Wafer drying apparatus and wafer drying method

Abstract

The application discloses a wafer drying device and a wafer drying method, and particularly relates to the technical field of wafer drying, and comprises a main body and a spin-drying frame, a driving part comprises a turnover frame matched with the spin-drying frame, a clamping part comprises a plurality of placing grooves opened on the spin-drying frame, a plurality of pressure-tight closing members are arranged in each placing groove, the pressure-tight closing members clamp and fix the wafers in the placing grooves, an adjusting part comprises adjusting rods corresponding to the pressure-tight closing members, when the adjusting rods move intermittently, the pressure-tight closing members are reciprocally extruded, the pressure-tight closing members distributed on the circumferential side of the wafer are intermittently opened, a flow guide part comprises flow guide plates symmetrically arranged outside the pressure-tight closing members, when the pressure-tight closing members are opened, the two flow guide plates abut and push, the included angle of the two flow guide plates is increased, and the guide channel formed is expanded; the wafer can be fixed, meanwhile, the fixed position can avoid hindering drying, and the drying efficiency and quality of the wafer are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer drying, and more particularly to a wafer drying device and a wafer drying method. BACKGROUND

[0002] In the manufacturing process of semiconductor integrated circuit chips, chemical mechanical planarization is a core technology for global planarization of wafer surfaces. Through chemical corrosion in a polishing liquid and mechanical polishing, combined with physical friction of a polyurethane polishing pad, nanoscale surface morphology control is achieved. Since CMP is a wet processing technology, a large amount of polishing liquid containing abrasive particles, polishing debris and metal ion contaminants are introduced in the processing process, resulting in the formation of a complex heterogeneous adhesion layer on the wafer surface. At the end of the CMP process, the cleaning and drying processes have a decisive influence on device performance. If the residual contaminants are not completely removed, fatal defects such as gate oxide breakdown and metal interconnection short circuit will be caused.

[0003] In the prior art, the method of spin-drying is generally used for drying the wafer surface. Specifically, the wafer is placed in a spin-drying frame, and the cleaning liquid on the wafer surface is removed by the centrifugal force generated by the high-speed rotation of the wafer. However, in the actual drying process, multiple wafers are usually processed at the same time. When these wafers rotate in the spin-drying frame, on the one hand, the wafers will collide and rub with the inner groove of the spin-drying frame, and on the other hand, there is a risk of mutual collision between multiple wafers. To solve this problem, the wafers in the spin-drying frame need to be fixed. However, this fixing method also brings new problems. The cleaning liquid is easily retained on the wafer surface at the position where the wafer is fixed. Whether it is spin-dried by centrifugal force or dried by blowing hot nitrogen, the fixing device will hinder the drying effect of the wafer, affecting the efficiency and quality of drying. SUMMARY

[0004] In order to overcome the above-mentioned defects of the prior art, the present application provides a wafer drying device and a wafer drying method to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a wafer drying device, comprising a main body and a spin-drying frame, further comprising:

[0006] a driving part comprising a turnover frame matched with the spin-drying frame;

[0007] a clamping part comprising a plurality of placement grooves opened on the spin-drying frame, and a plurality of pressure expansion elements are arranged in each placement groove to clamp and fix the wafer in the placement groove;

[0008] An adjusting part comprising adjusting rods corresponding to the pressure receiving clamps, when the adjusting rods move intermittently, the pressure receiving clamps are reciprocally pressed, and the pressure receiving clamps distributed on the periphery of the wafer are intermittently opened;

[0009] A flow guiding part comprising flow guiding plates symmetrically arranged outside the pressure receiving clamps, when the pressure receiving clamps are opened, the two flow guiding plates are pushed against each other, the included angle of the two plates is increased, and the guiding channel is expanded.

[0010] Preferably, a rotating disc is arranged in the main body, a plurality of supporting blocks are fixedly connected to the top of the rotating disc, each supporting block is rotationally connected with a corresponding turnover frame, a motor is fixedly connected to the bottom of the main body, the output end of the motor is coaxially fixedly connected with the rotating disc, the turnover frame is rotationally connected with the supporting block through a rotating shaft, a plurality of air holes are arranged on the rotating disc, and a handle is arranged on the side wall of the turnover frame.

