Server

Abstract

The invention discloses a server, which relates to the technical field of servers, and comprises a case, a processor module, a fan module and a radiator, the processor module, the fan module and the radiator are arranged in the accommodating cavity of the case; the fan module extends along a first direction; the radiator comprises a substrate, a heat conduction piece and a heat dissipation piece, and the substrate is connected with the processor module. The heat dissipation piece is arranged between the fan module and the processor module, the size of the heat dissipation piece is larger than or equal to that of the fan module in the first direction, the flow of the fan module flowing through the heat dissipation piece can be increased, the uniformity of heat of the processor module in the server can be improved, local hot spots brought by the processor module can be avoided, and the service life of the server is prolonged. Therefore, the utilization rate of airflow of the fan module can be improved, and heat dissipation power consumption can be reduced.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a server. Background Art

[0002] A server is a device used to provide data processing. The server uses a Central Processing Unit (CPU) to process data.

[0003] In the related art, a circuit board, a fan module, a memory module, and a power module are provided in the server. A CPU is provided on the circuit board, and a radiator is provided on the CPU. In order to guide the airflow, both the CPU and the power module are configured with air guide covers. However, the heat dissipation method adopted by the server has the problem of high heat dissipation power consumption. Summary of the Invention

[0004] This application provides a server to at least solve the problem of high heat dissipation power consumption in the server in the related art.

[0005] This application provides a server, including:

[0006] A chassis having a receiving cavity;

[0007] A processor module disposed in the receiving cavity;

[0008] A fan module disposed in the receiving cavity, the fan module extending along a first direction;

[0009] A radiator disposed in the receiving cavity; the radiator includes a substrate, a heat conduction member, and a heat dissipation member. The substrate is connected to the processor module. The heat dissipation member is disposed between the fan module and the processor module. The heat conduction member connects the substrate and the heat dissipation member. In the first direction, the size of the heat dissipation member is greater than or equal to the size of the fan module.

[0010] In this application, by disposing the heat dissipation member of the radiator between the fan module and the processor module, the size of the heat dissipation member in the first direction can be increased, the flow rate of the fan module flowing through the heat dissipation member can be increased, the uniformity of the heat of the processor module in the server can be improved, local hot spots caused by the processor module can be avoided, thereby the utilization rate of the airflow of the fan module can be improved, the heat dissipation power consumption and noise of the fan module can be reduced, and further the heat dissipation power consumption can be reduced. In addition, by disposing the heat dissipation member of the radiator between the fan module and the processor module and increasing the size of the heat dissipation member in the first direction, the air guide cover can be eliminated, the components of the server can be reduced, and the production cost of the server can be reduced. Description of the Drawings

[0011] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0012] Figure 1 Schematic diagram of a server provided by an embodiment of the present application;

[0013] Figure 2 For Figure 1 Cross-sectional schematic diagram at A-A in

[0014] Figure 3 For Figure 2 Enlarged schematic diagram at B in

[0015] Figure 4 For Figure 1 Enlarged schematic diagram at C in

[0016] Figure 5 Top view schematic diagram of two adjacent heat dissipation fins of a heat sink provided by an embodiment of the present application;

[0017] Figure 6 Front view schematic diagram of a heat dissipation fin of a heat sink provided by an embodiment of the present application;

[0018] Figure 7 For Figure 5 Enlarged schematic diagram at D in

[0019] Among them, the above-mentioned drawings include the following reference numerals:

[0020] 100 - chassis; 110 - accommodation cavity; 200 - circuit board; 300 - processor module; 400 - memory module; 500 - fan module; 610 - substrate; 611 - heat dissipation channel; 621 - evaporation section; 622 - condensation section; 630 - heat dissipation fin; 631 - diversion groove; 632 - roughness increasing part; 640 - liquid pump; 650 - blocking valve; 660 - temperature sensor; 700 - hard disk module; 800 - power supply module; 900 - interface module; 910 - microcontroller. Detailed implementation manners

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0022] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0023] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0024] See Figure 1 As shown, an embodiment of the present application provides a server. The server may include a chassis 100, and the chassis 100 has a receiving cavity 110.

[0025] A circuit board 200 and electrical components may be disposed in the receiving cavity 110 of the chassis 100, and the circuit board 200 is used for electrically connecting to the electrical components. The chassis 100 can serve as a protective structural member for the circuit board 200 and the electrical components to protect the circuit board 200 and the electrical components from dust, moisture, etc. in the external environmental substances of the chassis 100 from entering the chassis 100, affecting the heat dissipation performance of the server and the service performance of the server, thereby improving the data processing performance of the server and the working stability of the server.

[0026] The circuit board 200 is fixedly connected to the chassis 100. Exemplarily, the connection between the circuit board 200 and the inner box wall of the chassis 100 can be fixed by screws.

[0027] See Figure 1 and Figure 2 As shown, the length direction of the circuit board 200 can be the X-axis direction, that is, the first direction is the X-axis direction; the width direction of the circuit board 200 can be the Y-axis direction, that is, the second direction is the Y-axis direction; the height direction of the circuit board 200 can be the Z-axis direction, that is, the third direction is the Z-axis direction.

[0028] The first direction, the second direction and the third direction intersect with each other. In some examples, the first direction, the second direction and the third direction are perpendicular to each other.

