching element SW1 and the second switching element SW2 of the first upper and lower arm 41. A fifth wiring 35 is connected to the connection point between the third switching element SW3 and the fourth switching element SW4 of the second upper and lower arm 42. The fourth wiring 34 connects the connection point between the upper arm and the lower arm of the first upper and lower arm 41 to the fifth terminal 25. The fifth wiring 35 connects the connection point between the upper arm and the lower arm of the second upper and lower arm 42 to the sixth terminal 26.

[0052] In the relationship between the external connection terminals 2 and the bridge circuit 4, the first connection terminal pair 11 is connected to one side of the bridge. The second connection terminal pair 12 is connected to the positive side of the bridge. The third connection terminal pair 13 is connected to the midpoint of the bridge. The fourth connection terminal pair 14 is connected to the other side of the bridge. The midpoint of the bridge refers to the connection point between the upper arm and the lower arm.

[0053] The semiconductor module 1 can be configured as various power converters by switching the wiring. The external circuit on the input side and the external circuit on the output side are connected to the external connection terminals 2. By appropriately switching the wiring on the external circuit side and performing appropriate switching control, the semiconductor module 1 can function as various power converters.

[0054] Among the external connection terminals 2, any one of the four connection terminal pairs is connected to the external circuit on the input side, and one of the remaining three connection terminal pairs is connected to the external circuit on the output side. Moreover, one of the remaining two connection terminal pairs is electrically open-circuited, and the other is short-circuited. An electrically open-circuited connection terminal pair means a state where the external device (external circuit, component) is not connected to the connection terminal pair at all, or a state where the external device is connected to the connection terminal pair but the connection terminal pair is electrically open-circuited on the external device side. A short-circuited connection terminal pair means a state where the connection terminal pair is short-circuited through the external device when the external device is connected to the connection terminal pair. In this connection state, the first to fourth switching elements SW1 to SW4 included in the bridge circuit 4 perform switching operations, whereby the semiconductor module 1 converts the power input from the external circuit on the input side into the desired power and outputs it to the external circuit on the output side. For example, the semiconductor module can function as a bidirectional buck-boost converter, an AC-DC converter, etc.

[0055] Specifically, the semiconductor module 1 can be driven in any one of the DCDC mode, the ACDC mode, the DCAC mode, and the PFC mode. The DCDC mode is a driving state in which the input DC power is converted into a specified voltage and output. The ACDC mode is a driving state in which the input AC power is converted into DC power and output. The DCAC mode is a driving state in which the input DC power is converted into AC power and output. The PFC mode is a mode in which it is driven as a power factor improvement circuit, and is a driving state in which the phase difference between the voltage and the current is reduced to improve the power factor.

[0056] As a first mode, when the semiconductor module 1 is driven in the DCDC mode, the first connection terminal pair 11 becomes an input / output terminal, and the fourth connection terminal pair 14 becomes an input / output terminal. The DCDC mode includes two connection methods: a first mode in which the first connection terminal pair 11 is used as an input terminal and the fourth connection terminal pair 14 is used as an output terminal, and a second mode in which the fourth connection terminal pair 14 is used as an input terminal and the first connection terminal pair 11 is used as an input terminal.

[0057] In the DCDC mode of the first mode, the external DC circuit on the input side is connected to the first connection terminal pair 11, the external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is electrically open, and the third connection terminal pair 13 is short-circuited. In this state, the semiconductor module 1 converts the DC power input from the first connection terminal pair 11 into a specified voltage and outputs it from the fourth connection terminal pair 14. In this case, the semiconductor module 1 functions as a buck-boost converter. When functioning as a boost converter, the semiconductor module 1 boosts the DC voltage applied to the first connection terminal pair 11 and outputs it to the fourth connection terminal pair 14. When functioning as a buck converter, the semiconductor module 1 steps down the DC voltage applied to the first connection terminal pair 11 and outputs it to the fourth connection terminal pair 14.

