Photosensitive resin composition, insulating cured film and insulating cured film for touch panel obtained by cureing same, and touch panel

Abstract

A photosensitive resin composition containing an alkali-soluble resin (A) and a (meth) acrylic monomer (B), the alkali-soluble resin (A) including a structural unit (a1) having an acid group, a structural unit (a2) having an oxygen-containing ring, and a structural unit (a3) represented by a predetermined chemical formula (a3), the (meth) acrylic monomer (B) having a urethane structure and / or a carboxyl group, and having two or more (meth) acryloyl groups.

Description

Technical Field

[0001] The present invention relates to a photosensitive resin composition and an insulating cured film obtained by curing the composition. For example, it relates to a photosensitive resin composition useful for applications of insulating cured films used in touch panels (such as insulating film applications, protective film applications, flat film applications, etc.), an insulating cured film for touch panels obtained by curing the composition, and a touch panel including the cured film. Background Art

[0002] In recent years, as electronic devices have become increasingly highly functional, diversified, miniaturized, and lightweight, a transparent touch panel is installed in front of display elements such as liquid crystals, and it has become increasingly common to view, select characters, symbols, pictures, etc. displayed on the display element through the transparent touch panel and switch the various functions of the device.

[0003] The detection methods of touch panels include the resistive film method, capacitive method, ultrasonic method, optical method, etc. In recent years, the resistive film method and the capacitive method have been gradually popularized. For example, the resistive film method is composed of a double-sided structure of an upper electrode film and a lower electrode glass, and the method of causing a reaction by pressing a switch by applying pressure with a pen tip or the like on the upper electrode film. In addition, the capacitive method is composed of a protective glass on the surface and a sensor glass, and when a finger touches the glass on the surface, capacitive coupling occurs, resulting in a capacitance difference with the glass inside, and the touched position is determined based on this difference.

[0004] For a capacitive touch panel, for example, a glass with an ITO film is used as the substrate, and an insulating film and a protective film are provided in the laminated structure to prevent misidentification of the touched position. As such a protective film, a protective film formed of high-hardness inorganic SiO2, SiNx, transparent resin, etc., and an organic protective film are used. In addition, touch panels can be classified into an external-mounted (Out-Cell) structure, an on-cell structure, and an in-cell structure according to the installation position when combined with a liquid crystal display device. In recent years, the on-cell structure and the in-cell structure with excellent visibility have gradually become mainstream. These on-cell structures and in-cell structures are to provide a touch panel inside a liquid crystal panel. In addition, as the structure of a touch panel, a double-sided type in which an X electrode is disposed on one side of an insulating film and a Y electrode is disposed on the other side, and a single-sided type in which an X electrode and a Y electrode are formed on the same plane are known.

[0005] As a technology applicable to such a touch panel, for example, a technology related to a cured film using a specific alkali-soluble resin and a photoreactive monomer and having excellent chemical resistance, developability, and wrinkle resistance has been proposed (for example, refer to Patent Document 1).

[0006] Prior Art Documents

[0007] Patent Document

[0008] Patent Document 1: International Publication WO2020 / 251004 Gazette Summary of the Invention

[0009] As described above, in order to form an insulating film used in a touch panel, a liquid crystal display device, etc., a photosensitive resin composition is mostly used. Patterning is sometimes performed on such an insulating film, and in addition, for the purpose of conducting between electrodes, etc., fine through-holes (so-called vias) are sometimes formed. Moreover, after forming the vias, in order to remove foreign substances present on the insulating film, a step of wiping the surface of the insulating film with a non-woven fabric impregnated with alcohol, etc. is sometimes performed, and it is known that scratches are likely to occur on the surface of the insulating film at this time.

[0010] Therefore, an object of the present invention is to solve the above problems and provide a photosensitive resin composition having excellent scratch resistance, an insulating cured film obtained by curing the composition, an insulating cured film for a touch panel, and a touch panel including the cured film.

[0011] The inventors of the present invention conducted in-depth research to solve the above problems. As a result, it was found that by using a composition containing a copolymer having a specific structure and a monomer having a specific structure in a specific ratio, the above problems can be solved, and thus the present invention was completed.

[0012] <1>

[0013] A photosensitive resin composition containing an alkali-soluble resin (A) and a (meth)acrylic monomer (B),

[0014] The above alkali-soluble resin (A) includes: a structural unit (a1) having an acid group, a structural unit (a2) having an oxygen-containing ring, and a structural unit (a3) represented by the following formula (a3),

[0015] The above (meth)acrylic monomer (B) has at least one of a urethane structure and a carboxyl group, and has two or more (meth)acryloyl groups.

[0016]

[0017] (In formula (a3), R 1 represents a hydrogen atom or a methyl group, and R 4 represents at least one selected from linear, branched or cyclic aliphatic hydrocarbon groups having 1 to 20 carbon atoms that may contain an oxygen atom, aromatic groups, and combinations thereof.)

[0018] <2>

[0019] The photosensitive resin composition according to <1> above, further comprising a (meth)acrylic monomer (C), wherein the (meth)acrylic monomer (C) has two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups.

[0020] <3>

[0021] The photosensitive resin composition according to <1> or <2> above, further comprising a photoinitiator.

[0022] <4>

[0023] The photosensitive resin composition according to any one of <1> to <3> above, wherein the weight average molecular weight of the alkali-soluble resin (A) is 3,000 to 20,000.

[0024] <5>

[0025] The photosensitive resin composition according to any one of <1> to <4> above, wherein the acid value of the alkali-soluble resin (A) is 55 mgKOH / g to 130 mgKOH / g.

[0026] <6>

[0027] The photosensitive resin composition according to any one of <1> to <5> above, wherein the glass transition temperature of the alkali-soluble resin (A) is 140 °C or lower.

[0028] <7>

[0029] The photosensitive resin composition according to any one of <1> to <6> above, wherein the content ratios (mol%) of the structural unit (a1), the structural unit (a2), and the structural unit (a3) in the alkali-soluble resin (A) are (a1) / (a2) / (a3) = 10 to 35 / 15 to 50 / 20 to 70.

[0030] <8>

[0031] The photosensitive resin composition according to any one of <1> to <7> above, wherein the (meth)acrylic monomer (B) comprises at least one or more of the compounds represented by the following formula (b1) and the compounds represented by the following formula (b2).

[0032]

[0033] (In formula (b1), R 5Each independently represents a hydrogen atom or a methyl group, A represents an aliphatic hydrocarbon group having 3 to 20 carbon atoms in a straight chain or a branched chain which may contain an oxygen atom, B represents one selected from an aliphatic hydrocarbon group having 1 to 10 carbon atoms in a straight chain or a branched chain which may contain a hetero atom, an aromatic group, and a combination thereof, and m represents 2 to 8.)

[0034]

[0035] (In the formula (b2), R 5 Each independently represents a hydrogen atom or a methyl group, A' each independently represents an aliphatic hydrocarbon group having 1 to 20 carbon atoms in a straight chain or a branched chain which may contain an oxygen atom, B' represents one selected from an aliphatic hydrocarbon group having 1 to 10 carbon atoms in a straight chain or a branched chain which may contain a hetero atom, an aromatic group, and a combination thereof, m1 and m2 each independently represent 1 to 8, and n represents 0 or 1.)

[0036] <9>

[0037] The photosensitive resin composition according to any one of <2> to <8> above, wherein the (meth)acrylic monomer (C) contains a compound represented by the following formula (c1).

[0038]

[0039] (In the formula (c1), R 11 and R 12 Each independently represents a hydrogen atom or a methyl group, Y 1 and Y 2 Each independently represents a single bond, or an aliphatic hydrocarbon group having 1 to 26 carbon atoms in a straight chain or a branched chain which may contain an oxygen atom, X 11 Represents an aliphatic hydrocarbon group or an aromatic group having 6 to 26 carbon atoms having a cyclic skeleton, W 1 and W 2 Each independently represents O, N, or S.)

[0040] <10>

[0041] Use of the photosensitive resin composition according to any one of <1> to <9> above for forming an insulating film.

[0042] <11>

[0043] An insulating cured film obtained by curing the photosensitive resin composition according to any one of <1> to <9> above.

[0044] <12>

[0045] An insulating cured film for a touch panel is obtained by curing the photosensitive resin composition according to any one of the above <1> to <9>.

[0046] <13>

[0047] A touch panel includes the insulating cured film for a touch panel according to the above <12>.

[0048] According to the present invention, it is possible to provide a photosensitive resin composition having excellent scratch resistance, an insulating cured film obtained by curing the composition, an insulating cured film for a touch panel, and a touch panel including the cured film. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a plan view showing the configuration of one mode of the touch panel of the present embodiment.

[0050] Figure 2 is Figure 1 the AA cross-sectional view of.

[0051] Figure 3 It is a schematic view showing the cross-sectional shape of the through hole. DETAILED DESCRIPTION OF THE INVENTION

[0052] Hereinafter, a mode for implementing the present invention (hereinafter, referred to as "the present embodiment") will be described in detail. However, the present invention is not limited thereto, and various modifications can be made without departing from the gist thereof.

[0053] 1. Photosensitive Resin Composition

[0054] The photosensitive resin composition of the present embodiment contains an alkali-soluble resin (A) and a (meth)acrylic monomer (B).

[0055] The alkali-soluble resin (A) includes: a structural unit (a1) having an acid group, a structural unit (a2) having an oxygen-containing ring, and a structural unit (a3) represented by the following formula (a3).

[0056] The (meth)acrylic monomer (B) has at least one of a urethane structure and a carboxyl group, and has two or more (meth)acryloyl groups.

