Two-agent type metal adhesive and metal adhesive piece

Abstract

The invention relates to a two-agent type metal adhesive which comprises an agent A and an agent B, 100 wt% of the agent A comprises 20 to 60 wt% of alumina powder, 0.1 to 10 wt% of boron nitride powder, 14 to 30 wt% of silicon dioxide powder, 10 to 30 wt% of iron powder, 0.5 to 1 wt% of carbon black powder and 15 to 30 wt% of bisphenol A epoxy resin. The agent B comprises the following components in percentage by weight: 20 to 60 percent of aluminum oxide powder, 0.1 to 10 percent of boron nitride powder, 15 to 30 percent of silicon dioxide powder, 15 to 30 percent of poly (bisphenol A-co-epichlorohydrin) and 1 to 5 percent of bisphenol F type epoxy resin. The invention further discloses a metal bonding piece formed by mixing and curing the agent A and the agent B of the two-agent type metal bonding agent. The metal bonding piece has good bonding strength, insulativity, thermal conductivity and temperature resistance, so that two metal objects made of different materials can be firmly bonded with each other by using the two-agent type metal bonding agent.

Description

Technical Field

[0001] The present invention relates to a metal bonding technology, and particularly to a two-component metal adhesive for bonding two metal objects of different materials to each other, and a metal bonded part formed by the two-component metal adhesive. Background Art

[0002] Currently, on the market, different material metal objects are usually bonded to each other by using solder (such as soldering tin) for welding. In addition, to meet market demands, the surface of the metal object is usually formed by functional (such as heat dissipation) paint or ink. However, the solder cannot adhere to the surface formed by the functional paint or ink. Therefore, in order to weld different material metal objects, it is necessary to first perform chemical electroplating (such as nickel plating) on the surface of the metal object to form a metal layer that can allow the solder to adhere.

[0003] As can be seen from the above processing steps, the chemical electroplating must be performed first to smoothly perform the welding, which has the disadvantages of cumbersome steps and energy consumption, resulting in the problem of high carbon emissions. In addition, the process of performing the chemical electroplating will also generate electroplating wastewater that is highly polluting to the environment, and the electroplating wastewater must undergo complex and rigorous treatment procedures before it can be discharged, thus giving rise to the problems of being environmentally unfriendly and having high treatment costs. Summary of the Invention

[0004] An object of the present invention is to provide a two-component metal adhesive for adhering metal objects of different materials, which is environmentally friendly, energy-saving, and simple to operate.

[0005] The two-component metal adhesive of the present invention comprises Agent A and Agent B.

[0006] Based on the total amount of Agent A being 100 wt%, it includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 14 wt% to 30 wt%, iron powder with a content range of 10 wt% to 30 wt%, carbon black powder with a content range of 0.5 wt% to 1 wt%, and bisphenol A type epoxy resin with a content range of 15 wt% to 30 wt%.

[0007] Based on the total amount of Agent B being 100 wt%, it includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 15 wt% to 30 wt%, poly(bisphenol A-co-epichlorohydrin) with a content range of 15 wt% to 30 wt%, and bisphenol F type epoxy resin with a content range of 1 wt% to 5 wt%.

[0008] For the two-component metal adhesive of the present invention, based on the total amount of Agent A being 100 wt%, the content range of the silica powder is 14 wt% to 25 wt%.

[0009] In the two-component metal adhesive of the present invention, based on the total amount of the A agent being 100 wt%, the content range of the iron powder is 10 wt% to 15 wt%.

[0010] Another object of the present invention is to provide a metal bonding member for bonding two independent metal objects to each other.

[0011] The metal bonding member of the present invention is formed by mixing and curing the A agent and the B agent of the two-component metal adhesive.

[0012] In the metal bonding member of the present invention, the weight ratio of the A agent to the B agent is 1:1.