[0058] In the DCDC mode of the second mode, the external DC circuit on the input side is connected to the fourth connection terminal pair 14, the external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is electrically open, and the third connection terminal pair 13 is short-circuited. In this state, the semiconductor module 1 converts the DC power input from the fourth connection terminal pair 14 into a specified voltage and outputs it from the first connection terminal pair 11. In this case, the semiconductor module 1 functions as a buck-boost converter. When functioning as a boost converter, the semiconductor module 1 boosts the DC voltage applied to the fourth connection terminal pair 14 and outputs it to the first connection terminal pair 11. When functioning as a buck converter, the semiconductor module 1 steps down the DC voltage applied to the fourth connection terminal pair 14 and outputs it to the first connection terminal pair 11.

[0059] As a second mode, when the semiconductor module 1 is driven in the AC-DC mode, the third connection terminal pair 13 becomes an input terminal, and the first connection terminal pair 11 or the fourth connection terminal pair 14 becomes an output terminal. The AC-DC mode includes two connection methods: a first mode in which the first connection terminal pair 11 is used as the output terminal and a second mode in which the fourth connection terminal pair 14 is used as the output terminal.

[0060] In the first mode of the AC-DC mode, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically open. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the first connection terminal pair 11.

[0061] In the second mode of the AC-DC mode, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically open. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the fourth connection terminal pair 14.

[0062] As a third mode, when the semiconductor module 1 is driven in the DC-AC mode, the first connection terminal pair 11 or the fourth connection terminal pair 14 becomes an input terminal, and the third connection terminal pair 13 becomes an output terminal. The DC-AC mode includes two connection methods: a first mode in which the first connection terminal pair 11 is used as the input terminal and a second mode in which the fourth connection terminal pair 14 is used as the input terminal.

[0063] In the first mode of the DC-AC mode, an external DC circuit on the input side is connected to the first connection terminal pair 11, an external AC circuit on the output side is connected to the third connection terminal pair 13, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically open. In this state, the semiconductor module 1 converts the DC power input from the first connection terminal pair 11 into AC power and outputs it from the third connection terminal pair 13.

[0064] In the second mode of the DC-AC mode, an external DC circuit on the input side is connected to the fourth connection terminal pair 14, an external AC circuit on the output side is connected to the third connection terminal pair 13, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically open. In this state, the semiconductor module 1 converts the DC power input from the fourth connection terminal pair 14 into AC power and outputs it from the third connection terminal pair 13.

[0065] As a fourth mode, when the semiconductor module 1 is driven in the PFC mode, the third connection terminal pair 13 becomes an input terminal, and the first connection terminal pair 11 or the fourth connection terminal pair 14 becomes an output terminal. The PFC mode includes two connection methods: a first mode in which the first connection terminal pair 11 is used as the output terminal and a second mode in which the fourth connection terminal pair 14 is used as the output terminal.

[0066] In the PFC mode of the first mode, the external AC circuit on the input side is connected to the third connection terminal pair 13, the external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically open. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the first connection terminal pair 11.

[0067] In the PFC mode of the second mode, the external AC circuit on the input side is connected to the third connection terminal pair 13, the external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically open. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the fourth connection terminal pair 14.

[0068] In this way, any two of the first connection terminal pair 11, the third connection terminal pair 13, and the fourth connection terminal pair 14 of the semiconductor module 1 are connected to different connection objects respectively. In this connection state, the semiconductor module 1 converts the power input from one connection object into the desired power and outputs it to the other connection object.

[0069] As described above, according to the embodiment, by appropriately switching the wiring on the external circuit side and performing appropriate switching control, the semiconductor module 1 can be applied to various power converters. In addition, cost reduction can be expected through mass production effects.

[0070] In addition, the semiconductor module 1 is not limited to Figure 1 the structure shown. It may also incorporate a control circuit and sensors. For example, the semiconductor module 1 may include a drive circuit for the switching element, and may also include a control circuit that determines the on and off of the drive circuit, a power supply for driving the drive circuit. The semiconductor module 1 may also include functions for performing an emergency stop and communicating with an external circuit. The semiconductor module 1 may also include a communication circuit for communicating with an external circuit. The semiconductor module 1 may also include sensors such as a voltage sensor, a current sensor, and a thermistor.

