A high-precision multi-channel electronic component testing system

Abstract

The present invention discloses a high-precision multi-channel electronic component testing system, which belongs to the field of electronic component testing technology, and comprises: a carrier frame, two groups of transmission columns are rotatably installed in the carrier frame, two groups of conveyor belts are sleeved on the outer surfaces of the two groups of transmission columns, the outer surfaces of the two groups of conveyor belts are embedded with three groups of placement grooves, connecting cylinders are fixedly installed in the two groups of conveyor belts, the connecting cylinders touch the upper and lower surfaces inside the conveyor belts, two groups of positioning detection mechanisms are fixedly installed on the upper surface of the carrier frame, and rejection mechanisms are fixedly installed in the two groups of connecting cylinders, and the blowing ends of the rejection mechanisms pass through the upper surfaces of the connecting cylinders and are connected to the air holes. Through the design of the positioning detection mechanism and the rejection mechanism, the present application realizes a series of automated processes from the transportation, positioning, detection of electronic components to the rejection of defective products, reduces manual intervention, significantly improves production efficiency and test continuity, and is particularly suitable for large-scale batch testing scenarios.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and in particular to a high-precision multi-channel electronic component testing system. Background Art

[0002] Electronic components are components of electronic components and small electrical machines and instruments. They are usually composed of several parts and can be used in similar products. They often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors, transistors, hairsprings, springs, and other electronic devices. Common ones include diodes, etc. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystals, quartz, ceramic magnetic materials, substrates for printed circuits, special materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and parts, etc.

[0003] For example, a Chinese patent with the announcement number CN119667319A discloses an electronic component testing system and method, which includes: a test board, the test board including a test surface; a contact strip, arranged on one side of the test surface of the test board, and the contact strip provides at least a first contact surface to the connection of the device under test; a transfer point, connected to the contact strip via a connecting wire, and the transfer point is located on one side of the test surface and provides at least a second contact surface to the test device; wherein the wiring of the connecting wire is arranged inside the test board. By disconnecting the connection of the device under test from the contact strip, damage to the chip or bonding wire inside the device under test caused by pressing and connecting to fix the device under test is avoided. At the same time, the contact strip, transfer point and connecting wire are used as a whole to reconstruct the pins of the device under test, so that the IV curve test and electrical performance test of the device under test after opening are effectively performed, meeting the general tooling requirements for IV curve test and electrical performance test of the device under test.

[0004] However, the above-mentioned electronic component testing system cannot automatically remove unqualified electronic components from the installation slot when detecting them. In addition, during the process of electronic component testing, the probe cannot automatically track the contacts of the electronic components to achieve precise connection. Therefore, it is difficult to integrate into an automated production line and cannot meet some complex testing scenarios that require higher testing accuracy and efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-precision multi-channel electronic component testing system to solve the problem raised in the above background technology that when unqualified electronic components are detected, they cannot be automatically removed from the installation slot, and during the electronic component detection process, the probe cannot automatically track the contacts of the electronic components to achieve automated detection of precise connections.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A high-precision multi-channel electronic component testing system comprises: a carrier, wherein two groups of transmission columns are rotatably mounted in the carrier, two groups of conveyor belts are sheathed on the outer surfaces of the two groups of transmission columns, and the outer surfaces of the two groups of conveyor belts are each embedded with three groups of placement slots, wherein electronic components can be placed in the placement slots, and a first transmission disc is fixedly mounted on one end of one group of transmission columns, a transmission belt is sheathed on the outer surface of the first transmission disc, and the other end of the transmission belt is sheathed on the outer surface of a second transmission disc, and the second transmission disc is fixedly mounted on one end of the output shaft of a reduction motor, and the reduction motor is fixedly mounted on the inner upper surface of the carrier, and the reduction motor is controlled by a computer, and the computer is fixedly mounted on one end of one group of assembly plates;

[0008] Wherein, a connecting cylinder is fixedly installed in each of the two groups of conveyor belts, and the connecting cylinder contacts the upper and lower surfaces inside the conveyor belt, thereby exerting a supporting force on the conveyor belt to prevent the electronic components from collapsing during transportation, and the connecting cylinder is fixedly installed at one end of the assembly plate, and the assembly plate is fixedly installed between the carrier frames;

[0009] Among them, two groups of positioning detection mechanisms are fixedly installed on the upper surface of the carrier, and the two groups of positioning detection mechanisms slide out from between the two groups of assembly plates, and the positioning end and the detection end of the positioning detection mechanism are both suspended on the upper surface of the conveyor belt and flush with the multiple groups of placement slots. The signal transmitting end of the detection end in the positioning detection mechanism is connected to the signal receiving end of the computer through a USB, and the positioning end and the detection end of the two groups of positioning detection mechanisms can be inserted into the placement slots by pulling back, and the insertion of the two groups of positioning ends can achieve the synchronous pushing of the electronic components placed in the placement slots toward the center by synchronously sliding toward the center, so that the insertion of the detection end can accurately contact the contacts of the electronic components, allowing the detection end to preliminarily detect the conductivity, insulation, etc. of the electronic components;

[0010] Among them, a rejection mechanism is fixedly installed in both groups of connecting tubes, and the blowing end of the rejection mechanism passes through the upper surface of the connecting tube and is connected to the air hole, and the air hole is opened in the placement groove, so that the rejection mechanism can blow out and reject unqualified electronic components detected by the positioning detection mechanism from the placement groove.

[0011] Preferably, pressure plates are fixedly mounted on the upper surfaces of the two groups of connecting tubes, and the pressure plates cover the upper surface of the conveyor belt, thereby limiting the electronic components placed in the placement grooves to avoid warping caused by being pushed by the positioning end of the positioning detection mechanism.

[0012] Preferably, the rejection mechanism includes two groups of high-pressure air pumps, which are respectively fixedly installed in two groups of connecting cylinders. One end of the air outlet of the high-pressure air pump is connected to a TY four-way pipe, and the other three groups of pipes of the TY four-way pipe pass through the upper surface of the connecting cylinder and can be opposite to and connected with the air holes of the three groups of placement slots. The middle sections of the three groups of pipes of the TY four-way pipe are all connected to solenoid valves, and the high-pressure air pump and the solenoid valve are both controlled by a computer.

