Resin member, reel body, packaging body, and resin material

Abstract

The present invention relates to a resin member comprising a resin component that exhibits tackiness by a photoreaction and a photo-radical initiator.

Description

Technical Field

[0001] The present invention relates to a resin member, a reel body, a package, and a resin material. Background Art

[0002] Regarding an adhesive material, due to its adhesiveness and tackiness, it cannot be peeled off or separated after lamination. Therefore, as a product form, a separator is necessary (for example, Patent Document 1).

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2004-10647 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] In a social environment that has recently emphasized reducing greenhouse gases, not using a separator will be a great contribution.

[0008] An object of the present invention is to provide a resin member that can be used as an adhesive material without using a separator. Another object of the present invention is to provide a resin material suitable for forming the above resin member.

[0009] Means for Solving the Technical Problem

[0010] The present invention provides the following [1] to

[11] in several aspects.

[0011] [1] A resin member comprising a resin component that exhibits adhesiveness by a photoreaction and a photo radical initiator.

[0012] [2] The resin member according to [1], wherein the resin component has a crosslinked structure and has a disulfide bond.

[0013] [3] The resin member according to [1] or [2], wherein the resin component is a reaction product of a compound a having two or more (meth)acryloyl groups and a compound b having two or more groups capable of reacting with the (meth)acryloyl group, the compound a includes a compound a-1 having three or more (meth)acryloyl groups, and at least one of the compound a and the compound b has a disulfide bond in the molecule.

[0014] [4] The resin member according to [3], wherein the photo radical initiator is a compound that provides a benzoyl radical by light irradiation, and the molar ratio of the benzoyl radical to the (meth)acryloyl group in the compound a-1 is 5 / 6 or less.

[0015] [5] The resin member according to [1] or [2], wherein the resin component is a reaction product of a compound c having two or more isocyanate groups and a compound d having two or more groups capable of reacting with the isocyanate groups, and at least one of the compound c and the compound d has a disulfide bond in the molecule.

[0016] [6] The resin member according to any one of [1] to [5], which is in the form of a film.

[0017] [7] A reel body, which includes a core and the resin member according to [6] wound around the core.

[0018] [8] A package, which includes: the resin member according to any one of [1] to [6] or the reel body according to [7]; and a packaging bag having light-shielding properties and containing the resin member or the reel body.

[0019] [9] A resin material, which includes: a compound a having two or more (meth)acryloyl groups; a compound b having two or more groups capable of reacting with the (meth)acryloyl groups; and a photo radical initiator, the compound a includes a compound a-1 having three or more (meth)acryloyl groups, and at least one of the compound a and the compound b has a disulfide bond in the molecule.

[0020]

[10] The resin material according to [9], wherein the photo radical initiator is a compound that provides a benzoyl radical upon light irradiation, and the molar ratio of the benzoyl radical to the (meth)acryloyl groups in the compound a-1 is 5 / 6 or less.

[0021]

[11] A resin material, which includes: a compound c having two or more isocyanate groups; a compound d having two or more groups capable of reacting with the isocyanate groups; and a photo radical initiator, the compound c includes a compound having three or more isocyanate groups, and at least one of the compound c and the compound d has a disulfide bond in the molecule.

[0022] Advantages of the Invention

[0023] According to the present invention, a resin member that can be used as an adhesive material without using a separator can be provided. According to the present invention, a resin material suitable for forming the resin member can be provided. Brief Description of the Drawings

[0024] Figure 1 It is a diagram showing a test piece made for evaluating the adhesive force.

[0025] Figure 2It is a graph showing the change in storage modulus with respect to elapsed time for Examples 1a to 1d.

[0026] Figure 3 It is a chart showing the change in storage modulus with respect to elapsed time for Examples 2a to 2e. Detailed Description of the Invention

[0027] Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

[0028] In this specification, the term "process" includes not only independent processes, but also those that are included in this term even when they cannot be clearly distinguished from other processes as long as they achieve the intended function of the process. Also, the numerical range represented by "~" means a range that includes the numerical values described before and after "~" as the minimum value and the maximum value, respectively.

[0029] In this specification, when there are multiple substances corresponding to each component in a resin component or resin material, unless otherwise specified, it refers to the total amount of these multiple substances present in the resin component or resin material. Unless otherwise specified, the exemplary materials can be used alone or in combination of two or more.

[0030] Within the numerical ranges described stepwise in this specification, the upper limit value or lower limit value of one step's numerical range can also be replaced with the upper limit value or lower limit value of another step's numerical range. Within the numerical ranges described in this specification, the upper limit value or lower limit value of the numerical range can also be replaced with the value shown in the examples. "A or B" only needs to include either A or B, and can also include both. In this specification, "(meth)acryloyl" is methacryloyl or acryloyl. In this specification, the "weight average molecular weight" is a polystyrene conversion value obtained by gel permeation chromatography (GPC) using a calibration curve based on standard polystyrene. In this specification, "room temperature" means 25 ± 10°C.

[0031] 〔Resin Component〕

[0032] The resin component according to this embodiment contains a resin component that exhibits adhesiveness through a photoreaction and a photo radical initiator.

[0033] Due to its adhesiveness and tackiness, conventional adhesive materials are used together with a partition on the adhesive surface side that covers the adhesive material. The resin component according to the present embodiment exhibits adhesiveness after light irradiation. Therefore, for example, the resin component according to the present embodiment is provided in contact with an object to be adhered in a state before light irradiation without adhesiveness, and when the user uses it, the resin component is softened and made adhesive by light irradiation, and thus can be used as an adhesive material without using a partition.

[0034] <Resin component>

[0035] The resin component contains a resin that exhibits adhesiveness through a photoreaction. The resin component may contain a polymer having one or more (two or more) photoreactive functional groups. The number of photoreactive functional groups can be, for example, 1 to 1000 or 4 to 50. For example, through light irradiation, a part or all of the photoreactive groups in the resin component are decomposed and made low molecular weight, thereby exhibiting adhesiveness.

[0036] As photoreactive functional groups, for example, disulfide bonds (-S-S-), trithiocarbonates, nitrobenzyls, alkyl phenyl ketones, acylphosphine oxides, oxime esters, hexarylbisimidazoles, allyl sulfides, and styrene pyrene dimers can be cited.

[0037] The resin component can be a resin having a disulfide bond, or a resin having a disulfide bond in the main chain of the polymer. The resin component may have a crosslinked structure. When the resin component has a crosslinked structure, the disulfide bond may be present in one or both of the main chain and the crosslinked portion.

[0038] Based on the total amount of the resin component, the total content of the resin component can be 60% by mass or more, 70% by mass or more, or 80% by mass or more, and can also be 99% by mass or less, 97% by mass or less, or 95% by mass or less.