[0029] The server may further include a processor module 300. The processor module 300 is disposed on the circuit board 200, and the processor module 300 is electrically connected to the circuit board 200.

[0030] The processor module 300 may include at least one processor.

[0031] Exemplarily, the processor may be a Central Processing Unit (CPU). When the CPU is connected to the circuit board 200, a slot may be provided on the circuit board 200, a hole structure is provided in the slot, the CPU is provided with pins, the CPU is placed in the slot, and the pins of the CPU are inserted into the hole structure.

[0032] The server may further include a memory module 400. The memory module 400 is disposed on the circuit board 200, and the memory module 400 is electrically connected to the circuit board 200.

[0033] The memory module 400 is used to temporarily store data and instructions that the CPU is processing or about to process.

[0034] The memory module 400 may include at least one memory stick.

[0035] Exemplarily, when the memory stick is connected to the circuit board 200, a slot may be provided on the circuit board 200, metal contacts are provided in the insertion, the memory stick is provided with pins, the memory stick is placed in the slot, and the pins of the memory stick are electrically connected to the metal contacts.

[0036] In some examples, the processor module 300 includes two CPUs. The two CPUs are spaced apart along the first direction. Memory sticks are respectively provided on both sides of the CPUs in the first direction.

[0037] The server may further include a fan module 500. The fan module 500 may be disposed in the accommodating cavity 110 of the chassis 100. The fan module 500 may extend along a first direction. The fan module 500 is used to dissipate heat inside the chassis 100 when the server is running.

[0038] The fan module 500 may include at least one fan. The fan may be installed on the inner wall of the chassis 100. Alternatively, the fan may also be installed on the circuit board 200.

[0039] In some examples, the fan module 500 includes a plurality of fans, and the plurality of fans and the inner wall of the chassis 100 may be fixed by screws. The plurality of fans are arranged in sequence along a first direction. In the first direction, the size of the fan module 500 may be L1.

[0040] The server may further include a radiator. The radiator may be disposed in the accommodating cavity 110. The radiator is used to dissipate heat and cool the processor module 300.

[0041] The heat sink may include a substrate 610, a heat conducting member and a heat sink. The substrate 610 may be connected to the processor module 300, the heat sink is arranged between the fan module 500 and the processor module 300, the heat conducting member connects the substrate 610 and the heat sink, and in the first direction, the size of the heat sink is greater than or equal to the size of the fan module 500. In this way, the size of the heat sink in the first direction may be increased, so that the heat sink covers the fan module 500 in the first direction, the flow of the fan module 500 flowing through the heat sink may be increased, the uniformity of the heat of the processor module 300 in the server may be improved, the local hot spots caused by the processor module 300 may be avoided, and the utilization rate of the airflow of the fan module 500 may be improved, the heat dissipation power consumption and noise of the fan module 500 may be reduced, and the heat dissipation power consumption may be reduced, and the greening of the computer room may be realized. In addition, the air guide cover may be eliminated, so that the components of the server are reduced, and the cost of the server may be reduced.

[0042] In some examples, the number of substrates 610 is equal to the number of CPUs. Figure 2 As shown, in the third direction, the substrate 610 can be arranged on the side of the CPU away from the circuit board 200, that is, the substrate 610 can be arranged on the side of the +Z axis direction of the CPU. The substrate 610 can be fixedly connected to the circuit board 200 by screws. A layer of thermal conductive silicone grease can be applied between the substrate 610 and the CPU to fill the gap between the substrate 610 and the CPU, and to improve the heat conduction efficiency between the substrate 610 and the CPU.

[0043] In some examples, the substrate 610 may be made of copper alloy.

[0044] In some examples, the electroless nickel plating and gold plating process can form a metal coating on the surface of the substrate 610, which can improve the heat conduction efficiency between the substrate 610 and the CPU, fill the gap between the substrate 610 and the CPU, reduce the air gap, and reduce the contact thermal resistance.

[0045] The heat conduction component can transfer the heat of the substrate 610 to the heat dissipation component. In some examples, the heat conduction component can utilize the principle of phase change heat transfer and achieve conduction through the evaporation and condensation of the internal working fluid (for example, methanol and water).

[0046] In some examples, the heat conduction component can be a heat pipe. A capillary structure (such as a sintered copper powder wick or a wire mesh wick) is arranged inside the heat pipe.

[0047] The heat dissipation component can include a plurality of heat sinks 630. The plurality of heat sinks 630 are arranged in sequence along the first direction. In some examples, in the first direction, the size of the heat dissipation component can be L2. L2 is greater than or equal to L1. With such a setting, the size of the heat dissipation component in the first direction can be increased, the heat exchange area can be increased, the heat dissipation component can cover the fan module 500 in the first direction, the uniformity of the air flow distribution can be improved, the temperature difference of the air flow inside the chassis 100 can be reduced, the local hot spots caused by the processor module 300 can be avoided, thereby the utilization rate of the air flow of the fan module 500 can be improved, the heat dissipation power consumption and noise of the fan module 500 can be reduced, and further the heat dissipation power consumption can be reduced.

[0048] In a possible implementation manner, the processor module 300 can include a plurality of processors. The plurality of processors are arranged at intervals along the first direction. On one side of the plurality of processors in the third direction, each is connected to a substrate 610, and the substrate 610 is connected to at least one heat conduction component. With such a setting, each processor can be connected to an independent substrate 610, and heat interference between the processors can be avoided.