[0011] Preferably, a plurality of sliding grooves corresponding to the pressure receiving clamps and communicating with the placing grooves are arranged on the spin-drying frame, a pushing plate is slidably connected in each sliding groove, the pushing plate corresponds to the adjusting rod, each pressure receiving clamp comprises two moving plates, and the pushing plate can drive the corresponding two moving plates to move towards or away from each other.

[0012] Preferably, an extrusion block is fixedly connected to the bottom of the pushing plate, a baffle is arranged at one end of the sliding groove towards the center of the spin-drying frame, the baffle is connected with the side wall of the extrusion block through a first spring, and the opposite ends of each group of two moving plates are connected with the side wall of the placing groove through second springs.

[0013] Preferably, a guide frame is fixedly connected to each end of the adjusting rod, two swing rods are rotationally connected to the two side walls of the turnover frame, the two swing rods on the same side are connected through a third spring, and a plug-in column is arranged at the free end of each swing rod and inserted into the corresponding guide frame.

[0014] Preferably, a plurality of connecting rods corresponding to the turnover frame are slidably connected to the rotating disc, the number of connecting rods in each group is two, a connecting frame is fixedly connected to each of the two adjusting rods close to the center of the rotating disc, and when the turnover frame is turned to the inside of the main body, the connecting rod can be matched with the corresponding connecting frame.

[0015] Preferably, a fixed ring is arranged below the rotating disc in the main body, two guide grooves are arranged on the side wall of the fixed ring, and the lower end of the connecting rod penetrates through the rotating disc and is provided with a guide column inserted into the corresponding guide groove.

[0016] Preferably, the guide grooves undulate up and down along the horizontal direction, and the two guide grooves are arranged in a staggered manner.

[0017] Preferably, a circular groove is formed on the moving plate, a rotating shaft is rotatably connected in the circular groove, the rotating shaft is connected with the side wall of the circular groove through a torsional spring, and a guide plate is fixedly connected to the rotating shaft.

[0018] A wafer drying method, comprising the following steps:

[0019] S1, multiple wafers are respectively placed in the placing slots in the spin-drying frame, and the wafers are located between the pressure expansion and contraction members;

[0020] S2, the handle is rotated to make the opening of the turnover frame face upward, and the spin-drying frame loaded with the wafers is placed in the turnover frame; during the placing process, the multiple pressure expansion and contraction members clamp the corresponding wafers respectively;

[0021] S3, the handle is rotated to make the turnover frame and the connecting rod complete the cooperation, the motor and the gas feeding device are started, and the rotating disc drives the multiple turnover frames to rotate synchronously, and the gas feeding device continuously feeds hot nitrogen gas to dry the multiple wafers;

[0022] S4, while the turnover frame drives the wafers to rotate centrifugally, the pressure expansion and contraction members in the same placing slot can be intermittently opened and closed, so that the wafers are clamped and fixed during the rotating process, and the clamping position can be switched, thereby avoiding liquid residues at the contact position between the pressure expansion and contraction members and the wafers;

[0023] S5, while the clamping device is opened, the two guide plates corresponding to each group can change the inclination angle to form a guide channel, so that the hot nitrogen gas in the main body is guided to the surface of the wafer corresponding to the pressure expansion and contraction member.

[0024] The technical effects and advantages of the present application are as follows:

[0025] 1. According to the present application, the turnover frame, the spin-drying frame, the placing slot, the pushing plate, the moving plate, the extrusion block, the first spring and the second spring are cooperatively arranged, when the spin-drying frame is placed in the turnover frame, four groups of pressure expansion and contraction members are arranged in the same placing slot, the four groups of pressure expansion and contraction members clamp and fix the four corners of the wafer respectively, so that each wafer is stably fixed, thereby effectively avoiding the mutual collision between the wafers and preventing the wafers from rubbing against the side wall of the spin-drying frame.

[0026] 2. According to the present application, the adjusting rod, the swing rod, the wire frame, the connecting frame, the connecting rod, the guide slot and the guide column are cooperatively arranged, four pressure expansion and contraction members are arranged in the same placing slot, two pressure expansion and contraction members on the same diagonal line form a group, and the two groups are alternately switched, so that the wafer is fixed well and the clamping position of the wafer can be flexibly switched, thereby effectively avoiding the problem of liquid stagnation caused by the fixed clamping position, reducing the obstruction of the pressure expansion and contraction members to the centrifugal drying process, and ensuring that the wafer is always in a stable fixed state.

