Imprint equipment and process control method for preparing etching mask by adopting imprint equipment

Abstract

The embodiment of the invention provides imprinting equipment and a process control method for preparing an etching mask by adopting the imprinting equipment, and the process control method comprises the steps: controlling an imprinting roller to horizontally move from a direction close to a first side frame to a direction far away from the first side frame and always contact a rigid transparent substrate in the process of executing demolding operation, a demolding executing mechanism is controlled to drive the first side frame to ascend, and the current pressure of the rigid transparent substrate acting on the impressing roller is monitored; and formulating a first speed adjustment strategy according to the current pressure, and executing the first speed adjustment strategy. The first speed adjusting strategy is used for enabling the subsequent pressed pressure of the impressing roller to be within a preset demolding pressure range, and the preset demolding pressure range is a pressure range determined when the distance between the impressing roller and the demolding separation line is smaller than a set distance. According to the scheme, the distance between the impressing roller and the demolding separation line is smaller than the set distance, and smooth demolding is better achieved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor manufacturing processes, and particularly to an imprinting device and a process control method for preparing an etching mask using the imprinting device. Background Art

[0002] To reduce production costs, an imprinting method is used to fabricate an etching mask on a wafer during the manufacturing process of some semiconductor devices. Specifically, a patterned soft film is used to imprint a substrate coated with photoresist, and then the photoresist covering the soft film and passively patterned is exposed and cured. Finally, the patterned soft film and the cured photoresist are demolded and peeled off.

[0003] In the prior art, the imprinting device for implementing the foregoing imprinting method includes a template fixture, a demolding actuator, and an imprinting roller. The patterned soft film is carried by a light-transmitting film with good elasticity, and the light-transmitting film is tensionally mounted on the template fixture. During the demolding operation using the imprinting device, the demolding actuator controls the template fixture to tilt and rise to achieve demolding. Since the transparent film can deform flexibly to ensure the demolding pressure, the foregoing demolding process can be smoothly performed. However, precisely because both the light-transmitting film and the patterned soft film have good elastic deformation characteristics, the etching mask formed by the foregoing imprinting process has poor shape reducibility of the pattern on the patterned soft film and cannot meet the preparation requirements of some semiconductor devices.

[0004] To further improve the ability of the photoresist layer to restore the shape of the pattern on the patterned soft film, related technologies have proposed a solution for preparing an etching mask using an imprinting device by preparing the soft film on a rigid transparent substrate with high stiffness but certain deformation characteristics. However, during the demolding operation using the imprinting device, the movement coordination between the imprinting roller and the demolding actuator is unreasonable, and problems such as abnormal demolding or cracking of the rigid transparent substrate may occur. The foregoing problems require machine maintenance, resulting in interruption of continuous production and instead increasing the overall production operation cost. Summary of the Invention

[0005] In a first aspect, an embodiment of the present disclosure provides a process control method for preparing an etching mask using an imprinting device. The imprinting device includes a template fixture, an imprinting roller, and a demolding actuator. The template fixture is used to carry a rigid transparent substrate with an imprinting pattern on its surface. The demolding actuator is used to drive the first side frame of the template fixture to rise during the demolding operation to achieve inclined demolding. The process control method includes: During the demolding operation, controlling the imprinting roller to horizontally move from near the first side frame to away from the first side frame and always contact the rigid transparent substrate, controlling the demolding actuator to drive the first side frame to rise, and monitoring the current pressure exerted by the rigid transparent substrate on the imprinting roller; Formulate a first speed adjustment strategy based on the current pressure and execute the first speed adjustment strategy; The first speed adjustment strategy includes adjusting the horizontal movement speed of the imprinting roller and / or the vertical movement speed of the first side frame; the first speed adjustment strategy is used to keep the subsequent pressure on the imprinting roller within a preset demolding pressure range, and the preset demolding pressure range is the pressure range determined when the distance between the imprinting roller and the demolding separation line is less than a set distance.

[0006] Optionally, formulating a first speed adjustment strategy based on the current pressure includes: When the current pressure is less than the lower limit of the preset demolding pressure range, reduce the horizontal movement speed of the imprinting roller and / or increase the vertical movement speed of the first side frame.

[0007] Optionally, when reducing the horizontal movement speed of the imprinting roller, the method further includes: Determine whether the horizontal movement speed has dropped to zero; When the horizontal movement speed drops to zero, count the first statistical duration during which the horizontal movement speed continuously remains zero; When the first statistical duration exceeds a preset duration, generate an alarm prompt message.

