Display panel and display device

Abstract

The application discloses a display panel and a display device, and relates to the technical field of display. The display panel comprises a display substrate, a chip and a circuit board. The display substrate comprises a display area, a bending area and a binding area. The binding area is located on the backlight side of the display area after being bent through the bending area. The chip is located on the binding area. The circuit board comprises a circuit board body and a plurality of functional devices arranged on the circuit board body. The circuit board body is connected with the binding area. At least part of the plurality of functional devices is located between the circuit board body and the display area. The circuit board body is provided with a first dispensing opening and a first observation opening located on both sides of the functional device. A first filling layer is formed around the functional device through the first dispensing opening. Alternatively, the chip is located between the binding area and the display area. The binding area is provided with a second dispensing opening and a second observation opening located on both sides of the chip. A second filling layer is formed around the chip through the second dispensing opening. The display panel provided by the application improves the reliability.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display panel and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are active light-emitting display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. Flexible display devices that use OLEDs as light-emitting devices and are controlled by thin film transistors (TFTs) have become the mainstream products in the display field.

[0003] With the development of display technology, users not only pursue display effects such as high resolution, high contrast and high screen ratio of display devices, but also the thinness and lightness of display devices.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a display panel and display device that improve reliability.

[0006] According to one aspect of the present invention, a display panel is provided, the display panel comprising:

[0007] The display substrate includes a display area, a bending area, and a bonding area. The bonding area is located on the backlight side of the display area after being bent through the bending area.

[0008] Chip, the chip being located on the bonding area;

[0009] A circuit board, comprising a circuit board body and a plurality of functional devices disposed on the circuit board body, wherein the circuit board body is connected to the bonding area;

[0010] Wherein, at least some of the plurality of functional devices are located between the circuit board body and the display area, and a first filling layer surrounding the functional devices is provided between the circuit board body and the display area; the circuit board body is provided with a first adhesive outlet and a first observation port located on both sides of the functional devices, and the first filling layer surrounds the functional devices after being filled through the first adhesive outlet; and / or

[0011] The chip is located between the bonding area and the display area, and a second filling layer is provided between the bonding area and the display area to surround the chip; the bonding area is provided with a second glue outlet and a second observation port located on both sides of the chip, and the second filling layer surrounds the chip after being filled through the second glue outlet.

[0012] In one exemplary embodiment of this disclosure, a clearance portion is formed on the display substrate, and at least a portion of the functional device located between the circuit board body and the display area is located in the clearance portion.

[0013] In one exemplary embodiment of this disclosure, the display substrate includes:

[0014] Display layer:

[0015] A heat dissipation layer, the heat dissipation layer being located on the backlight side of the display layer, and the clearance portion being formed on the heat dissipation layer.

[0016] In one exemplary embodiment of this disclosure, the display substrate includes:

[0017] Display layer:

[0018] A support layer is located on the backlight side of the display layer;

[0019] A hardened layer is located on the side of the support layer opposite to the display layer.

[0020] In one exemplary embodiment of this disclosure, the display panel further includes:

[0021] The circuit board is bonded to the backlight side of the display area through the first adhesive layer.

[0022] In one exemplary embodiment of this disclosure, the display panel further includes:

[0023] The second adhesive layer connects the bonding area to the backlight side of the display area.

[0024] In an exemplary embodiment of this disclosure, the circuit board body includes a bonding portion located on the bonding area, the bonding portion having a through hole, and the chip on the bonding area being connected to the backlight side of the display substrate through the through hole; the bonding portion of the circuit board and the backlight side of the display area are bonded together by the second adhesive layer.

[0025] In one exemplary embodiment of this disclosure, the display panel further includes: a first adhesive layer, wherein the circuit board is bonded to the backlight side of the display area through the first adhesive layer, the first adhesive layer is disposed around the functional device and spaced apart from a circumferential sidewall of the functional device, and a first filling layer is filled between the first adhesive layer and the functional device.

[0026] In one exemplary embodiment of this disclosure, the display panel further includes: a second adhesive layer, wherein the bonding area is connected to the backlight side of the display area through the second adhesive layer, the second adhesive layer is disposed around the chip and spaced apart from a circumferential sidewall of the chip, and a second filling layer is filled between the second adhesive layer and the chip.

