Embedded board card with heat dissipation structure

Abstract

The invention relates to the technical field of board cards, in particular to an embedded board card with a heat dissipation structure. Comprising a shell; the plurality of first fixing shells are fixedly connected in the shell, all the first fixing shells are jointly provided with a board card body, and the board card body comprises a heating unit; the cooling shell is fixedly connected outside the shell, and a heat exchange tube is arranged in the cooling shell; and the communicating shell communicates with the heat exchange pipe, the communicating shell is rotationally connected with a rotating shaft, and the rotating shaft is fixedly connected with a plurality of blades. Compared with the prior art, the board card has the following advantages that the board card body is wrapped by the shell, the cooling liquid flows in the heat exchange pipes, the heating unit on the board card body is cooled, isolation of the board card and the environment is achieved, dust, water vapor and the like in the air are prevented from being attached to the surface of the board card body, and then safe operation of the board card body is guaranteed; therefore, the service life of the board card body is prevented from being shortened due to damp or corrosion.

Description

Technical Field

[0001] The present invention relates to the technical field of boards and cards, and in particular to an embedded board and card with a heat dissipation structure. Background Art

[0002] Embedded boards are computer hardware designed for specific applications, usually used to control machines, monitor systems or perform other dedicated tasks. They are widely used in various fields, including industrial automation, consumer electronics, automotive electronics, medical equipment, etc. Embedded boards are designed to meet specific functional requirements, such as data acquisition, communication interface, real-time processing, etc.

[0003] When boards are used in chemical plants and other places, the air in the factory is humid, which will cause a large number of tiny water droplets to condense on the surface of the boards. Although existing boards are coated with a layer of conformal coating on the surface to prevent the boards from being damaged by moisture, once this phenomenon occurs for a long time, the water will mix with other corrosive substances in the air, such as sulfur, which will greatly increase the corrosive ability of the water droplets, causing damage to the boards and short circuits, which will shorten the service life of the boards and increase the cost of use. Summary of the invention

[0004] In order to overcome the shortcomings mentioned in the above background technology, the present invention provides an embedded board with a heat dissipation structure.

[0005] Technical solution: An embedded board with a heat dissipation structure, including: case; There are a plurality of first fixed shells, all of which are fixedly connected to the housing, and all of the first fixed shells are provided with a board body, and the board body contains a heating unit; A cooling shell is fixedly connected to the outside of the shell, and a heat exchange tube is arranged in the cooling shell, and the heat exchange tube is in contact with the heat generating unit of the board body; The connecting shell is connected to the heat exchange tube, the connecting shell is rotatably connected to a rotating shaft, and the rotating shaft is fixed with a plurality of blades.

[0006] Preferably, it also includes: A fixing seat, fixedly connected in the cooling shell, and a motor is fixedly connected to the fixing seat; The blade fan is fixedly connected to the output shaft of the motor, and the output shaft of the motor and the rotating shaft are driven by a gear set.

[0007] Preferably, the heat exchange tube contains a heat absorbing part and a heat dissipating part. The heat absorbing part of the heat exchange tube contacts the heating unit of the board body. The heat dissipating part of the heat exchange tube is spiral-shaped, and the diameters on both sides of the heat dissipating part gradually change, so that all parts of the airflow flowing through the cooling shell can contact the heat exchange tube for heat exchange.

[0008] Preferably, it further includes: A flow guide member, fixedly connected to the inside of the cooling shell through a fixing frame.

[0009] Preferably, the shape of the flow guide member conforms to the shape of the heat dissipation part of the heat exchange tube. The cross section of the flow guide member is L-shaped to change the air flow direction so that the side of the heat dissipation part of the heat exchange tube facing away from the air flow can also contact the air flow for heat exchange.

[0010] Preferably, it further includes: Buffer seats, several of them, all slidingly connected to the shell. A first spring is arranged between the buffer seats and the shell.

[0011] Preferably, it further includes: Limit posts, the number of which is the same as the number of the buffer seats. The limit posts are slidingly connected to the adjacent buffer seats. A second spring is arranged between the limit posts and the adjacent buffer seats. The shell is provided with several grooves for limiting the limit posts, and the number of the grooves is the same as the number of the buffer seats.

