Leveling equipment

Abstract

Leveling equipment comprises a first pressure head comprising a plurality of moving parts and a second pressure head configured corresponding to the first pressure head, so that each moving part can independently move towards the second pressure head to flatten a target object, and therefore, the target object can be flattened according to the processing requirements of products of different types and different sizes. And moving the moving pieces with different numbers towards the second pressure head to perform the flattening action.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor packaging technology, and more particularly to a leveling device capable of improving the yield rate. Background Art

[0002] With the vigorous development of the electronics industry, electronic products tend to be thinner, lighter, shorter, and smaller in form, and are developed towards high performance, high functionality, and high speed in terms of functions. Therefore, in order to meet the requirements of high integration and miniaturization of semiconductor devices, in the packaging process, packaging substrates with high-density and fine-pitch circuits are often used, such as chip scale package (CSP) strip products, ball grid array package (BGA) single independent products, etc.

[0003] In the existing packaging process, due to cost considerations, even for different types of products, a single production line is still used for processing. For example, when performing the tin ball leveling operation, the pressing head needs to be replaced according to the size of the product.

[0004] However, during the process of replacing the existing pressing head, foreign objects are easily introduced, contaminating the surface of the tin ball, thus increasing the defective rate of the product. Moreover, replacing the existing pressing head consumes time, resulting in poor work efficiency.

[0005] Furthermore, for small-sized ball grid array (BGA) products, due to time or cost considerations, the pressing head is not replaced, and the same small-sized pressing head needs to be continuously used for flattening operations, resulting in the existing small-sized pressing head being easily overused and quickly damaged, causing problems such as scratches on the tin balls and poor coplanarity in the later manufactured products, and significantly increasing the defective rate of the entire batch of products.

[0006] In addition, for large-sized chip scale package (CSP) products, when the existing equipment does not have a pressing head of an appropriate size, a small-sized pressing head needs to be used to process large-sized products, resulting in the small-sized pressing head being repeatedly used for flattening operations on a single product, causing the existing small-sized pressing head to be easily overused and quickly damaged, not only increasing the risk of product defective rate, but also significantly reducing the processing efficiency.

[0007] Therefore, how to overcome the above-mentioned various problems of the existing technology has actually become an urgent issue to be solved at present. Summary of the Invention

[0008] The object of the present invention is to provide a leveling device to solve at least one of the above problems.

[0009] In view of the various defects of the above-mentioned prior art, the present disclosure provides a leveling device, including: a first pressing head, which includes a plurality of moving members; and a second pressing head, which is configured corresponding to the first pressing head, so that each of the moving members can move independently towards the second pressing head to flatten the target object.

[0010] In a specific embodiment of the above-mentioned leveling device, the moving member is a plate body.

[0011] In a specific embodiment of the above-mentioned leveling device, the plurality of moving members are arranged in an array.

[0012] In a specific embodiment of the above-mentioned leveling device, the first pressing head further includes a plurality of transmission members that link each of the moving members to drive each of the moving members to move towards the second pressing head. For example, each of the transmission members is a telescopic pneumatic rod. Alternatively, each of the moving members is connected to a plurality of the transmission members.

[0013] In a specific embodiment of the above-mentioned leveling device, the first pressing head further includes at least two positioning members, which are respectively arranged on the opposite two sides of any two adjacent moving members, so that any two adjacent moving members are located between the two positioning members. For example, each of the positioning members includes a positioning block and a sensor that controls the positioning block. Further, the sensor is a photosensitive type, and the top surface heights of the positioning block and the sensor are the same.

[0014] In a specific embodiment of the above-mentioned leveling device, the sensor is adjacent to the outer edge of the first pressing head.

[0015] In a specific embodiment of the above-mentioned leveling device, the second pressing head is a working platform.

[0016] As can be seen from the above, the leveling device of the present disclosure mainly relies on the design that the first pressing head includes a plurality of moving members. According to the processing requirements of different types and sizes of products, different numbers of moving members are moved towards the second pressing head to perform the flattening action. Therefore, compared with the prior art, the present disclosure does not need to disassemble and assemble the pressing head multiple times to avoid the risk of foreign objects being introduced during the process of replacing the pressing head, thus avoiding the surface of the solder balls from being contaminated and further reducing the defective rate of the products.

[0017] Furthermore, for small-sized products, considering time or cost, the leveling device of the present disclosure can evenly press down four moving members to share the pressing force and effectively avoid problems such as scratches on the solder balls and poor coplanarity of the subsequently manufactured products, thereby effectively reducing the defective rate of the entire batch of products.