[0027] In one exemplary embodiment of this disclosure, the circuit board body includes a bonding portion located on the bonding area, the bonding portion having a through hole, the chip on the bonding area being connected to the backlight side of the display substrate through the through hole, and the sidewall of the through hole being spaced apart from a ring of sidewalls in the circumferential direction of the chip; the bonding portion of the circuit board is bonded to the backlight side of the display area by a second adhesive layer, the second adhesive layer surrounding the chip and spaced apart from a ring of sidewalls in the circumferential direction of the chip, and a second filling layer filling the space between the sidewall of the through hole and the chip and between the second adhesive layer and the chip.

[0028] In one exemplary embodiment of this disclosure, the bending region is filled with a third filler layer on the inner side facing the chip.

[0029] According to another aspect of the present invention, a display device is provided, the display device including the display panel described above.

[0030] The display panel disclosed herein features functional components on a circuit board mounted in reverse on the side of the circuit board body away from the display area, and / or chips mounted in reverse on the bonding area away from the display area. This improves the structural flatness at the module FOP (FPC On COPBonding) and COP (Chip On Panel), thereby reducing the thickness at these locations and improving space utilization in the overall design, which is beneficial for the overall layout. Furthermore, the first filling layer surrounding the functional components forms a waterproof barrier, enhancing their water resistance and salt spray resistance, preventing moisture ingress that could cause component failure. By positioning the first dispensing port and the first observation port on opposite sides of the functional component, the first observation port allows observation or overflow of the filling material when the functional component is completely surrounded by the first filling layer, facilitating the determination of whether the first filling layer is fully filled. The second filling layer surrounding the chip forms a waterproof barrier, enhancing its water resistance and salt spray resistance, preventing moisture ingress that could cause chip failure. By positioning the second adhesive dot and the second observation port on opposite sides of the chip, when the chip is completely surrounded by the second filling layer, the second observation port can observe or overflow the filling material of the second filling layer, thus facilitating the determination of whether the chip is completely surrounded by the second filling layer.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0033] Figure 1 A schematic diagram of the display panel provided in this disclosure;

[0034] Figure 2 A schematic diagram of a display panel provided according to an embodiment of this disclosure;

[0035] Figure 3 A schematic diagram of a display panel provided for another embodiment of this disclosure;

[0036] Figure 4 A schematic diagram of a display panel provided for yet another embodiment of this disclosure;

[0037] Figure 5This is a schematic diagram of adhesive dispensing for a display panel provided in yet another embodiment of this disclosure.

[0038] Explanation of reference numerals in the attached figures:

[0039] 10. Display substrate; 110. Display layer; 120. Support layer; 130. Hardening layer; 140. Heat dissipation layer; 150. Second adhesive dot; 160. Second observation port;

[0040] 20. Chips;

[0041] 30. Circuit board; 310. Circuit board body; 320. Functional component; 330. First glue dispensing port; 340. First observation port;

[0042] 41. First adhesive layer; 42. Second adhesive layer;

[0043] 50. Spacers;

[0044] 60. Protective layer;

[0045] 71. First filler layer; 72. Second filler layer; 73. Third filler layer;

[0046] 81. Polarizing layer; 82. Optical adhesive layer; 83. Cover plate. Detailed Implementation

[0047] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0048] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this disclosure. The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0049] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0050] The terms “a,” “one,” “the,” and “at least one” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” etc. are used only as markers and are not a limitation on the number of objects.

[0051] like Figure 1 As shown, in the display panel, the chip 20' on the bonding area of ​​the display substrate 10' is located on the side of the bonding area away from the display area. After the circuit board body 310' of the circuit board 30' is bonded to the bonding area of ​​the display substrate 10', the functional components 320' of the circuit board body 310' are located on the side away from the display area. It can be seen that the structure is uneven at the module FOP (FPC On COPBonding) and COP (Chip On Panel), resulting in a thicker thickness at this point. This leads to low space utilization in the overall design and restricts the overall layout. At the same time, with the continuous thinning of display panels, the risk of cracks in the bending area increases due to the reduction in the bending radius. In addition, due to sealing reasons, moisture can seep in, causing component failure and seriously affecting the lifespan of the display panel.

