Electronic equipment, denoising method and computer readable storage medium

Abstract

The invention provides electronic equipment, a denoising method and a computer readable storage medium. The electronic equipment comprises a noise signal acquisition module and an audio compensation module, the noise signal acquisition module comprises a multilayer chip ceramic capacitor and an analog-to-digital converter; the noise signal acquisition module is used for converting the acquired noise vibration signal into a noise analog signal by using a multi-layer chip ceramic capacitor and converting the noise analog signal into a noise digital signal by using an analog-to-digital converter; and the audio compensation module is used for carrying out noise reduction on the noise according to the noise digital signal. The multi-layer chip ceramic capacitor is used for collecting noise vibration signals and converting the noise vibration signals into noise analog signals, and collection of the noise vibration signals is achieved. The analog-to-digital converter is utilized to convert the noise analog signal into the noise digital signal which can be identified by the audio compensation module, so that the audio compensation module can perform noise reduction on the noise according to the noise digital signal, and finally sound de-noising on the electronic equipment is realized.

Description

Technical Field

[0001] This application relates to the technical field of noise denoising, and particularly to an electronic device, a denoising method, and a computer-readable storage medium. Background Art

[0002] During the use of an electronic device, there may be phenomena of board vibration and magnetic coupling, which affect the sound effects of functions such as calls and recordings of the electronic device. Among them, board vibration refers to the vibration of capacitors on the circuit board due to the inverse piezoelectric effect under the action of an alternating voltage, which drives the Printed Circuit Board (PCB) to generate audible noise. Magnetic coupling refers to the coil of the speaker being coupled and vibrating due to the influence of the alternating magnetic field generated by the board-level pulse current, thereby generating noise.

[0003] Therefore, how to perform sound denoising on an electronic device has become a technical problem to be urgently solved. Summary of the Invention

[0004] In view of this, this application provides an electronic device, a denoising method, and a computer-readable storage medium to perform sound denoising on the electronic device.

[0005] In the first aspect of this application, an electronic device is provided, including: a noise signal acquisition module and an audio compensation module; the noise signal acquisition module includes a multilayer ceramic capacitor and an analog-to-digital converter; the noise signal acquisition module is configured to convert the acquired noise vibration signal into a noise analog signal by using the multilayer ceramic capacitor, and convert the noise analog signal into a noise digital signal by using the analog-to-digital converter; the audio compensation module is configured to perform noise reduction on the noise according to the noise digital signal. Using the multilayer ceramic capacitor to collect the noise vibration signal and convert it into a noise analog signal realizes the acquisition of the noise vibration signal; using the analog-to-digital converter to convert the noise analog signal into a noise digital signal that can be recognized by the audio compensation module, so that the audio compensation module can perform noise reduction on the noise according to the noise digital signal, and finally realizes sound denoising of the electronic device.

[0006] In a possible implementation manner, the electronic device further includes a circuit board, and the multilayer ceramic capacitor is disposed on the circuit board; the multilayer ceramic capacitor is configured to vibrate in response to the magnetic coupling effect or the board vibration of the circuit board, and generate a noise analog signal based on the vibration. The multilayer ceramic capacitor vibrates in response to the magnetic coupling effect or board vibration, which can collect the board vibration noise and the noise of the speaker coil caused by magnetic coupling, realizes the acquisition of the noise of different noise sources, and thus can compensate for different noise sources.

[0007] In a possible implementation, the electronic device is a screen sound-emitting device, and the audio compensation module includes a processor and a vibration unit, where the vibration unit is disposed on the screen; the processor is configured to generate a vibration compensation signal for canceling noise after receiving the noise digital signal; the vibration unit is configured to vibrate in response to the vibration compensation signal to cancel and reduce the noise. For a screen sound-emitting device, the vibration unit disposed on the screen is used to cancel and reduce the noise, achieving sound noise reduction for the screen sound-emitting device.

[0008] In a possible implementation, the vibration unit is a piezoelectric ceramic sheet. Piezoelectric ceramics is an information functional ceramic material that can convert mechanical energy and electrical energy into each other. The piezoelectric ceramic sheet has piezoelectricity, dielectricity, and elastic properties, and is more suitable for the vibration scenario of a screen sound-emitting device, and has a longer service life in the scenario of a screen sound-emitting device.

[0009] In a possible implementation, the processor is specifically configured to, after receiving the noise digital signal, determine a cancellation phase for canceling the noise based on the reverse phase method; and generate a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase based on the cancellation phase. Determining the cancellation phase for canceling the noise based on the reverse phase method, and thus driving the vibration unit to vibrate according to the cancellation phase, can effectively perform sound noise reduction, especially suitable for the noise reduction scenario of a screen sound-emitting device.

[0010] In a possible implementation, the electronic device further includes a microphone chip, and the audio compensation module includes a processor; the microphone chip is configured to collect a sound analog signal; the analog-to-digital converter is further configured to convert the sound analog signal into a sound digital signal; the processor is configured to denoise the sound digital signal according to the noise digital signal to obtain denoised sound data. The microphone chip and the multilayer ceramic capacitor share an analog-to-digital converter, which can save hardware costs and can denoise the board vibration noise of the sound collected by the microphone chip, achieving noise reduction for the noise during the sound pickup process.

[0011] In a possible implementation, the electronic device further includes a speaker, and the audio compensation module includes a processor and a smart power amplifier; the processor is configured to perform denoising compensation on the sound signal to be played according to the noise digital signal to obtain a compensated sound signal; the smart power amplifier is configured to control the speaker to emit sound according to the compensated sound signal. The smart power amplifier controls the speaker to emit sound according to the compensated sound signal to achieve denoising of the speaker sound, thereby achieving the effect of reducing or eliminating the speaker noise, and is suitable for the noise reduction scenario of a speaker sound-emitting device.

