Dispensing device for LED die bonder and dispensing method thereof
By designing a dispensing device for LED crystal solidifiers, the crystal solid glue is plasticized into a flat square block using plastic grooves, which solves the problem of crystal solid glue overflow and improves the crystal solidification effect and process efficiency of the LED chip.
Patent Information
- Application Number
- CN202510249412.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2025-06-17
AI Technical Summary
The existing solid crystal coating method is easily spread out into a larger circular area after being pressed, causing the solid crystal coating to overflow the edge of the chip, affecting the solid crystal effect of the LED chip.
A dispensing device for LED crystal fixing machines is designed, including a dispensing table, a glue extrusion assembly and a glue output assembly. The glue-out assembly is arranged oppositely between the dosing valve and the glue-out tube a and b, and combines the plastic groove composed of spliced inclined plates and vertical plates to ensure that the solid crystal glue is molded into a flat square shape after the glue is discharged.
Through the flat square shape of the solid crystal glue after shaping, ensure the close fit between the LED chip and the solid crystal glue, reduce the inclination angle of the LED chip, and maintain the top plane when the solid crystal glue overflows, improving the quality and efficiency of the solid crystal process.
Smart Images
Figure CN120155336A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of dispensing, and in particular, to a dispensing device and a dispensing method for an LED die bonder. Background Art
[0002] Die bonding is a key process in the LED manufacturing process. By bonding the wafer to a specified area of the bracket, it ensures that the LED chip can be firmly fixed on the substrate and form an effective thermal path or electrical path. With the continuous progress of LED technology, the importance of the die bonding process has become increasingly prominent, posing higher requirements for the precise control and uniform distribution of die bonding glue. The die bonding process not only directly affects the performance and lifespan of LED products but also largely determines the production cost and market competitiveness.
[0003] In the existing die bonding process, the common die bonding glue coating method is to dispense the die bonding glue in the form of a sphere or a water droplet on the substrate through an automatic dispensing head. To ensure that the LED chip can firmly adhere to the substrate, a certain downward pressure is usually applied to flatten the die bonding glue into a cylindrical glue layer under the action of pressure. If this downward pressure is not applied, when the LED chip contacts the top surface of the spherical die bonding glue, it will tilt along the spherical surface, and this tilting direction is uncertain, often resulting in the bonding offset of the LED chip and affecting the product quality. In addition, some methods have been used to improve the coating effect of die bonding glue, such as optimizing the glue volume and glue shape by changing the design of the dispensing head, adjusting the dispensing speed and pressure, using different types of die bonding glue, etc. Although these methods can improve the die bonding effect to a certain extent, there are still many problems in actual operation.
[0004] However, the main problem faced by the existing die bonding glue coating methods in practical applications is that the die bonding glue is prone to spread out into a larger circular area after being pressed, which often causes the die bonding glue to overflow the chip edge, especially for square LED chips, this phenomenon is more significant. The overflow of die bonding glue will cause a series of problems, such as the conductive glue overflowing onto the pad resulting in a short circuit, the insulating glue covering the pad resulting in poor soldering, and the die bonding glue overflowing may affect other pads, further causing a short circuit. These problems seriously affect the quality and efficiency of the die bonding process. Summary of the Invention
[0005] To solve the above problems, the present application provides a dispensing device and a dispensing method for an LED die bonder.
[0006] The dispensing device and the dispensing method for an LED die bonder provided by the present application adopt the following technical solutions: A dispensing device for an LED die bonder, comprising a dispensing table, an extrusion assembly and a glue outlet assembly. The glue outlet assembly includes a metering valve and a long glue outlet tube. An outlet is arranged inside the long glue outlet tube. The two oppositely arranged long glue outlet tubes are respectively a long glue outlet tube a and a long glue outlet tube b. The longitudinal sections of the long glue outlet tube a and the long glue outlet tube b are both arranged as wide and flat rectangles. Two short sides of the long glue outlet tube a close to the outlet are fixedly provided with splicing inclined plates a, and two short sides of the long glue outlet tube b close to the outlet are fixedly provided with splicing inclined plates b. The splicing inclined plates a and b are both arranged as right-angled triangular plates, and the splicing inclined plates a and b are symmetrically distributed about the center, and the splicing inclined plates a and b can be spliced to form a rectangular surface; Vertical plates are respectively fixedly arranged at the top of the outlet to form a vertical plate a and a vertical plate b. The vertical plate a, the vertical plate b, the splicing inclined plate a and the splicing inclined plate b jointly form a plastic groove, and the plastic groove is in a rectangular frame shape.