[0052] To address the aforementioned technical problems, embodiments of this disclosure provide a display panel, such as... Figure 2As shown, the display panel includes a display substrate 10, a chip 20, and a circuit board 30. The display substrate 10 includes a display area AA, a bending area WZ, and a bonding area BD. The bonding area BD is located on the backlight side of the display area AA after being bent through the bending area WZ. The chip (IC) 20 is located on the bonding area BD. The chip 20 is a DDIC (Display Driver Integrated Circuit). The chip 20 can be bonded to the chip bonding area of ​​the bonding area BD of the display substrate 10 through a COP (Chip On Panel) process. The circuit board (Flexible Printed Circuit, FPC) 30 includes a circuit board body 310 and multiple functional devices 320 (such as resistors, capacitors, diodes, chips, etc.) disposed on the circuit board body 310. The circuit board body 310 can be bonded to the circuit board bonding area of ​​the bonding area BD of the display substrate 10 through an FOP (FPC On COP Bonding) process.

[0053] Among them, at least some of the functional devices 320 are located between the circuit board body 310 and the display area AA, and / or the drive rod chip 20 is located between the bonding area BD and the display area AA.

[0054] The display panel provided in this disclosure has functional devices 320 on the circuit board 30 reverse-mounted on the side of the circuit board body 310 away from the display area AA, and / or chip 20 reverse-mounted on the side of the bonding area BD away from the display area AA. This can improve the structural flatness at the module FOP and COP, optimize the structure, and achieve the effect of thinning the module. This can improve the space utilization rate in the overall design and is beneficial to the overall layout.

[0055] In one embodiment, such as Figure 2 As shown, the display substrate 10 includes a display layer (PNL) 110 and a back film (BF) 120, with the back film 120 distributed at least on the display area AA and the bonding area BD of the display layer 110.

[0056] The support layer 120 is made of metallic materials, such as dense metals like tungsten and iron, or stainless steel and alloys containing tungsten and iron. Alternatively, the support layer 120 can be a polymer material, such as polyester, polyethylene, optical adhesive, or pressure-sensitive adhesive film materials. For example, the thickness of the support layer 120 can be 50μm-200μm, such as 50μm, 70μm, 100μm, 130μm, 170μm, and 200μm, etc., which are not listed here. Of course, it can also be less than 50μm or greater than 200μm; this disclosure does not impose any limitations on this.

[0057] In one embodiment, the display layer 110 may include a substrate, a driving functional layer, a display functional layer, and an encapsulation layer.

[0058] The substrate can be, for example, an organic material, such as polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinylphenol (PVP), polyether sulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or a combination thereof; in addition, the substrate material can also be a flexible material, such as polyimide (PI).

[0059] The driving functional layer is disposed on the substrate and includes multiple pixel driving circuits and multiple signal traces for providing electrical signals to the pixel driving circuits. Each pixel driving circuit includes at least a transistor TFT and a conductive structure for connecting the transistor TFT. For example, the driving functional layer includes an active layer disposed on the substrate, a gate insulating layer covering the substrate and the active layer, a gate layer disposed on the gate insulating layer, an interlayer dielectric layer covering the gate layer and the gate insulating layer, and a source / drain electrode layer disposed on the interlayer dielectric layer. This source / drain electrode layer is connected to the active layer through a first via penetrating the interlayer dielectric layer and the gate insulating layer. Furthermore, the driving functional layer also includes a planarization layer covering the source / drain electrode layer and the interlayer dielectric layer.

[0060] The display functional layer includes an anode disposed on a planarization layer, which is connected to the source / drain electrode layer through a via penetrating the planarization layer. A pixel defining layer in the display functional layer covers the planarization layer and part of the anode. The pixel defining layer has multiple pixel openings, and the anode within each pixel opening is not covered by the pixel defining layer. The display functional layer also includes a light-emitting layer disposed within each pixel opening and a cathode covering the pixel defining layer and the light-emitting layer. By applying a first voltage to the anode and a second voltage to the cathode through the driving functional layer, the light-emitting layer within the pixel opening emits light under the control of the voltage difference between the first and second voltages. The anode, light-emitting layer, and cathode corresponding to one pixel opening form a pixel unit.

