Processing equipment for manufacturing semiconductor device

Abstract

The invention belongs to the technical field of semiconductor device manufacturing and processing, and particularly relates to semiconductor device manufacturing processing equipment which comprises a base and a mechanical arm fixedly arranged at the top of the base, a dust removal mechanism is fixedly arranged at one end of the mechanical arm, and a wafer polishing mechanism is fixedly arranged at the bottom end of the dust removal mechanism. A pneumatic lifting mechanism is fixedly arranged at the top of the base, when a wafer clamped by the wafer clamping mechanism needs to be turned over, the clamping air bag is inflated through the air nozzle, the wafer is clamped through the clamping air bag, then a valve on the air outlet is closed, at the moment, the air pressure in the hollow stand column can be continuously increased, and the wafer can be turned over. The piston assembly in the pneumatic lifting mechanism is pushed by air pressure to be jacked upwards, the ejector rod can be synchronously driven to ascend when the piston assembly is jacked upwards, the wafer clamping mechanism can be jacked up synchronously through the ejector rod, a wafer needing to be polished can be turned over conveniently, and the back face of the wafer can be polished conveniently.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device manufacturing and processing, and in particular relates to processing equipment for semiconductor device manufacturing. Background Art

[0002] In the current booming semiconductor industry, wafers, as the basic core components of integrated circuits, undergo a manufacturing process that includes numerous sophisticated and complex steps, including photolithography, etching, coating, and grinding. These processes place stringent demands on the automation, precision control, and stability of the processing equipment. Furthermore, wafers, as the substrates of semiconductor devices, require extremely high alignment accuracy and a clean environment during processing. Any minor flaws or contamination can lead to a decrease in yield, impacting the entire electronics industry chain.

[0003] After the wafer is sliced, its surface needs to be polished by semiconductor device manufacturing processing equipment. The existing semiconductor device manufacturing processing equipment has poor self-cleaning effect. The particle waste generated during the polishing process is easily adsorbed on the wafer surface or accumulated on the polishing table, which will affect the normal polishing of the wafer. In addition, the existing semiconductor device manufacturing processing equipment cannot flip the wafer well, which is not convenient for polishing the back of the wafer.

[0004] In order to solve the above problems, this application proposes a processing equipment for manufacturing semiconductor devices. Summary of the Invention

[0005] The present invention provides a processing equipment for manufacturing semiconductor devices, which can effectively solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a processing equipment for manufacturing semiconductor devices, comprising a base and a robotic arm fixedly mounted on the top of the base, a dust removal mechanism fixedly mounted on one end of the robotic arm, a wafer polishing mechanism fixedly mounted on the bottom end of the dust removal mechanism, a pneumatic lifting mechanism fixedly mounted on the top of the base, a polishing protective cover and a wafer clamping mechanism mounted on the top end of the pneumatic lifting mechanism, and a negative pressure suction cup fixedly mounted on the bottom of the inner cavity of the polishing protective cover;

[0007] The pneumatic lifting mechanism includes a hollow column fixedly arranged on the top of the base and an air outlet with a valve arranged on the outside of the bottom end of the hollow column. A first channel is opened on the hollow column, and a pressure relief port is provided on the inside of the first channel. A piston assembly is provided inside the hollow column, and a push rod is fixedly provided on the top of the piston assembly. A return spring is provided on the outside of the push rod, and the two ends of the return spring are respectively fixedly connected to the hollow column and the piston assembly.

[0008] Preferably, the dust removal mechanism includes a dust removal box and an electric telescopic rod fixedly arranged at the end of the robotic arm, the bottom end of the electric telescopic rod is fixedly connected to a filter frame, and the filter frame is passed through the dust removal box, and a filter mesh plate is fixedly provided in the inner cavity of the filter frame, and a corrugated hose is provided on one side of the dust removal box, and the end of the corrugated hose away from the dust removal box is connected to the hollow column, and an air pump is connected to the corrugated hose.

[0009] Preferably, the wafer polishing mechanism includes a driving motor and an extension table fixedly arranged at the bottom end and one side of the bottom end of the dust removal box, the end of the output shaft of the driving motor is fixedly connected to a driving gear, the extension table is rotatably connected to a hollow rod through a bearing, the top of the hollow rod is rotatably connected to a dust suction pipe through a bearing, and the outer side and bottom end of the bottom end of the hollow rod are respectively fixed with a linkage gear and a wafer polishing head.