[0049] Exemplarily, the processor can be a CPU. The processor module 300 can include two CPUs. The two CPUs are arranged at intervals along the first direction. The two CPUs are respectively connected to two substrates 610, that is, one CPU corresponds to one substrate 610. It can be understood that the two CPUs are respectively connected to one substrate 610. The two substrates 610 are respectively connected to at least one heat conduction component.

[0050] In a possible implementation manner, as shown in Figure 1 shown, the server can further include a hard disk module 700, a power supply module 800, and an interface module 900.

[0051] Among them, the hard disk module 700 can be connected to the inner side wall of the chassis 100 or to the circuit board 200. The embodiments of the present application do not make specific requirements on this.

[0052] In some examples, in the second direction, the hard disk module 700 is disposed on the side of the fan module 500 away from the circuit board 200, that is, the hard disk module 700 can be disposed on one side of the fan module 500 in the -Y axis direction. The hard disk module 700 may include a plurality of hard disks. The plurality of hard disks are sequentially arranged along the first direction. The hard disks can be connected to the inner wall of the chassis 100 by screws. The hard disks can be connected to the power supply module 800 through power lines to obtain power. The hard disks can be connected to the circuit board 200 through data lines to achieve data transmission.

[0053] The circuit board 200 is connected to the inner wall of the chassis 100. Refer to Figure 2 As shown, the processor module 300 and the memory module 400 are respectively connected to the circuit board 200.

[0054] In some examples, in the second direction, the circuit board 200, the processor module 300, and the memory module 400 are disposed on the side of the fan module 500 away from the hard disk module 700, that is, the circuit board 200, the processor module 300, and the memory module 400 can be disposed on one side of the fan module 500 in the +Y axis direction.

[0055] The power supply module 800 can be connected to the inner side wall of the chassis 100 or to the circuit board 200. The embodiments of the present application do not make specific requirements on this.

[0056] The power supply module 800 can supply power to the hard disk module 700, the fan module 500, the circuit board 200, the processor module 300, the memory module 400, and the interface module 900.

[0057] In some examples, in the second direction, the power supply module 800 can be disposed on the side of the circuit board 200 away from the fan module 500, that is, the power supply module 800 can be disposed on one side of the circuit board 200 in the +Y axis direction. The power supply module 800 can be connected to the inner side wall of the chassis 100 by screws.

[0058] The interface module 900 can be connected to the inner side wall of the chassis 100 or to the circuit board 200. The embodiments of the present application do not make specific requirements on this.

[0059] The interface module 900 may include a power interface, a network interface, a management interface, etc. The power interface is used to connect to an external power supply and can supply power to the server. The network interface is used to communicate with an external network. The management interface can be used to monitor and maintain the server.

[0060] In some examples, in the second direction, the interface module 900 can be disposed on a side of the circuit board 200 away from the fan module 500, that is, the interface module 900 can be disposed on a side of the +Y axis direction of the circuit board 200. In the first direction, the interface module 900 can be disposed on a side of the power module 800, that is, the interface module 900 can be disposed on a side of the -X axis direction of the power module 800. The interface module 900 and the inner wall of the chassis 100 can be connected by screws.

[0061] In some examples, in the second direction, the air outlet of the fan module 500 faces the circuit board 200, the processor module 300, the memory module 400, the power module 800 and the interface module 900. In this way, the airflow of the fan module 500 can take away the heat of the circuit board 200, the processor module 300, the memory module 400, the power module 800 and the interface module 900.

[0062] It should be pointed out that in the related art, the radiator is set on the CPU, and the temperature of the airflow of the fan module passing through the CPU is greater than the temperature of the airflow of the fan module after the memory module (for example, a difference of 10°C). The CPU brings local hot spots, and the air outlet temperature of the radiator can be above 60 degrees. The high-temperature airflow will blow to the interface module, causing the temperature of the interface module to rise, resulting in an increase in the speed of the fan module, an increase in the proportion of the heat dissipation power consumption of the fan module, and an increase in the noise of the fan module, thereby resulting in high heat dissipation power consumption.

[0063] In the embodiment of the present application, in the second direction, the heat sink can be arranged between the fan module 500 and the circuit board 200. With such arrangement, compared with the heat sink of the radiator in the related art, the size of the heat sink in the first direction can be increased, the heat exchange area can be increased, the heat sink can cover the fan module 500 in the first direction, the uniformity of airflow distribution can be improved, the temperature difference of the airflow inside the chassis 100 can be reduced, the local hot spots caused by the CPU can be avoided, and the utilization rate of the airflow of the fan module 500 can be improved, the heat dissipation power consumption and noise of the fan module 500 can be reduced, and the heat dissipation power consumption can be reduced.

[0064] In one possible implementation, see Figure 1 As shown, the heat sink further includes a liquid pump 640, and a channel portion is provided inside the substrate 610, and a coolant is placed inside the channel portion, and the channel portion is connected to the liquid pump 640. In this way, the heat dissipation area can be increased through the channel portion inside the substrate 610, and the coolant flows in the channel portion to take away the heat of the processor module 300, which can improve the heat conduction efficiency between the substrate 610 and the processor module 300.

