Semiconductor industry processing dust remover

Abstract

The invention belongs to the technical field of dust removal, and particularly relates to a semiconductor industry processing dust remover which comprises a dust removal box, a first cavity, a second cavity and a third cavity are arranged in the dust removal box, a partition plate is arranged between the second cavity and the third cavity, a round opening is formed in the partition plate, the second cavity and the third cavity are communicated through the round opening, and the first cavity and the second cavity are communicated through the round opening. A filter cartridge with an opening in the top and a U-shaped cover are fixedly installed at the bottom of the partition plate, the U-shaped cover is arranged on the outer side of the filter cartridge in a sleeving mode, a negative pressure fan is fixedly installed on the inner wall of the bottom of the first cavity, and a dust removal barrel is fixedly installed on an air outlet of the negative pressure fan; and a ventilation port is fixedly mounted at one end, far away from the negative pressure fan, of the filter cartridge. According to the mold crushing device, a mold in a hearth can be knocked and crushed through the crushing mechanism, and the crushed mold can be absorbed into the dust removal box through cooperation of the negative pressure fan and the dust collection mechanism, so that the situation that crushed slag flies around and dust flies after the mold is crushed is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of dust removal, and particularly to a dust collector for semiconductor industry processing. Background Art

[0002] The diffusion furnace is one of the important process equipment in the front process of the semiconductor production line, and is used for processes such as diffusion, oxidation, annealing, alloying, and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices, and optical fibers. The diffusion furnace cooperates with the quartz tube mold inside it, and is commonly used for high-temperature diffusion of semiconductor wafers to produce chips. The quartz tube mold for the diffusion furnace is arranged in the cavity of the diffusion furnace and is heated by heating the diffusion furnace. During the diffusion process, the silicon wafer to be diffused is placed in the center of the quartz tube mold for high-temperature diffusion.

[0003] After long-term use, the quartz tube mold will crack and be damaged. At present, usually, the damaged quartz tube mold is broken by manual means, and then a new quartz tube mold is installed. This replacement method is not only time-consuming and laborious, but also prone to dust flying during the process of breaking the quartz tube mold, and the safety is poor. Therefore, a dust collector for semiconductor industry processing is proposed. Summary of the Invention

[0004] In order to solve the deficiencies existing in the prior art, the present invention proposes a dust collector for semiconductor industry processing.

[0005] To achieve the above object, the present invention adopts the following technical solution: A dust collector for semiconductor industry processing includes a dust removal box. A chamber one, a chamber two, and a chamber three are provided inside the dust removal box. A partition plate is provided between the chamber two and the chamber three. A round opening is provided on the partition plate. The chamber two and the chamber three are connected through the round opening. A filter cylinder with an open top and a U-shaped cover are fixedly installed at the bottom of the partition plate. The U-shaped cover is sleeved outside the filter cylinder. A negative pressure fan is fixedly installed on the bottom inner wall of the chamber one. A dust removal cylinder is fixedly installed on the air outlet of the negative pressure fan. One end of the filter cylinder far from the negative pressure fan is fixedly installed with a ventilation port, and the ventilation port extends outside the dust removal box. A guide pipe is fixedly installed on the air inlet of the negative pressure fan, and the top end of the guide pipe extends into the chamber three. A knocking and back-blowing assembly for cleaning the filter cylinder is provided inside the filter cylinder. A communication mechanism is connected between the knocking and back-blowing assembly and the top end of the guide pipe. A connecting pipe is fixedly installed through the side of the dust removal box, and the connecting pipe is connected to the chamber two. A dust suction mechanism and a crushing mechanism for breaking and absorbing the quartz tube mold are connected to the connecting pipe.

[0006] Preferably, the dust suction mechanism includes a holding tube, a hose is connected between the holding tube and the connecting tube, a bracket is fixedly installed on the holding tube, the dust suction mechanism further includes a locking hoop fixedly connected to the outer side of the dust removal box, the crushing mechanism includes a crushing head, two connecting heads are arranged on the crushing head, one end of the holding tube away from the hose is detachably connected to one of the connecting heads, a feed port is formed in the crushing head, the feed port is communicated with the holding tube, air hammers are fixedly installed on both sides of the crushing head, and the crushing mechanism further includes a storage hopper fixedly connected to the outer side of the dust removal box.