[0008] Optionally, formulating a first speed adjustment strategy based on the current pressure includes: When the current pressure is greater than the upper limit of the preset demolding pressure range, reduce the vertical movement speed of the first side frame and / or increase the horizontal movement speed of the imprinting roller.

[0009] Optionally, when reducing the vertical movement speed of the first side frame, the method further includes: Determine whether the vertical movement speed has dropped to zero; When the vertical movement speed drops to zero, count the second statistical duration during which the vertical movement speed continuously remains zero; When the second statistical duration exceeds a preset duration, generate an alarm prompt message.

[0010] Optionally, when the current pressure is within the preset demolding pressure range, keep the horizontal movement speed of the imprinting roller and the vertical movement speed of the first side frame unchanged, or synchronously increase the vertical movement speed of the imprinting roller and the vertical movement speed of the first side frame.

[0011] Optionally, it further includes: during the demolding operation, monitoring the horizontal distance between the imprinting contact line of the imprinting roller and the vertical plane where the side of the rigid transparent substrate near the first side frame is located, and monitoring the vertical movement distance of the side of the rigid transparent substrate near the first side frame; Formulate a second speed adjustment strategy according to the horizontal distance, the vertical movement distance, the horizontal movement speed of the imprinting roller, and the vertical movement speed; the second speed adjustment strategy includes adjusting the horizontal movement speed of the imprinting roller and / or the vertical movement speed of the first side frame; the second speed adjustment strategy is used to ensure that the included angle between the plane of the demolded area of the rigid transparent substrate and the plane of the non-demolded area is less than the maximum allowable angle, and the maximum allowable angle is the maximum bendable angle that ensures that the rigid transparent substrate does not undergo plastic deformation; Determine a comprehensive adjustment strategy according to the first speed adjustment strategy and the second speed adjustment strategy; the comprehensive adjustment strategy is a strategy that simultaneously makes the subsequent pressing pressure of the imprinting roller within the preset demolding pressure range and ensures that the included angle between the plane of the demolded area of the rigid transparent substrate and the plane of the non-demolded area is less than the maximum allowable angle Implementing the first speed adjustment strategy includes: implementing the comprehensive adjustment strategy.

[0012] Optionally, it further includes: during the imprinting operation, after the imprinting roller presses the rigid transparent substrate to a preset imprinting depth, maintaining the imprinting pressure within the preset imprinting pressure range and moving from one side of the rigid transparent substrate to the other side.

[0013] Optionally, it further includes: during the imprinting operation, maintaining the photoresist for forming the etching mask within the imprinting temperature range, and the imprinting temperature range is the temperature range that enables the photoresist to maintain the fluidity required for forming the imprint pattern.

[0014] In a second aspect, an embodiment of the present disclosure provides an imprinting device for preparing a wafer etching mask, including a template fixture, an imprinting roller, a demolding execution mechanism, and a controller, as well as a pressure sensor for detecting the pressing pressure of the imprinting roller and a sensor for monitoring the motion states of the imprinting roller and the demolding execution mechanism; the controller adopts the process control method for preparing an etching mask using the imprinting device as described above to achieve process control during the preparation process of the etching mask.

[0015] In an embodiment of the present disclosure, the pressure range detected when the imprinting roller and the demolding separation line are less than a preset distance is used as the preset demolding pressure range, the relationship between the current pressure and the preset demolding pressure range is judged, and a first speed adjustment strategy is formulated according to the foregoing relationship, so that the subsequent pressing pressure of the imprinting roller is as much as possible within the preset demolding pressure range, and the distance between the imprinting roller and the demolding separation line is less than the set distance, so as to better achieve smooth demolding. Brief Description of the Drawings

[0016] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0017] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or in the prior art, the following briefly introduces the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where: Figure 1 is a partial flowchart of the process control method provided by an embodiment of the present disclosure; Figure 2 is a schematic diagram of the relative positions of the imprinting roller and the demolding separation line in one case during the demolding process; Figure 3 is a relative schematic diagram of the imprinting roller and the demolding separation line in another case during the demolding process; Figure 4 is a partial flowchart of the process control method provided by an embodiment of the present disclosure. Detailed Description of the Embodiments

[0018] The embodiments of the present disclosure will be described in more detail below with reference to the drawings. Although some embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not used to limit the protection scope of the present disclosure.

