Conductive foam injection molding device
Through the conductive foam injection molding device, the first molding mold and the conductive material injection device are used to solve the deformation problem caused by the temperature difference during the molding of foam and conductive material in the prior art, and a higher quality and smooth conductive foam product is achieved.
Patent Information
- Application Number
- CN202510543873.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2025-06-20
AI Technical Summary
After forming, the existing conductive foam molding device will deform due to the temperature difference between the foam and the conductive material, which will affect the flatness and quality of the product.
The conductive foam injection molding device is adopted, which preforms the foam layer through the first forming mold, and under the driving of the conductive material injection device, the conductive material is laid on the foam layer to ensure that deformation caused by temperature difference is avoided during molding and to improve fit tightness.
It effectively avoids deformation caused by temperature difference between foam and conductive material when forming, improves the flatness and quality of the finished product, and ensures a close fit between the foam layer and the conductive layer.
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Figure CN120170978A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of conductive foam production devices, specifically to a conductive foam injection molding device. Background Art
[0002] Conductive foam is a conductive electronic shielding material. Its main material is polyethylene or modified polyethylene, which is extruded together with conductive fillers and antistatic agents, and then a sponge core strip is formed by radiation cross-linking and high-temperature foaming. Then, a layer of conductive cloth tape is wrapped around the core strip through processing, so that the conductive foam has shielding performance and conductive performance. SMT conductive foam is a conductive contact terminal with excellent elasticity that can be reflow soldered onto a PCB board through SMT technology. It is a type of conductive foam used for EMI, grounding, or conductive terminals, and its core strip can be made of materials such as silica gel.
[0003] In currently commonly used conductive foam molding devices, the foam is pre-prepared into a sheet shape, and at the same time, the foam is moved to the lower end of the injection device. The conductive material is evenly coated on the outside of the foam through the injection device, and then the conductive material can be driven to be prepared and formed. However, after the foam is formed, there is a stable temperature difference between the surface temperature of the foam surface and the conductive material. Moreover, after the foam comes into contact with the conductive material, the foam deforms due to high temperature, resulting in an uneven surface of the subsequent formed conductive foam, thereby affecting the product quality. Thus, we have proposed a conductive foam injection molding device. Summary of the Invention
[0004] Aiming at the deficiencies of the existing conductive foam injection molding devices, the present invention provides a conductive foam injection molding device, which has the advantages of pre-injection molding the foam layer through a first molding die, and at the same time, the formed foam layer is moved to the lower end of the conductive material feeding device. The conductive material feeding device drives the conductive material to be laid on the upper part of the conductive layer, and the conductive layer drives the reinforcing layer to be clamped outside the foam layer, ensuring that the foam layer and the conductive layer do not deform due to temperature difference during molding, and improving the tightness when they are mutually attached, thus solving the problems raised in the above background art.
[0005] The present invention provides the following technical solution: A conductive foam injection molding device, including a base, an outer shell is installed on the upper part of the base through a positioning structure, a foam feeding device is fixedly connected to one side of the outer shell, a conductive material feeding device is fixedly connected to the middle of the upper end of the outer shell, a first molding die is installed on one side inside the outer shell, a second molding die is fixedly connected to one side of the first molding die, a limiting device is installed on the side of the outer shell, and the limiting device is arranged on the sides of the first molding die and the second molding die. A foam layer is cast and formed inside the first molding die, and a conductive layer is cast and formed between the second molding die and the outer shell.
[0006] Preferably, a first screw rod and a second screw rod are respectively installed inside the conductive material injection device and the foam injection device. A motor is installed on one side of the first screw rod and the second screw rod, and the first screw rod and the second screw rod are spiral-shaped.
[0007] Preferably, one end of the foam injection device is communicated with the first molding die, and the conductive material injection device is communicated with the upper end of the joint of the first molding die and the second molding die.
[0008] Preferably, a first injection pipe and a second injection pipe are respectively installed on the upper parts of the foam injection device and the conductive material injection device, and an injection device is sleeved and installed on the upper parts of the first injection pipe and the second injection pipe.
[0009] Preferably, the limiting device includes a screw rod, the screw rod is threadedly installed on the side surface of the outer shell, and a side pressing plate for limiting the positions of the first molding die and the second molding die is threadedly installed on the inner side of the screw rod.
[0010] Preferably, a support block is movably sleeved inside the bottom end of the outer shell. The support block is arranged at the lower ends of the first molding die and the second molding die, and the upper ends of the first molding die and the second molding die are kept in contact with the top end of the outer shell.
