Printed circuit board processing method, printed circuit board and electronic equipment

Abstract

Embodiments of the present invention relate to the technical field of printed circuit boards and disclose a method for processing a printed circuit board, a printed circuit board, and an electronic device. The method comprises: obtaining multiple printed circuit boards; performing parameter design and simulation optimization using finite element analysis software to obtain simulation parameters, and etching the printed circuit board surfaces to obtain a bionic honeycomb wrinkle structure based on the simulation parameters; applying a multi-level grayscale mask and photoresist coating to each printed circuit board based on the bionic honeycomb wrinkle structure, and etching to obtain an etched printed circuit board; laminating and bonding the multiple etched printed circuit boards in a staggered manner along a first direction, with adjacent etched printed circuit boards at least partially overlapping, and curling and pressing the staggered laminated and bonded printed circuit boards in the first direction using a mold to form a cylindrical printed circuit board; and baking and curing the cylindrical printed circuit board to obtain the cylindrical printed circuit board. The embodiments of the present invention provide a high-performance cylindrical printed circuit board.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of printed circuit boards, and in particular to a method for processing a printed circuit board, a printed circuit board, and an electronic device. Background Art

[0002] Nearly all modern electronic devices incorporate printed circuit boards (PCBs). Traditional PCB manufacturing relies on complex processes such as photolithography, etching, and drilling, leading to material waste, chemical contamination, and low multilayer board alignment accuracy. PCB antenna modules, a modular design that integrates antennas directly onto printed circuit boards (PCBs), are widely used in wireless communication devices. They transmit and receive signals by printing traces in specific shapes (such as straight lines, F-shaped patterns, and serpentines) on the PCB. This design offers advantages such as compactness, low cost, and ease of integration, making it suitable for a variety of wireless communication scenarios.

[0003] However, existing PCB antenna modules remain insufficiently integrated. While existing circuit boards with cylindrical structures exist, bending and curling during processing can lead to insufficient precision control, resulting in misalignment between layers and impacting electrical performance. Furthermore, curling can lead to uneven stress distribution across multiple layers, reducing the reliability of PCB antenna modules. Summary of the Invention

[0004] In view of the above problems, an embodiment of the present invention provides a printed circuit board processing method, a printed circuit board and an electronic device, which are used to solve the problems existing in the prior art of achieving inter-layer misalignment, affecting electrical performance, and uneven distribution of stress in multiple layers during curling, resulting in reduced reliability of the PCB antenna module.

[0005] According to one aspect of an embodiment of the present invention, a method for processing a printed circuit board is provided, the method comprising:

[0006] Obtain multiple printed circuit boards; the printed circuit boards include a composite PI layer and a copper foil layer; the composite PI layer is prepared by embedding vertically oriented graphene nanosheets in a PI substrate;

[0007] Performing parameter design and simulation optimization using finite element analysis software to obtain simulation parameters, and etching a bionic honeycomb wrinkle structure on the surface of the printed substrate according to the simulation parameters;

[0008] Performing multi-level grayscale masking and photoresist coating on each printed substrate according to the bionic honeycomb wrinkle structure, and etching to obtain an etched printed substrate;

[0009] Laminating and bonding a plurality of etched printed circuit boards in a staggered manner along a first direction, with adjacent etched printed circuit boards at least partially overlapping, and curling and pressing the staggered, laminated, and bonded printed circuit boards along the first direction using a mold to form a cylindrical printed circuit board;

[0010] The cylindrical printed circuit board is baked and cured to obtain a cylindrical printed circuit board.

[0011] In an optional manner, before obtaining the plurality of printed circuit boards, the method further includes:

[0012] Using oxygen plasma, setting the power to 50W and the time to 5 minutes, the surface of the PI substrate is treated to generate oxygen-containing functional groups on the surface of the PI substrate;

[0013] The treated PI substrate was immersed in a 2 wt % 3-aminopropyltriethoxysilane ethanol solution and reacted at 60° C. for 2 hours to form an amino layer on the surface of the PI substrate.