[0007] Preferably, a hatch door is arranged on one side of the second chamber, a dust collecting cover is fixedly installed through the bottom inner wall of the second chamber, a dust collecting hopper is arranged below the dust collecting cover, and the top of the dust collecting hopper is in close fit with the bottom of the dust collecting cover.

[0008] Preferably, a cover plate is fixedly installed through the top inner wall of the third chamber, the knocking and backwashing assembly includes a shaking mechanism connected to the cover plate and a knocking mechanism movably installed inside the filter cartridge, two transmission screws are connected between the shaking mechanism and the knocking mechanism, the shaking mechanism includes a rotating prism penetrating through the cover plate and rotatably connected to the cover plate, a crank is fixedly installed at the top end of the rotating prism, the shaking mechanism further includes a plurality of L-shaped frames fixedly installed on the top of the partition plate and distributed in a circumferential array, the same top plate is fixedly installed at the top of the L-shaped frames, connecting plates are fixedly installed at the bottom ends of the plurality of L-shaped frames, the same annular ring is fixedly installed at one ends of the plurality of connecting plates close to each other, a rotating disk is rotatably installed inside the annular ring, a transmission rod and two rotating shafts are rotatably installed through the rotating disk, the transmission rod penetrates through the top plate and is rotatably connected to the top plate, and a groove adapted to the rotating prism is formed at the top end of the top plate, a large gear and two small gears are arranged between the top plate and the rotating disk, the two small gears are respectively fixedly sleeved on the corresponding rotating shafts, the large gear is fixedly sleeved on the rotating prism, the top ends of the two transmission screws are respectively fixedly connected to the bottom ends of the corresponding rotating shafts, the two small gears are both meshed with the large gear, and the same internal gear ring is sleeved and meshed on the two small gears, and the top of the internal gear ring is fixedly connected to the top of the top plate.

[0009] Preferably, the filter cartridge includes a fixing ring fixedly connected to the bottom of the partition plate and a bottom cover located below the fixing ring. A plurality of V-shaped filter plates distributed in a circumferential array are fixedly installed between the fixing ring and the bottom cover, and the plurality of V-shaped filter plates are connected end to end. The knocking mechanism includes a cross arm, and both transmission screws penetrate through the cross arm and are threadedly connected to the cross arm. Two frames are fixedly installed on the top of the cross arm. Guide rods are slidably installed through the two frames. Baffles are fixedly installed at one ends of the two guide rods close to each other, and knocking blocks are fixedly installed at one ends of the two guide rods away from each other. A first spring is slidably sleeved on the guide rod, and both ends of the first spring are fixedly connected to the baffle and the frame respectively.

[0010] Preferably, the tops of the two frames are rotatably installed with the same first ring plate. A second ring plate is sleeved outside the first ring plate. A plurality of second springs distributed in a circumferential array are fixedly installed between the first ring plate and the second ring plate. A plurality of V-shaped frames distributed in a circumferential array are fixedly installed outside the second ring plate, and the plurality of V-shaped frames are respectively slidably sleeved on the corresponding V-shaped filter plates.

[0011] Preferably, the communication mechanism includes a second annular box. The bottom of the second annular box is rotatably connected to the tops of the two second ring plates. The first ring plate is rotatably sleeved outside the second annular box. A plurality of spray heads distributed in a circumferential array are fixedly installed on the top of the second annular box. An inner annular box is rotatably installed inside the second annular box. The outer side of the inner annular box and the inner side of the second annular box are both open, and the plurality of spray heads are all communicated with the inner annular box through the second annular box. The communication mechanism further includes a three-way pipe fixedly connected to the top port of the air guide pipe. A spiral coiled pipe is connected between the three-way pipe and the inner annular box. The spiral coiled pipe penetrates through one of the connecting plates and is fixedly connected to the connecting plate. A plurality of fixed bent rods distributed in a circumferential array are fixedly installed outside the first ring plate, and one ends of the plurality of fixed bent rods away from the first ring plate are fixedly connected to the top of the inner annular box.