[0027] 3. The application is characterized in that when the pressure receiving and opening member is opened, the two moving plates move in opposite directions, at the same time, the two guide plates gradually tilt under the action of the torsional spring, showing a form that the interval is smaller near the one end of the wafer and the interval is larger far from the one end of the wafer, thereby forming a guide channel, at this time, the hot nitrogen gas in the main body converges to the position corresponding to the pressure receiving and opening member and the wafer under the guidance of the guide channel, in this way, the drying effect of the position can be enhanced, and the problem of residual cleaning liquid can be effectively avoided. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is the overall structure schematic diagram of the application.

[0029] Figure 2 It is the structure schematic diagram of the turnover frame and the spin-drying frame of the application.

[0030] Figure 3 It is the structure schematic diagram of the pressure receiving and opening member and the guide part of the application.

[0031] Figure 4 It is the structure schematic diagram in the placing groove of the application.

[0032] Figure 5 It is the enlarged view of A in the application. Figure 4

[0033] Figure 6 It is the exploded view of the guide part of the application.

[0034] Figure 7 It is the structure schematic diagram of the connecting frame and the connecting rod of the application.

[0035] Figure 8 It is the full section front view in the main body of the application.

[0036] Figure 9 It is the part drawing in the fixed ring and the guide groove of the application.

[0037] ​The figure marks are: 1, main body; 2, spin-drying frame; 3, driving part; 301, supporting block; 302, turnover frame; 303, motor; 304, rotating shaft; 305, handle; 306, rotating disc; 307, air hole; 4, clamping part; 401, pressure expansion piece; 4011, pushing plate; 4012, moving plate; 4013, extrusion block; 402, placing groove; 403, baffle; 404, first spring; 405, second spring; 5, adjusting part; 501, adjusting rod; 502, guide frame; 503, swing lever; 504, third spring; 505, inserting column; 506, connecting rod; 507, connecting frame; 508, fixing ring; 509, guide groove; 510, guide column; 6, flow guide part; 601, flow guide plate; 602, circular groove; 603, rotating shaft; 604, torsional spring. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0039] Embodiment one

[0040] When the wafer surface is subjected to spin-drying treatment, the wafer needs to be placed in the spin-drying frame 2, and the centrifugal force generated by high-speed rotation of the wafer is used to remove the cleaning liquid on the surface of the wafer. However, during high-speed rotation and spin-drying, multiple wafers are usually processed at the same time. When these wafers rotate in the spin-drying frame 2, on the one hand, the wafers will collide and rub against the inner groove of the spin-drying frame 2, and on the other hand, there is a risk of mutual collision between multiple wafers, which is likely to cause damage and corner loss of the wafers.

[0041] To solve the above technical problems, please refer to Figures 1 to 5 The first embodiment of the present application provides a wafer drying device, which comprises a main body 1 and a spin-drying frame 2, and further comprises a driving part 3 and a clamping part 4. The driving part 3 comprises a turnover frame 302 matched with the spin-drying frame 2. The clamping part 4 comprises multiple placing grooves 402 opened on the spin-drying frame 2, and multiple pressure expansion pieces 401 are arranged in each placing groove 402 to clamp and fix the wafers in the placing groove 402.

[0042] The main body 1 is provided with a rotating disc 306, a plurality of supporting blocks 301 are fixedly connected to the top of the rotating disc 306, each supporting block 301 is rotationally connected with a corresponding turnover frame 302, a motor 303 is fixedly connected to the bottom of the main body 1, the output end of the motor 303 is coaxially fixedly connected with the rotating disc 306, the turnover frame 302 is rotationally connected with the supporting block 301 through a rotating shaft 304, a plurality of air holes 307 are formed in the rotating disc 306, a handle 305 is arranged on the side wall of the turnover frame 302, the air holes 307 are used for passing hot nitrogen gas, and the nitrogen gas heating and feeding mode is a prior art and will not be repeated here.