[0014] In an optional manner, after immersing the treated PI substrate in a 2 wt % 3-aminopropyltriethoxysilane ethanol solution at 60° C. for 2 hours to form an amino layer on the surface of the PI substrate, the method further comprises:

[0015] uniformly dispersing graphene nanosheets in a solvent by ultrasonic dispersion to prepare a graphene dispersion liquid;

[0016] Arranging the graphene dispersions vertically in multiple rows on the surface of the PI substrate;

[0017] The graphene nanosheets are embedded in the PI substrate by hot pressing to form the composite PI layer.

[0018] In an optional manner, the embedding of graphene nanosheets into the PI substrate by hot pressing to form the composite PI layer comprises:

[0019] The PI substrate with vertical graphene was immersed in a polydopamine solution with a pH of 8.5 and reacted at room temperature for 12 hours. The polydopamine solution formed an adhesion layer at the interface between the graphene and the PI;

[0020] In a vacuum hot press, the temperature is maintained at 150° C. and a pressure of 5 MPa for 30 minutes to eliminate pores and enhance interface bonding, thereby obtaining the composite PI layer.

[0021] In an optional manner, the parameter design and simulation optimization are performed by finite element analysis software to obtain simulation parameters, and the bionic honeycomb wrinkle structure is etched on the surface of the printed substrate according to the simulation parameters, further comprising:

[0022] A three-dimensional model of a printed circuit board is established in finite element analysis software to obtain simulation parameters; the printed circuit board design parameters include the geometric dimensions and material properties of the composite PI layer and the copper foil layer, and the initial geometric parameters of the bionic honeycomb wrinkle structure on the copper foil layer;

[0023] Performing electrical performance simulation based on the printed circuit board design parameters to obtain electrical properties of the printed circuit board; the electrical properties include dielectric constant, signal loss, and conductivity;

[0024] determining whether the electrical properties meet the electrical performance requirements; if not, revising the PCB three-dimensional model according to the electrical properties, and performing electrical performance simulation again according to the revised PCB design parameters until the electrical performance requirements are met, thereby obtaining final PCB design parameters;

[0025] According to the final design parameters of the printed circuit board, the bionic honeycomb wrinkle structure is obtained by etching the surface of the copper foil layer by ultraviolet laser.

[0026] In an optional manner, the method comprises: staggering and laminating a plurality of etched printed substrates along a first direction, wherein adjacent etched printed substrates at least partially overlap, and curling and pressing the staggered and laminated printed substrates along the first direction using a mold to form a cylindrical printed circuit substrate, comprising:

[0027] Embedding magnetic nano-marking dots on the surface of the etched printed substrate in a predetermined area of the etched printed substrate by inkjet printing; wherein the material of the magnetic nano-marking dots includes an inner layer of Fe3O4@SiO2 core-shell structured magnetic nanoparticles and an outer layer of SiO2 insulating coating;

[0028] Staggering and bonding a plurality of etched printed substrates along a first direction, with adjacent etched printed substrates at least partially overlapping;

[0029] According to the magnetic nano-marking points, interlayer micro-displacement adjustment is performed on the printed substrates that are stacked and bonded in an offset manner;

[0030] The adjusted offset-laminated and bonded printed circuit boards are rolled up along the first direction and pressed into a cylindrical printed circuit board by a mold.

[0031] In an optional manner, the step of applying a multi-level grayscale mask and photoresist coating to each printed substrate according to the bionic honeycomb wrinkle structure, and etching the printed substrate to obtain the etched printed substrate comprises:

[0032] applying photoresist to each printed substrate;

[0033] Performing photolithographic exposure on the photoresist on each printed substrate through a multi-level grayscale mask, thereby achieving pattern transfer; wherein the multi-level grayscale mask is designed based on the simulation parameters of the bionic honeycomb wrinkle structure;

[0034] After the pattern is transferred, etching is performed to obtain an etched printed circuit board.