[0012] In a second aspect, an embodiment of the present application provides a noise reduction method, the method comprising: using a multilayer ceramic capacitor to convert the collected noise vibration signal into a noise analog signal; converting the noise analog signal into a noise digital signal; and performing noise reduction on the noise according to the noise digital signal. By using a multilayer ceramic capacitor to collect the noise vibration signal and convert it into a noise analog signal, the collection of the noise vibration signal is realized; by using an analog-to-digital converter to convert the noise analog signal into a noise digital signal that can be recognized by an audio compensation module, the audio compensation module can perform noise reduction on the noise according to the noise digital signal, and finally, sound noise reduction of the electronic device is realized.

[0013] In a possible implementation manner, the using the multilayer ceramic capacitor to convert the collected noise vibration signal into a noise analog signal includes: using the multilayer ceramic capacitor to vibrate in response to a magnetic coupling effect or the board vibration of a circuit board, and generating a noise analog signal based on the vibration. The multilayer ceramic capacitor vibrates in response to a magnetic coupling effect or board vibration, can collect board vibration noise and the noise of a speaker coil caused by magnetic coupling, realizes the collection of noises from different noise sources, and thus can compensate for different noise sources.

[0014] In a possible implementation manner, the performing noise reduction on the noise according to the noise digital signal includes: generating a vibration compensation signal for canceling the noise according to the noise digital signal; and controlling a vibration unit to vibrate according to the vibration compensation signal to cancel and reduce the noise. For a screen sound-emitting device, the vibration unit provided on the screen is used to cancel and reduce the noise, and sound noise reduction of the screen sound-emitting device is realized.

[0015] In a possible implementation manner, the generating a vibration compensation signal for canceling the noise according to the noise digital signal includes: determining a cancellation phase for canceling the noise based on a reverse phase manner according to the noise digital signal; and generating a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase based on the cancellation phase. By determining the cancellation phase for canceling the noise based on a reverse phase manner, and thus driving the vibration unit to vibrate according to the cancellation phase, effective sound noise reduction can be performed, which is particularly applicable to the noise reduction scenario of a screen sound-emitting device.

[0016] In a possible implementation manner, the performing noise reduction on the noise according to the noise digital signal includes: acquiring a sound analog signal collected by a microphone chip; converting the sound analog signal into a sound digital signal; and performing noise reduction on the sound digital signal according to the noise digital signal to obtain denoised sound data. It is possible to perform noise reduction on the board vibration noise of the sound collected by the microphone chip, and noise reduction during the sound pickup process is realized.

[0017] In a possible implementation manner, reducing noise according to the noise digital signal includes: performing denoising compensation on the sound signal to be played according to the noise digital signal to obtain a compensated sound signal; controlling a speaker to emit sound according to the compensated sound signal. Controlling the speaker to emit sound according to the compensated sound signal to achieve noise reduction of the speaker's sound, thereby achieving the effect of reducing or eliminating the speaker noise, and being applicable to the noise reduction scenario of a speaker sound-emitting device.

[0018] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, including a computer program, which when running on an electronic device, enables the electronic device to execute the method described in any one of the present application.

[0019] Adopting the technical solution provided by the embodiment of the present application, the electronic device includes: a noise signal acquisition module and an audio compensation module; the noise signal acquisition module includes a multilayer ceramic capacitor and an analog-to-digital converter; the noise signal acquisition module is configured to convert the collected noise vibration signal into a noise analog signal by using the multilayer ceramic capacitor, and convert the noise analog signal into a noise digital signal by using the analog-to-digital converter; the audio compensation module is configured to reduce noise according to the noise digital signal. Using the multilayer ceramic capacitor to collect the noise vibration signal and convert it into a noise analog signal realizes the collection of the noise vibration signal; using the analog-to-digital converter to convert the noise analog signal into a noise digital signal that can be recognized by the audio compensation module, so that the audio compensation module can reduce noise according to the noise digital signal, and finally realizes sound denoising of the electronic device.

[0020] Of course, implementing any product or method of the present application does not necessarily require achieving all the above-mentioned advantages at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a first structural schematic diagram of the electronic device according to the embodiment of the present application;

[0023] Figure 2 It is a schematic diagram of a system architecture of the electronic device according to the embodiment of the present application;

[0024] Figure 3The second structural schematic diagram of the electronic device according to the embodiment of the present application;

[0025] Figure 4 The third structural schematic diagram of the electronic device according to the embodiment of the present application;

[0026] Figure 5 A structural schematic diagram of the noise signal acquisition module according to the embodiment of the present application;

[0027] Figure 6 A schematic diagram of the simplified circuit diagram of the noise signal acquisition module according to the embodiment of the present application;

[0028] Figure 7 The fourth structural schematic diagram of the electronic device according to the embodiment of the present application;

[0029] Figure 8 The fifth structural schematic diagram of the electronic device according to the embodiment of the present application;

[0030] Figure 9 The sixth structural schematic diagram of the electronic device according to the embodiment of the present application;

[0031] Figure 10 The first process schematic diagram of the denoising method according to the embodiment of the present application;

[0032] Figure 11 The second process schematic diagram of the denoising method according to the embodiment of the present application;

[0033] Figure 12 The third process schematic diagram of the denoising method according to the embodiment of the present application;