[0010] Preferably, one end of the dust suction pipe away from the hollow rod is connected to the dust removal box, and the linkage gear is meshed with the driving gear.

[0011] Preferably, the wafer grinding head includes a dust hood fixedly arranged at the bottom end of a hollow rod and a wafer grinding disc, a slot is provided at the bottom end of the dust hood, a limiting hole is provided on the outside of the slot, a plug-in block is fixedly provided on the top of the wafer grinding disc, a spring clip is provided on the plug-in block, a chip collecting groove is provided at the bottom of the wafer grinding disc, and dust collection holes are equidistantly provided in the chip collecting groove.

[0012] Preferably, the plug-in block matches the slot, and the spring buckle matches the limiting hole.

[0013] Preferably, the polishing protective cover includes an outer cover body and a second channel opened on the outer cover body, a polishing table is fixedly provided at the bottom of the inner cavity of the outer cover body, the polishing table is connected with the second channel, and a first purge nozzle is circumferentially provided on the outer side of the polishing table, a purge pipe fitting is circumferentially provided on the top of the outer cover body, and a second purge nozzle is provided at one end of the purge pipe fitting.

[0014] Preferably, a through opening is provided between the second channel and the first channel, and the second channel and the first channel are connected through the through opening.

[0015] Preferably, an electrostatic dust removal plate is fixedly provided on the inner wall of the outer cover.

[0016] Preferably, the wafer clamping mechanism includes an annular lifting platform fixedly arranged on the top of the ejector rod, a rotating motor is fixedly arranged on the outside of the annular lifting platform, an annular clamping frame is fixedly connected to the end of the output shaft of the rotating motor, a clamping airbag is fixedly arranged on the inside of the annular clamping frame, and an air nozzle is provided on the side of the annular lifting platform away from the rotating motor;

[0017] The air nozzle is coaxially arranged with an output shaft at one end of the rotating motor, and one end of the air nozzle is rotatably connected to the annular clamping frame through a bearing.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. By setting up a wafer polishing mechanism, the driving motor on the wafer polishing mechanism can drive the driving gear to rotate, and when the driving gear rotates, the hollow rod can be driven to rotate through the linkage gear, and the wafer polishing head can be driven to rotate quickly through the hollow rod to polish the wafer surface. The wafer polishing disc at the bottom of the wafer polishing head is fixed with a spring clip and a limit hole, which is convenient for disassembly and replacement. The wafer polishing mechanism is controlled by a robotic arm to move on the wafer surface to polish the wafer surface. At the same time, the vacuum pump on the dust removal mechanism can absorb and clean the waste chips generated during wafer surface polishing through the chip collection groove and dust suction hole opened at the bottom of the corrugated hose and the wafer polishing disc, so as to avoid the waste chips being sandwiched between the wafer and the wafer polishing disc or accumulating on the polishing table, which affects the polishing accuracy of the wafer.

[0020] 2. The filter screen set inside the dust box can intercept and filter the absorbed and cleaned waste particles. By controlling the contraction of the electric telescopic rod, the filter frame and the filter screen can be pulled out of the dust box, which is convenient for cleaning or replacing the filter screen. While the dust removal mechanism is sucking dust, the vacuum pump can blow the purified gas filtered by the filter screen into the pneumatic lifting mechanism through the corrugated hose. Under normal circumstances, the air outlet on the outside of the pneumatic lifting mechanism is in an open state. When blowing air, the piston assembly inside the pneumatic lifting mechanism will not be affected by the air pressure and rise. When the wafer clamping machine needs to be adjusted, the air outlet on the outside of the pneumatic lifting mechanism is in an open state. When blowing air, the piston assembly inside the pneumatic lifting mechanism will not be affected by the air pressure and rise. When the wafer clamped by the pneumatic lifting mechanism is flipped, the clamping airbag is first inflated through the air nozzle to clamp the wafer, and then the valve on the air outlet is closed. At this time, the air pressure in the hollow column will continue to increase, and the piston assembly in the pneumatic lifting mechanism will be pushed upward under the push of the air pressure. When the piston assembly is pushed upward, it can simultaneously drive the ejector rod to rise, and the wafer clamping mechanism can be lifted up by the ejector rod, so that there is enough flipping space between the wafer clamping mechanism and the polishing table, which is convenient for flipping the wafer to be polished and polishing the back of the wafer.