[0019] The term "including" and its variants used herein are open-ended, that is, "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts such as "first" and "second" mentioned in the present disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence relationship of the functions performed by these devices, modules or units.

[0020] In order to improve the successful demolding efficiency during the preparation process of a highly restored etching mask by using an imprinting process with a rigid transparent substrate as a soft film carrier, an embodiment of the present disclosure provides a process control method for preparing an etching mask using an imprinting device.

[0021] To better understand the process control method provided by the embodiments of the present disclosure, a simple analysis of the structure of the imprinting device is first made.

[0022] Similar to existing imprinting devices, the imprinting device adopted in the embodiments of the present disclosure includes a wafer carrier platform, a lifting mechanism, a fixture base, a template fixture, an exposure mechanism, an imprinting mechanism, and a demolding execution mechanism.

[0023] The wafer carrier platform is used to carry the wafer on whose surface an etching mask needs to be prepared; the lifting mechanism is used to lift the fixture base and / or the exposure mechanism, so as to leave a reasonable operating space for loading and unloading the wafer on the wafer carrier platform.

[0024] Both the template fixture and the demolding execution mechanism are installed on the fixture base. The template fixture is installed on the fixture base in a laterally positioned and movably connected manner. The aforementioned rigid transparent substrate is installed on the template fixture. In some applications, the edge of the rigid transparent substrate is fixed on the fixture base. In some other embodiments, the rigid transparent substrate is adhesively fixed on a light-transmitting film with a softer material, and then the light-transmitting film is fixed on the fixture base; in this case, when the rigid transparent substrate is installed on the fixture base, the deformation of the light-transmitting film can be used to adapt to the conflict between the rigid structures of the rigid transparent substrate and the fixture base, avoiding the deformation of the rigid transparent substrate due to the conflict between the two rigidities.

[0025] The demolding execution mechanism is installed on the lower side of the template fixture. Before the demolding operation is performed, the demolding execution mechanism will not lift the template fixture, and the corresponding template fixture is installed on the fixture base in a horizontally placed manner; during the demolding operation, the demolding execution mechanism will lift the first side frame of the template fixture, causing the first side frame to rise and rotate around the second side frame opposite to the first side frame, realizing the inclined demolding of the rigid transparent substrate.

[0026] The imprinting mechanism is installed on the upper side of the template fixture and includes an imprinting roller. The imprinting roller is used to abut against the rigid transparent substrate to realize the imprinting operation and the demolding operation in the solution of this embodiment.

[0027] The exposure mechanism is used to expose the photoresist formed by passive imprinting before the imprinting process is completed and the demolding process is executed, so that the photoresist is cured.

[0028] In addition, to implement the aforementioned process control method, necessary sensors also need to be set. The sensors include a pressure sensor arranged on the imprinting mechanism for detecting the pressure between the imprinting roller and the rigid transparent substrate, and other sensors for realizing the moving speeds of the imprinting roller and the first side frame of the template fixture. Among them, the other sensors can be inertial sensors or displacement sensors that can calculate the speed and determine the displacement through displacement monitoring.

[0029] In order to implement the process control in the embodiments of the present disclosure, the power devices for controlling the imprint roller and the demolding actuator in the imprinting mechanism should be devices with speed-adjustable capabilities.

[0030] Figure 1 It is a partial flowchart of the process control method provided by the embodiments of the present disclosure. Figure 1 The shown partial flowchart demonstrates the process control method during the demolding operation. As Figure 1 shown, the process control method during the execution of the demolding operation includes S110 - S120.

[0031] S110: Control the imprint roller to horizontally move away from the first side frame while always contacting the rigid transparent substrate, control the demolding actuator to drive the first side frame to rise, and monitor the current pressure exerted by the rigid transparent substrate on the imprint roller.

[0032] Before the demolding operation starts, the imprint roller has moved to the side of the rigid transparent substrate close to the first side frame of the template fixture and abuts against the rigid transparent substrate. After the demolding operation starts, the controller controls the imprint roller and the demolding actuator to perform specific actions respectively to achieve the demolding separation of the rigid transparent substrate and the cured etching mask (possibly including the wafer): (1) Control the imprint roller to horizontally move away from the first side frame while keeping in contact with the rigid transparent substrate; (2) Control the demolding actuator to drive the first side frame of the template fixture to rotate and rise.