[0057]

[0058] (In the formula (a3), R 1 represents a hydrogen atom or a methyl group, and R 4 represents at least one selected from a linear, branched or cyclic aliphatic hydrocarbon group having 1 to 20 carbon atoms which may contain an oxygen atom, an aromatic group, and a combination thereof.)

[0059] The photosensitive resin composition of the present embodiment has excellent abrasion resistance. The reason is not particularly limited and is considered as follows. It is considered that in the process of wiping the surface of the insulating film with a non-woven fabric impregnated with alcohol or the like, the covalent bond of the resin constituting the insulating film is broken due to the friction between the non-woven fabric and the surface of the insulating film, resulting in scratches on the surface of the insulating film. In contrast, it is considered that the photosensitive resin composition of the present embodiment increases the strength of the insulating film and improves the abrasion resistance by generating hydrogen bonds between monomers, between polymers, or between monomers and polymers, by making the alkali-soluble resin (A) which is a constituent element thereof contain a structural unit having an acid group and making the (meth)acrylic monomer (B) have at least one of a urethane structure and a carboxyl group. And, although the hydrogen bond is weaker than the covalent bond in terms of bond strength, since it can undergo reversible bonding and dissociation, when a frictional force is applied, the hydrogen bond can be formed again after the frictional force is released by stress relaxation of the insulating film, and thus the surface of the insulating film is not easily damaged.

[0060] In addition, even when the photosensitive resin composition of the present embodiment is used as a negative photosensitive resin composition, it can form fine patterns, and in particular, it has excellent through-hole forming properties. The reason is not particularly limited and is considered as follows. Since the photosensitive resin composition of the present embodiment contains the alkali-soluble resin (A) and the (meth)acrylic monomer (B), the developability of the non-latent image portion (non-exposed portion) when forming a through-hole is excellent. In addition, since the alkali-soluble resin (A) and the (meth)acrylic monomer (B) each have a crosslinkable group in their structures, they are firmly bonded by a crosslinking reaction and have high resistance to a developer in the latent image portion (exposed portion). It is presumed that these are one of the reasons for the excellent through-hole forming properties. Presumably for the same reason, it is possible to suppress the shape change (so-called thermal collapse) of the through-hole wall surface due to heat during post-baking after development, and the cross-sectional shape of the hole can be maintained as an inverted trapezoid when observed from the exposure direction.

[0061] In addition, since the alkali-soluble resin (A), the (meth)acrylic monomer (B), etc. are firmly bonded by a crosslinking reaction, etc., the photosensitive resin composition of the present embodiment also has excellent chemical resistance.

[0062] Hereinafter, the photosensitive resin composition of the present embodiment will be described in detail.

[0063] 1.1. Alkali-soluble resin (A)

[0064] The alkali-soluble resin (A) of the present embodiment contains: a structural unit (a1) having an acid group, a structural unit (a2) having an oxygen-containing ring, and a structural unit (a3) represented by the following formula (a3). Hereinafter, each structural unit will be described in detail.

[0065] 1.1.1. Structural unit (a1)

[0066] The structural unit (a1) is a structural unit having an acid group. The above-mentioned acid group is a group that can be a proton donor and is not particularly limited. For example, carboxyl group, acid anhydride group, sulfo group, phosphoric acid group, etc. can be cited. The structural unit (a1) is not particularly limited as long as it is a structural unit containing an acid group, preferably a unit corresponding to an unsaturated carboxylic acid, and more preferably a unit represented by the following formula (a1-1).

[0067]

[0068] (In the structural unit (a1-1), R 1 represents a hydrogen atom or a methyl group, and X 1 represents a single bond or a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms that may contain an oxygen atom.)

[0069] In the structural unit (a1-1), R 1 represents a hydrogen atom or a methyl group, and from the perspective of the heat resistance of the obtained cured product (which means that the shape of the cured product is not easily changed by heat. Hereinafter, it is simply referred to as "heat resistance"), a methyl group is preferred.

[0070] In addition, X 1 represents a single bond or a linear or cyclic aliphatic hydrocarbon group (divalent bonding group) having 1 to 15 carbon atoms that may contain an oxygen atom. From the viewpoint of heat resistance, the number of carbon atoms of the aliphatic hydrocarbon group that may contain an oxygen atom is preferably 1 to 9. These aliphatic hydrocarbon groups may have an -O- structure in the structure (a structure containing an oxygen atom: for example, ether group (-O-), ester group (-CO-O-), acid anhydride group (-CO-O-CO-)). As the linear aliphatic hydrocarbon group, an alkylene group having 1 to 15 carbon atoms, an aliphatic hydrocarbon group having 3 to 15 carbon atoms that may contain a plurality of ester groups or acid anhydride groups (-CO-O-CO-), etc. can be cited. In addition, as the cyclic aliphatic hydrocarbon group, a cycloalkylene group having 3 to 15 carbon atoms, a cycloalkylene group having 3 to 15 carbon atoms that may contain a plurality of ester groups or acid anhydride groups, etc. can be cited. In addition, X 1 can be an aliphatic hydrocarbon group containing both a linear part and a cyclic part. As an example of X 1 having a plurality of ester groups or acid anhydride groups, -CO-O-CH2-CH2-O-CO-CH2-CH2-, -CO-O-CH2-CH2-O-CO-cyclohexyl-, etc. can be cited.

[0071] As the structural unit (a1-1), there is no particular limitation. For example, methacrylic acid (hereinafter sometimes referred to as "MAA"), acrylic acid, crotonic acid (trans), maleic acid (cis), fumaric acid (trans), citraconic acid (cis), mesaconic acid (trans), itaconic acid, maleic anhydride, citraconic anhydride, itaconic anhydride, 2-methacryloyloxyethyl hexahydrophthalate, etc. may be cited. As the preferred structure of the structural unit (a1-1), the structural units corresponding to the following respective compounds may be exemplified.

[0072]

[0073] 1.1.2. Structural unit (a2)

[0074] The structural unit (a2) is a structural unit having an oxygen-containing ring, and preferably a structural unit represented by the following formula (a2-1). It should be noted that the structural unit having an oxygen-containing ring has the same meaning as the structural unit having a cyclic ether structure.

[0075] In the following structural unit (a2-1), R 1 represents a hydrogen atom or a methyl group, and R 3 represents an aliphatic hydrocarbon group having 3 to 15 carbon atoms having a cyclic ether structure and may contain an oxygen atom other than the oxygen atom contained in the cyclic ether structure.

[0076]

[0077] In the structural unit (a2-1), R 1 represents a hydrogen atom or a methyl group, and from the viewpoint of heat resistance, a methyl group is preferred.

[0078] In addition, R 3 represents an aliphatic hydrocarbon group having 3 to 15 carbon atoms having a cyclic ether structure and may contain an oxygen atom other than the oxygen atom contained in the cyclic ether structure.

[0079] Here, from the viewpoint of developability, the number of carbon atoms of the aliphatic hydrocarbon group having a cyclic ether structure is preferably 3 to 7. These aliphatic hydrocarbon groups may have an -O- structure (a structure containing an oxygen atom: for example, an ether group (-O-), an ester group (-CO-O-), an acid anhydride group (-CO-O-CO-)) in a structure other than the cyclic ether structure. As the aliphatic hydrocarbon group having a cyclic ether structure, a group in which a cyclic ether structure is bonded to the end of an alkylene group (for example, a methylene group) may be cited. As the preferred structure of the structural unit (a2), there is no particular limitation. For example, the structural units corresponding to the following respective compounds may be exemplified.

[0080]

[0081] 1.1.3. Structural unit (a3)

[0082] The structural unit (a3) is represented by the following formula (a3).

[0083] By having the structural unit (a3), the alkali-soluble resin (A) makes the photosensitive resin composition of the present embodiment excellent in resistance to the developer.

[0084]

[0085] (In the formula, R 1 represents a hydrogen atom or a methyl group, and R 4 represents at least one selected from linear, branched or cyclic aliphatic hydrocarbon groups having 1 to 20 carbon atoms which may contain an oxygen atom, aromatic groups, and combinations thereof.)

[0086] In the structural unit (a3), R 1 represents a hydrogen atom or a methyl group, and from the viewpoint of heat resistance, a methyl group is preferred.

[0087] In addition, R 4 is a linear, branched or cyclic aliphatic hydrocarbon group having 1 to 20 carbon atoms, an aromatic group, or a combination of the above aliphatic hydrocarbon and aromatic group. Here, from the viewpoints of resistance to the developer and developability, the number of carbon atoms of the above aliphatic hydrocarbon group is preferably 1 to 10. These aliphatic hydrocarbon groups may have a hydroxyl group (-OH group) or an -O- structure (a structure containing an oxygen atom: for example, an ether group (-O-), an ester group (-CO-O-), an acid anhydride group (-CO-O-CO-)) in the structure. Examples of the above linear, branched or cyclic aliphatic hydrocarbon group include linear, branched or cyclic alkyl groups having 1 to 20 carbon atoms, and from the viewpoint of resistance to the developer, methyl, n-propyl, n-butyl, n-hexyl, cyclopentyl, cyclohexyl, isobornyl, tricyclodecyl, and adamantyl are preferred. In addition, examples of the above aromatic group include phenyl, biphenyl, naphthyl, anthracenyl, etc., and from the viewpoint of transparency of the cured product, phenyl is preferred. In addition, examples of the combination of an aliphatic hydrocarbon group having 1 to 20 carbon atoms and an aromatic group include alkoxyphenyl, alkylphenyl, alkoxynaphthyl, alkylnaphthyl, alkoxyanthracenyl, alkylanthracenyl, etc., and from the viewpoint of transparency of the cured product, alkoxyphenyl and alkylphenyl are preferred. Preferred structures of the structural unit (a3) include structural units corresponding to the following respective compounds.