[0013] Preferably, trapezoidal blocks are fixedly installed on the upper surfaces of the two groups of pressure plates, and three groups of photoelectric sensors are fixedly installed on the upper surfaces of the two groups of trapezoidal blocks. The detection ends of the three groups of photoelectric sensors pass through the lower surface of the pressure plate and are flush with the placement slots, so that the photoelectric sensors can detect the electronic components that have been transported and count them. After the unqualified electronic components have been transported, the photoelectric sensors can be connected to the computer through the USB interface through the ADC module of the signal transmitting end, so that the computer can control the high-pressure air pump in real time and open the corresponding solenoid valve to blow high-pressure gas into the corresponding placement slot. The model of the photoelectric sensor is E3Z-L61.

[0014] Preferably, a guide tube is fixedly installed at one end of the pressure plate, the inlet of the guide tube is flush with the air outlets of the other three groups of pipes of the TY four-way pipe, and also covers the upper surface of the conveyor belt. The other end of the guide tube is connected to a storage box, and the storage box is placed at one end of the carrier frame.

[0015] Preferably, the positioning detection mechanism includes two groups of linear modules, the two groups of linear modules are relatively arranged and fixedly mounted on the two ends of the inner upper surface of the carrier, the upper surfaces of the movable blocks of the two groups of linear modules are fixedly mounted with connecting plates, the two ends of the connecting plates are respectively fixedly mounted with a first electric push rod and a second electric push rod, the piston rods of the first electric push rod and the second electric push rod are both slid out from between the two groups of connecting cylinders, and a rake plate is fixedly mounted on the upper surface of the first electric push rod, the rake plate is suspended above the upper end of the conveyor belt and is flush with the placement slot;

[0016] The first electric push rod, the second electric push rod and the linear module are also controlled by a computer.

[0017] Preferably, the two groups of rake plates can be driven to be inserted into the placement groove by the pullback of the first electric push rod, and can again be driven by the two groups of linear modules through the moving blocks to synchronously slide toward the center in the placement groove, thereby enabling the electronic components placed in the placement groove to be synchronously pushed toward the center.

[0018] Preferably, a mounting plate is fixedly mounted on the upper surface of the piston rod of the second electric push rod, a frame is fixedly mounted on the upper surface of the mounting plate, an electronic load tester is fixedly mounted inside the frame, and a detection probe of the electronic load tester passes through the lower surface of the mounting plate and is flush with the placement groove, so that the detection probe can be connected to the contacts of the electronic component by being pulled back by the second electric push rod.

[0019] Preferably, a CCD camera is fixedly mounted on one end of the mounting plate, and the CCD camera is connected to a USB port of a computer via a USB cable, and enables the computer to identify and install a corresponding image acquisition driver.

[0020] Preferably, the CCD camera can perform operations such as image filtering, edge detection, feature extraction, and target recognition through an image acquisition program. According to preset algorithms and rules, it calculates the position and posture information of the detection probe relative to the target object, and feeds the results back to the computer to achieve the purpose of accurate visual positioning of the detection probe.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. Automated process realization: Through the coordinated work of the conveyor belt, positioning detection mechanism, and rejection mechanism, the automated process of electronic components from transportation, positioning, detection to rejection of unqualified products is realized, reducing manual intervention and improving production efficiency.

[0023] 2. Accurate detection: The design of the positioning detection mechanism can achieve accurate detection of electronic components. By synchronously pushing and approaching the electronic components, the detection end is precisely in contact with the contacts of the electronic components. By applying voltage or current signals, basic electrical performance problems such as short circuit and open circuit can be determined, thereby improving test accuracy.

[0024] 3. Automatic rejection and collection of defective products: Using high-pressure air pumps, solenoid valves, photoelectric sensors, etc., unqualified electronic components can be automatically rejected and collected to prevent unqualified products from mixing with qualified products, ensuring product quality and the continuity of the production process without the need for manpower input, reducing the risk of manual operation errors.

[0025] 4. Image recognition and precise positioning: The design of linear modules, electric linear actuators, and CCD cameras enables precise positioning and inspection of electronic components. The CCD camera captures images, and the computer uses image recognition to calculate the position and posture of the detection probe, ensuring precise connection between the detection probe and the electronic component contacts. The electronic load tester performs electrical performance testing, while the CCD camera detects surface damage and scratches on the electronic components, enabling rapid batch inspection and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the overall structure of the high-precision multi-channel electronic component testing system of the present invention;

[0027] Figure 2 It is a structural schematic diagram of the conveyor belt and placement trough of the present invention;

[0028] Figure 3 This is a schematic structural diagram of the pressure plate of the present invention covering the surface of the conveyor belt;

[0029] Figure 4 It is a structural schematic diagram of the rejection mechanism of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the TY four-way pipe and the guide pipe relative to each other in the present invention;

[0031] Figure 6 It is a structural schematic diagram of the positioning detection mechanism of the present invention;

[0032] Figure 7 This is a schematic diagram of the structure in which the detection probe of the present invention is flush with the placement groove.

[0033] In the figure: 1. Carrying frame; 101. Transmission column; 102. Computer; 103. Conveyor belt; 104. Placement slot; 105. Pressure plate; 106. Reducer motor; 107. First transmission plate; 108. Transmission belt; 109. Second transmission plate; 110. Connecting cylinder; 2. Positioning detection mechanism; 201. Linear module; 202. Connecting plate; 203. First electric push rod; 204. Second electric push rod; 205. CCD camera; 206. Rake plate; 207. Detection probe; 208. Mounting plate; 209. Frame; 210. Electronic load tester; 3. Rejection mechanism; 301. High-pressure air pump; 302. TY four-way pipe; 303. Solenoid valve; 304. Photoelectric sensor; 305. Trapezoidal block; 306. Guide tube; 307. Storage box; 4. Assembly plate. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 7 , this embodiment provides the following technical solutions:

[0036] like Figure 1-Figure 2 As shown, a high-precision multi-channel electronic component testing system includes: a carrier 1, two groups of transmission columns 101 are rotatably installed in the carrier 1, and two groups of conveyor belts 103 are sheathed on the outer surfaces of the two groups of transmission columns 101. The outer surfaces of the two groups of conveyor belts 103 are embedded with three groups of placement slots 104, and electronic components can be placed in the placement slots 104. A first transmission disk 107 is fixedly installed at one end of one group of transmission columns 101, and a transmission belt 108 is sheathed on the outer surface of the first transmission disk 107. The other end of the transmission belt 108 is sheathed on the outer surface of a second transmission disk 109. The second transmission disk 109 is fixedly installed on one end of the output shaft of a reduction motor 106. The reduction motor 106 is fixedly installed on the inner upper surface of the carrier 1. The reduction motor 106 is controlled by a computer 102, and the computer 102 is fixedly installed on one end of one group of assembly plates 4.

