Power supply device, method for forming filter device, and battery system including power

Abstract

A power supply device includes: a primary side printed circuit board (PCB); a secondary side PCB insulated from the primary side PCB; a filter device including a plurality of metal plates disposed between the primary side PCB and the secondary side PCB; and a transformer provided on the filter device and including a primary side winding connected to the primary side PCB and a secondary side winding connected to the secondary side PCB.

Description

Technical Field

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0120505, filed on September 11, 2023, with the Korean Intellectual Property Office, the entire content of which is incorporated herein by reference.

[0003] The present disclosure relates to a power supply device, a method for forming a filter device, and a battery system including the power supply device. Background Art

[0004] A battery management system (BMS) for managing the operation of a battery pack may be connected to each of a low - voltage region and a high - voltage region. For example, the BMS may be connected to the 12V auxiliary power (low - voltage region) of a vehicle to which the battery pack is applied and receive power required for its operation from the 12V auxiliary power, and may be connected to the high - voltage region of the battery pack and perform operations such as voltage measurement of the battery pack or insulation measurement of the battery pack. The high potential difference occurring between the low - voltage region and the high - voltage region requires insulation, and the BMS may thus include an isolated switching - mode power supply (SMPS), such as a flyback converter.

[0005] However, electromagnetic compatibility (EMC) noise may frequently occur during the operation of the flyback converter. Summary of the Invention

[0006] [Technical Problem]

[0007] The present disclosure attempts to provide a power supply device, a method for forming a filter device, and a battery system that can reduce electromagnetic compatibility (EMC) noise.

[0008] [Technical Solution]

[0009] According to one aspect, there is provided a power supply device, including: a primary - side printed circuit board (PCB); a secondary - side PCB insulated from the primary - side PCB; a filter device including a plurality of metal plates disposed between the primary - side PCB and the secondary - side PCB; and a transformer disposed on the filter device and including a primary - side winding connected to the primary - side PCB and a secondary - side winding connected to the secondary - side PCB.

[0010] The filter device may further include a PCB, and a plurality of insulating layers of the PCB may be disposed between the plurality of metal plates. A capacitance may be provided by the plurality of metal plates and the plurality of insulating layers disposed between the plurality of metal plates.

[0011] The plurality of metal plates may be formed by using metal fillings in a plurality of through - holes extending from one surface of the filter device.

[0012] The primary - side PCB, the filter device, and the secondary - side PCB can be implemented as one PCB.

[0013] A plurality of metal plates can be arranged at regular intervals.

[0014] The plurality of metal plates can include a plurality of first metal plates connected to the primary - side PCB and a plurality of second metal plates connected to the secondary - side PCB. The plurality of first metal plates and the plurality of second metal plates can be arranged alternately. An insulating region can be provided between the plurality of first metal plates and the plurality of second metal plates.

[0015] According to another aspect, a method for forming a filter device disposed between a primary - side printed circuit board (PCB) and a secondary - side PCB is provided. The method includes: forming a plurality of vias in a direction perpendicular to one surface of the PCB in one surface of the PCB; and forming a plurality of metal plates by filling the plurality of vias with metal. A plurality of insulating layers of the PCB can be provided between the plurality of metal plates.

[0016] The transformer can be disposed to face one surface of the filter device.

[0017] According to still another aspect, a battery system is provided, including: a battery pack including a plurality of battery cells; a battery management system that monitors the battery pack and controls charging and discharging of the battery pack; and a power supply device that supplies power to the battery management system. The power supply device can include: a primary - side printed circuit board (PCB); a secondary - side PCB insulated from the primary - side PCB; a filter device including a plurality of metal plates disposed between the primary - side PCB and the secondary - side PCB; and a transformer disposed on the filter device and including a primary - side winding connected to the primary - side PCB and a secondary - side winding connected to the secondary - side PCB.

[0018] The filter device can further include a PCB, and a plurality of insulating layers of the PCB are provided between the plurality of metal plates. Capacitance can be provided by the plurality of metal plates and the plurality of insulating layers provided between the plurality of metal plates.