[0007] By adopting the above technical solution, through the setting of the plastic groove, the plastic groove is jointly composed of two splicing inclined plates a and b in the shape of right-angled triangular plates and the vertical plates a and b, so that the plastic groove forms a rectangular frame shape. This setting can, after the glue is dispensed, shape the die bonding glue into a flat square shape by the plastic groove. A plane is formed at the top of the die bonding glue in this form, which provides convenience for the subsequent bonding of the LED chip. When the LED chip contacts the shaped die bonding glue, the top of the plane can ensure that the chip and the die bonding glue are more closely bonded. As the plastic groove disassembles, the die bonding glue evenly overflows to the surrounding, and this process effectively reduces the tilting angle of the LED chip. While the die bonding glue maintains its flat square shape, its top plane is maintained for a period of time, providing a stable foundation for the placement and bonding of the LED chip.
[0008] In a specific feasible embodiment, an outlet cavity is arranged inside the long glue outlet tube. The glue outlet assembly further includes a metering valve, and two metering valves are respectively arranged to communicate with the outlet cavity from the tops of the long glue outlet tube a and the long glue outlet tube b.
[0009] By adopting the above technical solution, the metering valve is used for quantitatively conveying the die bonding glue. After the die bonding glue is conveyed to the outlet cavity through the metering valve, it will be temporarily stored in the outlet cavity.
[0010] In a specific feasible embodiment, the extrusion assembly includes a double-tube extruder, the double-tube extruder is fixedly arranged on the dispensing table, and two independent pipelines are connected below the double-tube extruder to form a glue distribution pipeline, and the two glue distribution pipelines are respectively communicated with the two metering valves.
[0011] By adopting the above technical solution, the double-tube glue extruder can ensure independent glue output for each branch. Each dispensing pipeline is provided with one and is connected to the metering valve. The dispensing pipeline can adapt to the movement of the glue output long tube, improving flexibility.
[0012] In a specific feasible implementation, a notch is formed at the bottom of the dispensing table to form a material feeding port.
[0013] By adopting the above technical solution, the setting of the material feeding port enables the glue output device to adapt to the die bonder, so that the dispensing table does not interfere with the movement path of the substrate.
[0014] In a specific feasible implementation, the glue output assembly further includes an electric slide table. The metering valve and the glue output long tube are both fixedly arranged on the moving table surface of the electric slide table, and one end of the glue output long tube extends outwards.
[0015] By adopting the above technical solution, the setting of the electric slide table enables the glue output long tube to be controlled by a program.
[0016] In a specific feasible implementation, a glue pushing assembly is further arranged at the end of the glue output long tube. The glue pushing assembly includes a glue pushing seat. The glue pushing seat is fixedly arranged at one end of the glue output long tube far away from the glue outlet. A coil is fixedly arranged in the glue pushing seat. The inside of the coil is hollow to form a magnetic hole. A fixed iron core is fixedly arranged at one end of the coil far away from the glue output long tube. A spring is fixedly arranged on the fixed iron core. A moving iron core is fixedly arranged at one end of the spring far away from the fixed iron core.
[0017] In a specific feasible implementation, a push shaft is fixedly arranged at one end of the moving iron core far away from the spring. One end of the push shaft extends into the glue output cavity. A piston is fixedly arranged at one end of the push shaft extending into the glue output cavity.
[0018] By adopting the above technical solution, the setting of the glue pushing assembly is used to push the glue in the glue output cavity out through the glue outlet, so that the glue in the glue output cavity does not stay, ensuring the accuracy of the glue output volume.
