Dustproof and heat dissipation type POE switch

By connecting multiple heat pipes and heat dissipation rings, combined with air guides and dust scraping components, the problem of uneven heat dissipation and dust ingress in PoE switches is solved, achieving balanced heat dissipation and dust prevention.

CN120151307BActive Publication Date: 2026-02-06SHENZHEN HAIFENG INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510205395.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-24
Publication Date
2026-02-06
Estimated Expiration
2045-02-24

AI Technical Summary

Technical Problem

The existing heat dissipation methods of PoE switches cannot evenly dissipate heat from different electronic components, resulting in components with low heat generation still having a higher temperature than components with high heat generation after heat dissipation, and they are also prone to attracting dust.

Method used

Multiple heat pipes are connected to a heat dissipation ring to dissipate heat sequentially along the direction of airflow. Combined with an air guide and dust scraping components, this achieves balanced heat dissipation and dust prevention.

Benefits of technology

It achieves balanced heat dissipation for all electronic components, prevents dust from entering, and improves heat dissipation and dustproof performance of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of switches and discloses a dustproof and heat dissipation type POE switch which comprises an outer casing, the inner space of the outer casing is divided into an installation area and a heat dissipation area, electronic components of the switch are arranged in the installation area, a heat dissipation assembly is arranged in the heat dissipation area, the heat dissipation assembly comprises a heat dissipation channel, the heat dissipation channel comprises heat dissipation ring pipes, heat pipes are arranged between the heat dissipation ring pipes and heat generation parts of the electronic components to realize heat conduction connection, the heat generation parts of the electronic components are arranged at multiple positions, the heat pipes and the heat dissipation ring pipes are correspondingly provided with multiple heat pipes, all the heat dissipation ring pipes are coaxially arranged, two adjacent heat dissipation ring pipes are connected through heat insulation ring sleeves, the heat insulation ring sleeves are coaxial with the heat dissipation ring pipes and have consistent inner diameters, and a fan is arranged at one end of the heat dissipation channel; when the heat of different heat generation parts of the electronic components is conducted to the heat dissipation ring pipes through corresponding heat pipes, the temperature of the heat dissipation ring pipes increases along the wind power flow direction of the fan.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of switches, in particular to a dustproof and heat dissipation POE switch. BACKGROUND

[0002] POE switch refers to a technology that can provide direct current for IP-based terminals (such as IP phones, wireless LAN access points AP, network cameras, etc.) while transmitting data signals for the terminals without any modification of the existing Ethernet Cat.5 wiring infrastructure, that is, a switch supporting power over Ethernet.

[0003] During the use of the POE switch, the internal electronic components will inevitably generate heat, therefore, the POE switch needs to be cooled, and the common existing switch cooling technology is the fan cooling method, that is, the heat inside the switch is dissipated by the airflow generated by the operation of the fan, this cooling method is easy to bring dust from the outside into the switch, therefore, a heat conduction pipe is used to conduct heat out and then dissipate the heat in the prior art, for example, the Chinese utility model patent with the authorization announcement number CN222088037U discloses a radiator with a heat pipe, which uses the heat pipe to conduct the heat inside the computer out, and then the heat conducted by the heat pipe is quickly dissipated by the cooperation of the fan, the heat dissipation fins and the aluminum heat sink, but this heat dissipation method still has some deficiencies, for example:

[0004] It only simply conducts the heat out for dissipation, which is essentially not different from the wind force generated by the fan directly blowing on the electronic components, and since the types of electronic components inside the switch and other devices are very complex and diverse, the heat generated by each type of electronic component is different, and the difference is large, therefore, when the fan cools, it can effectively cool the electronic components with high heat generation, but the cooling of the electronic components with low heat generation is poor, and based on the principle of heat diffusion from high to low, the temperature of the electronic components with high heat generation after cooling is still higher than that of the electronic components with low heat generation, therefore, the electronic components with low heat generation not only do not receive cooling, but also are heated.