[0012] Preferably, it further includes: First sliding rods, the number of which is the same as the number of the first fixed shells. The first sliding rods are slidingly connected to the adjacent first fixed shells. The first sliding rods are provided with sliding grooves, and the sliding grooves communicate with the adjacent first fixed shells. The first fixed shells are slidingly connected to the board card body; Limit blocks, several of them, slidingly connected to the adjacent sliding grooves.

[0013] Preferably, it further includes: A second fixed shell, fixedly connected to the outside of the shell, and all the first fixed shells communicate with the second fixed shell; Second sliding rods, slidingly connected to the second fixed shell.

[0014] Preferably, it further includes: A limiting member, slidingly connected to the second fixed shell. A third spring is arranged between the limiting member and the second fixed shell. The second sliding rods are provided with several limiting grooves, and the limiting member limits the second sliding rods through the limiting grooves.

[0015] Compared with the prior art, the present invention has the following advantages: The present invention wraps the board card body through the shell and makes the coolant flow in the heat exchange tube to cool the heating units on the board card body, realizing the isolation of the board card from the environment, thereby preventing dust, water vapor, etc. in the air from adhering to the surface of the board card body, and further ensuring the safe operation of the board card body to avoid shortening the service life of the board card body due to moisture or corrosion.

[0016] The gas flowing in the cooling shell is guided by a flow guide member, so that heat exchange can also be carried out on the side of the heat exchange tube facing away from the air flow direction, thereby improving the heat exchange efficiency of the heat exchange tube and improving the heat dissipation efficiency of the heat generating unit of the board body of the device.

[0017] The vibration energy of the housing is absorbed by the first spring between the housing and the buffer seat, thereby realizing shock absorption of the housing, further protecting the board body, and making the use environment of the device wider.

[0018] The limiting block is driven to move by the second sliding rod, thereby realizing the rapid disassembly and assembly of the board body and improving the maintenance or repair speed of the device. Description of the Drawings

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a three-dimensional structural sectional view of the housing and the cooling shell of the present invention; Figure 3 is a three-dimensional structural schematic diagram of the motor and the fan of the present invention; Figure 4 is a three-dimensional structural sectional view of the heat exchange tube and the flow guide member of the present invention; Figure 5 is a three-dimensional structural schematic diagram of the housing, the buffer seat and the limiting column of the present invention; Figure 6 is a three-dimensional structural schematic diagram of the sliding groove and the limiting block of the present invention; Figure 7 is a three-dimensional structural sectional view of the second fixed shell and the second sliding rod of the present invention.

[0020] Reference numerals: 1, housing; 2, first fixed shell; 3, board body; 4, cooling shell; 5, heat exchange tube; 6, communication shell; 7, rotating shaft; 8, blade; 9, fixed seat; 10, motor; 11, fan; 12, flow guide member; 13, buffer seat; 14, limiting column; 15, first sliding rod; 16, sliding groove; 17, limiting block; 18, second fixed shell; 19, second sliding rod; 20, limiting member. Detailed Description of the Invention

[0021] Although the present invention may be described with respect to a particular application or industry, those skilled in the art will recognize the broader applicability of the present invention. Those of ordinary skill in the art will recognize that terms such as up, down, etc. are used to describe the drawings and do not represent a limitation on the scope of the present invention. Any numerical labels such as first or second are merely illustrative and are not intended to limit the scope of the present invention in any way.

[0022] An embedded board with a heat dissipation structure, as Figures 1-3As shown, it includes: a shell 1; a first fixed shell 2, which has a plurality of them and is fixedly connected to the shell 1, and all the first fixed shells 2 are commonly provided with a board body 3, and the board body 3 contains a heating unit; a cooling shell 4, which is fixedly connected to the outside of the shell 1, and a heat exchange tube 5 is provided in the cooling shell 4, and the heat exchange tube 5 is in contact with the heating unit of the board body 3; a connecting shell 6, which is connected to the heat exchange tube 5, and the connecting shell 6 is rotatably connected to a rotating shaft 7, and the rotating shaft 7 is fixedly connected to a plurality of blades 8.

[0023] In the above scheme, it is intended to prevent water vapor and impurities in the air from adhering to the surface of the board body 3, thereby preventing the board body 3 from being corroded. The housing 1 is formed by splicing the upper and lower parts so that the board body 3 can be installed therein. The cooling shell 4 is cylindrical. A heat-conducting material such as silicone grease can be coated between the heat exchange tube 5 and the heating unit of the board body 3 to improve the heat exchange efficiency between the heat exchange tube 5 and the heating unit of the board body 3, thereby enhancing the heat dissipation effect of the heating unit on the board body 3. The heat exchange tube 5 is filled with coolant to transfer heat from the heat absorption part of the heat exchange tube 5 to the heat dissipation part.