[0011] Preferably, a wire forming plate is fixedly connected inside the first molding die. The wire forming plate is located above the foam layer and is adapted to the pouring groove.
[0012] Preferably, a reinforcing layer that is matched with the upper end of the foam layer to form a pouring groove is fixedly connected to the lower end of the conductive layer, and the conductive layer is attached and installed on the upper end of the foam layer.
[0013] Preferably, a condensing device is installed outside the first molding die and the second molding die, and a traction device is installed on the side surfaces of the foam layer and the conductive layer.
[0014] Compared with the existing conductive foam injection molding device, the present invention has the following beneficial effects:
[0015] 1. In this conductive foam injection molding device, the first molding die and the second molding die overlap each other, and at the same time, the first molding die and the second molding die are installed inside the outer shell. According to the different thicknesses of the first molding die and the second molding die, a support block is installed at the bottom end of the outer shell. The support block limits the positions of the first molding die and the second molding die, and the first molding die and the second molding die are attached inside the outer shell. At the same time, rotate the screw rod, and the screw rod pushes the side pressing plate to move inward. The side pressing plate squeezes and limits the positions of the sides of the first molding die and the second molding die, ensuring the convenience of positioning the first molding die and the second molding die.
[0016] 2. The conductive foam injection molding device drives the foam layer to be molded through the first molding die. At the same time, the wire molding plate drives the formation of a casting groove inside the foam layer. Then the foam layer moves to the lower end of the conductive material feeding device, and the conductive material feeding device pours the conductive material on the upper part of the foam layer. That is, the foam layer and the conductive layer can be integrally molded, and the conductive layer drives the reinforcing layer to be clamped inside the casting groove, improving the tightness when the foam layer and the conductive layer are attached. When there is an opening formed outside the foam layer, the conductive layer fills the gap inside the foam layer, improving the neatness after the foam layer and the conductive layer are molded.
[0017] 3. The conductive foam injection molding device drives the foam and the conductive material to be injected into the first molding die and the second molding die in sequence by the foam feeding device and the conductive material feeding device. That is, the conductive foam can be integrally molded during the molding process, improving the molding efficiency of the conductive foam. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic diagram of the main structure of the present invention;
[0019] Figure 2 is a schematic cross-sectional view of the main structure of the present invention;
[0020] Figure 3 is a schematic diagram of the casting molding state structure of the present invention;
[0021] Figure 4 is a schematic diagram of the enlarged mold structure of the present invention;
[0022] Figure 5 is a schematic diagram of the enlarged conductive foam structure of the present invention;
[0023] Figure 6 is a schematic diagram of the partial enlarged structure of the feeding device of the present invention.
[0024] In the figure: 1. Base; 2. Outer shell; 3. Positioning structure; 4. Foam feeding device; 5. Conductive material feeding device; 6. First screw rod; 7. Second screw rod; 8. First molding die; 9. Second molding die; 10. Wire molding plate; 11. Support block; 12. Screw; 13. Side pressing plate; 14. First injection tube; 15. Second injection tube; 16. Foam layer; 17. Conductive layer; 18. Reinforcing layer. DETAILED DESCRIPTION OF THE INVENTION
[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0026] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , a conductive foam injection molding device, including a base 1, an outer shell 2 is installed on the upper part of the base 1 through a positioning structure 3, the outer shell 2 is installed on the upper part of the base 1, and the outer shell 2 can be installed and disassembled on the upper part of the base 1. One side of the outer shell 2 is fixedly connected with a foam injection device 4, the foam injection device 4 drives the foam to be injected into the interior of the first molding die 8. The middle part of the upper end of the outer shell 2 is fixedly connected with a conductive material injection device 5. The first molding die 8 evenly drives the conductive layer 17 to fit on the upper part of the foam layer 16. One side inside the outer shell 2 is provided with the first molding die 8. One side of the first molding die 8 is fixedly connected with a second molding die 9. After the first molding die 8 and the second molding die 9 cooperate with each other, the first molding die 8 and the second molding die 9 drive the material to be prepared and molded in sequence. A limiting device is installed on the side of the outer shell 2, and the limiting device is arranged on the sides of the first molding die 8 and the second molding die 9. A foam layer 16 is cast and molded inside the first molding die 8, and a conductive layer 17 is cast and molded between the second molding die 9 and the outer shell 2.