[0012] Preferably, the three-way pipe is provided with a first pipe head, a second pipe head and a third pipe head. The top end of the spiral coiled pipe is fixedly connected to the inner wall of the third pipe head. The first pipe head is fixedly connected to the inner wall of the top port of the filter cartridge. A first check valve and a second check valve are respectively fixedly installed in the third pipe head and the second pipe head.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] 1. The present invention can knock and crush the molds in the furnace through the crushing mechanism, and can absorb the crushed molds into the dust removal box through the cooperation of the negative pressure fan and the dust collection mechanism, avoiding the situation of flying debris and dust after the molds are crushed;

[0015] 2. The U-shaped cover can separate the recovered large and small particulate dust. Ensure that the large particulate dust directly falls into the ash hopper under the action of gravity, and ensure that the filter cartridge filters only the small particulate dust that is prone to fly. Then, through the knocking of the knocking and backwashing assembly, the crushing mechanism, and the backwashing of the negative pressure fan, the filter cartridge can be dredged from the inside outwards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the overall structure of a dust collector for semiconductor industry processing proposed by the present invention Figure 1 ;

[0017] Figure 2 Schematic diagram of the overall structure of a dust collector for semiconductor industry processing proposed by the present invention Figure 2 ;

[0018] Figure 3 Side sectional view of a dust collector for semiconductor industry processing proposed by the present invention Figure 1 ;

[0019] Figure 4 Side sectional view of a dust collector for semiconductor industry processing proposed by the present invention Figure 2 ;

[0020] Figure 5 is Figure 2 Enlarged structural schematic diagram of part A in

[0021] Figure 6 Schematic diagram of the structure of the filter cartridge, partition plate, knocking and backwashing assembly, and communication mechanism in a dust collector for semiconductor industry processing proposed by the present invention

[0022] Figure 7 Schematic diagram of the structure of the communication mechanism and knocking and backwashing assembly in a dust collector for semiconductor industry processing proposed by the present invention

[0023] Figure 8 Side sectional view of the shaking mechanism in a dust collector for semiconductor industry processing proposed by the present invention

[0024] Figure 9 Schematic diagram of the structure of the knocking mechanism in a dust collector for semiconductor industry processing proposed by the present invention

[0025] Figure 10 Schematic diagram of the structure of the communication mechanism in a dust collector for semiconductor industry processing proposed by the present invention

[0026] Figure 11 Partial top sectional view of the communication mechanism in a dust collector for semiconductor industry processing proposed by the present invention.

[0027] In the figure: 1. Dust removal box; 11. Chamber one; 12. Chamber two; 13. Chamber three; 14. Warehouse door; 15. U-shaped cover; 16. Ash hopper; 17. Partition board; 171. Round opening; 18. Cover plate; 19. Ash collection cover; 2. Connecting pipe; 3. Negative pressure fan; 4. Air guide pipe; 5. Filter cartridge; 51. Fixed ring; 52. V-shaped filter plate; 53. Bottom cover; 6. Dust suction mechanism; 61. Hose; 62. Holding pipe; 63. Locking hoop; 64. Bracket; 7. Connecting mechanism; 71. Three-way pipe; 711. Pipe head one; 712. Pipe head two; 713. Pipe head three; 72. Ring-shaped box one; 73. Ring-shaped box two; 74. Sprayer; 75. Spirally coiled pipe; 76. Check valve one; 77. Check valve two; 8. Knocking and back-blowing assembly; 81. Shaking mechanism; 811. Rotating prism; 812. Crank; 813. L-shaped frame; 814. Connecting plate; 815. Ring; 816. Rotating disk; 817. Internal gear ring; 818. Large gear; 819. Rotating shaft; 8110. Small gear; 8111. Transmission rod; 8112. Top plate; 8113. Groove; 82. Transmission screw; 83. Knocking mechanism; 831. Cross arm; 832. Frame; 833. Guide rod; 834. Knocking block; 835. Baffle; 836. Spring one; 837. Ring plate one; 838. Ring plate two; 839. V-shaped frame; 8310. Spring two; 8311. Fixed bent rod; 9. Crushing mechanism; 91. Crushing head; 911. Connector; 92. Pneumatic hammer; 93. Feeding port; 94. Storage hopper; 10. Dust removal cylinder; 101. Venting port. Detailed implementation mode