[0039] The resin component can be a reaction product of a compound A having two or more first groups and a compound B having two or more groups capable of reacting with the first group, i.e., a second group. In the resin component, at least one of the compound A and the compound B may have a disulfide bond in the molecule. The first group can be, for example, a (meth)acryloyl group or an isocyanate group. The second group can be appropriately selected according to the type of the first group. As the second group, for example, a mercapto group (-SH) and an amino group (-NH 2 and -NH- etc.) can be cited.

[0040] In one embodiment, the resin component may contain a reaction product of a compound a having two or more (meth)acryloyl groups in the molecule and a compound b having two or more groups capable of reacting with the (meth)acryloyl group in the molecule.

[0041] Compound a may include compound a-1 having three or more (meth)acryloyl groups. Compound a-1 is a compound having three or more groups selected from the group consisting of methacryloyl group and acryloyl group in the molecule. The upper limit of the number of (meth)acryloyl groups of compound a-1 may be, for example, 10 or less, 8 or less, 6 or less, or 4 or less per molecule. Compound a-1 may be a compound having three (meth)acryloyl groups.

[0042] The molecular weight or weight average molecular weight of compound a-1 may be 150 or more, 500 or more, or 1000 or more, and may also be 50000 or less, 10000 or less, or 2000 or less.

[0043] Examples of compound a-1 include compounds having a trimethylolpropane skeleton and having three or more (meth)acryloyl groups, compounds having a pentaerythritol skeleton and having three or more (meth)acryloyl groups, compounds having an isocyanurate skeleton and having three or more (meth)acryloyl groups, and compounds having a pentaerythritol skeleton and having three or more (meth)acryloyl groups.

[0044] Compound a-1 having a trimethylolpropane skeleton may be, for example, a compound represented by the following formula (a1).

[0045]

[0046] In formula (a1), R 1 represents a hydrogen atom or a methyl group, and L 1 represents an alkylene group. n1, n2, and n3 each independently represent an integer of 1 or more. When there are a plurality of R 1 , they may be the same or different from each other. The number of carbon atoms of the alkylene group represented by L 1 may be 2 or more, and may also be 10 or less, 6 or less, or 3 or less. The alkylene group represented by L 1 may be, for example, ethylene group (-CH 2 -CH 2 -). When there are a plurality of L 1 , they may be the same or different from each other. The sum n1 + n2 + n3 of n1, n2, and n3 may be, for example, 0 or more or 6 or more, and may also be 27 or less, 20 or less, or 9.

[0047] As commercially available products of the compound a-1 having 3 (meth)acryloyl groups, for example, F ANCRYL FA-133 (manufactured by SHOWA DENKO MATERIALS CO., LTD.), FA-132A, FA-137A, FA-133M, FA-137M (all manufactured by SHOWA DENKO MATERIALS CO., LTD.), NK ESTER A-TMPT, NK ESTER A-TMPT-9EO, NK ESTER AT-20E, NK ESTER A-GLY-3E, NK ESTER A-GLY-9E, NK ESTER A-GLY-20E, NK ESTER A-9300 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), TMP TA, EBECRYL 160S, OTA480 (all manufactured by DAICEL-ALLNEX LTD.), VISCOAT #295, VISCOAT #300 (all manufactured by Osaka Organic Chemical Industry Ltd.), EB ECRYL 4513, EBECRYL 8465, EBECRYL 9260, EBECRYL 8701, KRM8667 and KRM8296 (all manufactured by DAICEL-ALLNEX LTD.) can be cited. As commercially available products of the compound a-1 having 4 or more (meth)acryloyl groups, for example, EBECRYL 4265, EBECRYL 4587, EBECRYL 4666, EBECRYL 8210, EBECRYL 8606, EBECRYL 1290, EB ECRYL 5129, EBECRYL 8254, EBECRYL 8301R, KRM8200, KRM8904, KR M8452, EBECRYL 220 (all manufactured by DAICEL-ALLNEX LTD.), NK ESTER A-TMMT, NK ESTER ATM-35E, NK ESTER AD-TMP, NK ESTER A-DPH, NK ESTER A-9550, NK ESTER A-DPH-12E and NK ESTER TPOA-50 (all manufactured by Shin-Nakamura Chemical Co., Ltd.) can be cited.

[0048] Compound a may further contain a compound a-2 having 2 (meth)acryloyl groups. Compound a-2 is a compound having 2 or more groups selected from the group consisting of methacryloyl groups and acryloyl groups in the molecule. Compound a-2 further contains a linking group that links 2 (meth)acryloyl groups.

[0049] The molecular weight or weight-average molecular weight of compound a-2 can be 150 or more, 500 or more, or 1000 or more, and can also be 50000 or less, 10000 or less, or 2000 or less.

[0050] Compound a-2 can be, for example, a compound represented by the following formula (a2).

[0051]

[0052] In formula (a2), R 2 represents a hydrogen atom or a methyl group. L 2 represents an alkylene group. When there are multiple Rs 2 , they can be the same or different from each other. The number of carbon atoms of the alkylene group represented by L 2 can be 2 or more, and can also be 10 or less, 6 or less, or 3 or less. The alkylene group represented by L 2 can be, for example, an ethylene group (-CH 2 -CH 2 -). m represents an integer of 1 or more. m can be 2 or more or 3 or more. The upper limit of m can be, for example, 10 or less, 8 or less, 6 or less, or 5 or less. When there are multiple Ls 2 , they can be the same or different from each other.

[0053] As commercially available products of Compound a-2, for example, FANCRYL FA-220 (manufactured by SHOWA DENKO MATERIALS CO., LTD.), NK ESTER HD-N, NK ESTER NO D-N, NK ESTER DOD-N, NK ESTERNPG, NK ESTER 701, NK ESTER 2G, NK ESTER 3G, NK ESTER 4G, NK ESTER 9G, NK ESTER14G, N K ESTER 23G, NK ESTER 9PG, NK ESTER DCP, NK ESTER BPE-80N, NK ESTER BPE-100, NK ESTER BPE-200, NK ESTER BPE-500, NK EST ER BPE-900, NK ESTER BPE-1300N, NKESTER A-HD-N, NK ESTER A-NOD-N, NK ESTER A-DOD-N, NK ESTER A-NPG-N, NK ESTER701A, NK ESTER A-200, NK ESTER A-400, NK ESTER A-600, NK ESTER A-1000, NK ESTERAPG-200, NK ESTER APG-400, NK ESTER APG-700, N K ESTER A-PTMG65, NK ESTER A-DCP, NK ESTER ABE-300, NK EST ER A-BPE-4, NK ESTER A-BPE-10, NK ESTER A-BPE-20 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), EBECRYL210, EBECRYL230, EBECRYL270, EBECRYL4858, EBECRYL8402, EBECRYL8804, EBECRYL8807, EBEC RYL9270, EBECRYL8191, Violet light TM UV-2000B, Violet light TM UV-3000B, Violet light TM UV-3200B, Violet light TM UV-3300B, Violet light TM UV-3310B, Violet light TM UV-3500BA, Violet light TM U V-3520EA, Violet light TM UV-3700B and Violet light TMUV-6640B (all manufactured by Mitsubishi Chemical Corporation).