[0027] Please refer to Figure 2 , a first screw rod 6 and a second screw rod 7 are respectively installed inside the conductive material injection device 5 and the foam injection device 4. Motors are installed on one side of the first screw rod 6 and the second screw rod 7. The first screw rod 6 and the second screw rod 7 are spiral. Due to the spiral shapes of the first screw rod 6 and the second screw rod 7, and when the motors are started, the motors drive the first screw rod 6 and the second screw rod 7 to rotate. At the same time, after the foam and the conductive material are sequentially injected into the interiors of the foam injection device 4 and the conductive material injection device 5, through the rotation of the first screw rod 6 and the second screw rod 7, the materials can be driven to be evenly distributed to ensure the uniformity when the materials are injected.
[0028] Please refer to Figure 2, the foam injection device 4 is connected to one end of the first molding die 8, and the conductive material injection device 5 is connected to the upper end of the joint between the first molding die 8 and the second molding die 9. Through the connection between the foam injection device 4 and the first molding die 8, the foam can be accurately injected into the interior of the first molding die 8. At the same time, the conductive material is injected into the upper part of the second molding die 9 through the conductive material injection device 5, and then evenly coated on the upper end of the foam layer 16 through the second molding die 9.
[0029] Please refer to Figure 1 , the upper parts of the foam injection device 4 and the conductive material injection device 5 are respectively installed with a first injection pipe 14 and a second injection pipe 15. The upper parts of the first injection pipe 14 and the second injection pipe 15 are sleeved and installed with an injection device. Through the installation of the first injection pipe 14 and the second injection pipe 15 on the upper parts of the foam injection device 4 and the conductive material injection device 5, the foam and the conductive material are evenly injected into the interiors of the foam injection device 4 and the conductive material injection device 5 by using the injection device through the first injection pipe 14 and the second injection pipe 15, improving the efficiency of the foam and the conductive material.
[0030] Please refer to Figure 1 , the limiting device includes a screw rod 12. The screw rod 12 is threadedly installed on the side of the outer shell 2. The inner side of the screw rod 12 is threadedly installed with a side pressing plate 13 for limiting the positions of the first molding die 8 and the second molding die 9. Through the installation of the first screw rod 6 and the second screw rod 7 inside the outer shell 2, and by rotating the screw rod 12 at the same time, the screw rod 12 pushes the side pressing plate 13 to move inward. At the same time, the side pressing plate 13 squeezes and limits the sides of the first molding die 8 and the second molding die 9, ensuring the stability of the first molding die 8 and the second molding die 9 when positioned inside the outer shell 2.
[0031] Please refer to Figure 3 , a support block 11 is movably sleeved inside the bottom end of the outer shell 2. The support block 11 is arranged at the lower ends of the first molding die 8 and the second molding die 9. The upper ends of the first molding die 8 and the second molding die 9 are kept in contact with the top end of the outer shell 2. Through the installation of the support block 11 at the bottom end of the outer shell 2, support blocks 11 with different thicknesses are replaced according to the different thicknesses of the first molding die 8 and the second molding die 9. At the same time, after the support block 11 is installed inside the outer shell 2, the support block 11 supports the bottom ends of the first molding die 8 and the second molding die 9, ensuring the stability of the first molding die 8 and the second molding die 9 when positioned inside the outer shell 2.
[0032] Please refer to Figure 4, a wire forming plate 10 is fixedly connected inside the first forming die 8. The wire forming plate 10 is located above the foam layer 16 and is adapted to the pouring groove. By fixedly connecting the wire forming plate 10 inside the first forming die 8, when the foam is poured and formed, after the foam passes through the inside of the first forming die 8, it forms an integral body, and the formed foam layer 16 is formed. At the same time, the wire forming plate 10 drives the upper part of the foam layer 16 to form a pouring groove.
[0033] Please refer to Figure 5 , a reinforcing layer 18 that is matched with the pouring groove formed on the upper end of the foam layer 16 is fixedly connected to the lower end of the conductive layer 17. The conductive layer 17 is fitted and installed on the upper end of the foam layer 16. By fixedly connecting the reinforcing layer 18 to the lower end of the conductive layer 17, and the reinforcing layer 18 is movably sleeved inside the pouring groove formed on the upper end of the foam layer 16 to ensure the tightness when the foam layer 16 and the conductive layer 17 coincide.