[0035] In an optional manner, the step of baking and curing the cylindrical printed circuit substrate to obtain the cylindrical printed circuit substrate comprises:

[0036] Placing the curled and pressed cylindrical printed circuit substrate in a baking and curing device;

[0037] Set the baking temperature and time parameters according to the substrate material and adhesive properties;

[0038] The temperature and time parameters of the equipment are monitored in real time to obtain a cylindrical printed circuit substrate.

[0039] According to another aspect of an embodiment of the present invention, a printed circuit board is provided. The printed circuit board includes a cylindrical printed circuit substrate, and the cylindrical printed circuit substrate is processed by the printed circuit board processing method.

[0040] According to another aspect of the embodiments of the present invention, the electronic device includes a cylindrical printed circuit substrate; the cylindrical printed circuit substrate is processed using the above-mentioned method for processing a printed circuit board.

[0041] The embodiment of the present invention obtains multiple printed circuit boards; performs parameter design and simulation optimization using finite element analysis software to obtain simulation parameters, and etches a bionic honeycomb wrinkle structure on the surface of the printed circuit board according to the simulation parameters; applies a multi-level grayscale mask and photoresist coating to each printed circuit board according to the bionic honeycomb wrinkle structure, and then etches to obtain an etched printed circuit board; staggers and bonds the multiple etched printed circuit boards along a first direction, with adjacent etched printed circuit boards at least partially overlapping, and uses a mold to curl and press the staggered, bonded printed circuit boards along the first direction into a cylindrical printed circuit board; and bakes and cures the cylindrical printed circuit board to obtain a cylindrical printed circuit board. Through the use of composite materials, simulation optimization, sophisticated etching and photolithography processes, and unique structural design and molding processes, a high-performance cylindrical printed circuit board can be manufactured, providing strong support for the miniaturization, high performance, and flexibility of electronic devices.

[0042] The above description is only an overview of the technical solutions of the embodiments of the present invention. In order to more clearly understand the technical means of the embodiments of the present invention, they can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiments of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the drawings. In the drawings:

[0044] Figure 1 A schematic flow chart of a method for processing a printed circuit board provided in one embodiment of the present invention is shown;

[0045] Figure 2 A schematic diagram showing a bionic honeycomb wrinkle structure on a copper foil layer provided by an embodiment of the present invention is shown;

[0046] Figure 3 A schematic structural diagram of a cylindrical printed circuit substrate provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0047] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0048] Figure 1 FIG. 1 is a flow chart showing a method for processing a printed circuit board according to an embodiment of the present invention. Figure 1 As shown, the method includes the following steps:

[0049] Step 110: Obtain multiple printed circuit boards.

[0050] Each printed circuit board comprises a composite PI layer and a copper foil layer. The composite PI layer is prepared by embedding vertically oriented graphene nanosheets within a PI substrate. Specifically, the composite PI layer is prepared by the following steps: First, a graphene dispersion is prepared: graphene oxide (GO) is dispersed in a water / ethanol mixture (1:1 volume ratio) and ultrasonically treated for 2 hours at 300W to a concentration of 1 mg / mL. Fe₃O₄ magnetic nanoparticles (10 nm in diameter, 5 wt%) are added to modify the GO surface via electrostatic adsorption to produce a graphene dispersion. Subsequently, an oxygen plasma treatment is performed at 50W for 5 minutes on the surface of the PI substrate to generate oxygen-containing functional groups (-COOH or -OH) on the surface, enhancing graphene adhesion. The treated PI substrate is then immersed in a 2 wt% ethanol solution of 3-aminopropyltriethoxysilane at 60°C for 2 hours to form an amino layer on the surface of the PI substrate, promoting directional anchoring of the graphene. Graphene nanosheets are uniformly dispersed in a solvent by ultrasonic dispersion to prepare a graphene dispersion. The graphene dispersions are vertically arranged in multiple columns on the surface of the PI substrate; the graphene nanosheets are embedded in the PI substrate by hot pressing to form the composite PI layer. In an embodiment of the present invention, the graphene nanosheets can be vertically oriented on the surface of the PI base layer by a magnetic field induction method or a template-assisted CVD growth method. After obtaining the PI substrate with added vertical graphene, the PI substrate with added vertical graphene is immersed in a polydopamine solution with a pH of 8.5 and reacted at room temperature for 12 hours. The polydopamine solution forms an adhesion layer at the interface between graphene and PI; in a vacuum hot press, it is maintained at 150°C and a pressure of 5MPa for 30 minutes to eliminate pores and enhance interface bonding to obtain the composite PI layer.