[0054] Based on the total amount of the resin component, the content of compound a (the total content of compound a-1 and compound a-2) can be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and can also be 99% by mass or less, 97% by mass or less, or 95% by mass or less.

[0055] Based on the total amount of the resin component, the content of compound a-1 can be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and can also be 90% by mass or less, 70% by mass or less, or 50% by mass or less.

[0056] Based on the total amount of the resin component, the content of compound a-2 can be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and can also be 99% by mass or less, 97% by mass or less, or 95% by mass or less.

[0057] The ratio of the number of moles of compound a-1 to the total number of moles of compound a (the total number of moles of compound a-1 and compound a-2) can be 0.2 or more, 0.3 or more, or 0.4 or more, and can also be 1.0 or less, 0.9 or less, or 0.8 or less.

[0058] When compound a has a disulfide bond in the molecule, the number of disulfide bonds in compound a-1 or compound a-2 can be, for example, 1 to 1000 or 4 to 50.

[0059] Compound b is a compound b having two or more groups capable of reacting with a (meth)acryloyl group. The upper limit of the number of groups capable of reacting with a (meth)acryloyl group can be, for example, 10 or less, 8 or less, 6 or less, 4 or less, or 3 or less per molecule. Compound b can be a compound in which the group capable of reacting with a (meth)acryloyl group is a thiol group. That is, compound b can be a compound having two or more thiol groups in the molecule.

[0060] When compound b has a disulfide bond in the molecule, the number of disulfide bonds in compound b can be, for example, 1 to 1000 or 4 to 50.

[0061] The molecular weight or weight-average molecular weight of compound b can be 100 or more, 1000 or more, or 3000 or more, and can also be 50000 or less, 30000 or less, or 10000 or less.

[0062] Compound b can be a compound (e.g., a polymer or oligomer) having a linear molecular chain and end groups and having a disulfide bond in the molecular chain. In this case, the end group in compound b can be a thiol group. When compound b is such a compound, it is even easier to form a reaction product (cured product) that can exhibit excellent photoresist adhesiveness. The molecular chain in compound b can contain a disulfide bond and a polyether chain, or can be composed of a disulfide bond and a polyether chain.

[0063] Compound b can be, for example, a compound represented by the formula (1): HS-(A-S-S) p -A-SH (Compound (1)). In the formula, A represents a polyether chain. Multiple A's can be the same as each other or different from each other. p represents an integer of 1 or more. p can be, for example, 1 or more or 4 or more, and can also be 1000 or less. Compound b can be a compound obtained by chain-extending Compound (1).

[0064] The polyether chain as A can be, for example, a polyoxyalkylene chain. The polyether chain as A can be, for example, a group represented by -A 1 -O-A 2 -O-A 3 -. A 1 ~A 3 can each independently be an alkylene group, or can be an alkylene group having 1 to 2 carbon atoms (e.g., methylene, ethylene). As the polyether chain of A, for example, -CH 2 CH 2 -O-CH 2 -O-CH 2 CH 2 - etc. can be cited.

[0065] As commercially available products of compound b, for example, Thiocol LP series (dithiols having disulfide bonds, manufactured by TORAY FINE CHEMICALS CO., LTD.) etc. can be cited. Compound b can be used alone in 1 kind, or can be used in combination of 2 or more kinds. Compound b can also be obtained by converting the reactive functional groups of a raw material compound having reactive functional groups and disulfide bonds at the ends into thiol groups. As the reactive functional groups in the raw material compound, carboxyl group, hydroxyl group, etc. can be cited. As the raw material compound having reactive functional groups and disulfide bonds at the ends, 3,3'-dithiobipropionic acid, dithioethanolamine, cysteamine, etc. can be cited.

[0066] Based on the total mass of the resin component, the content of compound b can be 1% by mass or more, 3% by mass or more, 5% by mass or more, 30% by mass or more, or 50% by mass or more, and can also be 99% by mass or less, 97% by mass or less, or 95% by mass or less.

[0067] The ratio of the number of moles of the thiol group in Compound b to the number of moles of the (meth)acryloyl group in Compound a can be, for example, 0.90 or more, or 0.95 or more, and can also be 1.1 or less, or 1.05 or less. If the ratio of the number of moles of the thiol group in Compound b to the number of moles of the (meth)acryloyl group in Compound a is within the above range, the decrease in the photo adhesive property is further suppressed, and the decrease in the storage stability of the resin component is further suppressed.

[0068] More specifically, the reaction product of Compound a and Compound b can be a Michael addition reaction product of the (meth)acryloyl group in Compound a and the thiol group in Compound b. The reaction of Compound a and Compound b can be carried out by heating, or can be carried out at room temperature using a catalyst (curing catalyst) that promotes the reaction of Compound a and Compound b. The reaction temperature of Compound a and Compound b can be, for example, 0 to 200 °C, or can also be 30 to 150 °C or 60 to 100 °C. The time maintained at the above reaction temperature can be, for example, 0.1 to 168 hours, or can also be 72 hours or less, 24 hours or less, 12 hours or less, 6 hours or less, 4 hours or less, 3 hours or less, or 2 hours or less.

[0069] As a catalyst that promotes the reaction of Compound a and Compound b, for example, an amine compound and a phosphorus compound can be cited. The amine compound can be, for example, a tertiary amine compound or a secondary amine compound. As the amine compound, dicyandiamide, trimethylamine, triethylamine, tripropylamine, tributylamine, tri-n-octylamine, dimethylethylamine, dimethylpropylamine, dimethylbutylamine, dimethyl-n-octylamine, 1,4-diazabicyclo[2.2.2]octane, 1,8-diazabicyclo[5.4.0]undec-7-ene, benzyldimethylamine, 4-methyl-N,N-dimethylbenzylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 4-dimethylaminopyridine, etc. can be cited.

[0070] Considering aspects such as easier rapid curing at room temperature and easier adjustment of the open time, the catalyst that promotes the reaction of Compound a and Compound b can be 1,8-diazabicyclo[5.4.0]undec-7-ene, a phosphorus compound, or a secondary amine compound.

[0071] Based on the total amount of the resin component, the content of the catalyst that promotes the reaction of Compound a and Compound b can be 0.02% by mass or more, 0.1% by mass or more, or 1% by mass or more, and can also be 3% by mass or less, 2.5% by mass or less, or 2% by mass or less.