[0021] 3. When the pneumatic lifting mechanism rises to a certain height under the push of air pressure, the piston assembly on the pneumatic lifting mechanism is higher than the pressure relief port, and excess gas will be discharged from the pressure relief port, which not only prevents the air pressure in the pneumatic lifting mechanism from continuing to rise and causing damage, but also the gas discharged from the pressure relief port is transported into the second channel through the first channel, and finally blown out from the first purge nozzle and the second purge nozzle, which can respectively purge and clean the waste chips at the bottom of the inner cavity of the polishing protective cover and the surface of the wafer, and can prevent waste chip particles from remaining on the negative pressure suction cup on the top of the polishing table and on the surface of the wafer to affect the polishing process. The electrostatic dust removal plate can electrostatically adsorb and remove the waste chips generated during the polishing process or the waste chips scattered during the purging of the first purge nozzle and the second purge nozzle. The dust removal mechanism suspended above the polishing protective cover can further remove the dust scattered in the air by negative pressure adsorption, and the dust removal effect is good.

[0022] 4. After the wafer clamping mechanism is lifted to a certain height by the ejector rod, the circular clamping frame is driven by the rotary motor on the wafer clamping mechanism to rotate 180 degrees to flip the wafer to be polished. After the wafer is flipped, the valve on the air outlet is opened to relieve the pressure on the pneumatic lifting mechanism. At this time, the piston assembly and the ejector rod on the pneumatic lifting mechanism will drive the wafer clamping mechanism to move downward for reset under the action of the reset spring. When the wafer clamping mechanism is reset, the wafer clamped on the wafer clamping mechanism will fall back onto the polishing table. At this time, the clamping airbag is depressurized through the air nozzle, and then the wafer can be fixed by negative pressure adsorption through the negative pressure suction cup set on the top of the polishing table, which can effectively prevent the wafer from shaking during polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 This is a schematic diagram of the overall structure of a processing equipment for manufacturing semiconductor devices according to the present invention;

[0025] Figure 2 Schematic diagram of the connection structure of the robot arm, dust removal mechanism and wafer polishing mechanism in the present invention;

[0026] Figure 3 Schematic diagram of the cross-sectional structure of the dust removal box in the present invention;

[0027] Figure 4 Schematic diagram of the connection structure between the dust removal mechanism and the wafer polishing mechanism in the present invention;

[0028] Figure 5 For the present invention Figure 4 A in the figure shows the enlarged structural diagram;

[0029] Figure 6 It is a schematic structural diagram of the polishing protective cover in the present invention;

[0030] Figure 7 This is a schematic cross-sectional view of the pneumatic lifting mechanism and the polishing protective cover in the present invention from a first perspective;

[0031] Figure 8 A schematic cross-sectional view of the pneumatic lifting mechanism and the polishing protective cover of the present invention from a second perspective;

[0032] Figure 9 For the present invention Figure 8 The enlarged structural diagram at B in FIG.

[0033] In the figure: 1. base;

[0034] 2. Robotic arm;

[0035] 3. Dust removal mechanism; 301. Dust removal box; 302. Electric telescopic rod; 303. Filter frame; 304. Filter screen; 305. Corrugated hose; 306. Air pump;

[0036] 4. Wafer polishing mechanism; 401. Drive motor; 402. Extension table; 403. Drive gear; 404. Hollow rod; 405. Dust collection pipe; 406. Linkage gear; 407. Wafer polishing head; 4071. Dust collection hood; 4072. Wafer polishing disc; 4073. Slot; 4074. Limiting hole; 4075. Connecting block; 4076. Spring buckle; 4077. Chip collection groove; 4078. Dust collection hole;

[0037] 5. Pneumatic lifting mechanism; 501. Hollow column; 502. Air outlet; 503. First channel; 504. Pressure relief port; 505. Piston assembly; 506. Ejector rod; 507. Return spring;