[0018] In addition, for large-sized products, multiple moving members can be used alternately without replacing the first pressing head, so as to avoid excessive use and rapid damage of a single moving member, which can not only reduce the risk of product defective rate, but also improve the processing efficiency. Description of the Drawings

[0019] Figure 1 It is a three-dimensional schematic diagram of the leveling device of the present disclosure.

[0020] Figure 2A is Figure 1 Partial top-down plan schematic diagram of.

[0021] Figure 2B is Figure 2A Partial three-dimensional schematic diagram of.

[0022] Figures 3A to 3C It is a three-dimensional schematic diagram of different actuation modes of the leveling device of the present disclosure.

[0023] Figure 4A and Figure 4B It is a three-dimensional schematic diagram of different applications of the leveling device of the present disclosure.

[0024] Description of main component symbols

[0025] 1 First press head

[0026] 2 Second press head

[0027] 11, 12, 13, 14 Moving parts

[0028] 15 Transmission part

[0029] 16 Positioning part

[0030] 160 Positioning block

[0031] 161 Inductor

[0032] 3 Leveling device

[0033] 8, 9 Target object. Detailed implementation manners

[0034] The following illustrates the implementation manners of the present disclosure through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification.

[0035] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the conditions for the implementation of this disclosure. Therefore, they do not have any substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that this disclosure can produce and the purpose that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in this disclosure. At the same time, the terms such as "upper", "first", "second", "one", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation of this disclosure. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope that this disclosure can implement.

[0036] Figure 1 This is a three-dimensional schematic diagram of the leveling device 3 of the present disclosure. As Figure 1 shown, the leveling device 3 is used for the solder ball leveling operation of the ball planting action in the substrate packaging process, and it includes a first press head 1 and a second press head 2 arranged corresponding to the first press head 1. Among them, the first press head 1 includes a plurality of moving parts 11, 12, 13, 14 and as Figure 2A shown, a plurality of transmission parts 15 and a plurality of positioning parts 16.

[0037] The moving parts 11, 12, 13, 14 are plate bodies, such as rectangular sheets, and each of the moving parts 11, 12, 13, 14 is arranged in an array to form a rectangular contour.

[0038] In this embodiment, the first press head 1 includes four moving parts 11, 12, 13, 14, which are arranged adjacent to each other in a checkerboard pattern to serve as a modular ball planting special flattening jig that can be automatically split into four parts. For example, the maximum tolerance of the two contact surfaces of each of the moving parts 11, 12, 13, 14 is 10 micrometers (μm) to prevent the moving parts 11, 12, 13, 14 from scratching adjacent moving parts 11, 12, 13, 14 when moving.

[0039] Furthermore, the four moving parts 11, 12, 13, 14 can move independently towards the second press head 2, such as displacement in the up and down direction. For example, for different leveling areas (such as the size of the substrate), one moving part 12 can be moved as Figure 3A shown, two moving parts 11, 12 can be moved as Figure 3B shown, or four moving parts 11, 12, 13, 14 can be moved as Figure 3C shown.

[0040] The transmission parts 15 are linked to the moving parts 11, 12, 13, 14 to drive the moving parts 11, 12, 13, 14 to move towards the second press head 2.

[0041] In this embodiment, the transmission member 15 is a telescopic pneumatic rod, which drives the displacement of the moving members 11, 12, 13, 14 by telescoping up and down. For example, multiple, such as four, transmission members 15 are arranged on a single moving member 11, 12, 13, 14, as Figure 2A shown, so that each of the transmission members 15 corresponds to the corners of the moving members 11, 12, 13, 14, making the forces on the moving members 11, 12, 13, 14 evenly distributed.

[0042] Furthermore, a single transmission member 15 is connected to a single control air valve (not shown in the figure) to independently control each transmission member 15. Therefore, when a part of the control air valves (not shown in the figure) on one of the moving members 11, 12, 13, 14 fails, there are still other control air valves (not shown in the figure) that can control the transmission member 15, enabling the leveling device 3 to still control the forces on the moving members 11, 12, 13, 14, so as to avoid the problem of uneven pressure during the flattening operation of the first pressing head 1, thereby avoiding the loss of yield.