[0072] The reaction product of Compound a and Compound b has the formula (I): *-C(=O)-CHR-CH 2-S-* represents the structure and disulfide bond. In formula (I), R represents a hydrogen atom or a methyl group, and * represents a bonding site. The disulfide bond that becomes the bond cleavage site may be present in one or both of the main chain and the side chain of the reaction product. From the viewpoint of easily obtaining a resin component that exhibits tackiness after light irradiation, the disulfide bond may be present in the main chain of the reaction product.

[0073] The reaction product of compound a and compound b may contain a compound including a structure represented by the following formula (x1).

[0074]

[0075] In formula (x1), R 1 , L 1 , n1, n2 and n3 have the same meanings as in formula (a1), A and p have the same meanings as in formula (1), and * represents a bonding site. In formula (x1), when there are multiple Rs 1 , L 1 , A and p may be the same as or different from each other.

[0076] The reaction product of compound a and compound b may contain a compound including a structure represented by the following formula (x2).

[0077]

[0078] In formula (x2), R 2 , L 2 and m have the same meanings as in formula (a2), A and p have the same meanings as in formula (1), and * represents a bonding site. In formula (x2), when there are multiple Rs 2 , A and p may be the same as or different from each other.

[0079] In one embodiment, the resin component may contain a reaction product of a compound c having two or more isocyanate groups in the molecule and a compound d having two or more groups capable of reacting with the isocyanate group in the molecule.

[0080] The upper limit of the number of isocyanate groups of compound c may be, for example, 10 or less, 8 or less, 6 or less, or 4 or less per molecule. Compound c may be a compound having two or three isocyanate groups.

[0081] The molecular weight or weight average molecular weight of compound c may be 150 or more, and may also be 600 or less, 1000 or less, or 10000 or less.

[0082] In one embodiment, compound c may include compound c-1 having two isocyanate groups and compound c-2 having three isocyanate groups. By increasing the content of compound c-1 having two isocyanate groups, the flexibility of the resin component can be improved. By increasing the content of compound c-2 having three isocyanate groups, the crosslinking degree can be increased and rigidity can be imparted.

[0083] Examples of compound c-1 having two isocyanate groups include aliphatic diisocyanates such as ethylene diisocyanate, propylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate, and trimethylhexamethylene diisocyanate; alicyclic diisocyanates such as isophorone diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, norbornane diisocyanate, 1,4-isocyanatocyclohexane, 1,3-bis(isocyanatomethyl)-cyclohexane, and 1,3-bis(2-isocyanatopropyl-2-yl)-cyclohexane; and aromatic diisocyanates such as toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylene diisocyanate, and 1,5-naphthalene diisocyanate. Among these, compound c-1 may be an aliphatic diisocyanate or hexamethylene diisocyanate (HDI).

[0084] Examples of compound c-2 having three isocyanate groups include triphenylmethane-4,4',4''-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1,3,5-tris(isocyanatomethyl)benzene, and 2,6-diisocyanatohexanoic acid-2-isocyanatoethyl ester. Examples of compound c-2 having three isocyanate groups include trimers of the above compound c-1. Among these, compound c-2 may be a trimer of an aliphatic diisocyanate or a trimer of hexamethylene diisocyanate (HDI).

[0085] The isocyanate groups in compound c can be protected by a blocking agent. Generally, the isocyanate groups protected by the blocking agent are stable at room temperature. When compound c having two or more isocyanate groups protected by the blocking agent is heated to a temperature above the dissociation temperature of the blocking agent, free isocyanate groups are generated. Examples of the blocking agent may be methyl ethyl ketoxime (MEKO, dissociation temperature 130 °C), dimethylpyrazole (DMP, dissociation temperature 110 °C), diethyl malonate (DEM, dissociation temperature 110 °C), and active methylene compounds (dissociation temperature 90 °C).

[0086] Based on the total amount of the resin component, the content of compound c constituting the resin component (for example, the total content of compound c-1 and compound c-2) can be 2% by mass or more, 4% by mass or more, or 7% by mass or more, and can also be 50% by mass or less, 40% by mass or less, or 30% by mass or less.

[0087] In one embodiment, the ratio of the number of moles of compound c-2 to the total number of moles of compound c (the total number of moles of compound c-1 and compound c-2) can be 0.5 or more. If this ratio is 0.5 or more, the crosslinking degree can be increased and rigidity can be imparted. In this case, this ratio can be 0.7 or more, 0.8 or more, or 0.9 or more. The upper limit of this ratio can be 1 or less.

[0088] When compound c (compound c-1 and compound c-2) has a disulfide bond in the molecule, the number of disulfide bonds in one molecule can be, for example, 1 to 1000 or 4 to 50.

[0089] Compound d is a compound having two or more groups capable of reacting with an isocyanate group. As compound d, a compound having two or more mercapto groups (-SH) in the molecule can be used. The details of the compound having two or more mercapto groups (-SH) in the molecule can be as described above.

[0090] The ratio of the number of moles of the mercapto group in compound d to the number of moles of the isocyanate group in compound c can be, for example, 0.90 or more or 0.95 or more, and can also be 1.1 or less or 1.05 or less.

[0091] More specifically, the reaction product of compound c and compound d is formed by a thiocarbamation reaction of the isocyanate group in compound c and the mercapto group in compound d. The reaction of compound c and compound d can be carried out by heating, or can be carried out at room temperature using a catalyst (curing catalyst) that promotes the reaction of compound c and compound d. The reaction temperature of compound c and compound d can be, for example, 0 to 200 °C, and can also be 30 to 150 °C or 60 to 100 °C. The time maintained at the above reaction temperature can be, for example, 0.1 to 168 hours, and can also be 72 hours or less, 24 hours or less, 12 hours or less, 6 hours or less, 4 hours or less, 3 hours or less, or 2 hours or less.

[0092] As the catalyst that promotes the reaction of compound c and compound d, the catalysts exemplified as the catalyst that promotes the reaction of compound c and compound d can be used. The content of the catalyst that promotes the reaction of compound c and compound d can be 0.01 part by mass or more, 0.1 part by mass or more, or 1 part by mass or more, and can also be 3 parts by mass or less, 2.5 parts by mass or less, or 2% by mass or less with respect to 100 parts by mass of the total amount of the resin component.

[0093] The reaction product of compound c and compound d has a structure represented by formula (II): *-NH-C(=O)-S-* and a disulfide bond. In formula (II), * represents a bonding bond. The disulfide bond may be present in one or both of the main chain and the side chain of the reaction product. From the viewpoint of more easily exhibiting photoresist adhesiveness, the disulfide bond may be present in the main chain of the reaction product.