[0034] Figure 13 A schematic diagram of the phenomenon of slab earthquake in the related art;

[0035] Figure 14 A schematic diagram of the phenomenon of coupled vibration in the related art. Detailed implementation manners

[0036] For a better understanding of the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0037] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0038] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0039] It should be understood that the term "and / or" used herein is merely an association relationship describing associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0040] During the use of an electronic device, there will be board vibration and magnetic coupling phenomena. Board vibration refers to the vibration of capacitors on a circuit board due to the inverse piezoelectric effect under the action of an alternating voltage, which drives the circuit board (Printed Circuit Board, PCB) to form audible noise. For example Figure 13 As shown, the capacitor that vibrates under the action of the alternating voltage (hereinafter referred to as the board vibration capacitor) drives the circuit board to generate vibrations with nanoscale deformations, and thus the circuit board emits noise due to the vibrations. Magnetic coupling refers to the coupling vibration of the speaker coil affected by the alternating magnetic field generated by the board-level pulsed current. For example Figure 14 As shown, the alternating magnetic field generated by the board-level pulsed current causes the magnetic field around the speaker coil to change, thereby causing the coupling vibration of the speaker coil, and the speaker coil emits noise.

[0041] In order to perform sound denoising on the electronic device, the embodiments of the present application provide an electronic device, a denoising method, and a computer-readable storage medium, which will be specifically described below.

[0042] See Figure 1 , Figure 1 As shown, it is a schematic diagram of the hardware structure of the electronic device provided by the embodiments of the present application. The electronic device can be a mobile phone, a tablet computer, or other user terminals.

[0043] The electronic device includes a processor 110, a transceiver 120, and a display unit 170. Among them, the display unit 170 may include a display screen.

[0044] In one example, the electronic device may further include a memory 130. The processor 110, the transceiver 120, and the memory 130 can communicate with each other through an internal connection path to transmit control and / or data signals. The memory 130 is used to store a computer program, and the processor 110 is used to call and run the computer program from the memory 130.

[0045] In one example, the electronic device may further include an antenna 140 for transmitting the wireless signals output by the transceiver 120.

[0046] The above-mentioned processor 110 and the memory 130 may be integrated into a processing device. More commonly, they are independent components. The processor 110 is used to execute the program code stored in the memory 130 to implement the above functions. Specifically, in implementation, the memory 130 may also be integrated in the processor 110, or be independent of the processor 110.

[0047] In addition, in order to make the functions of the electronic device more complete, the electronic device may further include one or more of an input unit 160, an audio circuit 180, a camera 190, a sensor 101, etc. The audio circuit may further include a speaker 182, a microphone 184, etc.

[0048] In one example, the above-mentioned electronic device may further include a power supply 150 for supplying power to various devices or circuits in the electronic device.

[0049] It can be understood that Figure 1 The operations and / or functions of the respective modules in the illustrated electronic device are respectively for implementing the corresponding processes in the following method embodiments. For details, please refer to the descriptions in the following method embodiments. To avoid repetition, the detailed descriptions are appropriately omitted here.

[0050] It can be understood that Figure 1 The processor 110 in the illustrated electronic device may include one or more processing units. For example, the processor 110 may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units may be independent devices or integrated in one or more processors. A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can save the instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to use the instruction or data again, it can directly call it from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0051] In some embodiments, the processor 110 may include one or more interfaces. The interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0052] It can be understood that the interface connection relationships among the modules illustrated in the embodiments of the present application are only illustrative descriptions and do not constitute a structural limitation on the electronic device. In other embodiments of the present application, the electronic device may also adopt different interface connection manners in the above embodiments, or a combination of multiple interface connection manners.

[0053] It can be understood that Figure 1 The power supply 150 shown is used to supply power to the processor 110, the memory 130, the display unit 170, the camera 190, the input unit 160, the transceiver 120, etc. The antenna 140 is used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device can be used to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization rate of the antennas. For example, the antenna 140 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in combination with a tuning switch.

[0054] The transceiver 120 can provide wireless communication solutions applied to electronic devices, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite systems (GNSSs), frequency modulation (FM), near field communication (NFC), infrared technology (IR), etc. The transceiver 120 can be one or more devices integrating at least one communication processing module. The transceiver 120 receives electromagnetic waves via the antenna 140, performs frequency modulation and filtering processing on the electromagnetic wave signals, and sends the processed signals to the processor 110. The transceiver 120 can also receive the signals to be sent from the processor 110, perform frequency modulation on them, amplify them, and convert them into electromagnetic waves through the antenna 140 for radiation.

[0055] In some embodiments, the antenna 140 of the electronic device is coupled to the transceiver 120, enabling the electronic device to communicate with a network and other devices via wireless communication technologies. The wireless communication technologies may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc. The GNSS may include Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), Beidou Navigation Satellite System (BDS), Quasi-Zenith Satellite System (QZSS), and / or Satellite Based Augmentation Systems (SBAS).

[0056] The electronic device implements the display function through the GPU, the display unit 170, and the application processor, etc. The GPU is a microprocessor for image processing, connected to the display unit 170 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs, which execute program instructions to generate or change display information.

[0057] The display unit 170 is used to display images, videos, etc. The display unit 170 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a MiniLED, a MicroLED, a Micro-OLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the electronic device may include one or N display units 170, where N is a positive integer greater than 1.

[0058] The electronic device can implement the shooting function through the ISP, the camera 190, the video codec, the GPU, the display unit 170, and the application processor, etc.