[0037] Among them, the two sets of conveyor belts 103 are fixedly installed with connecting cylinders 110. The connecting cylinders 110 touch the upper and lower surfaces of the inner part of the conveyor belts 103, thereby exerting a supporting force on the conveyor belts 103 to prevent the electronic components from collapsing during transportation. The connecting cylinders 110 are fixedly installed at one end of the assembly plate 4, and the assembly plate 4 is fixedly installed between the carrier frames 1.

[0038] Among them, two groups of positioning detection mechanisms 2 are fixedly installed on the upper surface of the carrier 1, and the two groups of positioning detection mechanisms 2 slide out from between the two groups of assembly plates 4, and the positioning end and the detection end of the positioning detection mechanism 2 are both suspended on the upper surface of the conveyor belt 103 and flush with the multiple groups of placement slots 104. The signal transmitting end of the detection end in the positioning detection mechanism 2 is connected to the signal receiving end of the computer 102 via USB, and the positioning end and the detection end of the two groups of positioning detection mechanisms 2 can be inserted into the placement slot 104 by pulling back, and the insertion of the two groups of positioning ends can achieve the synchronous pushing of the electronic components placed in the placement slot 104 toward the center by sliding toward the center synchronously, so that the insertion of the detection end can accurately contact the contacts of the electronic components, so that the detection end can preliminarily detect the conductivity, insulation, etc. of the electronic components;

[0039] Among them, the two groups of connecting tubes 110 are fixedly installed with a rejection mechanism 3, the blowing end of the rejection mechanism 3 passes through the upper surface of the connecting tube 110 and is connected to the air hole, and the air hole is opened in the placement groove 104, so that the rejection mechanism 3 can blow out and reject the unqualified electronic components detected by the positioning detection mechanism 2 from the placement groove 104. The upper surface of the two groups of connecting tubes 110 is fixedly installed with a pressure plate 105, and the pressure plate covers the upper surface of the conveyor belt 103, so as to limit the electronic components placed in the placement groove 104 to avoid warping when pushed by the positioning end of the positioning detection mechanism 2.

[0040] Through the design of the conveyor belt 103, the placement slot 104, the pressure plate 105, the positioning detection mechanism 2 and the rejection mechanism 3, when in use, the produced electronic components can be guided into the placement slot 104 of the conveyor belt 103, and as the conveyor belt 103 is transported, the electronic components in the placement slot 104 can be transported to the lower end of the pressure plate 105, so that the pressure plate 105 can limit the electronic components in the placement slot 104, until the conveyor belt 103 is transported to a specific stroke, the reduction motor 106 can be controlled by the computer 102 to stop, and the positioning detection mechanism 2 is started at the same time to return Pull, so that the positioning end and the detection end of the positioning detection mechanism 2 can be inserted into the placement groove 104 by pulling back, and the insertion of the two sets of positioning ends can realize the synchronous pushing of the electronic components placed in the placement groove 104 toward the center by sliding toward the center, and the restriction of the pressure plate 105 can prevent the electronic components that are close to each other from tilting, and then the insertion of the detection end can make precise contact with the contacts of the electronic components, and because the electronic components are close to each other, the stroke of the detection end moving each time can be the same, and then the probe can be driven to accurately contact the contacts of the electronic components, so that the detection end By applying a certain voltage or current signal, the response of the electronic components is measured to determine whether there are basic electrical performance problems such as short circuit and open circuit. If there is a problem with the detected electronic components, the positioning detection mechanism 2 can first determine which group of placement slots 104 the components are in, and then determine the position of the unqualified electronic components based on the number of times the detection end moves from left to right or from right to left. After the inspection of this batch of electronic components is completed, the computer 102 can start the reduction motor 106 again to continue conveying the conveyor belt 103, and as the conveyor belt 103 transports the inspected electronic components, the electronic components are transported to the conveyor belt 103. When leaving the conveyor belt 103, they will be detected and counted by the rejection mechanism 3, and the counted electronic components will be conveyed out from the lower end of the pressure plate 105. After the unqualified electronic components are output, the rejection mechanism 3 can blow air into the air holes opened in the corresponding placement slots 104 to blow the unqualified electronic components out of the placement slots 104 and remove them. Through the coordinated work of the positioning detection mechanism 2 and the rejection mechanism 3, a series of automated processes from the transportation, positioning, detection to the rejection of unqualified products of electronic components are realized, which reduces manual intervention and improves production efficiency and test accuracy.

[0041] like Figure 3-Figure 5As shown, the rejection mechanism 3 includes two groups of high-pressure air pumps 301, and the two groups of high-pressure air pumps 301 are respectively fixedly installed in the two groups of connecting cylinders 110. One end of the air outlet of the high-pressure air pump 301 is connected to a TY four-way pipe 302. The other three groups of pipes of the TY four-way pipe 302 pass through the upper surface of the connecting cylinder 110 and can be opposite to and connected to the air holes of the three groups of placement slots 104. The middle sections of the three groups of pipes of the TY four-way pipe 302 are all connected and installed with electromagnetic valves 303. The high-pressure air pump 301 and the electromagnetic valve 303 are all controlled by the computer 102. The upper surfaces of the two groups of pressure plates 105 are fixedly installed with trapezoidal blocks 305. The upper surfaces of the two groups of trapezoidal blocks 305 are divided into Three groups of photoelectric sensors 304 are fixedly installed. The detection ends of the three groups of photoelectric sensors 304 all penetrate the lower surface of the pressure plate 105 and are flush with the placement slot 104, so that the photoelectric sensors 304 can detect the electronic components that have been transported and count them. After the unqualified electronic components have been transported, the photoelectric sensors 304 can be connected to the computer 102 through the USB interface through the ADC module of the signal transmitting end, and the computer 102 can control the high-pressure air pump 301 in real time and open the corresponding solenoid valve 303 to blow high-pressure gas into the corresponding placement slot 104. The model of the photoelectric sensor 304 is E3Z-L61.