[0061] The encapsulation layer is located on the pixel defining layer. The encapsulation layer may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. For example, a first encapsulation layer can be formed on the side of the light-emitting layer away from the substrate using physical vapor deposition (PVD) or chemical vapor deposition (CVD). Then, a second encapsulation layer can be formed on the side of the first encapsulation layer away from the light-emitting layer using inkjet printing. Finally, a third encapsulation layer can be formed on the side of the second encapsulation layer away from the first encapsulation layer using PVD or CVD. The second encapsulation layer can be an organic encapsulation layer, while the first and third encapsulation layers can be inorganic encapsulation layers. By setting multiple inorganic encapsulation layers, the ability of the encapsulation layer to block water and oxygen can be improved, and by setting organic encapsulation layers, planarization can be achieved. For example, the inner and outer inorganic encapsulation layers can be made of inorganic materials such as silicon nitride (SiN). The organic encapsulation layer can be made of curable (e.g., photocurable or thermocurable) organic materials; for example, the organic encapsulation layer can be made of at least one of epoxy resin-based organic materials, acrylate-based organic materials, and silicone-based materials. Furthermore, the packaging structure may include not only the aforementioned internal inorganic packaging layer, external inorganic packaging layer, and organic packaging layer, but may also include other inorganic and organic packaging layers, which may be stacked alternately. This disclosure does not impose any restrictions on this.

[0062] In one embodiment, such as Figure 2 As shown, a polarizing layer (POL) 81 is formed on the display area AA on one side of the display substrate 10. An optical adhesive layer (OCA) 82 is formed on the side of the polarizing layer 81 away from the display substrate 10. A cover plate 83 is subsequently bonded through the optical adhesive layer 82. The cover plate 830 is, for example, a glass cover plate (CG).

[0063] In one embodiment, such as Figure 2 As shown, the display substrate 10 has a protective layer 60 coated on the bending region WZ. In order to improve the strength of the bent portion on the display substrate 10, the strength of the bending region WZ is enhanced by coating the bending region WZ with a protective material, such as MCL (Micro Coating Layer) adhesive.

[0064] In one embodiment, such as Figure 2 As shown, the display substrate 10 also includes a heat dissipation layer 140, which is located on the backlight side of the display layer 110. The heat dissipation layer 140 can be made of super clean foam (SCF) composite film, which plays a role in buffering, heat dissipation and other functions.

[0065] In one embodiment, such as Figure 2As shown, the hard coating (HC) 130 is located between the back of the support layer 120 and the heat dissipation layer 140. The hard coating 130 can enhance the surface hardness of the support layer 120 away from the display layer 110, so as to improve the hardness of the display area AA of the display substrate 10 and improve the reliability of the display substrate 10.

[0066] When the functional device 320 on the circuit board 30 is reverse-mounted on the side of the circuit board body 310 away from the display area AA, and / or the chip 20 is reverse-mounted on the bonding area BD away from the display area AA, the functional device 320 and / or the chip 20 will be connected to the backlight layer of the display substrate 10. During connection, a certain compressive force will be generated on the backlight side of the display substrate 10. By increasing the surface hardness of the support layer 120 away from the display layer 110, the hardness of the display substrate 10 can be improved. This can prevent the compressive force generated by the functional device 320 and / or the chip 20 on the backlight side of the display substrate 10 from causing functional problems in the display substrate 10, thereby improving the reliability of the display substrate 10.

[0067] In one embodiment, such as Figures 2-4 As shown, the functional device 320 on the circuit board 30 is disposed in the opposite direction on the side of the circuit board body 310 away from the display area AA.

[0068] The display substrate 10 has a clearance portion, and at least a portion of the functional device 320 located between the circuit board body 310 and the display area AA is located in the clearance portion. By providing the clearance portion, it is possible to accommodate the functional device in reverse orientation, thereby helping to reduce the module thickness.

[0069] The clearance portion can be formed on the heat dissipation layer 140, for example, by forming a clearance groove or clearance through hole on the heat dissipation layer 140. The depth of the clearance portion can be set according to the height of the functional device 320. For example, when the distance between the circuit board body 310 and the heat dissipation layer 140 is determined, the depth of the clearance portion is determined by the height of the functional device 320. When there are multiple functional devices 320, the multiple functional devices 320 can be located in the same clearance portion at the same time, and the depth of the clearance portion must be sufficient to accommodate the functional device 320 with the largest height. The depth of the parts in the clearance portion corresponding to functional devices 320 of different heights can be different or the same, and the multiple functional devices 320 can also be located in an independent clearance portion, or partially located in the same clearance portion. This disclosure does not impose any restrictions in this regard.