[0005] Based on the above, the present application provides a dustproof and heat dissipation POE switch. SUMMARY

[0006] To solve the above-mentioned background in the device inside the switch and so on electronic components of many kinds and complex, each kind of electronic components produced by the heat is different, difference is big, fan cooling, can directly to the high heat production electronic components effective cooling, low heat production electronic components cooling is poor, and based on the principle of heat from high to low diffusion, easy to appear high heat production electronic components cooling temperature is still higher than the temperature of low heat production electronic components, then low heat production electronic components not only has not been cooled, but also will be heated, the present application provides a dustproof cooling type POE switch.

[0007] To achieve the above technical purpose, the technical scheme adopted by the present application is as follows.

[0008] A dustproof cooling type POE switch, comprising an outer shell, the inner space of the outer shell is divided into an installation area and a cooling area which are not communicated with each other, the electronic components of the switch are arranged in the installation area, and a cooling assembly is arranged in the cooling area, the cooling assembly and the heat production parts of the electronic components are connected by heat pipes, and the heat production parts of the electronic components are arranged in multiple positions, and the heat pipes are correspondingly arranged in multiple positions.

[0009] The cooling assembly comprises a cooling channel, and the cooling channel comprises a cooling ring pipe, the cooling ring pipe is arranged in the form of a circular ring, a plurality of cooling ring pipes are arranged along the axial direction of the cooling ring pipe, and the adjacent two cooling ring pipes are connected by a heat insulation ring sleeve.

[0010] One end of the cooling channel is provided with a fan, when the heat of different heat production parts of the electronic components is conducted to the cooling ring pipe through the corresponding heat pipe, the temperature of the cooling ring pipe increases along the wind power flow direction of the fan.

[0011] As a further improvement and optimization of the present application, the cooling area is open at both ends and is respectively provided with a mesh cover.

[0012] As a further improvement and optimization of the present application, the inner surface of the cooling ring pipe is provided with a first fin along the axial direction, and the first fin is arranged in an array along the circumferential direction of the cooling ring pipe.

[0013] The inner surface of the heat insulation ring sleeve is provided with a second fin along the axial direction, and the second fin is arranged in an array along the circumferential direction of the heat insulation ring sleeve, the heat insulation ring sleeve and the second fin are made of heat insulation material, and the first fin and the corresponding second fin are located on the same straight line.

[0014] As a further improvement and optimization of the application, the air outlet end of the fan is provided with an air outlet pipeline, the end of the air outlet pipeline is provided with a wind guide body through a support body, the wind guide body, the air outlet pipeline and the heat dissipation channel are coaxial, the wind guide body comprises a circular truncated cone section connected with the support body, the outer diameter of the circular truncated cone section increases along the wind flow direction of the fan, the end of the circular truncated cone section is provided with a circular cylinder section, and the outer circular surface of the circular cylinder section is close to the first fin or the second fin.

[0015] As a further improvement and optimization of the application, the heat dissipation channel is provided with a dust scraping assembly, and the dust scraping assembly is used for cleaning dust in the heat dissipation channel.

[0016] As a further improvement and optimization of the application, the dust scraping assembly comprises a dust scraping ring and a linear module for driving the dust scraping ring to move along the axial line direction of the heat dissipation channel, the outer circular surface of the dust scraping ring extends a third fin, and initially, the third fin extends into the area between the adjacent two first fins or the area between the adjacent two second fins.

[0017] As a further improvement and optimization of the application, the two ends of the heat dissipation channel are respectively provided with a side support, the linear module comprises a lead screw arranged between the two side supports and a motor for driving the lead screw to rotate, the axial line of the lead screw is parallel to the axial line of the heat dissipation channel, the lead screw is in threaded connection with the dust scraping ring, and the lead screw is provided with two.

[0018] As a further improvement and optimization of the application, the motor and the lead screw are in power connection through a power transmission piece.

[0019] Compared with the prior art, the application has the beneficial effects that:

[0020] The heat of the heat generating parts of the electronic components of the switch is conducted to the heat dissipation ring pipe through the heat pipe, since there are multiple heat generating parts of the electronic components, the heat dissipation ring pipe and the heat pipe are correspondingly provided with multiple heat pipes, and when the heat of different heat generating parts of the electronic components is conducted to the heat dissipation ring pipe through the corresponding heat pipe, the temperature of the heat dissipation ring pipe increases along the wind flow direction of the fan, that is, during heat dissipation, the wind generated by the operation of the fan first dissipates heat from the parts with low heat generation of the electronic components, and then dissipates heat from the parts with high heat generation, the heat dissipation mode has the advantages that the wind sequentially dissipates heat from the corresponding parts of the electronic components along the direction in which the heat generation of the electronic components increases, so that each part of the electronic components is effectively cooled, the heat dissipation is more balanced, and the problem that the temperature of the electronic components with high heat generation is still higher than that of the electronic components with low heat generation after heat dissipation based on the principle that heat diffuses from high to low is solved, so that the electronic components with low heat generation are not cooled but heated.