[0019] A dispensing method for an LED die bonder includes the following steps: Installation: Install the dispensing table and the electric slide table on the die bonder, set the conveying direction of the conveying device to pass through the material feeding port, and install the two electric slide tables oppositely on both sides of the conveying device; Distance adjustment: Start the electric slide table, drive the glue output long tube to extend, and adjust the distance between the bottom of the glue output long tube and the substrate. The adjustment range of the distance is 0.5 mm - 1.1 mm; Setting: Set the corresponding substrate parameter information in the die bonder, and set the dispensing time and the glue output volume; The substrate supply board transports the substrate to the bottom of the long glue dispensing tube through a transmission device; Glue dispensing: The long glue dispensing tube dispenses glue onto the substrate; Substrate output: The substrate after glue dispensing is transported by the transmission device to the next process for LED die bonding.
[0020] The glue dispensing step further includes the following steps: Glue supply: The dual-tube glue extruder extrudes the die bonding glue through the glue distribution pipeline to the metering valve, and the metering valve supplies glue according to the preset glue output; Positioning: The die bonder drives the electric slide table to extend the long glue dispensing tube a and the long glue dispensing tube b according to the preset information of the substrate; Closing: A plastic glue trough composed of vertical plate a, vertical plate b, splicing inclined plate a and splicing inclined plate b is formed directly above the glue dispensing position of the substrate; Glue output: The metering valve feeds the quantified die bonding glue into the glue output cavity, and the coil is energized to drive the piston to push the die bonding glue out of the glue output cavity; Plastic shaping: The die bonding glue is shaped in the plastic glue trough; Separation: The electric slide table drives the long glue dispensing tube a and the long glue dispensing tube b to separate left and right.
[0021] The shaped die bonding glue is in the shape of a flat square In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the setting of the glue dispensing assembly, the glue dispensing assembly includes a metering valve and a long glue dispensing tube. The long glue dispensing tube adopts two oppositely arranged tube bodies, namely the long glue dispensing tube a and the long glue dispensing tube b. The longitudinal cross-sections of these two tube bodies are set as wide and flat rectangles, and splicing inclined plate a and splicing inclined plate b are fixedly arranged along the short sides of the tube bodies. These splicing inclined plates are all right-angled triangular plates and are symmetrically distributed about the center, and can be spliced to form a rectangular surface. Vertical plate a and vertical plate b are respectively fixed at the top, and together with the splicing inclined plates, they form a plastic glue trough, and the plastic glue trough is in the shape of a rectangular frame. Through this design, the die bonding glue will be shaped into a flat square shape by the plastic glue trough after glue dispensing. A flat surface is formed on the top of the die bonding glue in this form, which facilitates the subsequent bonding of the LED chip. When the LED chip contacts the shaped die bonding glue, the flat top surface can ensure that the chip fits more closely with the die bonding glue. In addition, the setting of the plastic glue trough effectively reduces the inclination angle of the LED chip, so that while the die bonding glue maintains the flat square shape, its top flat surface can be maintained for a period of time, providing a stable basis for the placement and bonding of the LED chip.
[0022] 2. The inside of the glue long tube is provided with a glue outlet cavity. The glue outlet assembly further includes a metering valve. There are two metering valves, which are respectively communicated with the glue outlet cavity from the tops of the glue outlet long tube a and the glue outlet long tube b. Such a design can ensure the metered transportation and storage of the die bonding glue. A glue pushing assembly is also provided at the end of the glue outlet long tube, which includes components such as a glue pushing seat, a coil, a fixed iron core, a spring, and a moving iron core. The function of the glue pushing assembly is to push the glue in the glue outlet cavity out through the glue outlet, ensure the accuracy of the glue output volume, and prevent the glue from staying in the glue outlet cavity. Description of the Drawings
[0023] Figure 1 is the front view of the embodiment of the present application; Figure 2 is the right view of the embodiment of the present application; Figure 3 is the three-dimensional view of the embodiment of the present application; Figure 4 is the structural view of the plastic groove; Figure 5 is the three-dimensional view of the glue outlet assembly; Figure 6 is the cross-sectional view of the glue outlet assembly.
[0024] Description of the reference numerals: 1. Dispensing table; 11. Feeding port; 21. Double-tube glue extruder; 22. Glue distribution pipeline; 31. Glue outlet long tube a; 311. Splicing inclined plate a; 312. Vertical plate a; 32. Glue outlet; 33. Glue outlet long tube b; 331. Splicing inclined plate b; 332. Vertical plate b; 34. Glue outlet cavity; 35. Plastic groove; 36. Metering valve; 41. Glue pushing seat; 42. Moving iron core; 43. Fixed iron core; 44. Coil; 45. Spring; 46. Pushing shaft; 47. Piston; 5. Electric sliding table. Detailed Embodiment
[0025] The following will be further described in detail with reference to the attached Figures 1-6 drawings to explain the present application in more detail.