[0070] Among them, such as Figures 2-4As shown, the display panel also includes a first adhesive layer 41, through which the circuit board 30 is bonded to the backlight side of the display area AA. By adjusting the thickness of the first adhesive layer 41, the distance between the circuit board body 310 and the heat dissipation layer 140 can be adjusted, thereby providing support for the circuit board body 310 while simultaneously adjusting the position of the circuit board body 310 relative to the heat dissipation layer 140. The first adhesive layer 41 can be a double-sided adhesive, such as AD adhesive (acrylic hot melt adhesive), which can simultaneously serve the functions of bonding and support.

[0071] In one embodiment, such as Figures 2-4 As shown, chip 20 is reverse-mounted on the bonding area BD on the side opposite to the display area AA.

[0072] Among them, such as Figure 2 As shown, the bonding area BD is connected to the heat dissipation layer 140 through a spacer 50. A through hole is formed on the spacer 50, and the chip 20 is located in the through hole to bond to the chip bonding area.

[0073] Among them, such as Figure 3 As shown, the bonding portion on the circuit board body 310 is widened to replace the spacer 50 for support, and the widened bonding portion of the circuit board body 310 is connected to the heat dissipation layer 140 through the second adhesive layer 42. By adjusting the thickness of the second adhesive layer 42, the distance between the widened bonding portion of the circuit board body 310 and the heat dissipation layer 140 can be adjusted, thereby providing support for the widened bonding portion of the circuit board body 310 while adjusting the position of the widened bonding portion of the circuit board body 310 relative to the heat dissipation layer 140. The second adhesive layer 42 can be a double-sided adhesive, such as AD adhesive (acrylic hot melt adhesive), which can simultaneously serve as an adhesive and support. The materials of the first adhesive layer 41 and the second adhesive layer 42 can be the same or different. In this case, through holes can be formed on the widened bonding portion of the circuit board body 310 and the second adhesive layer 42, and the chip 20 can be located in the through holes to be bonded to the chip bonding area.

[0074] In one embodiment, such as Figure 4 and Figure 5 As shown, a first filler layer 71 is filled between the circuit board 30 and the display area AA, and the first filler layer 71 surrounds the functional device 320. By surrounding the functional device 320 with the first filler layer 71, a waterproof barrier is formed for the functional device 320, which improves the waterproofness and salt spray resistance of the functional device 320 on the circuit board 30, avoids the failure of the functional device 320 due to water vapor intrusion, extends the service life of the display panel, and enables the display panel to adapt to more usage scenarios, thereby improving its competitiveness.

[0075] Among them, such as Figure 5As shown, the first adhesive layer 41 is disposed around the functional device 320 and spaced apart from a ring of sidewalls in the circumferential direction of the functional device 320, and the first filler layer 71 is filled between the first adhesive layer 41 and the functional device 320.

[0076] Among them, such as Figure 5 As shown, the circuit board body 310 is provided with a first dispensing port 330 and a first observation port 340. The first dispensing port 330 and the first observation port 340 are located on both sides of the functional device 320. The first filling layer 71 surrounds the functional device 320 after being filled through the first dispensing port 330. By positioning the first dispensing port 330 and the first observation port 340 on both sides of the functional device 320, when the functional device 320 is completely filled with the first filling layer 71, the first observation port 340 can observe or overflow the filling material of the first filling layer 71, thereby facilitating the determination of whether the functional device 320 is completely filled with the first filling layer 71. At the same time, when the first filling layer 71 is filled through the first dispensing port 330, air can be vented through the first observation port 340 to prevent air bubbles or voids from appearing in the first filling layer 71 during the filling process.

[0077] Among them, such as Figure 5 As shown, the first dispensing port 330 and the first observation port 340 are located diagonally opposite each other on the functional device 320. During dispensing, when the functional device 320 is completely surrounded by the first filling layer 71, the first observation port 340 can observe or overflow the filling material of the first filling layer 71 due to the fluidity of the dispensing material, thus facilitating the determination of whether the functional device 320 is completely surrounded by the first filling layer 71.