[0051] In the embodiment of the present invention, after the composite PI layer is prepared, the side provided with the graphene nanosheets is laminated to a copper foil layer to obtain a printed circuit board.

[0052] Step 120: performing parameter design and simulation optimization using finite element analysis software to obtain simulation parameters, and etching the surface of the printed substrate to obtain a bionic honeycomb wrinkle structure according to the simulation parameters.

[0053] Specifically, it is carried out in the following ways:

[0054] Step 1201: Create a three-dimensional model of a printed circuit board in finite element analysis software to obtain simulation parameters.

[0055] Among them, the finite element analysis software can be ANSYS, COMSOL Multiphysics, AltairHyperWorks, etc. Among them, ANSYS Mechanical can be used to analyze the PCB structural strength analysis (such as bending stress, vibration fatigue) and solder joint reliability verification. ANSYS Icepak is used to analyze PCB thermal management (chip heat dissipation, air convection optimization). ANSYS SIwave&HFSS is used to analyze signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC). The printed circuit board design parameters include the geometric dimensions and material properties of the composite PI layer and the copper foil layer, and the initial geometric parameters of the bionic honeycomb wrinkle structure on the copper foil layer. In an embodiment of the present invention, the bionic wrinkle structure is as follows Figure 2 As shown, only the local structure is shown in the figure.

[0056] Step 1202: Perform electrical performance simulation based on the printed circuit board design parameters to obtain electrical properties of the printed circuit board, wherein the electrical properties include dielectric constant, signal loss, and conductivity.

[0057] Step 1203: Determine whether the electrical properties meet the electrical performance requirements. If not, modify the PCB three-dimensional model based on the electrical properties, and perform electrical performance simulation again based on the modified PCB design parameters until the electrical performance requirements are met, thereby obtaining the final PCB design parameters.

[0058] Step 1204: etching the surface of the copper foil layer using ultraviolet laser to obtain the bionic honeycomb wrinkle structure according to the final printed circuit board design parameters.

[0059] Among them, the bionic honeycomb wrinkle structure can be composed of multiple connected rectangles or hexagons. In one embodiment of the present invention, the bionic honeycomb wrinkle structure is a honeycomb structure composed of multiple hexagons. The size of a single unit of the bionic honeycomb wrinkle structure matches the wavelength. In high-frequency applications (such as 28GHz), the signal wavelength λ≈10.7mm, and the side length of the honeycomb unit is set to λ / 10≈1mm. In low-frequency applications (such as 1GHz), the unit side length can be extended to λ / 5≈60mm. When the copper foil thickness is 35μm, the groove depth is ≤7μm (copper thickness 20%), and the stress distribution is verified by finite element analysis (ANSYS). At least 5μm of continuous copper layer is retained at the bottom of the groove to avoid signal line breakage. Use HFSS or CST simulation tools to optimize the groove shape (hexagon) to ensure that the insertion loss in the 28GHz band is <1.2dB / cm.

[0060] In one embodiment of the present invention, a biomimetic honeycomb wrinkle structure was etched onto the substrate surface using an ultraviolet laser. The cells were 200 μm in size and 20 μm in depth, distributing stress evenly along the hexagonal grid. ANSYS simulations and actual measurements showed that, at the same curvature, the maximum principal stress was reduced by 67%.