[0038] 6. Polishing protective cover; 601. Outer cover; 602. Second channel; 603. Polishing table; 604. First purge nozzle; 605. Purge pipe; 606. Second purge nozzle;

[0039] 7. Wafer clamping mechanism; 701. Annular lifting platform; 702. Rotating motor; 703. Annular clamping frame; 704. Clamping airbag; 705. Air nozzle;

[0040] 8. Negative pressure suction cup. DETAILED DESCRIPTION

[0041] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0042] Examples, such as Figure 1-9 As shown, a processing equipment for manufacturing semiconductor devices includes a base 1 and a robot arm 2 fixedly arranged on the top of the base 1, a dust removal mechanism 3 is fixedly provided at one end of the robot arm 2, a wafer polishing mechanism 4 is fixedly provided at the bottom end of the dust removal mechanism 3, a pneumatic lifting mechanism 5 is fixedly provided on the top of the base 1, a polishing protective cover 6 and a wafer clamping mechanism 7 are provided at the top end of the pneumatic lifting mechanism 5, a negative pressure suction cup 8 is fixedly provided at the bottom of the inner cavity of the polishing protective cover 6, and the wafer polishing mechanism 4 is controlled by the robot arm 2 to move on the wafer surface to polish the wafer surface. At the same time, the vacuum pump 306 on the dust removal mechanism 3 can absorb and clean the waste particles generated during the polishing of the wafer surface through the corrugated hose 305 and the chip collecting groove 4077 and the dust suction hole 4078 opened at the bottom end of the wafer polishing disk 4072, so as to prevent the waste particles from being sandwiched between the wafer and the wafer polishing disk 4072 or accumulating on the polishing table 603, thereby affecting the polishing accuracy of the wafer;

[0043] The pneumatic lifting mechanism 5 includes a hollow column 501 fixedly arranged on the top of the base 1 and an air outlet 502 with a valve arranged on the outside of the bottom end of the hollow column 501. A first channel 503 is opened on the hollow column 501, and a pressure relief port 504 is provided inside the first channel 503. A piston assembly 505 is provided inside the hollow column 501. A push rod 506 is fixedly provided on the top of the piston assembly 505. A return spring 507 is provided on the outside of the push rod 506, and the two ends of the return spring 507 are respectively fixedly connected to the hollow column 501 and the piston assembly 5 05, while the dust removal mechanism 3 is sucking dust, the vacuum pump 306 can blow the gas filtered and purified by the filter plate 304 into the pneumatic lifting mechanism 5 through the corrugated hose 305. Under normal circumstances, the air outlet 502 on the outside of the pneumatic lifting mechanism 5 is in an open state. When blowing air, the piston assembly 505 inside the pneumatic lifting mechanism 5 will not rise due to the influence of air pressure. When it is necessary to flip the wafer clamped by the wafer clamping mechanism 7, the clamping airbag 704 is first inflated through the air nozzle 705, and the clamping airbag 704 is used to The wafer is clamped, and then the valve on the air outlet 502 is closed. At this time, the air pressure in the hollow column 501 will continue to increase, and the piston assembly 505 in the pneumatic lifting mechanism 5 will be pushed upward under the push of the air pressure. When the piston assembly 505 is pushed upward, it can simultaneously drive the ejector rod 506 to rise. The ejector rod 506 can synchronously lift the wafer clamping mechanism 7 to facilitate the flipping of the wafer that needs to be polished. When the pneumatic lifting mechanism 5 rises to a certain height under the push of the air pressure, the piston assembly 505 on the pneumatic lifting mechanism 5 is high. At the pressure relief port 504, excess gas will be discharged from the pressure relief port 504, which not only prevents the air pressure in the pneumatic lifting mechanism 5 from continuing to rise and causing damage, but also the gas discharged from the pressure relief port 504 is transported into the second channel 602 through the first channel 503, and finally blown out from the first purge nozzle 604 and the second purge nozzle 606, which can respectively purge and clean the waste chips at the bottom of the inner cavity of the polishing protective cover 6 and the surface of the wafer, and can prevent waste chip particles from remaining on the negative pressure suction cup 8 on the top of the polishing table 603 and on the surface of the wafer to affect the polishing process.