[0019] [Beneficial Effects]

[0020] As described above, the present disclosure provides a power supply device, a method for forming a filter device, and a battery system including the power supply device that can reduce electromagnetic compatibility (EMC) noise. Description of the Drawings

[0021] Figure 1 is a block diagram showing a power supply device according to an embodiment.

[0022] Figure 2 is a circuit diagram of the power supply device.

[0023] Figure 3 FIG. Figure 3 is a diagram showing a conventional primary-side printed circuit board (PCB) and a conventional secondary-side PCB.

[0024] Figure 4 FIG. Figure 4 is an analog diagram showing the capacitance between a conventional primary-side PCB and a secondary-side PCB.

[0025] Figure 5 FIG. is a diagram showing a primary-side PCB, a filter device, and a secondary-side PCB according to an embodiment.

[0026] Figure 6 FIG. Figure 7 is an analog diagram showing the capacitance between a primary-side PCB and a secondary-side PCB according to an embodiment.

[0027] Figure 7 FIG. Figure 8 is a diagram showing a primary-side PCB, a filter device, and a secondary-side PCB according to another embodiment.

[0028] Figure 8 FIG. Figure 9 is an analog diagram showing the capacitance between a primary-side PCB and a secondary-side PCB according to an embodiment.

[0029] Figure 9 FIG. Figure 10 is a diagram showing a primary-side PCB, a filter device, and a secondary-side PCB according to still another embodiment.

[0030] Figure 10 FIG. Figure 11 is an analog diagram showing the capacitance between a primary-side PCB and a secondary-side PCB according to an embodiment.

[0031] Figure 11 FIG. Figure 12 is a schematic diagram showing a filter device according to an embodiment.

[0032] Figure 12 and Figure 13 FIGS. and

[0033] are diagrams each showing a method for forming a plurality of metal plates according to an embodiment.

[0033] Figure 14 FIG. is a diagram showing a battery system including a power supply device according to an embodiment. DETAILED DESCRIPTION

[0034] When describing the embodiments disclosed in this specification, a detailed description of cases where a detailed description of known technologies related to the present disclosure may obscure the gist of the present disclosure is omitted. In addition, it is to be understood that the accompanying drawings are provided only to allow for easy understanding of the embodiments of the present disclosure, and the spirit of the present disclosure is not limited by the drawings and includes all modifications, equivalents, and substitutions included in the spirit and scope of the present disclosure.

[0035] Terms including ordinal numbers such as "first" and "second" may be used to describe various components. However, these components are not limited to these terms. These terms are only used to distinguish one component from another component.

[0036] It is to be understood that when a component is referred to as being "connected to" or "coupled to" another component, a component can be directly connected or coupled to another component, or can be connected or coupled to another component while a third component is inserted therebetween. On the other hand, it is to be understood that when a component is referred to as being "directly connected to" or "directly coupled to" another component, a component can be connected or coupled to another component without a third component being inserted therebetween.

[0037] It is also to be understood that terms such as "comprising" and "having" used in the specification specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof mentioned in the specification, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0038] Figure 1 is a block diagram showing a power supply device according to an embodiment.

[0039] As Figure 1 shown, the power supply device 1 may include a primary side printed circuit board (PCB) 10, a secondary side PCB 20, a transformer 30, and a filter device 12. The primary side PCB 10, the filter device 12, and the secondary side PCB 20 may be implemented as one PCB, or may be implemented as separate PCBs and connected to each other. The primary side PCB 10 and the secondary side PCB 20 may be implemented as at least two PCB layers.

[0040] The transformer 30 may include a primary side winding 31 and a secondary side winding 32. In the transformer 30, the primary side winding 31 and the secondary side winding 32 may be electrically insulated from each other. To describe the electrical connection between the transformer 30 and the primary side PCB 10 and between the transformer 30 and the secondary side PCB 20, Figure 1 each region of the primary side winding 31 and the secondary side winding 32 provided in the transformer 30 is also schematically shown. The primary side winding 31 and the secondary side winding 32 may actually be implemented in various ways different from Figure 1 that shown.