[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings. The described embodiments are only possible technical implementations of the present invention, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present invention to obtain other embodiments without creative labor, and these embodiments are also within the protection scope of the present invention.
[0027] The inventors of the present application found that the traditional die bonding glue coating method is likely to cause the die bonding glue to overflow the edge of the chip, affecting the die bonding effect of the LED chip. Therefore, the present application mainly uses the following dispensing device, including a dispensing table, an extrusion assembly, and a glue outlet assembly, achieving the purpose of effectively controlling the amount and shape of the die bonding glue, avoiding the overflow of the die bonding glue, and improving the quality and efficiency of the die bonding process. The following is a further detailed description of the present application.
[0028] An embodiment of the present application discloses a dispensing device for an LED die bonder. Referring to Figures 1-4 , it includes a dispensing table 1, an extrusion assembly, and a glue outlet assembly. The glue outlet assembly includes a metering valve 36 and a glue outlet long tube. A glue outlet 32 is provided inside the glue outlet long tube. Two opposing glue outlet long tubes are respectively the glue outlet long tube a 31 and the glue outlet long tube b 33. The glue outlet long tube a 31 and the glue outlet long tube b 33 have a certain length to ensure sufficient length redundancy. In order to make the die bonding glue easier to separate from the glue outlet long tube after dispensing and minimize adhesion as much as possible when separating. The longitudinal cross-sections of the glue outlet long tube a 31 and the glue outlet long tube b 33 are both set as wide and flat rectangles. Two short sides of the glue outlet long tube a 31 close to the glue outlet 32 are fixedly provided with splicing inclined plates a 311, and two short sides of the glue outlet long tube b 33 close to the glue outlet 32 are fixedly provided with splicing inclined plates b 331. The splicing inclined plates a 311 and the splicing inclined plates b 331 are both set as right-angled triangular plates. The splicing inclined plates a 311 and the splicing inclined plates b 331 are made of aluminum alloy thin plates, making them lightweight and strong in rigidity. The splicing inclined plates a 311 and the splicing inclined plates b 331 are symmetrically distributed about the center. The splicing inclined plates a 311 and the splicing inclined plates b 331 can be spliced to form a rectangular surface. In the embodiment of the present application, the splicing inclined plates a 311 and the splicing inclined plates b 331 have an inclined surface angle of 45 degrees to ensure that the spliced rectangular surface is flatter. When the inclined splicing inclined plates are spliced to form a rectangular surface or separated from each other, a greater cutting force can be generated using the inclined angle, reducing the damage to the self-tension of the die bonding glue. Thus, when the splicing inclined plates a 311 and the splicing inclined plates b 331 are separated from each other, the influence on the shaped die bonding glue can be minimized as much as possible.
[0029] In order to prevent the die bonding glue from overflowing from the top of the glue outlet long tube after dispensing, vertical plates are respectively fixedly provided at the top of the glue outlet 32 to form vertical plate a 312 and vertical plate b 332. The vertical plate a 312, the vertical plate b 332, the splicing inclined plates a 311, and the splicing inclined plates b 331 jointly form a plastic groove 35. The plastic groove 35 is in a rectangular frame shape. Due to the formation of the plastic groove 35 being in a rectangular frame shape, the inner wall of the plastic groove 35 forms four straight surfaces. When the die bonding glue is squeezed into the plastic groove 35, since the four directions of the die bonding glue are shaped into straight surfaces by the four surfaces of the plastic groove 35, the top of the die bonding glue must also be a horizontal plane. Thus, the die bonding glue can be shaped into a rectangular block shape in the plastic groove 35.
