Heat sink and electronic equipment

Abstract

An embodiment of the present application provides a heat spreader and an electronic device, relating to the technical field of heat spreaders, the heat spreader comprising: a heat conducting component, one end of the heat conducting component along a first direction being used to contact a heat source; a first cover plate, the first cover plate being arranged to cover an end of the heat conducting component facing away from the heat source, an evaporation chamber and a heat dissipation chamber for steam flow being provided between the first cover plate and the heat conducting component, the heat dissipation chamber being arranged outside the evaporation chamber, and the orthographic projection of the evaporation chamber in the first direction at least partially overlapping with the heat source; a partitioning component, the partitioning component dividing the heat dissipation chamber into at least two sub-cavities sequentially arranged around the evaporation chamber, the sub-cavities being connected to the evaporation chamber, and the steam entering the evaporation chamber can be guided by the sub-cavities to diffuse in different directions, thereby improving the uniformity of the steam distribution in the heat dissipation chamber, thereby improving the temperature uniformity of the heat spreader.

Description

Technical Field

[0001] The present application relates to the technical field of vapor chambers, and in particular to a vapor chamber and an electronic device. Background Art

[0002] The ultra-thin heat spreader is a light and efficient two-phase heat transfer element, including an evaporation end at the heat source position and a condensation end far away from the heat source. The evaporation end at the heat source position absorbs heat, causing the liquid working fluid to quickly vaporize and take away a large amount of heat at the same time; the vaporized working fluid will diffuse from the high-pressure evaporation end to the low-pressure condensation end, and the gaseous working fluid will release heat at the condensation end, causing the gaseous working fluid to condense and transform into liquid working fluid. Under the action of the capillary wick, it flows back to the evaporation area, forming a gas-liquid circulation, which can effectively solve the heat dissipation problem of electronic equipment.

[0003] In actual applications, the heat dissipation space for electronic equipment to install heat spreaders is limited, and the heat source for the electronic equipment to dissipate heat is not necessarily in the center of the heat dissipation space. This causes the evaporation end to deviate from the center of the heat spreader, causing the relative distance between the evaporation end and the condensation end to change. The steam tends to flow to the condensation end with a relatively short distance, causing uneven steam diffusion, thereby reducing the temperature equalization effect of the heat spreader. Summary of the Invention

[0004] Embodiments of the present application provide a vapor chamber and an electronic device to achieve the effect of improving the uniformity of vapor diffusion within the vapor chamber.

[0005] In a first aspect, an embodiment of the present application provides a vapor chamber, comprising:

[0006] a heat conducting component, wherein one end of the heat conducting component along the first direction is configured to contact a heat source;

[0007] a first cover plate, the first cover plate being arranged to cover an end of the heat conducting component away from the heat source, an evaporation chamber and a heat dissipation chamber for steam flow being defined between the first cover plate and the heat conducting component, the heat dissipation chamber being arranged outside the evaporation chamber, and an orthographic projection of the evaporation chamber in the first direction at least partially overlapping with the heat source;

[0008] A partition component is provided, wherein the partition component divides the heat dissipation chamber into at least two sub-cavities which are sequentially arranged around the circumference of the evaporation chamber, and the sub-cavities are communicated with the evaporation chamber.

[0009] In a possible embodiment, the partition assembly includes at least two partitions, and the partitions extend radially from the evaporation chamber toward an edge of the heat dissipation chamber, so that the sub-cavity is located between adjacent partitions.

[0010] In a possible embodiment, the invention further includes a shut-off member, wherein two ends of the shut-off member along the first direction are respectively connected to the first cover plate and the heat conducting component, and cooperate with the first cover plate and the heat conducting component to form the evaporation chamber;

[0011] The shut-off member is provided with at least one connecting port between adjacent partitions, and the connecting port is connected to the evaporation chamber and the corresponding sub-chamber.

[0012] In a possible implementation manner, the total length of the connection ports communicating with the same sub-cavity on the outer circumference of the shut-off member is positively correlated with the area of ​​the orthographic projection of the sub-cavity in the first direction.