[0061] Furthermore, by combining a bionic honeycomb wrinkle structure with vertical graphene in a composite PI layer, the present invention increases the surface area of the honeycomb grooves by 30%. Combined with the vertical graphene (thermal conductivity of 1500 W / m·K), the overall thermal resistance is reduced by 45%. This effectively dissipates heat from the cylindrical printed circuit board.

[0062] Step 130: performing multi-level grayscale masking and photoresist coating on each printed substrate according to the bionic honeycomb wrinkle structure, and etching to obtain an etched printed substrate.

[0063] After obtaining the bionic honeycomb wrinkle structure, photoresist is applied to each printed circuit board. In this embodiment of the present invention, the photoresist on each printed circuit board is exposed using a multi-level grayscale mask, thereby achieving pattern transfer. The multi-level grayscale mask is designed based on the simulation parameters of the bionic honeycomb wrinkle structure. Using a multi-level grayscale mask (e.g., with 0%, 30%, 70%, and 100% transmittance), the circuit pattern (conductors / pads) and the groove structure are integrated into the same mask. The grayscale regions correspond to the groove depth gradient (0% represents the deepest groove, 100% represents no groove). After pattern transfer, etching is performed to obtain the etched printed circuit board.

[0064] The photoresist coating and exposure are carried out in the following manner:

[0065] Substrate pretreatment: Plasma cleaning of the PI substrate surface (O2, 100W, 5min) to enhance the adhesion of the photoresist.

[0066] Spin-coat photoresist: Use AZ4620 positive photoresist with a thickness of 8 μm (3000 rpm, 30 s).

[0067] Grayscale exposure: Using an i-line lithography machine (wavelength 365nm) and dose gradient control (50~150mJ / cm²) to achieve different cross-linking degrees of photoresist in different areas.

[0068] The following methods are used for development and etching:

[0069] Development: AZ400K developer (1:4 dilution), development time 60s, to form a stepped photoresist structure.

[0070] Copper etching: FeCl3 etching solution (concentration 40%), controlled temperature 25°C, etching rate 1.2μm / min, accurately retaining the copper layer at the bottom of the groove.

[0071] PI substrate etching: O2 / CF4 plasma etching (power 200W, gas pressure 50mTorr) with a rate of 0.5μm / min was used to form a honeycomb groove structure.

[0072] In the embodiment of the present invention, after etching, correction scanning is performed by using an ultraviolet laser with a wavelength of 355 nm, a pulse width of 10 ps, and a repetition frequency of 100 kHz.

[0073] A honeycomb-shaped ground copper layer (line / spacing = 50 / 50μm) is inserted above and below the signal layer, generated using laser direct structuring (LDS). The ground layer is spaced 100μm from the signal layer and filled with a low-k dielectric (ε_r = 2.7), creating a ground shield.

[0074] In this embodiment, the wavy conductors were set to have an amplitude of 50μm and a wavelength of 300μm. HFSS was used to optimize the line width and spacing, for example, to achieve impedance control, with a 50Ω differential line width of 90μm and a spacing of 80μm. An online TDR tester (40GHz bandwidth) was also used to monitor impedance fluctuations in real time (within ±5%).

[0075] Step 140: staggeredly stacking and bonding a plurality of etched printed substrates along a first direction, with adjacent etched printed substrates at least partially overlapping, and curling and pressing the staggered stacked and bonded printed substrates along the first direction into a cylindrical printed circuit substrate using a mold.