[0042] Among them, a guide tube 306 is fixedly installed at one end of the pressure plate 105, the inlet of the guide tube 306 is flush with the air outlet of the other three groups of pipes of the TY four-way tube 302, and also covers the upper surface of the conveyor belt 103. The other end of the guide tube 306 is connected to and installed with a storage box 307, and the storage box 307 is placed at one end of the carrier frame 1.

[0043] Through the design of the high-pressure air pump 301, the TY four-way pipe 302, the solenoid valve 303, the photoelectric sensor 304, the guide tube 306 and the storage box 307, the positioning detection mechanism 2 can first determine which group of placement slots 104 the electronic component is in, and then determine the position of the unqualified electronic component based on the number of times the detection end moves from left to right or from right to left. Then, the computer 102 can start the reduction motor 106 to continue to convey the conveyor belt 103. As the conveyor belt 103 conveys the inspected electronic components out of the conveyor belt 103, they are all conveyed out from the lower end of the pressure plate 105, and at the lower end of the pressure plate 105 A photoelectric sensor 304 is provided, so that all the electronic components being transported will be transported from the lower end of the photoelectric sensor 304 to be detected. Each time a group of electronic components is detected, the photoelectric sensor 304 converts the optical signal into an electrical signal, and after analog-to-digital conversion by the ADC module, the data is transmitted to the computer 102 through the USB interface, so that the computer 102 counts the electronic components passing through. When unqualified electronic components are transported through the photoelectric sensor 304, the photoelectric sensor 304 also transmits a signal to the computer 102, and the computer 102 determines the number of unqualified electronic components based on the counting information. The electronic components currently passing through are unqualified. At this time, the computer 102 immediately issues a control instruction, and controls the high-pressure air pump 301 to start and the electromagnetic valve 303 on the pipeline connected to the air hole of the corresponding placement slot 104 to open. The high-pressure gas generated by the high-pressure air pump 301 is diverted through the TY four-way pipe 302 and enters the air hole of the corresponding placement slot 104 through the opened electromagnetic valve 303, so that the high-pressure gas is ejected from the air hole, forming a strong airflow impact force, blowing out the unqualified electronic components in the placement slot 104. The blown-out unqualified electronic components will enter the guide pipe 306 under the push of the high-pressure gas, and The guide tube 306 guides the unqualified electronic components, causing them to slide along a specific path into the storage box 307 for collection and storage. In this way, the automatic removal and collection of unqualified electronic components is achieved, preventing unqualified products from mixing with qualified products, ensuring product quality and the continuity of the production process. At the same time, the system continues to inspect subsequent electronic components and remove unqualified products until the inspection of the entire batch of electronic components is completed. The process does not require manpower investment, reduces the risk of manual operation errors, and significantly improves production efficiency and test continuity. It is especially suitable for large-scale batch inspection scenarios.

[0044] like Figure 6-Figure 7As shown, the positioning detection mechanism 2 includes two groups of linear modules 201, which are relatively arranged and fixedly mounted on the two ends of the upper surface of the carrier 1. The upper surfaces of the movable blocks of the two groups of linear modules 201 are fixedly mounted with connecting plates 202, and the two ends of the connecting plates 202 are respectively fixedly mounted with a first electric push rod 203 and a second electric push rod 204. The piston rods of the first electric push rod 203 and the second electric push rod 204 slide out from between the two groups of connecting cylinders 110, and a rake plate 206 is fixedly mounted on the upper surface of the first electric push rod 203. The rake plate 206 is suspended on the upper end of the conveyor belt 103 and is flush with the placement groove 104.

[0045] Among them, the first electric push rod 203, the second electric push rod 204 and the linear module 201 are also controlled by the computer 102, and the two sets of rake plates 206 can be driven to be inserted into the placement groove 104 by the pullback of the first electric push rod 203, and can again be driven by the two sets of linear modules 201 through the moving blocks to drive the two sets of rake plates 206 to slide synchronously toward the center in the placement groove 104, thereby being able to achieve the electronic components placed in the placement groove 104 being pushed synchronously toward the center. The upper surface of the piston rod of the second electric push rod 204 is fixedly installed with a mounting plate 208, and the upper surface of the mounting plate 208 is fixed A frame 209 is fixedly installed, and an electronic load tester 210 is fixedly installed in the frame 209. The detection probe 207 of the electronic load tester 210 penetrates the lower surface of the mounting plate 208 and is flush with the placement groove 104, so that the detection probe 207 can be connected to the contact of the electronic component by being pulled back by the second electric push rod 204. A CCD camera 205 is fixedly installed at one end of the mounting plate 208. The CCD camera 205 is connected to the USB port of the computer 102 via a USB cable, and enables the computer 102 to recognize and install the corresponding image acquisition driver.

[0046] The CCD camera 205 can perform operations such as image filtering, edge detection, feature extraction, and target recognition through the image acquisition program. According to preset algorithms and rules, it calculates the position and posture information of the detection probe 207 relative to the target object, and feeds the results back to the computer 102 to achieve the purpose of accurate visual positioning of the detection probe 207.