[0013] In a possible implementation manner, the total length of all the connection ports communicating with the sub-cavity on the outer circumference of the shut-off member is:

[0014]

[0015] in, is the total length of all the connection ports communicating with the nth sub-cavity on the outer peripheral side of the shut-off member; is the area of ​​the orthographic projection of the i-th sub-cavity in the first direction, is the total length of all the connection ports communicating with the i-th sub-cavity on the outer peripheral side of the shut-off member, is the area of ​​the orthographic projection of the nth sub-cavity in the first direction, n≥2, i≥1.

[0016] In a possible implementation manner, the size of the connecting port gradually decreases from the evaporation chamber to the sub-chamber.

[0017] In a possible implementation, the shape of the shut-off member matches the shape of the heat source, and the distance between the edge of the orthographic projection of the evaporation chamber in the first direction and the edge of the heat source is less than or equal to 0.5 mm.

[0018] In a possible implementation, a flow guide is provided in the sub-cavity, and the flow guide extends radially from the evaporation cavity toward an edge of the heat dissipation cavity.

[0019] In a possible implementation, a heat-conducting column is provided in the sub-cavity, and the heat-conducting column is connected to the first cover plate.

[0020] In one possible implementation, the heat conducting component includes:

[0021] a second cover plate, the second cover plate being connected to the first cover plate;

[0022] A capillary structure is connected to the second cover plate, and the heat dissipation cavity and the evaporation cavity are provided between the capillary structure and the first cover plate.

[0023] In a possible implementation, the partition component is fixed on the first cover plate, and a side of the partition component facing away from the first cover plate is in contact with the capillary structure.

[0024] In a second aspect, an embodiment of the present application provides an electronic device, comprising a device body and a heat spreader as described in any one of the first aspects, wherein the heat spreader is used to dissipate heat for the device body.

[0025] In the heat spreader and electronic device provided in the embodiments of the present application, the heat spreader is provided with a heat conducting component, a first cover plate, and a partition component. The first cover plate is provided to cover the end of the heat conducting component away from the heat source, and a heat dissipation chamber and an evaporation chamber are formed between the first cover plate and the heat conducting component. At the same time, the heat dissipation chamber is arranged outside the evaporation chamber, and the evaporation chamber is opposite to the heat source. When the heat emitted by the heat source is transferred to the heat conducting component, the liquid working medium in the corresponding area can quickly evaporate into vapor and enter the evaporation chamber. The partition component divides the heat dissipation chamber into at least two sub-cavities sequentially arranged around the evaporation chamber. The gas in the evaporation chamber can enter the corresponding sub-cavity through the area connected to the different sub-cavities, so that the vapor diffuses in the sub-cavity and reaches different positions in the sub-cavity, and contacts the first cover plate for condensation. Therefore, when the heat source does not contact the central area of ​​the heat conducting component, the vapor in the evaporation chamber can still be restricted by the sub-cavity and move synchronously toward different sub-cavities, contacting different positions of the first cover plate for condensation, thereby effectively improving the uniformity of vapor diffusion and reducing the influence of the heat source position on the temperature uniformity of the heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0027] Figure 1 A schematic structural diagram of the first cover plate in the heat sink provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram of the structure of a heat sink provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of a first arrangement of a partition assembly in a vapor chamber provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of a second arrangement of a partition assembly in a vapor chamber provided in an embodiment of the present application;

[0031] Figure 5A schematic diagram of a third arrangement of the partition assembly in the vapor chamber provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of a fourth arrangement of a partition assembly in a vapor chamber according to an embodiment of the present application;

[0033] Figure 7 A schematic diagram of a first embodiment of a flow cutoff member in a vapor chamber provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of a second embodiment of a flow cutoff member in a vapor chamber provided in an embodiment of the present application;

[0035] Figure 9 A schematic diagram of a third embodiment of a flow cutoff member in a vapor chamber provided in an embodiment of the present application;

[0036] Figure 10 A schematic diagram of an implementation of a heat conducting component in a vapor chamber provided in an embodiment of the present application;

[0037] Figure 11 A schematic diagram of another embodiment of the first cover plate in the heat sink provided in an embodiment of the present application.