[0076] In this process, multiple etched printed substrates are staggered along a first direction according to design requirements, ensuring that adjacent substrates at least partially overlap. A layer of high-performance adhesive is evenly applied to the bonding surface of the substrates. The adhesive should have excellent adhesion, insulation, and high-temperature resistance to ensure strong bonding and electrical isolation between the substrates. The adhesive-coated substrates are stacked and bonded together in sequence, and the adhesive is cured by applying a certain pressure and temperature to form an integrated stacked structure. During the bonding process, care is taken to control the pressure and temperature to avoid damage or deformation to the substrates, while ensuring that the adhesive is fully cured to improve the bonding strength and stability of the stacked structure. The printed substrates, after being staggered and bonded, are placed in a dedicated curling mold. Utilizing the shape and structure of the mold, the substrates are gradually curled into shape along the first direction by applying external force. During the curling process, the curling speed and force are precisely controlled to avoid defects such as cracks and wrinkles on the substrates, ensuring that the curled cylindrical structure has good geometric shape and dimensional accuracy.

[0077] To ensure accuracy during curling, magnetic nano-markers are embedded into the surface of the etched printed substrate in predetermined areas via inkjet printing. The magnetic nano-markers are made of an inner layer of Fe3O4@SiO2 core-shell magnetic nanoparticles and an outer layer of SiO2 insulating coating. Multiple etched printed substrates are stacked and bonded together in a staggered manner along a first direction, with adjacent etched printed substrates at least partially overlapping. In this embodiment of the present invention, the printed substrate is a rectangular structure, and the first direction is parallel to the length of the etched printed substrate. Specifically, the multiple etched printed substrates are stacked and bonded together in a staggered manner along the length. Micro-displacement is adjusted between the layers of the staggered, bonded printed substrates based on the magnetic nano-markers. The adjusted staggered, bonded printed substrates are then rolled and pressed together in the first direction using a mold to form a cylindrical printed circuit board. To minimize the impact of uneven forces on the electrical performance of the substrates during the curling process, this embodiment of the present invention utilizes a combination of laser preforming and dynamic temperature-controlled pressing. It is carried out by laser pre-bending and dynamic gradient temperature control pressing. Specifically, a 355nm pulsed laser is used to selectively weaken the lattice of the straight core board, generating a microcrack array (spacing 100μm, depth 10μm) in the preset curling path. The crack density is adjusted by the laser energy density to achieve 0°~30° pre-bending (accuracy ±0.5°) to control the pre-bending angle. The axial temperature gradient control is achieved by integrating a multi-segment heating module into the pressing mold. Specifically, the center area is set to 180°C (rapid curing of the adhesive layer) and the edge area is set to 120°C (maintaining the elasticity of the substrate). Combined with air pressure-assisted molding (dynamic adjustment of pressure 0.1~0.5MPa), residual stress is eliminated. Thus, a cylindrical printed circuit substrate with better performance is obtained.

[0078] Step 150: baking and curing the cylindrical printed circuit substrate to obtain a cylindrical printed circuit substrate.

[0079] In an embodiment of the present invention, a rolled and pressed cylindrical printed circuit substrate is placed in a baking and curing device. The baking temperature and time parameters are set according to the substrate material and adhesive properties. The temperature and time parameters of the device are monitored in real time to produce the cylindrical printed circuit substrate.

[0080] The embodiment of the present invention obtains a plurality of printed substrates; performs parameter design and simulation optimization through finite element analysis software to obtain simulation parameters, and etches the printed substrate surface according to the simulation parameters to obtain a bionic honeycomb wrinkle structure; performs multi-level grayscale masking and photoresist coating on each printed substrate according to the bionic honeycomb wrinkle structure, and etches to obtain an etched printed substrate; staggers and stacks the plurality of etched printed substrates along a first direction, with adjacent etched printed substrates at least partially overlapping, and uses a mold to curl and press the staggered stacked and bonded printed substrates along the first direction into a cylindrical printed circuit substrate; bakes and solidifies the cylindrical printed circuit substrate to obtain a cylindrical printed circuit substrate. Figure 3 As shown, through the use of composite materials, simulation optimization, fine etching and photolithography processes, as well as unique structural design and molding processes, high-performance cylindrical printed circuit substrates can be manufactured, providing strong support for the miniaturization, high performance and flexibility of electronic devices.