[0059] The ISP is used to process the data fed back by the camera 190. For example, when recording a video, the camera is turned on, and light passes through the lens and is transmitted to the camera sensor. The optical signal is converted into an electrical signal, and the camera sensor transmits the electrical signal to the ISP for processing and converts it into an image visible to the naked eye. The ISP can also optimize the noise, brightness, and skin color of the image through algorithms.

[0060] The ISP can also optimize parameters such as the exposure and color temperature of the shooting scene. In some embodiments, the ISP can be set in the camera 190. The camera 190 is used to capture static images or videos. An object generates an optical image through the lens and projects it onto the sensor. The sensor can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The sensor converts the optical signal into an electrical signal and then transmits the electrical signal to the ISP to convert it into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in standard RGB, YUV, etc. formats. In some embodiments, the electronic device may include one or N cameras 190, where N is a positive integer greater than 1. The digital signal processor is used to process digital signals. In addition to processing digital image signals, it can also process other digital signals. For example, when the electronic device selects a frequency point, the digital signal processor is used to perform a Fourier transform on the frequency point energy, etc.

[0061] A video codec is used to compress or decompress digital video. An electronic device may support one or more video codecs. In this way, the electronic device can play or record videos in multiple encoding formats, such as Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

[0062] The NPU is a neural-network (NN) computing processor. By drawing on the structure of a biological neural network, such as the transmission pattern between neurons in the human brain, it can quickly process input information and can also continuously self-learn. Through the NPU, applications such as intelligent cognition of the electronic device can be realized, such as image recognition, face recognition, speech recognition, text understanding, etc.

[0063] The memory 130 can be used to store computer-executable program code, and the executable program code includes instructions. The memory 130 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system, application programs required for at least one function (such as a sound playback function, an image playback function, etc.). The data storage area can store data created during the use of the electronic device (such as audio data, phone book, etc.). In addition, the memory 130 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc. The processor 110 executes various functional applications and data processing of the electronic device by running the instructions stored in the memory 130 and / or the instructions stored in the memory provided in the processor.

[0064] The electronic device can implement audio functions through the audio circuit 180, the speaker 182, the microphone 184, and the application processor, etc. Such as music playback, recording, etc.

[0065] The audio circuit 180 is used to convert digital audio information into an analog audio signal for output, and is also used to convert analog audio input into a digital audio signal. The audio circuit 180 can also be used to encode and decode audio signals. In some embodiments, the audio circuit 180 may be provided in the processor 110, or some functional modules of the audio circuit 180 may be provided in the processor 110.

[0066] The speaker 182, also known as the "loudspeaker", is used to convert an audio electrical signal into a sound signal. The electronic device can listen to music or hands-free calls through the speaker 182.

[0067] The microphone 184, also known as a "microphone" or "transmitter", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can input a sound signal into the microphone 184 by speaking close to it. The electronic device can be provided with at least one microphone 184. In some other embodiments, the electronic device can be provided with two microphones 184, which can not only collect sound signals but also implement a noise reduction function. In some other embodiments, the electronic device can also be provided with three, four or more microphones 184 to collect sound signals, reduce noise, identify the sound source, and implement functions such as directional recording.

[0068] The noise reduction method in the embodiments of this application can be implemented through Figure 2 the system architecture shown in Figure 2 . The layered architecture divides the software into several layers, each layer having a clear role and division of labor; communication between layers is through software interfaces. In some embodiments, the Android system is divided into four layers, from top to bottom, namely the application layer, the application framework layer, the system libraries of the Android runtime, and the kernel layer. The application layer can include a series of application packages.

[0069] As Figure 2 shown, the application packages can include applications (APPs) such as noise reduction, gallery, music, etc. Exemplarily, the noise reduction App can be used to start and run the noise reduction method provided in the embodiments of this application.

[0070] The application framework layer provides application programming interfaces (APIs) and programming frameworks for the applications in the application layer. The application framework layer includes some predefined functions. As Figure 2 shown, the application framework layer can include a window manager, a content provider, a view system, a resource manager, a notification manager, etc.

[0071] The window manager is used to manage window programs. The window manager can obtain the display screen size, determine whether there is a status bar, lock the screen, capture the screen, etc.

[0072] The content provider is used to store and obtain data, and make this data accessible to applications. The data can include videos, images, audio, incoming and outgoing calls, browsing history and bookmarks, phone books, etc.

[0073] The view system includes visual controls, such as controls for displaying text, controls for displaying pictures, etc. The view system can be used to build applications. The display interface can be composed of one or more views. For example, a display interface including a notification icon can include a view for displaying text and a view for displaying pictures.

[0074] The resource manager provides various resources for the application, such as localized strings, icons, pictures, layout files, video files, and so on.

[0075] The notification manager enables the application to display notification information in the status bar. It can be used to convey informative messages, which can automatically disappear after a short stay without user interaction. For example, the notification manager is used to inform that the download is complete, message reminders, etc. The notification manager can also be a notification that appears in the system top status bar in the form of a chart or scroll bar text, such as the notification of a background-running application, or a notification that appears on the screen in the form of a dialog window. For example, it can prompt text information in the status bar, emit a prompt sound, vibrate the electronic device, blink the indicator light, etc.

[0076] Android runtime includes a core library and a virtual machine. Android runtime is responsible for the scheduling and management of the Android system.

[0077] The core library consists of two parts: one is the functional functions that need to be called by the Java language, and the other is the core library of Android.

[0078] The application layer and the application framework layer run in the virtual machine. The virtual machine executes the Java files of the application layer and the application framework layer as binary files. The virtual machine is used to perform functions such as object lifecycle management, stack management, thread management, security and exception management, and garbage collection.