[0043] A plurality of sliding grooves corresponding to the pressure expansion and contraction members 401 and communicating with the placing grooves 402 are formed in the spin-drying frame 2, a pushing plate 4011 is slidably connected in each sliding groove, the pushing plate 4011 corresponds to the adjusting rod 501, each pressure expansion and contraction member 401 includes two moving plates 4012, the pushing plate 4011 is hollow triangular in the middle, when the pushing plate 4011 moves, the inclined surface in the middle of the pushing plate 4011 can push the two moving plates 4012 to relatively move, the relative movement of the two moving plates 4012 can clamp and fix the corresponding wafer, and the moving plate 4012 is made of rubber and has a certain deformation buffering capacity.

[0044] The pushing plate 4011 is fixedly connected with an extrusion block 4013 at the bottom, one end of the sliding groove towards the center of the spin-drying frame 2 is provided with a baffle 403, the baffle 403 is connected with the side wall of the extrusion block 4013 through a first spring 404, the opposite ends of the two moving plates 4012 in each group are respectively connected with the side wall of the placing groove 402 through a second spring 405, the extrusion block 4013 is triangularly arranged, and the end face of the extrusion block 4013 on the outer side is obliquely arranged, in the process of placing the spin-drying frame 2 into the turnover frame 302, the side wall of the turnover frame 302 can push the inclined surface of the extrusion block 4013, so that the extrusion block 4013 moves.

[0045] In actual use, the wafer is placed in the placing groove 402 of the spin-drying frame 2, the handle 305 is rotated, the handle 305 drives the turnover frame 302 to rotate around the rotating shaft 304, the opening of the turnover frame 302 is upward, the spin-drying frame 2 is placed in the turnover frame 302, in the process of placing the spin-drying frame 2 in the turnover frame 302, the side wall of the turnover frame 302 extrudes the inclined surface of the extrusion block 4013, the extrusion block 4013 moves towards the center of the spin-drying frame 2, and the first spring 404 is compressed, the extrusion block 4013 drives the push plate 4011 to move towards the center of the spin-drying frame 2, the inclined surface in the middle of the push plate 4011 drives the two moving plates 4012 to move relatively, and the second spring 405 is stretched, the relative movement of the two moving plates 4012 gradually clamps and fixes the corresponding wafer, when the spin-drying frame 2 is completely placed in the turnover frame 302, the outer side of the push plate 4011 is in contact with the adjusting rod 501, and a plurality of wafers are clamped and fixed in the corresponding placing grooves 402, in the same placing groove 402, there are four groups of pressure expansion and contraction members 401, which clamp and fix the four corners of the wafer respectively, so that the fixing of each wafer is realized, the mutual collision between the wafers is avoided, and the friction between the wafers and the side wall of the spin-drying frame 2 is also avoided.

[0046] Embodiment two

[0047] On the basis of the above embodiment, the wafers in the spin-drying frame 2 need to be fixed, however, although the above clamping and fixing method can avoid damage caused by collision of the wafers, the cleaning liquid is easy to stay on the surface of the wafer due to the blockage of the pressure expansion and contraction member 401, no matter whether the spin-drying is realized by relying on the centrifugal force or the drying is realized by using hot nitrogen gas, the clamping and fixing of the wafer by the pressure expansion and contraction member 401 will hinder the drying effect of the wafer, and affect the efficiency and quality of the drying.

[0048] Please refer to Figures 1 to 9 As shown in the figure, the adjusting part 5 includes corresponding adjusting rods 501, when the adjusting rods 501 move intermittently, the pressure expansion and contraction members 401 are reciprocally extruded, and the pressure expansion and contraction members 401 distributed on the circumferential side of the wafer are intermittently opened.

[0049] Each adjusting rod 501 is fixedly connected with a guide frame 502 at both ends, two swing rods 503 are rotatably connected to the two side walls of the turnover frame 302 respectively, the two swing rods 503 are distributed in an X shape, the two swing rods 503 on the same side are connected through a third spring 504, and a plug column 505 is arranged at the free end of each swing rod 503 and inserted into the corresponding guide frame 502.

[0050] A plurality of groups of connecting rods 506 corresponding to the turnover frame 302 are slidably connected to the rotating disc 306, each group of connecting rods 506 has two connecting rods, and two adjusting rods 501 near the center of the rotating disc 306 are fixedly connected with connecting frames 507 respectively, and when the turnover frame 302 is turned to the inside of the main body 1, the connecting rods 506 can be matched with the corresponding connecting frames 507.