[0024] Further, such as Figures 2-4 As shown, it also includes: a fixed base 9, which is fixedly connected to the cooling shell 4, and a motor 10 is fixedly connected to the fixed base 9; a blade fan 11, which is fixedly connected to the output shaft of the motor 10, and the output shaft of the motor 10 and the rotating shaft 7 are driven by a gear set.

[0025] The heat exchange tube 5 includes a heat absorbing part and a heat dissipating part. The heat absorbing part of the heat exchange tube 5 contacts the heating unit of the board body 3. The heat dissipating part of the heat exchange tube 5 is spiral-shaped, and the diameters on both sides of the heat dissipating part gradually change, so that all parts of the airflow flowing through the cooling shell 4 can contact the heat exchange tube 5 for heat exchange.

[0026] In the above scheme, the purpose is to improve the heat dissipation effect of the device on the board body 3. When the blade fan 11 rotates, wind flow is generated. When the wind flow is generated in the cooling shell 4 and exchanges heat with the heat exchange tube 5, the farther the distance from the heat exchange tube 5, the worse the heat exchange effect of the gas. Therefore, the heat dissipation part of the heat exchange tube 5 is spirally shaped with a gradually changing diameter, and the airflow in the cooling shell 4 is blocked in all directions to increase the probability of the airflow contacting the heat dissipation part of the heat exchange tube 5, thereby improving the heat exchange efficiency between the heat dissipation part of the heat exchange tube 5 and the air.

[0027] Further, such as Figure 2 and Figure 4 As shown, it also includes: a flow guide 12, which is fixed to the cooling shell 4 through a fixing frame.

[0028] The shape of the guide 12 matches the shape of the heat dissipation part of the heat exchange tube 5. The cross section of the guide 12 is L-shaped to change the airflow direction so that the side of the heat dissipation part of the heat exchange tube 5 facing away from the airflow can also contact the airflow for heat exchange.

[0029] In the above solution, it aims to further increase the probability of the air contacting the heat dissipation part of the heat exchange tube 5, thereby improving the heat exchange efficiency of the heat dissipation part of the heat exchange tube 5. When the air flow in the cooling shell 4 flows to contact and exchange heat with the heat exchange tube 5 and then continues to flow, the air flow contacts the flow guide member 12 and, under its guiding action, the air flow contacts the side of the heat exchange tube 5 facing away from the air flow direction, thereby improving the heat exchange efficiency between the heat exchange tube 5 and the air, and guiding the heat-exchanged air flow to the periphery of the cooling shell 4 to reduce the mixing degree of the heat-exchanged air flow and the non-heat-exchanged air flow, so as to make full use of the temperature of the air flow.

[0030] Furthermore, as Figure 1 , Figure 2 and Figure 5 shown, it further includes: buffer seats 13, several of them, all slidably connected to the housing 1, and a first spring is provided between the buffer seats 13 and the housing 1.

[0031] Furthermore, as Figure 5 shown, it further includes: limit posts 14, the number of which is the same as the number of buffer seats 13, the limit posts 14 are slidably connected to the adjacent buffer seats 13, a second spring is provided between the limit posts 14 and the adjacent buffer seats 13, and the housing 1 is provided with several grooves for limiting the limit posts 14, and the number of these grooves is the same as the number of buffer seats 13.

[0032] In the above solution, it aims to buffer the large vibrations generated by this device to protect the board body 3. The housing 1 is provided with several bolt holes for fixing this device, and the limit posts 14 are used to fix between the buffer seats 13 and the housing 1 to prevent this device from shaking when it is slightly vibrated and does not require shock absorption. The second spring adjacent to the limit posts 14 is initially in a compressed state.

[0033] Working process: When installing this device, place this device at the installation position, then pass the bolts through the bolt holes on the housing 1, and then rotate the bolts to tighten. The bolts squeeze the housing 1 to move downward, and the housing 1 compresses the first spring between it and the buffer seats 13. Stop rotating the bolts when the limit posts 14 are aligned with the grooves on the housing 1. At this time, the limit posts 14 are inserted into the grooves on the housing 1 under the action of the adjacent second springs. When this device generates large vibrations due to impacts or other reasons, the housing 1 is displaced relative to the buffer seats 13, and the housing 1 squeezes the limit posts 14 to make the limit posts 14 move into the buffer seats 13, and then use the first spring between the housing 1 and the buffer seats 13 to absorb the vibration energy for buffering.