[0079] The system library can include multiple functional modules. For example, the surface manager, media libraries, 3D graphics processing library (e.g., OpenGL ES), 2D (two-dimensional) graphics engine (e.g., SGL), image processing library, etc.

[0080] The surface manager is used to manage the display subsystem and provides the fusion of 2D and 3D layers for multiple applications.

[0081] The media library supports the playback and recording of multiple audio formats, the playback and recording of multiple video formats, and static image files. The media library can support multiple audio and video coding formats, such as: MPEG4, H.264, moving picture experts group audio layer III (MP3), advanced audio coding (AAC), adaptive multi rate (AMR), joint photographic experts group (JPG), and portable network graphics (PNG). The 3D graphics processing library is used to implement 3D graphics drawing, image rendering, synthesis, and layer processing, etc.

[0082] The 2D graphics engine is a drawing engine for 2D drawing.

[0083] The kernel layer refers to the layer between hardware and software; the kernel layer at least includes sensor drivers, camera drivers, display drivers, etc.

[0084] See Figure 3 , Figure 3 which is another structural schematic diagram of the electronic device provided by the embodiment of the present application, including:

[0085] A noise signal acquisition module 31 and an audio compensation module 32; the noise signal acquisition module 31 includes a Multi-layer Ceramic Capacitor (MLCC) 311 and an analog-to-digital converter 312;

[0086] The noise signal acquisition module 31 is used to convert the collected noise vibration signal into a noise analog signal by using the multi-layer ceramic capacitor 311, and convert the noise analog signal into a noise digital signal by using the analog-to-digital converter 312;

[0087] The audio compensation module 32 is used to reduce the noise according to the noise digital signal.

[0088] The multi-layer ceramic capacitor 311 has a piezoelectric effect and can convert vibration into an analog electrical signal. In a possible implementation, see Figure 4 , the electronic device further includes a circuit board 33, and the multi-layer ceramic capacitor 311 is disposed on the circuit board 33; the multi-layer ceramic capacitor 311 is used to vibrate in response to a magnetic coupling effect or the board vibration of the circuit board 33, and generate a noise analog signal based on the vibration.

[0089] In one example, the multilayer ceramic capacitor 311 can be disposed on the circuit board 33, that is, the multilayer ceramic capacitor 311 can collect the board vibration condition of the circuit board 33, so as to obtain an analog electrical signal of the board vibration noise. In addition, when a pulse current is generated in the electronic device, the pulse current will cause the vibration of the inductor. The multilayer ceramic capacitor 311 realizes the collection of the vibration caused by the pulse current by collecting the vibration of the inductor; it can be understood that the speaker magnetic coupling vibration is also caused by the pulse current. Therefore, by collecting the vibration of the multilayer ceramic capacitor 311 caused by the pulse current, the speaker magnetic coupling vibration caused by the pulse current can be indirectly obtained.

[0090] The multilayer ceramic capacitor 311 can convert the collected noise vibration into an analog signal (i.e., a noise analog signal) through the piezoelectric effect, and the analog-to-digital converter 312 converts the analog signal into a digital signal (i.e., a noise digital signal), so as to facilitate the audio compensation module 32 to cancel and reduce the noise according to the noise digital signal.

[0091] In a possible implementation manner, Figure 5 As shown, the noise signal acquisition module 31 may further include a filter 313. The filter 313 is disposed between the multilayer ceramic capacitor 311 and the analog-to-digital converter 312, and the filter 313 is used to filter the noise analog signal of the multilayer ceramic capacitor 311. In one example, the simplified circuit of the noise signal acquisition module 31 may be as Figure 6 shown, where C MLCC represents the multilayer ceramic capacitor, I represents the equivalent deformation current generated by the vibration of the multilayer ceramic capacitor 311, R1 represents the resistance of the filter 313, C1 represents the capacitance of the filter 313, R ADC represents the resistance of the analog-to-digital converter 312, and C ADC represents the capacitance of the analog-to-digital converter 312. The sampling vibration signal of the multilayer ceramic capacitor 311 can be abstracted into the form of an ideal constant current source in parallel with a capacitor. Then, the amplitude of the sampling signal of the analog-to-digital converter 312 is:

[0092]

[0093] Because So formula (1) can be simplified to:

[0094] U ADC = I·R ADC (2)

[0095] Among them, U ADC represents the voltage value of the sampling signal of the analog-to-digital converter 312, I represents the current value measured by the ammeter, and R ADC represents the resistance of the analog-to-digital converter 312. represents the impedance of the analog-to-digital converter 312 represents the impedance of the multilayer ceramic chip capacitor 311

[0096] In the embodiment of the present application, a multilayer ceramic chip capacitor is used to collect noise vibration signals and convert them into noise analog signals, realizing the collection of noise vibration signals; an analog-to-digital converter is used to convert the noise analog signals into noise digital signals that can be recognized by the audio compensation module, so that the audio compensation module can reduce noise according to the noise digital signals, and finally realize sound noise reduction for the electronic device

[0097] The sound generation methods of the electronic device mainly include screen sound generation and speaker sound generation. The noise reduction processes of screen sound generation and speaker sound generation are described below respectively

[0098] In a possible implementation manner, the electronic device is a screen sound generation device. Refer to Figure 7 , the audio compensation module 32 includes a processor 321 and a vibration unit 322, and the vibration unit 322 is arranged on the screen

[0099] The processor 321 is configured to generate a vibration compensation signal for canceling noise after receiving the noise digital signal

