High-color gamut white light packaging device

Abstract

The invention discloses a high-color-gamut white light packaging device which comprises a first electrode plate, a second electrode plate, a blue light LED chip, a green light LED chip and fluoride red powder glue. The first electrode plate and the second electrode plate are oppositely arranged; the blue-light LED chip and the green-light LED chip are arranged between the first electrode plate and the second electrode plate at intervals, and the electrode surfaces at the bottoms of the blue-light LED chip and the green-light LED chip are flush with the bottoms of the first electrode plate and the second electrode plate; the fluoride red powder glue coats the peripheral sides and the tops of the first electrode plate, the second electrode plate, the blue-light LED chip and the green-light LED chip; by means of the structure, the DCI-P3 color gamut value can reach 92%-100%, meanwhile, the color gamut has the advantages of being simple in production process, good in reliability and low in cost, and the use requirement is met.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and particularly to a high-color gamut white light packaging device. Background Art

[0002] Currently, LCD liquid crystal displays are still the most mainstream display technology in the display industry due to their mature technology, low cost, high clarity, etc.; however, with the continuous improvement of people's living standards, the requirements for display screens such as televisions, computer monitors, laptop computers, and vehicle-mounted displays are also getting higher and higher. Clarity, contrast, and color vividness have become important indicators for improving the display effect; the color gamut is a measure of the color vividness of a display. The larger the color gamut value, the more vivid and realistic the colors displayed by the display; currently, the mainstream ways to improve the color gamut of a display are to use a blue LED backlight + quantum dot film and to use a high-color gamut white LED as the display backlight. Due to the high cost and poor reliability of quantum dot materials, the high-color gamut white LED backlight has become the primary technical bottleneck to be broken through in the industry.

[0003] For the white LED device used in a white LED backlight module, currently, it mainly has a blue LED chip (30) + YAG yellow-green phosphor + sulfide red phosphor. Among them, the half-wave width of the YAG yellow-green phosphor is 110 - 115 nm, and the half-wave width is the most important indicator determining the color gamut. For the white LED backlight made of a blue LED chip (30) + YAG yellow-green phosphor + sulfide red phosphor, the DC I-P3 color gamut is < 80%, which does not meet the standard of the high-color gamut DC I-P3 > 90% commonly mentioned in the industry.

[0004] Therefore, there is an urgent need for a high-color gamut white light packaging device to solve the above problems. Summary of the Invention

[0005] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a high-color gamut white light packaging device.

[0006] An embodiment of the present invention adopts the following technical solution to solve its technical problems: a high-color gamut white light packaging device, including a first electrode sheet, a second electrode sheet, a blue LED chip, a green LED chip, and a fluoride red powder glue;

[0007] The first electrode sheet and the second electrode sheet are arranged opposite to each other;

[0008] The blue LED chip and the green LED chip are arranged at intervals between the first electrode sheet and the second electrode sheet, and the electrode surfaces at the bottoms of the blue LED chip and the green LED chip are flush with the bottoms of the first electrode sheet and the second electrode sheet;

[0009] The fluoride red powder glue is coated on the peripheries and tops of the first electrode sheet, the second electrode sheet, the blue LED chip, and the green LED chip.

[0010] As one of the preferred embodiments of the present invention, the electrode directions of the blue LED chip and the green LED chip are the same. The first electrode sheet corresponds to the positive electrodes of the blue LED chip and the green LED chip, and the second electrode sheet corresponds to the negative electrodes of the blue LED chip and the green LED chip.

[0011] As one of the preferred embodiments of the present invention, the electrode directions of the blue LED chip and the green LED chip are the same. The first electrode sheet includes independent first welding sheets and second welding sheets. The second electrode sheet includes independent third welding sheets and fourth welding sheets. The first welding sheet corresponds to the positive electrode of the blue LED chip, the second welding sheet corresponds to the positive electrode of the green LED chip, the third welding sheet corresponds to the negative electrode of the blue LED chip, and the fourth welding sheet corresponds to the negative electrode of the green LED chip.

[0012] As one of the preferred embodiments of the present invention, the electrode directions of the blue LED chip and the green LED chip are opposite. The first electrode sheet includes independent fifth welding sheets and sixth welding sheets. The fifth welding sheet corresponds to the positive electrode of the blue LED chip, the sixth welding sheet corresponds to the negative electrode of the green LED chip, and the second electrode sheet corresponds to the negative electrode of the blue LED chip and the positive electrode of the green LED chip.

[0013] As one of the preferred embodiments of the present invention, the electrode directions of the blue LED chip and the green LED chip are opposite. The first electrode sheet includes independent seventh welding sheets and eighth welding sheets. The seventh welding sheet corresponds to the negative electrode of the blue LED chip, the eighth welding sheet corresponds to the positive electrode of the green LED chip, and the second electrode sheet corresponds to the positive electrode of the blue LED chip and the negative electrode of the green LED chip.