[0094] The reaction product of compound c and compound d may contain a compound including a structure represented by the following formula (y1).

[0095]

[0096] In formula (y1), A and p have the same meanings as in formula (1), and * represents a bonding bond.

[0097] <Photo radical initiator>

[0098] The photo radical initiator is a component that generates radicals upon light irradiation. For example, components that can be used as photoinitiators for photopolymerization can be used as the photo radical initiator. Examples of the photo radical initiator include hydrogen abstraction type photo radical polymerization initiators that generate radicals by abstracting hydrogen from other molecules upon light irradiation, and intramolecular cleavage type photo radical polymerization initiators that generate two radicals by photolytic cleavage of themselves upon light irradiation. The photo radical initiator is preferably an intramolecular cleavage type photo radical initiator.

[0099] Examples of the hydrogen abstraction type photo radical initiator include hexaarylbiimidazole (HABI) compounds, benzophenone compounds, thioxanthone compounds, fluorenone compounds, and α-diketone compounds.

[0100] Examples of the HABI compound include 2,2'-bis(ortho-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole), 2,2'-bis(ortho-bromophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(ortho,para-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(ortho-chlorophenyl)-4,4',5,5'-tetrakis(m-methoxyphenyl)biimidazole, 2,2'-bis(ortho,ortho'-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(ortho-nitrophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(ortho-methylphenyl)-4,4',5,5'-tetraphenylbiimidazole, etc.

[0101] Examples of benzophenone compounds include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, etc.

[0102] Examples of thioxanthone compounds include thioxanthone, 2-isopropylthioxanthone, 2-dodecylthioxanthone, 2-cyclohexylthioxanthone, 2,4-diethylthioxanthone, 2,4-dimethylthioxanthone, 1-phenoxythioxanthone, 1-methoxycarbonylthioxanthone, 2-ethoxycarbonylthioxanthone, 3-(2-methoxyethoxycarbonyl)-thioxanthone, 4-butoxycarbonylthioxanthone, 3-butoxycarbonyl-7-methylthioxanthone, 3,4-di-[2-(2-methoxyethoxy)-ethoxycarbonyl]-thioxanthone, 2-chlorothioxanthone, 1-ethoxycarbonyl-3-ethoxythioxanthone, 1-ethoxycarbonyl-3-chlorothioxanthone, 1-chloro-4-n-propoxythioxanthone, 2-methyl-6-dimethoxymethyl-thioxanthone, 2-methyl-6-(1,1-dimethoxybenzyl)-thioxanthone, 6-ethoxycarbonyl-2-methoxy-thioxanthone, 6-ethoxycarbonyl-2-methylthioxanthone, 1-ethoxycarbonyl-3-(1-methyl-1-morpholinoethyl)-thioxanthone, 2-morpholinomethylthioxanthone, 2-methyl-6-morpholinomethylthioxanthone, and polyethylene glycol ester of thioxanthone-2-carboxylic acid.

[0103] Examples of fluorenone compounds include 9-fluorenone, 3,4-benzofluorenone, 2-dimethylamino-9-fluorenone, 2-methoxy-9-fluorenone, 2-chloro-9-fluorenone, 2,7-dichloro-9-fluorenone, 2-bromo-9-fluorenone, 2,7-dibromo-9-fluorenone, 2-nitro-9-fluorenone, 2-acetyl-9-fluorenone, etc.

[0104] Examples of α-diketone compounds include benzyl (a compound also known as diphenylglyoxal or dibenzoyl).

[0105] Examples of intramolecular cleavage type photo radical initiators include benzyl ketal type photo radical initiators, α-aminoalkylbenzophenone type photo radical initiators, α-hydroxyalkylbenzophenone type photo radical initiators, α-hydroxyacetophenone type photo radical initiators, acylphosphine oxide type photo radical initiators, etc.

[0106] Examples of benzyl ketal type photo radical initiators include 2,2-dimethoxy-1,2-diphenylethane-1-one (Omnirad651), etc.

[0107] Examples of α - aminoalkyl phenyl ketone - based photo - radical initiators include 2 - benzyl - 2 - dimethylamino - 1 - (4 - morpholinophenyl) - butan - 1 - one (Omnirad 369), 2 - methyl - 1 - [4 - (methylthio)phenyl] - 2 - morpholinopropan - 1 - one (Omnirad 907), 2 - dimethylamino - 2 - (4 - methyl - benzyl) - 1 - (4 - morpholin - 4 - yl - phenyl) - butan - 1 - one (Omnirad 379EG), etc.

[0108] Examples of α - hydroxyalkyl phenyl ketone - based photo - radical initiators include 1 - hydroxy - cyclohexyl - phenyl - ketone (Omnirad 184), etc.

[0109] Examples of α - hydroxyacetophenone - based photo - radical initiators include 2 - hydroxy - 1 - {4 - [4 - (2 - hydroxy - 2 - methyl - propionyl) - benzyl] - phenyl} - 2 - methyl - propan - 1 - one (Omnirad 127), 2 - hydroxy - 2 - methyl - 1 - phenyl - propan - 1 - one (Omnirad 1173), etc.

[0110] Examples of acylphosphine oxide - based photo - radical initiators include 2,4,6 - trimethylbenzoyl - diphenyl - phosphine oxide (Omnirad TPO H), bis(2,4,6 - trimethylbenzoyl) - phenylphosphine oxide (Omnirad 819), etc.

[0111] From the viewpoint of further improving the heat resistance of resin parts, the 5% weight loss temperature of the photo - radical initiator can be 150 °C or higher, 200 °C or higher, or 250 °C or higher, and can also be 300 °C or lower, for example. The 5% weight loss temperature is the temperature at the point when the mass of the sample decreases by 5% from the initial value in thermogravimetric analysis that measures the mass change of the sample while heating.

[0112] From the viewpoint of making the photo-softening property more excellent, the photo-radical initiator may be a compound that more easily exhibits tackiness upon light irradiation, wherein, upon light irradiation, each molecule of the photo-radical initiator generates two or more monoradicals and does not generate diradicals. As such a photo-radical initiator, for example, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propanone (5% weight loss temperature: 204 °C), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propanone (5% weight loss temperature: 220 °C), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (5% weight loss temperature: 248 °C), 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one (5% weight loss temperature: 248 °C), bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (5% weight loss temperature: 241 °C), 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (5% weight loss temperature: 253 °C), and their polymers can be cited.

[0113] The photo-radical initiator may be a compound that provides benzoyl radicals upon light irradiation. A compound that provides benzoyl radicals upon light irradiation refers to a compound that cleaves by a photoreaction to generate benzoyl radicals. As a compound that provides benzoyl radicals upon light irradiation, for example, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide can be cited.