[0065] The liquid pump 640 can drive the coolant to circulate in the channel portion.

[0066] In some examples, the coolant can be a fluorinated liquid. The liquid pump 640 drives the fluorinated liquid to flow within the flow channel portion. The fluorinated liquid exchanges heat with the CPU, can carry away the heat of the CPU, and can improve the heat conduction efficiency between the substrate 610 and the CPU.

[0067] In some examples, referring to Figure 2 and Figure 3 As shown, the channel portion can include a plurality of heat dissipation channels 611. The plurality of heat dissipation channels 611 communicate with each other. With such a setting, the liquid pump 640 can drive the coolant to flow within the plurality of heat dissipation channels 611 of the channel portion, and can improve the uniformity of the heat transfer from the processor module 300 to the coolant.

[0068] Among them, the heat dissipation channel 611 can extend along the third direction.

[0069] In some examples, in the third direction, the size of the substrate 610 is L3, and L3 can be greater than or equal to 3 mm and less than or equal to 5 mm. For example, the value of L3 can be 3 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, 4 mm, 4.2 mm, 4.4 mm, 4.6 mm, 4.8 mm, or 5 mm, etc. Of course, L3 can also be other values, and those skilled in the art can select according to requirements, and this embodiment does not limit this. If L3 is less than 3 mm, the substrate 610 will be relatively thin, resulting in the substrate 610 bending in a vibration or impact environment and reducing the heat dissipation performance of the radiator. If L3 is greater than 5 mm, the substrate 610 will be relatively thick, resulting in an extended heat conduction path, increasing the thermal resistance, and reducing the heat dissipation efficiency. By restricting the size of the substrate 610 in the third direction, the heat dissipation performance of the radiator can be improved, and at the same time, the heat dissipation efficiency can be improved.

[0070] In the third direction, the size of the heat dissipation channel 611 is L4, and L4 can be greater than or equal to 1 mm and less than or equal to 2 mm. For example, the value of L4 can be 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, or 2 mm, etc. Of course, L4 can also be other values, and those skilled in the art can select according to requirements, and this embodiment does not limit this.

[0071] In the second direction, the size of the heat dissipation channel 611 is L5, and L5 can be greater than or equal to 50 μm and less than or equal to 100 μm. For example, the value of L5 can be 50 μm, 55 μm, 60 μm, 65 μm, 75 μm, 80 μm, 85 μm, 90 μm, or 100 μm, etc. Of course, L5 can also be other values, and those skilled in the art can select according to requirements, and this embodiment does not limit this.

[0072] Exemplarily, in the third direction, the size of the substrate 610 may be 4 mm. In the third direction, the size of the heat dissipation channel 611 may be 1.5 mm. In the second direction, the size of the heat dissipation channel 611 may be 75 μm.

[0073] In a possible implementation, the heat conduction component may be a heat pipe. The heat pipe includes at least one evaporation section 621 (see Figure 4 shown) and at least one condensation section 622 (see Figure 1 shown) that are connected. At least one evaporation section 621 is in thermal conduction with the area where the channel portion is located on the substrate 610, and at least one condensation section 622 is in thermal conduction with the heat dissipation component. With such a setting, the working fluid in the evaporation section 621 of the heat conduction component can absorb heat from the channel portion and evaporate. The vapor carries the latent heat of vaporization and flows to the condensation section 622. The condensation section 622 exchanges heat with the heat dissipation component, condenses into a liquid, and returns to the evaporation section 621 through the suction force of the capillary structure to enter the next working cycle.

[0074] Among them, the number of evaporation sections 621 may be equal to the number of condensation sections 622. Or, the number of evaporation sections 621 may be greater than the number of condensation sections 622. Or, the number of evaporation sections 621 may be less than the number of condensation sections 622.

[0075] In some examples, the diameter of the heat pipe is greater than or equal to 6 mm and less than or equal to 8 mm. For example, the diameter of the heat pipe may take values such as 6 mm, 6.2 mm, 6.4 mm, 6.6 mm, 6.8 mm, 7 mm, 7.2 mm, 7.4 mm, 7.6 mm, 7.8 mm, or 8 mm, etc. Of course, the diameter of the heat pipe may also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this.

[0076] Exemplarily, the diameter of the heat pipe is 7 mm. The heat pipe includes one evaporation section 621 and one condensation section 622 that are connected. One evaporation section 621 of the heat pipe is inserted into the area where the channel portion is located on the substrate 610, and the evaporation section 621 is in interference fit with the substrate 610. One condensation section 622 of the heat pipe is inserted into the heat dissipation component, and the condensation section 622 is connected to the heat dissipation component by brazing.

[0077] In other embodiments, the diameter of the heat pipe is 8 mm. The heat pipe includes one evaporation section 621 and one condensation section 622 that are connected. One evaporation section 621 of the heat pipe is inserted into the area where the channel portion is located on the substrate 610, and the evaporation section 621 is welded to the substrate 610. One condensation section 622 of the heat pipe is inserted into the heat dissipation component, and the condensation section 622 is connected to the heat dissipation component by snap - fitting.

[0078] The size of the heat pipe can be set according to the overall size of the radiator and the heat dissipation requirements.