[0034] Please refer to Figure 4 , a condensation device is installed outside the first forming die 8 and the second forming die 9, and a traction device is installed on the sides of the foam layer 16 and the conductive layer 17. By installing the condensation device outside the first forming die 8 and the second forming die 9, the condensation device drives the foam layer 16 and the conductive layer 17 to perform condensation forming treatment. At the same time, a traction device is installed outside the foam layer 16 and the conductive layer 17, and the traction device can improve the convenience after the foam layer 16 and the conductive layer 17 are formed.
[0035] Working principle: When in use, the first forming die 8 and the second forming die 9 are sequentially installed inside the outer shell 2. According to the different thicknesses of the first forming die 8 and the second forming die 9, a support block 11 is installed inside the outer shell 2. The support block 11 drives the first forming die 8 and the second forming die 9 to maintain stability when the positions are limited inside the outer shell 2. At the same time, a screw 12 is installed on the side of the outer shell 2, and the screw 12 pushes the side pressing plate 13 to squeeze and limit the positions of the first forming die 8 and the second forming die 9. The foam material is injected into the inside of the foam feeding device 4 through the first injection pipe 14. The second screw rod 7 is started, and the second screw rod 7 drives the material to be evenly transported to the inside of the first forming die 8. The foam is formed inside the first forming die 8, and the conductive material is injected into the inside of the conductive material feeding device 5 through the second injection pipe 15. At the same time, the material is transported to the inside of the second forming die 9, and at the same time, the material forms the conductive layer 17 and is simultaneously attached to the inside of the foam layer 16, which can drive the material to be quickly integrally formed, and improve the tightness when the foam layer 16 and the conductive layer 17 are attached.
[0036] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A conductive foam injection molding device, comprising a base (1), a housing (2) being mounted on the upper portion of the base (1) via a positioning structure (3), a foam injection device (4) being fixedly connected to one side of the housing (2), characterized in that: A conductive material injection device (5) is fixedly connected to the middle of the upper end of the shell (2); a first molding die (8) is installed on one side of the interior of the shell (2); a second molding die (9) is fixedly connected to one side of the first molding die (8); a limiting device is installed on the side of the shell (2); the limiting device is arranged on the side of the first molding die (8) and the second molding die (9); a foam layer (16) is cast inside the first molding die (8); and a conductive layer (17) is cast between the second molding die (9) and the shell (2).
2. The conductive foam injection molding device according to claim 1, characterized in that: A first screw rod (6) and a second screw rod (7) are respectively installed inside the conductive material injection device (5) and the foam injection device (4), a motor is installed on one side of the first screw rod (6) and the second screw rod (7), and the first screw rod (6) and the second screw rod (7) are spiral-shaped.
3. The conductive foam injection molding device according to claim 1, characterized in that: The foam injection device (4) is connected to one end of the first molding die (8), and the conductive material injection device (5) is connected to the upper end of the connection between the first molding die (8) and the second molding die (9).
4. The conductive foam injection molding device according to claim 1, characterized in that: A first injection tube (14) and a second injection tube (15) are respectively installed on the upper parts of the foam injection device (4) and the conductive material injection device (5); injection devices are sleeved and installed on the upper parts of the first injection tube (14) and the second injection tube (15).
5. The conductive foam injection molding device according to claim 1, characterized in that: The limiting device comprises a screw (12) which is threadedly mounted on the side of the housing (2), and a side pressure plate (13) for limiting the positions of the first molding die (8) and the second molding die (9) is threadedly mounted on the inner side of the screw (12).
6. The conductive foam injection molding device according to claim 1, characterized in that: A support block (11) is movably sleeved inside the bottom end of the shell (2), and the support block (11) is arranged at the lower ends of the first molding die (8) and the second molding die (9), and the upper ends of the first molding die (8) and the second molding die (9) are kept in contact with the top end of the shell (2).
7. The conductive foam injection molding device according to claim 1, characterized in that: A wire forming plate (10) is fixedly connected to the interior of the first forming mold (8), the wire forming plate (10) is located at the upper end of the foam layer (16), and the wire forming plate (10) is compatible with the casting trough.
8. The conductive foam injection molding device according to claim 1, characterized in that: The lower end of the conductive layer (17) is fixedly connected to a reinforcing layer (18) which matches the casting groove formed by the upper end of the foam layer (16), and the conductive layer (17) is fitted on the upper end of the foam layer (16).
9. The conductive foam injection molding device according to claim 1, characterized in that: Condensation devices are installed outside the first molding die (8) and the second molding die (9), and traction devices are installed on the sides of the foam layer (16) and the conductive layer (17).