[0013] The beneficial effect of the present invention is that: through the types and content ranges of the components in the A agent and the B agent, when the two-component metal adhesive of the present invention containing the A agent and the B agent is used to bond two independent metal objects to each other, only the separately stored A agent and B agent need to be mixed and left standing in a normal temperature environment, and then the metal bonding member of the present invention that can firmly bond the two metal objects to each other can be cured. Moreover, the metal bonding member has good bonding strength, good insulation, good thermal conductivity and good heat resistance, and is suitable for bonding between metal objects of various materials.

[0014] In addition, compared with the prior art in which chemical electroplating must be carried out first to successfully perform welding to bond two independent metal objects to each other, using the two-component metal adhesive of the present invention to bond two independent metal objects has the advantages of simple operation steps, energy saving, and no wastewater generation, thus having the benefits of low carbon emission and environmental protection. Detailed Embodiments

[0015] The two-component metal adhesive of the present invention includes a separate A agent and B agent. The term "separate" means that the A agent and the B agent are independent of each other and not mixed together.

[0016] The metal bonding member of the present invention is formed by mixing and curing the A agent and the B agent of the two-component metal adhesive.

[0017] The present invention will be described in detail below.

[0018] Based on the total amount of Agent A being 100 wt%, it includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 14 wt% to 30 wt%, iron powder with a content range of 10 wt% to 30 wt%, carbon black powder with a content range of 0.5 wt% to 1 wt%, and bisphenol A epoxy resin with a content range of 15 wt% to 30 wt%.

[0019] Based on the total amount of Agent B being 100 wt%, it includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 15 wt% to 30 wt%, Poly(bisphenol A-co-epichlorohydrin) with a content range of 15 wt% to 30 wt%, and bisphenol F epoxy resin with a content range of 1 wt% to 5 wt%.

[0020] Since the alumina powder is non-conductive, it can endow the metal joint with the property of electrical insulation. In addition, the alumina powder can also endow the metal joint with the properties of heat conduction and heat dissipation. Therefore, the content range of the alumina powder in Agent A is 20 wt% to 60 wt%, and the content range of the alumina powder in Agent B is 20 wt% to 60 wt%, enabling the metal joint formed by mixing and curing Agent A and Agent B to have good heat conduction, heat dissipation, and insulation properties.

[0021] Since the boron nitride powder is non-conductive, it can endow the metal joint with the property of electrical insulation. In addition, the boron nitride powder can also endow the metal joint with the properties of adhesion and heat dissipation. Therefore, the content range of the boron nitride powder in Agent A is 0.1 wt% to 10 wt%, and the content range of the boron nitride powder in Agent B is 0.1 wt% to 10 wt%, enabling the formed metal joint to have good adhesion strength, heat dissipation, and insulation properties.

[0022] Since the silica powder is non-conductive, it can endow the metal joint with the property of electrical insulation. In addition, the silica powder can also endow the metal joint with the properties of adhesion and heat dissipation. Therefore, the content range of the silica powder in Agent A is 14 wt% to 30 wt%, and the content range of the silica powder in Agent B is 15 wt% to 30 wt%, enabling the formed metal joint to have good adhesion strength, heat dissipation, and insulation properties.

[0023] The function of the iron powder is not only to fill the pores, but also to endow the metal bonding member with the property of heat conduction. Therefore, in the Agent A, the content range of the iron powder is 10 wt% to 30 wt%, so that the formed metal bonding member has good compactness and heat conduction.

[0024] The function of the carbon black powder is not only to fill the pores, but also to endow the metal bonding member with the property of heat conduction. Therefore, in the Agent A, the content range of the carbon black powder is 0.5 wt% to 1 wt%, so that the formed metal bonding member has good compactness and heat conduction.

[0025] The function of the bisphenol A epoxy resin is to endow the metal bonding member with the properties of adhesion, heat resistance and chemical resistance. The specific type of the bisphenol A epoxy resin does not need to be particularly limited, and any known or commercially available bisphenol A epoxy resin that can provide adhesiveness and can be cured is applicable to the present invention. Considering controlling the bonding strength and heat and chemical resistance of the metal bonding member, in the Agent A, the content range of the bisphenol A epoxy resin is 15 wt% to 30 wt%.