[0033] In addition, during the operation of controlling the horizontal movement of the imprint roller, instead of controlling the imprint roller to actively apply pressure to the rigid transparent substrate, the imprint roller is made to passively bear the pressure generated by the rigid transparent substrate. Of course, if the moving speed of the imprint roller is not coordinated with the rising speed of the first side frame driven by the demolding actuator, and the rigid roller moves too slowly, it can also be understood that the aforementioned pressure is caused by the imprint roller.

[0034] During the execution of the aforementioned operations, the pressure sensor detects the current pressure exerted by the rigid transparent substrate on the imprint roller during the demolding process.

[0035] S120: Formulate a first speed adjustment strategy based on the current pressure and execute the first speed adjustment strategy.

[0036] In the embodiments of the present disclosure, the first speed adjustment strategy is a strategy for adjusting the moving speeds of the imprint roller and the first side frame, so as to achieve as correct demolding as possible of the subsequent rigid transparent substrate and the photo-cured etching mask. The first speed adjustment strategy includes a sub-strategy for adjusting the horizontal moving speed of the imprint roller, a sub-strategy for adjusting the vertical moving speed of the first side frame, and a combination of the aforementioned two strategies.

[0037] In the embodiments of the present disclosure, the first speed adjustment strategy is used to make the subsequent pressing pressure of the imprinting roller fall within a preset demolding pressure range. The preset demolding pressure range is pre-determined and is the pressure range determined when the distance between the imprinting roller and the demolding separation line is less than a set distance interval.

[0038] Figure 2 It is a schematic diagram of the relative position of the imprinting roller and the demolding separation line in a case of the demolding process; Figure 3 It is a relative schematic diagram of the imprinting roller and the demolding separation line in another case during the demolding process.

[0039] As Figure 2 shown, in some cases, due to the relatively small horizontal movement speed of the imprinting roller (it may also be because the vertical movement speed of the first side frame is relatively large), the contact line between the imprinting roller and the rigid transparent substrate is located between the demolding separation line and the demolding actuator. In this case, due to the demolding operation, the pressure exerted by the rigid transparent substrate on the imprinting roller is relatively large.

[0040] As Figure 3 shown, in some other cases, due to the relatively large horizontal movement speed of the imprinting roller (it may also be because the vertical movement speed of the first side frame is relatively small), the demolding separation line is located between the contact line between the imprinting roller and the rigid transparent substrate and the demolding actuator. In this case, since the rigid transparent substrate in contact with the imprinting roller does not deform due to separation from the etching mask, the pressure exerted by the rigid transparent substrate on the imprinting roller is relatively small.

[0041] In the foregoing Figure 2 case, since the imprinting roller restricts the movement of the demolding separation line between the rigid transparent substrate and the etching mask, the normal demolding of the rigid transparent substrate will be restricted in this case. And in Figure 3 the case shown, since the imprinting roller is not pressed against the vicinity of the demolding separation line, the peeling force generated by the operation of the demolding actuator needs to overcome the bonding force between the relatively large area of the etching mask and the rigid transparent substrate to achieve demolding. That is, in Figure 2 and Figure 3 both cases, the rigid transparent substrate and the etching mask cannot achieve good demolding.

[0042] Combining Figure 2 and Figure 3 , if the distance between the contact line between the imprinting roller and the rigid transparent substrate and the demolding separation line is relatively close (ideally, the contact line between the imprinting roller and the rigid transparent substrate is directly above the demolding separation line), the imprinting roller abuts against the rigid transparent substrate, so that the peeling force generated by the demolding actuator is exactly applied to a relatively small area near the demolding separation line, and the imprinting roller does not hinder the demolding process. And the pressure received by the imprinting roller at this time (that is, the current pressure) is less than the pressure received in the case shown in Figure 1 and greater than that in the foregoingFigure 3 The pressure under the shown circumstances.

[0043] Based on the foregoing considerations, in the embodiments of the present disclosure, the pressure range detected when the imprinting roller and the demolding separation line are less than a preset distance is used as the preset demolding pressure range, the relationship between the current pressure and the preset demolding pressure range is judged, and a first speed adjustment strategy is formulated according to the foregoing relationship, so that the subsequent pressure on the imprinting roller is as much as possible within the preset demolding pressure range, and further the distance between the imprinting roller and the demolding separation line is less than the set distance, so as to better achieve smooth demolding.

[0044] In specific implementation, formulating the first speed adjustment strategy according to the current pressure needs to be determined according to the current pressure and the situation of the preset demolding pressure range. Specifically, it includes the following three situations.