[0100] The vibration unit 322 is configured to vibrate in response to the vibration compensation signal to cancel and reduce the noise

[0101] The screen sound generation device uses the vibration of the screen to generate sound. Therefore, the sound can be denoised by arranging the vibration unit 322 on the screen. The vibration unit 322 can vibrate under the drive of the vibration compensation signal, so a material with piezoelectric effect can be used for preparation. In one example, the vibration unit 322 can be a piezoelectric ceramic sheet. Piezoelectric ceramics are an information functional ceramic material that can convert mechanical energy and electrical energy into each other. The piezoelectric ceramic sheet can vibrate in response to an electrical signal (vibration compensation signal) to cancel the noise. In addition, the piezoelectric ceramic sheet has characteristics such as dielectric property and elasticity in addition to piezoelectricity, which is more suitable for vibration scenarios and has a longer service life

[0102] The processor 321 may adopt a SoC (System on Chip), specifically an ADSP (a digital signal processing chip), etc. The processor 321 uses a preset denoising algorithm to generate a vibration compensation signal for canceling noise based on the noise digital signal. In a possible implementation manner, the processor 321 is specifically configured to, after receiving the noise digital signal, determine a cancellation phase for canceling noise based on the reverse phase method; and generate a vibration compensation signal for driving the vibration unit 322 to vibrate according to the cancellation phase.

[0103] For example Figure 7 As shown, the vibration of the board shock capacitor will cause the circuit board 33 to have a board shock phenomenon. The multilayer ceramic capacitor 311 is disposed on the circuit board 33, and the multilayer ceramic capacitor 311 is vibrationally coupled with the board shock capacitor, that is, the multilayer ceramic capacitor 311 can collect the board shock condition of the circuit board 33. It can be understood that sound is generated by vibration. When two sound vibrations have opposite directions and the same vibration amplitude, these two sounds can exactly cancel each other out. Therefore, the processor 321 can determine a cancellation phase for canceling the board shock noise based on the reverse phase method, and generate a vibration compensation signal for driving the vibration unit 322 to vibrate according to the cancellation phase. In this way, the driving vibration unit 322 can vibrate according to the vibration compensation signal according to the cancellation phase, so as to achieve the effect of reducing or eliminating the board shock noise.

[0104] In a possible implementation manner, the electronic device is a horn sound-emitting device. Refer to Figure 8 , the electronic device further includes a speaker 34, and the audio compensation module 32 includes a processor 321 and a smart power amplifier 323; the processor 321 is configured to perform denoising compensation on the sound signal to be played according to the noise digital signal to obtain a compensated sound signal; the smart power amplifier 323 is configured to control the speaker 34 to emit sound according to the compensated sound signal.

[0105] Under the magnetic coupling effect, due to the influence of the alternating magnetic field generated by the board-level pulse current, the coil of the speaker 34 is coupled and vibrated, generating noise. The board-level pulse current will also cause the vibration of the inductor in the boost-buck chip, and the multilayer ceramic capacitor 311 is coupled with the inductor board vibration. Therefore, the vibration of the coil of the speaker 34 can be obtained by collecting the vibration of the multilayer ceramic capacitor 311. For example, the corresponding relationship between the vibration of the multilayer ceramic capacitor 311 and the vibration of the coil of the speaker 34 under different intensities of pulse current can be measured in advance, and the transformation curve between the vibration of the multilayer ceramic capacitor 311 and the vibration of the coil of the speaker 34 can be established through a fitting algorithm. Thus, according to this transformation curve, the vibration of the coil of the speaker 34 can be obtained from the vibration of the multilayer ceramic capacitor 311 collected. The processor 321 obtains the vibration condition of the coil of the speaker 34 caused by the pulse current (i.e., the noise of the coil of the speaker 34) according to the noise digital signal, and uses a preset denoising algorithm to perform denoising compensation on the sound signal to be played, obtaining a compensated sound signal. For example, the processor 321 can determine a compensation signal with the same vibration amplitude and opposite phase based on the reverse phase method according to the vibration condition of the coil of the speaker 34 caused by the pulse current, and fuse this compensation signal into the sound signal to be played, thereby obtaining a compensated sound signal. It can be understood that, in the case where the noise has been determined, performing denoising compensation on the sound signal to be played is a prior art, and the compensation of the sound signal to be played can also be achieved through other denoising algorithms. The specific denoising algorithm is not limited in this application, and relevant denoising algorithms can be referred to. After obtaining the compensated sound signal, the intelligent power amplifier 323 controls the speaker 34 to emit sound according to the compensated sound signal, so as to realize the denoising of the sound emitted by the speaker 34, thereby achieving the effect of reducing or eliminating the speaker noise.

[0106] The mainstream sound pickup methods of electronic devices are all to use a microphone chip for sound pickup. The process of sound pickup and denoising of the microphone chip is introduced below. In a possible way, see Figure 9 , the electronic device further includes a microphone chip 35, and the audio compensation module 32 includes a processor 321;

[0107] The microphone chip 35 is used to collect an analog sound signal;

[0108] The analog-to-digital converter 312 is further used to convert the analog sound signal into a digital sound signal;

[0109] The processor 321 is used to perform denoising on the digital sound signal according to the noise digital signal, obtaining denoised sound data.