[0044] As a further implementation scheme of the above invention: the dust removal mechanism 3 includes a dust removal box 301 and an electric telescopic rod 302 fixedly arranged at the end of the mechanical arm 2, the bottom end of the electric telescopic rod 302 is fixedly connected to a filter frame 303, and the filter frame 303 is arranged in the dust removal box 301, and the inner cavity of the filter frame 303 is fixedly provided with a filter screen plate 304, a corrugated hose 305 is provided on one side of the dust removal box 301, and the end of the corrugated hose 305 away from the dust removal box 301 is connected to the hollow column 501, and the corrugated hose 305 is connected to the hollow column 501. It is connected to an exhaust pump 306, and the waste particles absorbed and cleaned can be intercepted and filtered through the filter plate 304 set inside the dust removal box 301. By controlling the contraction of the electric telescopic rod 302, the filter frame 303 together with the filter plate 304 can be pulled out from the dust removal box 301, so that the filter plate 304 can be cleaned or replaced. While the dust removal mechanism 3 is sucking dust, the exhaust pump 306 can blow the gas filtered and purified by the filter plate 304 into the pneumatic lifting mechanism 5 through the corrugated hose 305.

[0045] As a further implementation scheme of the above invention: the wafer polishing mechanism 4 includes a driving motor 401 and an extension platform 402 fixedly arranged at the bottom end and one side of the dust removal box 301, the output shaft end of the driving motor 401 is fixedly connected to a driving gear 403, and a hollow rod 404 is rotatably connected to the extension platform 402 through a bearing, and the top of the hollow rod 404 is rotatably connected to a dust suction pipe 405 through a bearing, and a linkage gear 406 and a wafer polishing head 407 are respectively fixed on the outer side and the bottom end of the hollow rod 404. The driving motor 401 on the wafer polishing mechanism 4 can drive the driving gear 403 to rotate, and when the driving gear 403 rotates, the hollow rod 404 can be driven to rotate through the linkage gear 406, and the hollow rod 404 can drive the wafer polishing head 407 to rotate rapidly to polish the wafer surface.

[0046] As a further implementation scheme of the above invention: one end of the dust collection pipe 405 away from the hollow rod 404 is connected to the dust removal box 301 , and the linkage gear 406 is meshed and connected with the driving gear 403 .

[0047] As a further embodiment of the above invention: the wafer grinding head 407 includes a dust cover 4071 fixedly arranged at the bottom end of the hollow rod 404 and a wafer grinding disc 4072, the dust cover 4071 is provided with a slot 4073 at the bottom end, and a limit hole 4074 is provided on the outer side of the slot 4073, a plug-in block 4075 is fixedly provided on the top of the wafer grinding disc 4072, and a spring buckle 4076 is provided on the plug-in block 4075, and a chip collection groove 4077 is provided at the bottom of the wafer grinding disc 4072, and dust collection holes 4077 are equidistantly provided in the chip collection groove 4077. 78. The wafer grinding disc 4072 at the bottom of the wafer grinding head 407 is fixed by a spring clip 4076 and a limiting hole 4074, which is convenient for disassembly and replacement. The vacuum pump 306 on the dust removal mechanism 3 can absorb and clean the waste particles generated during the grinding of the wafer surface through the corrugated hose 305 and the chip collecting groove 4077 and the dust suction hole 4078 opened at the bottom of the wafer grinding disc 4072, so as to prevent the waste particles from being sandwiched between the wafer and the wafer grinding disc 4072 or accumulating on the grinding table 603, thereby affecting the grinding accuracy of the wafer.

[0048] As a further implementation scheme of the above invention: the plug-in block 4075 matches the slot 4073, and the spring clip 4076 matches the limiting hole 4074, which facilitates the installation and disassembly of the wafer grinding disc 4072.