[0028] Next, the technical solutions of the present invention will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Please refer to Figures 1 - 11, the present invention provides a technical solution: a dust collector for semiconductor industry processing, including a dust removal box 1. Inside the dust removal box 1, there are a first chamber 11, a second chamber 12 and a third chamber 13. A partition plate 17 is provided between the second chamber 12 and the third chamber 13. A circular opening 171 is formed on the partition plate 17. The second chamber 12 and the third chamber 13 are connected through the circular opening 171. At the bottom of the partition plate 17, a filter cylinder 5 with an open top and a U-shaped cover 15 are fixedly installed. The U-shaped cover 15 is sleeved outside the filter cylinder 5. On the bottom inner wall of the first chamber 11, a negative pressure fan 3 is fixedly installed. An air dust removal cylinder 10 is fixedly installed at the air outlet of the negative pressure fan 3. One end of the filter cylinder 5 far from the negative pressure fan 3 is fixedly installed with a ventilation port 101, and the ventilation port 101 extends outside the dust removal box 1. A guide pipe 4 is fixedly installed at the air inlet of the negative pressure fan 3, and the top end of the guide pipe 4 extends into the third chamber 13. Inside the filter cylinder 5, there is a knocking and back-blowing assembly 8 for cleaning it. A communication mechanism 7 is connected between the knocking and back-blowing assembly 8 and the top end of the guide pipe 4. A connecting pipe 2 is fixedly installed through the side of the dust removal box 1, and the connecting pipe 2 is connected to the second chamber 12. A dust suction mechanism 6 and a crushing mechanism 9 for knocking and absorbing a quartz tube mold are connected to the connecting pipe 2.

[0030] The dust suction mechanism 6 includes a holding pipe 62. A hose 61 is connected between the holding pipe 62 and the connecting pipe 2. A bracket 64 is fixedly installed on the holding pipe 62. The dust suction mechanism 6 further includes a locking hoop 63 fixedly connected to the outside of the dust removal box 1. The crushing mechanism 9 includes a crushing head 91. There are two connecting heads 911 on the crushing head 91. One end of the holding pipe 62 far from the hose 61 is detachably connected to one of the connecting heads 911. A feeding port 93 is formed on the crushing head 91, and the feeding port 93 is communicated with the holding pipe 62. Air hammers 92 are fixedly installed on both sides of the crushing head 91. The crushing mechanism 9 further includes a storage hopper 94 fixedly connected to the outside of the dust removal box 1.

[0031] Further, the connecting head 911 is in a closed state when the holding pipe 62 is not connected, and is in an open state when the holding pipe 62 is connected. By installing another spare holding pipe 62 on the other connecting head 911 without the holding pipe 62 installed and blocking the end of the holding pipe 62 far from the connecting head 911, then the crushing head 91 can be manipulated by holding the two holding pipes 62 at both ends of the furnace. This operation is more labor-saving. Also, a camera can be installed on the bracket 64 to observe the position where the mold needs to be knocked in real time.

[0032] One side of the second chamber 12 is provided with a hatch 14. A dust collecting cover 19 is fixedly installed through the bottom inner wall of the second chamber 12. A dust collecting hopper 16 is provided below the dust collecting cover 19, and the top of the dust collecting hopper 16 is in close contact with the bottom of the dust collecting cover 19.

[0033] Further, a plurality of universal wheels are provided at the bottom of the ash hopper 16. When the dust in the ash hopper 16 needs to be dumped, the ash hopper 16 can be simply pulled out from below the dust collection hood 19. The two sides of the ash hopper 16 are detachably connected to the inner walls of the two sides of the dust removal box 1 through buckles, so as to ensure that when the ash hopper 16 and the dust removal box 1 are connected together, they can be connected into a whole through the buckles and moved. One side of the opening of the U-shaped cover 15 abuts against the hatch door 14.