[0041] The primary - side PCB 10 may include two connection terminals T1 and T2 electrically connected to one end and the other end of the primary - side winding 31. The two connection terminals T1 and T2 may be electrically connected to other components through two corresponding through - holes in the primary - side PCB 10. The primary - side PCB 10 may include two input terminals connected to a low - voltage power supply. For example, the two output terminals of a 12V auxiliary power supply provided in a vehicle may be electrically connected to the two input terminals.

[0042] The secondary - side PCB 20 may include two connection terminals T3 and T4 electrically connected to one end and the other end of the secondary - side winding 32. The two connection terminals T3 and T4 may be electrically connected to other components through two corresponding through - holes in the secondary - side PCB 20. The secondary - side PCB 20 may supply voltage to another circuit operating in a high - voltage region. For example, the voltage required for a battery management system to measure the voltage of a battery pack may be supplied to the battery management system through the secondary - side PCB 20. The voltage required for the battery management system to measure the insulation resistance of the battery pack may be supplied to the battery management system through the secondary - side PCB 20.

[0043] The filter device 12 may be disposed between the primary - side PCB 10 and the secondary - side PCB 20 in a first direction ( Figure 1 the x - axis direction in []) and may be disposed relative to the transformer 30 in a second direction ( Figure 1 the - z - axis direction in []). The filter device 12 may include a plurality of metal plates formed in the yz - direction and arranged between the primary - side PCB 10 and the secondary - side PCB 20 in the first direction. The filter device 12 and the transformer 30 may be electrically insulated by an insulator or may be electrically insulated from each other by being spatially separated from each other. As Figure 1 shown, the transformer 30 may be disposed to face the upper surface of the filter device 12.

[0044] Figure 1 It is shown that the filter device 12 and the primary - side PCB 10 are in contact with each other. However, the filter device 12 and the primary - side PCB 10 may be insulated from each other because the filter device 12 may include an insulating material at the surface where the filter device 12 and the primary - side PCB 10 are in contact. Similarly, Figure 1 It is shown that the filter device 12 and the secondary - side PCB 20 are in contact with each other. However, the filter device 12 and the secondary - side PCB 20 may be insulated from each other because the filter device 12 may include an insulating material at the surface where the filter device 12 and the secondary - side PCB 20 are in contact.

[0045] Figure 2 is a circuit diagram of a power supply device.

[0046] Figure 2The power supply device shown can be implemented as a flyback converter suitable for the embodiments.

[0047] The power supply device 100 may include a primary side winding 101, a secondary side winding 102, a switching circuit 103, a switching control circuit 104, a rectifying diode 105, an output capacitor 106, and a feedback circuit 107.

[0048] One end of the primary side winding 101 may be connected to the input terminal IN1, and the other end of the primary side winding 102 may be connected to one end of the switching circuit 103. The switching circuit 103 may include a plurality of power transistors. The plurality of power transistors may be n-channel transistors and may be connected in parallel with each other. The other end of the primary side winding 102 may be connected to the drain of the switching circuit 103. The other end of the switching circuit 103 may be connected to the input terminal IN2. The input power may be connected between the two input terminals IN1 and IN2. For example, a 12V auxiliary battery of a vehicle may have a positive electrode connected to the input terminal IN1 and a negative electrode connected to the input terminal IN2.

[0049] The secondary side winding 102 may have one end connected to the anode of the rectifying diode 105 and the other end connected to the secondary side output terminal OUT2. The cathode of the rectifying diode 105 may be connected to the secondary side output terminal OUT1, and the output capacitor 106 may be connected between the secondary side output terminal OUT1 and the secondary side output terminal OUT2 to filter the ripple of the output voltage VOUT and smooth the output voltage VOUT.

[0050] The feedback circuit 107 may generate a feedback voltage VF based on the output voltage VOUT and provide it to the switching control circuit 104. The feedback circuit 107 may include an isolation coupler, such as an optocoupler, which is electrically connected to each of the isolated primary side and secondary side.

[0051] The switching control circuit 104 may generate a gate signal VG for controlling the duty cycle of the switching circuit 103 based on the feedback voltage VF. The switching circuit 103 may be turned on when the gate signal VG is at the on level and turned off when the gate signal VG is at the off level. When, as the load increases, the feedback voltage VF increases due to a decrease in the output voltage VOUT, the switching control circuit 104 may increase the conduction duty cycle of the gate signal VG. Then the power provided from the primary side to the secondary side may be increased. Conversely, when, as the load decreases, the feedback voltage VF decreases due to an increase in the output voltage VOUT, the switching control circuit 104 may decrease the conduction duty cycle of the gate signal VG. Then the power provided from the primary side to the secondary side may be decreased. In this way, the switching control circuit 104 can adjust the output voltage VOUT.