[0110] The microphone chip 35 can be disposed on the circuit board 33. The vibration of the board vibration capacitor will cause the circuit board 33 to generate a board vibration phenomenon. The multilayer ceramic capacitor 311 is disposed on the circuit board 33. The multilayer ceramic capacitor 311 is vibration-coupled with the board vibration capacitor, that is, the multilayer ceramic capacitor 311 can collect the board vibration condition of the circuit board 33. The board vibration of the circuit board 33 will generate noise, resulting in the sound analog signal collected by the microphone chip 35 being a sound analog signal containing board vibration noise. The analog-to-digital converter 312 converts the sound analog signal containing board vibration noise into a sound digital signal containing board vibration noise and sends it to the processor 321. The processor 321 denoises the sound digital signal according to the noise digital signal to obtain the denoised sound data. The noise digital signal can characterize the board vibration noise. After obtaining the noise digital signal, the processor 321 can use a preset denoising algorithm to denoise the board vibration noise of the sound digital signal containing board vibration noise, so as to obtain the denoised sound data. Denoising a signal containing the noise in the case of known noise is a prior art, and the denoising algorithm used here is not limited in this application. In the embodiment of this application, the multilayer ceramic capacitor 311 is used to collect the board vibration condition, so as to denoise the board vibration noise of the sound collected by the microphone chip 35, realizing denoising of the noise in the sound pickup process.

[0111] Hereinafter, the denoising method in the embodiment of this application will be described. Refer to Figure 10 , Figure 10 which is a schematic flow chart of a denoising method in a screen sound generating device. The method includes:

[0112] S1001, using a multilayer ceramic capacitor to vibrate in response to the board vibration of the circuit board and generating a noise analog signal based on the vibration.

[0113] S1002, converting the noise analog signal into a noise digital signal.

[0114] S1003, based on the noise digital signal, determining a cancellation phase for canceling the noise in a reverse phase manner.

[0115] S1004, generating a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase according to the cancellation phase.

[0116] S1005, controlling the vibration unit to vibrate according to the vibration compensation signal to cancel and reduce the noise.

[0117] For example Figure 7As shown, the vibration of the board shock capacitor causes the circuit board to generate a board shock phenomenon, and the board shock of the circuit board generates noise; the multilayer ceramic capacitor is arranged on the circuit board and is vibrationally coupled with the board shock capacitor, that is, the multilayer ceramic capacitor can collect the board shock condition of the circuit board. The multilayer ceramic capacitor converts the board shock condition into an analog electrical signal based on the piezoelectric effect, that is, a noise analog signal. Using an analog-to-digital converter, the analog signal is converted into a digital signal that can be recognized by the processor, that is, the noise analog signal is converted into a noise digital signal. The processor determines the cancellation phase for canceling the noise according to the noise digital signal in a reverse phase manner, and generates a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase. The processor controls the vibration unit to vibrate according to the vibration compensation signal to cancel and reduce the board shock noise.

[0118] In the embodiment of the present application, for a screen sound generating device, a vibration unit arranged on the screen is used to cancel and reduce noise, realizing noise reduction for the screen sound generating device. Based on the reverse phase method, the cancellation phase for canceling the noise is determined, so as to drive the vibration unit to vibrate according to the cancellation phase, which can effectively perform noise reduction, especially suitable for the noise reduction scenario of the screen sound generating device.

[0119] See Figure 11 , Figure 11 which is a schematic flow chart of a noise reduction method for a speaker sound generating device, including:

[0120] S1101, using a multilayer ceramic capacitor to vibrate in response to the magnetic coupling effect, and generating a noise analog signal based on the vibration.

[0121] S1102, converting the noise analog signal into a noise digital signal.

[0122] S1103, performing noise reduction compensation on the sound signal to be played according to the noise digital signal to obtain a compensated sound signal.

[0123] S1104, controlling the speaker to emit sound according to the compensated sound signal.

[0124] For example Figure 8As shown, under the magnetic coupling effect, due to the influence of the alternating magnetic field generated by the board-level pulsed current, the coil of the speaker vibrates coupledly, generating noise. The board-level pulsed current will cause the vibration of the inductor, such as the inductor in the buck-boost chip, and the multilayer ceramic capacitor vibrates with the vibration of the inductor. Therefore, the vibration of the coil of the speaker can be obtained by collecting the vibration of the multilayer ceramic capacitor and converting it. The processor obtains the vibration condition of the speaker coil caused by the pulsed current according to the noise digital signal, and uses a preset denoising algorithm to perform denoising compensation on the sound signal to be played, obtaining a compensated sound signal. After obtaining the compensated sound signal, the intelligent power amplifier controls the speaker to emit sound according to the compensated sound signal to achieve denoising of the speaker's sound, thereby achieving the effect of reducing or eliminating the speaker noise. It can be understood that performing denoising compensation on the sound signal to be played is a prior art when the noise has been determined, and the present application does not specifically limit the denoising algorithm.

[0125] See Figure 12 , Figure 12 is a schematic flow chart of a noise reduction method during the sound pickup process of an electronic device, including:

[0126] S1201, using a multilayer ceramic capacitor to vibrate in response to the board vibration of the circuit board, and generating a noise analog signal based on the vibration.

[0127] S1202, converting the noise analog signal into a noise digital signal.

[0128] S1203, obtaining the sound analog signal collected by the microphone chip.

[0129] S1204, converting the sound analog signal into a sound digital signal.

[0130] S1205, performing noise reduction on the sound digital signal according to the noise digital signal to obtain the denoised sound data.