[0078] The first dispensing port 330 can be located on the circuit board body 310 near the heat dissipation layer 140, while the first observation port 340 can be located away from the heat dissipation layer 140. During dispensing, when the functional device 320 is completely surrounded by the first filling layer 71, the first observation port 340 can observe or overflow the filling material of the first filling layer 71 due to the influence of gravity on the fluid dispensing material. This facilitates the determination of whether the functional device 320 is completely surrounded by the first filling layer 71. Simultaneously, it further prevents air bubbles or voids from appearing in the first filling layer 71 during the filling process.

[0079] In one embodiment, such as Figure 4 and Figure 5 As shown, a second filling layer 72 is filled between the bonding area BD and the display area AA, and the second filling layer 72 surrounds the chip 20. By surrounding the chip 20 with the second filling layer 72, a waterproof barrier is formed for the chip 20, which improves the waterproofness and salt spray resistance of the chip 20, avoids the failure of the chip 20 due to water vapor intrusion, extends the service life of the display panel, and enables the display panel to adapt to more usage scenarios, thereby improving its competitiveness.

[0080] Among them, such as Figure 4 As shown, when the bonding area BD is connected to the heat dissipation layer 140 through the spacer 50, and the spacer 50 has a through hole, and the chip 20 is located in the through hole to bond to the chip bonding area, the sidewall of the through hole on the spacer 50 is spaced apart from the circumferential sidewall of the chip 20, and the second filling layer 72 fills the spacer 50 and the chip 20.

[0081] When the widened bonding portion of the circuit board body 310 forms a through hole with the second adhesive layer 42, and the chip 20 is placed in the through hole to be bonded to the chip bonding area, the sidewall of the through hole formed by the widened bonding portion of the circuit board body 310 and the second adhesive layer 42 is spaced apart from the circumferential sidewall of the chip 20, and the second filling layer 72 fills the space between the second adhesive layer 42 and the chip 20 and between the widened bonding portion of the circuit board body 310 and the chip 20.

[0082] Among them, such as Figure 5 As shown, the bonding area BD is provided with a second adhesive dot 150 and a second observation port 160. The second adhesive dot 150 and the second observation port 160 are located on both sides of the chip 20. The second filler layer 72 surrounds the chip 20 after being filled through the second adhesive dot 150. By positioning the second adhesive dot 150 and the second observation port 160 on both sides of the chip 20, when the chip 20 is completely surrounded by the second filler layer 72, the second observation port 160 can observe or overflow the filling material of the second filler layer 72, thereby facilitating the determination of whether the chip 20 is completely surrounded by the second filler layer 72. At the same time, when the second filler layer 72 is filled through the second adhesive dot 150, air can be vented through the second observation port 160 to prevent air bubbles or voids from appearing in the second filler layer 72 during the filling process.

[0083] Among them, such as Figure 5 As shown, the second dispensing port 150 and the second observation port 160 are located diagonally opposite each other on the chip 20. During dispensing, when the chip 20 is completely surrounded by the second filler layer 72, the second observation port 160 can observe or overflow the filler material of the second filler layer 72 due to the fluidity of the dispensing material, thus facilitating the determination of whether the chip 20 is completely surrounded by the second filler layer 72. Simultaneously, this further prevents air bubbles or voids from appearing in the first filler layer 71 during the filling process.

[0084] In one embodiment, such as Figure 4 and Figure 5As shown, the bending area WZ facing the inside of the chip 20 is filled with a third filler layer 73. By filling the bending area WZ facing the inside of the chip 20 with the third filler layer 73, the third filler layer 73 forms a supporting effect on the bending area WZ, which can reduce the risk of cracks caused by the compression of the bonding area BD after bending, and greatly improve the yield of the display panel.

[0085] Among them, such as Figure 5 As shown, the adhesive can be dispensed from one side of the width direction of the bending area WZ to fill at least two-thirds of the bending area WZ in the width direction, thereby ensuring the support of the bending area WZ after the adhesive cures.