[0014] As one of the preferred embodiments of the present invention, the first electrode sheet is provided with a first groove and a second groove. The second electrode sheet is provided with a third groove arranged opposite to the first groove and a fourth groove arranged opposite to the second groove. Both ends of the blue LED chip extend into the first groove and the third groove respectively, and both ends of the green LED chip extend into the second groove and the fourth groove respectively.

[0015] As one of the preferred embodiments of the present invention, the wavelength of the blue LED chip is 450 - 470 nm, and the wavelength of the green LED chip is 520 - 540 nm.

[0016] As one of the preferred embodiments of the present invention, the fluoride red powder glue is made by mixing silica gel and fluoride red powder. The chemical formula of the fluoride red powder is K2SiF6:Mn4+, and the wavelength is 625 - 635 nm.

[0017] Advantages of the present invention: A high-color gamut white light packaging device includes a first electrode sheet, a second electrode sheet, a blue LED chip, a green LED chip, and a fluoride red phosphor glue; the first electrode sheet and the second electrode sheet are arranged opposite to each other; the blue LED chip and the green LED chip are spaced and arranged between the first electrode sheet and the second electrode sheet, and the electrode surfaces at the bottoms of the blue LED chip and the green LED chip are flush with the bottoms of the first electrode sheet and the second electrode sheet; the fluoride red phosphor glue coats the peripheries and tops of the first electrode sheet, the second electrode sheet, the blue LED chip, and the green LED chip; through the above structure, a DCI-P3 color gamut value of 92%-100% can be achieved, and at the same time, it has the advantages of simple production process, good reliability, and low cost, meeting the usage requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a schematic structural diagram of a high-color gamut white light packaging device before segmentation;

[0020] Figure 2 is a schematic structural diagram of a high-color gamut white light packaging device after segmentation;

[0021] Figure 3 is an exploded view of a high-color gamut white light packaging device after segmentation;

[0022] Figure 4 is a partial schematic structural diagram of a first embodiment of a high-color gamut white light packaging device;

[0023] Figure 5 is a partial schematic structural diagram of a second embodiment of a high-color gamut white light packaging device;

[0024] Figure 6 is a partial schematic structural diagram of a third embodiment of a high-color gamut white light packaging device;

[0025] Figure 7 is a partial schematic structural diagram of a fourth embodiment of a high-color gamut white light packaging device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The role of the drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the protection scope of the present invention.

[0027] In the description of the present invention, the meaning of "a plurality of" is more than two. Understandings such as "greater than", "less than", and "exceeding" do not include the corresponding number, while understandings such as "above", "below", and "within" include the corresponding number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0028] In the description of the present invention, it should be understood that for the description of directions, such as the directions or position relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or position relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0029] In the present invention, unless otherwise clearly defined, terms such as "arrangement", "installation", and "connection" should be understood in a broad sense. For example, it can be directly connected, or indirectly connected through an intermediate medium; it can be a fixed connection, a detachable connection, or integrally formed; it can be a mechanical connection; it can be the communication inside two elements or the interaction relationship between two elements. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0030] Referring to Figures 1-7 , a high-color gamut white light packaging device, includes a first electrode sheet 10, a second electrode sheet 20, a blue light LED chip 30, a green light LED chip 40, and a fluoride red phosphor glue 50;

[0031] The first electrode sheet 10 and the second electrode sheet 20 are arranged oppositely;

[0032] The blue light LED chip 30 and the green light LED chip 40 are arranged at intervals between the first electrode sheet 10 and the second electrode sheet 20, and the electrode surfaces at the bottoms of the blue light LED chip 30 and the green light LED chip 40 are flush with the bottoms of the first electrode sheet 10 and the second electrode sheet 20;

[0033] The fluoride red phosphor glue 50 covers the peripheries and tops of the first electrode sheet 10, the second electrode sheet 20, the blue light LED chip 30, and the green light LED chip 40.

[0034] Referring to Figures 1-3, when the encapsulated device is being produced, 1. First, the blue LED chips 30 and the green LED chips 40 are neatly arranged on the array formed by the first electrode sheet 10 and the second electrode sheet 20. Specifically, the blue LED chips 30 and the green LED chips 40 are arranged at intervals between the first electrode sheet 10 and the second electrode sheet 20; 2. Then, the fluoride red powder glue 50 is evenly covered and pressed on the blue LED chips 30 and the green LED chips 40 and baked and cured. The fluoride red powder glue 50 covers the first electrode sheet 10, the second electrode sheet 20, the blue LED chips 30 and the green LED chips 40, and only exposes the pads of the first electrode sheet 10, the second electrode sheet 20, the blue LED chips 30 and the green LED chips 40 that need to be welded to the PCB board 70; 3. Cut and separate the device horizontally and vertically in the middle by means of waterless cutting; 4. After turning over the film, the finished product of the high-color gamut white light encapsulated device is obtained.