[0030] The glue extrusion assembly includes a dual-tube glue extruder 21, which is fixedly arranged on the dispensing table 1. A notch is formed at the bottom of the dispensing table 1 to form a material feeding port 11. Two independent pipelines are connected below the dual-tube glue extruder 21 to form a glue dispensing pipeline 22. An glue outlet cavity 34 is arranged inside the glue outlet long tube. The glue extrusion assembly further includes a metering valve 36. The two glue dispensing pipelines 22 are respectively communicated with the two metering valves 36. The metering valve 36 is provided with two, which are respectively communicated with the glue outlet cavity 34 from the tops of the glue outlet long tube a31 and the glue outlet long tube b33. The glue outlet cavity 34 is used for temporarily storing die bonding glue. The length of the glue outlet cavity 34 determines the amount of glue dispensed each time. The metering valve 36 sends a fixed amount of die bonding glue into the glue outlet cavity 34 according to the preset amount of glue dispensed in advance.
[0031] Refer to Figure 4 、 Figure 5 and Figure 6 As shown in, the glue extrusion assembly further includes an electric slide table 5. The metering valve 36 and the glue outlet long tube are fixedly arranged on the moving table surface of the electric slide table 5. One end of the glue outlet long tube extends outwards. The electric slide table 5 controls the glue dispensing moment of the glue outlet long tube. When dispensing glue, the glue outlet long tube is driven to extend out, so that the glue outlet long tube a31 and the glue outlet long tube b33 are close to form a plastic groove 35.
[0032] A glue pushing assembly is further arranged at the end of the glue outlet long tube. The glue pushing assembly includes a glue pushing seat 41, which is fixedly arranged at one end of the glue outlet long tube away from the glue outlet 32. A coil 44 is fixedly arranged inside the glue pushing seat 41. The inside of the coil 44 is hollow to form a magnetic hole. A fixed iron core 43 is fixedly arranged at one end of the coil 44 away from the glue outlet long pipeline. A spring 45 is fixedly arranged on the fixed iron core 43. A moving iron core 42 is fixedly arranged at one end of the spring 45 away from the fixed iron core 43. When the coil 44 is energized, it can generate magnetic force. One end of the moving iron core 42 away from the spring 45 is fixedly provided with a push shaft 46. One end of the push shaft 46 extends into the glue outlet cavity 34. A piston 47 is fixedly arranged at one end of the push shaft 46 extending into the glue outlet cavity 34. The moving iron core 42 is adsorbed towards the direction of the fixed iron core 43 by the magnetic force of the coil 44. When the coil 44 is powered off, the moving iron core 42 pops out under the elastic force of the spring 45, so that the piston 47 can push out the die bonding glue in the glue outlet cavity 34. When the spring 45 rebounds the moving iron core 42 to the end closest to the glue outlet cavity 34, the end face of the piston 47 close to the plastic groove 35 is flush with the end face of the glue outlet long tube, blocking the glue outlet 32 and forming a plane. This setting can extrude all the die bonding glue and shape the die bonding glue in the plastic groove 35 through the plane formed with the glue outlet 32.
[0033] A dispensing method for an LED die bonder includes the following steps: Installation: Install the dispensing table 1 and the electric slide table 5 on the die bonder, set the conveying direction of the conveying device to pass through the material feeding port 11, and install the two electric slide tables 5 oppositely on both sides of the conveying device; Adjust the distance. Start the electric slide table 5 to drive the glue outlet long tube to extend, and adjust the distance between the bottom of the glue outlet long tube and the substrate. The adjustment range of the distance is 0.5 mm - 1.1 mm. Adjust the glue outlet long tube to keep a certain distance from the substrate. Firstly, it is convenient for the substrate to move, enabling the substrate to be easily moved to the dispensing position and removed after dispensing. At the same time, the distance between the substrate and the glue outlet long tube should not be too large, otherwise the die bonding glue will overflow. Since the fluidity of the die bonding glue is poor, controlling the adjustment range within 0.5 mm - 1.1 mm can effectively ensure the movement of the substrate and prevent the die bonding glue from overflowing.
[0034] Set. Set the corresponding substrate parameter information in the die bonder, and set the dispensing time and the amount of glue discharged. Supply the substrate. Transfer the substrate to the bottom of the glue outlet long tube through the transmission device. Dispense glue. The glue outlet long tube dispenses glue on the substrate. Remove the substrate. Convey the substrate with dispensing completed to the next process for LED die bonding through the transmission device.