[0088]

[0089] 1.1.4. Other Structural Units

[0090] The alkali-soluble resin (A) may contain other structural units that do not belong to any of the above structural units (a1) to (a3). There is no particular limitation on the other structural units. For example, 1,3-bis(methacryloyloxy)-2-propanol, 2-methacryloyloxyethyl isocyanate, N-cyclohexylmaleimide, etc. can be cited.

[0091] From the viewpoints of resistance to the developer and developability, the content ratio (mol%) of the other structural units in the above alkali-soluble resin (A1) is preferably 0 to 35 mol%, more preferably 0 to 20 mol%.

[0092] 1.1.5. Composition ratio

[0093] From the viewpoints of resistance to the developer and developability, the content ratios (mol%) of the structural unit (a1), the structural unit (a2), and the structural unit (a3) in the alkali-soluble resin (A) are preferably (a1) / (a2) / (a3) = 10 to 35 / 15 to 50 / 20 to 70, more preferably 10 to 30 / 15 to 45 / 30 to 70, and particularly preferably 15 to 30 / 20 to 45 / 30 to 60.

[0094] 1.1.6. Acid value

[0095] The acid value of the alkali-soluble resin (A1) is preferably 55 mgKOH / g to 130 mgKOH / g, preferably 60 mgKOH / g to 120 mgKOH / g, more preferably 65 mgKOH / g to 110 mgKOH / g, and further preferably 70 mgKOH / g to 100 mgKOH / g. If the acid value of the alkali-soluble resin (A) is within the range of 55 mgKOH / g to 130 mgKOH / g, the occurrence of poor development can be suppressed, and the resistance to the developer (e.g., potassium hydroxide) is high, and the tendency of overdevelopment can be suppressed. As the acid value of the alkali-soluble resin, the theoretical solid content acid value can be used and can be calculated as follows.

[0096] Theoretical solid content acid value (mgKOH / g) = [56.1 (molecular weight of potassium hydroxide) × (total amount of acid group-containing structural units in the alkali-soluble resin (A1) [g]) × 1000] / [(total amount of solid components of the alkali-soluble resin (A1) [g]) × (molecular weight of the acid group-containing structural unit)]

[0097] 1.1.7. Molecular weight

[0098] The weight-average molecular weight of the alkali-soluble resin (A1) is not particularly limited, and is preferably 3,000 to 20,000, more preferably 4,000 to 20,000, still more preferably 5,000 to 15,000, and particularly preferably 5,500 to 13,000 from the viewpoint of developability. The molecular weight of the alkali-soluble resin (A) can be measured by gel permeation chromatography (manufactured by TOSOH CORPORATION, model: HLC-8120, column: two connected columns of G-5000HXL and G-3000HXL, detector: RI, mobile phase: tetrahydrofuran), and the value is in terms of polystyrene conversion.

[0099] 1.1.8. Glass transition temperature (Tg)

[0100] The glass transition temperature (hereinafter, also simply referred to as "Tg") of the alkali-soluble resin (A) is not particularly limited, and is preferably 140 °C or lower, more preferably 40 °C to 140 °C, still more preferably 60 °C to 140 °C, still further preferably 70 °C to 130 °C, and particularly preferably 80 °C to 120 °C from the viewpoint of scratch resistance.

[0101] The glass transition temperature of the alkali-soluble resin (A) in the present embodiment is a theoretical value calculated by the following FOX equation from the Tg of the homopolymer of each structural unit constituting the alkali-soluble resin and the ratio of each structural unit.

[0102] FOX equation: 1 / Tg = w1 / Tg1 + w2 / Tg2 + ··· + wn / Tgn

[0103] (Tg: glass transition temperature (K) of the alkali-soluble resin (A), Tg1, Tg2, ··· Tgn: glass transition temperatures (K) of the homopolymers of each structural unit, w1, w2, ··· wn: weight percentages of each structural unit)

[0104] It should be noted that the theoretical glass transition temperature calculated by the above FOX equation is in good agreement with the measured glass transition temperature obtained by differential scanning calorimetry (DSC), dynamic viscoelasticity, etc. Therefore, sometimes when it is difficult to calculate the theoretical value, the glass transition temperature can be measured by a differential scanning calorimeter (DSC) based on JIS.K 6240:2011.

[0105] In addition, the Tg of the monomer represents the Tg of the homopolymer. When the Tg of the monomer can adopt a known literature value (for example, the value described in "Polymer Handbook" (4th edition, John Wiley & Sons, Inc., 1999)), this value is used. In other cases, for example, the monomer is subjected to bulk polymerization to form a homopolymer, and the value obtained by measuring the Tg of the homopolymer is used as the Tg of the monomer.

[0106] 1.1.9. Epoxy equivalent

[0107] From the viewpoint of considering both the resistance to the developer and the developability, the epoxy equivalent of the alkali-soluble resin (A1) is preferably 200 to 1000, more preferably 200 to 800, and particularly preferably 250 to 600. This epoxy equivalent can be determined, for example, according to JIS K7236:2001.

[0108] As specific examples of the alkali-soluble resin (A1), for example, the following polymers can be cited. It should be noted that the numerical values marked in the structural units of each polymer are the molar ratios of the respective structural units in each polymer.

[0109]

[0110] 1.1.10. Content

[0111] The content of the alkali-soluble resin (A) in the photosensitive resin composition of the present embodiment is not particularly limited, and is preferably 35 to 80% by mass, more preferably 40 to 70% by mass, and particularly preferably 45 to 65% by mass with respect to all the solid components in the composition. Throughout this specification, "all solid components" means all components in the resin composition except for the solvent. By making the content of the alkali-soluble resin (A) 35% by mass or more, there is a tendency for the solubility in the developer to increase, and by making the content of the alkali-soluble resin (A) 80% by mass or less, there is a tendency to suppress thermal collapse.

[0112] 1.2. Other polymers

[0113] The photosensitive resin composition of the present embodiment may contain other polymers in addition to the alkali-soluble resin (A). The content of the other polymers in the photosensitive resin composition of the present embodiment is not particularly limited, and from the viewpoint of not significantly impairing the chemical resistance of the cured film, etc. and being able to obtain the effects brought by the other polymers, it is preferably 0 to 30 parts by mass, more preferably 0 to 20 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A).

[0114] 1.3. (Meth)acrylic monomer (B)

[0115] (Meth)acrylic monomer (B) has at least one of a urethane structure and a carboxyl group, and has two or more (meth)acryloyl groups.

[0116] As the (meth)acrylic monomer (B), as long as it has at least one of a urethane structure and a carboxyl group and has two or more (meth)acryloyl groups, it is not particularly limited, and compounds represented by the following formula (b1) and formula (b2) can be cited. From the viewpoint of scratch resistance, the (meth)acrylic monomer (B) preferably contains at least one or more of the compounds represented by the following formula (b1) and formula (b2), and more preferably contains the compound represented by the following formula (b1). First, the compound represented by the following formula (b1) will be described in detail below.

[0117]

[0118] (In the formula (b1), R 5 each independently represents a hydrogen atom or a methyl group, A represents a linear or branched aliphatic hydrocarbon group having 3 to 20 carbon atoms which may contain an oxygen atom, B represents one selected from a linear or branched aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain a heteroatom, an aromatic group, and a combination thereof, and m represents 2 to 8.)

[0119] Among them, A preferably has one or more pentaerythritol skeletons to which a (meth)acryloyl group is bonded. Having a pentaerythritol skeleton means having a skeleton common to the carbon skeleton of pentaerythritol. More specifically, it means having one or more structures represented by C(CH2-)4. As the structure represented by two or more C(CH2-)4, there is no particular limitation, and for example, a dipentaerythritol skeleton and a tripentaerythritol skeleton can be cited. By having a pentaerythritol skeleton to which a (meth)acryloyl group is bonded, the amount of (meth)acryloyl groups contained in the monomer (B) increases. Therefore, there is a tendency that the photosensitivity during photocuring is excellent and the scratch resistance of the obtained cured product is excellent.

[0120] m is 2 to 8, more preferably 3 or more. By making m 2 to 8, the amount of (meth)acryloyl groups contained in the monomer (B) increases. Therefore, there is a tendency that the photosensitivity during photocuring is excellent and the scratch resistance of the obtained cured product is excellent.

[0121] B is preferably a linear or branched aliphatic hydrocarbon group having 2 to 10 carbon atoms which may contain a heteroatom, more preferably a linear or branched aliphatic hydrocarbon group having 2 to 6 carbon atoms, and further preferably a linear or branched aliphatic hydrocarbon group having 2 to 4 carbon atoms. By making the number of carbon atoms 10 or less, there is a tendency that hydrogen bonds are easily generated and the scratch resistance is excellent.

[0122] As the specific compound represented by the following formula (b1), there is no particular limitation, and for example, the following compounds can be cited.

[0123]

[0124]

[0125] Next, the compound represented by the following formula (b2) will be described in detail.

[0126]

[0127] (In formula (b2), R 5 each independently represents a hydrogen atom or a methyl group, A' each independently represents a linear or branched aliphatic hydrocarbon group having 1 to 20 carbon atoms which may contain an oxygen atom, B' represents one selected from a linear or branched aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain a hetero atom, an aromatic group, and a combination thereof, m1 and m2 each independently represent 1 to 8, and n represents 0 or 1.)