[0049] As a further implementation scheme of the above invention: the polishing protective cover 6 includes an outer cover body 601 and a second channel 602 opened on the outer cover body 601, a polishing table 603 is fixedly provided at the bottom of the inner cavity of the outer cover body 601, the polishing table 603 is connected to the second channel 602, and a first purge nozzle 604 is circumferentially provided on the outer side of the polishing table 603, a purge pipe 605 is circumferentially provided on the top of the outer cover body 601, and a second purge nozzle 606 is provided at one end of the purge pipe 605. When the pneumatic lifting mechanism 5 rises to a certain height under the push of air pressure, the piston assembly 505 on the pneumatic lifting mechanism 5 is higher than the pressure relief port 504, and excess gas will be discharged from the pressure relief port 504 Not only does it prevent the air pressure in the pneumatic lifting mechanism 5 from continuing to rise and causing damage, but the gas discharged from the pressure relief port 504 is transported into the second channel 602 through the first channel 503, and finally blown out from the first purge nozzle 604 and the second purge nozzle 606. The second purge nozzle 606 can blow away the waste chips on the surface of the wafer and the surface of the negative pressure suction cup 8, and the blown away waste chips fall onto the polishing table 603 in the inner cavity of the outer cover 601. The first purge nozzle 604 can blow the waste chips that fall on the polishing table 603 to the electrostatic dust removal plate 607 in all directions, and then the electrostatic dust removal plate 607 can electrostatically adsorb the waste chips, which can effectively prevent dust from floating during purging and cleaning.

[0050] As a further implementation of the above invention: a through opening is provided between the second channel 602 and the first channel 503 , and the second channel 602 and the first channel 503 are connected through the through opening.

[0051] As a further implementation scheme of the above invention: an electrostatic dust removal plate 607 is fixedly provided on the inner wall of the outer cover 601, and the electrostatic dust removal plate 607 can be used to remove the waste chips generated during the grinding process or the waste chips scattered during the blowing of the first purge nozzle 604 and the second purge nozzle 606 by electrostatic adsorption. Then, the dust removal mechanism 3 suspended above the grinding protective cover 6 can further remove the dust scattered into the air by negative pressure adsorption, and the dust removal effect is good.

[0052] As a further implementation scheme of the above invention: the wafer clamping mechanism 7 includes an annular lifting platform 701 fixedly arranged on the top of the ejector rod 506, a rotating motor 702 is fixedly arranged on the outside of the annular lifting platform 701, an annular clamping frame 703 is fixedly connected to the end of the output shaft of the rotating motor 702, a clamping airbag 704 is fixedly arranged on the inside of the annular clamping frame 703, and an air nozzle 705 is provided on the side of the annular lifting platform 701 away from the rotating motor 702. After the wafer clamping mechanism 7 is lifted to a certain height by the ejector rod 506, the rotating motor 702 on the wafer clamping mechanism 7 drives the annular clamping frame 703 to rotate 180 degrees to reach the wafer that needs to be polished. The wafer is flipped. After the wafer is flipped, the valve on the air outlet 502 is opened to release the pressure on the pneumatic lifting mechanism 5. At this time, the piston assembly 505 and the push rod 506 on the pneumatic lifting mechanism 5 will drive the wafer clamping mechanism 7 to move downward for reset under the action of the reset spring 507. When the wafer clamping mechanism 7 is reset, the wafer clamped on the wafer clamping mechanism 7 will fall back onto the polishing table 603. At this time, the clamping airbag 704 is depressurized through the air nozzle 705, and then the negative pressure suction cup 8 provided on the top of the polishing table 603 can be used to negatively adsorb and fix the wafer, which can effectively prevent the wafer from shaking during polishing.

[0053] The air nozzle 705 is arranged coaxially with the output shaft at one end of the rotating motor 702, and one end of the air nozzle 705 is rotatably connected to the annular clamping frame 703 through a bearing. The air nozzle 705 is rotatably connected to the annular clamping frame 703 through a bearing, so the clamping airbag 704 can be inflated without affecting the rotation of the annular clamping frame 703.

[0054] In a specific implementation, the robotic arm 2 controls the wafer polishing mechanism 4 to move on the wafer surface to polish the wafer surface. At the same time, the vacuum pump 306 on the dust removal mechanism 3 can absorb and clean the waste particles generated during the polishing of the wafer surface through the corrugated hose 305 and the chip collection groove 4077 and dust suction hole 4078 opened at the bottom end of the wafer polishing disk 4072, thereby preventing the waste particles from being sandwiched between the wafer and the wafer polishing disk 4072 or accumulating on the polishing table 603.