[0047] Through the design of the linear module 201, the first electric push rod 203, the second electric push rod 204, the CCD camera 205, the rake plate 206, the detection probe 207 and the electronic load tester 210, the produced electronic components are guided into the placement slot 104 of the conveyor belt 103. As the conveyor belt 103 runs, the electronic components are conveyed to the lower end of the pressure plate 105, and the pressure plate 105 imposes a limit on the electronic components in the placement slot 104 to prevent them from shifting or tilting in subsequent operations. After being conveyed to a specific position, the computer 102 controls the reduction motor 106 to stop, so that the electronic components stay at the detection station. Then the computer 102 can issue a command to control the two sets of linear modules 201 to start, so that the two sets of linear modules 201 can be The moving block drives the connecting plate 202 to move outward synchronously. At the same time, the first electric push rod 203 on the connecting plate 202 is started, and the piston rod is pulled back, driving the rake plate 206 to be inserted downward into the placement groove 104. Subsequently, the two sets of linear modules 201 drive the two sets of rake plates 206 to slide synchronously toward the center in the placement groove 104 through the moving block, so as to achieve the electronic components in the placement groove 104 being pushed toward the center synchronously, completing accurate positioning and ensuring that the electronic components are in the appropriate detection position. While the rake plate 206 completes positioning, the CCD camera 205 at one end of the mounting plate 208 starts working. The CCD camera 205 is connected to the computer 102 via a USB cable. After the computer 102 automatically recognizes and installs the image acquisition driver, The CCD camera 205 collects images of the electronic components in the placement slot 104, and the computer 102 runs the image acquisition program to perform image filtering, edge detection, feature extraction, target recognition and other operations on the collected images. According to the preset algorithm and rules, the position and posture information of the detection probe 207 relative to the contact of the electronic component is calculated, and the result is fed back to the computer 102, so that the computer 102 controls the second electric push rod 204 to start according to the position and posture information fed back by the CCD camera 205, so that the piston rod of the second electric push rod 204 is pulled back, and the mounting plate 208 and the frame 209 fixed thereon, the electronic load tester 210 and the detection probe 207 are moved downward, so that the detection probe 207 and the contact of the electronic component are accurately After the detection probe 207 is connected to the electronic component contact, the electronic load tester 210 starts working. The electronic load tester 210 applies a specific voltage or current signal to the electronic component and measures the response of the electronic component, such as voltage drop, current value and other parameters. By analyzing these parameters, it is determined whether the electronic component has basic electrical performance problems such as short circuit, open circuit, substandard performance, etc., and the detection data and results are fed back to the computer 102. At this time, the CCD camera 205 will also check the surface of the electronic component for breakage and scratches. After receiving the data fed back by the electronic load tester 210, the computer 102 will judge the electronic component according to the preset qualification standard to determine whether it is qualified. At the same time,Computer 102 records the inspection results and location information of each electronic component for subsequent processing. After the inspection is completed, computer 102 controls the first electric push rod 203, the second electric push rod 204, and the linear module 201 to reset, so that the rake plate 206 and the inspection probe 207 return to their initial positions. Then, computer 102 restarts the reduction motor 106, and the conveyor belt 103 continues to operate, transporting the inspected electronic components out and simultaneously transporting the next batch of electronic components to be inspected to the inspection station. The above inspection process is repeated, and the automated process connects each link in an orderly manner, allowing it to complete a single inspection process in a short time. Combined with the continuous operation of the conveyor belt 103, rapid batch inspection of electronic components can be achieved, improving production efficiency.

[0048] Specifically, the specific schemes of the algorithms and rules preset in this embodiment are as follows:

[0049] 1. Image processing and probe positioning algorithm

[0050] (1) Image preprocessing and filtering

[0051] Gaussian filtering: Perform Gaussian blur on the original image captured by the CCD camera to eliminate noise interference.

[0052] Histogram equalization: Enhance image contrast and highlight the contacts and contour features of electronic components.

[0053] (2) Edge detection and feature extraction

[0054] Canny edge detection: Extract edge contours of electronic components and contacts.

[0055] Hough transform: Identify the geometric shape of the touch point (such as circle or rectangle) and locate the coordinates of the touch point center.

[0056] Contour analysis: Filter effective contact areas through parameters such as contour area and aspect ratio.

[0057] (3) Target identification and positioning

[0058] Template matching: A standard contact template is preset and the contact positions in the actual image are matched using the normalized cross correlation (NCC) algorithm.

[0059] Coordinate system calibration:

[0060] Camera calibration: Use the checkerboard calibration method to obtain the intrinsic parameter matrix and distortion coefficient of the CCD camera.

[0061] Hand-eye calibration: Establish a mapping relationship between the image coordinate system and the mechanical motion coordinate system, and calculate the movement path of the detection probe through perspective transformation (PnP algorithm).

[0062] (4) Posture estimation and path planning

[0063] Least squares fitting: Fits the probe's optimal contact path based on the contact point coordinates, ensuring simultaneous alignment of multiple contact points.

[0064] Motion interpolation algorithm: Generates the motion trajectory of the linear module 201 to achieve smooth movement of the probe to the target position.

[0065] 2. Electronic load test data analysis rules

[0066] (1) Continuity test

[0067] Rule: Apply a constant current (e.g. 10mA), measure the voltage drop across the contacts, and calculate the resistance.

[0068] Eligibility criteria: resistance value R≤Rmax (e.g. Rmax=50Ω).

[0069] (2) Insulation test

[0070] Rules: Apply high voltage (e.g. 500VDC), measure leakage current, and calculate insulation resistance.

[0071] Qualification conditions: Insulation resistance Rins ≥ Rmin (such as Rmin = 10MΩ).

[0072] (3) Dynamic performance test

[0073] Rule: Apply a step current / voltage signal and measure the response time (e.g. trise ≤ 1ms).

[0074] Frequency domain analysis: Use FFT to detect frequency response characteristics and ensure that the bandwidth meets the specifications.

[0075] (4) Multi-channel data synchronization

[0076] Rule: Process data from multiple slots in parallel, independently determine the eligibility of each channel, and avoid cross-interference.

[0077] 3. Surface defect detection algorithm (CCD camera assisted)

[0078] Scratch detection:

[0079] Histogram of Oriented Gradients (HOG): Extracts texture features of scratch areas.

[0080] Morphological operation: Separate scratches from background noise through opening operation.

[0081] Crushing detection:

[0082] Image difference method: Compare with standard component images to detect missing areas.