[0034] After installation, during the use of this device, the heating unit on the board card body 3 generates heat. At this time, the motor 10 is started, and the output shaft of the motor 10 drives the fan 11 to rotate, generating an air flow from right to left. The output shaft of the motor 10 drives the rotating shaft 7 to rotate through a gear set, and the rotating shaft 7 drives a number of blades 8 to rotate. The blades 8 drive the coolant in the heat exchange tube 5 to flow, so that the coolant in the heat dissipation part of the heat exchange tube 5 flows from right to left. When the air flow in the cooling shell 4 flows, it passes through the guide member 12, and through the guidance of the guide member 12, it is in full contact with the heat exchange tube 5, so as to make full use of the temperature of the air flow, and then reduce the temperature of the coolant and flow to the heat absorption part of the heat exchange tube 5, absorbing the heat of the heating unit on the board card body 3, thereby enhancing the cooling effect.

[0035] Further, as Figure 6 shown, it further includes: a first sliding rod 15, the number of which is the same as that of the first fixed shell 2. The first sliding rod 15 is slidably connected to the adjacent first fixed shell 2. The first sliding rod 15 is provided with a chute 16, and the chute 16 communicates with the adjacent first fixed shell 2. The first fixed shell 2 is slidably connected to the board card body 3; a limiting block 17, which has several, and is slidably connected to the adjacent chute 16.

[0036] Further, as Figure 1 and Figure 7 shown, it further includes: a second fixed shell 18, which is fixedly connected to the outside of the housing 1, and all the first fixed shells 2 communicate with the second fixed shell 18; a second sliding rod 19, which is slidably connected to the second fixed shell 18.

[0037] In the above solution, it aims to improve the speed of disassembly and assembly of the board card body 3 in this device. The first fixed shell 2 is provided with a protrusion, and the protrusion and the limiting block 17 clamp and fix the board card body 3. The limiting block 17 is composed of a disc, a round rod and a rectangular block. The round rod of the limiting block 17 penetrates through the first sliding rod 15, and the disc of the limiting block 17 is located in the chute 16. The first fixed shell 2 and the second fixed shell 18 are both filled with liquid for transmission. When the liquid in the chute 16 increases, it will push the round rod part of the limiting block 17 to move.

[0038] Further, as Figure 7 shown, it further includes: a limiting member 20, which is slidably connected to the second fixed shell 18. A third spring is arranged between the limiting member 20 and the second fixed shell 18. The second sliding rod 19 is provided with several limiting grooves, and the limiting member 20 limits the second sliding rod 19 through the limiting grooves.

[0039] In the above solution, it is intended to limit the second sliding rod 19 and adjust the pressure of the limiting block 17 on the board card body 3. The limiting member 20 is composed of a wedge-shaped block and a round rod. The round rod of the limiting member 20 penetrates through the second fixed shell 18. When the second sliding rod 19 moves to different positions, the limiting member 20 is inserted into different limiting grooves on the second sliding rod 19, so that the limiting block 17 generates different pressures on the board card body 3.

[0040] Workflow: When the board card body 3 needs to be repaired due to damage or other reasons, the housing 1 is disassembled, and then the limiting member 20 is pulled to separate the limiting member 20 from the limiting groove of the second sliding rod 19. Then, the second sliding rod 19 is pressed, and the second sliding rod 19 presses the liquid in the second fixed shell 18 into the first fixed shell 2. The liquid in the first fixed shell 2 increases, pushing the first sliding rod 15 to move upward. At the same time, the liquid enters the chute 16, pushing the limiting block 17 to move, so that the limiting block 17 releases the block on the board card body 3, facilitating the removal of the board card body 3. After replacing the new board card body 3, the second sliding rod 19 is moved upward. The second sliding rod 19 pumps the liquid in the first fixed shell 2 and the chute 16 into the second fixed shell 18, so that the limiting block 17 clamps the board card body 3, and under the action of the first sliding rod 15, the pressure of the limiting block 17 on the board card body 3 increases to fix the board card body 3. When the second sliding rod 19 moves upward, the second sliding rod 19 presses the limiting member 20, and the limiting member 20 moves and compresses the third spring adjacent to it. When the pressure between the limiting block 17 and the board card body 3 reaches the requirement, the movement of the second sliding rod 19 is stopped. At this time, the limiting member 20 is inserted into the limiting groove of the second sliding rod 19 under the action of the third spring adjacent to it, so as to limit the second sliding rod 19, thereby ensuring the quick disassembly and assembly of the board card body 3 of the device and improving the maintenance efficiency.