[0035] When the device provided by the present invention is welded to the PCB board using a welding material, the welding material can connect the pads at the bottoms of the first electrode sheet 10 and the second electrode sheet 20 and the blue LED chips 30 and the green LED chips 40 to the PCB board. The blue LED chips 30 and the green LED chips 40 in the present invention are conducted through the circuit design of the PCB board, and can be designed in series or in parallel.

[0036] Refer to Figures 3-4 , as the first embodiment of the high-color gamut white light encapsulated device, the electrode directions of the blue LED chips 30 and the green LED chips 40 are the same. The first electrode sheet 10 corresponds to the positive electrodes of the blue LED chips 30 and the green LED chips 40, and the second electrode sheet 20 corresponds to the negative electrodes of the blue LED chips 30 and the green LED chips 40; in this embodiment, a parallel circuit is formed between the blue LED chips 30 and the green LED chips 40.

[0037] Refer to Figure 3 and Figure 5 , as the second embodiment of the high-color gamut white light encapsulated device, the electrode directions of the blue LED chips 30 and the green LED chips 40 are the same. The first electrode sheet 10 includes independent first welding pieces 11a and second welding pieces 12a, and the second electrode sheet 20 includes independent third welding pieces 21a and fourth welding pieces 22a. The first welding piece 11a corresponds to the positive electrode of the blue LED chip 30, the second welding piece 12a corresponds to the positive electrode of the green LED chip 40, the third welding piece 21a corresponds to the negative electrode of the blue LED chip 30, and the fourth welding piece 22a corresponds to the negative electrode of the green LED chip 40; in this embodiment, the blue LED chips 30 and the green LED chips 40 exist independently and need to be connected to the drive circuit separately.

[0038] Refer to Figure 3 andFigure 6 As a third embodiment of the high-color gamut white light packaging device, the electrode directions of the blue LED chip 30 and the green LED chip 40 are opposite. The first electrode sheet 10 includes independent fifth welding sheets 11b and sixth welding sheets 12b. The fifth welding sheet 11b corresponds to the positive electrode of the blue LED chip 30, and the sixth welding sheet 12b corresponds to the negative electrode of the green LED chip 40. The second electrode sheet 20 corresponds to the negative electrode of the blue LED chip 30 and the positive electrode of the green LED chip 40. In this embodiment, a series circuit is formed between the blue LED chip 30 and the green LED chip 40. Among them, the fifth welding sheet 11b is connected to the positive electrode of the power supply, and the sixth welding sheet 12b is connected to the negative electrode of the power supply.

[0039] Referring to Figure 3 and Figure 7 As a fourth embodiment of the high-color gamut white light packaging device, the electrode directions of the blue LED chip 30 and the green LED chip 40 are opposite. The first electrode sheet 10 includes independent seventh welding sheets 11c and eighth welding sheets 12c. The seventh welding sheet 11c corresponds to the negative electrode of the blue LED chip 30, and the eighth welding sheet 12c corresponds to the positive electrode of the green LED chip 40. The second electrode sheet 20 corresponds to the positive electrode of the blue LED chip 30 and the negative electrode of the green LED chip 40. In this embodiment, a series circuit is formed between the blue LED chip 30 and the green LED chip 40. Among them, the seventh welding sheet 11c is connected to the negative electrode of the power supply, and the eighth welding sheet 12c is connected to the positive electrode of the power supply.

[0040] Referring to Figures 3-7 On the first electrode sheet 10, a first groove 61 and a second groove 62 are provided. On the second electrode sheet 20, a third groove 63 arranged opposite to the first groove 61 and a fourth groove 64 arranged opposite to the second groove 62 are provided. Both ends of the blue LED chip 30 extend into the first groove 61 and the third groove 63 respectively, and both ends of the green LED chip 40 extend into the second groove 62 and the fourth groove 64 respectively. By providing the first groove 61, the second groove 62, the third groove 63, and the fourth groove 64, it is possible to increase the welding area as much as possible while also reducing the area occupied by the overall device as much as possible.

[0041] In some embodiments, the wavelength of the blue LED chip 30 is 450 - 470 nm, and the wavelength of the green LED chip 40 is 520 - 540 nm; the fluoride red phosphor glue 50 is made by mixing silica gel and fluoride red phosphor, and the chemical formula of the fluoride red phosphor is K2SiF6:Mn4+ (potassium fluorosilicate doped with manganese ions), with a wavelength of 625 - 635 nm; the full width at half maximum of the blue LED chip 30 is about 20 nm, and the full width at half maximum of the green LED chip 40 is about 20 nm. After being coated with the fluoride red phosphor glue 50, the half wavelength of the excited converted red light is 5 - 30 nm, enabling the white light packaging device to achieve a DC I-P3 color gamut value of 92% - 100%, and it is used as a high-color gamut white light backlight module and a high-color gamut white light Mini backlight module.