[0038] Reference numerals:

[0039] 110 - heat conduction component, 111 - second cover plate, 112 - capillary structure, 120 - first cover plate, 130 - partition component, 140 - evaporation chamber, 150 - sub-chamber, 160 - shut-off member, 161 - connection port, 170 - flow guide member.

[0040] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0041] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0042] As mentioned in the background technology, the heat dissipation space that can be used to install the heat spreader in general electronic devices is limited, which results in the relative position of the heat spreader and the heat source of the electronic device being restricted. The position where the heat spreader contacts the heat source of some electronic devices is not the center area of ​​the heat spreader, which poses a severe test to the normal performance of the heat dissipation performance of the heat spreader.

[0043] The position of the evaporation end changes with the position of the heat source. When the heat source is no longer in contact with the center area of ​​the vapor chamber, the evaporation end is no longer in the center area of ​​the vapor chamber, causing the relative distance between the evaporation end and the condensation end (i.e., the low-temperature area) to also change. The condensation end here can be the side of the vapor chamber away from the heat source.

[0044] When the relative distance between the evaporation end and the condensation end is shorter, the steam flow resistance is small, and the steam tends to diffuse toward the condensation end with a shorter relative distance. When the relative distance between the evaporation end and the condensation end is longer, the steam flow resistance is large, and the steam is not easy to diffuse toward this end. Therefore, when the evaporation end is not in the center area of ​​the heat spreader, most of the steam diffuses toward the condensation end with a shorter relative distance to the evaporation end, resulting in more steam in some areas and very little steam in some areas, resulting in uneven steam diffusion, worsening the temperature uniformity of the heat spreader, and making it difficult for the heat spreader to effectively exert its heat dissipation capacity.

[0045] In this regard, the present application provides a heat spreader, in which at least two sub-cavities are arranged around the evaporation chamber corresponding to the heat source. The diffusion of steam is restricted by the sub-cavities, thereby reducing the amount of steam diffusing toward the condensation end with a relatively shorter distance, and increasing the amount of steam diffusing toward the condensation end with a relatively longer distance. In this way, with the evaporation chamber as the center, the evaporation chamber is evenly dispersed to different sub-cavities, and diffused to different positions in the sub-cavity for condensation, thereby enhancing the heat transfer efficiency and improving the temperature uniformity of the heat spreader.

[0046] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0047] This embodiment of the application provides a heat sink, see Figure 1 and Figure 2 As shown, it includes a heat conducting component 110 , a first cover plate 120 and a partition component 130 .

[0048] The heat conducting component 110 is along the first direction ( Figure 2The first end of the heat conducting component 110 (in the X direction in the figure) is used to contact the heat source to conduct heat with the heat source to reduce the temperature of the heat source. The second end of the heat conducting component 110 along the first direction is used to connect with the first cover plate 120. A heat dissipation cavity and an evaporation cavity 140 are defined between the first cover plate 120 and an end of the heat conducting component 110 facing away from the heat source. The heat dissipation cavity is disposed outside the evaporation cavity 140.

[0049] The orthographic projection of the evaporation chamber 140 in the first direction at least partially overlaps with the heat source. For example, the orthographic projection of the evaporation chamber 140 in the first direction completely overlaps with the heat source, or at least partially extends outside the heat source, or only partially overlaps with the heat source. Of course, it is preferable that the orthographic projection of the heat source in the first direction is completely within the evaporation chamber 140. In this case, when the heat spreader contacts the heat source, the area corresponding to the heat source is completely covered by the evaporation chamber 140. When the working medium is converted into vapor through heat exchange in the area where the heat source is located, the vapor will first enter the evaporation chamber 140. The partition assembly 130 is located within the heat dissipation chamber and divides the heat dissipation chamber into at least two sub-cavities 150. All sub-cavities 150 are sequentially arranged around the circumference of the evaporation chamber 140 and are each connected to the evaporation chamber 140, so that the evaporation chamber 140 diffuses into each sub-cavity 150 for condensation.

[0050] It should be noted that the heat conducting component 110 and the first cover plate 120 are both made of materials with good thermal conductivity, so that the working fluid inside the heat conducting component 110 can effectively exchange heat with the heat source, and at the same time, the heat of the working fluid can be transferred to the external environment through the first cover plate 120, so that the working fluid is condensed into liquid and circulated.