[0026] The poly(bisphenol A-co-epichlorohydrin) endows the metal bonding member with the property of adhesion. The specific type of the poly(bisphenol A-co-epichlorohydrin) does not need to be particularly limited, and any known or commercially available poly(bisphenol A-co-epichlorohydrin) that can provide adhesiveness is applicable to the present invention. Considering controlling the bonding strength of the metal bonding member, in the Agent B, the content range of the poly(bisphenol A-co-epichlorohydrin) is 15 wt% to 30 wt%.

[0027] The bisphenol F epoxy resin endows the metal bonding member with the property of adhesion. The specific type of the bisphenol F epoxy resin does not need to be particularly limited, and any known or commercially available bisphenol F epoxy resin that can be used as a curing agent is applicable to the present invention. Considering controlling the bonding strength and enhancing the curability of the metal bonding member, in the Agent B, the content range of the bisphenol F epoxy resin is 1 wt% to 5 wt%.

[0028] In some embodiments of the present invention, the density range of the Agent A is 1.5 g / cm 3 to 2.5 g / cm 3 , and the viscosity range at 25 °C is 80,000 cps to 250,000 cps.

[0029] In some embodiments of the present invention, the density range of the Agent B is 1.5 g / cm 3 to 2.5 g / cm 3 , and the viscosity range at 25 °C is 100,000 cps to 250,000 cps.

[0030] The Agent A and the Agent B are stored separately in an environment of 15°C to 28°C. When using the two-component metal adhesive to form the metal bonding member, the Agent A and the Agent B are mixed evenly at a weight ratio of 1:1 to form a colloid, and the colloid is left standing in a normal temperature (15°C to 28°C) environment for 30 minutes to 12 hours, so that the Agent A and the Agent B in the colloid undergo a curing reaction to form the metal bonding member, and the metal bonding member can bond two independent metal objects to each other. Among them, the types of materials of the above two independent metal objects are not limited and can be the same or different from each other. In some applications of the present invention, the metal bonding member is used to bond a metal object made of aluminum and a metal object made of copper to each other. In a specific application of the present invention, the metal bonding member is used to bond a heat pipe to a heat sink fin, and the surface of the heat sink fin is formed by a heat dissipation paint.

[0031] In some embodiments of the present invention, the two-component metal adhesive is an insulating two-component metal adhesive, and the metal bonding member is an insulating metal bonding member.

[0032] The present invention will be further described with reference to the following examples, but it should be understood that the examples are only for illustrative purposes and should not be construed as a limitation on the implementation of the present invention.

[0033] 〈Example 1〉Two-component metal adhesive

[0034] 20.0 wt% of alumina powder (CAS No. 1344-28-1, purchased from Chenzhan Co., Ltd.), 10.0 wt% of boron nitride powder (CAS No. 10043-11-5, purchased from Chenzhan Co., Ltd.), 24.5 wt% of silica powder (CAS No. 7631-86-9, purchased from Kafuter), 15.0 wt% of iron powder (CAS No. 7439-89-6, purchased from Kafuter), 0.5 wt% of carbon black powder (CAS No. 1333-86-4, purchased from Kafuter), and 30.0 wt% of bisphenol A epoxy resin (CAS No. 25085-99-8, purchased from Kafuter) are mixed evenly to obtain a total of 100 wt% of Agent A. The Agent A is stored in an environment of 15°C to 28°C.

[0035] Mix 25.0 wt% of alumina powder (CAS No. 1344-28-1, purchased from Chenzhan Co., Ltd.), 10.0 wt% of boron nitride (CAS No. 10043-11-5, purchased from Chenzhan Co., Ltd.), 30.0 wt% of silica powder (CAS No. 7631-86-9, purchased from Kafuter), 5.0 wt% of bisphenol F type epoxy resin (CAS No. 9003-36-5, purchased from Kafuter), and 30.0 wt% of poly(bisphenol A-co-epichlorohydrin) (CAS No. 25068-38-6, purchased from Kafuter, number average molecular weight less than 700) evenly to obtain Agent B with a total amount of 100 wt%. Store the Agent B in an environment of 15 °C to 28 °C.