[0128] A' preferably has a pentaerythritol skeleton bonded with a (meth)acryloyl group. By having a pentaerythritol skeleton bonded with a (meth)acryloyl group, the amount of (meth)acryloyl groups contained in monomer (B) increases, and thus there is a tendency that the photosensitivity during photocuring is excellent and the abrasion resistance of the obtained cured product is excellent.

[0129] m1 and m2 each independently are preferably 2 or more, more preferably 3 or more, and still more preferably 5 or more. By making m1 and m2 2 or more, the amount of (meth)acryloyl groups contained in monomer (B) increases, and thus there is a tendency that the photosensitivity during photocuring is excellent and the abrasion resistance of the obtained cured product is excellent. In addition, the total of m1 and m2 (m1 + m2) is not particularly limited, and from the viewpoint of balancing developability and photocurability, it is preferably 2 to 14, and more preferably 4 to 12.

[0130] B' is preferably a linear or branched aliphatic hydrocarbon group having 1 to 10 carbon atoms, more preferably a linear or branched aliphatic hydrocarbon group having 2 to 9 carbon atoms, and still more preferably a linear or branched aliphatic hydrocarbon group having 3 to 8 carbon atoms. By making the number of carbon atoms 10 or less, there is a tendency that hydrogen bonds are easily formed and the abrasion resistance is excellent.

[0131] As the specific compound represented by formula (b2), there is no particular limitation, and for example, the following compounds can be cited.

[0132]

[0133]

[0134] The acid value of the solid content of the (meth)acrylic monomer (B) in the present embodiment is preferably 1 to 130 mgKOH / g, more preferably 5 to 125 mgKOH / g, still more preferably 10 to 120 mgKOH / g, and particularly preferably 20 to 120 mgKOH / g. By making the acid value of the solid content of the (meth)acrylic monomer (B) within the above range, the hydrogen bond with the alkali-soluble resin (A) tends to be good, and the scratch resistance tends to be excellent. It should be noted that the acid value of the solid content of the (meth)acrylic monomer (B) can be calculated in the same manner as the theoretical acid value of the solid content of the above-mentioned alkali-soluble resin (A).

[0135] The content of the (meth)acrylic monomer (B) in the present embodiment is not particularly limited with respect to all the solid components in the composition. From the viewpoint of scratch resistance, it is preferably 1 to 50% by mass, more preferably 2 to 30% by mass, and particularly preferably 4 to 20% by mass with respect to all the solid components in the composition.

[0136] In addition, the ratio (B / A) of the content of the (meth)acrylic monomer (B) to the content of the alkali-soluble resin (A) is not particularly limited. From the viewpoint of scratch resistance, it is preferably 0.01 to 1.0, more preferably 0.025 to 0.8, still more preferably 0.05 to 0.6, and even more preferably 0.06 to 0.4.

[0137] The content of the compound represented by the above formula (b1) is not particularly limited. It is preferably 10% by mass or more, more preferably 20% by mass or more, and still more preferably 25% by mass or more with respect to the total amount of the (meth)acrylic monomer (B). By making the content of the compound represented by the above formula (b1) 10% by mass or more, the scratch resistance tends to be excellent.

[0138] The content of the compound represented by the above formula (b2) is not particularly limited. It is preferably 25% by mass or more, more preferably 30% by mass or more, and still more preferably 40% by mass or more with respect to the total amount of the (meth)acrylic monomer (B). By making the content of the compound represented by the above formula (b2) 25% by mass or more, the scratch resistance tends to be excellent.

[0139] The total content of the compounds represented by the above formulas (b1) and (b2) is not particularly limited. It is preferably 15% by mass or more, more preferably 25% by mass or more, and still more preferably 30% by mass or more with respect to the total amount of the (meth)acrylic monomer (B). By making the total content of the compounds represented by the above formulas (b1) and (b2) 15% by mass or more, the scratch resistance tends to be excellent.

[0140] 1.4. (Meth)acrylic monomer (C)

[0141] (Meth)acrylic monomer (C) is a compound having two polymerizable functional groups and a ring structure between the two polymerizable functional groups, and having at least one (meth)acryloyl group. The photosensitive resin composition of the present embodiment can further improve the via formation property by using the (meth)acrylic monomer (C).

[0142] Here, the "ring structure" means a structure having at least one cyclic skeleton, and includes both a structure composed only of a cyclic skeleton and a structure composed of a cyclic skeleton and other structures such as a linear structure bonded to the cyclic skeleton. In addition, the "ring structure between two polymerizable functional groups" means that the two polymerizable functional groups are bonded via the ring structure, and the polymerizable functional group may be directly bonded to the cyclic skeleton or indirectly bonded to the cyclic skeleton. From the viewpoint of resistance to a developer, the ring structure of the (meth)acrylic monomer (C) may be any one selected from an aliphatic hydrocarbon group having 6 to 26 carbon atoms which may contain an oxygen atom, an aromatic hydrocarbon having 6 to 26 carbon atoms which may contain an oxygen atom, and a combination thereof (for example, a combination of an aliphatic hydrocarbon and an aromatic hydrocarbon, a combination of different aliphatic hydrocarbons, different aromatic hydrocarbon compounds, etc.). Specific examples of the cyclic skeleton include, for example, a fluorene skeleton, a cyclohexane skeleton, a bisphenol A skeleton, a dicyclopentane skeleton, and a combination thereof.

[0143] The "polymerizable functional group" is (meth)acryloyl itself, a group containing one (meth)acryloyl group, or a functional group containing one polymerizable group other than (meth)acryloyl group. Examples of the polymerizable functional group other than (meth)acryloyl group include a vinyl group, an allyl group, a (meth)acrylamide group, etc. Hereinafter, when referring to a "group containing a (meth)acryloyl group", it means (meth)acryloyl itself or a group containing one (meth)acryloyl group. The (meth)acrylic monomer (C) is preferably a group in which each of the two polymerizable functional groups contains a (meth)acryloyl group, and at least one of the two polymerizable functional groups is preferably an acryloyl group. In the (meth)acrylic monomer (C), the number of polymerizable functional groups is two. If the number of polymerizable functional groups is greater than two, the via formation property may sometimes decrease. In addition, the types of the two polymerizable functional groups may be the same or different from each other.

[0144] As the (meth)acrylic monomer (C), a compound represented by the following formula (c1) can be used.

[0145]

[0146] (In the formula (c1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, Y 1 and Y 2Each independently represents a single bond, or an aliphatic hydrocarbon group having 1 to 26 carbon atoms in a straight chain or branched chain which may contain an oxygen atom, X 11 represents an aliphatic hydrocarbon group or aromatic group having 6 to 26 carbon atoms with a cyclic skeleton, and W1 and W2 each independently represent O, N or S.)

[0147] In formula (c1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and from the viewpoint of the composition showing good curability during exposure, a hydrogen atom is preferred.

[0148] Y 1 and Y 2 each independently represent a single bond, or an aliphatic hydrocarbon group having 1 to 26 carbon atoms in a straight chain or branched chain which may contain an oxygen atom (a divalent bonding group). From the viewpoint of curability, the number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 20, more preferably 1 to 12. As the straight chain or branched chain aliphatic hydrocarbon group, an alkylene group having 1 to 26 carbon atoms can be cited, and examples include a methylene group, an ethylene group, 1-methylethylene group, 1-methylpropylene group, 2-methylpropylene group, 1,1-dimethylethylene group, etc. In addition, as Y 1 and Y 2 , for example, a group represented by -O(C2H4O) m - (m is 1 to 13) etc. can be cited. As Y 1 and Y 2 , for example, a methylene group is preferred.

[0149] X 11 represents an aliphatic hydrocarbon group or aromatic group having 6 to 26 carbon atoms with a cyclic skeleton (a divalent bonding group). From the viewpoint of resistance to the developer, the number of carbon atoms of X 11 is preferably 6 to 26.

[0150] As the above-mentioned aliphatic hydrocarbon having 6 to 26 carbon atoms with a cyclic skeleton, a divalent bonding group composed of a cyclohexane ring, a cyclodecane ring, a tricyclodecane ring, an adamantane ring, a norbornane ring or a decalin ring can be cited, and as the above-mentioned aromatic group, a divalent bonding group composed of a benzene ring, a naphthalene ring, etc. can be cited. As X 11 , a divalent bonding group containing at least 1 kind selected from the above-mentioned fluorene skeleton, cyclohexane skeleton, bisphenol A skeleton, dicyclopentane skeleton and their combinations is preferred.

[0151] As the (meth)acrylic monomer (C), there is no particular limitation, and for example, the following compounds can be cited.

[0152]

[0153] The content of the (meth)acrylic monomer (C) in the photosensitive resin composition of the present embodiment is not particularly limited. From the viewpoint of scratch resistance, it is preferably 5 to 50% by mass, more preferably 10 to 30% by mass, and particularly preferably 10 to 20% by mass based on all the solid components in the composition.

[0154] The ratio ((C) / (A)) of the content of the (meth)acrylic monomer (C) to the content of the alkali-soluble resin (A) in the photosensitive resin composition of the present embodiment is not particularly limited. From the viewpoint of via formation property, it is preferably 0.01 to 1.0, more preferably 0.05 to 0.8, further preferably 0.1 to 0.6, and even more preferably 0.2 to 0.4.

[0155] In addition, the photosensitive resin composition of the present embodiment may contain a photopolymerizable monomer other than the (meth)acrylic monomer (C). The other photopolymerizable monomer is not particularly limited. For example, a compound having three or more ethylenically unsaturated groups in the molecule can be mentioned. Examples of such a compound include trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, and the like.