[0081] According to another aspect of an embodiment of the present invention, a printed circuit board is provided. The printed circuit board includes a cylindrical printed circuit substrate, and the cylindrical printed circuit substrate is processed by the printed circuit board processing method.

[0082] According to another aspect of the embodiments of the present invention, the electronic device includes a cylindrical printed circuit substrate; the cylindrical printed circuit substrate is processed using the above-mentioned method for processing a printed circuit board.

[0083] The algorithm or demonstration provided herein are not inherently relevant to any particular computer, virtual system or other equipment. Various general-purpose systems may also be used together with the teachings based on this. According to the above description, it is apparent that the structure required for constructing this type of system. In addition, the embodiment of the present invention is not directed to any specific programming language yet. It should be understood that various programming languages can be utilized to realize the content of the present invention described herein, and the above description of specific languages is for the purpose of disclosing the best mode of the present invention.

[0084] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0085] Similarly, it should be understood that in order to streamline the present invention and facilitate understanding of one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim.

[0086] Those skilled in the art will appreciate that the modules in the devices of the embodiments can be adaptively modified and installed in one or more devices different from the embodiments. The modules, units, or components in the embodiments can be combined into a single module, unit, or component, or they can be divided into multiple sub-modules, sub-units, or sub-components. All features disclosed in this specification (including the accompanying claims, abstract, and drawings), and all processes or units of any method or device disclosed therein, can be combined in any combination, unless at least some of such features and / or processes or units are mutually exclusive. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0087] It should be noted that the above embodiments illustrate rather than limit the invention, and that alternative embodiments may be devised by a person skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs placed between brackets should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising several different elements and by means of appropriately programmed computers. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments should not be understood as limiting the order of execution unless otherwise specified.

Claims

1. A method for processing a printed circuit board, characterized in that: The method comprises: Obtain multiple printed circuit boards; the printed circuit boards include a composite PI layer and a copper foil layer; the composite PI layer is prepared by embedding vertically oriented graphene nanosheets in a PI substrate; Performing parameter design and simulation optimization using finite element analysis software to obtain simulation parameters, and etching a bionic honeycomb wrinkle structure on the surface of the printed substrate according to the simulation parameters; Performing multi-level grayscale masking and photoresist coating on each printed substrate according to the bionic honeycomb wrinkle structure, and etching to obtain an etched printed substrate; Laminating and bonding a plurality of etched printed circuit boards in a staggered manner along a first direction, with adjacent etched printed circuit boards at least partially overlapping, and curling and pressing the staggered, laminated, and bonded printed circuit boards along the first direction using a mold to form a cylindrical printed circuit board; The cylindrical printed circuit board is baked and cured to obtain a cylindrical printed circuit board.

2. The method according to claim 1, characterized in that Before obtaining the plurality of printed circuit boards, the method further includes: Using oxygen plasma, setting the power to 50W and the time to 5 minutes, the surface of the PI substrate is treated to generate oxygen-containing functional groups on the surface of the PI substrate; The treated PI substrate was immersed in a 2 wt % 3-aminopropyltriethoxysilane ethanol solution and reacted at 60° C. for 2 hours to form an amino layer on the surface of the PI substrate.

3. The method according to claim 2, characterized in that After immersing the treated PI substrate in a 2 wt % 3-aminopropyltriethoxysilane ethanol solution at 60° C. for 2 hours to form an amino layer on the surface of the PI substrate, the method further comprises: uniformly dispersing graphene nanosheets in a solvent by ultrasonic dispersion to prepare a graphene dispersion liquid; Arranging the graphene dispersions vertically in multiple rows on the surface of the PI substrate; The graphene nanosheets are embedded in the PI substrate by hot pressing to form the composite PI layer.