[0055] When the dust is sucked by the dust removal mechanism 3, the air suction pump 306 can blow the purified air filtered by the filter plate 304 into the pneumatic lifting mechanism 5 through the corrugated hose 305. Under normal circumstances, the air outlet 502 on the outside of the pneumatic lifting mechanism 5 is in an open state. When blowing air, the piston assembly 505 inside the pneumatic lifting mechanism 5 will not be affected by the air pressure and will rise. When it is necessary to flip the wafer clamped by the wafer clamping mechanism 7, first, the clamping airbag 704 is inflated through the air nozzle 705, and the wafer is clamped by the clamping airbag 704. Then, the valve on the air outlet 502 is closed. At this time, the air pressure in the hollow column 501 will continue to increase, and the piston assembly 505 in the pneumatic lifting mechanism 5 will push upward under the push of the air pressure. When the piston assembly 505 pushes upward, it can simultaneously drive the ejector rod 506 to rise, and the wafer clamping mechanism 7 can be lifted up by the ejector rod 506, so as to facilitate the flipping of the wafer that needs to be polished.

[0056] When the pneumatic lifting mechanism 5 rises to a certain height under the push of air pressure, the piston assembly 505 on the pneumatic lifting mechanism 5 is higher than the pressure relief port 504, and the excess gas will be discharged from the pressure relief port 504, which not only prevents the air pressure in the pneumatic lifting mechanism 5 from continuing to rise and causing damage, but also the gas discharged from the pressure relief port 504 is transported into the second channel 602 through the first channel 503, and finally blown out from the first purge nozzle 604 and the second purge nozzle 606. The first purge nozzle 604 can blow the waste chips that fall on the polishing table 603 to the electrostatic dust removal plate 607 in all directions, and then the electrostatic dust removal plate 607 can electrostatically adsorb the waste chips, which can effectively prevent dust from floating during purging and cleaning, and can prevent waste chip particles from remaining on the negative pressure suction cup 8 on the top of the polishing table 603 and on the surface of the wafer to affect the polishing process;

[0057] After the wafer clamping mechanism 7 is lifted to a certain height by the push rod 506, the annular clamping frame 703 is driven by the rotating motor 702 on the wafer clamping mechanism 7 to rotate 180 degrees to flip the wafer to be polished. After the wafer is flipped, the valve on the air outlet 502 is opened to relieve the pressure on the pneumatic lifting mechanism 5. At this time, the piston assembly 505 and the push rod 506 on the pneumatic lifting mechanism 5 will drive the wafer clamping mechanism 7 to move downward for resetting under the action of the reset spring 507. When the wafer clamping mechanism 7 is reset, the wafer clamped on the wafer clamping mechanism 7 will fall back onto the polishing table 603. At this time, the clamping airbag 704 is depressurized by the air nozzle 705, and then the wafer can be fixed by negative pressure adsorption through the negative pressure suction cup 8 arranged on the top of the polishing table 603, which can effectively prevent the wafer from shaking during polishing.

[0058] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A processing device for manufacturing semiconductor devices, comprising a base (1) and a robotic arm (2) fixedly arranged on the top of the base (1), characterized in that: A dust removal mechanism (3) is fixedly provided at one end of the robot arm (2), a wafer polishing mechanism (4) is fixedly provided at the bottom end of the dust removal mechanism (3), a pneumatic lifting mechanism (5) is fixedly provided at the top of the base (1), a polishing protective cover (6) and a wafer clamping mechanism (7) are provided at the top end of the pneumatic lifting mechanism (5), and a negative pressure suction cup (8) is fixedly provided at the bottom of the inner cavity of the polishing protective cover (6); The pneumatic lifting mechanism (5) comprises a hollow column (501) fixedly arranged on the top of the base (1) and an air outlet (502) with a valve arranged on the outer side of the bottom end of the hollow column (501); a first channel (503) is opened on the hollow column (501); a pressure relief port (504) is provided on the inner side of the first channel (503); a piston assembly (505) is provided inside the hollow column (501); a push rod (506) is fixedly provided on the top of the piston assembly (505); a return spring (507) is sleeved on the outer side of the push rod (506); and two ends of the return spring (507) are respectively fixedly connected to the hollow column (501) and the piston assembly (505).