[0052] Set atFigure 2 The primary-side configurations of the primary-side winding 101, switching circuit 103, switching control circuit 104, and feedback circuit 107 in the power supply device 100 shown in Figure 1 can be implemented in the primary-side PCB 10 shown in Figure 2 The secondary-side configurations of the secondary-side winding 101, rectifying diodes 105, output capacitors 106, and feedback circuit 107 in the power supply device 100 shown in Figure 1 can be implemented in the secondary-side PCB 20 shown in

[0053] Figure 3 is a diagram showing a conventional primary-side printed circuit board (PCB) and a conventional secondary-side PCB.

[0054] As Figure 3 shown, the primary-side PCB 41 and the secondary-side PCB 42 include four metal layers 411 to 414 and three FR4 layers 421 to 423 disposed between two metal layers. An insulating region 43 including only the FR4 layers 421 to 423 can be provided between the primary-side PCB 41 and the secondary-side PCB 42.

[0055] Figure 4 is an analog diagram showing the capacitance between a conventional primary-side PCB and a secondary-side PCB.

[0056] In Figure 4 the diagram shown, the horizontal axis indicates the signal frequency generated between the primary-side PCB 41 and the secondary-side PCB 42, and the vertical axis indicates the capacitance between the primary-side PCB and the secondary-side PCB, and its unit is "femtofarad (fF)". As Figure 4 shown, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary-side PCB and the secondary-side PCB can be 12.74 to 13.40 [fF].

[0057] Figure 5 is a diagram showing a primary-side PCB, a filter device, and a secondary-side PCB according to an embodiment.

[0058] Figure 5 shows the connection relationship between the primary-side PCB 10 and the filter device 12, the connection relationship between the secondary-side PCB 20 and the filter device 12, and the configuration of the filter device 12.

[0059] The filter device 12 may include a plurality of metal plates 501, 502, 511, and 512, two connection electrodes 521 and 522, and a plurality of insulating layers 531 and 532.

[0060] The primary - side PCB 10 and the secondary - side PCB 20 may include four metal layers and layers of FR4 disposed between two adjacent metal layers. The primary - side PCB 10 may be electrically connected to the filter device 12 via the connection electrode 521. For example, the ground of the primary - side PCB 10 may be connected to the connection electrode 521. The secondary - side PCB 20 may be electrically connected to the filter device 12 via the connection electrode 522. For example, the ground of the secondary - side PCB 20 may be connected to the connection electrode 522.

[0061] A plurality of metal plates 501, 502, 511, and 512 may be formed in Figure 3 a plurality of through - holes formed in the insulating region 43 shown. The plurality of metal plates 501, 502, 511, and 512 may extend along the yz - plane and be arranged along the x - axis. The plurality of metal plates 501, 502, 511, and 512 may have some (e.g., 501 and 502) connected to the connection electrode 521 and others (e.g., 511 and 512) connected to the connection electrode 522. The plurality of metal plates connected to the connection electrode 521 and the plurality of metal plates connected to the connection electrode 522 may be alternately arranged, and an insulating layer may be provided between adjacent metal plates. For example, the plurality of metal plates 501, 511, 502, and 512 may be sequentially arranged, and an insulating layer (e.g., 531 or 532) may be provided between two adjacent metal plates (e.g., 501 and 511 or 511 and 502). In this way, a capacitance can be formed between the primary - side PCB 10 and the secondary - side PCB 20.

[0062] Figure 6 is a simulation diagram showing the capacitance between the primary - side PCB and the secondary - side PCB according to an embodiment.