[0156] (Double bond equivalent)

[0157] From the viewpoints of reactivity and developability, the double bond equivalent of the (meth)acrylic monomer (C) is preferably 120 to 1000, more preferably 120 to 800, and particularly preferably 120 to 600. This double bond equivalent can be obtained from (molecular weight of the (meth)acrylic monomer (C)) / ((number of ethylenically unsaturated groups possessed by the (meth)acrylic monomer (C))).

[0158] (LogP)

[0159] From the viewpoints of resistance to developer and developability, the LogP of the (meth)acrylic monomer (C) is preferably 1 to 8, more preferably 1.5 to 7, further preferably 2 to 6, particularly preferably 2.5 to 6, and most preferably 3 to 5.

[0160] The LogP can be determined by HPLC (High Performance Liquid Chromatography) using a reversed-phase column (C18) in accordance with OECD GUIDELINES FOR THE TESTING OF CHEMICALS Partition Coefficient (n-octanol / water), High Performance Liquid Chromatography (HPLC) Method 117 (Adopted 13 April 2004). Standard substances with known LogP values such as benzyl alcohol, anisole, toluene, and butylbenzene are used.

[0161] Examples of the determination conditions for LogP are as follows.

[0162] · Equipment: 1200 Series HPLC manufactured by Agilent Technology

[0163] · Column: Inspire C18 5μm 150×4.6mm (particle size 5μm, inner diameter 4.6mm, length 150mm) manufactured by DiKMA

[0164] · Mobile phase: A mixed solution of acetonitrile and 0.5 wt% phosphoric acid aqueous solution {mixing ratio 55:45 (volume ratio)}

[0165] · Oven temperature: 40 °C

[0166] · Flow rate: 1 mL / min

[0167] · UV detection wavelength: 210 nm

[0168] 1.5. Photoinitiator

[0169] The photosensitive resin composition of this embodiment preferably contains a photoinitiator. A photoinitiator is a compound that is activated by various actinic rays such as ultraviolet rays to initiate polymerization. There is no particular limitation on the photoinitiator. For example, radical photoinitiators, cationic photoinitiators, and anionic photoinitiators can be cited. There is no particular limitation on the photoinitiator. For example, a photoinitiator that generates radicals for polymerizing ethylenically unsaturated groups from ultraviolet rays to visible light can be preferably used.

[0170] As the photoinitiator, there is no particular limitation. For example, acetophenones such as acetophenone, 2,2'-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, etc.; α-aminoketone-based photoinitiators such as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, etc.; oxime ester-based photoinitiators such as 1-[4-(phenylthio)phenyl]octane-1,2-dione 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime), 1-[9-ethyl-6-benzoyl-9H-carbazol-3-yl]-octan-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-ethanone oxime-O-benzoate, 1-[9-n-butyl-6-(2-ethylbenzoyl)-9H-carbazol-3-yl]-ethanone oxime-O-benzoate, 1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime), 1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime), 1-[9-ethyl-6-(2-methyl-5-tetrahydrofuranylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime, 1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxolanyl)methoxybenzoyl}-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime), etc.; benzophenones such as benzophenone, 2-chlorobenzophenone, p,p'-bis(dimethylamino)benzophenone, etc.; benzoin ethers such as benzil, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, etc.; sulfur compounds such as benzil dimethyl ketal, thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, etc.; anthraquinones such as 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, etc.; triazines such as 2,4-trichloromethyl-(4'-methoxyphenyl)-6-triazine, 2,4-trichloromethyl-(4'-methoxynaphthyl)-6-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine, etc.; organic peroxides such as azobisisobutyronitrile, benzoyl peroxide, cumene hydroperoxide, etc.; 2-mercaptobenzimidazole, 2-mercaptobenzo Thiazoles, mercaptobenzothiazole and other thiol compounds. From the viewpoint of balancing the resistance to the developer and the developability, an oxime ester-based photopolymerization initiator is preferably used as the photopolymerization initiator. These photopolymerization initiators can be used alone, or two or more of them can be used in combination.

[0171] The content of the photopolymerization initiator in the photosensitive resin composition of the present embodiment is not particularly limited with respect to all solid components in the composition. From the viewpoint of the composition showing good curability during exposure, it is preferably 0.1 to 10, more preferably 1.0 to 8.0, and further preferably 3.0 to 5.0.

[0172] In addition, the ratio of the total amount of the photopolymerization initiator to the (meth)acrylic monomer (photopolymerization initiator / (meth)acrylic monomer) is not particularly limited. From the viewpoint of the composition showing good curability during exposure, it is preferably 0.01 to 1.0, more preferably 0.05 to 0.8, further preferably 0.1 to 0.4, and even more preferably 0.1 to 0.2. It should be noted that the total amount of the above (meth)acrylic monomers refers to the sum of the contents of the (meth)acrylic monomer (A), the (meth)acrylic monomer (B), and other (meth)acrylic monomers.

[0173] 1.6. Solvent

[0174] In the present embodiment, the solvent can be appropriately selected and used according to the required purpose from known solvents.

[0175] The above solvent is not particularly limited. For example, cyclohexanone (ANONE), cyclopentanone, diethylene glycol methyl ethyl ether, acetylacetone, methanol, ethanol, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve, methyl cellosolve acetate, diethylene glycol dimethyl ether, cyclohexanone, ethylbenzene, xylene, isoamyl acetate, n-amyl acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol methyl ethyl ether (EDM), diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, triethylene glycol, triethylene glycol monomethyl ether, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether, triethylene glycol monoethyl ether acetate, liquid polyethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monoethyl ether acetate, lactate, methyl methoxypropionate, ethyl ethoxypropionate, etc. can be cited.

[0176] The above solvents may be used alone or in combination of two or more. In addition, the content of the solvent in the photosensitive resin composition of the present embodiment is not particularly limited. From the viewpoints of storage stability and coatability, it is preferably used in such a manner that the total solid content concentration ((total solid content (parts by mass) / (total solid content (parts by mass) + solvent (parts by mass))) × 100) is preferably 1 to 60% by mass, more preferably 5 to 50% by mass, still more preferably 10 to 40% by mass, and particularly preferably 10 to 30% by mass. By making the total solid content concentration within the above range, the viscosity of the photosensitive resin composition can be made appropriate, and thus the coatability when coating on a substrate or the like to form a film is particularly high.

[0177] 1.7. Polymerization inhibitor

[0178] From the viewpoint of suppressing the polymerization of (meth)acrylic acid-based monomer (C) and the like, the photosensitive resin composition of the present embodiment may contain a polymerization inhibitor. In addition, as the polymerization inhibitor, known ultraviolet absorbers can be used.

[0179] Examples of the polymerization inhibitor include phenolic compounds such as 4-methoxyphenol, 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-N,N-dimethylaminop-cresol, 2,4-dimethyl-6-tert-butylphenol, 4-tert-butylcatechol, 4,4'-thio-bis(3-methyl-6-tert-butylphenol), 4,4'-butylidene-bis(3-methyl-6-tert-butylphenol); N-oxyl compounds such as 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-acetamido-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-N-oxyl, 2,2,6,6-tetramethylpiperidine-N-oxyl; quinone compounds such as p-methoxyphenol (MEHQ), hydroquinone, 2,5-di-tert-butylhydroquinone, 2,6-di-tert-butylhydroquinone, benzoquinone; cuprous chloride; copper dialkyldithiocarbamates such as copper dimethyldithiocarbamate; amino compounds such as phenothiazine, N,N'-diphenyl-p-phenylenediamine, phenyl-β-naphthylamine, N,N'-di-β-naphthyl-p-phenylenediamine, N-phenyl-N'-isopropyl-p-phenylenediamine; hydroxylamine compounds such as 1,4-dihydroxy-2,2,6,6-tetramethylpiperidine, 1-hydroxy-2,2,6,6-tetramethylpiperidine, 4-hydroxy-2,2,6,6-tetramethylpiperidine. As the polymerization inhibitor, for example, the above p-methoxyphenol can be preferably used. As the polymerization inhibitor, they can be used alone or in combination of two or more.

[0180] The content of the polymerization inhibitor in the photosensitive resin composition of the present embodiment is not particularly limited. From the viewpoint of via formation, it is preferably 0.01 to 0.5% by mass, more preferably 0.03 to 0.3% by mass, and still more preferably 0.05 to 0.15% by mass, based on all solid components.

[0181] 1.8. Silane Coupling Agent

[0182] From the viewpoint of improving the adhesion between the substrate and the coating film, a silane coupling agent can be used in the photosensitive resin composition of the present embodiment.

[0183] The type of the silane coupling agent is not particularly limited, and known silane coupling agents can be used. For example, the following compounds can be used.

[0184]

[0185] The content of the silane coupling agent in the photosensitive resin composition of the present embodiment is not particularly limited. From the viewpoints of improving the adhesion and insulation properties to the substrate, it is preferably 0.1 to 10% by mass, more preferably 0.5 to 8 parts by mass, and still more preferably 1.0 to 8 parts by mass, based on all solid components.

[0186] 1.9. Other Components

[0187] The photosensitive resin composition of the present embodiment may also optionally contain various additives such as inorganic fine particles, adhesion promoters, surfactants, storage stabilizers, leveling agents, light stabilizers, and antioxidants. Examples of these additives are not particularly limited. For example, the additives described in JP-A-2012-215833 can be cited.