[0114] Based on the total amount of the resin component, the content of the photo-radical initiator may be 1% by mass or more, 2% by mass or more, or 3% by mass or more, and may also be 15% by mass or less, 12% by mass or less, or 9% by mass or less.

[0115] When the resin component contains compound a-1, the ratio of the number of moles of benzoyl radicals to the number of moles of (meth)acryloyl groups (total number of moles of acryloyl groups and methacryloyl groups) in compound a-1 can be 5 / 6 or less, 4 / 6 or less, 7 / 12 or less, or 1 / 2 or less, and can also be 1 / 12 or more, 1 / 6 or more, or 1 / 4 or more.

[0116] <Physical properties of resin components, etc.>

[0117] The crosslink point distance Mc (g / mol) of the resin component can be 50000 or less, 35000 or less, or 20000 or less, and can also be 3000 or more, 3500 or more, or 4000 or more. If the crosslink point distance is below the above upper limit value, the occurrence of adhesiveness before light irradiation is suppressed, it is less likely to become gel-like, and the change in adhesiveness before and after light irradiation becomes larger. If the crosslink point distance is below the above upper limit value, it is less likely for the resins to adhere to each other before light irradiation, and thus it is easier to stack. If the crosslink point distance is above the above lower limit value, the amount of photo radical initiator required for the appearance of adhesiveness after light irradiation can be further reduced, and the adhesiveness can be more easily manifested.

[0118] The crosslink point distance Mc is the crosslinked molecular weight, that is, the average molecular weight between crosslink points, and the theoretical value is calculated by the formulation. Regarding the calculation of the crosslink point distance, when an atom where C-C or C-O single bonds in the resin component branch in three or more directions is used as a crosslink point, or when there is a branch in three or more directions from a cyclic skeleton such as isocyanurate, the cyclic skeleton itself (the six-membered ring of C and N itself) is regarded as a crosslink point for calculation. The specific calculation method is described in the examples below.

[0119] The storage modulus G' of the resin component can be 100000000 or less, 10000000 or less, or 2000000 or less, and can also be 10000 or more, 100000 or more, or 500000 or more.

[0120] The loss tangent tanδ of the resin component can be 1 or less, 0.9 or less, or 0.8 or less, and can also be 0.005 or more, 0.01 or more, or 0.02 or more. The loss tangent tanδ is represented by the ratio of the loss modulus G" to the storage modulus G' (G" / G').

[0121] The storage modulus G' and loss modulus G" of the resin component can be measured by the methods described in the examples below.

[0122] The shear adhesion force of the resin component (resin component before light irradiation) at 25°C can be 5 N / cm 2 or less, and can also be 0 N / cm 2The shear adhesive strength of the resin member can be measured by the method described in the examples described later.

[0123] The resin part develops adhesiveness by light irradiation. The light used for light irradiation may include, for example, light with a wavelength of 365 nm or 405 nm. The exposure amount of light irradiation may be, for example, 1000 mJ / cm 2 In this specification, exposure refers to the illuminance (mW / cm 2 ) multiplied by the irradiation time (seconds). The irradiation of light may be performed directly on the irradiated object or through glass or the like. The light source used for light irradiation is not particularly limited, and examples thereof include LED lamps, mercury lamps (low pressure, high pressure, ultra-high pressure, etc.), metal halide lamps, excimer lamps, xenon lamps, etc. Among these, the light source used for light irradiation may be an LED lamp, a mercury lamp, or a metal halide lamp.

[0124] Generally, the storage modulus G' of the resin member after light irradiation is lower than the storage modulus G' of the resin member before light irradiation. The storage modulus G' of the resin member after light irradiation may be 1,000,000 or less, 500,000 or less, or 200,000 or more, or 1,000 or more, 10,000 or more, or 20,000 or more.

[0125] The loss modulus G" of the resin component after light irradiation may be 1,000,000 or less, 500,000 or less, or 200,000 or less, or 1,000 or more, 10,000 or more, or 20,000 or more.

[0126] The loss tangent tan δ of the resin member after light irradiation may be 2 or less, 1.7 or less, or 1.5 or less, or 0.1 or more, 0.15 or more, or 0.2 or more.

[0127] The storage modulus G′ and the loss modulus G″ of the resin member after light irradiation can be measured by the method described in the examples described later.

[0128] The shear adhesion of the resin parts after light irradiation at 25°C can be 5N / cm 2 Above, 10N / cm 2 Above or 15N / cm 2 The shear adhesive strength of the resin member after light irradiation at 25° C. can be measured by the method described in the examples described later.

[0129] The shape of the resin part can be various shapes such as film, block, etc. The method of forming into a film or block is not particularly limited, and a known method can be applied. The thickness of the film-shaped resin part can be, for example, 5 μm or more or 10 μm or less, or 5 mm or less than 1 mm.

[0130] The resin component can be used for applications such as adhesive materials, protective materials, and pick-up materials for parts and materials.

[0131] The resin component can be obtained by a method including the following steps: reacting a precursor of a resin component in a mixture containing a precursor of a resin component that exhibits adhesiveness through a photoreaction and a photo radical initiator. The reaction conditions can be as described above.

[0132] 〔Resin material〕

[0133] The resin material according to one embodiment contains a compound a having two or more (meth)acryloyl groups, a compound b having two or more groups capable of reacting with (meth)acryloyl groups, and a photo radical initiator. In this resin material, the compound a contains a compound a-1 having three or more (meth)acryloyl groups, and at least one of the compound a and the compound b has a disulfide bond in the molecule.

[0134] The resin material according to another embodiment contains a compound c having two or more isocyanate groups, a compound d having two or more groups capable of reacting with isocyanate groups, and a photo radical initiator. In this resin material, at least one of the compound c and the compound d has a disulfide bond in the molecule. In this resin material, the compound c can contain a compound having three or more isocyanate groups.

[0135] In the above resin materials, the specific forms of the compounds a to d and the photo radical initiator can be applied to the above forms.

[0136] The above resin material is a material suitable for forming a resin component that can be used as an adhesive material without using a separator.

[0137] 〔Spool〕

[0138] The spool according to this embodiment includes a core and the above resin component wound around the core. In the spool, the above resin component is in the form of a film. The spool can be manufactured, for example, by a method including winding a long strip of film-like resin component around the outer surface of a cylindrical core.

[0139] 〔Package〕

[0140] The package according to this embodiment includes the above resin component or the above spool, and a packaging bag having light-shielding properties and accommodating the resin component or the spool. The packaging bag is not particularly limited as long as it has light-shielding properties against light from the outside and can accommodate the above resin component or the above spool.

[0141] Examples

[0142] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples.

[0143] 〔Test Materials〕

[0144] The materials used in the synthesis were directly the purchased materials.