[0051] The main body 1 is provided with a fixed ring 508 below the rotating disc 306, two guide grooves 509 are formed in the side wall of the fixed ring 508, the lower end of the connecting rod 506 penetrates the rotating disc 306 and is provided with a guide column 510 inserted into the corresponding guide groove 509, the guide column 510 away from the center of the rotating disc 306 is inserted into the upper guide groove 509, and the guide column 510 near the center of the rotating disc 306 is inserted into the lower guide groove 509.

[0052] As shown in Figure 9 , the guide groove 509 undulates up and down along the horizontal direction, and the two guide grooves 509 are arranged in a staggered manner, and the guide groove 509 is an annular groove.

[0053] For the convenience of description, the center of the rotating disc 306 is taken as the reference point, the side near the center of the rotating disc 306 is the inner side, and the side away from the center of the rotating disc 306 is the outer side, and the initial state is that the connecting rod 506 moves upward to the limit position, when the drying rack 2 and the turnover frame 302 are assembled, the handle 305 is rotated, the handle 305 drives the turnover frame 302 to rotate around the rotating shaft 304, so that the turnover frame 302 is rotated to the inside of the main body 1, at the same time, the two connecting frames 507 are driven by the turnover frame 302 to rotate to the directly below, so that the connecting rod 506 is inserted into the corresponding connecting frame 507, so that the connecting rod 506 and the connecting frame 507 are matched, at the same time, the position of the turnover frame 302 is limited, and the above operation is repeated to load a plurality of drying racks 2 into the turnover frame 302, the motor 303 is started, and hot nitrogen gas is introduced into the air hole 307, the motor 303 drives the rotating disc 306 to rotate, the rotating disc 306 drives a plurality of turnover frames 302 and drying racks 2 to rotate through the supporting plate, the drying rack 2 drives a plurality of wafer pieces to rotate in the main body 1, and the water on the surface of the wafer is thrown out by the action of centrifugal force, and the hot nitrogen gas introduced further enhances the drying effect of the wafer.

[0054] Meanwhile, as the rotating disc 306 rotates, the rotating disc 306 drives the plurality of connecting rods 506 to rotate, so that the connecting rods 506 drive the guide columns 510 to move in the guide grooves 509 in the fixed ring 508. Since the guide grooves 509 are up and down in the horizontal direction and are annular grooves, the connecting rods 506 can move reciprocatingly in the vertical direction while moving circumferentially along with the rotating disc 306. When the outer connecting rods 506 are driven by the guide columns 510 to move downward, the outer connecting rods 506 drive the adjusting rods 501 to move downward through the connecting frames 507, the outer adjusting rods 501 drive the outer guide frames 502 to move downward, the outer guide frames 502 drive the swing rods 503 to rotate and compress the third springs 504 through the insertion columns 505, the insertion columns 505 on the upper side of the swing rods 503 drive the upper inner adjusting rods 501 to move upward, the two adjusting rods 501 diagonally arranged move away from each other, so that the adjusting rods 501 no longer block the corresponding push plates 4011, the push plates 4011 move away from the center of the spin-drying rack 2 under the restoring action of the first springs 404, the inclined surfaces in the middle of the push plates 4011 move away from the center of the spin-drying rack 2, the two moving plates 4012 corresponding to the push plates 4011 move away from each other under the restoring action of the second springs 405, the opposite ends of the two moving plates 4012 contact the inclined surfaces in the middle of the push plates 4011 under the action of the second springs 405, so that the moving plates 4012 no longer clamp the wafers, and the feedback is in the same placement groove 402. The two pressure expansion and contraction members 401 diagonally arranged are open. Since the inner guide columns 510 do not displace vertically at this time, the corresponding adjusting rods 501 do not displace, and the two pressure expansion and contraction members 401 diagonally arranged in the same placement groove 402 are still closed, so as to fix the wafers. As the rotating disc 306 rotates, the outer guide columns 510 move upward to the initial position, and the inner guide columns 510 move upward. As described above, when the inner guide columns 510 move upward, the other two adjusting rods 501 diagonally arranged move away from each other, and the feedback is in the same placement groove 402. The four pressure expansion and contraction members 401 are arranged in diagonal lines as a group, and are switched alternately in pairs. The wafer clamping position is switched while the fixing effect of the wafers is ensured, so that the stagnation of the cleaning liquid caused by the clamping position can be effectively avoided, the pressure expansion and contraction members 401 are weakened to hinder the centrifugal drying, and the fixing effect of the wafers is ensured.

