Method and device for verifying putty adhesion effect of wind tunnel test model

By selecting marking points on the wind tunnel test model, designing samples and applying loads, the adhesion effect of putty in the wind tunnel test model is verified, and the problem of lack of effective verification methods in the existing technology is solved, and the effective adhesion effect of putty is verified, which improves the accuracy of the test data.

CN120180831AActive Publication Date: 2025-06-20CHENGDU KAIDI SEIKO TECH CO LTD
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Patent Information

Application Number
CN202510653116.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-21
Publication Date
2025-06-20
Estimated Expiration
2045-05-21

AI Technical Summary

Technical Problem

The existing technology lacks effective methods to verify the adhesion effect of putty in the wind tunnel test model, resulting in the putty being bubbled, layered, broken, and shedding, which affects the accuracy of the test data.

Method used

By selecting several marking points on the wind tunnel test model, using finite element analysis software to calculate the deformation of the trace trench area under the target test load, design a sample with the same stiffness as the model trace trench, and perform embedded parts embedding and putty filling and repair on the sample. Then, one end of the sample is fixed and the other end is loaded to bend it until the displacement data of the sample is consistent with the displacement data of the model, and finally the adhesion effect of the putty is checked.

Benefits of technology

This method can effectively verify the adhesion effect of putty in the wind tunnel test model, ensure that the putty does not fall off, drum, separation and other problems during the test, thereby improving the accuracy of the test data and providing data support for the structural design and manufacturing of the wind tunnel test model.

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Abstract

The invention relates to the technical field of wind tunnel tests, and provides a wind tunnel test model putty adhesion effect verification method and device, and the method comprises the following steps: selecting a plurality of points as model mark points on an established wind tunnel test model along the edge direction of a model wiring channel, and carrying out the finite element analysis of the model mark points through finite element analysis software; calculating the deformation of the wiring channel area of the model under the target test load, and recording the displacement data of each model mark point; according to the displacement data of each model mark point, designing a sample piece to simulate the rigidity of a model wiring channel area and a model wiring channel structure; then pre-embedding of an embedded part and filling and shaping of putty are carried out on a sample piece wiring groove in the sample piece; and finally, fixing one end of the sample piece, and applying a load to the other end of the sample piece, so that the sample piece is directionally and quantitatively bent, and the putty adhesion effect is observed and verified. According to the invention, data support for the adhesion effect of the wiring channel and the putty is provided for the structural design and manufacturing of a wind tunnel test model, and a great auxiliary effect is provided for the design of an aircraft.
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Description

Technical Field

[0001] The present invention relates to the technical field of wind tunnel test, and in particular, to a method and device for verifying the adhesion effect of putty on a wind tunnel test model. Background Art

[0002] For a wind tunnel test model, putty is a frequently used material. In some areas of the model with relatively thin thickness, it is necessary to arrange embedded parts (such as pressure measuring tubes, ducts, wire harnesses, sensors and other components). Since the thickness of these areas is relatively thin, it is usually impossible to design a wire routing cover plate, and an open wire routing groove must be used to arrange the embedded parts and wires. At this time, putty is used to fill the wire routing groove to avoid the exposure of the embedded parts. At the same time, by performing streamline shaping on the surface of the putty and the surface of the model, the damage to the model surface caused by holes and grooves can be reduced, the integrity of the aerodynamic shape of the model can be maintained, and more real and accurate test data can be obtained.

[0003] During the test process, it is necessary to ensure the adhesion effect of the putty to avoid phenomena such as blistering, delamination, breakage, and shedding of the putty, which may affect the accuracy of the test data. However, there is currently no dedicated method in the art to verify the adhesion effect of putty in a wind tunnel test model. Therefore, how to verify the adhesion effect of putty is an urgent problem to be solved in the art. Summary of the Invention

[0004] The purpose of the present invention is to provide a method and device for verifying the adhesion effect of putty on a wind tunnel test model, so as to achieve the purpose of verifying the adhesion effect after the deformation of the putty.

[0005] The present invention is realized through the following technical solutions: A method for verifying the adhesion effect of putty on a wind tunnel test model includes the following steps: S1. Establish a wind tunnel test model to be verified, and select several points along the edge of the model wire routing groove as model marking points on the model; S2. Use finite element analysis software to calculate the deformation of the model wire routing groove area under the target test load, and record the displacement data of each model marking point; S3. According to the displacement data of each model marking point, design a sample with the same stiffness as the model wire routing groove area. The sample has a sample wire routing groove consistent with the model wire routing groove, and mark sample marking points at the positions corresponding to the model marking points on the sample; S4. Embed embedded parts in the sample wire routing groove of the sample, and fill and shape the putty; S5. Fix one end of the sample, and apply a load to the other end of the sample to bend the sample in a specific direction and with a specific amount. Record the displacement data of each sample marking point on the sample until the displacement data of each sample marking point is consistent with the displacement data of the corresponding model marking point in step S2; S6. Check the adhesion effect of the putty.

