A method for processing double-sided adhesive tape products with narrow adhesive strips
By employing a multi-stage die-cutting and composite structural layer processing method, the problem of material shortage during the die-cutting process of double-sided adhesive products was solved, achieving high-precision narrow adhesive strip formation, reducing the defect rate, and improving the quality of finished products.
Patent Information
- Application Number
- CN202311682155.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-08
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2043-12-08
AI Technical Summary
Existing double-sided tape products are prone to material shortages during the die-cutting process, resulting in a high scrap rate for finished products, especially in the processing of small-sized parts.
The process employs multiple die-cutting and composite structural layers, with multiple feeding and receiving components working together to precisely control the cutting and waste disposal of the double-sided tape. This includes the design of the cutting edge of the multiple die-cutting components to ensure the precise formation of narrow adhesive strips.
It significantly reduced the defect rate of finished products to within 3%, reduced scrap due to material shortages, and improved processing accuracy and finished product quality.