[0055] Example Three

[0056] On the basis of the above-mentioned embodiments, when the wafer is subjected to the spin-drying operation, the pressure receiving and opening member 401 is in an intermittent opening state. When the pressure receiving and opening member 401 is opened, the moving plate 4012 is in a parallel position relationship with the wafer. Moreover, after the pressure receiving and opening member 401 is opened, the wafer surface at the corresponding position is retained with the cleaning liquid due to the previous clamping state. At this time, although the pressure receiving and opening member 401 is no longer in contact with the wafer surface, the existence of the pressure receiving and opening member 401 still interferes with the blowing effect of the hot nitrogen gas, thereby reducing the drying efficiency of the wafer and affecting the drying quality.

[0057] Referring to Figures 1 to 9 As shown in the figure, the flow guide part 6 includes flow guide plates 601 symmetrically arranged outside the pressure receiving and opening member 401. When the pressure receiving and opening member 401 is opened, the two flow guide plates 601 abut and push each other, the included angle between the two flow guide plates 601 increases, and the guide channel formed is expanded.

[0058] The moving plate 4012 is provided with a circular groove 602. A rotating shaft 603 is rotatably connected in the circular groove 602. The rotating shaft 603 is connected with the side wall of the circular groove 602 through a torsional spring 604. The flow guide plate 601 is fixedly connected to the rotating shaft 603.

[0059] On the basis of the above-mentioned embodiment two, when the pressure receiving and opening member 401 clamps and fixes the wafer, the two moving plates 4012 drive the two flow guide plates 601 to move relative to each other. Since the flow guide plates 601 are arranged in an inclined manner, one end of the flow guide plates 601 first contacts the wafer. With the relative movement of the two moving plates 4012, the wafer is clamped, so that the two flow guide plates 601 gradually swing to a position parallel to the moving plate 4012, so that the flow guide plates 601 rotate relative to the moving plate 4012. The flow guide plates 601 drive the rotating shaft 603 to rotate and stretch the torsional spring 604. This is the clamping state. When the pressure receiving and opening member 401 is opened, the two moving plates 4012 move away from each other. With the movement of the two moving plates 4012 away from each other, the two flow guide plates 601 begin to incline under the restoring action of the torsional spring 604. The distance between the two ends of the two flow guide plates 601 close to the wafer is small, and the distance between the two ends of the two flow guide plates 601 away from the wafer is large, forming a flow guide channel. At this time, the hot nitrogen gas in the main body 1 converges towards the position corresponding to the pressure receiving and opening member 401 and the wafer under the flow guiding action of the flow guide channel. Therefore, the position is the contact position of the pressure receiving and opening member 401 and the wafer, and the cleaning liquid is relatively more retained at this position. The flow guide channel formed by the two flow guide plates 601 can further converge the hot nitrogen gas, strengthen the drying effect at this position, and avoid the retention of the cleaning liquid.

[0060] Embodiment four

[0061] The embodiment provides a wafer drying method, which comprises the following steps:

[0062] S1, respectively, a plurality of wafers are placed in the placing groove 402 in the spin-drying frame 2, and the wafers are located between the pressure expansion and closing members 401;

[0063] S2, rotating the handle 305 to make the opening of the turnover frame 302 face upward, and placing the spin-drying frame 2 loaded with wafers into the turnover frame 302, and during the placing process, a plurality of pressure expansion and closing members 401 clamp the corresponding wafers respectively;

[0064] S3, rotating the handle 305 to make the turnover frame 302 and the connecting rod 506 complete the cooperation, starting the motor 303 and the gas feeding device, and the rotating disc 306 drives a plurality of turnover frames 302 to rotate synchronously, and at the same time, the gas feeding device continuously feeds hot nitrogen gas to dry a plurality of wafers;

[0065] S4, while the turnover frame 302 drives the wafers to rotate centrifugally, the pressure expansion and closing member 401 in the same placing groove 402 can be intermittently opened and closed, so that the wafers are clamped and fixed during the rotating process, and the clamping position can be switched, so as to avoid liquid residue at the contact position between the pressure expansion and closing member 401 and the wafers;

[0066] S5, while the clamping device is opened, each group of two corresponding flow guide plates 601 can change the inclination angle to form a flow guide channel, so that the hot nitrogen gas in the main body 1 is guided to the surface of the wafer corresponding to the pressure expansion and closing member 401.