[0006] Optionally, before step S6, simulate the usage environment of the putty.

[0007] The present invention also provides a device for verifying the adhesion effect of putty for a wind tunnel test model. Using the verification method described in any one of the above, it includes a workbench, a clamping component, and a loading component. The clamping component and the loading component are arranged on the top of the workbench. One end of the sample is clamped and fixed by the clamping component, and the loading component is used to apply a load to the other end of the sample to bend it.

[0008] Optionally, the sample has a clamping section, a simulation section, and a stress section. The clamping section is arranged at one end of the simulation section, and the stress section is arranged at the other end of the simulation section. The clamping section is used to be clamped and fixed by the clamping component. The simulation section is used to simulate the stiffness of the model wiring groove area and the model wiring groove structure. The stress section is used to bear the load applied by the loading component.

[0009] Optionally, the clamping component includes a support table and a fixing plate. The support table is fixedly arranged, and the fixing plate is connected to the support table through fasteners to clamp and fix the clamping section between the fixing plate and the support table.

[0010] Optionally, a positioning groove that can cooperate with the clamping section is arranged on the top of the support table for restricting the position of the sample.

[0011] Optionally, the loading component includes a pressing plate, a loading nut, a guiding rod with a thread at the top, and a height-adjustable supporting member. One end of the pressing plate presses on the supporting member, the other end of the pressing plate presses on the end of the stress section. A strip-shaped hole is arranged in the middle of the pressing plate, the guiding rod passes through the strip-shaped hole, and the loading nut is connected to the guiding rod and presses the pressing plate to bend the sample by the downward displacement of the loading nut.

[0012] Optionally, a semi-cylindrical convex platform for contacting the pressing plate is arranged at the end of the stress section.

[0013] Optionally, the supporting member is a jack.

[0014] Optionally, a T-shaped groove is arranged on the workbench, and the guiding rod is a bolt, and the head of the bolt is arranged in the T-shaped groove.

[0015] The technical solution of the present invention has at least the following advantages and beneficial effects: In the present invention, a number of points are selected along the edge of the model wiring groove on the established wind tunnel test model as model marking points, and the deformation of the model wiring groove area under the target test load is calculated by finite element analysis software, and the displacement data of each model marking point is recorded; then, according to the displacement data of each model marking point, a sample is designed to simulate the stiffness of the model wiring groove area and the model wiring groove structure; then, the sample wiring groove on the sample is embedded with embedded parts and filled and trimmed with putty; finally, one end of the sample is fixed, and a load is applied to the other end of the sample to make the sample perform directional and quantitative bending, thereby achieving the purpose of verifying the adhesion effect of the putty, providing data support for the adhesion effect of the wiring groove and putty for the structural design and manufacturing of the wind tunnel test model, which has a great auxiliary effect on the design of the aircraft and has a positive significance for promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a wing model in the prior art; Figure 2 It is a schematic diagram of the structure of the sample; Figure 3 A schematic diagram of the structure of a wind tunnel test model putty adhesion effect verification device provided by the present invention; Figure 4 is a structural schematic diagram of the support platform; Figure 5 It is a structural schematic diagram of the pressing plate; Figure 6 An initial state diagram of a wind tunnel test model putty adhesion effect verification device provided by the present invention; Figure 7 for Figure 6 The state diagram of the sample after being bent; Figure markings: 1-sample, 101-simulation section, 1011-sample wiring groove, 102-clamping section, 103-force section, 1031-semi-cylindrical boss, 2-putty, 3-pressure measuring tube, 4-fixing plate, 5-support platform, 501-positioning groove, 6-workbench, 601-T-slot, 7-support top piece, 8-pressure plate, 801-strip hole, 9-guide rod, 10-force nut, 11-wing model, 1101-model wiring groove. DETAILED DESCRIPTION

[0017] In this embodiment, a wind tunnel test model is a certain wing model 11, the embedded part is a pressure measuring tube 3, and the usage environment of putty 2 is low temperature (for example, used in a low-temperature wind tunnel test model) as an example for illustration. It should be understood that in other embodiments, the verification method and device provided by the present invention can of course be used on other models, the embedded part can of course also be other components introduced in the background technology, and the usage environment of putty 2 is of course not limited to low temperature.