[0079] In some examples, the heat conduction member is a heat pipe. In the extending direction of the heat pipe, the ratio of the size of the evaporation section 621 to the size of the heat conduction member is a1, where a1 is greater than or equal to 1 / 3 and less than or equal to 1 / 2. For example, the value of a1 can be 1 / 3, 9 / 24, 10 / 24, 11 / 24, or 1 / 2, etc. Of course, a1 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this. If a1 is less than 1 / 3, the size of the evaporation section 621 is small, resulting in less contact area between the evaporation section 621 and the channel portion, reducing the heat transfer efficiency. If a1 is greater than 1 / 2, the size of the evaporation section 621 is large, resulting in a longer liquid reflux path after condensation, increasing the resistance of the capillary action and affecting the working fluid circulation efficiency. By limiting the ratio of the size of the evaporation section 621 to the size of the heat conduction member, the heat transfer efficiency can be improved while the working fluid circulation efficiency is not affected.

[0080] Exemplarily, in the extending direction of the heat pipe, the ratio of the size of the evaporation section 621 to the size of the heat conduction member can be 1 / 2.

[0081] In a possible implementation manner, as shown in FIGS. 1 and Figure 4 shown, the radiator may further include a blocking valve 650. The blocking valve 650 is connected between the evaporation section 621 and the channel portion. The blocking valve 650 is configured to increase the heat transfer efficiency between the evaporation section 621 and the channel portion when it is opened. With such a setting, when the blocking valve 650 is opened, the evaporation section 621 can be in direct contact with the channel portion, increasing the heat transfer efficiency between the evaporation section 621 and the channel portion. When the blocking valve 650 is closed, the evaporation section 621 may not be in direct contact with the channel portion, reducing the heat transfer efficiency between the evaporation section 621 and the channel portion. Thus, the heat transfer efficiency between the evaporation section 621 and the channel portion can be adjusted by the state of the blocking valve 650.

[0082] In some examples, the blocking valve 650 can be a temperature memory alloy valve. The temperature memory alloy valve is made of memory alloy. The temperature memory alloy valve can automatically adjust the opening and closing state of the valve according to the temperature without an external power source.

[0083] Exemplarily, the temperature memory alloy valve is configured to open when the temperature of the channel portion is greater than or equal to a first preset temperature, and the temperature memory alloy valve is configured to close when the temperature of the channel portion is less than the first preset temperature. Specifically, when the temperature of the channel portion is greater than or equal to the first preset temperature, the temperature memory alloy valve opens, enabling the evaporation section 621 to be in direct contact with the channel portion. When the temperature of the channel portion is less than the first preset temperature, the temperature memory alloy valve closes, preventing the evaporation section 621 from being in direct contact with the channel portion. With such a setting, the radiator does not need to be equipped with an external power source to adjust the state of the valve, which can reduce the production cost of the radiator.

[0084] Among them, the first preset temperature can be set according to the heat dissipation requirement.

[0085] In some examples, the first preset temperature can be greater than or equal to 45°C and less than or equal to 60°C. For example, the value of the first preset temperature can be 45°C, 46°C, 47°C, 48°C, 49°C, 50°C, 52°C, 54°C, 56°C, 58°C or 60°C, etc. Of course, the first preset temperature can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this.

[0086] Exemplarily, when the temperature of the channel part is greater than or equal to 50°C, the temperature memory alloy valve opens, so that the evaporation section 621 can be in direct contact with the channel part. When the temperature of the channel part is less than 50°C, the temperature memory alloy valve closes, so that the evaporation section 621 can be not in direct contact with the channel part.

[0087] In a possible implementation manner, the radiator further includes a temperature sensor 660 (see Figure 1 shown), and the temperature sensor 660 is used to detect the temperatures of the processor module 300, the substrate 610 and the heat dissipation component.

[0088] The server may further include a microcontroller 910. The microcontroller 910 is electrically connected to the fan module 500, the temperature sensor 660 and the liquid pump 640. With such a setting, the microcontroller 910 can adjust the flow rate of the coolant in the channel part of the substrate 610 and adjust the rotation speed of the fan module 500 according to the temperature detected by the temperature sensor 660, and can realize the intelligent allocation of the heat dissipation inside the server, and can reduce the heat dissipation power consumption while ensuring the heat dissipation effect. In addition, when the temperature of the processor module 300, the substrate 610 or the heat dissipation component is abnormal (when it is greater than the second preset temperature), the heat dissipation can be adjusted in time, improving the reliability and service life of the server.

[0089] In some examples, when the temperature detected by the temperature sensor 660 is less than the second preset temperature, the microcontroller 910 can control the liquid pump 640 to reduce the flow rate of the coolant in the channel part of the substrate 610, and the microcontroller 910 can control the fan module 500 to reduce the rotation speed of the fan module 500; when the temperature detected by the temperature sensor 660 is greater than or equal to the second preset temperature, the microcontroller 910 can control the liquid pump 640 to increase the flow rate of the coolant in the channel part of the substrate 610, and the microcontroller 910 can control the fan module 500 to increase the rotation speed of the fan module 500.

[0090] The second preset temperature can be set according to the heat dissipation requirement. The second preset temperature can be greater than or equal to 45 °C and less than or equal to 60 °C. For example, the value of the second preset temperature can be 45 °C, 46 °C, 47 °C, 48 °C, 49 °C, 50 °C, 52 °C, 54 °C, 56 °C, 58 °C or 60 °C, etc. Of course, the second preset temperature can also be other values, which can be selected by those skilled in the art according to the requirements, and this embodiment does not limit this.