[0071] In addition, the semiconductor module 1 may also incorporate passive components and sub-circuits. For example, the semiconductor module 1 may also be configured to include a reactor and a capacitor. The reactor and the capacitor may be mounted on the semiconductor module 1, or may also be mounted on an external connection object.

[0072] Figure 2 It is a schematic diagram of a semiconductor module showing a first modification example. The semiconductor module of the first modification example includes a first capacitor C1, a second capacitor C2, a third capacitor C3, and a reactor L.

[0073] As Figure 2 shown, the first capacitor C1 connects between the first wiring 31 and the second wiring 32. The first capacitor C1 is connected in parallel with the first upper and lower arm 41 and is connected between the first terminal 21 and the second terminal 22 of the first connection terminal pair 11. As Figure 3 shown, in the driving state where the first connection terminal pair 11 serves as the input / output terminal for DC power, the first capacitor C1 functions as a smoothing capacitor for smoothing the voltage of the DC power input / output with respect to the first connection terminal pair 11.

[0074] The second capacitor C2 connects between the third wiring 33 and the second wiring 32. The second capacitor C2 is connected in parallel with the second upper and lower arm 42 and is connected between the seventh terminal 27 and the eighth terminal 28 of the fourth connection terminal pair 14. As Figure 2 and Figure 3 shown, in the driving state where the fourth connection terminal pair 14 serves as the input / output terminal for DC power, the second capacitor C2 functions as a smoothing capacitor for smoothing the voltage of the DC power input / output with respect to the fourth connection terminal pair 14.

[0075] The third capacitor C3 connects between the fourth wiring 34 and the fifth wiring 35. The reactor L is provided on the fourth wiring 34. The third capacitor C3 and the reactor L constitute an LC filter connected between the fifth terminal 25 and the sixth terminal 26 of the third connection terminal pair 13. As Figure 4 shown, in the driving state where the third connection terminal pair 13 serves as the input / output terminal for AC power, the reactor L and the third capacitor C3 function as an LC filter.

[0076] In addition, the semiconductor module 1 of the first modification example is not limited to Figure 2 the structure shown. For example, in the first connection terminal pair 11, it is not limited to connecting the first capacitor C1, and a coil or an LC filter may also be connected. In the fourth connection terminal pair 14, it is not limited to connecting the second capacitor C2, and a coil or an LC filter may also be connected. In the third connection terminal pair 13, it is not limited to connecting an LC filter, and a capacitor or a coil may also be connected.

[0077] In addition, asFigure 4 As shown, when driving the semiconductor module 1 of the first modification in the ACDC mode, DCAC mode, or PFC mode, the first capacitor C1 may not be provided. In other words, it is sufficient to provide a capacitor only on the side of the connection terminal pair connected to the external circuit on the DC side. In Figure 4 the example shown, since the fourth connection terminal pair 14 is used as the input / output terminal, it is sufficient to provide the second capacitor C2, and the first capacitor C1 on the side of the first connection terminal pair 11 that is electrically open-circuited may not be provided. Conversely, when the first connection terminal pair 11 is used as the input / output terminal, it is sufficient to provide the first capacitor C1, and the second capacitor C2 on the side of the fourth connection terminal pair 14 that is electrically open-circuited may not be provided.

[0078] Figure 5 is a schematic diagram showing a semiconductor module of a second modification. The semiconductor module 1 of the second modification includes a bridge circuit 4 formed by connecting two switching elements in parallel. The upper arm of the first upper and lower arm 41 is an element formed by connecting the first switching element SW11 and the switching element SW12 in parallel. The lower arm of the first upper and lower arm 41 is an element formed by connecting the second switching element SW21 and the switching element SW22 in parallel. The upper arm of the second upper and lower arm 42 is an element formed by connecting the third switching element SW31 and the switching element SW32 in parallel. The lower arm of the second upper and lower arm 42 is an element formed by connecting the fourth switching element SW41 and the switching element SW42 in parallel.