4. The method according to claim 3, characterized in that The method of embedding graphene nanosheets into the PI substrate by hot pressing to form the composite PI layer comprises: The PI substrate with vertical graphene was immersed in a polydopamine solution with a pH of 8.5 and reacted at room temperature for 12 hours. The polydopamine solution formed an adhesion layer at the interface between the graphene and the PI; In a vacuum hot press, the temperature was maintained at 150° C. and a pressure of 5 MPa for 30 minutes to eliminate pores and enhance interface bonding, thereby obtaining the composite PI layer.

5. The method according to claim 3, characterized in that The method further comprises: performing parameter design and simulation optimization by finite element analysis software to obtain simulation parameters, and etching the bionic honeycomb wrinkle structure on the surface of the printed substrate according to the simulation parameters. A three-dimensional model of a printed circuit board is established in finite element analysis software to obtain simulation parameters; the printed circuit board design parameters include the geometric dimensions and material properties of the composite PI layer and the copper foil layer, and the initial geometric parameters of the bionic honeycomb wrinkle structure on the copper foil layer; Performing electrical performance simulation based on the printed circuit board design parameters to obtain electrical properties of the printed circuit board; the electrical properties include dielectric constant, signal loss, and conductivity; determining whether the electrical properties meet the electrical performance requirements; if not, revising the PCB three-dimensional model according to the electrical properties, and performing electrical performance simulation again according to the revised PCB design parameters until the electrical performance requirements are met, thereby obtaining final PCB design parameters; According to the final design parameters of the printed circuit board, the bionic honeycomb wrinkle structure is obtained by etching the surface of the copper foil layer by ultraviolet laser.

6. The method according to claim 5, characterized in that The method comprises: staggering and laminating a plurality of etched printed substrates along a first direction, wherein adjacent etched printed substrates are at least partially overlapped; and curling and pressing the staggered and laminated printed substrates along the first direction into a cylindrical printed circuit substrate using a mold, comprising: Embedding magnetic nano-marking dots on the surface of the etched printed substrate in a predetermined area of the etched printed substrate by inkjet printing; wherein the material of the magnetic nano-marking dots includes an inner layer of Fe3O4@SiO2 core-shell structured magnetic nanoparticles and an outer layer of SiO2 insulating coating; Staggering and bonding a plurality of etched printed substrates along a first direction, with adjacent etched printed substrates at least partially overlapping; According to the magnetic nano-marking points, interlayer micro-displacement adjustment is performed on the printed substrates that are stacked and bonded in an offset manner; The adjusted offset-laminated and bonded printed circuit boards are rolled up along the first direction and pressed into a cylindrical printed circuit board by a mold.

7. The method according to any one of claims 1 to 6, characterized in that The method comprises: performing multi-level grayscale masking and photoresist coating on each printed substrate according to the bionic honeycomb wrinkle structure, and etching to obtain an etched printed substrate, comprising: applying photoresist to each printed substrate; Performing photolithographic exposure on the photoresist on each printed substrate through a multi-level grayscale mask, thereby achieving pattern transfer; wherein the multi-level grayscale mask is designed based on the simulation parameters of the bionic honeycomb wrinkle structure; After the pattern is transferred, etching is performed to obtain an etched printed circuit board.

8. The method according to any one of claims 1 to 6, characterized in that After the cylindrical printed circuit substrate is baked and cured, a cylindrical printed circuit substrate is obtained, comprising: Placing the curled and pressed cylindrical printed circuit substrate in a baking and curing device; Set the baking temperature and time parameters according to the substrate material and adhesive properties; The temperature and time parameters of the equipment are monitored in real time to obtain a cylindrical printed circuit substrate.

9. A printed circuit board, characterized in that: The printed circuit board comprises a cylindrical printed circuit substrate, and the cylindrical printed circuit substrate is processed by the printed circuit board processing method according to any one of claims 1 to 8.

10. An electronic device, characterized in that: The electronic device includes a cylindrical printed circuit substrate; the cylindrical printed circuit substrate is processed by the printed circuit board processing method according to any one of claims 1 to 8.

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