[0091] Exemplarily, when the temperature detected by the temperature sensor 660 is less than 50 °C, the microcontroller 910 can control the liquid pump 640 to reduce the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to reduce the rotation speed of the fan module 500; when the temperature detected by the temperature sensor 660 is greater than or equal to 50 °C, the microcontroller 910 can control the liquid pump 640 to increase the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to increase the rotation speed of the fan module 500.

[0092] In some examples, the temperature sensor 660 can be a thermistor. A temperature sensor 660 can be respectively configured for the processor module 300, the substrate 610 and the heat dissipation component. The temperature sensor 660 corresponding to the processor module 300, the temperature sensor 660 corresponding to the substrate 610 and the temperature sensor 660 corresponding to the heat dissipation component are respectively electrically connected to the microcontroller 910. It can be understood that the microcontroller 910 can receive three detected temperatures.

[0093] When at least one of the three detected temperatures is less than the second preset temperature, the microcontroller 910 can control the liquid pump 640 to reduce the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to reduce the rotation speed of the fan module 500; when at least one of the three detected temperatures is greater than or equal to the second preset temperature, the microcontroller 910 can control the liquid pump 640 to increase the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to increase the rotation speed of the fan module 500. Or, when at least two of the three detected temperatures are less than the second preset temperature, the microcontroller 910 can control the liquid pump 640 to reduce the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to reduce the rotation speed of the fan module 500; when at least two of the three detected temperatures are greater than or equal to the second preset temperature, the microcontroller 910 can control the liquid pump 640 to increase the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to increase the rotation speed of the fan module 500. Or, when all three detected temperatures are less than the second preset temperature, the microcontroller 910 can control the liquid pump 640 to reduce the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to reduce the rotation speed of the fan module 500; when all three detected temperatures are greater than or equal to the second preset temperature, the microcontroller 910 can control the liquid pump 640 to increase the flow rate of the coolant in the channel portion of the substrate 610, and the microcontroller 910 can control the fan module 500 to increase the rotation speed of the fan module 500.

[0094] In a possible implementation, the heat sink may include a plurality of heat sinks 630. The plurality of heat sinks 630 are arranged at intervals along the first direction. With such an arrangement, the airflow of the fan module 500 can flow smoothly between adjacent heat sinks 630, reducing the airflow resistance, thereby improving the heat dissipation efficiency.

[0095] In some examples, refer to Figure 5As shown, in the first direction, the distance L6 between two adjacent heat sinks 630 is greater than or equal to 1 mm and less than or equal to 1.5 mm. For example, the value of L6 can be 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, etc. Of course, L6 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this. If the value of L6 is less than 1 mm, the gap between two adjacent heat sinks 630 is small, the airflow of the fan module 500 is blocked, and the heat dissipation effect will be reduced. If the value of L6 is greater than 1.5 mm, the gap between two adjacent heat sinks 630 is large, the heat dissipation area is reduced, and the heat dissipation capacity of the heat dissipation component is reduced. By restricting the distance between two adjacent heat sinks 630, the heat dissipation effect can be improved, and at the same time, the heat dissipation capacity can also be improved.

[0096] The multiple heat sinks 630 of the heat dissipation component are arranged staggeredly. With such a setting, the effective heat dissipation area of the heat dissipation component can be increased within a limited space, and the contact time between air and the heat sinks 630 can be increased. At the same time, the staggeredly arranged heat sinks 630 can increase the turbulent effect of air flow, thereby improving the heat exchange efficiency.

[0097] In some examples, the heat dissipation component includes multiple heat sinks 630, and the multiple heat sinks 630 include a first heat sink and a second heat sink that are alternately arranged along the first direction. It can be understood that two adjacent heat sinks 630 of the heat dissipation component can be the first heat sink and the second heat sink. In the second direction, the first heat sink and the second heat sink are misaligned with each other, that is, in the second direction, one end of the first heat sink in the -Y axis direction is not aligned with one end of the second heat sink in the -Y axis direction, and one end of the first heat sink in the +Y axis direction is not aligned with one end of the second heat sink in the +Y axis direction. It can be understood that in the first direction, the projection of the first heat sink and the projection of the second heat sink can partially overlap, so that the multiple heat sinks 630 of the heat dissipation component can be arranged staggeredly.

[0098] In the second direction, the misalignment distance L7 between two adjacent heat sinks 630 can be the misalignment distance between one end of the first heat sink in the -Y axis direction and one end of the second heat sink in the -Y axis direction in the second direction, or the misalignment distance between one end of the first heat sink in the +Y axis direction and one end of the second heat sink in the +Y axis direction.