[0043] The positioning members 16 are arranged on the sides of each of the moving members 11, 12, 13, 14. Specifically, the first pressing head 1 includes at least two positioning members 16, which are respectively arranged on the opposite two sides of any two adjacent moving members 11, 12, 13, 14, so that any two adjacent moving members 11, 12, 13, 14 are located between the two positioning members 16, ensuring that each of the moving members 11, 12, 13, 14 does not shift up and down and tilt during operation. For example, as Figure 2A shown, two positioning members 16 are provided on the upper and lower opposite sides of the moving members 11, 12, and two positioning members 16 are also provided on the upper and lower opposite sides of the moving members 13, 14, and the moving members 11, 14 can share a positioning member 16; the moving members 12, 13 can share a positioning member 16. Similarly, the two flush outer sides of the moving members 11, 12 share a positioning member 16; the two flush outer sides of the moving members 13, 14 share a positioning member 16.

[0044] In this embodiment, the positioning member 16 includes a positioning block 160 and a sensor 161 for controlling the positioning block 160, and the sensor 161 is adjacent to the outer edge of the first pressing head 1. As Figure 2A shown. For example, the positioning block 160 is an L-shaped block, and the sensor 161 is a photosensitive rectangular block, which is combined with the positioning block 160 to form a rectangular block, and the top surface heights of the two are the same and flush, as Figure 2B shown, which is conducive to detecting whether there is light leakage between it and the positioning block 160, thereby avoiding abnormal positioning.

[0045] Furthermore, the top surface of the positioning block 160 is flush with the top surfaces of the moving members 11, 12, 13, 14, enabling the sensor 161 to determine the flatness of the moving members 11, 12, 13, 14 based on the state of the positioning block 160. For example, when one of the moving members 12 descends, whether the positioning block 160 remains flat without tilting, as Figure 3A shown. Or, when two moving members 11, 12 descend, whether the positioning block 160 remains flat without tilting, as Figure 3B shown.

[0046] In addition, when the sensor 161 detects that the moving members 11, 12, 13, 14 are not fully positioned, the leveling device 3 will automatically activate the warning mechanism. For example, when the moving members 11, 12, 13, 14 do not remain flat, the leveling device 3 automatically activates the warning mechanism, so that the control air valve (not shown in the figure) can be controlled to actuate the transmission member 15 to adjust the force applied to the moving members 11, 12, 13, 14, enabling the moving members 11, 12, 13, 14 to be flat and positioned.

[0047] In addition, when multiple moving members 11, 12 are actuated, as Figure 3B or Figure 3C shown, it is necessary to first confirm whether the sensor 161 and the positioning block 160 are fully engaged to avoid abnormal vertical misalignment. If the sensor 161 detects that the positioning block 160 is not fully positioned, the control air valve (not shown in the figure) stops actuating the transmission member 15 to press down, and the leveling device 3 will automatically activate the warning mechanism.

[0048] The second indenter 2 described above is an integral working platform, and the area of its working region corresponds to the area of the contour region of the first indenter 1.

[0049] During use, as Figure 4A shown, for an object 9 with a single substrate specification of Ball Grid Array (BGA) (substrate area is 19*19 cm 2 ), first, four sensors 161 detect whether the alignment between the four moving members 11, 12, 13, 14 is flat. Then, the four moving members 11, 12, 13, 14 are synchronously lowered to the vicinity above the second indenter 2. After the sensor 161 reconfirms that there is no abnormality in the alignment of the four lowered moving members 11, 12, 13, 14, the transmission members 15 corresponding to the four moving members 11, 12, 13, 14 uniformly apply pressure to press down the four moving members 11, 12, 13, 14 onto the object 9 to flatten the solder balls (not shown in the figure) on the object 9.

[0050] Therefore, if small-sized products (substrate area is 19*19 cm 2) By using this leveling device 3, there is no need to replace the first pressing head 1, thus avoiding the risk of foreign objects being introduced during the process of replacing the pressing head. Therefore, it can prevent the solder balls on the surface of the target object 9 from being contaminated, and thus reduce the defect rate of the target object 9.

[0051] Moreover, using this leveling device 3 can avoid the time consumption caused by the process of replacing the pressing head, and thus improve work efficiency.

[0052] In addition, considering time or cost, if the pressing head is not replaced and the process work needs to be carried out using a single pressing head, it is necessary to use a small-sized pressing plane to repeat the pressing action. Therefore, when using this leveling device 3, only a single first pressing head 1 needs to be purchased, and the four moving parts 11, 12, 13, 14 are evenly pressed down, so that the four divided areas of the target object 9 correspond to each of the moving parts 11, 12, 13, 14, to share the pressing force and avoid the problem that the moving parts 11, 12, 13, 14 are quickly damaged. Thus, it can effectively prevent problems such as the solder balls of the later-produced products being scratched and the coplanarity being poor, and effectively reduce the defect rate of the entire batch of products.