[0086] In one embodiment, at least one of the first filler layer 71, the second filler layer 72, and the third filler layer 73 may be made of UV-curable adhesive, epoxy resin adhesive, acrylic adhesive, silicone potting compound, or other waterproof damming filler adhesive, and this disclosure does not limit the application of this material.

[0087] The first filler layer 71, the second filler layer 72, and the third filler layer 73 can be made of the same material. The first filler layer 71, the second filler layer 72, and the third filler layer 73 can be made by three consecutive dispensing processes, which improves manufacturing efficiency and reduces production costs.

[0088] Embodiments of this disclosure also provide a display device, which includes the display panel described above. This display device may be, for example, a mobile phone, watch, tablet computer, advertising screen, vehicle display, or other terminal device. Its beneficial effects are detailed in the above-described display panel embodiments and will not be repeated here.

[0089] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0090] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A display panel, characterized in that, include: The display substrate includes a display area, a bending area, and a bonding area. The bonding area is located on the backlight side of the display area after being bent through the bending area. Chip, the chip being located on the bonding area; A circuit board, comprising a circuit board body and a plurality of functional devices disposed on the circuit board body, wherein the circuit board body is connected to the bonding area; Wherein, at least some of the plurality of functional devices are located between the circuit board body and the display area, and a first filling layer surrounding the functional devices is provided between the circuit board body and the display area; the circuit board body is provided with a first adhesive outlet and a first observation port located on both sides of the functional devices, and the first filling layer surrounds the functional devices after being filled through the first adhesive outlet; and / or The chip is located between the bonding area and the display area, and a second filling layer is provided between the bonding area and the display area to surround the chip; the bonding area is provided with a second glue outlet and a second observation port located on both sides of the chip, and the second filling layer surrounds the chip after being filled through the second glue outlet.

2. The display panel according to claim 1, characterized in that, A clearance portion is formed on the display substrate, and at least a portion of the functional device located between the circuit board body and the display area is located in the clearance portion.

3. The display panel according to claim 2, characterized in that, The display substrate includes: Display layer: A heat dissipation layer, the heat dissipation layer being located on the backlight side of the display layer, and the clearance portion being formed on the heat dissipation layer.

4. The display panel according to claim 1, characterized in that, The display substrate includes: Display layer: A support layer is located on the backlight side of the display layer; A hardened layer is located on the side of the support layer opposite to the display layer.

5. The display panel according to claim 1, characterized in that, The display panel also includes: The circuit board is bonded to the backlight side of the display area through the first adhesive layer.

6. The display panel according to claim 1, characterized in that, The display panel also includes: The second adhesive layer connects the bonding area to the backlight side of the display area.

7. The display panel according to claim 6, characterized in that, The circuit board body includes a bonding portion located on the bonding area, the bonding portion having a through hole, and the chip on the bonding area being connected to the backlight side of the display substrate through the through hole; the bonding portion of the circuit board and the backlight side of the display area are bonded together by the second adhesive layer.

8. The display panel according to claim 1, characterized in that, The display panel further includes: a first adhesive layer, wherein the circuit board is bonded to the backlight side of the display area through the first adhesive layer, the first adhesive layer is disposed around the functional device and spaced apart from a circumferential sidewall of the functional device, and a first filling layer is filled between the first adhesive layer and the functional device.

9. The display panel according to claim 1, characterized in that, The display panel further includes: a second adhesive layer, wherein the bonding area and the backlight side of the display area are connected through the second adhesive layer, the second adhesive layer surrounds the chip and is spaced apart from a circumferential sidewall of the chip, and a second filling layer fills the space between the second adhesive layer and the chip.

10. The display panel according to claim 1, characterized in that, The circuit board body includes a bonding portion located on the bonding area. The bonding portion has a through hole. The chip on the bonding area is connected to the backlight side of the display substrate through the through hole, and the sidewall of the through hole is spaced apart from a ring of sidewalls in the circumferential direction of the chip. The bonding portion of the circuit board is bonded to the backlight side of the display area by a second adhesive layer. The second adhesive layer surrounds the chip and is spaced apart from a ring of sidewalls in the circumferential direction of the chip. A second filling layer fills the space between the sidewall of the through hole and the chip, and between the second adhesive layer and the chip.

11. The display panel according to claim 1, characterized in that, The bending area is filled with a third filling layer facing the inside of the chip.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 11.

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