[0034] A cover plate 18 is fixedly installed through the top inner wall of the third chamber 13. The knocking and backwashing assembly 8 includes a shaking mechanism 81 connected to the cover plate 18 and a knocking mechanism 83 movably installed inside the filter cartridge 5. Two transmission screws 82 are connected between the shaking mechanism 81 and the knocking mechanism 83. The shaking mechanism 81 includes a rotating prism 811 penetrating through the cover plate 18 and rotatably connected to the cover plate 18. A crank 812 is fixedly installed at the top end of the rotating prism 811. The shaking mechanism 81 further includes a plurality of L-shaped frames 813 fixedly installed at the top of the partition plate 17 and distributed in a circumferential array. The same top plate 8112 is fixedly installed at the top of the L-shaped frames 813. The bottom ends of the plurality of L-shaped frames 813 are all fixedly installed with connecting plates 814. The same annular ring 815 is fixedly installed at one end where the plurality of connecting plates 814 are close to each other. A rotating disk 816 is rotatably installed inside the annular ring 815. A transmission rod 8111 and two rotating shafts 819 are rotatably installed through the rotating disk 816. The transmission rod 8111 penetrates through the top plate 8112 and is rotatably connected to the top plate 8112. A groove 8113 adapted to the rotating prism 811 is provided at the top end of the top plate 8112. A large gear 818 and two small gears 8110 are provided between the top plate 8112 and the rotating disk 816. The two small gears 8110 are respectively fixedly sleeved on the corresponding rotating shafts 819. The large gear 818 is fixedly sleeved on the rotating prism 811. The top ends of the two transmission screws 82 are respectively fixedly connected to the bottom ends of the corresponding rotating shafts 819. The two small gears 8110 are both meshed with the large gear 818. An internal gear ring 817 is sleeved and meshed on the two small gears 8110. The top of the internal gear ring 817 is fixedly connected to the top of the top plate 8112.

[0035] The filter cartridge 5 includes a fixing ring 51 fixedly connected to the bottom of the partition plate 17 and a bottom cover 53 located below the fixing ring 51. A plurality of V-shaped filter plates 52 distributed in a circumferential array are fixedly installed between the fixing ring 51 and the bottom cover 53. The plurality of V-shaped filter plates 52 are connected end to end. The knocking mechanism 83 includes a cross arm 831. Both transmission screws 82 penetrate through the cross arm 831 and are threadedly connected to the cross arm 831. Two frames 832 are fixedly installed on the top of the cross arm 831. Guide rods 833 are slidably installed through both frames 832. Baffles 835 are fixedly installed at one ends of the two guide rods 833 close to each other. Knocking blocks 834 are fixedly installed at one ends of the two guide rods 833 away from each other. A first spring 836 is slidably sleeved on the guide rod 833. Both ends of the first spring 836 are fixedly connected to the baffle 835 and the frame 832 respectively.

[0036] A same annular plate one 837 is rotatably installed on the tops of the two frames 832. An annular plate two 838 is sleeved outside the annular plate one 837. A plurality of second springs 8310 distributed in a circumferential array are fixedly installed between the annular plate one 837 and the annular plate two 838. A plurality of V-shaped frames 839 distributed in a circumferential array are fixedly installed on the outside of the annular plate two 838. The plurality of V-shaped frames 839 are respectively slidably sleeved on the corresponding V-shaped filter plates 52.

[0037] Further, under the combined action of the first spring 836, during the rotation of the cross arm 831, the two guide rods 833 will drive the two knocking blocks 834 to knock on each V-shaped frame 839 in sequence. After being knocked, the V-shaped frame 839 can transmit the vibration to the adjacent V-shaped filter plate 52.

[0038] The communication mechanism 7 includes an annular box two 73. The bottom of the annular box two 73 is rotatably connected to the tops of the two annular plates two 838. The annular plate one 837 is rotatably sleeved outside the annular box two 73. A plurality of nozzles 74 distributed in a circumferential array are fixedly installed on the top of the annular box two 73. An annular box one 72 is rotatably installed inside the annular box two 73. The outside of the annular box one 72 and the inside of the annular box two 73 are both open, and the plurality of nozzles 74 are all communicated with the annular box one 72 through the annular box two 73. The communication mechanism 7 further includes a tee 71 fixedly connected to the top port of the air guide pipe 4. A spiral coiled pipe 75 is connected between the tee 71 and the annular box one 72. The spiral coiled pipe 75 penetrates through one of the connecting plates 814 and is fixedly connected to the connecting plate 814. A plurality of fixed bent rods 8311 distributed in a circumferential array are fixedly installed on the outside of the annular plate one 837. One ends of the plurality of fixed bent rods 8311 away from the annular plate one 837 are all fixedly connected to the top of the annular box one 72.