[0188] 1.10. Method for Preparing Photosensitive Resin Composition

[0189] The photosensitive resin composition of the present embodiment contains an alkali-soluble resin (A) and a (meth)acrylic monomer (B), and is prepared by further adding a solvent, a polymerization inhibitor, a silane coupling agent, etc. and stirring and mixing them.

[0190] 2. Insulating Cured Film

[0191] The use of the photosensitive resin composition of the present embodiment is not particularly limited, and it can be used for forming an insulating film. For example, it can be used as an insulating cured film, particularly an insulating cured film for a touch panel. The insulating cured film for a touch panel can be formed by coating the photosensitive resin composition on a substrate such as a glass substrate, ITO, metal film, or organic film by various coating methods such as spin coating, casting coating such as die coating, roll coating, or coating based on roll transfer printing to form a coating film, and then curing the coating film.

[0192] Specifically, the photosensitive resin composition can be applied onto a substrate such as a glass substrate, irradiated with light through a mask, developed, and heat-treated as needed to perform pattern processing, thereby forming the cured film of the present embodiment.

[0193] 3. Insulating cured film for touch panel

[0194] The insulating cured film can be used for any application such as insulating film application, protective film application, flat film application, etc. The insulating cured film using the photosensitive resin composition of the present embodiment is particularly suitable for use as a protective film for touch panel and an insulating film for touch panel.

[0195] In addition, the insulating cured film of the present embodiment can not only be used for the so-called permanent film application in devices such as touch panels, but also can be used as a resist film used when patterning an ITO film on a glass substrate.

[0196] 3.1. Cured film with through-holes

[0197] For the conduction between electrodes, etc., through-holes with required dimensions can be provided on the cured film used for the insulating cured film of a touch panel, etc. The through-hole is a form of the pattern formed by patterning. As described above, even when the photosensitive resin composition of the present embodiment is used as a negative composition, it has excellent through-hole forming property, and can form through-holes that are fully opened to the hole side and have an inverted trapezoidal cross-sectional shape when observed from the exposure direction. Therefore, it can be applied as a composition for forming a cured film with through-holes.

[0198] The method for producing the cured film with through-holes using the photosensitive resin composition of the present embodiment is not particularly limited. For example, a well-known through-hole forming method and a cured film production method can be appropriately selected. As an example of the method for producing a cured film with through-holes using the photosensitive resin composition of the present embodiment, a method including the following steps can be cited: a step of applying the photosensitive resin composition of the present embodiment onto a substrate to form a coating film (coating film forming step), a step of exposing the above coating film through a through-hole forming mask (exposure step), a step of removing the unexposed portion of the exposed coating film with a developer (development step), and a step of heating the coating film from which the unexposed portion has been removed (for example, 90 to 230 °C, 10 to 60 minutes) (post-baking step). A step of heating the coating film (for example, 80 to 100 °C, 60 to 180 seconds) (pre-baking step) can be implemented between the coating film forming step and the exposure step, etc. In addition, as described above, it can include a step of removing foreign matters by wiping the surface of the insulating film with a non-woven fabric impregnated with alcohol, etc. after the post-baking step (hereinafter, also referred to as "foreign matter removing step"). At this time, by using the photosensitive resin composition of the present embodiment, even when the foreign matter removing step is implemented, the surface of the insulating film is not easily damaged.

[0199] The thickness of the cured film with through-holes can be appropriately set according to the purpose. For example, from the viewpoint of reactivity, it can be 0.2 μm to 10 μm, and can further be 0.5 μm to 5 μm.

[0200] In addition, the aperture diameter of the through-holes formed in the cured film with through-holes can be appropriately set according to the purpose. For example, from the viewpoints of reactivity and developability, it can be 100 μm or less, and can further be 50 μm or less. It should be noted that as Figure 3 shown, the "aperture diameter" of the through-holes formed in the cured film with through-holes can be defined as the aperture diameter of the height corresponding to 10% starting from the bottom surface of the through-hole ( Figure 3 10% bottom CD in 10 ); also referred to as "R

[0201] The film thickness [T] of the cured film and the opening diameter [R 10 (the aperture diameter of the height corresponding to 10% starting from the bottom surface of the through-hole ( Figure 3 10% bottom CD in 10 ) ratio [T:R

[0202] is preferably 1:50 or less, and more preferably 1:1 to 30.

[0203] In addition, the opening size of the through-holes formed in the cured film with through-holes is not particularly limited, and can be 15 μm or less, or less than 10 μm in terms of the 10% bottom CD value. Figure 3 Regarding the taper angle of the cross-sectional shape of the through-hole (the angle α (taper angle) at the intersection of the straight line A and the straight line B shown in

[0204] 4. Touch panel

[0205] As described above, the photosensitive resin composition of the present embodiment and the insulating cured film using the same can be applied as an insulating film for a touch panel. Hereinafter, the insulating cured film of the present embodiment and the insulating film for a touch panel may be simply collectively referred to as "the cured film of the present embodiment".

[0206] The touch panel of the present embodiment can be any one of a resistive film type, a capacitive type, an ultrasonic type, and an optical type, and a capacitive touch panel is preferred.

[0207] A capacitive touch panel uses, for example, glass with an ITO film as the substrate. To prevent misrecognition of the contact position, an insulating film and a protective film are provided in the laminated structure (e.g., between electrodes). When the touch panel of the present embodiment is a capacitive touch panel, the cured film of the present embodiment can be used, for example, as the insulating film, the protective film, or both in the laminated structure.

[0208] In addition, the touch panel can be divided into a double-sided structure in which the X electrode is disposed on one side of the insulating film and the Y electrode is disposed on the other side, and a single-sided structure in which the X electrode and the Y electrode are formed on the same plane. The touch panel of the present embodiment can be either a double-sided or a single-sided structure, and a touch panel with a single-sided structure is particularly preferred.

[0209] In the single-sided touch panel structure, the X electrode and the Y electrode are electrically separated. At this time, according to the pattern of the electrodes, for example, it can be classified into an island pattern, a via hole pattern, etc. For example, in the case of an island pattern, in addition, in the single-sided touch panel structure, the separated electrodes are electrically connected to each other through a component called a jumper portion. In addition, the electrode jumper portion uses a transparent electrode such as an ITO film. For example, when the jumper portion connects the separated Y electrodes to each other, an insulating layer is provided below the jumper portion to maintain insulation from the X electrode. In addition, generally, an insulating film (protective film) is formed uniformly on each electrode configured in a single-sided manner.

[0210] Therefore, when the touch panel of the present embodiment has a single-sided touch panel structure, the touch panel of the present embodiment can use the cured film of the present embodiment, for example, for the insulating film formed on the electrodes, the insulating layer formed below the jumper portion, or both.

[0211] In addition, when the touch panel is provided in a liquid crystal display device, according to its installation position, it can be divided into an external attachment structure, an external embedding structure, and an internal embedding structure. In the external embedding structure and the internal embedding structure, the touch panel is provided inside the liquid crystal panel, and in the external attachment structure, the touch panel is provided outside the liquid crystal panel. In the external embedding structure, the touch panel is provided between the polarizer on the viewing direction side and the liquid crystal laminate (a laminate composed of a pair of substrate glasses and a liquid crystal layer sandwiched therebetween). In addition, in the internal embedding structure, the liquid crystal layer of the liquid crystal laminate has a touch panel function. The touch panel of the present embodiment can be applied to any structure. For example, it is preferably used in the external embedding structure.

[0212] Hereinafter, one mode of the touch panel of the present embodiment will be described with reference to the drawings. Figure 1 It is a top view showing the configuration of one mode of the touch panel of the present embodiment. As Figure 1As shown in the figure, when the touch panel of this embodiment is a single-sided touch panel, ITO (indium tin oxide) electrodes (X1 to X3, Y1 to Y3) are formed on the glass substrate 10.

[0213] As the material of the glass substrate 10, for example, there is no particular limitation. For example, glass plates such as soda-lime glass, low-alkali borosilicate glass, and alkali-free aluminosilicate glass can be used. In addition, plastic plates or plastic films made of polyethylene terephthalate (PET), triacetyl cellulose (TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), etc. can be used instead of the glass substrate.

[0214] The ITO electrodes (X1 to X3, Y1 to Y3) are transparent electrodes. In this embodiment, ITO is used as the material of the transparent electrode. As long as it can be disposed on the surface of the substrate, there is no particular limitation. For example, in addition to ITO, inorganic conductive materials such as ZnO (zinc oxide) and organic conductive materials such as PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / polystyrene sulfonate), polyaniline, and polypyrrole can also be used. These materials can be used alone or in combination of two or more.

[0215] It should be noted that Figure 1 and 2 Although not described herein, a metal thin film having the function of a metal wiring or a transparent electrode can be used under each electrode and the jumper portion X12. As the metal thin film, metal materials such as Mo (molybdenum), Al (aluminum), Ag (silver), and Pd (palladium) can be used, and preferably any one or more of Mo and Al are used.

[0216] As Figure 1 shown, the ITO electrodes X1 to X3 are electrodes arranged along the Figure 1 arrow P direction. The ITO electrodes X1 to X3 are separated from the adjacent electrodes and are electrically connected to the electrodes adjacent in the P direction through the jumper portion X12. The jumper portion X12 can be formed of the same material as the transparent electrode such as ITO. In addition, an insulating film 14 as shown in Figure 2 is sandwiched between the lower part in the thickness direction of the jumper portion X12 and the connection portion with the ITO electrode Y. And in order to electrically connect the electrodes X2 and X3 adjacent in the P direction, vias 20 are provided at both ends of each jumper portion X12.