[0145] <Compound A>

[0146] ·Trimethylolpropane triacrylate (FANCRYL FA - 133, EO - modified trimethylolpropane triacrylate, manufactured by SHOWA DENKO MATERIALS CO., LTD.)

[0147]

[0148] ·1,3,5 - Tris(6 - isocyanatohexan - 1 - yl)-1,3,5 - triazine - 2,4,6(1H,3H,5H)-trione (Desmodule N - 3300 (HDI trimer), manufactured by Covestro Urethane Co., Ltd.)

[0149] <Compound B>

[0150] ·Polysulfide (Thiocol LP - 55, manufactured by TORAY FINE CHEMICALS CO., LTD., SH% = 1.8%)

[0151]

[0152] <Photo - radical initiator>

[0153] ·2 - (Dimethylamino)-2 - (4 - methylbenzyl)-1 - [4 - morpholin - 4 - yl - phenyl)butan - 1 - one (Omnirad - 379EG; manufactured by IGM Resins B.V., 5% weight loss temperature: 248 °C)

[0154] ·2,4,6 - Trimethylbenzoyl - diphenylphosphine oxide (Omnirad - TPO, manufactured by IGM Resins B.V., 5% weight loss temperature: 253 °C)

[0155] <Curing catalyst>

[0156] ·2,4,6 - Tris(dimethylaminomethyl)phenol (ADEKA curing agent EHC - 30; manufactured by ADEKA CORP ORATION)

[0157] ·Triethylamine (TEA, manufactured by Tokyo Chemical Industry Co., Ltd.)

[0158] 〔Test Example 1〕

[0159] 1-1. Preparation of Resin Material and Fabrication of Evaluation Film

[0160] Polysulfide, trimethylolpropane triacrylate, and Omnirad-379EG, which are terminal difunctional thiols (molecular weight of about 3700) having disulfide bonds in the chain, were used as test materials. The test materials were placed in a 100 mL plastic ointment jar, heated at 95 °C for 1 hour, and then stirred for 3 minutes at a rotation speed of 2000 rpm using a planetary mixer (Awat ori Rentaro ARE-310; manufactured by THINKY CORPORATION) to complete the mixing. Thus, the resin materials of Examples 1a to 1d were prepared.

[0161] The resin material obtained by sandwiching between the release surfaces of two sheets of release PET (Film Byna DB-50 (manufactured by FUJIMORI KOGYO CO., LTD.)) together with a spacer of the target film thickness was cured under the condition of 1 week at room temperature. Regarding the curing method, referring to the existing reports on the reaction between mercapto group and acryloyl group, 2 parts by weight of 2,4,6-tris(dimethylaminomethyl)phenol (A DEKA curing agent EHC-30; manufactured by ADEKA CORPORATION) was added as a catalyst, and thus the Michael addition reaction between the mercapto group and the acrylic group was carried out at room temperature. The curing rate was calculated based on the measurement results of infrared absorption spectrum, and the polymerization was considered completed when the integral value of the peak of the acryloyl group near 810 cm -1 decreased by more than 95% compared with that before polymerization.

[0162] After curing, the release film was peeled off, and thus the evaluation films of Examples 1a to 1d were obtained. The obtained evaluation films were used as test specimens for various evaluations.

[0163] 1-2. Light Irradiation

[0164] A UV irradiation device (manufactured by Panasonic Industrial Devices SUNX Co., Ltd., power supply: AicureUJ30, 405 nm LED head: ANUJ6189) was used for UV irradiation. Regarding the irradiation conditions, measurement was carried out using an illuminometer UIT-250 (manufactured by Ushio Inc.) and a light receiver for 405 nm.

[0165] 1-3. Calculation of Distance between Crosslinking Points (Theoretical Value)

[0166] Calculate the distance between crosslinking points Mc (g / mol) (theoretical value) of the resin component obtained by curing the resin material. Regarding the distance between crosslinking points (theoretical value), since a trifunctional monomer is used as the crosslinking site, one molecule of triacrylate itself is regarded as a crosslinking point, and the influence of plasticizing components such as photoinitiators is excluded for calculation. The distance between crosslinking points Mc of the resin components in Examples 1a to 1d is 4139.

[0167] 1-4. Mechanical property evaluation

[0168] As an option of the viscoelasticity measuring device (manufactured by TA Instruments, trade name: DHR-2), a glass stage for microscopic observation and an 8-mm disposable rotor were used. The evaluation sample was irradiated with light through the UV irradiation device described in "1-2. Light irradiation" from the bottom surface of the glass stage, and thus the change in viscoelasticity with respect to light irradiation was evaluated. The measurement was performed at a gap between the stage and the rotor of 500 ± 200 μm, a frequency of 1 Hz, and a displacement of 1%. During the measurement, a film with a thickness of 500 ± 200 μm obtained by the method of "1-1. Preparation of resin material and production of evaluation film" was punched into a cylindrical film with a diameter of 8 mm.

[0169] 1-5. Evaluation of shear adhesion

[0170] In the measurement of shear adhesion, a film with a thickness of 500 ± 100 μm obtained by the method of "1-1. Preparation of resin material and production of evaluation film" was punched into a cylindrical film with a diameter of 10 ± 1 mm. As Figure 1 such, the cylindrical cured product was overlapped in the order of adherend, test body, and adherend from below to cross the adherends, and a load of 500 g was applied for 1 hour for bonding, thereby obtaining a measurement sample for shear adhesion. As the adherend, a polycarbonate (PC) plate was used. The measurement of shear adhesion was performed before and after light irradiation. For light irradiation, LED light with a wavelength of 405 nm was irradiated from both sides at 5000 mJ / cm 2 using the device of "1-2. Light irradiation". The obtained test piece was used to measure the shear adhesion at a tensile speed of 10 mm / min at 25 °C using AUTOGRAPH AGS-X manufactured by SHIMADZU CORPORATION. The films before UV irradiation did not adhere to each other even when laminated and could be peeled and separated.

[0171] 1-6. Evaluation results of photo-viscoelasticity

[0172] Table 1 shows the evaluation results of the storage modulus, loss modulus, and shear adhesion before and after light irradiation.

[0173] [Table 1]

[0174]

[0175] In the resin member in which the molar ratio of the photoradical initiator to the polysulfide was 70 to 60%, no resin residue was observed after the resin member was peeled off, and the shear adhesive strength was further improved.

[0176] Figure 2 It is a graph showing the change in storage modulus of Examples 1a to 1d with respect to the elapsed time. The elastic modulus of the resin parts of Examples 1a to 1d decreased after light irradiation, and it was confirmed that adhesiveness was exhibited. All samples of the resin parts before light irradiation can be easily peeled and separated after stacking themselves. Based on the above results, it is shown that the resin parts designed in Test Example 1 can function as adhesive materials without a partition.