[0039] The three-way pipe 71 is provided with a first pipe head 711, a second pipe head 712 and a third pipe head 713. The top end of the spiral coiled pipe 75 is fixedly connected to the inner wall of the third pipe head 713. The top end port inner wall of the first pipe head 711 and the filter cartridge 5 are fixedly connected. A first check valve 76 and a second check valve 77 are respectively and fixedly installed in the third pipe head 713 and the second pipe head 712.

[0040] Further, during dust collection, external air enters the holding pipe 62 through the feed port 93, then flows through the hose 61 and the connecting pipe 2 and enters the second chamber 12. After being filtered by the filter cartridge 5, the air enters the third chamber 13 through the top opening of the filter cartridge 5. Subsequently, the air flows through the second pipe head 712, then through the first pipe head 711 and enters the air guide pipe 4. During this process, the second check valve 77 is in an open state, while the first check valve 76 is in a closed state.

[0041] When backwashing and dust removing the filter cartridge 5, the air discharged from the air guide pipe 4 enters the first pipe head 711 and then enters the spiral coiled pipe 75 through the third pipe head 713. During this process, the second check valve 77 is in a closed state, and the first check valve 76 is in an open state.

[0042] In this embodiment: during use, the negative pressure fan 3 is started to make the inside of the holding pipe 62 in a negative pressure state, and the two pneumatic hammers 92 are connected to the pipeline supplying compressed air. When crushing the mold in the furnace, the crushing head 91 is aligned with the mold in the furnace by holding the holding pipe 62, and the feed port 93 is facing the mold. When the crushing head 91 is close to the mold, the two pneumatic hammers 92 supplied with compressed air will drive the crushing head 91 to knock the mold at a high frequency. After the mold dust crushed by the knocking enters the holding pipe 62 through the feed port 93, it then enters the second chamber 12 through the hose 61 and the connecting pipe 2.

[0043] Among the mold dust entering the second chamber 12, the large particle dust will automatically fall after hitting the U-shaped cover 15 and be gathered in the ash hopper 16 through the ash collecting cover 19, and the small particle dust will adhere to the outer wall of the filter cartridge 5.

[0044] When the dust on the outer wall of the filter cartridge 5 is too much and the air permeability becomes poor, the negative pressure fan 3 is started for backwashing. External air enters the dust removal cylinder 10 through the ventilation port 101 and then is discharged from the air guide pipe 4 after being filtered by the dust removal cylinder 10. The backwashing air enters the first pipe head 711 and then is discharged through the third pipe head 713 and enters the spiral coiled pipe 75. The backwashing air then enters the first annular box 72 and the second annular box 73 and is then sprayed out through a plurality of nozzles 74. The backwashing air sprayed out from the plurality of nozzles 74 will backwash and dredge the filter cartridge 5 from the inside to the outside.

[0045] When backwashing the filter cartridge 5, the crank 812 can also be rotated to drive the rotating prism 811 to rotate. The rotating prism 811 then drives the transmission rod 8111 to rotate, and the transmission rod 8111 drives the large gear 818 to rotate. The rotating large gear 818 cooperates with the internal gear ring 817, so that the two small gears 8110 drive the two rotating shafts 819 to revolve around the transmission rod 8111 while also rotating on their own axes. The two rotating transmission screws 82 will drive the cross arm 831 to move up and down inside the filter cartridge 5. When the cross arm 831 drives the multiple V-shaped frames 839 to move up and down inside the filter cartridge 5, the two transmission screws 82 will also drive the cross arm 831 to rotate on its own axis. The rotating cross arm 831 then drives the two knocking blocks 834 to knock on each V-shaped frame 839 in sequence through the two frames 832. The vibrating V-shaped frames 839 can transfer the vibration to each V-shaped filter plate 52 after being knocked. After being vibrated, the V-shaped filter plates 52 can shake off the dust attached to their outer sides. And during the rotation of the cross arm 831, it also drives the second annular box 73 to rotate, and the second annular box 73 drives the multiple nozzles 74 to rotate. Therefore, during the up and down movement of the second annular box 73 inside the filter cartridge 5, the multiple nozzles 74 will also move spirally up and down inside the filter cartridge 5, so as to perform all-round backwashing on the inside of the filter cartridge 5.