[0045] The first situation: the current pressure is less than the lower limit of the preset demolding pressure range, that is Figure 3 The pressure situation under the shown state. In this case, it is necessary to make the imprinting roller wait for the demolding separation line to approach itself. The corresponding control strategies can be: (1) reducing the horizontal movement speed of the imprinting roller; (2) increasing the vertical movement speed of the first side frame, that is, increasing the rising execution speed of the demolding execution mechanism; (3) reducing the horizontal movement speed of the imprinting roller and at the same time increasing the vertical movement speed of the first side frame. In specific implementation, considering that single control can achieve better control effect, so it is preferably to adopt the foregoing (1) or (2) two control strategies.

[0046] The second situation: the current pressure is greater than the preset demolding pressure range, that is Figure 2 The pressure situation under the shown state. In this case, the corresponding control strategies can be: (1) increasing the horizontal movement speed of the imprinting roller; (2) reducing the vertical movement speed of the first side frame, that is, reducing the rising execution speed of the demolding execution mechanism; (3) increasing the horizontal movement speed of the imprinting roller and at the same time reducing the vertical movement speed of the first side frame. In specific implementation, considering that single control can achieve better control effect, so it is also preferably to adopt the foregoing (1) or (2) two control strategies.

[0047] In practical applications, the template fixture is mostly directly pressed on the fixture table by gravity, and is positioned and placed for sensing through a vertical positioning pin, without vertical limit. Due to the limitations of the existing wafer processing technology, the wafers coated with etching masks are all circular sheet wafers. During the demolding operation, the demolding separation line first gradually increases, and then gradually decreases after reaching the maximum value. In practical applications, if the moving speed of the first side frame is kept constant while the horizontal moving speed of the imprinting roller is increased, when the demolding separation line increases to the maximum value and then gradually decreases, there may be a sudden increase in the peeling force. In the case of a sudden increase in the peeling force, since the template fixture has no vertical positioning limit, the peeling force may lift the template fixture, causing the template fixture to bounce and disengage from the vertical positioning pin, and not return to the correct position. At this time, the vertical positioning pin cannot detect the template fixture and assumes that there is no template fixture placed in the imprinting device. By the method of reducing the vertical moving speed of the first side frame described above (2), it is also possible to avoid the problem that the imprinting template bounces and disengages from the vertical positioning pin due to the too fast vertical moving speed of the first side frame.

[0048] The third case: The current pressure is within the preset demolding pressure range. In this case, the horizontal moving speed of the imprinting roller and the vertical moving speed of the first side frame are coordinated with each other, and the following operations can be performed: (1) Keep the horizontal moving speed of the imprinting roller and the vertical moving speed of the first side frame unchanged; (2) Synchronously increase the vertical moving speed and the horizontal moving speed of the imprinting roller. In specific implementation, (1) can be performed when one of the horizontal moving speed of the imprinting roller or the vertical moving speed of the first side frame has reached the maximum feasible speed, and (2) can be performed when neither the horizontal moving speed of the imprinting roller nor the vertical moving speed of the first side frame has reached the maximum feasible speed, so as to improve the time-consuming of a single imprinting operation of the imprinting device as much as possible.

[0049] In practical applications, when the horizontal moving speed of the imprinting roller is reduced, an extreme situation may occur where the horizontal moving speed of the imprinting roller is reduced to zero, but the probability of this extreme situation occurring is relatively small, mostly caused by a malfunction during the demolding process of the imprinting device. Since the imprinting device normally performs operations automatically, manual intervention is required to eliminate the malfunction in the case of a device malfunction.

[0050] Correspondingly, in order to identify the malfunction of the imprinting device during the demolding process through the horizontal moving speed of the imprinting roller, when the horizontal moving speed of the imprinting roller is reduced as described above, the process control method may further include the following S130 - S150.

[0051] S130: Determine whether the horizontal moving speed is reduced to zero; if so, execute S140; if not, end the execution.

[0052] S140: Statistically calculate the first statistical duration during which the horizontal movement speed continuously remains at zero value.

[0053] S150: Generate an alarm prompt message when the first statistical duration exceeds a preset duration.

[0054] In specific implementation, if the horizontal movement speed of the imprinting roller remains at zero value for a long time, according to the aforementioned logical analysis, it can be inferred that the demolding separation line between the rigid transparent substrate and the etching layer has not moved. And this situation is not normal. Based on this, when it is determined that the horizontal movement speed remains at zero value for more than the preset duration, an alarm prompt message for prompting the machine platform management personnel to intervene manually is generated.