[0131] For example Figure 9As shown, the microphone chip can be set on the circuit board. The vibration of the board vibration capacitor will cause the circuit board to generate a board vibration phenomenon, and the multi-layer ceramic capacitor is vibrationally coupled with the board vibration capacitor. The board vibration of the circuit board will generate noise, resulting in the sound analog signal collected by the microphone chip being a signal containing board vibration noise. The multi-layer ceramic capacitor can also be set on the circuit board, and the board vibration noise collected by the multi-layer ceramic capacitor at the same time is converted into a noise analog signal. The analog-to-digital converter converts the noise analog signal into a noise digital signal, converts the sound analog signal containing board vibration noise into a sound digital signal containing board vibration noise, and sends it to the processor. The processor denoises the sound digital signal according to the noise digital signal to obtain the denoised sound data. Denoising a signal containing such noise in the case of known noise is a prior art, and the denoising algorithm used here is not limited in this application. In the embodiments of this application, the multi-layer ceramic capacitor is used to collect the board vibration situation, so as to denoise the board vibration noise of the sound collected by the microphone chip, realizing the denoising of the noise during the sound pickup process.

[0132] This application also provides a computer-readable storage medium, including a computer program, which, when running on an electronic device, causes the electronic device to execute the denoising method described in any one of the above.

[0133] This application also provides a computer program product, which, when running on a computer, causes the computer to execute the denoising method described in any one of the above embodiments.

[0134] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or a data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a DVD), or a solid state disk (SSD), etc.

[0135] The present application also provides a GUI (Graphical User Interface), which includes the aforementioned first interface, second interface, first sharing interface, second sharing interface, third sharing interface, fourth sharing interface, conversion in progress interface, application selection interface, and icon editing interface. For how the user interacts with these interfaces and in what situations the electronic device displays which interface, reference can be made to the relevant descriptions of each interface above, and details will not be elaborated here.

Claims

1. An electronic device, characterized in that, Including: A noise signal acquisition module and an audio compensation module; The noise signal acquisition module includes a multilayer ceramic capacitor and an analog-to-digital converter; The noise signal acquisition module is configured to convert the acquired noise vibration signal into a noise analog signal by using the multilayer ceramic capacitor, and convert the noise analog signal into a noise digital signal by using the analog-to-digital converter; The audio compensation module is configured to reduce the noise according to the noise digital signal.

2. The electronic device according to claim 1, characterized in that, The electronic device is a screen sound-emitting device, and the audio compensation module includes a processor and a vibration unit, and the vibration unit is arranged on the screen; The processor is configured to generate a vibration compensation signal for canceling the noise after receiving the noise digital signal; The vibration unit is configured to vibrate in response to the vibration compensation signal to cancel and reduce the noise.

3. The electronic device according to claim 2, characterized in that, The vibration unit is a piezoelectric ceramic sheet.

4. The electronic device according to claim 2, characterized in that, Specifically, the processor is configured to, after receiving the noise digital signal, determine a cancellation phase for canceling the noise based on the reverse phase method; and generate a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase according to the cancellation phase.

5. The electronic device according to claim 1, characterized in that, The electronic device further includes a microphone chip, and the audio compensation module includes a processor; The microphone chip is configured to collect a sound analog signal; The analog-to-digital converter is further configured to convert the sound analog signal into a sound digital signal; The processor is configured to denoise the sound digital signal according to the noise digital signal to obtain denoised sound data.

6. The electronic device according to claim 1, characterized in that, The electronic device further includes a speaker, and the audio compensation module includes a processor and an intelligent power amplifier; The processor is configured to perform denoising compensation on the sound signal to be played according to the noise digital signal to obtain a compensated sound signal; The intelligent power amplifier is configured to control the speaker to emit sound according to the compensated sound signal.

7. The electronic device according to claim 1, characterized in that, The electronic device further includes a circuit board, and the multilayer ceramic capacitor is arranged on the circuit board; The multilayer ceramic capacitor is configured to vibrate in response to the magnetic coupling effect or the board vibration of the circuit board, and generate a noise analog signal based on the vibration.

8. A denoising method, characterized in that, The method includes: Converting the acquired noise vibration signal into a noise analog signal by using a multilayer ceramic capacitor; Converting the noise analog signal into a noise digital signal; Reducing the noise according to the noise digital signal.

9. The method according to claim 8, characterized in that, The converting the acquired noise vibration signal into a noise analog signal by using the multilayer ceramic capacitor includes: Vibrating the multilayer ceramic capacitor in response to the magnetic coupling effect or the board vibration of the circuit board, and generating a noise analog signal based on the vibration.

10. The method according to claim 8, characterized in that, The reducing the noise according to the noise digital signal includes: Generating a vibration compensation signal for canceling the noise according to the noise digital signal; Controlling the vibration unit to vibrate according to the vibration compensation signal to cancel and reduce the noise.

11. The method according to claim 10, characterized in that, The generating a vibration compensation signal for canceling the noise according to the noise digital signal includes: Based on the noise digital signal and in a reverse phase manner, determine a cancellation phase for canceling the noise; Generate a vibration compensation signal for driving the vibration unit to vibrate according to the cancellation phase based on the cancellation phase.

12. The method according to claim 8, wherein, The noise reduction of the noise according to the noise digital signal includes: Obtain the sound analog signal collected by the microphone chip; Convert the sound analog signal into a sound digital signal; Denoise the sound digital signal according to the noise digital signal to obtain the denoised sound data.

13. The method according to claim 8, wherein, The noise reduction of the noise according to the noise digital signal includes: Perform denoising compensation on the sound signal to be played according to the noise digital signal to obtain the compensated sound signal; Control the speaker to emit sound according to the compensated sound signal.

14. A computer-readable storage medium, wherein, It includes a computer program which, when running on an electronic device, causes the electronic device to execute the method according to any one of claims 8 to 13.

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