[0217] In addition, the ITO electrodes Y1 to Y3 are electrodes arranged along the Figure 1 arrow Q direction. The ITO electrodes Y1 to Y3 are continuously connected to the adjacent electrodes in the Q direction through the connection portions formed of ITO films, so as to be electrically connected in the Q direction. It should be noted that usually the ITO electrodes Y1 to Y3 and each connection portion are integrally and continuously formed during electrode forming.

[0218] Hereinafter, the electrode group electrically connected in the P direction is referred to as the "X electrode", and the electrode group electrically connected in the Q direction is referred to as the "Y electrode". As Figure 1 shown, in the single-sided touch panel, the X electrodes are arranged along the P direction, and the Y electrodes are arranged along the Q direction.

[0219] Next, Figure 2 the cross-sectional structure of the touch panel of the present embodiment will be described. Figure 2 is Figure 1 the AA cross-sectional view of. As Figure 2 shown, an insulating film 14 and a connection portion Y12 between the ITO electrodes Y1 and Y2 are sandwiched between the ITO electrodes X2 and X3. As described above, the ITO electrodes X2 and X3 are electrically connected via the jumper portion X12. In addition, a part of the insulating film 14 extends between the lower part in the thickness direction of the jumper portion X12 and the connection portion Y12 to ensure the insulation between the jumper portion X12 and the connection portion Y12. In addition, an insulating protective layer 16 is provided on the upper side in the thickness direction of the insulating film 14 and the jumper portion X12.

[0220] In the present embodiment, at least one of the insulating film 14 or the insulating protective layer 16 can use the curable film of the present embodiment. However, the other can be formed of a known material conventionally used in an insulating film or a protective film, and both the insulating film 14 and the insulating protective layer 16 are preferably the curable film of the present embodiment.

[0221] In the above touch panel, the method for forming the curable film of the present embodiment is not particularly limited. For example, a coating film can be formed on a lower layer (for example, the glass substrate 10 and the ITO electrode for the insulating film 14, or the ITO electrode for the insulating protective layer 16, etc.) by coating methods such as spraying, spin coating, slot die coating, roll coating, bar coating, etc. At this time, the dry film thickness of the coating film is not particularly limited. For example, in the case of the insulating protective layer 16, it is preferably 0.5 to 20 μm, more preferably 1.0 to 10 μm. Similarly, in the case of the insulating film 14, the dry film thickness is preferably 0.2 to 10 μm, more preferably 0.5 to 5 μm. In addition, the coating film can be exposed through a mask having a predetermined pattern provided in a contact or non-contact state with the coating film as needed. The type of light during exposure is not particularly limited. For example, visible light, ultraviolet light, far-infrared light, electron beam, X-ray, etc. can be cited, and ultraviolet light is preferably used. The illuminance of the light is not particularly limited, and it is preferably 5 to 150 mW / cm 2 at 365 nm, and particularly preferably 5 to 35 mW / cm 2 .

[0222] Thereafter, it is impregnated as needed in an aqueous alkali developer such as sodium carbonate, sodium hydroxide, potassium hydroxide, or tetramethylammonium hydroxide (TMAH), or the developer is sprayed by spraying or the like to remove the uncured portion, thereby forming a desired pattern. In addition, in order to promote the polymerization of the photosensitive composition and cure it, heating (post-baking) may be performed as needed. It should be noted that when forming this cured film, the above-described method for forming the through hole can be employed.

[0223] In addition, for example, when forming the jumper portion X12, first, the patterned X electrode and Y electrode are formed on the glass substrate 10. Thereafter, the photosensitive resin composition is coated on the glass substrate 10 and the electrode surfaces, and the photosensitive resin composition is exposed and developed using the insulating film 14 and the mask capable of forming the through hole 20. Next, a material (such as ITO) that becomes the jumper portion X12 is deposited on the insulating film 14 and the through hole 20 by PVD or the like to form a conductive layer. Thereafter, a protective layer is provided only on the surface of the conductive layer at the portion where the jumper portion X12 is formed (for example, Figure 2 the insulating film 14 on the connection portion Y12 in ), and an etching process is performed, whereby the jumper portion X12 can be formed on the insulating film 14 on the connection portion Y12.

[0224] Examples

[0225] Hereinafter, the present invention will be described more specifically using examples and comparative examples. However, the present invention is not limited at all by the following examples.

[0226] 1. Preparation of photosensitive resin composition

[0227] Each component was mixed according to the formulation shown in the following table to prepare a photosensitive resin composition. The mixing was carried out at room temperature, and ultraviolet rays were shielded so as not to initiate a polymerization reaction.

[0228] [Table 1]

[0229]

[0230] It should be noted that in Table 1 above, the numerical values of the respective components are parts by mass relative to the entire composition (excluding the solvent). In addition, the respective components in Table 1 above use the substances shown in Tables 2 to 5 below.

[0231] [Table 2]

[0232]

[0233] [Table 3]

[0234]

[0235] [Table 4]

[0236]

[0237] [Table 5]

[0238] Name Compound Name Photoinitiator 1-[4-(Phenylthio)phenyl]octane-1,2-dione 2-(O-benzoyloxime) Silane Coupling Agent 3-Trimethoxysilylpropylsuccinic Anhydride Polymerization Inhibitor 4-Methoxyphenol

[0239] Among them, each resin in Table 2 above and each monomer in Table 3 were synthesized by the following method.

[0240] 1.1. Synthesis of Resin A-1

[0241] In a reaction vessel equipped with a stirring device, a reflux condenser, a nitrogen blowing tube, and a thermometer, 53 parts by mass of methyl methacrylate (Tg: 105 °C), 33 parts by mass of glycidyl methacrylate (Tg: 41 °C), 14 parts by mass of methacrylic acid (Tg: 185 °C), and 300 parts by mass of cyclohexanone were charged and dissolved while blowing nitrogen. After heating to 65 °C, 6 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) (ADVN) was added, and polymerization was carried out at 65 °C for 8 hours to obtain Resin A-1. The weight-average molecular weight of the obtained Resin A-1 was measured by gel permeation chromatography, and the result was 11,000 in terms of polystyrene conversion.

[0242] 1.2. Synthesis of Resins A-2 to A-4

[0243] For Resins A-2 to A-4, except for changing the types and input ratios of the monomers, synthesis was carried out under the same conditions as those for the synthesis of Resin A-1. The weight-average molecular weights of the obtained Resins A-2 to A-4 were measured by gel permeation chromatography, and the results were 12,000, 7,000, and 6,000 in terms of polystyrene conversion, respectively. It should be noted that the Tg of the monomers used were dicyclopentanyl methacrylate: 175 °C, 2-hydroxyethyl methacrylate: 55 °C, and 3,4-epoxycyclohexylmethyl methacrylate: 72 °C.

[0244] 1.3. Synthesis of Monomer B-1

[0245] In a 1-L reaction vessel equipped with a stirrer, a condenser, and a thermometer, 500.0 g of KAYARAD DPHA (Nippon Kayaku Co., Ltd.), 28.3 g of succinic anhydride, 0.5 g of 4-methoxyphenol as a polymerization inhibitor, and 660.3 g of toluene as a solvent were mixed. Then, while blowing air, stirring was carried out, and the reaction was carried out at 70 °C for 12 hours. Next, while blowing air, toluene was distilled off under reduced pressure to obtain Monomer B-1.

[0246] Assuming that all of the succinic anhydride reacted without side reactions, and based on the input amount of succinic anhydride, Monomer B-1 contained 30 wt% of succinic anhydride-modified dipentaerythritol pentaacrylate.

[0247] 1.4. Synthesis of Monomer B-2

[0248] 500.0 g of Viscoat #300 (Osaka Organic Chemical Industry Co., Ltd.) was used instead of 500.0 g of KAYARAD DPHA (Nippon Kayaku Co., Ltd.), 95.6 g of succinic anhydride was used, 0.6 g of 4-methoxyphenol was used, and 744.5 g of toluene was used. Otherwise, monomer B-2 was obtained in the same manner as the synthesis of monomer B-1.

[0249] Assuming that all of the succinic anhydride reacted without side reactions, and based on the input amount of succinic anhydride, monomer B-2 contains 64 wt% of succinic anhydride-modified pentaerythritol triacrylate.

[0250] 1.5. Synthesis of monomer B-3

[0251] 664.0 g of KAYARAD DPHA (Nippon Kayaku Co., Ltd.) and 51.0 g of hexamethylene diisocyanate were charged into a 1-L reaction vessel equipped with a stirrer, a cooling tube, and a thermometer, and reacted at 60 °C for 8 hours to obtain monomer B-3. It should be noted that after the reaction was completed, the absence of isocyanate groups in the reaction product was confirmed by IR analysis.

[0252] Assuming that all of the hexamethylene diisocyanate reacted without side reactions, and based on the input amount of hexamethylene diisocyanate, monomer B-3 contains 52 wt% of urethane structure-modified acrylate.

[0253] 2. Evaluation

[0254] The following evaluations were performed on the curable compositions of the examples and comparative examples obtained by the above preparation.

[0255] 2.1. Formation of cured film

[0256] The obtained photosensitive resin composition was coated on a substrate having an ITO film by spin coating, and prebaked on a hot plate at 90 °C for 120 seconds to form a coating film. Then, using a contact hole pattern for negative film (pitch 200 μm / aperture 30 μm), light from an ultra-high pressure mercury lamp with an irradiation of 50 mJ / cm 2 (illuminance at 365 nm: 10 mW / cm 2 ) was irradiated. Next, it was developed with a 0.05% aqueous potassium hydroxide solution for 60 seconds and heated at 130 °C for 30 minutes to fabricate a substrate with a cured film having a film thickness of 2.0 μm.