[0083] Deep learning model: Train a lightweight CNN classifier (such as MobileNet) to identify defects such as cracks and chipped corners.

[0084] 4. Eliminate decision-making and control logic

[0085] (1) Rules for determining non-conformity

[0086] Comprehensive judgment criteria: If any test item (conductivity, insulation, dynamic performance, surface defects) fails to meet the standard, it will be rejected.

[0087] Priority setting: Electrical performance defects take precedence over appearance defects.

[0088] (2) Elimination trigger mechanism

[0089] Counting and matching: The photoelectric sensor 304 counts and locates the serial number of the placement slot 104 where the defective product is located.

[0090] Timing control: Calculate the delay according to the conveyor belt speed and accurately trigger the corresponding solenoid valve 303 to blow air.

[0091] (3) Fault tolerance and calibration mechanism

[0092] Dynamic threshold adjustment: Adaptively update the qualified threshold based on historical test data (such as the 3σ principle).

[0093] Periodic self-test: Start probe contact impedance calibration and CCD camera white balance correction every day.

[0094] 5. Software Architecture and Data Flow

[0095] Modular design:

[0096] Image processing module: Real-time image analysis based on OpenCV.

[0097] Motion control module: Controls the linear module 201 and the electric push rod accuracy through the PID algorithm (error ≤ 0.1mm).

[0098] Data management module: record test results (timestamp, batch number, parameter value) and generate SPC charts.

[0099] Communication protocol:

[0100] USB transmission: CCD image data and photoelectric sensor signals.

[0101] Modbus / TCP: controls the high-pressure air pump 301 , the solenoid valve 303 , and the linear module 201 .

[0102] Solution Advantages

[0103] High-precision positioning: Combining vision and mechanical calibration, the probe contact error is ≤0.05mm.

[0104] Real-time: Single detection cycle ≤ 2s (including image processing, testing, and rejection decision-making).

[0105] Flexibility: Configure test parameters through the computer 102 interface to adapt to different types of components.

[0106] Reliability: Redundant design (such as dual photoelectric sensor verification) ensures rejection accuracy ≥ 99.9%.

[0107] This solution achieves fully automated, high-reliability testing and sorting of electronic components through multi-algorithm collaboration and rule-based decision-making, significantly improving production line efficiency and product yield.

[0108] The preset algorithm also includes the dynamic probe contact error compensation equation (DEC), which is expressed as:

[0109] ;

[0110] in:

[0111] Δ n is the probe position compensation amount during the nth detection;

[0112] e n−1 is the error between the actual contact position and the target position detected in the n−1th time;

[0113] α is the recent error weight coefficient, β is the historical error attenuation coefficient;

[0114] γ is the time attenuation factor, λ is the nonlinear disturbance term coefficient;

[0115] The computer 102 calculates the compensation amount in real time according to the equation, and corrects the motion path of the detection probe 207 through the linear module 201 to achieve error convergence;

[0116] The time decay factor γ ranges from 0.8 to 0.95, and is used to perform exponential weight decay on the historical error. The nonlinear perturbation term coefficient λ is obtained by the sign function sgn(e n−1 ) Eliminate mechanical vibration interference within ±0.03mm;

[0117] The equation described achieves error compensation through the following process:

[0118] 1. The CCD camera 205 collects the contact image between the detection probe 207 and the electronic component and calculates the position error e n ;

[0119] 2. Computer 102 will e nSubstitute into the DEC equation to generate the compensation amount Δ n+1 ;

[0120] 3. Linear module 201 according to Δ n+1 Adjusting the moving coordinates of the detection probe 207;

[0121] 4. Repeat the iteration until the error converges to within 0.02mm.

[0122] Example scenario: The detection probe needs to compensate for the positioning errors of the previous three times during the fourth detection.

[0123] Known parameters:

[0124] α=0.7, β=0.2, γ=0.9, λ=0.03;

[0125] Historical error sequence: e1=0.15mm, e2=0.10mm, e3=0.08mm;

[0126] Calculate Δ4=0.1443mm;

[0127] Result: During the fourth test, the probe position needed to be compensated by 0.1443 mm to offset the accumulated error.

[0128] This equation is obtained by γ n−k−1 Exponential decay of historical error weights avoids long-term error accumulation, making the total error converge exponentially as the number of detections increases. Compared with traditional PID control, the error of the DEC equation is reduced to less than 0.02mm after 10 iterations (the traditional method is 0.05mm). n−1 ) item eliminates tiny jitter caused by mechanical vibration or ambient temperature (disturbance within ±0.03mm is completely suppressed); when α needs to be dynamically adjusted due to probe wear, the α and β parameters can be updated through online learning algorithms (such as RL) to adapt to hardware degradation.

[0129] Application scenario verification

[0130] Case: A chip resistor test production line had an original positioning error of ±0.1mm. After applying the DEC equation:

[0131] Test results:

[0132] Error sequence for the 1st to 5th times: 0.10mm→0.07mm→0.04mm→0.02mm→0.01mm; the yield rate increased from 98.2% to 99.6% (misjudgments due to poor contact were reduced).

[0133] Data comparison table:

[0134] This equation solves the problem of accumulated probe positioning errors in electronic component testing through dynamic weight distribution and nonlinear disturbance suppression, significantly improving detection accuracy and system stability. It also has strong engineering interpretability and can be extended to precision mechanical positioning scenarios.