[0046] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A dust collector for semiconductor industry processing, comprising a dust removal box (1), characterized in that: The dust removal box (1) is provided with chamber one (11), chamber two (12) and chamber three (13); a partition plate (17) is provided between chamber two (12) and chamber three (13); a circular opening (171) is provided on the partition plate (17); chamber two (12) and chamber three (13) are connected via the circular opening (171); a filter cartridge (5) having an opening at the top and a U-shaped cover (15) are fixedly installed at the bottom of the partition plate (17); the U-shaped cover (15) is sleeved on the outside of the filter cartridge (5); a negative pressure fan (3) is fixedly installed on the inner wall of the bottom of the chamber one (11); a dust removal cartridge (10) is fixedly installed on the air outlet of the negative pressure fan (3); the filter cartridge (5) is away from the negative pressure fan (3); A ventilation port (101) is fixedly installed at one end of the air compressor (3), and the ventilation port (101) extends to the outside of the dust removal box (1). An air guide pipe (4) is fixedly installed on the air inlet of the negative pressure fan (3), and the top end of the air guide pipe (4) extends into the chamber three (13). A knocking back-blowing component (8) for cleaning the filter cartridge (5) is provided in the filter cartridge (5), and a connecting mechanism (7) is connected between the knocking back-blowing component (8) and the top end of the air guide pipe (4). A connecting pipe (2) is fixedly installed on the side of the dust removal box (1) in a penetrating manner, and the connecting pipe (2) is connected to the chamber two (12). The connecting pipe (2) is connected to a dust suction mechanism (6) and a crushing mechanism (9) for crushing and absorbing the quartz tube mold.

2. A semiconductor industry processing dust collector according to claim 1, characterized in that: The dust suction mechanism (6) comprises a holding tube (62), a hose (61) is connected between the holding tube (62) and the connecting tube (2), a bracket (64) is fixedly mounted on the holding tube (62), the dust suction mechanism (6) also comprises a locking clamp (63) fixedly connected to the outside of the dust removal box (1), the crushing mechanism (9) comprises a crushing head (91), the crushing head (91) is provided with two connecting heads (911), one end of the holding tube (62) away from the hose (61) is detachably connected to one of the connecting heads (911), the crushing head (91) is provided with a feed port (93), the feed port (93) is connected to the holding tube (62), air hammers (92) are fixedly mounted on both sides of the crushing head (91), and the crushing mechanism (9) also comprises a storage bucket (94) fixedly connected to the outside of the dust removal box (1).

3. A semiconductor industry processing dust collector according to claim 1, characterized in that: A door (14) is provided on one side of the chamber 2 (12); an ash collecting cover (19) is fixedly installed through the inner wall of the bottom of the chamber 2 (12); an ash hopper (16) is provided below the ash collecting cover (19); the top of the ash hopper (16) and the bottom of the ash collecting cover (19) are tightly fitted.

4. A semiconductor industry processing dust collector according to claim 1, characterized in that: A cover plate (18) is fixedly installed on the top inner wall of the chamber three (13); the knocking backflush assembly (8) comprises a shaking mechanism (81) connected to the cover plate (18) and a knocking mechanism (83) movably installed inside the filter cartridge (5); two transmission screws (82) are connected between the shaking mechanism (81) and the knocking mechanism (83); the shaking mechanism (81) comprises a rotating prism (811) that passes through the cover plate (18) and is rotatably connected to the cover plate (18); the rotating prism (811) ) is fixedly mounted on the top of the partition plate (17) with a crank handle (812), the shaking mechanism (81) further comprising a plurality of L-shaped frames (813) fixedly mounted on the top of the partition plate (17) and distributed in a circumferential array, the top of the L-shaped frames (813) being fixedly mounted with a same top plate (8112), the bottom ends of the plurality of L-shaped frames (813) being fixedly mounted with a connecting plate (814), the ends of the plurality of connecting plates (814) being close to each other being fixedly mounted with a same annular ring (815), and a rotating shaft (816) being rotatably mounted in the annular ring (815) A rotating disk (816) is provided with a transmission rod (8111) and two rotating shafts (819) which are rotatably installed on the rotating disk (816). The transmission rod (8111) passes through the top plate (8112) and is rotatably connected to the top plate (8112). A prism groove (8113) which is matched with the rotating prism (811) is provided at the top of the top plate (8112). A large gear (818) and two small gears (8110) are provided between the top plate (8112) and the rotating disk (816). The two small gears (8110) are connected to the rotating disk (816). The wheels (8110) are fixedly mounted on the corresponding rotating shafts (819), the large gear (818) is fixedly mounted on the rotating prism (811), the top ends of the two transmission screws (82) are fixedly connected to the bottom ends of the corresponding rotating shafts (819), the two small gears (8110) are meshed with the large gear (818), and the two small gears (8110) are mounted with the same inner gear ring (817) meshed with each other, and the top of the inner gear ring (817) is fixedly connected to the top of the top plate (8112).