[0063] In Figure 6 the figure shown, the horizontal axis indicates the signal frequency generated between the primary - side PCB 10 and the secondary - side PCB 20, and the vertical axis indicates the capacitance between the primary - side PCB 10 and the secondary - side PCB 20, and its unit is "picofarad (pF)". As Figure 6 shown, in the frequency range of 100KHz to 1GHz, the capacitance between the primary - side PCB and the secondary - side PCB may be 23.50 to 25.54 [pF]. Figure 6 shows that a capacitance can be provided that is 2000 times or more larger than Figure 4 the conventional capacitance shown.

[0064] The shape and configuration of the filter device are not limited to the foregoing embodiments and may be variously modified.

[0065] Figure 7 is a diagram showing the primary - side PCB, the filter device, and the secondary - side PCB according to another embodiment.

[0066] Figure 7 Shows the connection relationship between the primary - side PCB 10 and the filter device 13, the connection relationship between the secondary - side PCB 20 and the filter device 13, and the configuration of the filter device 13. Figure 7 The illustrated embodiment shows a filter device 13 that includes a smaller number of metal plates compared to Figure 5 the filter device 12 shown.

[0067] The filter device 13 may include a plurality of metal plates 701, 702, 711, and 712, two connection electrodes 721 and 722, and a plurality of insulating layers 731 and 732.

[0068] The primary - side PCB 10 and the secondary - side PCB 20 may include four metal layers and FR4 layers disposed between two adjacent metal layers. The primary - side PCB 10 may be electrically connected to the filter device 13 via the connection electrode 721. For example, the ground of the primary - side PCB 10 may be connected to the connection electrode 721. The secondary - side PCB 20 may be electrically connected to the filter device 13 via the connection electrode 722. For example, the ground of the secondary - side PCB 20 may be connected to the connection electrode 722.

[0069] The plurality of metal plates 701, 702, 711, and 712 may be formed in Figure 3 a plurality of through - holes formed in the illustrated insulating region 43. The plurality of metal plates 701, 702, 711, and 712 may extend along the yz - plane and be arranged along the x - axis. Some of the plurality of metal plates 701, 702, 711, and 712 (e.g., 701 and 702) may be connected to the connection electrode 721, and others (e.g., 711 and 712) may be connected to the connection electrode 522. Insulating layers (e.g., 731 or 732) may be disposed between two adjacent metal plates (e.g., 701 and 702 or 711 and 712). In this way, a capacitance can be formed between the primary - side PCB 10 and the secondary - side PCB 20.

[0070] Figure 8 Is an analog diagram showing the capacitance between the primary - side PCB and the secondary - side PCB according to an embodiment.

[0071] In Figure 8 the illustrated figure, the horizontal axis indicates the signal frequency generated between the primary - side PCB 10 and the secondary - side PCB 20, and the vertical axis indicates the capacitance between the primary - side PCB 10 and the secondary - side PCB 20, and its unit is "femto - farad (fF)". As Figure 8As shown, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary-side PCB and the secondary-side PCB can be 136.98 to 137.11 [fF]. Figure 8 shows a capacitance that can provide a capacitance 10 times or more greater than Figure 4 the conventional capacitance shown.

[0072] Figure 9 is a diagram showing a primary-side PCB, a filter device, and a secondary-side PCB according to another embodiment.

[0073] Figure 9 shows the connection relationship between the primary-side PCB 10 and the filter device 14, the connection relationship between the secondary-side PCB 20 and the filter device 14, and the configuration of the filter device 14. Figure 9 The filter device 14 shown has an insulating layer, and its shape is different from Figure 5 the shape of the filter device 13 shown. In Figure 9 it, the same reference numerals as in Figure 7 can be used to represent the same configuration, and its description is omitted below.

[0074] The filter device 14 may include a plurality of metal plates 701, 702, 711, and 712, two connection electrodes 721 and 722, and a plurality of insulating layers 731, 732, and 901. The insulating layer 901 may also be made of FR4.

[0075] The insulating layer 901 can be implemented as a layer provided between the metal plate 703, which is the farthest from the primary-side PCB 10 among the plurality of metal plates 701 to 703 connected to the connection electrode 721, and the metal plate 713, which is the farthest from the secondary-side PCB 20 among the plurality of metal plates 711 to 713 connected to the connection electrode 722. In this way, a capacitance can be formed between the primary-side PCB 10 and the secondary-side PCB 20.