[0257] 2.2. Abrasion resistance

[0258] The abrasion resistance of the cured product was evaluated using a commercially available reciprocating sliding tester. Specifically, the obtained substrate with a cured film was fixed to the moving stage of the reciprocating sliding tester. A Teflon ball with a radius of curvature of 4 mm was used for the contact part, and a non-woven fabric containing ethanol was fixed in a manner covering the Teflon ball. Then, it was set up such that the non-woven fabric was in contact with the substrate with the cured film, and the test was carried out under the conditions of a load of 700 g, a reciprocating distance of 8 cm (the distance from the starting point to the ending point was 4 cm), a reciprocating speed of 8 cm / s, and 40 sliding cycles. The haze of the substrate with the cured film before and after the abrasion test was measured using a haze meter (HM-150, Murakami Color Technology Research Institute), and the Δhaze ("haze after the abrasion test" - "haze before the abrasion test") was evaluated according to the following evaluation criteria. In the above evaluation criteria, a judgment of B or above was regarded as qualified. It should be noted that the test standard adopted JIS K7136. The evaluation results are shown in Table 1.

[0259] [Evaluation Criteria]

[0260] A: Δhaze is 1% or less.

[0261] B: Δhaze is greater than 1% and 2% or less.

[0262] C: Δhaze is greater than 2% and 4% or less.

[0263] D: Δhaze is greater than 4%.

[0264] 2.3. Through-Hole Formability

[0265] The curable resin compositions of Examples 1 to 10 and Comparative Examples 1 and 2 obtained above were applied onto a glass substrate by spin coating, pre-baked on a hot plate at 90 °C for 120 seconds to form a coating film, and irradiated with light from an ultra-high pressure mercury lamp with an exposure gap of 170 μm at 50 mJ / cm 2 (the illuminance at 365 nm: 10 mW / cm 2 ). Thereafter, it was developed with a 0.3% aqueous sodium carbonate solution for 60 seconds and heated at 130 °C for 30 minutes to fabricate a substrate with a cured film having a film thickness of 2.0 μm.

[0266] After observing the cross-section of the obtained substrate with the cured film using a laser microscope (manufactured by LASERTEC Corporation, product name: OPTELICSHYBRID), the aperture diameter of the through-hole (R 10 ; 10% bottom surface CD value) was measured for the substrate with the cured film when the aperture diameter of the mask was 30 μm, and evaluated according to the following evaluation criteria. It should be noted that regarding whether the through-hole was open, the case where the through-hole penetrated to the substrate was regarded as open, and the case where a film was confirmed at the bottom of the hole was regarded as not open. The evaluation results are shown in Table 6.

[0267] [Evaluation Criteria]

[0268] A: The 10% CD value is 20 μm or more.

[0269] B: The 10% CD value is 15 μm or more and less than 20 μm.

[0270] C: The 10% CD value is less than 15 μm.

[0271] D: The through-hole is not open.

[0272] 2.4. Chemical resistance

[0273] The same operations as the above through-hole forming test were performed on the curable resin compositions of Examples 1 to 10 and Comparative Examples 1 and 2 to obtain substrates with cured films. Thereafter, the obtained substrates with cured films were immersed in a 3.6 mass% aqueous oxalic acid solution at 41°C for about 120 seconds. After immersion, the substrates were washed with water, and further immersed in an amine solution (monoethanolamine / dimethyl sulfoxide = 70 / 30 (mass%)) at 60°C for about 60 seconds. After immersion, the substrates with cured films were washed with water and dried. Thereafter, a grid (1 mm × 1 mm × 100 meshes) was scratched on the surface of the cured film using a cutter. Next, after attaching a transparent tape to the cut surface, the operation of peeling off the transparent tape was performed. Then, the surface of the cured film of the substrate was observed with a stereomicroscope, and the number of grids remaining without peeling of the cured film was counted. Based on this number, the chemical resistance was evaluated according to the following evaluation criteria. The evaluation results are shown in Table 6.

[0274] [Evaluation criteria]

[0275] A: The number of grids remaining without peeling of the cured film is 90 or more.

[0276] B: The number of grids remaining without peeling of the cured film is 65 or more and less than 90.

[0277] C: The number of grids remaining without peeling of the cured film is 35 or more and less than 65.

[0278] D: The number of grids remaining without peeling of the cured film is less than 35.

[0279] [Table 6]

[0280]

[0281] 3. Results

[0282] From the obtained results, it was found that Examples 1 to 12 were excellent in abrasion resistance as compared with Comparative Examples 1 and 2 which did not use the (meth)acrylic monomer (B) of the present embodiment.

[0283] In addition, it is known that Examples 1 to 5 and 7 to 12 using a resin having a glass transition temperature of 120°C or lower as the alkali-soluble resin (A) are superior in scratch resistance compared to Example 6 using the alkali-soluble resin A-4 having a glass transition temperature exceeding 120°C. It is considered that this is because the fluidity of the alkali-soluble resin (A) becomes low in the post-baking process, and the distance between the molecules of the alkali-soluble resin (A) and the (meth)acrylic monomer (B) is difficult to approach, and it is not easy to form hydrogen bonds.

[0284] Furthermore, it is known that Examples 1 to 4 and 6 to 12 using a (meth)acrylic monomer (B) containing a carboxyl group are superior in via hole formation compared to Example 5 using a (meth)acrylic monomer (B) having a urethane skeleton.

[0285] Symbol Explanation

[0286] 10: Glass substrate, 14: Insulating film, 16: Insulating protective layer, X1 to X3, Y1 to Y3: ITO electrodes, X12: Jumper portion, Y12: Connection portion, 20: Via hole

[0287] The disclosure of Japanese Patent Application No. 2022-191301 filed on November 30, 2022 is incorporated herein by reference in its entirety.

[0288] In addition, all the documents, patent applications, and technical standards described in the specification are incorporated herein by reference to the same extent as the case where each document, patent application, and technical standard is specifically and independently incorporated by reference.

Claims

1. A photosensitive resin composition containing an alkali-soluble resin (A) and a (meth)acrylic monomer (B). The alkali-soluble resin (A) includes: a structural unit (a1) having an acid group, a structural unit (a2) having an oxygen-containing ring, and a structural unit (a3) represented by the following formula (a3). The (meth)acrylic monomer (B) has at least one of a urethane structure and a carboxyl group, and has two or more (meth)acryloyl groups. In formula (a3), R 1 represents a hydrogen atom or a methyl group, and R 4 represents at least one selected from linear, branched or cyclic aliphatic hydrocarbon groups having 1 to 20 carbon atoms which may contain an oxygen atom, aromatic groups, and combinations thereof.

2. The photosensitive resin composition according to claim 1, wherein Further contains a (meth)acrylic monomer (C), the (meth)acrylic monomer (C) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups.

3. The photosensitive resin composition according to claim 1, wherein Further contains a photoinitiator.

4. The photosensitive resin composition according to claim 1, wherein The weight-average molecular weight of the alkali-soluble resin (A) is 3,000 to 20,000.

5. The photosensitive resin composition according to claim 1, wherein The acid value of the alkali-soluble resin (A) is 55 mgKOH / g to 130 mgKOH / g.

6. The photosensitive resin composition according to claim 1, wherein The glass transition temperature of the alkali-soluble resin (A) is 140 °C or lower.

7. The photosensitive resin composition according to claim 1, wherein The content rates in mol% of the structural unit (a1), the structural unit (a2), and the structural unit (a3) in the alkali-soluble resin (A) are (a1) / (a2) / (a3) = 10 to 35 / 15 to 50 / 20 to 70.

8. The photosensitive resin composition according to claim 1, wherein The (meth)acrylic monomer (B) contains at least one or more of the compound represented by the following formula (b1) and the compound represented by the following formula (b2). In formula (b1), R 5 each independently represents a hydrogen atom or a methyl group, A represents a linear or branched aliphatic hydrocarbon group having 3 to 20 carbon atoms which may contain an oxygen atom, B represents one selected from a linear or branched aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain a heteroatom, an aromatic group, and a combination thereof, and m represents 2 to 8. In formula (b2), R 5 each independently represents a hydrogen atom or a methyl group, A' each independently represents a linear or branched aliphatic hydrocarbon group having 1 to 20 carbon atoms which may contain an oxygen atom, B' represents one selected from a linear or branched aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain a heteroatom, an aromatic group, and a combination thereof, m1 and m2 each independently represent 1 to 8, and n represents 0 or 1.

9. The photosensitive resin composition according to claim 2, wherein The (meth)acrylic monomer (C) contains the compound represented by the following formula (c1). In formula (c1), R 11 and R 12 each independently represents a hydrogen atom or a methyl group, Y 1 and Y 2 each independently represents a single bond, or an aliphatic hydrocarbon group having 1 to 26 carbon atoms in a straight chain or a branched chain which may contain an oxygen atom, X 11 represents an aliphatic hydrocarbon group or an aromatic group having 6 to 26 carbon atoms with a cyclic skeleton, W 1 and W 2 each independently represents O, N or S.

10. Use of the photosensitive resin composition according to any one of claims 1 to 9 for forming an insulating film.

11. An insulating cured film obtained by curing the photosensitive resin composition according to any one of claims 1 to 9.

12. An insulating cured film for a touch panel is obtained by curing the photosensitive resin composition according to any one of claims 1 to 9.

13. A touch panel includes the insulating cured film for a touch panel according to claim 12.

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