[0021] Furthermore, the air guide can direct the airflow generated by the fan to the area between two adjacent first fins or two adjacent second fins, allowing the airflow to move within this area. This has two advantages: firstly, the airflow can contact the first fins promptly, carrying away heat from the heat dissipation channels and the first fins, thus improving heat dissipation; secondly, compared to airflow through the heat dissipation channels, the airflow velocity in the area between two adjacent first fins is faster. Based on Bernoulli's principle, the cool air in the heat dissipation channels will flow towards the first fins, further enhancing the heat dissipation effect. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0024] Figure 3 A schematic diagram of the electronic components, heat pipes, and heat dissipation assembly of the switch;

[0025] Figure 4 Schematic diagram of the heat dissipation component Figure 1 ;

[0026] Figure 5 Schematic diagram of the heat dissipation component Figure 2 ;

[0027] Figure 6 Schematic diagram of the heat dissipation component Figure 3 ;

[0028] Figure 7 This is a cross-sectional view of the heat dissipation component.

[0029] The labels in the attached diagram are:

[0030] 100. Outer casing; 101. Mesh cover; 200. Heat pipe; 300. Heat dissipation assembly; 301. Heat dissipation ring pipe; 302. Insulation ring sleeve; 303. Fan; 304. Motor; 305. Lead screw; 306. Power transmission component; 307. Dust scraper ring; 308. Air outlet duct; 309. Support body; 310. Air guide body. Detailed Implementation

[0031] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0032] In the attached diagram of this solution, 'a' refers to the electronic components inside the switch.

[0033] Refer to Figures 1-7 The dustproof and heat dissipation type POE switch comprises an outer casing 100, an internal space of the outer casing 100 is divided into a mounting area and a heat dissipation area which are not communicated with each other, electronic components of the switch are arranged in the mounting area, a heat dissipation assembly 300 is arranged in the heat dissipation area, the heat dissipation assembly 300 and heat generating parts of the electronic components are connected through heat pipes 200, further, different parts of the electronic components generate heat in different ways, therefore, the heat pipes 200 are correspondingly arranged in multiple, further, the mounting area is closed, both ends of the heat dissipation area are opened and each is provided with a mesh cover 101, therefore, dust from the outside cannot be brought into the electronic components during heat dissipation, and the dustproof and heat dissipation purposes are achieved.

[0034] Refer to Figures 4-7 The heat dissipation assembly 300 comprises a heat dissipation channel, the heat dissipation channel comprises heat dissipation ring pipes 301, the heat dissipation ring pipes 301 are in the shape of a ring, a plurality of heat dissipation ring pipes 301 are arranged along the axial line direction of the heat dissipation ring pipes 301, and adjacent two heat dissipation ring pipes 301 are connected through heat insulation ring sleeves 302, the heat insulation ring sleeves 302 are also in the shape of a ring, the heat insulation ring sleeves 302 are coaxial with the heat dissipation ring pipes 301 and have the same inner diameter.

[0035] The inner surface of the heat dissipation ring pipe 301 is provided with first fins in the axial line direction, the first fins are arranged in an array along the circumferential direction of the heat dissipation ring pipe 301, and the heat dissipation ring pipe 301 and the first fins are both made of heat conductive material.

[0036] The inner surface of the heat insulation ring sleeve 302 is provided with second fins in the axial line direction, the second fins are arranged in an array along the circumferential direction of the heat insulation ring sleeve 302, the heat insulation ring sleeve 302 and the second fins are both made of heat insulation material, and the first fins and the corresponding second fins are located on the same straight line.

[0037] The heat pipes 200 are arranged between the heat dissipation ring pipes 301 and the heat generating parts of the electronic components, further, the axial length of the heat dissipation ring pipe 301 corresponding to the part of the electronic components which generates more heat can be longer, so as to improve the heat dissipation effect of the part of the electronic components which generates more heat.