[0055] Similar to the analysis above, when reducing the vertical movement speed of the first side frame, an extreme situation may occur where the vertical movement speed of the first side frame drops to zero value. Similarly, the probability of this extreme situation occurring is also very small, and most likely it is also caused by a malfunction during the demolding process of the imprinting equipment. Correspondingly, in order to identify the malfunction of the imprinting equipment during the demolding process through the vertical movement speed of the first side frame, when performing the operation of reducing the vertical movement speed of the first side frame in the previous text, the process control method may further include the following S160 - S180.

[0056] S160: Determine whether the vertical movement speed has dropped to zero value; if so, execute S170; if not, end the execution.

[0057] S170: Statistically calculate the second statistical duration during which the vertical movement speed continuously remains at zero value.

[0058] S180: Generate an alarm prompt message when the second statistical duration exceeds the preset duration.

[0059] In specific implementation, if the vertical movement speed of the imprinting roller remains at zero value for a long time, according to the aforementioned logical analysis, it can be deduced that the imprinting roller has been pressing against the separated part of the rigid transparent substrate and is at a position far from the demolding separation line. And this situation is not normal. Based on this, when it is determined that the vertical movement speed remains at zero value for more than the preset duration, an alarm prompt message for prompting the machine platform management personnel to intervene manually is generated.

[0060] As analyzed above, because the rigidity of the rigid transparent substrate is relatively high, if the rigid transparent substrate deforms too much during the demolding operation, it may cause plastic deformation, resulting in inability to return to the original state or fragmentation, and further causing the imprinting soft film provided on it to be scrapped. Figure 4 It is a partial flowchart of the process control method provided by the embodiments of the present disclosure. As Figure 4 shown, some embodiments of the present disclosure also execute the following S210 - S230 during the demolding operation.

[0061] S210: Monitor the horizontal distance between the imprinting contact line of the imprinting roller and the vertical plane where the side of the rigid transparent substrate near the first side frame is located, and monitor the vertical movement distance of the side of the rigid transparent substrate near the first side frame.

[0062] S220: Formulate a second speed adjustment strategy based on the horizontal distance, vertical movement distance, horizontal movement speed of the imprinting roller, and vertical movement speed of the first side frame.

[0063] Take Figure 2 as an example. Point A in the figure represents the imprinting contact line of the imprinting roller (here it is assumed to be close to the demolding separation line, and its position is the position where the demolding analysis line is located), and point B represents the side of the rigid transparent substrate near the first side frame. The corresponding horizontal distance is the distance between points A and C in the figure, and the vertical movement distance is the distance between points B and C. Since the straight line where AC is located is parallel to the unpeeled part of the rigid transparent substrate, the angle between AC and AB is the angle representing the deformation angle of the rigid transparent substrate. The aforementioned angle will change dynamically with the horizontal movement speed of the imprinting roller and the vertical movement speed of the first side frame.

[0064] Through preliminary verification, it is found that if the rigid transparent substrate is bent to a certain maximum angle, it will undergo plastic deformation and cannot return to its initial shape, and accordingly cannot be used for subsequent imprinting. The aforementioned certain maximum angle is set as the maximum allowable angle.

[0065] Formulate a second speed control strategy based on the horizontal distance, vertical movement distance, horizontal movement speed and vertical movement speed of the imprinting roller to ensure that the angle between the plane where the demolded area of the rigid lens substrate is located and the plane where the non-demolded area is located is less than the maximum allowable angle. That is, the purpose of adopting the second speed adjustment strategy is to always keep the angle between AC and AB less than the maximum allowable angle.

[0066] After determining the second adjustment strategy, then execute S230.

[0067] S230: Determine a comprehensive adjustment strategy based on the first speed adjustment strategy and the second speed adjustment strategy.

[0068] The comprehensive adjustment strategy is a strategy that simultaneously makes the subsequent pressing pressure of the imprinting roller within the preset demolding pressure range and ensures that the angle between the plane where the demolded area of the rigid transparent substrate is located and the plane where the non-demolded area is located is less than the maximum allowable angle. In specific implementation, a strategy that simultaneously meets the aforementioned requirements in the first speed adjustment strategy and the second speed adjustment strategy can be retrieved as the comprehensive adjustment strategy.

[0069] In the case of executing the aforementioned S210 - S230, the specific implementation of the first speed adjustment strategy in S120 is to execute the comprehensive adjustment strategy.