[0036] 〈Examples 2 and 3, Comparative Examples 1 and 2〉 Two-component metal adhesive

[0037] Examples 2 and 3, and Comparative Examples 1 and 2 were carried out in the same steps as Example 1, except that the contents of the components in Agent A and Agent B were changed, as shown in Table 1.

[0038] 〈Evaluation items〉

[0039] Taking Example 1 as an example, the following evaluation items are described, and Examples 2 and 3, and Comparative Examples 1 and 2 are measured by the same test method.

[0040] Density: Uniformly mix the Agent A and the Agent B (weight ratio of 1:1) of Example 1 to form a colloid, and let the colloid stand for 30 minutes at room temperature (25 °C) to cure the colloid to form a metal bonding part. Then, according to the standard test method of Part 1 of ISO 1183-1 (2012 edition), measure the densities of the Agent A, the Agent B, and the metal bonding part of Example 1 respectively.

[0041] Viscosity (25 °C): Uniformly mix the Agent A and the Agent B (weight ratio of 1:1) of Example 1 to form a colloid. Then, according to the standard test method of ASTM D1084-97 (2005 edition), measure the viscosities of the Agent A, the Agent B, and the colloid at 25 °C of Example 1 respectively.

[0042] Adhesion: Uniformly mix the Agent A and the Agent B (weight ratio of 1:1) of Example 1 to form a colloid, and uniformly coat the colloid on one surface of an aluminum sheet with an area of 1 cm 2 to form a metal bonding layer, and then 2The copper sheet is placed on the metal bonding layer, and then left standing for 10 minutes at room temperature (25°C) to allow the metal bonding layer to cure and form a metal bonding part, thereby bonding the aluminum sheet and the copper sheet to each other through the metal bonding part to obtain a test sample. Then, according to the standard test method of ASTM D638 (2014 version), the test sample is analyzed to measure the bonding strength of the metal bonding part to the aluminum sheet and the copper sheet. The industry generally requires that the bonding strength of the metal bonding part to copper and aluminum should be above 200N.

[0043] Shore hardness (Type D): The Agent A and Agent B of Example 1 (weight ratio 1:1) are uniformly mixed to form a colloid, and the colloid is left standing for 30 minutes at room temperature (25°C) to allow the colloid to cure and form a metal bonding part. Then, according to the standard test method of ASTM D2240 (2015 version), the Shore hardness of the metal bonding part is measured with a Type D hardness tester. The industry generally requires that the Shore hardness of the metal bonding part should be above 86HD.

[0044] Shear strength: The Agent A and Agent B of Example 1 (weight ratio 1:1) are uniformly mixed to form a colloid, and the colloid is left standing for 30 minutes at room temperature (25°C) to allow the colloid to cure and form a metal bonding part. Then, according to the standard test method of ASTM B831 (2005 version), the shear strength of the metal bonding part is measured. The industry generally requires that the shear strength of the metal bonding part should be above 18MPa.

[0045] Resistivity: The Agent A and Agent B of Example 1 (weight ratio 1:1) are uniformly mixed to form a colloid, and the colloid is left standing for 30 minutes at room temperature (25°C) to allow the colloid to cure and form a metal bonding part. Then, according to the standard test method of ASTM D257 (2005 version), the resistivity of the metal bonding part is measured.

[0046] Thermal conductivity: The Agent A and Agent B of Example 1 (weight ratio 1:1) are uniformly mixed to form a colloid, and the colloid is uniformly coated on one surface of an aluminum foil (thickness 15μm; thermal conductivity 237W / mK) and then left standing for 30 minutes at room temperature (25°C) to allow the colloid to cure and form a metal bonding part with a thickness of 55μm, obtaining a test piece with a total thickness of 70μm.

[0047] Using a thermal conductivity analyzer (manufactured by Hot Disk; model TPS 3500) in combination with a sensor (manufactured by Hot Disk; model C5456; radius 3.189 mm), and according to the standard test method of ISO 22007-2 (2009 edition) and the slab method, the test piece to be tested was measured under the test conditions of a temperature of 25°C, a power of 100 mW, a time of 3 seconds, and a thermal conductivity measurement range of 1 W / mK to 1500 W / mK, and the thermal conductivity of the test piece to be tested was obtained as 87 W / mK.