[0038] The two ends of the heat dissipation channel are respectively provided with a side support, one of the side supports is provided with a fan 303, when the heat of different heat generating parts of the electronic components is conducted to the heat dissipation ring pipe 301 through the corresponding heat pipe 200, the temperature of the heat dissipation ring pipe 301 increases along the wind power flow direction of the fan 303, that is, during heat dissipation, the wind power generated by the operation of the fan 303 first dissipates heat from the parts of the electronic components with low heat generation, and then dissipates heat from the parts with high heat generation. The advantage of this heat dissipation mode is that the wind power is sequentially dissipated from the parts of the electronic components in the direction of increasing heat generation, so that each part of the electronic components is effectively cooled, and the heat dissipation is more balanced, solving the problem of the background art that the fan can directly effectively cool the electronic components with high heat generation, and the heat dissipation of the electronic components with low heat generation is poor, and based on the principle of heat diffusion from high to low, the temperature of the electronic components with high heat generation after heat dissipation is still higher than that of the electronic components with low heat generation, so that the electronic components with low heat generation not only do not receive heat dissipation, but also receive heating.

[0039] In preferred embodiments, with reference to Figure 7 , the air outlet end of the fan 303 is provided with an air outlet pipe 308, the distal end of the air outlet pipe 308 is provided with a wind guide body 310 through a support body 309, the wind guide body 310, the air outlet pipe 308 and the heat dissipation channel are coaxial, the wind guide body 310 includes a circular truncated cone section connected with the support body 309, the outer diameter of the circular truncated cone section increases along the wind power flow direction of the fan 303, the distal end of the circular truncated cone section is provided with a circular cylinder section, and the outer circular surface of the circular cylinder section is close to the first fin or the second fin; the significance of this is that the wind power generated by the fan 303 can be guided into the area between the adjacent two first fins or the adjacent two second fins through the wind guide body 310, so that the wind power flows in the area between the adjacent two first fins or the adjacent two second fins, which has the advantages that, on the one hand, the wind power can timely contact the first fin, thereby taking away the heat on the heat dissipation channel and the first fin, improving the heat dissipation effect, and on the other hand, compared with the wind power flowing in the heat dissipation channel, the flow speed of the wind power in the area between the adjacent two first fins is faster, based on Bernoulli's principle, the cold air in the heat dissipation channel will flow towards the first fin, thereby increasing the heat dissipation effect.

[0040] In preferred embodiments, during the heat dissipation process, the mesh cover 101 can only intercept larger particle impurities, and dust and other impurities can still enter the heat dissipation channel, therefore, a dust scraping assembly is arranged in the heat dissipation channel for cleaning dust, which is generally attached to the first fin or the second fin.

[0041] In particular, with reference to Figures 5-7The dust scraping assembly comprises a dust scraping ring 307 and a linear module for driving the dust scraping ring 307 to move along the axial line of the heat dissipation channel, and the outer circumferential surface of the dust scraping ring 307 extends with third fins, the third fins extend into the area between two adjacent first fins or the area between two adjacent second fins, when the dust scraping ring 307 moves, the third fins will move together with the dust scraping ring 307, and the dust cleaning of the first fins or the second fins is realized through the third fins.

[0042] Further, the linear module comprises a lead screw 305 arranged between the two side supports and a motor 304 for driving the lead screw 305 to rotate, the axial line of the lead screw 305 is parallel to the axial line of the heat dissipation channel, the lead screw 305 is in threaded connection with the dust scraping ring 307, and the lead screw 305 is provided with two.

[0043] Further, the power transmission member 306 arranged between the lead screw 305 and the motor 304 can adopt the technology of belt transmission combined with gear ring gears as shown in Figure 6 , which will not be described herein.