[0042] The advantages of the present invention are as follows: Through the above structure, a DC I-P3 color gamut value of 92% - 100% can be achieved, and at the same time, it has the advantages of simple production process, good reliability, and low cost, meeting the usage requirements.

[0043] Certainly, the present invention is not limited to the above embodiments. Those skilled in the art can make equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations and substitutions are all included within the scope defined by the claims of this application.

Claims

1. A high color gamut white light package device, characterized in that: It comprises a first electrode sheet (10), a second electrode sheet (20), a blue LED chip (30), a green LED chip (40) and a fluoride red powder glue (50); The first electrode sheet (10) and the second electrode sheet (20) are arranged opposite to each other; The blue LED chip (30) and the green LED chip (40) are arranged at intervals between the first electrode sheet (10) and the second electrode sheet (20), and the electrode surfaces at the bottom of the blue LED chip (30) and the green LED chip (40) are flush with the bottom of the first electrode sheet (10) and the second electrode sheet (20); The fluoride red-pink glue (50) is coated on the sides and tops of the first electrode sheet (10), the second electrode sheet (20), the blue LED chip (30) and the green LED chip (40).

2. The high color gamut white light package device according to claim 1, characterized in that: The electrodes of the blue LED chip (30) and the green LED chip (40) have the same direction; the first electrode sheet (10) corresponds to the positive electrode of the blue LED chip (30) and the positive electrode of the green LED chip (40); and the second electrode sheet (20) corresponds to the negative electrode of the blue LED chip (30) and the negative electrode of the green LED chip (40).

3. The high color gamut white light package device according to claim 1, characterized in that: The electrodes of the blue LED chip (30) and the green LED chip (40) are in the same direction; the first electrode sheet (10) comprises a first welding sheet (11a) and a second welding sheet (12a) which are independent of each other; the second electrode sheet (20) comprises a third welding sheet (21a) and a fourth welding sheet (22a) which are independent of each other; the first welding sheet (11a) corresponds to the positive electrode of the blue LED chip (30); the second welding sheet (12a) corresponds to the positive electrode of the green LED chip (40); the third welding sheet (21a) corresponds to the negative electrode of the blue LED chip (30); and the fourth welding sheet (22a) corresponds to the negative electrode of the green LED chip (40).

4. The high color gamut white light package device according to claim 1, characterized in that: The electrodes of the blue LED chip (30) and the green LED chip (40) are in opposite directions; the first electrode sheet (10) comprises a fifth welding sheet (11b) and a sixth welding sheet (12b) which are independent of each other; the fifth welding sheet (11b) corresponds to the positive electrode of the blue LED chip (30); the sixth welding sheet (12b) corresponds to the negative electrode of the green LED chip (40); and the second electrode sheet (20) corresponds to the negative electrode of the blue LED chip (30) and the positive electrode of the green LED chip (40).

5. The high color gamut white light package device according to claim 1, characterized in that: The electrodes of the blue LED chip (30) and the green LED chip (40) are in opposite directions; the first electrode sheet (10) comprises a seventh welding sheet (11c) and an eighth welding sheet (12c) which are independent of each other; the seventh welding sheet (11c) corresponds to the cathode of the blue LED chip (30); the eighth welding sheet (12c) corresponds to the anode of the green LED chip (40); and the second electrode sheet (20) corresponds to the anode of the blue LED chip (30) and the cathode of the green LED chip (40).

6. The high color gamut white light package device according to claim 1, characterized in that: The first electrode sheet (10) is provided with a first groove (61) and a second groove (62); the second electrode sheet (20) is provided with a third groove (63) arranged opposite to the first groove (61) and a fourth groove (64) arranged opposite to the second groove (62); two ends of the blue LED chip (30) extend into the first groove (61) and the third groove (63) respectively; and two ends of the green LED chip (40) extend into the second groove (62) and the fourth groove (64) respectively.

7. The high color gamut white light package device according to claim 1, characterized in that: The wavelength of the blue LED chip (30) is 450-470 nm, and the wavelength of the green LED chip (40) is 520-540 nm.

8. The high color gamut white light package device according to claim 1, characterized in that: The fluoride red powder glue (50) is made by mixing silica gel and fluoride red powder, and the chemical formula of the fluoride red powder is K2SiF6:Mn 4+ , wavelength is 625-635nm.

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