[0035] The dispensing step further includes the following steps: Supply glue. The double-tube glue extruder 21 extrudes the die bonding glue through the glue distribution pipeline 22 to the metering valve 36, and the metering valve 36 supplies glue according to the preset amount of glue discharged. When the metering valve 36 discharges glue quantitatively, it is necessary to ensure that the amount of glue discharged from the glue outlet long tube a31 and the glue outlet long tube b33 is the same.
[0036] Positioning. The die bonder drives the electric slide table 5 to extend the glue outlet long tube a31 and the glue outlet long tube b33 according to the preset information of the substrate. Closing. A plastic groove 35 composed of a vertical plate a312, a vertical plate b332, a splicing inclined plate a311, and a splicing inclined plate b331 is formed directly above the dispensing position of the substrate. Discharge glue. The metering valve 36 feeds the quantitatively die bonding glue into the glue outlet cavity 34, and the coil 44 is energized to drive the piston 47 to push the die bonding glue out of the glue outlet cavity 34. Plastic. The die bonding glue is shaped in the plastic groove 35. Separation. The electric slide table 5 drives the glue outlet long tube a31 and the glue outlet long tube b33 to separate left and right.
[0037] The shape of the die bonding glue after shaping is a flat square. The flat square shape is the optimal embodiment of the present invention. Generally speaking, as long as the top of the die bonding glue can form a plane after being shaped, it can meet the bonding effect of the LED chip. After the plastic groove 35 is disassembled, the die bonding glue in the shape of a flat square will overflow around, but the top will still remain approximately flat. This provides a certain amount of time for the placement of the LED chip, enabling the LED chip to better bond with the die bonding glue, thereby reducing the tilt angle of the LED chip. The best embodiment of this application is that the LED chip is completely parallel to the substrate.
[0038] The implementation principle of the embodiment of this application is as follows: By using the dispensing device, the die bonding glue is shaped into a flat square shape under the action of the plastic groove 35 after dispensing, so that a plane is formed on the top of the die bonding glue. When the LED chip contacts the die bonding glue, it can better bond with the die bonding glue. After the plastic groove 35 is disassembled, the die bonding glue overflows evenly around, reducing the tilt angle of the LED chip. Through the dispensing method, an automated and high-precision dispensing process can be achieved, avoiding the influence of human factors on the dispensing effect. The specific operations and parameter settings of each step can be adjusted according to actual needs to ensure the efficiency and reliability of the dispensing process. Through the above design, this embodiment further improves the quality and efficiency of the die bonding process, and is particularly suitable for the die bonding process of LEDs in large-scale production.
[0039] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. A dispensing device for an LED die-bonding machine, characterized in that: The invention comprises a glue dispensing station (1), a glue squeezing component and a glue discharging component, wherein the glue discharging component comprises a quantitative valve (36) and a long glue discharging tube, wherein a glue discharging port (32) is arranged in the long glue discharging tube, and the long glue discharging tube is provided with two opposite long glue discharging tubes, namely a long glue discharging tube a (31) and a long glue discharging tube b (33), wherein the longitudinal cross-sections of the long glue discharging tube a (31) and the long glue discharging tube b (33) are both arranged in a wide and flat rectangular shape, and the two short portions of the long glue discharging tube a (31) near the glue discharging port (32) are A splicing inclined plate a (311) is fixedly provided on one side, and a splicing inclined plate b (331) is fixedly provided on two short sides of the glue outlet long tube b (33) close to the glue outlet (32), and the splicing inclined plate a (311) and the splicing inclined plate b (331) are both configured as right-angled triangle plates, and the splicing inclined plate a (311) and the splicing inclined plate b (331) are centrally symmetrically distributed, and the splicing inclined plate a (311) and the splicing inclined plate b (331) can be spliced to form a rectangular surface; Vertical plates are fixedly arranged on the top of the glue outlet (32) to form a vertical plate a (312) and a vertical plate b (332). The vertical plate a (312), the vertical plate b (332), the splicing inclined plate a (311) and the splicing inclined plate b (331) are spliced together to form a plastic groove (35). The plastic groove (35) is in the shape of a rectangular frame.
2. The glue dispensing device for an LED die bonding machine according to claim 1, characterized in that: A glue outlet cavity (34) is arranged inside the glue outlet long tube, and the glue outlet assembly further comprises a quantitative valve (36). The quantitative valve (36) is provided with two valves connected to the glue outlet cavity (34) from the top of the glue outlet long tube a (31) and the top of the glue outlet long tube b (33), respectively.