[0070] The process control method during the demolding process was analyzed in the previous text. In addition, the process control method also ensures the control method during the imprinting process to form an imprint. Specifically, it includes S310 as follows.

[0071] S310: During the execution of the imprinting operation, after controlling the imprinting roller to press down the rigid transparent substrate to a preset imprinting depth, maintain the imprinting pressure within a preset imprinting pressure range, and move from one side of the rigid transparent substrate to the other side.

[0072] In a specific implementation, first, place the wafer to be prepared with an etching mask on the wafer carrier platform and coat a photocurable adhesive. Subsequently, control the fixture base and the template fixture to move downward so that the rigid transparent substrate abuts against the wafer coated with the photocurable adhesive. Then, control the imprinting roller to abut against the rigid transparent substrate to a preset imprinting depth, maintain the imprinting pressure within a preset imprinting pressure range, and move from one side of the rigid transparent substrate with a gradual change to the other side to achieve the imprinting of the rigid transparent substrate, thereby enabling the photocurable adhesive to fill into the pattern hollow areas on the rigid transparent substrate.

[0073] In a specific implementation, in order to ensure that the photoresist is within a reasonable imprinting fluidity range, that is, it will not be unable to fill the image hollow area due to excessive fluidity, nor will it be unable to be correctly imprinted with a pattern due to insufficient fluidity. During the execution of the aforementioned S310, the following S320 will also be executed.

[0074] S320: Keep the photoresist used to form the etching mask within the imprinting temperature range.

[0075] In a specific implementation, the imprinting temperature range is the temperature range that enables the photoresist to maintain a reasonable imprinting fluidity required for forming an imprint pattern. The imprinting temperature range is determined according to the type and performance parameters of the photoresist used.

[0076] After completing the control of the aforementioned S310 - S320, subsequently, the exposure mechanism can be controlled to perform an exposure operation according to reasonable exposure process parameters to achieve the curing of the photoresist. After the photoresist is cured, the process control method for the demolding operation as described above can be executed to achieve the demolding and peeling of the rigid transparent substrate and the photoresist.

[0077] In addition to providing the aforementioned process control method, the embodiments of the present disclosure also provide an imprinting device for implementing the aforementioned process control method. The imprinting device, in addition to including the aforementioned execution hardware, that is, in addition to including a template fixture, an imprinting roller, a demolding execution mechanism, a pressure sensor for detecting the pressure on the imprinting roller, and a sensor for monitoring the motion states of the imprinting roller and the demolding execution mechanism, further includes a controller; the controller adopts the aforementioned process control method to achieve the process control during the preparation of the etching mask.

[0078] In a specific application, for a photolithography mask product with a specific thickness, the ideal pressure range during the imprinting process is [P1, P2], the temperature range is [T1, T2], and the imprinting depth is D; the ideal pressure range during demolding is [P3, P4], the warning pressure range during demolding is [P5, P6], the temperature range is [T3, T4], and the demolding waiting time is S1.

[0079] During the imprinting process, the imprinting device executes S310 and S320 in the foregoing according to the foregoing ideal pressure range and temperature range to implement the imprinting operation, and exposes for S1 time after the imprinting is completed. During the demolding process, the actions of the imprinting roller and the demolding actuator are controlled, and the actual pressure received by the imprinting roller is monitored. When the actual pressure is less than P3 but greater than P5, the horizontal movement speed of the imprinting roller is controlled to decrease; when the actual pressure is between P3 and P4, the horizontal movement speed of the imprinting roller and the vertical movement speed of the demolding actuator are gradually increased until the maximum allowable demolding operation speed is reached; when the actual pressure is greater than P5 and less than P6, the vertical movement speed of the demolding actuator is decreased. According to the foregoing method, during the demolding operation, if the running speed of either the imprinting roller or the demolding actuator drops to zero and persists for a preset duration, an alarm prompt message is generated.

[0080] It should be noted that the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0081] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A process control method for preparing an etching mask using an imprinting device, characterized in that: The embossing device comprises a template fixture, an embossing roller and a demoulding actuator; the template fixture is used to carry a rigid transparent substrate with an embossed pattern on the surface; the demoulding actuator is used to drive the first side frame of the template fixture to rise during the demoulding operation to achieve inclined demoulding; the process control method comprises: During the demoulding operation, the embossing roller is controlled to move horizontally from close to the first side frame to away from the first side frame and always contact the rigid transparent substrate, the demoulding actuator is controlled to drive the first side frame to rise, and the current pressure of the rigid transparent substrate on the embossing roller is monitored; Formulate a first speed adjustment strategy according to the current pressure, and execute the first speed adjustment strategy; The first speed adjustment strategy includes adjusting the horizontal movement speed of the embossing roller and / or the vertical movement speed of the first side frame; the first speed adjustment strategy is used to make the subsequent pressing pressure of the embossing roller within a preset demolding pressure range, and the preset demolding pressure range is a pressure range determined when the distance between the embossing roller and the demolding separation line is less than a set distance.