[0018] A method for verifying the adhesion effect of putty on a wind tunnel test model includes the following steps: S1. Establish a wind tunnel test model to be verified (i.e., the wing model 11 as shown in Figure 1 . It is easy to understand that only a part of the model is intercepted and shown in the figure). Select several points along the edge trend of the model wire groove 1101 on the model as model marking points. It is easy to understand that the selection position and quantity of the model marking points should be able to roughly cover the change trend of the model wire groove 1101, that is, it should cover the range where the model wire groove 1101 may deform. In practical applications, the number of model marking points is greater than or equal to five. In this embodiment, as an option, six model marking points are selected and are sequentially denoted as P', A', B', C', D' and E' along the direction where the wing gradually thins.

[0019] S2. Use finite element analysis software to calculate the deformation of the model wire groove 1101 area under the target test load, and record the displacement data of each model marking point.

[0020] S3. According to the displacement data of each model marking point (it is easy to understand that the stiffness can be calculated inversely according to the deformation), design a sample 1 with the same stiffness as the model wire groove 1101 area. The sample 1 has a sample wire groove 1011 that is the same as the model wire groove 1101, and mark sample marking points at the positions corresponding to the model marking points on the sample 1. It should be understood that the position of the sample marking points relative to the sample wire groove 1011 is exactly the same as the position of the model marking points relative to the model wire groove 1101 in height, and the sample marking points are allowed to translate in the length direction perpendicular to the sample wire groove 1011 so that the sample marking points are at the edge of the sample 1 for easy measurement, and the corresponding model marking points are respectively denoted as P, A, B, C, D and E (as shown in Figure 2 .

[0021] S4. Embed the embedded part and fill and shape the putty 2 in the sample wire groove 1011 on the sample 1. That is, in this embodiment, embed the pressure measuring tube 3 inside the sample wire groove 1011 and pass the pressure measuring tube 3 out through the wire hole of the sample 1, and use low-temperature-resistant putty 2 to fill and shape the sample wire groove 1011.

[0022] S5. Fix one end of the sample 1 and apply a load to the other end of the sample 1 to make the sample 1 be directional and quantitatively bent, and record the displacement data of each sample 1 mark point on the sample 1 until the displacement data of each sample 1 mark point is consistent with the displacement data of the corresponding model mark point in step S2, that is, the sample 1 simulates the actual deformation in the wind tunnel test model.

[0023] S6. Check the adhesion effect of putty 2, that is, check whether putty 2 and sample 1 are falling off, bulging, or separated. In actual application, multiple tests are performed to improve test accuracy.

[0024] As can be seen from the above, the present invention selects several points along the edge of the model wiring groove 1101 on the established wind tunnel test model as model marking points, and calculates the deformation of the model wiring groove 1101 area under the target test load through finite element analysis software, and records the displacement data of each model marking point; then, according to the displacement data of each model marking point, the sample 1 is designed to simulate the stiffness of the model wiring groove 1101 area and the structure of the model wiring groove 1101; then, the sample wiring groove 1011 on the sample 1 is pre-embedded with embedded parts and filled and trimmed with putty 2; finally, one end of the sample 1 is fixed, and a load is applied to the other end of the sample 1, so that the sample 1 is directional and quantitatively bent, thereby achieving the purpose of verifying the adhesion effect of putty 2, providing data support for the adhesion effect of the wiring groove and putty 2 for the structural design and manufacturing of the wind tunnel test model, which has a great auxiliary effect on the design of the aircraft and has a positive significance for promotion and use.

[0025] As an option, in this embodiment, before step S6 (i.e., after the sample 1 reaches the target deformation), the use environment of putty 2 is simulated to improve the accuracy of verification. On the basis that the use environment of putty 2 in this embodiment is low temperature, the sample 1 is placed in a closed environment, and liquid nitrogen is introduced to make the closed environment reach the actual use temperature of putty 2 (in other embodiments, the corresponding use environment is simulated, such as simulating high temperature, high salt spray and other environments). It is easy to understand that in actual applications, the adhesion effect verification of putty 2 is achieved by a corresponding verification device, and the verification device should be placed in an experimental cabin that can be opened and closed to simulate the use environment of putty 2. Only the verification device itself is introduced below, and the above-mentioned experimental cabin is not repeated.