[0067] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A wafer drying apparatus, comprising a main body and a spin dryer, characterized in that, Also includes: The drive unit includes a flip frame that cooperates with the spin dryer; The clamping part includes multiple placement slots on the spin dryer, each placement slot having multiple pressure-bearing tensioning members that clamp and fix the wafers in the placement slots. The spin dryer has multiple sliding grooves corresponding to the pressure-bearing tensioning members and communicating with the placement slots. Each sliding groove has a slidably connected push plate. Each pressure-bearing tensioning member includes two moving plates. The push plate can drive the corresponding two moving plates to move relative to each other or in opposite directions. A pressing block is fixedly connected to the bottom of the push plate. A baffle is provided at one end of the sliding groove facing the center of the spin dryer. The baffle is connected to the side wall of the pressing block through a first spring. The opposite ends of the two moving plates in each group are respectively connected to the side wall of the placement slot through a second spring. The adjustment unit includes an adjustment rod corresponding to the pressure-bearing tension member. When the adjustment rod moves intermittently, it reciprocates to squeeze the pressure-bearing tension member, causing the pressure-bearing tension members distributed on the periphery of the wafer to open intermittently. Each adjustment rod has a guide frame fixedly connected to both ends. Two swing rods are rotatably connected to the two side walls of the flipping frame. The two swing rods on the same side are connected by a third spring. Each swing rod has a post inserted into the corresponding guide frame at its free end. The main body has a turntable. Multiple sets of connecting rods corresponding to the flipping frame are slidably connected to the turntable. Two adjustment rods near the center of the turntable are fixedly connected to the connecting frame. When the flipping frame flips into the main body, the connecting rod can cooperate with the corresponding connecting frame. The main body has a fixing ring located below the turntable. Two guide grooves are opened on the side wall of the fixing ring. The lower end of the connecting rod passes through the turntable and has a guide post inserted into the corresponding guide groove. The guide groove undulates up and down in the horizontal direction, and the two guide grooves are staggered. The guide section includes guide plates symmetrically arranged on the outside of the pressure-bearing tension member. When the pressure-bearing tension member opens, the two guide plates push against each other, the included angle between them increases, and the guide channel formed is expanded.

2. The wafer drying apparatus according to claim 1, characterized in that, The top of the turntable is fixedly connected to multiple support blocks, and each support block is rotatably connected to a corresponding flipping frame. The bottom of the main body is fixedly connected to a motor, and the output end of the motor is coaxially fixedly connected to the turntable. The flipping frame is rotatably connected to the support blocks through a rotating shaft. The turntable has multiple air holes, and the side wall of the flipping frame is provided with a handle.

3. The wafer drying apparatus according to claim 2, characterized in that, A circular groove is provided on the movable plate, and a rotating shaft is rotatably connected inside the circular groove. The rotating shaft is connected to the side wall of the circular groove via a torsion spring, and a guide plate is fixedly connected to the rotating shaft.

4. The drying method for drying wafers using the wafer drying apparatus according to claim 3, characterized in that, The drying method includes the following steps: S1. Place multiple wafers into the placement slots inside the spin dryer; S2. Turn the handle so that the opening of the flip frame faces upward, and place the spin dryer containing the wafer into the flip frame. During the placement process, multiple pressure-bearing clamping parts clamp the corresponding wafers respectively. S3. Turning the handle will engage the flip frame with the connecting rod, turn on the motor and the air supply device, and the turntable will drive multiple flip frames to rotate synchronously. At the same time, the air supply device will continuously supply hot nitrogen to dry multiple wafers. S4. While the flipping frame drives the wafer to rotate centrifugally, the pressure-bearing tensioning component in the same placement slot can open and close intermittently, so that the wafer is always clamped and fixed during rotation. At the same time, the clamping position can be switched to avoid liquid residue at the contact point between the pressure-bearing tensioning component and the wafer. S5. As the clamping device opens, the two guide plates in each group can change their tilt angle to form a guide channel, so that the hot nitrogen gas in the main body can be guided to the wafer surface corresponding to the pressure-shrinking component.

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