2. The process control method according to claim 1, characterized in that: Formulate a first speed adjustment strategy according to the current pressure, including: When the current pressure is less than the lower limit of the preset demoulding pressure range, the horizontal moving speed of the embossing roller is reduced, and / or the vertical moving speed of the first side frame is increased.

3. The process control method according to claim 2, characterized in that: In the case of reducing the horizontal moving speed of the embossing roller, the method further comprises: Determining whether the horizontal moving speed drops to zero; When the horizontal moving speed drops to zero, counting a first statistical time duration during which the horizontal moving speed continues to maintain the zero value; When the first statistical duration exceeds a preset duration, an alarm prompt message is generated.

4. The process control method according to claim 1, characterized in that: Formulate a first speed adjustment strategy according to the current pressure, including: When the current pressure is greater than the upper limit of the preset demoulding pressure range, the vertical moving speed of the first side frame is reduced, and / or the horizontal moving speed of the embossing roller is increased.

5. The process control method according to claim 4, characterized in that: In the case of reducing the vertical moving speed of the first side frame, the method further comprises: Determining whether the vertical moving speed drops to zero; When the vertical moving speed is about to reach a zero value, counting a second statistical time length during which the vertical moving speed continuously maintains a zero value; When the second statistical duration exceeds a preset duration, an alarm prompt message is generated.

6. The process control method according to claim 1, characterized in that: When the current pressure is within the preset demolding pressure range, the horizontal moving speed of the embossing roller and the vertical moving speed of the first side frame are kept unchanged, or the vertical moving speed of the embossing roller and the vertical moving speed of the first side frame are increased synchronously.

7. The process control method according to any one of claims 1 to 6, characterized in that: Also includes: During the demoulding operation, monitoring the horizontal distance between the embossing contact line of the embossing roller and the vertical plane where the side edge of the rigid transparent substrate close to the first side frame is located, and monitoring the vertical movement distance of the side edge of the rigid transparent substrate close to the first side frame; A second speed adjustment strategy is formulated according to the horizontal distance, the vertical moving distance, the horizontal moving speed of the embossing roller and the vertical moving speed; the second speed adjustment strategy includes adjusting the horizontal moving speed of the embossing roller and / or the vertical moving speed of the first side frame; the second speed adjustment strategy is used to ensure that the angle between the plane where the demolded area of ​​the rigid transparent substrate is located and the plane where the undemolded area is located is less than the maximum allowable angle, and the maximum allowable angle is the maximum bendable angle that ensures that the rigid transparent substrate does not undergo plastic deformation; Determine a comprehensive adjustment strategy according to the first speed adjustment strategy and the second speed adjustment strategy; the comprehensive adjustment strategy is a strategy that simultaneously makes the subsequent pressure of the embossing roller within a preset demolding pressure range and ensures that the angle between the plane where the demolded area of ​​the rigid transparent substrate is located and the plane where the undemolded area is located is less than the maximum allowable angle The executing the first speed adjustment strategy includes: executing the comprehensive adjustment strategy.

8. The process control method according to any one of claims 1 to 6, characterized in that: Also includes: During the embossing operation, the embossing roller is controlled to press the rigid transparent substrate to a preset embossing depth, maintain the embossing pressure within a preset embossing pressure range, and move from one side of the rigid transparent substrate to the other side.

9. The process control method according to claim 8, characterized in that: Also includes: During the imprinting operation, the photoresist used to form the etching mask is kept within an imprinting temperature range, which is a temperature interval that allows the photoresist to maintain fluidity required for forming an imprinting pattern.

10. An imprinting device for preparing a wafer etching mask, characterized in that: It includes a template clamp, an embossing roller, a demoulding actuator and a controller, as well as a pressure sensor for detecting the pressure of the embossing roller, and a sensor for monitoring the movement status of the embossing roller and the demoulding actuator; the controller adopts the process control method for preparing an etching mask using an embossing device as described in any one of claims 1 to 9 to realize process control during the preparation of the etching mask.

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