[0135] According to the above technical solution, the working steps of this solution are summarized and sorted out: when in use, the produced electronic components can be guided into the placement groove 104 of the conveyor belt 103, and the reduction motor 106 is started to drive the transmission belt 108 on the outer surface of the second transmission disk 109 to drive the first transmission disk 107 to rotate, so that the first transmission disk 107 can drive the two sets of conveyor belts 103 on the outer surface of the transmission column 101 to transmit, and as the conveyor belt 103 is transported, the electronic components in the placement groove 104 can be transported to the lower end of the pressure plate 105, so that the pressure plate 105 can limit the electronic components in the placement groove 104, until the conveyor belt 103 is transported to a specific stroke and the reduction can be controlled by the computer 102. The high-speed motor 106 stops, and at the same time, the computer 102 issues a command to control the two sets of linear modules 201 to start, so that the moving blocks of the two sets of linear modules 201 drive the connecting plate 202 to move outward synchronously. At the same time, the first electric push rod 203 on the connecting plate 202 is started, and the piston rod is pulled back, driving the rake plate 206 to be inserted downward into the placement slot 104. Subsequently, the two sets of linear modules 201 drive the two sets of rake plates 206 to slide synchronously toward the center in the placement slot 104 through the moving blocks, so as to achieve the synchronous pushing of the electronic components in the placement slot 104 toward the center, completing precise positioning and ensuring that the electronic components are in the appropriate detection position. At the same time as the rake plate 206 completes its positioning, the CCD camera 205 at one end of the mounting plate 208 starts The CCD camera 205 is connected to the computer 102 via a USB cable. After the computer 102 automatically recognizes and installs the image acquisition driver, the CCD camera 205 collects images of the electronic components in the placement slot 104. The computer 102 runs the image acquisition program and performs image filtering, edge detection, feature extraction, target recognition and other operations on the collected images. According to the preset algorithm and rules, the position and posture information of the detection probe 207 relative to the contact of the electronic component is calculated and the result is fed back to the computer 102. The computer 102 controls the second electric push rod 204 to start according to the position and posture information fed back by the CCD camera 205, so that the piston rod of the second electric push rod 204 is pulled back, driving the mounting plate 208 The frame 209, the electronic load tester 210 and the detection probe 207 fixed thereon are moved downward, so that the detection probe 207 is accurately connected to the contacts of the electronic component. After the detection probe 207 is connected to the contacts of the electronic component, the electronic load tester 210 starts to work. The electronic load tester 210 applies a specific voltage or current signal to the electronic component and measures the response of the electronic component, such as voltage drop, current value and other parameters. By analyzing these parameters, it is determined whether the electronic component has basic electrical performance problems such as short circuit, open circuit, and substandard performance, and the detection data and results are fed back to the computer 102. At this time, the CCD camera 205 will also inspect the surface of the electronic component for breakage and scratches.After receiving the data fed back by the electronic load tester 210, the computer 102 will judge the electronic components according to the preset qualification standards to determine whether they are qualified. At the same time, the computer 102 records the test results and position information of each electronic component for subsequent processing. After completing the test, the computer 102 controls the first electric push rod 203, the second electric push rod 204 and the linear module 201 to reset, so that the rake plate 206 and the detection probe 207 return to the initial position. Subsequently, the computer 102 starts the reduction motor 106 again, and the conveyor belt 103 continues to operate, and the tested electronic components are put into the test position. The electronic components are transported out, and the next batch of electronic components to be tested are transported to the testing station, and the above testing process is repeated. As the conveyor belt 103 transports the tested electronic components out of the conveyor belt 103, they are all transported out from the lower end of the pressure plate 105. A photoelectric sensor 304 is provided at the lower end of the pressure plate 105, so that the electronic components transported out are transported from the lower end of the photoelectric sensor 304 to be tested. Each time a group of electronic components is detected, the photoelectric sensor 304 converts the optical signal into an electrical signal, and performs analog-to-digital conversion through the ADC module. After that, the data is transmitted to the computer 102 through the USB interface, so that the computer 102 counts the electronic components that pass through. When an unqualified electronic component is conveyed through the photoelectric sensor 304, the photoelectric sensor 304 also transmits a signal to the computer 102. The computer 102 determines that the electronic component currently passing through is unqualified based on the counting information. At this time, the computer 102 immediately issues a control instruction, and at the same time controls the high-pressure air pump 301 to start and the electromagnetic valve 303 on the pipeline connected to the air hole of the corresponding placement slot 104 to open, and the high pressure generated by the high-pressure air pump 301 The gas is diverted through the TY cross-tube 302 and enters the corresponding air holes in the placement slot 104 through the opened solenoid valve 303. The high-pressure gas is ejected from the air holes, creating a powerful airflow impact, blowing out the unqualified electronic components in the placement slot 104. Under the pressure of the high-pressure gas, the blown-out unqualified electronic components will enter the guide tube 306. The guide tube 306 guides the unqualified electronic components, causing them to slide along a specific path to the storage box 307 for collection and storage. In this way, the automatic rejection and collection of unqualified electronic components is achieved.

[0136] In summary: This high-precision multi-channel electronic component testing system implements a series of automated processes from the transportation, positioning, detection to the removal of defective electronic components, reducing manual intervention, significantly improving production efficiency and test continuity, and is particularly suitable for large-scale batch testing scenarios.

[0137] Parts not described in the present invention are the same as those in the prior art or can be implemented using the prior art. Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision multi-channel electronic component testing system, characterized in that: include: A carrier frame (1) is provided, wherein two groups of transmission columns (101) are rotatably mounted in the carrier frame (1), two groups of conveyor belts (103) are sleeved on the outer surfaces of the two groups of transmission columns (101), three groups of placement grooves (104) are provided on the outer surfaces of the two groups of conveyor belts (103), electronic components can be placed in the placement grooves (104), and a first transmission disc (107) is fixedly mounted on one end of one group of transmission columns (101), a transmission belt (108) is sleeved on the outer surface of the first transmission disc (107), and the other end of the transmission belt (108) is sleeved on the outer surface of a second transmission disc (109), and the second transmission disc (109) is fixedly mounted on the reduction motor (10 6), the reduction motor (106) is fixedly mounted on the inner upper surface of the carrier (1), the reduction motor (106) is controlled by a computer (102), and the computer (102) is fixedly mounted on one end of one group of assembly plates (4); a connecting cylinder (110) is fixedly mounted in both groups of the conveyor belts (103), the connecting cylinder (110) contacts the upper and lower surfaces inside the conveyor belt (103), thereby applying a supporting force to the conveyor belt (103) to avoid collapse during the transportation of electronic components, the connecting cylinder (110) is fixedly mounted on one end of the assembly plate (4), and the assembly plate (4) is fixedly mounted between the carriers (1); Two groups of positioning detection mechanisms (2) are fixedly installed on the upper surface of the carrier (1), and the two groups of positioning detection mechanisms (2) are slid out from between the two groups of assembly plates (4), and the positioning end and the detection end of the positioning detection mechanism (2) are both suspended on the upper surface of the conveyor belt (103) and flush with the multiple groups of placement slots (104). The signal transmitting end of the detection end in the positioning detection mechanism (2) is connected to the signal receiving end of the computer (102) via USB. The positioning end and the detection end of the two groups of positioning detection mechanisms (2) can be inserted into the placement slot (104) by pulling back. The insertion of the two groups of positioning ends can achieve the synchronous pushing of the electronic components placed in the placement slot (104) toward the center by sliding toward the center synchronously, so that the insertion of the detection end can accurately contact the contact of the electronic component, so that the detection end can preliminarily detect the conductivity and insulation of the electronic component; A rejection mechanism (3) is fixedly installed in both groups of the connecting cylinders (110), and the blowing end of the rejection mechanism (3) passes through the upper surface of the connecting cylinder (110) and is connected to the air hole, and the air hole is opened in the placement groove (104), so that the rejection mechanism (3) can blow out the unqualified electronic components detected by the positioning detection mechanism (2) from the placement groove (104) and reject them; a pressure plate (105) is fixedly installed on the upper surface of the two groups of the connecting cylinders (110), and the pressure plate covers the upper surface of the conveyor belt (103), so as to limit the electronic components placed in the placement groove (104) to avoid being tilted when pushed by the positioning end of the positioning detection mechanism (2).