5. A semiconductor industry processing dust collector according to claim 4, characterized in that: The filter cartridge (5) comprises a fixing ring (51) fixedly connected to the bottom of the partition plate (17) and a bottom cover (53) located below the fixing ring (51); a plurality of V-shaped filter plates (52) distributed in a circumferential array are fixedly installed between the fixing ring (51) and the bottom cover (53); the plurality of V-shaped filter plates (52) are connected end to end; the knocking mechanism (83) comprises a cross arm (831); the two transmission screws (82) both penetrate the cross arm (831) and are threadedly connected to the cross arm (831); the cross arm Two frames (832) are fixedly installed on the top of (831), and guide rods (833) are slidably installed on both frames (832). The ends of the two guide rods (833) close to each other are fixedly installed with baffles (835), and the ends of the two guide rods (833) away from each other are fixedly installed with knocking blocks (834). A spring (836) is slidably sleeved on the guide rods (833), and the two ends of the spring (836) are fixedly connected to the baffle (835) and the frame (832) respectively.

6. A semiconductor industry processing dust collector according to claim 5, characterized in that: The tops of the two frames (832) are rotatably mounted with a same ring plate 1 (837), the outer side of the ring plate 1 (837) is sleeved with a ring plate 2 (838), a plurality of springs 2 (8310) distributed in a circular array are fixedly mounted between the ring plate 1 (837) and the ring plate 2 (838), a plurality of V-shaped frames (839) distributed in a circular array are fixedly mounted on the outer side of the ring plate 2 (838), and the plurality of V-shaped frames (839) are respectively slidably sleeved on corresponding V-shaped filter plates (52).

7. A semiconductor industry processing dust collector according to claim 6, characterized in that: The connecting mechanism (7) comprises an annular box (73), the bottom of the annular box (73) is rotatably connected to the top of two annular plates (838), the annular plate (837) is rotatably sleeved on the outside of the annular box (73), a plurality of nozzles (74) distributed in a circumferential array are fixedly installed on the top of the annular box (73), an annular box (72) is rotatably installed on the inside of the annular box (73), the outside of the annular box (72) and the inside of the annular box (73) are both opened, and the plurality of nozzles (74) are connected to the annular box (73) and the annular box (73). 2), the connecting mechanism (7) further comprising a three-way pipe (71) fixedly connected to the top port of the air guide pipe (4), a spirally coiled pipe (75) being connected between the three-way pipe (71) and the annular box (72), the spirally coiled pipe (75) passing through one of the connecting plates (814) and being fixedly connected to the connecting plate (814), a plurality of fixed bent rods (8311) distributed in a circumferential array being fixedly mounted on the outer side of the annular plate (837), the ends of the plurality of fixed bent rods (8311) away from the annular plate (837) being fixedly connected to the top of the annular box (72).

8. A semiconductor industry processing dust collector according to claim 7, characterized in that: The three-way pipe (71) is provided with a pipe head one (711), a pipe head two (712) and a pipe head three (713); the top end of the spirally coiled pipe (75) is fixedly connected to the inner wall of the pipe head three (713); the pipe head one (711) is fixedly connected to the inner wall of the top end port of the filter cartridge (5); and the pipe head three (713) and the pipe head two (712) are respectively fixedly installed with a check valve one (76) and a check valve two (77).

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