3. The glue dispensing device for an LED die bonding machine according to claim 2, characterized in that: The glue extrusion assembly comprises a double-tube glue extruder (21), the double-tube glue extruder (21) is fixedly arranged on the glue dispensing platform (1), two independent pipelines are connected below the double-tube glue extruder (21) to form a glue dispensing pipeline (22), and the two glue dispensing pipelines (22) are respectively connected to the two quantitative valves (36).
4. The glue dispensing device for an LED die bonding machine according to claim 1, characterized in that: A notch is provided at the bottom of the glue dispensing platform (1) to form a material outlet (11).
5. The glue dispensing device for LED die bonding machine according to claim 1, characterized in that: The glue discharging assembly further comprises an electric slide (5), the dosing valve (36) and the long glue discharging tube are both fixedly arranged on a movable table surface of the electric slide (5), and one end of the long glue discharging tube extends outward.
6. The glue dispensing device for LED die bonding machine according to claim 2, characterized in that: A rubber pushing assembly is also provided at the end of the long rubber outlet pipe, and the rubber pushing assembly includes a rubber pushing seat (41). The rubber pushing seat (41) is fixedly provided at one end of the long rubber outlet pipe away from the rubber outlet port (32). A coil (44) is fixedly provided inside the rubber pushing seat (41). The interior of the coil (44) is hollow to form a magnetic hole. A fixed iron core (43) is fixedly provided at one end of the coil (44) away from the long rubber outlet pipe. A spring (45) is fixedly provided on the fixed iron core (43). A moving iron core (42) is fixedly provided at one end of the spring (45) away from the fixed iron core (43).
7. The glue dispensing device for an LED die bonding machine according to claim 6, characterized in that: A push shaft (46) is fixedly provided at one end of the moving iron core (42) away from the spring (45), one end of the push shaft (46) extends into the glue outlet cavity (34), and a piston (47) is fixedly provided at one end of the push shaft (46) extending into the glue outlet cavity (34).
8. A dispensing method for LED die bonding machine, characterized in that: The dispensing device for an LED die-bonding machine according to any one of claims 1 to 7 comprises the following steps: Installation: installing the dispensing table (1) and the electric slide table (5) on the crystal bonding machine, setting the transmission direction of the transmission device to pass through the material feeding port (11), and installing the two electric slide tables (5) opposite to each other on both sides of the transmission device; Adjust the distance, start the electric slide (5), drive the long glue discharging tube to extend, and adjust the distance between the bottom of the long glue discharging tube and the base plate. The adjustment range of the distance is 0.5mm-1.1mm; Setting: set the corresponding substrate parameter information in the die bonder, set the dispensing time and glue output; Supplying the substrate, transferring the substrate to the bottom of the long glue discharging tube through a transfer device; Glue dispensing: dispensing glue on the substrate with a long glue tube; After the board is removed, the glue-dispensed substrate is transported to the next process for LED die bonding through a transmission device.
9. The dispensing method for LED die bonding machine according to claim 8, characterized in that: The dispensing step also includes the following steps: Supplying glue, the double-tube glue squeezer (21) squeezes the solid crystal glue through the glue distribution pipeline (22) to the quantitative valve (36), and the quantitative valve (36) supplies glue according to the preset glue output amount; Positioning, the die bonding machine drives the electric slide (5) to extend the glue outlet long tube a (31) and the glue outlet long tube b (33) according to the preset information of the substrate; Closed, a plastic groove (35) composed of the vertical plate a (312), the vertical plate b (332), the splicing inclined plate a (311) and the splicing inclined plate b (331) is formed just above the glue dispensing position of the substrate; When discharging glue, the quantitative valve (36) passes a quantitative amount of the solid crystal glue into the glue discharging chamber (34), and the coil (44) is energized to drive the piston (47) to push the solid crystal glue out of the glue discharging chamber (34); Plastic, the solid crystal glue is shaped in the plastic groove (35); Separation: the electric slide (5) drives the long glue outlet tube a (31) and the long glue outlet tube b (33) to separate left and right.
10. The dispensing method for LED die bonding machine according to claim 9, characterized in that: The shape of the shaped die-bonding adhesive is a flat square.