[0177] [Test Example 2]

[0178] 2-1. Preparation of resin material and production of evaluation film

[0179] With the composition shown in Table 2 (unit: mass parts), the sample material was matched according to the following steps. First, compound B and curing catalyst were matched in a 30mL plastic ointment jar. At this time, the amount of compound B was adjusted so that the content of the curing catalyst was 1% by mass based on the total amount of compound B and curing catalyst. Then, using a rotation-revolution mixer (Awatori Rentaro ARE-310, manufactured by THINKY CORPORATION), the complex was stirred for 1.5 minutes at a speed of 2000rpm to obtain a mixture a. Then, the remaining compound B and the photoradical initiator were matched in a 100mL plastic ointment jar, and the same rotation-revolution mixer was used to stir the complex for 1.5 minutes at a speed of 2000rpm, and it was heated at 95°C for 1 hour. After heating, using the same rotation-revolution mixer, it was cooled to room temperature after further stirring for 1.5 minutes at a speed of 2000rpm, and compound A was added, thereby obtaining a mixture b. Next, the mixture a and the mixture b were mixed in a 30 mL plastic ointment jar, and the mixture was stirred at a rotation speed of 2000 rpm for 1.5 minutes, thereby preparing the resin materials of Examples 2a to 2e.

[0180] The obtained resin material was sandwiched between the release surfaces of two release PET films (Film BinaDB-50 (manufactured by FUJIMORI KOGYO CO., LTD.)) with a spacer having a film thickness of 500 μm, and cured at room temperature for 1 week. Then the release films were peeled off to obtain the evaluation films for Examples 2a to 2e. This evaluation film was used as the test specimen for mechanical property evaluation. Regarding the completion of curing (polymerization), it was confirmed by infrared absorption spectroscopy. The point at which the integral value of the peak of the isocyanate near 2260 cm -1 decreased by more than 90% compared to that before polymerization was judged as the completion of curing (polymerization).

[0181] [Table 2]

[0182]

[0183] 2-2. Light irradiation

[0184] Light irradiation was carried out using the same UV irradiation device and illuminometer as in "1-2. Light irradiation".

[0185] 2-3. Calculation of distance between crosslinks (theoretical value)

[0186] The distance between crosslinks Mc (g / mol) (theoretical value) of the resin component obtained by curing the resin material was calculated. Regarding the distance between crosslinks (theoretical value), the isocyanurate ring itself of the HDI trimer was regarded as the crosslink point, and the influence of plasticizing components such as photoinitiators was excluded for the calculation. The results are shown in Table 3. The distance between crosslinks Mc of the resin components of Examples 2a to 2e was 3956.

[0187] 2-4. Mechanical property evaluation

[0188] As an option of the viscoelasticity measuring device (manufactured by TA Instruments, trade name: DHR-2), a glass stage for microscope observation and an 8 mm disposable rotor were used. The evaluation sample was irradiated with light through the UV irradiation device described in "1-2. Light irradiation" from the bottom surface of the glass stage, and thus the change in viscoelasticity with respect to light irradiation was evaluated. The measurement was carried out at a gap between the stage and the rotor of 600 ± 100 μm, a frequency of 1 Hz, and a displacement of 1%. In addition, during the measurement, a film with a thickness of 500 ± 100 μm obtained by the method of "2-1. Preparation of resin material and production of evaluation film" was punched into a cylindrical film with a diameter of 8 mm. Light irradiation was repeatedly carried out until the exposure dose became 30 J / cm 2 , and starting from 10 seconds after the start of the measurement, LED light with a wavelength of 405 nm was irradiated for 2 seconds at 500 mW / cm 2 every 10 seconds. The results are shown in Table 4.

[0189] [Table 3]

[0190]

[0191] [Table 4]

[0192]

[0193] 2-5. Evaluation Results of Photo-Viscoelasticity

[0194] The photo-viscoelasticity of the resin parts of Examples 2a to 2e was evaluated. For each sample, LED light with a wavelength of 405 nm was irradiated for 2 seconds every 10 seconds at an intensity of 500 mW / cm 2 to measure the viscoelasticity.

[0195] Figure 3 It is a graph showing the storage modulus of Examples 2a to 2e with respect to the change over time. The elastic modulus of the resin parts of Examples 2a to 2e decreased after light irradiation, and it was confirmed that tackiness appeared.

[0196] The above content shows that the resin part of the present invention can be used as an adhesive material without using a separator.

Claims

1. A resin component, which comprises a resin composition that exhibits adhesiveness through a photoreaction and a photo radical initiator.

2. The resin component according to claim 1, wherein, the resin composition has a crosslinked structure and has disulfide bonds.

3. The resin component according to claim 1 or 2, wherein, the resin composition is a reaction product of a compound a having two or more (meth)acryloyl groups and a compound b having two or more groups capable of reacting with the (meth)acryloyl groups, the compound a includes a compound a-1 having three or more (meth)acryloyl groups, at least one of the compound a and the compound b has a disulfide bond in the molecule.

4. The resin component according to claim 3, wherein, the photo radical initiator is a compound that provides benzoyl radicals upon light irradiation, the molar ratio of the benzoyl radicals to the (meth)acryloyl groups in the compound a-1 is 5 / 6 or less.

5. The resin component according to claim 1 or 2, wherein, the resin composition is a reaction product of a compound c having two or more isocyanate groups and a compound d having two or more groups capable of reacting with the isocyanate groups, at least one of the compound c and the compound d has a disulfide bond in the molecule.

6. The resin component according to claim 1, which is in the form of a film.

7. A reel body, which includes a core and the resin component according to claim 6 wound around the core.

8. A package, which includes: the resin component according to claim 1 or the reel body according to claim 7; and a packaging bag having light-shielding properties and containing the resin component or the reel body.

9. A resin material, which comprises: compound a, having two or more (meth)acryloyl groups; compound b, having two or more groups capable of reacting with the (meth)acryloyl groups; and a photo radical initiator, the compound a includes a compound a-1 having three or more (meth)acryloyl groups, at least one of the compound a and the compound b has a disulfide bond in the molecule.

10. The resin material according to claim 9, wherein, the photo radical initiator is a compound that provides benzoyl radicals upon light irradiation, the molar ratio of the benzoyl radicals to the (meth)acryloyl groups in the compound a-1 is 5 / 6 or less.

11. A resin material, which comprises: compound c, having two or more isocyanate groups; compound d, having two or more groups capable of reacting with isocyanate groups; and a photo radical initiator, the compound c includes a compound having three or more isocyanate groups, at least one of compound c and compound d has a disulfide bond in the molecule.

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