2. The processing equipment for manufacturing semiconductor devices according to claim 1, wherein: The dust removal mechanism (3) comprises a dust removal box (301) and an electric telescopic rod (302) fixedly arranged at the end of the mechanical arm (2); the bottom end of the electric telescopic rod (302) is fixedly connected to a filter frame (303), and the filter frame (303) is arranged in the dust removal box (301); a filter screen plate (304) is fixedly provided in the inner cavity of the filter frame (303); a corrugated hose (305) is provided on one side of the dust removal box (301); the end of the corrugated hose (305) away from the dust removal box (301) is connected to the hollow column (501), and the corrugated hose (305) is connected to an air pump (306).

3. The processing equipment for manufacturing semiconductor devices according to claim 2, wherein: The wafer grinding mechanism (4) comprises a driving motor (401) and an extension platform (402) fixedly arranged at the bottom end and one side of the bottom end of the dust removal box (301); the output shaft end of the driving motor (401) is fixedly connected to a driving gear (403); a hollow rod (404) is rotatably connected to the extension platform (402) via a bearing; the top end of the hollow rod (404) is rotatably connected to a dust suction pipe (405) via a bearing; and a linkage gear (406) and a wafer grinding head (407) are fixedly provided on the outer side and the bottom end of the bottom end of the hollow rod (404), respectively.

4. The processing equipment for manufacturing semiconductor devices according to claim 3, wherein: One end of the dust suction pipe (405) away from the hollow rod (404) is connected to the dust removal box (301), and the linkage gear (406) is meshed with the driving gear (403).

5. The processing equipment for manufacturing semiconductor devices according to claim 3, wherein: The wafer grinding head (407) comprises a dust hood (4071) fixedly arranged at the bottom end of a hollow rod (404) and a wafer grinding disc (4072); a slot (4073) is provided at the bottom end of the dust hood (4071); a limiting hole (4074) is provided on the outside of the slot (4073); a plug-in block (4075) is fixedly provided on the top of the wafer grinding disc (4072); a spring buckle (4076) is provided on the plug-in block (4075); a chip collection groove (4077) is provided at the bottom of the wafer grinding disc (4072); dust collection holes (4078) are equidistantly provided in the chip collection groove (4077).

6. The processing equipment for manufacturing semiconductor devices according to claim 5, characterized in that: The plug-in block (4075) matches the slot (4073), and the spring buckle (4076) matches the limiting hole (4074).

7. The processing equipment for manufacturing semiconductor devices according to claim 1, wherein: The polishing protective cover (6) comprises an outer cover body (601) and a second channel (602) provided on the outer cover body (601); a polishing platform (603) is fixedly provided at the bottom of the inner cavity of the outer cover body (601); the polishing platform (603) is connected to the second channel (602); a first purge nozzle (604) is circumferentially provided on the outer side of the polishing platform (603); a purge pipe (605) is circumferentially provided on the top of the outer cover body (601); and a second purge nozzle (606) is provided at one end of the purge pipe (605).

8. The processing equipment for manufacturing semiconductor devices according to claim 7, characterized in that: A through opening is provided between the second channel (602) and the first channel (503), and the second channel (602) and the first channel (503) are connected through the through opening.

9. The processing equipment for manufacturing semiconductor devices according to claim 7, characterized in that: An electrostatic dust removal plate (607) is fixedly provided on the inner wall of the outer cover (601).

10. The processing equipment for manufacturing semiconductor devices according to claim 1, wherein: The wafer clamping mechanism (7) comprises an annular lifting platform (701) fixedly arranged at the top end of the ejector rod (506), a rotating motor (702) fixedly arranged on the outside of the annular lifting platform (701), an annular clamping frame (703) fixedly connected to the end of the output shaft of the rotating motor (702), a clamping airbag (704) fixedly arranged on the inside of the annular clamping frame (703), and an air nozzle (705) arranged on the side of the annular lifting platform (701) away from the rotating motor (702); The air nozzle (705) is coaxially arranged with the output shaft of one end of the rotating motor (702), and one end of the air nozzle (705) is rotatably connected to the annular clamping frame (703) via a bearing.

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