[0051] Specifically, when the working fluid is liquid, it can flow in the heat conducting component 110, exchange heat in the contact area with the heat source, evaporate into steam, and then the steam enters the evaporation chamber 140, and respectively enters the sub-cavities 150 arranged in sequence around the evaporation chamber 140, so that the steam is restricted by the sub-cavity 150 in different areas of the heat dissipation chamber, and moves toward the sub-cavity 150 away from the evaporation chamber 140 and gradually condenses into liquid. Then the liquid moves back to the corresponding area of ​​the heat source in the heat conducting component 110 for heat exchange and circulation to reduce the temperature of the heat source. In this process, even if the evaporation chamber 140 and the heat source are not in the central area of ​​the heat conducting component 110, the movement range of the steam can be limited by the sub-area, thereby improving the uniformity of the steam distribution in the heat dissipation chamber, thereby improving the temperature uniformity of the heat spreader.

[0052] In some embodiments, see Figure 1 As shown, the partition assembly 130 includes at least two partitions, which extend radially from the evaporation chamber 140 toward the edge of the heat dissipation chamber, so that a sub-cavity 150 is formed between adjacent partitions.

[0053] Among them, the shape of the evaporation chamber 140 can be set according to the shape of the heat source, and the setting method of the partition can be adjusted according to the shape of the evaporation chamber 140, that is, the number and position of the partition can be adaptively adjusted according to the shape of the evaporation chamber 140 and the position of the evaporation chamber 140 relative to the heat conductive component 110 to improve the uniformity of vapor diffusion.

[0054] For example, Figure 6 and Figure 2 As shown, the heat source is circular and the evaporation chamber 140 is cylindrical. At this time, the first end of the partition in the first direction is connected to the first cover plate 120, and the second end in the first direction is in contact with the heat conductive component 110, and the extension line of the partition passes through the center of the evaporation chamber 140. The partitions can be 2, 3, 4 or more, which can be evenly arranged around the evaporation chamber 140, or can be arranged on the outside of the evaporation chamber 140 at different intervals.

[0055] When the heat source is polygonal in shape, the number of partitions can be any value, but it is generally preferred that the number of the formed sub-cavities 150 is greater than or equal to the number of sides of the heat source to improve the uniformity of vapor diffusion.

[0056] For example, Figure 3 and Figure 4 As shown, the heat source is rectangular and the evaporation chamber 140 is a rectangular columnar structure. At this time, the extension line of the partition passes through the center of the evaporation chamber 140. For example, the extension line of the partition extends along the diagonal line of the evaporation chamber 140, or the extension line of the partition passes through the middle position of the side of the evaporation chamber 140, or the partition includes both of the above.

[0057] For example, Figure 5 As shown, the heat source is a pentagon, and the evaporation chamber 140 is a pentagonal columnar structure. At this time, the extension line of the partition passes through the intersection of two adjacent side surfaces of the evaporation chamber 140 and extends to the center of the evaporation chamber 140.

[0058] It should be noted that the above examples are only for illustration and not for limitation. No matter what shape the heat source and the evaporation chamber 140 are, as long as the partition can separate the heat dissipation chamber surrounding the outside of the evaporation chamber 140 into multiple sub-cavities 150, it will be sufficient.

[0059] Of course, the partition can be a sheet structure, a columnar structure, or other structures, as long as the partition can be connected to the first cover plate 120 at one end and connected to the heat conductive component 110 at the other end, and the heat dissipation cavity is divided into different sub-cavities 150, and adjacent sub-cavities 150 cannot be connected at the partition.

[0060] In some embodiments, when one end of the partition is connected to or adjacent to the edge of the evaporation chamber 140 and the other end extends toward the edge of the heat dissipation chamber, the volume of the sub-cavity 150 generally gradually increases in a direction away from the evaporation chamber 140. At this time, it is convenient for the steam to diffuse to the end of the sub-cavity 150 away from the evaporation chamber 140, thereby assisting the steam to diffuse evenly.