[0041] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited by the above embodiments.

Claims

1. An embedded board with a heat dissipation structure, characterized in that: Included are: Housing (1); A plurality of first fixed shells (2) are fixedly connected to the housing (1); all of the first fixed shells (2) are provided with a board body (3); and the board body (3) contains a heating unit; A cooling shell (4) is fixedly connected to the outside of the shell (1), a heat exchange tube (5) is arranged inside the cooling shell (4), and the heat exchange tube (5) is in contact with the heat generating unit of the board body (3); The connecting shell (6) is connected to the heat exchange tube (5); the connecting shell (6) is rotatably connected to a rotating shaft (7); and a plurality of blades (8) are fixedly connected to the rotating shaft (7).

2. The embedded board with a heat dissipation structure according to claim 1, characterized in that: Also included are: A fixed seat (9) is fixedly connected inside the cooling shell (4), and a motor (10) is fixedly connected to the fixed seat (9); The impeller (11) is fixedly connected to the output shaft of the motor (10), and the output shaft of the motor (10) and the rotating shaft (7) are driven via a gear set.

3. The embedded board with a heat dissipation structure according to claim 2, characterized in that: The heat exchange tube (5) comprises a heat absorbing portion and a heat dissipating portion. The heat absorbing portion of the heat exchange tube (5) contacts the heat generating unit of the board body (3). The heat dissipating portion of the heat exchange tube (5) is spiral-shaped, and the diameters of both sides of the heat dissipating portion gradually change, so that each part of the airflow flowing through the cooling shell (4) can contact the heat exchange tube (5) for heat exchange.

4. The embedded board with a heat dissipation structure according to claim 3, characterized in that: Also included are: The flow guide (12) is fixedly connected to the cooling shell (4) via a fixing frame.

5. The embedded board with a heat dissipation structure according to claim 4, characterized in that: The shape of the flow guide (12) matches the shape of the heat dissipation portion of the heat exchange tube (5), and the cross-section of the flow guide (12) is L-shaped, so as to change the direction of the airflow so that the side of the heat dissipation portion of the heat exchange tube (5) facing away from the airflow can also contact the airflow for heat exchange.

6. The embedded board with a heat dissipation structure according to claim 1, characterized in that: Also included are: There are a plurality of buffer seats (13), all of which are slidably connected to the housing (1), and a first spring is provided between the buffer seat (13) and the housing (1).

7. The embedded board with a heat dissipation structure according to claim 6, characterized in that: Also included are: The number of the limiting columns (14) is the same as the number of the buffer seats (13); the limiting columns (14) are slidably connected to adjacent buffer seats (13); a second spring is provided between the limiting columns (14) and the adjacent buffer seats (13); the housing (1) is provided with a plurality of grooves, which are used to limit the limiting columns (14); and the number of the grooves is the same as the number of the buffer seats (13).

8. The embedded board with a heat dissipation structure according to claim 7, characterized in that: Also included are: The number of first sliding rods (15) is the same as the number of the first fixed shells (2); the first sliding rods (15) are slidably connected to the adjacent first fixed shells (2); the first sliding rods (15) are provided with sliding grooves (16); the sliding grooves (16) are connected to the adjacent first fixed shells (2); the first fixed shells (2) are slidably connected to the board body (3); There are a plurality of limit blocks (17) which are slidably connected to adjacent slide grooves (16).

9. The embedded board with a heat dissipation structure according to claim 8, characterized in that: Also included are: A second fixed shell (18) is fixedly connected to the outside of the shell (1), and all of the first fixed shells (2) are in communication with the second fixed shell (18); The second sliding rod (19) is slidably connected to the second fixed shell (18).

10. The embedded board with a heat dissipation structure according to claim 9, characterized in that: Also included are: A limiting member (20) is slidably connected to the second fixed shell (18); a third spring is provided between the limiting member (20) and the second fixed shell (18); the second sliding rod (19) is provided with a plurality of limiting grooves; the limiting member (20) limits the second sliding rod (19) via the limiting grooves.

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