[0076] Figure 10 is a simulation diagram showing the capacitance between the primary-side PCB and the secondary-side PCB according to an embodiment.

[0077] In Figure 10 the diagram shown, the horizontal axis indicates the signal frequency generated between the primary-side PCB 10 and the secondary-side PCB 20, the vertical axis indicates the capacitance between the primary-side PCB 10 and the secondary-side PCB 20, and its unit is "femtofarad (fF)". As Figure 10 shown, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary-side PCB and the secondary-side PCB can be 207 to 219 [fF]. Figure 10 shows a capacitance that can provide a capacitance 10 times or more greater than Figure 4a capacitor that is 15 times or more larger than the conventional capacitor shown.

[0078] In this way, the filter devices 12, 13, or 14 can filter the EMC noise that appears in the power supply device by providing the capacitance between the primary side and the secondary side of the transformer 30. The filter devices 12, 13, or 14 can be arranged between the primary side PCB 10 and the secondary side PCB 20 while being insulated, and thus filter the EMC noise while maintaining the insulation between the low-voltage area and the high-voltage area of the power supply device.

[0079] Hereinafter, the specification describes a method of forming a metal plate in a filter device.

[0080] Figure 11 is a schematic diagram showing a filter device according to an embodiment.

[0081] For ease of description, in Figure 11 the multiple metal plates 301 to 308 formed in the filter device 12 can be transparently shown. The filter device 12 may include multiple metal plates 301 to 308. As Figure 11 shown, each of the multiple metal plates 301 to 308 can be formed to extend in the yz plane direction. Figure 11 shows that the multiple metal plates 301 to 308 are eight plates, and the present disclosure is not limited thereto. In the filter device 12, the parts other than the multiple metal plates 301 to 308 can be implemented as insulating materials. For example, the filter device 12 may include multiple metal plates 301 to 308 arranged at regular intervals in a PCB. Therefore, in the filtering device 12, the parts other than the multiple metal plates 301 to 308 can be made of insulating materials. That is, an insulating layer can be provided between two adjacent metal plates among the multiple metal plates 301 to 308. Specifically, the PCB can be implemented as FR4, which is a glass fiber-reinforced epoxy laminate.

[0082] Figure 12 and Figure 13 are diagrams each showing a method for forming multiple metal plates according to an embodiment.

[0083] Figure 12 and Figure 13 show cross-sectional views taken along the line a-a' of Figure 12 during the process of forming the multiple metal plates 301 to 308.

[0084] As Figure 12 shown, it can be achieved by starting from the upper surface 410 of the FR4 PCB in the vertical direction (-z axis direction) (corresponding to Figure 11On the upper surface 310), drill holes or use lasers to form a plurality of through holes 401 to 408 in which a plurality of metal plates 301 to 308 will be formed. The plurality of through holes 401 to 408 can be formed in the yz direction and arranged at regular intervals in the first direction (x-axis direction).

[0085] As Figure 13 shown, each of the through holes 401 to 408 can be filled with metal by a through-hole filling technique. Then, a plurality of metal plates 301 to 308 can be formed in the plurality of through holes 401 to 408.

[0086] Figure 12 And Figure 13 are examples of methods for forming a plurality of metal plates 301 to 308, and the present disclosure is not limited thereto. There can be various ways to provide a space such as a plurality of through holes in a PCB where a plurality of metal plates can be provided. Additionally, there can be various ways to fill the space with metal.

[0087] As Figure 11 shown, an insulating layer can be provided between the plurality of metal plates 301 to 308, and the filter device 12 can thus provide a predetermined capacitance. For example, a capacitance can be formed between two adjacent metal plates among the plurality of metal plates 301 to 308. As a result, a plurality of capacitances can be formed between the plurality of metal plates 301 to 308, and a total capacitance synthesized from the plurality of capacitances can be provided.

[0088] Can be used Figure 12 And 13 The methods shown in Figure 7 And Figure 9 to implement the filter devices 13 and 14 of the embodiments in

[0089] Figure 14 is a diagram showing a battery system including a power supply device according to an embodiment.