[0026] refer to Figure 3 , Figure 6 and Figure 7, the present invention also provides a device for verifying the putty adhesion effect of a wind tunnel test model. Using the above verification method, specifically, the verification device includes a workbench 6, a clamping component, and a loading component. The clamping component and the loading component are arranged on the top of the workbench 6. One end of the sample 1 is clamped and fixed by the clamping component, and the loading component is used to apply a load to the other end of the sample 1 to bend it. As an option, in this embodiment, the workbench 6 is provided with a T-shaped groove 601 to facilitate accommodating the head of the bolt, thereby facilitating the adjustment of the position of the connecting parts. It should be noted that only a part of the workbench 6 is shown in the drawings. In actual applications, a plurality of T-shaped grooves 601 can be arranged in parallel on the workbench 6.

[0027] Refer again to Figure 2 , as an option, in this embodiment, the sample 1 has a clamping section 102, a simulation section 101, and a stress section 103. The clamping section 102 is arranged at one end of the simulation section 101, and the stress section 103 is arranged at the other end of the simulation section 101; the clamping section 102 is used to be clamped and fixed, the stress section 103 is used to bear the applied load, and the simulation section 101 is used to simulate the stiffness of the model wiring groove 1101 area and the structure of the model wiring groove 1101. Further, in this embodiment, the clamping section 102 is a rectangular beam with a constant cross-section, which is convenient for clamping; a semi-cylindrical boss 1031 is provided at the end of the stress section 103, which is convenient for loading; the simulation section 101 can achieve the purpose of simulating the stiffness of the model wiring groove 1101 area by varying parameters (such as thickness, width, shape, etc.) of the cross-section.

[0028] As an option, the specific structure of the clamping component in this embodiment is as follows. The clamping component includes a support platform 5 and a fixing plate 4. The support platform 5 is fixedly arranged. On the basis that the workbench 6 is provided with a T-shaped groove 601, the support platform 5 is connected and fixed by bolts and nuts. The head of the bolt is placed in the T-shaped groove 601, and the bolt rod passes through the through hole on the support platform 5 and is locked by a nut. The bolt is preferably a square head bolt to limit its rotation and facilitate tightening the nut. The fixing plate 4 is connected to the support platform 5 by fasteners (preferably screws) to clamp and fix the clamping section 102 between the fixing plate 4 and the support platform 5.

[0029] Refer to Figure 4 , further, a positioning groove 501 that can cooperate with the clamping section 102 is provided at the top of the support platform 5 to limit the position of the sample 1. It should be understood that the depth of the positioning groove 501 is slightly smaller than the thickness of the clamping section 102 of the sample 1 to ensure that the fixing plate 4 can clamp the sample 1 after being connected and fastened.

[0030] It should be understood that the above structure of the clamping component is only an option rather than a limitation. In other embodiments, the clamping component can of course be clamped and fixed in other ways. For example, two clamping blocks are provided, one of which is fixed, and the other clamping block is driven by a linear displacement driving element (such as a cylinder, an electric push rod, a hydraulic cylinder, etc.) to achieve clamping and loosening; or a suitable force is provided by a pressure device (such as a press) to press the clamping section 102, thereby achieving clamping.

[0031] As an option, in this embodiment, the loading component includes a pressure plate 8, a loading nut 10, a guide rod 9 with a thread at the top, and an adjustable support 7. One end of the pressure plate 8 presses on the support 7, and the other end of the pressure plate 8 presses on the end of the stressed section 103. On the basis that a semi-cylindrical boss 1031 is provided on the stressed section 103, the semi-cylindrical boss 1031 at the end of the stressed section 103 contacts the pressure plate 8. It is worth noting that with such a setting, the contact surface between the semi-cylindrical boss 1031 of the stressed section 103 and the pressure plate 8 is always the top generatrix of the semi-cylindrical boss 1031, which can ensure that the direction of the loading force always points to the axis of the semi-cylindrical boss 1031 and can also make the loading force transition smoothly.

[0032] A strip hole 801 is provided in the middle of the pressure plate 8. The guide rod 9 passes through the strip hole 801, and the loading nut 10 is connected to the guide rod 9 and presses the pressure plate 8. Since one end of the pressure plate 8 is supported by the support 7, by screwing the nut downward, the other end of the pressure plate 8 (i.e., the end contacting the sample 1) will bend the sample 1 downward. In practical applications, by screwing the nut downward and cooperating with changing the support height of the support 7, the sample 1 can reach the target deformation. Refer to Figure 5 , as an option, the two sides of the pressure plate 8 are chamfered inward and downward respectively, and the other two sides are slightly smaller than the middle section. The function is to reduce the loading surface.