[0061] Taking the heat dissipation cavity as a rectangle as an example, this extension method of the partition can divide the heat dissipation cavity into multiple sub-cavities 150 arranged around the evaporation cavity 140, and each sub-cavity 150 extends to the edge of the heat dissipation cavity at one end away from the evaporation cavity 140.

[0062] It should be noted that the partition may not extend radially around the evaporation chamber 140 , but may be designed into a more complex shape, as long as the end of the sub-cavity 150 adjacent to the evaporation chamber 140 can be arranged sequentially along the circumference of the evaporation chamber 140 .

[0063] In some embodiments, see Figure 1 、 Figure 2 、 Figure 7 、 Figure 8 and Figure 9 As shown, the heat spreader further includes a shut-off member 160 , the two ends of which along the first direction are respectively connected to the first cover plate 120 and the heat conducting assembly 110 , and cooperate with the first cover plate 120 and the heat conducting assembly 110 to form an evaporation chamber 140 .

[0064] One end of the partition is connected to the shut-off piece 160 to divide the heat dissipation chamber into at least two independent sub-cavities 150, wherein the shut-off piece 160 is provided with at least one connecting port 161 between adjacent partitions, and the connecting port 161 connects the evaporation chamber 140 and the corresponding sub-cavity 150, so that the steam in the evaporation chamber 140 can enter the corresponding sub-cavity 150 through the connecting port 161, and each sub-cavity 150 is independently arranged, which can prevent the steam entering the sub-cavity 150 from diffusing toward other sub-cavities 150. Of course, the connecting port 161 corresponding to the same sub-cavity 150 can be one or more, which can be adjusted according to actual conditions, wherein the connecting port 161 can pass through the shut-off piece 160 along the first direction, or it can only occupy a partial area of ​​the shut-off piece 160 in the first direction, but it is preferable that the height of each connecting port 161 in the first direction is the same.

[0065] Specifically, the distance between the edge of the orthographic projection of the evaporation chamber 140 in the first direction (i.e., the position of the orthographic projection of the inner surface of the shut-off member 160 in the first direction) and the edge of the heat source (i.e., the position of the orthographic projection of the outer surface of the heat source in the first direction) is preferably less than or equal to 0.5 mm. This facilitates the diffusion of vapor into the sub-cavity 150 without affecting the conversion of the liquid working medium into gas and its entry into the evaporation chamber 140.

[0066] Exemplarily, the orthographic projection of the shut-off member 160 in the first direction is arranged around the periphery of the heat source, and the straight-line distance between the position of the orthographic projection of the inner surface of the shut-off member 160 in the first direction and the position of the orthographic projection of the outer surface of the heat source in the first direction is 0.05 mm (i.e., the distance in the direction perpendicular to the outer surface of the heat source), or the two just coincide.

[0067] It should be noted that the shut-off member 160 may be an annular whole, or an annular structure formed by assembling a plurality of separately arranged partitions or partition columns, etc., which is not limited in this embodiment.

[0068] Furthermore, in order to further improve the uniformity of steam distribution in the heat dissipation cavity, when the height of the connecting port 161 in the first direction is the same, the total length of the connecting port 161 connected to the same sub-cavity 150 on the outer peripheral side of the shut-off member 160 is positively correlated with the area of ​​the positive projection of the sub-cavity 150 in the first direction, that is, the larger the area of ​​the first cover plate 120 corresponding to the sub-cavity 150, the larger the total size of the corresponding connecting port 161, so that the steam entering the sub-cavity 150 increases accordingly, thereby improving the uniformity of steam distribution.

[0069] Specifically, when determining the total length of all the connection ports 161 corresponding to the i-th sub-cavity 150 on the outer periphery of the shut-off member 160 After that, the total length of the connecting ports 161 corresponding to the remaining sub-cavities 150 on the outer circumference of the shut-off member 160 can be determined according to the following equation:

[0070]

[0071] in, is the total length of all the connection ports 161 communicating with the nth sub-cavity 150 on the outer circumference of the shut-off member 160; is the area of ​​the orthographic projection of the i-th sub-cavity 150 in the first direction, is the total length of all the connection ports 161 communicating with the i-th sub-cavity 150 on the outer circumference of the shut-off member 160, is the area of ​​the orthographic projection of the n-th sub-cavity 150 in the first direction.