[0090] The auxiliary battery 60 can supply power at a constant voltage to the power supply device 51. Two output terminals of the auxiliary battery 60 can be connected to two input terminals IN1 and IN2 of the power supply device 51. The auxiliary battery 60 can be provided in a vehicle in which the battery system 50 is installed.

[0091] The battery system 50 can include a power supply device 51, a battery management system (BMS) 52, and a battery pack 53.

[0092] The power supply device 51 can be implemented according to the above embodiment. The power supply device 51 can convert the power supplied from the auxiliary battery 60 and supply it to the BMS 53.

[0093] The battery pack 53 can include a plurality of battery cells CE1 to CEn. Figure 5It shows that a plurality of battery cells CE1 to CEn are connected in series between two output terminals P+ and P- of the battery pack 53. However, the plurality of battery cells CE1 to CEn may be connected in parallel and / or in series with each other.

[0094] The BMS 52 can be operated using the power supplied from the power supply device 51. The BMS 52 can monitor the battery pack 53 and control the charging and discharging of the battery pack 53. The BMS 52 can measure the individual voltage of each of the plurality of battery cells CE1 to CEn, measure the current flowing through the battery pack 53, and measure the temperature of the battery pack 53. The BMS 52 can control the charging and discharging of the battery pack 53 based on the measured values and detect abnormalities to thereby control the protection operation of the battery pack 53.

[0095] Although the embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited thereto, and may include various modifications and changes made by those skilled in the art using the basic concepts of the present disclosure defined in the claims.

Claims

1. A power supply device, comprising: Primary side PCB; A secondary-side PCB, wherein the secondary-side PCB is insulated from the primary-side PCB; a filter device, the filter device comprising a plurality of metal plates disposed between the primary side PCB and the secondary side PCB; as well as A transformer is provided on the filter device and includes a primary side winding connected to the primary side PCB and a secondary side winding connected to the secondary side PCB.

2. The device according to claim 1, wherein The filter device further includes a PCB, and a plurality of insulating layers of the PCB are disposed between the plurality of metal plates.

3. The device according to claim 2, wherein Capacitance is provided by the plurality of metal plates and the plurality of insulating layers disposed between the plurality of metal plates.

4. The device according to claim 1, wherein The plurality of metal plates are formed by filling a plurality of through holes extending from a surface of the filter device with metal.

5. The device according to claim 1, wherein The primary side PCB, the filter device, and the secondary side PCB are implemented as one PCB.

6. The device according to claim 1, wherein The plurality of metal plates are arranged at regular intervals.

7. The device according to claim 1, wherein The plurality of metal plates include: a plurality of first metal plates connected to the primary side PCB, and A plurality of second metal plates are connected to the secondary side PCB.

8. The device according to claim 7, wherein The plurality of first metal plates and the plurality of second metal plates are alternately arranged.

9. The device according to claim 7, wherein An insulating region is disposed between the plurality of first metal plates and the plurality of second metal plates.

10. A method for forming a filter device disposed between a primary side PCB and a secondary side PCB, the method comprising: forming a plurality of through holes in one surface of the PCB in a direction perpendicular to the one surface; as well as forming a plurality of metal plates by filling the plurality of through holes with metal, Wherein, the multiple insulating layers of the PCB are arranged between the multiple metal plates.

11. The method according to claim 10, wherein The transformer is arranged to face one surface of the filter device.

12. A battery system comprising: A battery pack, the battery pack comprising a plurality of battery cells; a battery management system that monitors the battery pack and controls charging and discharging of the battery pack; as well as a power supply device, the power supply device supplies power to the battery management system, Wherein, the power supply device comprises: Primary side PCB; A secondary-side PCB, wherein the secondary-side PCB is insulated from the primary-side PCB; a filter device including a plurality of metal plates disposed between the primary side PCB and the secondary side PCB; and A transformer is provided on the filter device and includes a primary side winding connected to the primary side PCB and a secondary side winding connected to the secondary side PCB.

13. The system of claim 12, wherein The filter device further includes the PCB, and a plurality of insulating layers of the PCB are disposed between the plurality of metal plates.

14. The system of claim 13, wherein Capacitance is provided by the plurality of metal plates and the plurality of insulating layers disposed between the plurality of metal plates.

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