[0033] As an option, in this embodiment, the support 7 is selected as a jack. Further, on the basis that a T-shaped groove 601 is provided on the workbench 6, in this embodiment, the guide rod 9 is a bolt, and the head of the bolt is arranged in the T-shaped groove 601. The bolt is preferably a square head bolt to limit its rotation and facilitate tightening the nut.

[0034] It should be understood that the above structure of the loading component and the loading method of pressing down are only one option rather than a limitation. In other embodiments, the loading component can of course be in other forms. For example, the loading component selects a pressure device (such as a press), and the sample 1 is bent by the loading method of pressing down. Another example is that the loading component selects a jack, and the jack is directly placed under the force-bearing section 103, and the sample 1 is bent by the loading method of jacking up. It is easy to understand that in this way, if the semi-cylindrical boss 1031 is provided at the force-bearing section 103, the sample 1 should be flipped and clamped and fixed so that the semi-cylindrical boss 1031 is loaded. Another example is that the loading component is a combination of a jack and a pressing member. The pressing member is fixed on the top of the jack, and the sample 1 is pressed down by the pressing member when the jack retracts, so that the sample 1 is bent.

[0035] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for verifying the adhesion effect of putty in a wind tunnel test model, characterized in that: The following steps are involved: S1. Establish a wind tunnel test model that needs to be verified, and select several points along the edge of the model wiring trough as model marking points; S2. Use finite element analysis software to calculate the deformation of the wiring trough area of ​​the model under the target test load and record the displacement data of each model mark point; S3. According to the displacement data of each model marking point, a sample with the same stiffness as the model wiring groove area is designed, the sample has a sample wiring groove consistent with the model wiring groove, and the sample marking point is marked on the sample at the corresponding model marking point; S4. Pre-embed the embedded parts of the sample wiring trough on the sample and fill and modify the shape with putty; S5, fix one end of the sample and apply a load to the other end of the sample to make the sample be oriented and quantitatively bent, and record the displacement data of each sample mark point on the sample until the displacement data of each sample mark point is consistent with the displacement data of the corresponding model mark point in step S2; S6. Check the adhesion of putty.

2. The wind tunnel test model putty adhesion effect verification method according to claim 1, characterized in that: Before step S6, the use environment of putty is simulated.

3. A wind tunnel test model putty adhesion effect verification device, using the verification method described in claim 1 or 2, characterized in that: It includes a workbench, a clamping component and a loading component. The clamping component and the loading component are arranged on the top of the workbench. One end of the sample is clamped and fixed by the clamping component. The loading component is used to apply a load to the other end of the sample to make it bend.

4. The wind tunnel test model putty adhesion effect verification device according to claim 3, characterized in that: The sample has a clamping section, a simulation section and a force-bearing section, the clamping section is arranged at one end of the simulation section, and the force-bearing section is arranged at the other end of the simulation section; the clamping section is used to be clamped and fixed by the clamping component, the simulation section is used to simulate the stiffness of the model wiring trough area and the model wiring trough structure, and the force-bearing section is used to bear the load applied by the loading component.

5. The wind tunnel test model putty adhesion effect verification device according to claim 4, characterized in that: The clamping component includes a support platform and a fixing plate. The support platform is fixedly arranged. The fixing plate and the support platform are connected by fasteners so as to clamp and fix the clamping section between the fixing plate and the support platform.

6. The wind tunnel test model putty adhesion effect verification device according to claim 5, characterized in that: The top of the support platform is provided with a positioning groove which can cooperate with the clamping section and is used to limit the position of the sample.

7. The wind tunnel test model putty adhesion effect verification device according to claim 4, characterized in that: The loading component includes a pressure plate, a force nut, a guide rod with a thread on the top and a height-adjustable support member. One end of the pressure plate is pressed on the support member, and the other end of the pressure plate is pressed on the end of the force-bearing section. A strip hole is provided in the middle of the pressure plate, and the guide rod passes through the strip hole. The force nut is connected to the guide rod and presses the pressure plate so that the sample is bent by the downward displacement of the force nut.

8. The wind tunnel test model putty adhesion effect verification device according to claim 7, characterized in that: A semi-cylindrical boss for contacting the pressing plate is provided at the end of the force-bearing section.

9. The wind tunnel test model putty adhesion effect verification device according to claim 7, characterized in that: The supporting member is a jack.

10. The wind tunnel test model putty adhesion effect verification device according to claim 7, characterized in that: The workbench is provided with a T-shaped slot, the guide rod is a bolt, and the head of the bolt is arranged in the T-shaped slot.

Citation Information

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