[0079] Figure 6 is a schematic diagram showing a semiconductor module of a third modification. The semiconductor module 1 of the third modification includes a bridge circuit 4 configured as a half-bridge circuit and a wiring 3 including a sixth wiring 36. The bridge circuit 4 configured as a half-bridge circuit has a first upper and lower arm 41. The sixth wiring 36 connects between the third wiring 33 and the second wiring 32. The fifth wiring 35 connects between the sixth terminal 26 and the sixth wiring 36. The semiconductor module 1 can be driven in any one of the DCDC mode, ACDC mode, DCAC mode, and PFC mode.

Claims

1. A semiconductor module comprising: External connection terminals; Wiring connected to the external connection terminal; as well as A full bridge circuit includes a plurality of switching elements. It is characterized in that The external connection terminal comprises: A first connection terminal pair, comprising a first terminal and a second terminal; A second connection terminal pair, including a third terminal and a fourth terminal; A third connection terminal pair including a fifth terminal and a sixth terminal; and a fourth connection terminal pair, comprising a seventh terminal and an eighth terminal, The wiring includes: a first wiring connecting the first terminal and the third terminal; a second wiring connecting the second terminal and the eighth terminal; a third wiring connecting the fourth terminal and the seventh terminal; a fourth wiring connected to the fifth terminal; and a fifth wiring connected to the sixth terminal, The full bridge circuit has: first upper and lower arms, connecting the first wiring and the second wiring; and The second upper and lower arms connect the third wiring and the second wiring. The fourth wiring connects the connection point between the upper arm and the lower arm of the first upper and lower arms and the fifth terminal. The fifth wiring connects a connection point between the upper arm and the lower arm of the second upper and lower arms and the sixth terminal.

2. The semiconductor module according to claim 1, characterized in that When the second connection terminal pair is in a short-circuited or electrically open state, and when any two of the first connection terminal pair, the third connection terminal pair, and the fourth connection terminal pair are respectively connected to different connection objects, a driving state is achieved in which power input from the connection object on the input side is converted and output to the connection object on the output side. The driving state is any one of a plurality of modes, The multiple modes include: In the first mode, the input DC power is converted into a specified voltage and output; In the second mode, the input DC power is converted into AC power and output; A third mode converts the input AC power into DC power and outputs the DC power; and In the fourth mode, the circuit is driven as a power factor improvement circuit.

3. The semiconductor module according to claim 2, characterized in that In the first mode, The connection object on the first AC side is connected to the first connection terminal pair, The connection object on the second AC side is connected to the fourth connection terminal pair, The second connection terminal pair is electrically open, The third connection terminal pair is short-circuited.

4. The semiconductor module according to claim 2 or 3, characterized in that In the second mode, the third mode and the fourth mode, The connection object on the AC side is connected to the third connection terminal pair, The connection object on the DC side is connected to either the first connection terminal pair or the fourth connection terminal pair. The remaining one of the first connection terminal pair and the fourth connection terminal pair is electrically open. The second connection terminal pair is short-circuited.

5. A semiconductor module comprising: External connection terminals; Wiring connected to the external connection terminal; as well as A half-bridge circuit includes a plurality of switching elements. It is characterized in that The external connection terminal comprises: A first connection terminal pair, comprising a first terminal and a second terminal; A second connection terminal pair, including a third terminal and a fourth terminal; A third connection terminal pair including a fifth terminal and a sixth terminal; and a fourth connection terminal pair, comprising a seventh terminal and an eighth terminal, The wiring includes: a first wiring connecting the first terminal and the third terminal; a second wiring connecting the second terminal and the eighth terminal; a third wiring connecting the fourth terminal and the seventh terminal; a fourth wiring line connected to the fifth terminal; a fifth wiring connected to the sixth terminal; and a sixth wiring connecting the second wiring and the third wiring, The half-bridge circuit has upper and lower arms, and the upper and lower arms connect the first wiring and the second wiring. The fourth wiring connects the connection point between the upper arm and the lower arm of the upper and lower arms and the fifth terminal. The fifth wiring connects the sixth wiring and the sixth terminal.

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