[0072] Specifically, assuming that the total area of ​​the orthographic projection of the heat dissipation cavity in the first direction is S, and n partitions divide the heat dissipation cavity into n sub-cavities 150, then the sum of the areas of the orthographic projections of all sub-cavities 150 in the first direction is equal to S, and the areas of the orthographic projections of each sub-cavity 150 in the first direction are , ,……, ,……, (n≥2, i≥1); the total length of all the connection ports 161 communicating with the same sub-cavity 150 on the outer peripheral side of the shut-off member 160 is , ,……, ,……, .

[0073] After determining the arrangement of the partitions, the S corresponding to each sub-cavity 150 can be determined. Taking the i-th sub-cavity 150 as a reference, the S corresponding to the i-th sub-cavity 150 can be determined. and After that, the d values ​​corresponding to the other sub-cavities 150 can be determined according to the above equation, that is, , , ,……, .

[0074] The length of the shut-off member 160 corresponding to each sub-cavity 150 is , ,……, ,……, The total length of the shut-off member 160 corresponding to each sub-cavity 150 on the peripheral side except the connection port 161 is , ,……, ,……, , wherein the shut-off member 160 is provided with m connecting ports 161 corresponding to each sub-cavity 150, m ≥ 1, and the length of the connecting port 161 on the side of the shut-off member 160 is , ,……, (The lengths of adjacent connection ports 161 may be equal or unequal), where is the minimum length of the mth connection port 161 on the circumference of the shut-off member 160, ,and , the number of connection ports 161 and the length of a single connection port 161 can be determined according to actual conditions, as long as the total length requirement of all connection ports 161 is met.

[0075] In order to prevent the heat spreader from deforming or collapsing at the intercepting member 160 and being unable to effectively isolate the evaporation chamber 140, the heat spreader can be made Maintain a certain length, and the specific value can be determined according to actual conditions.

[0076] For example, Figure 1 and Figure 7As shown, the heat source is rectangular, the shutoff member 160 is also a rectangular ring structure, and there are four separators, which are connected to the shutoff member 160 at the intersection of adjacent sides of the shutoff member 160. At the same time, the separators extend along the diagonal direction of the shutoff member 160 in the direction away from the evaporation chamber 140, dividing the heat dissipation chamber into four sub-cavities 150. The corresponding areas of the four sub-cavities 150 are respectively , , , .

[0077] Assumptions is the largest, As a benchmark, The length of the shutoff member 160 corresponding to the sub-cavity 150 is b, and the total length of the entity part of the shutoff member 160 excluding the connection port 161 is c. The entity part of the shutoff member 160 can be divided into h sub-parts, and the length of each sub-part is , ,……, , wherein the lengths of the sub-portions within the corresponding area of ​​the same sub-cavity 150 may be all equal, partially equal, or all unequal, and there are m connecting ports, m ≥ 1, h = m + 1 (in this case, the connecting port 161 corresponding to the sub-cavity 150 has sub-portions of the shutoff member 160 located within the corresponding area of ​​the sub-cavity 150 on both sides), or h = m (in this case, the connecting port 161 corresponding to the sub-cavity 150 has a partition separating the sub-cavity 150 at one end thereof as a side wall, or has a sub-portion of the shutoff member 160 of another sub-cavity 150 adjacent to the sub-cavity 150 as a side wall); the total length of the connecting ports 161 is d, d = bc, and the length of a single connecting port 161 is less than or equal to bc;

[0078] The total length of the corresponding connection port 161 is , The total length of the corresponding connection port 161 is , The total length of the corresponding connection port 161 is .

[0079] In some embodiments, the connection port 161 may be in any shape, such as a triangle, a rectangle, a circle, a diamond, or an ellipse, etc., which is not limited in this embodiment.

[0080] Furthermore, the size of the connecting port 161 gradually decreases from the evaporation chamber 140 to the sub-chamber 150 .