2. A high-precision multi-channel electronic component testing system according to claim 1, characterized in that: The rejection mechanism (3) comprises two groups of high-pressure air pumps (301), the two groups of high-pressure air pumps (301) being fixedly installed in two groups of connecting cylinders (110), respectively. One end of the air outlet of the high-pressure air pump (301) is connected to a TY four-way pipe (302), and the other three groups of pipes of the TY four-way pipe (302) pass through the upper surface of the connecting cylinder (110) and are able to be opposite to and connected to the air holes of the three groups of placement slots (104). The middle sections of the three groups of pipes of the TY four-way pipe (302) are all connected to a solenoid valve (303), and the high-pressure air pump (301) and the solenoid valve (303) are both controlled by a computer (102).

3. A high-precision multi-channel electronic component testing system according to claim 2, characterized in that: Trapezoidal blocks (305) are fixedly mounted on the upper surfaces of the two groups of pressure plates (105), and three groups of photoelectric sensors (304) are fixedly mounted on the upper surfaces of the two groups of trapezoidal blocks (305). The detection ends of the three groups of photoelectric sensors (304) extend through the lower surface of the pressure plate (105) and are flush with the placement slot (104), so that the photoelectric sensors (304) can detect and count the electronic components that have been transported. After the unqualified electronic components have been transported, the photoelectric sensors (304) can be connected to the computer (102) through the ADC module of the signal transmitting end through the USB interface, so that the computer (102) can control the high-pressure air pump (301) in real time and open the corresponding solenoid valve (303) to blow high-pressure gas into the corresponding placement slot (104).

4. A high-precision multi-channel electronic component testing system according to claim 3, characterized in that: A guide tube (306) is fixedly installed at one end of the pressure plate (105), and the inlet of the guide tube (306) is flush with the air outlets of the other three groups of pipes of the TY four-way pipe (302), and also covers the upper surface of the conveyor belt (103). The other end of the guide tube (306) is connected to a storage box (307) installed, and the storage box (307) is placed at one end of the carrier (1).

5. The high-precision multi-channel electronic component testing system according to claim 4, characterized in that: The positioning detection mechanism (2) includes two groups of linear modules (201), the two groups of linear modules (201) are fixedly mounted on the two ends of the inner upper surface of the carrier (1) in an opposite arrangement, the upper surfaces of the movable blocks of the two groups of linear modules (201) are fixedly mounted with connecting plates (202), the two ends of the connecting plates (202) are respectively fixedly mounted with a first electric push rod (203) and a second electric push rod (204), the piston rods of the first electric push rod (203) and the second electric push rod (204) are both slidably passed through between the two groups of connecting cylinders (110), and a rake plate (206) is fixedly mounted on the upper surface of the first electric push rod (203), the rake plate (206) is suspended above the upper end of the conveyor belt (103) and is flush with the placement groove (104); The first electric push rod (203), the second electric push rod (204) and the linear module (201) are also controlled by the computer (102).

6. The high-precision multi-channel electronic component testing system according to claim 5, characterized in that: The two groups of rake plates (206) can be driven to be inserted into the placement slot (104) by the pullback of the first electric push rod (203), and can again be driven by the two groups of linear modules (201) through the movable blocks to synchronously slide the two groups of rake plates (206) toward the center in the placement slot (104), thereby achieving the goal of synchronously pushing the electronic components placed in the placement slot (104) toward the center.

7. The high-precision multi-channel electronic component testing system according to claim 6, characterized in that: A mounting plate (208) is fixedly mounted on the upper surface of the piston rod of the second electric push rod (204), a frame (209) is fixedly mounted on the upper surface of the mounting plate (208), an electronic load tester (210) is fixedly mounted inside the frame (209), and a detection probe (207) of the electronic load tester (210) passes through the lower surface of the mounting plate (208) and is flush with the placement groove (104), so that the detection probe (207) can be connected to the contact of the electronic component by being pulled back by the second electric push rod (204).

8. The high-precision multi-channel electronic component testing system according to claim 7, characterized in that: A CCD camera (205) is fixedly mounted on one end of the mounting plate (208), and the CCD camera (205) is connected to a USB port of a computer (102) via a USB cable, and enables the computer (102) to identify and install a corresponding image acquisition driver.

9. The high-precision multi-channel electronic component testing system according to claim 8, characterized in that: The CCD camera (205) performs image filtering, edge detection, feature extraction, and target recognition operations through an image acquisition program, calculates the position and posture information of the detection probe (207) relative to the target object according to preset algorithms and rules, and feeds the results back to the computer (102) to achieve the purpose of accurate visual positioning of the detection probe (207).

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