[0048] Then, the thermal conductivity of the test piece to be tested was substituted into the following formula to calculate the thermal conductivity of the metal bonding part formed by the two-component metal adhesive of Example 1. The formula is: Thermal conductivity of the metal bonding part = (Thermal conductivity of the test piece to be tested × Total thickness of the test piece to be tested - Thermal conductivity of the aluminum foil × Thickness of the aluminum foil) ÷ Thickness of the metal bonding part.

[0049] Temperature resistance range: The A agent and the B agent of Example 1 (weight ratio 1:1) were uniformly mixed to form a colloid, and the colloid was left standing at room temperature (25°C) for 30 minutes to allow the colloid to cure and form a metal bonding part. Then, according to the standard test method of IEC 60216-8 (2013 edition), the temperature resistance range of the metal bonding part was measured.

[0050] Table 1

[0051]

[0052] As can be seen from Table 1, the metal bonding parts of Examples 1 to 3 have good bonding strength, insulation, thermal conductivity and temperature resistance. In particular, compared with the metal bonding part of Comparative Example 1 where boron nitride is not used in both the A agent and the B agent, and compared with the metal bonding part of Comparative Example 2 where the content of boron nitride in both the A agent and the B agent exceeds 10 wt%, the metal bonding parts of Examples 1 to 3 where the boron nitride content ranges from 0.1 wt% to 10 wt% in both the A agent and the B agent have better bonding strength and can be used as good insulators due to their higher resistivity.

[0053] In summary, through the types and content ranges of the components in the Agent A and the Agent B, when the two-component metal adhesive of the present invention containing the Agent A and the Agent B is used to bond two separate metal objects to each other, it is only necessary to mix the separately stored Agent A and Agent B and let it stand in a normal temperature environment to solidify and form the metal bonding member of the present invention that can firmly bond the two metal objects to each other. Moreover, the metal bonding member has good bonding strength, good insulation, good thermal conductivity and good heat resistance, and is applicable to the bonding between metal objects of various materials. Therefore, using the two-component metal adhesive to bond metal objects of different materials has the advantages of simple operation steps, energy saving and no wastewater generation, thus having the benefits of low carbon emissions and environmental protection, and can indeed achieve the purpose of the present invention.

[0054] However, the above are only examples of the present invention, and the scope of implementation of the present invention cannot be limited thereby. All simple equivalent changes and modifications made according to the claims and the content of the specification of the present invention still fall within the scope covered by the present invention.

Claims

1. A two-component metal adhesive, characterized in that, It includes: Agent A, based on the total amount of Agent A being 100 wt%, includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 14 wt% to 30 wt%, iron powder with a content range of 10 wt% to 30 wt%, carbon black powder with a content range of 0.5 wt% to 1 wt%, and bisphenol A type epoxy resin with a content range of 15 wt% to 30 wt%; and Agent B, based on the total amount of Agent B being 100 wt%, includes alumina powder with a content range of 20 wt% to 60 wt%, boron nitride powder with a content range of 0.1 wt% to 10 wt%, silica powder with a content range of 15 wt% to 30 wt%, poly(bisphenol A-co-epichlorohydrin) with a content range of 15 wt% to 30 wt%, and bisphenol F type epoxy resin with a content range of 1 wt% to 5 wt%.

2. The two-component metal adhesive according to claim 1, characterized in that: Based on the total amount of Agent A being 100 wt%, the content range of the silica powder is 14 wt% to 25 wt%.

3. The two-component metal adhesive according to claim 1, characterized in that: Based on the total amount of Agent A being 100 wt%, the content range of the iron powder is 10 wt% to 15 wt%.

4. A metal bonding part, characterized in that: The metal bonding member is formed by mixing and curing Agent A and Agent B of the two-component metal bonding agent according to any one of claims 1 to 3.

5. The metal bonding part according to claim 4, characterized in that: The weight ratio of Agent A to Agent B is 1:1.

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