[0081] For example, in a second direction perpendicular to the first direction, the cross-section of the connection port 161 may be trumpet-shaped, with a smaller width toward the end of the evaporation chamber 140 and a larger width toward the end of the heat dissipation chamber. At this time, the shut-off member 160 may include a plurality of connection sections, with a connection port 161 formed between adjacent connection sections, and each connection section may be a trapezoidal structure.

[0082] Of course, the connection port 161 may also be in other shapes. This approach can increase the pressure of the steam entering the heat dissipation chamber from the evaporation chamber 140 through the connection port 161 , thereby assisting the steam in rapidly diffusing within the sub-chamber 150 .

[0083] In some embodiments, auxiliary structures may be added to the sub-cavity 150 to guide the steam flow to improve the heat dissipation effect, including but not limited to the following two methods:

[0084] For example, Figure 1 and Figure 11 As shown, a guide member 170 is provided in the sub-cavity 150, and the guide member 170 extends radially from the evaporation cavity 140 toward the edge of the heat dissipation cavity to divide the sub-cavity 150 again to form multiple cavities, guiding the steam to flow in the corresponding cavity for condensation.

[0085] The guide members 170 can be provided in plurality, and the angles between adjacent guide members 170 can be the same or different, which can be selected according to actual conditions. The lengths of adjacent guide members 170 can also be determined according to actual conditions. However, when providing the guide members 170, a certain gap is generally provided between the guide members 170 and the shut-off member 160 to avoid affecting the entry of steam into the sub-cavity 150.

[0086] For example, a heat-conducting column is provided in the sub-cavity 150. The heat-conducting column can be made of metal or other materials with good thermal conductivity, and is connected to the first cover plate 120 to exchange heat with the first cover plate 120. Of course, multiple heat-conducting columns can also be provided in the sub-cavity 150, and this embodiment is not limited thereto.

[0087] In some embodiments, see Figure 1 and Figure 10 As shown, the heat conducting component 110 includes a second cover plate 111 and a capillary structure 112 . The second cover plate 111 is connected to the first cover plate 120 . The capillary structure 112 is connected to the second cover plate 111 . A heat dissipation cavity and an evaporation cavity 140 are provided between the capillary structure 112 and the first cover plate 120 .

[0088] Among them, the capillary structure 112 can be a metal mesh, metal felt, groove channel and metal porous material (such as copper mesh, stainless steel mesh, copper felt or copper powder) laid on the side of the first cover plate 120 away from the heat source, and the first cover plate 120 and the second cover plate 111 can be pure metal materials or alloy materials, such as stainless steel, aluminum alloy, copper alloy, etc. The thickness of the first cover plate 120 and the second cover plate 111 in the first direction is usually greater than or equal to 0.05 mm to have a certain strength.

[0089] The partition and the shut-off member 160 are both in contact with the capillary structure 112 and are also connected to the first cover plate 120 to separate the sub-chamber 150 from the evaporation chamber 140 .

[0090] During use, the liquid working medium is located in the capillary structure 112 and flows along the capillary structure 112 to exchange heat with the heat source. After the heat exchange, the liquid working medium evaporates into steam. The steam entering the evaporation chamber 140 enters the sub-cavity 150 along the connecting port 161, diffuses and condenses into liquid in the sub-cavity 150, and the liquid drips onto the capillary structure 112 and moves along the capillary structure 112 to the area where the heat source is located for circulation, thereby reducing the temperature of the heat source.

[0091] It should be noted that if Figure 10 and Figure 11 As shown, the partition and the shut-off member 160 can be welded to the first cover plate 120, or can be integrally formed with the first cover plate 120. This embodiment does not limit this. In order to avoid affecting the movement of the liquid working medium in the capillary structure 112, the partition and the shut-off member 160 are only connected to the side of the capillary structure 112 away from the second cover plate 111, and do not cut off the capillary structure 112.

[0092] An embodiment of the present application further provides an electronic device, which includes a device body and the heat sink in the above embodiment, wherein the heat sink is used to dissipate heat for the device body.

[0093] Specifically, the second cover plate 111 of the vapor chamber and the corresponding area of ​​the evaporation chamber 140 contact the heat source of the device body, dissipating heat through the phase change of the working fluid within the vapor chamber. The structure of the vapor chamber and the method of changing the working fluid are described in the above embodiment and will not be repeated here.