[0044] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as the above preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of the present application. Any modification, equivalent change and modification of the above embodiments made according to the technical essence of the present application, as long as it does not deviate from the technical solution of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A dustproof and heat dissipation type POE switch comprising an outer casing (100), characterized in that, The internal space of the outer casing (100) is divided into an installation area and a heat dissipation area which are not communicated with each other, the electronic components of the switch are arranged in the installation area, and the heat dissipation assembly (300) is arranged in the heat dissipation area, the heat dissipation assembly (300) and the heat generating parts of the electronic components are connected by the heat pipes (200) to realize heat conduction, and the heat generating parts of the electronic components exist in multiple places, and the heat pipes (200) are correspondingly provided with multiple heat pipes (200); The heat dissipation assembly (300) comprises a heat dissipation channel, the heat dissipation channel comprises heat dissipation ring pipes (301), the heat dissipation ring pipes (301) are circular in shape, a plurality of heat dissipation ring pipes (301) are arranged along the axial line of the heat dissipation ring pipes (301), and the adjacent two heat dissipation ring pipes (301) are connected by the heat insulation ring sleeves (302), the heat insulation ring sleeves (302) are circular in shape, the heat insulation ring sleeves (302) are coaxial with the heat dissipation ring pipes (301) and have the same inner diameter, and the heat pipes (200) are arranged between the heat dissipation ring pipes (301) and the heat generating parts of the electronic components; One end of the heat dissipation channel is provided with a fan (303), when the heat of different heat generating parts of the electronic components is conducted to the heat dissipation ring pipes (301) through the corresponding heat pipes (200), the temperature of the heat dissipation ring pipes (301) increases along the wind power flow direction of the fan (303); The inner surface of the heat dissipation ring pipe (301) is provided with a first fin along the axial line, the first fin is arrayed along the circumferential direction of the heat dissipation ring pipe (301), the heat dissipation ring pipe (301) and the first fin are made of heat conductive material; The inner surface of the heat insulation ring sleeve (302) is provided with a second fin along the axial line, the second fin is arrayed along the circumferential direction of the heat insulation ring sleeve (302), the heat insulation ring sleeve (302) and the second fin are made of heat insulation material, and the first fin and the corresponding second fin are located on the same straight line; The outlet end of the fan (303) is provided with an outlet pipeline (308), the outlet end of the outlet pipeline (308) is provided with a wind guide body (310) through a support body (309), the wind guide body (310), the outlet pipeline (308) and the heat dissipation channel are coaxial, the wind guide body (310) comprises a circular table section connected with the support body (309), the outer diameter of the circular table section increases along the wind power flow direction of the fan (303), the end of the circular table section is provided with a circular column section, and the outer circular surface of the circular column section is close to the first fin or the second fin; During heat dissipation, the wind power generated by the operation of the fan first dissipates heat from the low heat generating parts of the electronic components, and then dissipates heat from the high heat generating parts, the wind power sequentially dissipates heat from the corresponding parts of the electronic components along the direction in which the heat generation of the electronic components increases.

2. The dustproof and heat dissipation POE switch according to claim 1, characterized in that, The heat dissipation area is open at both ends and is respectively provided with a mesh cover (101).

3. The dustproof and heat dissipation POE switch according to claim 1, characterized in that, A dust scraping assembly is arranged in the heat dissipation channel, and the dust scraping assembly is used for cleaning dust in the heat dissipation channel.

4. The dustproof and heat dissipation POE switch according to claim 3, characterized in that, The dust scraping assembly comprises a dust scraping ring (307) and a linear module for driving the dust scraping ring (307) to move along the axial line of the heat dissipation channel, the outer circular surface of the dust scraping ring (307) extends a third fin, and initially, the third fin extends into the area between the adjacent two first fins or the area between the adjacent two second fins.

5. The dustproof and heat dissipation POE switch according to claim 4, characterized in that, Two ends of the heat dissipation channel are respectively provided with a side support, the linear module comprises a lead screw (305) arranged between the two side supports and a motor (304) for driving the lead screw (305) to rotate, an axis line of the lead screw (305) is parallel to an axis line of the heat dissipation channel, the lead screw (305) is in threaded connection with the ash scraping ring (307), and the lead screw (305) is provided with two.

6. The dustproof and heat dissipation POE switch according to claim 5, characterized in that, The motor (304) and the lead screw (305) are in power connection through a power transmission member (306).

Citation Information

Patent Citations

  • Radiator with heat conduction pipe

    CN222088037U

  • Power module

    CN110519967A

  • Industrial Ethernet switch

    CN201750661U