[0099] In some examples, in the second direction, the ratio of the misalignment distance L7 between two adjacent heat sinks 630 to the size L9 of the heat sink 630 is a2, where a2 is greater than or equal to 1 / 3 and less than or equal to 1 / 2. For example, the value of a2 can be 1 / 3, 9 / 24, 10 / 24, 11 / 24, 1 / 2, etc. Of course, a2 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this. If the value of a2 is less than 1 / 3, the misalignment distance between two adjacent heat sinks 630 will be small, resulting in the air flow between the heat sinks 630 tending to be laminar, reducing the turbulent effect and thus lowering the heat exchange efficiency. If the value of a2 is greater than 1 / 2, the misalignment distance between two adjacent heat sinks 630 will be large, resulting in a reduction in the effective heat dissipation area of the heat dissipation component and thus lowering the heat dissipation performance of the heat dissipation component. By restricting the ratio of the misalignment distance between two adjacent heat sinks 630 to the size of the heat sink 630, the turbulent effect of air flow can be increased, the heat exchange efficiency can be improved, and at the same time, the effective heat dissipation area of the heat dissipation component can be increased, and the heat dissipation performance of the heat dissipation component can be improved.

[0100] In a possible implementation manner, the heat sink 630 can be a heat dissipation fin. The heat dissipation fin can be made of an aluminum alloy and graphene composite material. In this way, while ensuring the heat dissipation performance, the weight of the heat sink 630 can be reduced.

[0101] Among them, a flow guiding portion is provided on the heat sink 630. The flow guiding portion can guide the air flow, increase the contact time between the air flow and the surface of the heat sink 630, and thus improve the heat exchange efficiency.

[0102] In some examples, as shown in Figure 6 the flow guiding portion includes at least one flow guiding groove 631, and the flow guiding groove 631 is used to guide the air flow.

[0103] Among them, the number of the flow guiding grooves 631 can be set according to the air flow speed and heat dissipation requirements.

[0104] The shape of the flow guiding groove 631 can be linear, wavy, serrated, etc.

[0105] Exemplarily, the shape of the diversion groove 631 is linear. The angle between the extending direction of the diversion groove 631 and the +Y axis direction can be greater than or equal to 10° and less than or equal to 45°. For example, the value of this angle can be 10°, 15°, 20°, 25°, 30°, 35°, 40° or 45°, etc. Of course, this angle can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit this. If the angle between the extending direction of the diversion groove 631 and the +Y axis direction is less than 10°, the guiding effect of the diversion groove 631 on the air flow will be weakened, and the air flow will pass through the heat sink 630 in a laminar flow form, unable to increase the turbulent effect, thereby reducing the heat exchange efficiency. If the angle between the extending direction of the diversion groove 631 and the +Y axis direction is less than 45°, the contact efficiency between the air flow and the heat sink 630 will be reduced, affecting the heat dissipation effect. By limiting the angle between the extending direction of the diversion groove 631 and the +Y axis direction, the turbulent effect can be increased, the heat exchange efficiency can be improved, and at the same time, the contact efficiency between the air flow and the heat sink 630 can be improved to ensure the heat dissipation effect.

[0106] See Figure 5 and Figure 7 As shown, a roughness increasing portion 632 is provided on the surface of the heat sink 630. The roughness increasing portion 632 can increase the roughness of the surface of the heat sink 630, increase the heat dissipation area, and thus improve the heat exchange efficiency.

[0107] In some examples, the roughness increasing portion 632 can include at least one protrusion, and the number of protrusions can be set according to the heat dissipation requirements.

[0108] In other embodiments, the roughness increasing portion 632 can also include at least one groove, and the number of grooves can be set according to the heat dissipation requirements. Or, the roughness increasing portion 632 can further include at least one protrusion and at least one groove, and the number of protrusions and the number of grooves can be set according to the heat dissipation requirements.

[0109] At least one layer of nano-coating (not shown in the figure) can be provided on the surface of the heat sink 630, which can enhance the radiation heat dissipation effect.

[0110] In some examples, the nano-coating is coated on the surface of the heat sink 630. The material of the nano-coating can be graphene, carbon nanotubes or metal oxides, etc.

[0111] See Figure 5As shown, in the first direction, the size of the heat sink 630 is L8, where L8 is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. For example, the value of L8 can be 0.3 mm, 0.32 mm, 0.34 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm, or 0.5 mm, etc. Of course, L8 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit it. If the value of L8 is less than 0.3 mm, the heat sink 630 will be relatively thin, and the heat sink 630 will bend in a vibrating or impact environment, affecting the reliability of the radiator. If the value of L8 is greater than 0.5 mm, the heat sink 630 will be relatively thick, resulting in a reduction in the number of heat sinks 630 of the radiator and affecting the heat dissipation effect. By restricting the size of the heat sink 630 in the first direction, the reliability of the radiator can be ensured, and at the same time, the heat dissipation effect can be ensured.

[0112] In the second direction, the size of the heat sink 630 is L9, where L9 is greater than or equal to 50 mm and less than or equal to 100 mm. For example, the value of L9 can be 50 mm, 60 mm, 70 mm, 80 mm, 90 mm, or 100 mm, etc. Of course, L9 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit it. If the value of L9 is less than 50 mm, the heat sink 630 will be relatively narrow, resulting in a reduction in the effective heat dissipation area and reducing the heat dissipation performance of the heat dissipation component. If the value of L9 is greater than 100 mm, the heat sink 630 will be relatively wide, increasing the resistance when the air flow passes through the heat dissipation component, resulting in an increase in the load of the fan module 500, and further increasing the noise and energy consumption. By restricting the size of the heat sink 630 in the second direction, the heat dissipation performance of the heat dissipation component can be improved, and at the same time, the noise and energy consumption can be reduced.