[0094] Finally, it should be noted that those skilled in the art will readily identify other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The present invention is not limited to the precise structure described above and illustrated in the accompanying drawings, and various modifications and variations may be made without departing from the scope thereof. The scope of the present invention is limited solely by the appended claims.

Claims

1. A heat sink, characterized in that: include: a heat-conducting component (110), wherein one end of the heat-conducting component (110) along a first direction is used for contacting a heat source; a first cover plate (120), the first cover plate (120) being arranged to cover an end of the heat-conducting component (110) facing away from the heat source, an evaporation chamber (140) and a heat dissipation chamber for steam flow being provided between the first cover plate (120) and the heat-conducting component (110), the heat dissipation chamber being arranged outside the evaporation chamber (140), and an orthographic projection of the evaporation chamber (140) in the first direction at least partially overlapping with the heat source; a partition assembly (130), the partition assembly (130) dividing the heat dissipation chamber into at least two sub-cavities (150) sequentially arranged around the circumference of the evaporation chamber (140), the sub-cavities (150) being in communication with the evaporation chamber (140); The partition assembly (130) comprises at least two partitions, the partitions extending radially from the evaporation chamber (140) toward the edge of the heat dissipation chamber, so that the sub-cavity (150) is located between adjacent partitions; It also includes a shutoff member (160), wherein the shutoff member (160) is connected to the first cover plate (120) and the heat-conducting component (110) at both ends along the first direction, and cooperates with the first cover plate (120) and the heat-conducting component (110) to form the evaporation chamber (140); The shut-off member (160) is provided with at least one connecting port (161) between adjacent partitions, and the connecting port (161) is connected to the evaporation chamber (140) and the corresponding sub-chamber (150); The total length of the connection port (161) communicating with the same sub-cavity (150) on the outer peripheral side of the shut-off member (160) is positively correlated with the area of ​​the orthographic projection of the sub-cavity (150) in the first direction.

2. The vapor chamber according to claim 1, wherein: The total length of all the connection ports (161) communicating with the sub-cavity (150) on the outer peripheral side of the shut-off member (160) is: in, is the total length of all connection ports (161) communicating with the nth sub-cavity (150) on the outer peripheral side of the shut-off member (160); is the area of ​​the orthographic projection of the i-th sub-cavity (150) in the first direction, is the total length of all the connection ports (161) communicating with the i-th sub-cavity (150) on the outer peripheral side of the shut-off member (160), is the area of ​​the positive projection of the nth sub-cavity (150) in the first direction, n≥2, i≥1.

3. The vapor chamber according to claim 1, wherein: The size of the connecting port (161) gradually decreases from the evaporation chamber (140) to the sub-chamber (150).

4. The vapor chamber according to claim 1, wherein: The shape of the shut-off member (160) is adapted to the shape of the heat source, and the distance between the edge of the orthographic projection of the evaporation chamber (140) in the first direction and the edge of the heat source is less than or equal to 0.5 mm.

5. The vapor chamber according to claim 1, wherein: A flow guide (170) is provided in the sub-cavity (150), and the flow guide (170) extends radially from the evaporation cavity (140) toward the edge of the heat dissipation cavity.

6. The vapor chamber according to claim 1, wherein: A heat-conducting column is provided in the sub-cavity (150), and the heat-conducting column is connected to the first cover plate (120).

7. The vapor chamber according to any one of claims 1 to 6, characterized in that: The heat conducting component (110) comprises: a second cover plate (111), the second cover plate (111) being connected to the first cover plate (120); A capillary structure (112) is connected to the second cover plate (111), and the heat dissipation cavity and the evaporation cavity (140) are provided between the capillary structure (112) and the first cover plate (120).

8. The vapor chamber according to claim 7, wherein: The partition component (130) is fixed on the first cover plate (120), and the side of the partition component (130) facing away from the first cover plate (120) is in contact with the capillary structure (112).

9. An electronic device, characterized in that: The device comprises a device body and a vapor chamber according to any one of claims 1 to 8, wherein the vapor chamber is used to dissipate heat for the device body.

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