[0053] On the other hand, as Figure 4B shown, if the target object 8 is a strip-shaped substrate of the Chip Scale Package (CSP) specification (the substrate area is 37.5 * 37.5 cm 2 ), the solder balls on the target object 8 can be flattened by a single moving part 12, and the other moving parts 11, 13, 14 do not act.

[0054] Therefore, when the production process requires continuous processing of large-sized products (the substrate area is 37.5 * 37.5 cm 2 ), by using this leveling device 3, there is no need to replace the first pressing head 1, thus avoiding the risk of foreign objects being introduced during the process of replacing the pressing head. Therefore, it can prevent the solder balls on the surface of the target object 9 from being contaminated, and thus reduce the defect rate of the target object 9.

[0055] Moreover, using this leveling device 3 can avoid the time consumption caused by the process of replacing the pressing head, and thus improve work efficiency.

[0056] In addition, for large-sized products, the four moving parts 11, 12, 13, 14 can be used alternately without replacing the first pressing head 1, so as to avoid the single moving parts 11, 12, 13, 14 being overused on a single product and being quickly damaged, not only effectively reducing the risk of product defect rate, but also greatly improving the processing efficiency.

[0057] In summary, the leveling device of the present disclosure can select an appropriate working mode of the first pressing head (i.e., the number of descending moving parts) for objects of different sizes, so as to avoid the problem of repeatedly disassembling and assembling the pressing head when the existing device processes products of various sizes. Therefore, when using the leveling device of the present disclosure, there is no need to separately purchase pressing heads of different sizes, and the production steps can be reduced to lower the production cost.

[0058] Furthermore, the leveling device of the present disclosure can provide a pressing head with high-precision dimensions (i.e., the number of descending moving parts), so as to avoid the dilemma of repeatedly processing with a single pressing head when the existing device does not have a pressing head of an appropriate size. Therefore, using the leveling device of the present disclosure can improve the processing efficiency and reduce process problems such as solder ball scratches and poor coplanarity.

[0059] In addition, through the configuration of multiple transmission parts (air rods) in the leveling device of the present disclosure, it is beneficial to evenly control the average distribution of the pressure received by the first pressing head (moving part). Therefore, using the leveling device of the present disclosure can avoid the occurrence of poor coplanarity.

[0060] In addition, the leveling device of the present disclosure can simultaneously meet the flattening requirements of chip scale package (CSP) strip products and ball grid array (BGA) single independent products on the same ball mounting workstation. Therefore, the leveling device of the present disclosure overcomes the problem that the flattening operation of the existing single production line cannot simultaneously meet the processing requirements of products of various sizes, and further realizes the requirement of using a single leveling device to complete the processing of different types (CSP and BGA) and different sizes of products.

[0061] The above embodiments are only used to illustrate the principles and effects of the present disclosure by way of example, rather than to limit the present disclosure. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present disclosure. Therefore, the scope of the rights protected by the present disclosure shall be as listed in the claims.

Claims

1. A leveling device, characterized in that: include: A first pressure head including a plurality of moving parts; as well as The second pressing head is arranged corresponding to the first pressing head, so that each of the moving parts can move toward the second pressing head individually to flatten the target object.

2. The leveling device according to claim 1, characterized in that: The moving part is a plate body.

3. The leveling device according to claim 1, characterized in that: The plurality of moving parts are arranged in an array.

4. The leveling device according to claim 1, characterized in that: The first pressing head further comprises a plurality of transmission members linked to the moving members to drive the moving members to move toward the second pressing head.

5. The leveling device according to claim 4, characterized in that: Each of the transmission parts is a telescopic pneumatic rod.

6. The leveling device according to claim 4, characterized in that: Each of the moving parts is connected to a plurality of the transmission parts.

7. The leveling device according to claim 1, characterized in that: The first pressing head further comprises at least two positioning members respectively arranged at two opposite sides of any two adjacent moving members, so that any two adjacent moving members are located between the two positioning members.

8. The leveling device according to claim 7, characterized in that: Each of the positioning members includes a positioning block and a sensor for controlling the positioning block.

9. The leveling device according to claim 8, characterized in that The sensor is a photosensitive type, and the positioning block is at the same height as the top surface of the sensor.

10. The flattening device according to claim 8, characterized in that The sensor is adjacent to the outer edge of the first pressure head.

11. The leveling device according to claim 1, characterized in that: The second pressure head is a working platform.

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