[0113] See Figure 6 As shown, in the third direction, the size of the heat sink 630 is L10, where L10 is greater than or equal to 30 mm and less than or equal to 50 mm. For example, the value of L10 can be 30 mm, 35 mm, 40 mm, 45 mm, or 50 mm, etc. Of course, L10 can also be other values, which can be selected by those skilled in the art according to requirements, and this embodiment does not limit it. If the value of L10 is less than 30 mm, the heat sink 630 will be relatively low, resulting in a reduction in the effective heat dissipation area and reducing the heat dissipation performance of the heat dissipation component. If the value of L10 is greater than 50 mm, the heat sink 630 will be relatively high, increasing the resistance when the air flow passes through the heat dissipation component, resulting in an increase in the load of the fan module 500, and further increasing the noise and energy consumption. By restricting the size of the heat sink 630 in the third direction, the heat dissipation performance of the heat dissipation component can be improved, and at the same time, the noise and energy consumption can be reduced.

[0114] The above has introduced in detail a server provided by this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server, characterized in that: include: A chassis (100), the chassis (100) having a containing cavity (110); A processor module (300), the processor module (300) being arranged in the accommodating cavity (110); A fan module (500), the fan module (500) being arranged in the accommodating cavity (110), and the fan module (500) extending along a first direction; A heat sink, the heat sink being arranged in the accommodating cavity (110); the heat sink comprising a substrate (610), a heat conduction member and a heat sink, the substrate (610) being connected to the processor module (300), the heat sink being arranged between the fan module (500) and the processor module (300), the heat conduction member connecting the substrate (610) and the heat sink, and in the first direction, the size of the heat sink is greater than or equal to the size of the fan module (500).

2. The server according to claim 1, characterized in that: The radiator further comprises a liquid pump (640); a channel portion is provided inside the substrate (610); a cooling liquid is contained in the channel portion; and the channel portion is connected to the liquid pump (640).

3. The server according to claim 2, characterized in that: The heat conduction element comprises at least one evaporation section (621) and at least one condensation section (622) connected to each other, at least one of the evaporation sections (621) is thermally connected to a region on the substrate (610) where the channel portion is located, and at least one of the condensation sections (622) is thermally connected to the heat sink.

4. The server according to claim 3, characterized in that: In the extension direction of the heat conducting element, the ratio of the size of the evaporation section (621) to the size of the heat conducting element is greater than or equal to 1 / 3 and less than or equal to 1 / 2.

5. The server according to claim 3, characterized in that: The radiator further comprises a blocking valve (650), wherein the blocking valve (650) is connected between the evaporation section (621) and the channel portion.

6. The server according to claim 5, characterized in that: The blocking valve (650) is a temperature memory alloy valve, which is used to open when the temperature of the channel portion is greater than or equal to a first preset temperature, and is used to close when the temperature of the channel portion is less than the first preset temperature.

7. The server according to any one of claims 2 to 6, characterized in that: The channel portion comprises a plurality of heat dissipation channels (611), and the plurality of heat dissipation channels (611) are interconnected.

8. The server according to any one of claims 1 to 6, characterized in that: The heat sink comprises a plurality of heat sinks (630), the plurality of heat sinks (630) are arranged at intervals along the first direction, and the plurality of heat sinks (630) are arranged in a staggered manner; At least one guide groove (631) is provided on the heat sink (630), and the guide groove (631) is used to guide airflow; The surface of the heat sink (630) is provided with at least one protrusion; The surface of the heat sink (630) is provided with at least one layer of nano coating; In the first direction, the size of the heat sink (630) is greater than or equal to 0.3 mm and less than or equal to 0.5 mm, and the distance between two adjacent heat sinks (630) is greater than or equal to 1 mm and less than or equal to 1.5 mm; In the second direction, the size of the heat sink (630) is greater than or equal to 50 mm and less than or equal to 100 mm, and the ratio of the offset distance between two adjacent heat sinks (630) to the size of the heat sink (630) is greater than or equal to 1 / 3 and less than or equal to 1 / 2; In the third direction, the size of the heat sink (630) is greater than or equal to 30 mm and less than or equal to 50 mm; The first direction, the second direction and the third direction intersect with each other.

9. The server according to any one of claims 1 to 6, characterized in that: The processor module (300) comprises a plurality of processors, the plurality of processors being arranged at intervals along the first direction, and in the third direction, one side of the plurality of processors is respectively connected to a substrate (610), and the substrate (610) is connected to at least one of the heat conducting members.

10. The server according to any one of claims 1 to 6, characterized in that: It also includes a circuit board (200), a hard disk module (700), a memory module (400), a power module (800) and an interface module (900); The circuit board (200), the fan module (500), the power module (800) and the interface module (900) are respectively connected to the inner wall of the chassis (100); The processor module (300) and the memory module (400) are respectively connected to the circuit board (200); In the second direction, the air outlet end of the fan module (500) faces the circuit board (200), the processor module (300), the memory module (400), the power module (800) and the interface module (900); In the second direction, the hard disk module (700) is arranged on a side of the fan module (500) facing away from the circuit board (200), the heat sink is arranged between the fan module (500) and the circuit board (200), and the power module (800) and the interface module (900) are arranged on a side of the circuit board (200) facing away from the fan module (500).

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